Stacked flexible circuit devices, flexible capacitive sensors, flexible actuators, flexible batteries

Abstract

To allow for preventing disconnection between layers at the time of application of a shear load and wiring crosstalk, and enable size reduction.SOLUTION: A capacitance sensor (10) formed of a plurality of laminated layers is provided, the sensor comprising: a first conductive portion (13); a second conductive portion (14) arranged to face the first conductive portion (13); first conductive wiring (13a) provided in a layer identical to the first conductive portion (13); second conductive wiring (14a) provided in a layer identical to the second conductive portion (14); and a flexible base material (15A) with a dielectric property and elasticity arranged between the first conductive portion (13) and the second conductive portion (14). Third conductive wiring (15a) connecting the first conductive portion (13) or the first conductive wiring (13a) to the second conductive portion (14) or the second conductive wiring (14a) between layers is arranged on the flexible base material (15A).SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a laminated flexible circuit device, a flexible capacitive sensor, a flexible actuator, and a flexible battery.

Background Art

[0002] In devices that come into contact with people, wearable devices, and robots, flexibility is required on their surfaces from the viewpoints of comfort and safety. Also, in devices and robots having movable parts, it is desirable that the skin has stretchability. On the other hand, in these devices and robots, from the viewpoints of realizing system multifunctionality and miniaturization, it is important to realize a functional skin that can incorporate an electric circuit without separating the flexible skin and the electric circuit. For example, there is a demand for realizing a functional skin that can incorporate power supply flexible wiring and / or communication flexible wiring, flexible sensor electrodes, flexible electrodes for actuators, flexible electrodes for batteries, etc.

[0003] Conventionally, in a flexible circuit (FSC; flexible stretchable circuit) where the electrodes and wiring themselves are flexible, most have a single-layer structure only. In a multi-layer circuit, regarding the bonding between layers, vias used in multi-layer FPC (Flexible Printed Circuit) are known.

[0004] Furthermore, as an example of a flexible circuit, in a flexible capacitive sensor that is also used as a tactile sensor, for example, by changing the position between electrodes that are separated from each other and facing each other, predetermined sensing is enabled. Here, as the detection characteristics in the sensor, they are greatly affected by the amount of change in the relative position such as the distance between the stacked electrodes. Therefore, a structure is required that maintains the electrodes in a predetermined relative positional relationship and supports them so that they can be displaced promptly in correspondence with the sensing amount.

[0005] In a flexible sensor, there may be a structure in which a plurality of sensors are arranged on the same surface. To miniaturize a sensor while maintaining its detection characteristics, one approach is to stack multiple sensors. Alternatively, vias are known to be used to connect electrodes, wiring, and other components between layers. The applicants have already filed a patent application for the capacitive sensor described in Patent Document 1. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2022-105964 [Overview of the project] [Problems that the invention aims to solve]

[0007] In flexible circuits (FSCs), where electrodes and wiring themselves are flexible, a single-layer structure makes miniaturization difficult as the circuit size increases due to the large area of ​​wiring. Therefore, multi-layering of flexible circuits is conceivable. However, no practical method for multi-layering flexible circuits that can prevent disconnection between layers when shear loads are applied was known.

[0008] When creating multilayer flexible circuits, a known method of connecting layers involves crimping by inserting metal objects such as rivets or snap buttons between the layers. However, in such structures, while other parts of the flexible circuit are flexible, vias and other components are made of rigid materials. This makes it difficult to maintain flexibility throughout the flexible circuit as a whole, leading to problems such as disconnection when strong shear forces are applied. Furthermore, rigid FPCs (Flexible Printed Circuits) that can use vias are able to bend and deform, but they are not stretchable. Because FPCs will break if strong stress (bending force or shear force) is applied to the via portion, there was a need for greater flexibility in flexible circuits.

[0009] Furthermore, when creating multi-layered flexible circuits, it was difficult to miniaturize them using conventional structures such as rigid FPCs or solder joints.

[0010] For example, in a flexible sensor, which is an example of a flexible circuit, when multiple sensors are arranged on the same hierarchical level, there is a problem that the area required for wiring to connect each electrode increases as the number of electrodes increases. If the spacing between the wires is reduced in order to miniaturize the sensor, the signal-to-noise ratio deteriorates, making miniaturization difficult in a structure where multiple sensors are arranged on the same hierarchical level.

[0011] Even when using a stacked structure of multiple sensors, wiring was formed for each layer, making miniaturization difficult. At the same time, reducing the spacing between wirings could lead to interference from wiring crosstalk between layers, and attempting to prevent this would increase the wiring area.

[0012] Furthermore, in flexible sensors, when vias are used to connect layers, there was a problem where, because the vias are made of a rigid material while the other parts are flexible, strong shear forces applied during detection in the sensor could cause malfunctions such as wire breakage.

[0013] The present invention has been made in view of the above circumstances, and aims to provide a stacked flexible circuit device, a flexible capacitive sensor, a flexible actuator, and a flexible battery that can sufficiently suppress the occurrence of wire breakage in stacked flexible circuits, have a degree of wiring freedom comparable to that of rigid FPCs (Flexible Printed Circuits) that can use vias, can be miniaturized, and can achieve low noise. [Means for solving the problem]

[0014] As a means of solving the above problem, the invention described in claim 1 is: A stacked flexible circuit device (10) consisting of multiple stacked layers, First conductive part (13) and A second conductive portion (14) is arranged to face the first conductive portion (13), The first conductive part (13) and the first conductive wiring (13a) at the same level, The second conductive part (14) and the second conductive wiring (14a) at the same level, A flexible substrate (15A) having dielectric properties and elasticity, disposed between the first conductive part (13) and the second conductive part (14), Equipped with, The flexible substrate (15A) is provided with a third conductive wiring (15a) that connects the first conductive part (13) or the first conductive wiring (13a) and the second conductive part (14) or the second conductive wiring (14a) between layers. It is characterized by the following: The invention described in claim 2 is a stacked flexible circuit device (10) described in claim 1, A first layer (11) including the first conductive portion (13) and the first conductive wiring (13a), The second layer (12) includes the second conductive portion (14) and the second conductive wiring (14a), Equipped with, The flexible substrate (15A) and at least one of the first layer (11) or the second layer (12) are made of the same material as the flexible substrate (15A). It is characterized by the following: The invention described in claim 3 is a stacked flexible circuit device (10) described in claim 2, The flexible substrate (15A) consists of a plurality of pillars (15) that extend in the lamination direction between the first layer (11) and the second layer (12) and are spaced apart from each other in a direction intersecting the lamination direction. It is characterized by the following: The invention described in claim 4 is a stacked flexible circuit device (10) described in claim 3, The third conductive wiring (15a) penetrates the inside of the pillar (15) in the stacking direction, The third conductive wiring (15a) is either exposed on the surface of the pillar (15) or not exposed on the surface of the pillar (15). It is characterized by the following: The invention described in claim 5 is the laminated flexible circuit device (10) described in claim 3, wherein the third conductive wiring (15b) extends in the stacking direction inside the pillar (15) between the first layer (11) and the second layer (12), and the third conductive wiring (15b) is either exposed on the surface of the pillar (15) or not exposed on the surface of the pillar (15), which is characterized by the above. The invention described in claim 6 is the laminated flexible circuit device (10) described in claim 1, wherein the third conductive wirings (15a) are arranged in a plurality and spaced apart from each other in a direction intersecting the stacking direction, the third conductive wiring (15a) connected to the first conductive portion (13) or the second conductive portion (14) has an arrangement surrounded by the third conductive wiring (15b) not connected to the first conductive portion (13) or the second conductive portion (14), which is characterized by the above. The invention described in claim 7 is the laminated flexible circuit device (10) described in claim 2, wherein it includes a fourth conductive wiring (16a) penetrating at least one of the first layer (11) and the second layer (12) in the stacking direction, which is characterized by the above. The invention described in claim 8 is the laminated flexible circuit device (10) described in claim 2, wherein a circuit board (19) overlapping the first layer (11) or the second layer (12) in the stacking direction is connected to at least one of the first layer (11) and the second layer (12) in the stacking direction, which is characterized by the above. The invention described in claim 9 is a capacitive sensor (10) including the laminated flexible circuit device according to any one of claims 1 to 8, wherein the first conductive portion (13) and the second conductive portion (14) have a portion overlapping when viewed in the stacking direction, and the capacitance between the first conductive portion (13) and the second conductive portion (14) is detected, which is characterized by the above. The invention described in claim 10 is, A flexible actuator (40) comprising a stacked flexible circuit device as described in any one of claims 1 to 8, The first conductive portion (13) or the first conductive wiring (13a) and the second conductive portion (14) or the second conductive wiring (14a) have a portion that overlaps when viewed in the stacking direction. It is characterized by the following: The invention described in claim 11 is, A flexible battery (50) comprising a stacked flexible circuit device as described in any one of claims 1 to 8, The first conductive portion (13) and the second conductive portion (14) have overlapping portions when viewed in the stacking direction, The first conductive part (13) is the anode, and the second conductive part (14) is the cathode. A separator layer (56) is provided between the first conductive portion (13) and the second conductive portion (14). It is characterized by the following:

[0015] According to the invention described in claim 1, the first electrode (first conductive part) or the first conductive wiring and the second electrode (second conductive part) or the second conductive wiring, which are stacked, are connected between layers by a third conductive wiring, and this third conductive wiring is arranged on a flexible substrate, making it possible to arrange wiring through different layers. Furthermore, the first electrode (first conductive part), the first conductive wiring, the second electrode (second conductive part), the second conductive wiring, and the third conductive wiring can all be made to have a similar degree of flexibility, so that their deformation attitudes in response to the load applied to the stacked flexible circuit device are all of the same degree. As a result, the resistance of the first electrode (first conductive part), the first conductive wiring, the second electrode (second conductive part), the second conductive wiring, and the third conductive wiring to shear force generated by the external load applied to the stacked flexible circuit device and to wire breakage due to deformation can be improved. Furthermore, by increasing the distance between wires compared to when they are placed on the same tier, the effects of noise can be reduced, and the decrease in the signal-to-noise ratio can be suppressed. At the same time, since it becomes possible to arrange wires through different tiers, the degree of freedom in wire layout can be improved, such as relocating wires to different tiers, making it possible to miniaturize stacked flexible circuit devices. In addition, since rigid materials such as vias are not used, it is possible to improve resistance to shear forces generated by applied external loads and to wire breakage due to deformation.

[0016] According to the invention described in claim 2, by making either the first layer or the second layer and the flexible substrate the same material, uniform flexibility can be achieved at the interface or boundary of the layers. This makes it possible to make the degree of deformation corresponding to stress uniform without changing the flexibility at the interface or boundary of the layers, thereby suppressing the occurrence of non-uniform conditions in response to fluctuations in the relative position between electrodes (conductive parts). As a result, for example, when a stacked flexible circuit device is used as a flexible capacitance-side sensor, it becomes possible to keep the capacitance change due to the relative displacement between electrodes (conductive parts) in a predetermined state, thereby suppressing deterioration of sensor characteristics. At the same time, it becomes possible to improve the resistance to shear forces generated by external loads applied to the stacked flexible circuit device, as well as to wire breakage due to deformation.

[0017] According to the invention described in claim 3, by forming and connecting pillars between the first and second layers, each having electrodes (conductive parts), the positional displacement between the electrodes (conductive parts) can be increased by the pillars, even when the same external force is applied. Therefore, for example, in the case of a flexible capacitive sensor, deterioration of the detection accuracy of the sensor can be prevented. At the same time, the detection accuracy of the sensor can be improved. Furthermore, by forming a third conductive wiring on the pillars, it is possible to improve resistance to disconnection caused by the difference in flexibility at the connection positions of each layer. By forming a third conductive wiring on the pillars, miniaturization can be achieved and the detection accuracy of the sensor can be improved. Furthermore, by setting the pillars to a predetermined position in a direction along the opposing surface of the electrodes (conductive parts), the selection of connection positions between layers using the third conductive wiring can be easily expanded by taking the pillar arrangement into consideration. This improves the layout flexibility between wirings, making it possible to miniaturize the stacked flexible circuit device. At the same time, it becomes possible to reduce the effects of noise and suppress the decrease in the signal-to-noise ratio.

[0018] According to the invention described in claim 4, the third conductive wiring can be made to follow the deformation of the pillar, thereby improving resistance to shear force generated by external loads applied to the laminated flexible circuit device and to wire breakage due to deformation. At the same time, the width dimension of the third conductive wiring can be increased in accordance with the circumferential dimensions of the pillar, thereby improving resistance to wire breakage due to deformation. Furthermore, by forming a conductive portion around the pillar that acts as a GND shield and electrically surrounding the third conductive wiring, the third conductive wiring can be made into a coaxial cable within the pillar, thereby reducing crosstalk. Furthermore, by forming a third conductive wire around the entire circumference of the pillar and connecting it to a wire that is at GND potential, a GND shield can be created. In particular, by placing a wire connected to an electrode aligned with the stacking direction in the center of the pillar, the third conductive wire around the pillar can be electrically enclosed as a GND shield. This makes it possible to use coaxial cables for the conductive wires within the pillar, thereby reducing crosstalk.

[0019] According to the invention described in claim 5, the third conductive wiring can be made to follow the deformation of the pillar, thereby improving resistance to shear force generated by external loads applied to the laminated flexible circuit device and to wire breakage due to deformation. At the same time, the width dimension of the third conductive wiring can be increased in accordance with the circumferential dimensions of the pillar, thereby improving resistance to wire breakage due to deformation. This allows for the use of coaxial cables for conductive wiring within the pillar, thereby reducing crosstalk.

[0020] According to the invention described in claim 6, by surrounding the third conductive wiring connected to the electrode (conductive part), that is, the signal line arranged in the stacking direction and connecting the layers, with a conductive part not connected to the signal line, it is possible to reduce crosstalk by providing a shielding effect from further separated parts to the surrounded signal line. Furthermore, by surrounding the signal line along its entire circumferential length, it is possible to reduce crosstalk at the inter-layer wiring layout location by using coaxial cables for the wiring inside the pillar. Here, the surrounding arrangement does not need to physically enclose the entire perimeter continuously; it is sufficient that the elements are positioned to the extent that electrical shielding is possible, and physically, this includes a state where the elements are intermittently enclosed in the circumferential direction. The same applies to the stacking direction; the elements may be physically separated, but they must be continuous to the extent that electrical shielding is possible.

[0021] According to the invention described in claim 7, the conductive wiring connected to the electrode (conductive part) or conductive wiring not only connects layers but also has a fourth conductive wiring that penetrates the first or second layer in the stacking direction and connects the front and back surfaces of the first or second layer, thereby further improving the freedom of wiring layout. The fourth conductive wiring and the third conductive wiring can be continuous with each other or connected via other wiring or electrodes.

[0022] According to the invention described in claim 8, by arranging the circuit board at a position that overlaps with each layer when viewed in the stacking direction, the degree of freedom in wiring layout can be increased compared to when the circuit board is arranged on the same layer. At the same time, it becomes possible to reduce the size of the contour, making it possible to miniaturize the stacked flexible circuit device. Furthermore, since it is possible to reduce the distance between the circuit board and the layer to which it is connected and reduce the length of the wiring, it becomes possible to suppress the occurrence of crosstalk.

[0023] According to the invention described in claim 9, it is possible to provide a flexible capacitive sensor that can detect shear force, external loads in three axes, or proximity conditions, while simultaneously suppressing wire breakage, by enabling connection of electrodes or wiring between layers, thereby improving the freedom of wiring layout, miniaturization, and suppressing a decrease in the signal-to-noise ratio.

[0024] According to the invention described in claim 10, it is possible to provide a flexible actuator that can be miniaturized while improving the freedom of wiring layout by allowing electrodes or wiring to be connected between layers, and which can suppress a decrease in the S / N ratio, and which can detect shear force, external loads in three axes, or proximity conditions, and can simultaneously suppress the occurrence of wire breakage.

[0025] According to the invention described in claim 10, it is possible to provide a flexible battery that can be miniaturized while improving the freedom of wiring layout by allowing electrodes or wiring to be connected between layers, suppressing a decrease in the signal-to-noise ratio, and that can detect shear force, external loads in three axes, or proximity conditions, while simultaneously suppressing the occurrence of wire breakage. [Effects of the Invention]

[0026] According to the present invention, it is possible to provide a capacitive sensor that can detect shear force, external loads in three axes, or proximity conditions, while simultaneously suppressing wire breakage, and which can be miniaturized while improving the freedom of wiring layout and suppressing a decrease in the signal-to-noise ratio. [Brief explanation of the drawing]

[0027] [Figure 1] This is a schematic cross-sectional view showing a first embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 2] This is a schematic cross-sectional view illustrating the operation of a first embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 3] This is a schematic cross-sectional view showing a second embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 4]This is a schematic top view showing a second embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 5] This is a schematic cross-sectional view illustrating the operation of a second embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 6] This is a schematic cross-sectional view illustrating the operation of a second embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 7] This is a schematic cross-sectional view showing a third embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 8] This is a schematic top view showing a third embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 9] This is a schematic top view showing a stacked flexible circuit device (capacitive sensor) for comparison. [Figure 10] This is a schematic cross-sectional view showing a fourth embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 11] This is a schematic cross-sectional view showing a fifth embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 12] This is a schematic cross-sectional view showing a sixth embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 13] This is a schematic cross-sectional view showing a pillar in the sixth embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 14] This is a schematic cross-sectional view showing a seventh embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 15] This is a schematic cross-sectional view showing a pillar in the seventh embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 16] This is a schematic cross-sectional view showing an eighth embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 17] This is a schematic cross-sectional view showing a stacked flexible circuit device (capacitive sensor) for comparison. [Figure 18]This is a schematic cross-sectional view showing the ninth embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 19] This is a schematic cross-sectional view showing a tenth embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 20] This is a schematic perspective view showing the 11th embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 21] This is a schematic cross-sectional view showing an eleventh embodiment of the stacked flexible circuit device (capacitive sensor) according to the present invention. [Figure 22] This is a schematic perspective view showing a twelfth embodiment of the stacked flexible circuit device (flexible actuator) according to the present invention. [Figure 23] This is a schematic perspective view showing a thirteenth embodiment of the stacked flexible circuit device (flexible battery) according to the present invention. [Figure 24] This is a schematic cross-sectional view showing a thirteenth embodiment of the stacked flexible circuit device (flexible battery) according to the present invention. [Modes for carrying out the invention]

[0028] A first embodiment of the capacitive sensor according to the present invention will be described below with reference to the drawings. Figure 1 is a schematic cross-sectional view showing a capacitive sensor in this embodiment, where reference numeral 10 denotes a capacitive sensor (stacked flexible circuit device).

[0029] As shown in Figure 1, the capacitive sensor (stacked flexible circuit device) 10 according to this embodiment comprises a first electrode support layer (first layer) 11, a second electrode (second conductive part) 14, a first electrode (first conductive part) 13, a second electrode support layer (second layer) 12, and a flexible substrate 15A. The first electrode support layer (first layer) 11 includes the first electrode (first conductive part) 13. The second electrode support layer (second layer) 12 includes the second electrode (second conductive part) 14, which is positioned opposite the first electrode support layer 11. The flexible substrate 15A connects the first electrode support layer 11 and the second electrode support layer 12 in the lamination direction. The first electrode support layer 11, the second electrode support layer 12, and the flexible substrate 15A are elastomer layers made of a dielectric and elastically deformable elastomer. The first electrode support layer 11, the second electrode support layer 12, and the flexible substrate 15A can be bonded together by an adhesive layer made of the same material as the elastomer layer (not shown).

[0030] The first electrode support layer 11, the second electrode support layer 12, and the flexible substrate 15A are made of elastomers that can be cured after application. For example, it is preferable to select a thermosetting resin. The first electrode support layer 11, the second electrode support layer 12, and the flexible substrate 15A are elastically deformable by a flexible dielectric material, such as polyvinyl chloride (PVC) gel, polyvinylidene fluoride (PVDF), polydimethylsiloxane (PDMS), silicone resin, urethane resin, epoxy resin, or a composite material thereof. It is preferable to select an elastomer that does not have reversibility with respect to the curing treatment described later.

[0031] Both the first electrode 13 and the second electrode 14 are composed of a flexible conductor. The first electrode 13 and the second electrode 14 can be formed from a silicon-based resin mixed with conductors such as carbon, carbon nanofibers, and graphite; a silicon-based resin containing metal conductive fillers such as silver and copper; a thiophene-based conductive polymer; a conductive resin such as polystyrene sulfonic acid (PSS); or a composite material thereof.

[0032] The first electrode 13 is formed in the first electrode support layer 11. The first electrode 13 may be contained in the thickness direction of the first electrode support layer 11. The first electrode 13 may be formed exposed on any surface of the first electrode support layer 11. The first electrode 13 only needs to be formed in a predetermined shape when the first electrode support layer 11 is formed. The first electrode 13 may be formed by mixing conductive materials such as carbon powder, carbon nanofibers, or metal powder into the same material as the first electrode support layer 11.

[0033] The first electrode 13 can have its formation shape, formation position, and number predetermined in the thickness direction or in-plane direction of the first electrode support layer 11, according to the sensor characteristics. Multiple first electrodes 13 may be arranged on the same layer of the first electrode support layer 11, for example, and can be arranged on the left and right sides as shown in Figure 1. The first electrode support layer 11 has first conductive wiring 13a and first conductive wiring 13b at the same level as the first electrode 13. In Figure 1, the wiring connected to the right first electrode 13 is referred to as first conductive wiring 13a, and the wiring connected to the left first electrode 13 is also referred to as first conductive wiring 13a, but the configuration is not limited to this.

[0034] The second electrode 14, like the first electrode 13, only needs to be formed in a predetermined shape when forming the second electrode support layer 12. The second electrode 14 can be appropriately positioned in the second electrode support layer 12, for example, and can be positioned between the first electrodes 13, which are positioned on the left and right sides, as shown in Figure 1. The second electrode support layer 12 has second conductive wiring 14a and second conductive wiring 14b at the same level as the second electrode 14. In Figure 1, the wiring connected to the second electrode 14 is referred to as second conductive wiring 14b, and the wiring not connected to the second electrode 14 is referred to as second conductive wiring 14a, but the configuration is not limited to this.

[0035] A third conductive wire 15a is placed on the flexible substrate 15A. The third conductive wire 15a connects the first conductive wire 13a and the second conductive wire 14b between layers. The third conductive wire 15a penetrates the flexible substrate 15A in the stacking direction. Both ends of the third conductive wire 15a are connected to the first conductive wire 13a and the second conductive wire 14b. The third conductive wiring 15a may be connected to the first electrode 13 or the second electrode 14. In this embodiment, the third conductive wiring 15a only needs to connect the conductive portion of the first electrode support layer 11 and the conductive portion of the second electrode support layer 12 across the respective layers, and it is possible that the connection target is either an electrode or a conductive wiring, or that the other end, which is located in a different layer from one end, is not connected to another conductive portion.

[0036] The third conductive wiring 15a, the first conductive wiring 13a, the first conductive wiring 13b, the second conductive wiring 14a, and the second conductive wiring 14b can all be made of conductors having the same elasticity as the first electrode 13 and the second electrode 14.

[0037] In the capacitive sensor of this embodiment, a first electrode support layer 11, a second electrode support layer 12, and a flexible base material 15A are prepared. Both the first electrode support layer 11 and the second electrode support layer 12 can be formed in a substantially plate shape. The first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A can be molded using a predetermined mold. Furthermore, the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A can be made of the same material or different materials.

[0038] Furthermore, the first electrode support layer 11, the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b can be formed simultaneously during molding. For example, before molding the first electrode support layer 11, a material containing conductive material corresponding to the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b can be applied to and cured in the mold recess, and then the first electrode support layer 11 can be injected into the mold recess and cured to simultaneously form the first electrode support layer 11, the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b.

[0039] Alternatively, the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b can be formed by applying them to the surface of a molded first electrode support layer 11 and curing them. In this case, the mold used to form the first electrode support layer 11 can have corresponding irregularities formed at the positions where the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b will be formed. Alternatively, conductive material can be injected into predetermined locations that will become the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b when forming the first electrode support layer 11, or afterward.

[0040] Similarly, the second electrode support layer 12, the second electrode 14, the second conductive wiring 14a, and the second conductive wiring 14b may be formed simultaneously. Alternatively, the second conductive wiring 14a and the second conductive wiring 14b may be formed later on the formed second electrode support layer 12. These can be formed using the same method as the first electrode support layer 11, the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b.

[0041] Similarly, the flexible substrate 15A and the third conductive wiring 15a may be formed simultaneously. Alternatively, the third conductive wiring 15a may be formed later on the formed flexible substrate 15A. These can be formed using the same method as the first electrode support layer 11, the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b. Furthermore, the same elastomer is applied to the interfaces between the prepared first electrode support layer 11, second electrode support layer 12, and flexible substrate 15A, and then cured. This allows the first electrode support layer 11, second electrode support layer 12, and flexible substrate 15A to be bonded to each other, thereby manufacturing a capacitive sensor 10.

[0042] Figure 2 is a cross-sectional view illustrating the operation of the capacitive sensor in this embodiment. As shown in Figure 2, in the capacitive sensor 10 according to this embodiment, when no external load F is applied, the overlapping area of ​​the first electrode 13 and the second electrode 14 in a plan view is S.

[0043] In contrast, when an external load F is applied, the overlapping area of ​​the first electrode 13, located on the right side in Figure 2, with the second electrode 14 becomes S + ΔS. This changes the capacitance formed by the first electrode 13 and the second electrode 14, and by detecting this change in capacitance, it becomes possible to measure the external load F. Similarly, when an external load F is applied, the overlapping area of ​​the first electrode 13, located on the left side in Figure 2, with the second electrode 14 becomes S-ΔS. In this way, the capacitance formed by the first electrode 13 and the second electrode 14 changes, and by detecting this change in capacitance, it becomes possible to measure the external load F.

[0044] In this case, the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A are all made of the same elastomer material. Therefore, the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A all have the same stress properties. Consequently, they do not have deformation peculiarities such as locally different hardness or locally softness. The first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A have a uniform degree of deformation.

[0045] Furthermore, the interfaces between the first electrode support layer 11 and the flexible substrate 15A, and between the second electrode support layer 12 and the flexible substrate 15A, can maintain the same stress characteristics. Therefore, the first electrode support layer 11, the second electrode support layer 12, and the flexible substrate 15A all deform in the same way in response to the applied external load F. Consequently, no discontinuity in deformation characteristics occurs at the adhesive surface. In other words, the first electrode support layer 11, the second electrode support layer 12, and the flexible substrate 15A all deform in the same way in response to the applied external load F.

[0046] This makes it possible to accurately detect the change in capacitance between the first electrode 13 and the second electrode 14. In other words, the first electrode support layer 11, the second electrode support layer 12, and the flexible substrate 15A deform in the same way in response to the applied external load F, regardless of the presence or absence of adhesive surfaces. This makes it possible to accurately detect the change in capacitance between the first electrode 13 and the second electrode 14.

[0047] Here, the first electrode 13 and the second electrode 14, the third conductive wiring 15a, the first conductive wiring 13a and the first conductive wiring 13b, the second conductive wiring 14a and the second conductive wiring 14b all use the same elastomer as the first electrode support layer 11, the second electrode support layer 12, and the flexible substrate 15A. Therefore, they all have almost the same stress characteristics. Furthermore, because these interfaces are formed from the same material, they have uniform characteristics, preventing stress concentration and improving peel resistance. At the same time, because these interfaces are formed from elastomers with the same molecular structure, the bonds are strong and they are resistant to peeling. Therefore, the degree of deformation when an external load F is applied is uniform. Consequently, the occurrence of wire breakage caused by the external load F can be suppressed. This makes it possible to maintain the required wire breakage resistance for the capacitive sensor 10.

[0048] In Figure 2, the applied external load F is shown as being applied in the left-right direction of the figure, but it can also be applied in the thickness direction of the first electrode support layer 11 and the second electrode support layer 12. In this case, the change in capacitance between the first electrode 13 and the second electrode 14 is detected by the distance d between the electrodes.

[0049] A second embodiment of the capacitive sensor (stacked flexible circuit device) according to the present invention will be described below with reference to the drawings. Figure 3 is a schematic cross-sectional view showing the capacitive sensor in this embodiment. Figure 4 is a schematic top view showing the capacitive sensor in this embodiment. In this embodiment, the difference from the first embodiment described above is the pillar, and other components corresponding to the first embodiment described above are denoted by the same reference numerals and their descriptions may be omitted.

[0050] In this embodiment, as shown in Figures 3 and 4, the capacitive sensor 10 has a plurality of columnar pillars 15 formed between the first electrode support layer 11 and the second electrode support layer 12. All of the pillars 15 are on the same layer and constitute a flexible substrate. Multiple pillars 15 are formed along the in-plane direction of the first electrode support layer 11 and the second electrode support layer 12, spaced apart from one another. The pillars 15 can be formed integrally with the second electrode support layer 12. All pillars 15 can have the same height dimension. The pillars 15 can have different heights depending on their in-plane position on the first electrode support layer 11 and the second electrode support layer 12. The height of the pillars 15 can change by tilting in one direction. The height of the pillars 15 can be set according to the sensor characteristics.

[0051] A first electrode 13 and a first conductive wiring 13a are formed on the first electrode support layer 11. The first electrode 13 and the first conductive wiring 13a may be contained in the thickness direction of the first electrode support layer 11. The first electrode 13 and the first conductive wiring 13a may be formed exposed on the surface of the first electrode support layer 11 facing the second electrode support layer 12. Multiple first electrodes 13 can be formed in the same layer.

[0052] The second electrode support layer 12 has a second electrode 14 and second conductive wiring 14a and second conductive wiring 14b formed on it. The second electrode 14 and second conductive wiring 14a and second conductive wiring 14b may be contained in the thickness direction of the second electrode support layer 12. The second electrode 14 and second conductive wiring 14a and second conductive wiring 14b may be formed exposed on the surface of the second electrode support layer 12 facing the first electrode support layer 11. Multiple second electrodes 14 can be formed in the same layer.

[0053] Among the multiple pillars, a third conductive wire 15a is arranged on pillar 15, which is positioned at a predetermined in-plane location, and which penetrates in the stacking direction. In this embodiment, the third conductive wire 15a is positioned at the center of pillar 15. That is, the third conductive wire 15a penetrates along the central axis of pillar 15. Both ends of the third conductive wire 15a are connected to the first conductive wire 13a and the second conductive wire 14b, respectively.

[0054] Furthermore, at the ends of the first conductive wiring 13a and the second conductive wiring 14b connected to the third conductive wiring 15a, the connection position 13a1 can be made larger in area when viewed from above than the width dimension of the other parts of the first conductive wiring 13a, as shown in Figure 4. This ensures a reliable connection between the connection position 13a1 and the third conductive wiring 15a. Similarly, at the end of the second conductive wiring 14b, a connection position 14b1 can be formed to maintain a reliable connection with the third conductive wiring 15a.

[0055] The end of the pillar 15 is bonded to the opposing first electrode support layer 11. The entire end of the pillar 15 can be bonded to the first electrode support layer 11. Some ends of the pillar 15 may not be bonded to the first electrode support layer 11. An adhesive layer may be formed between the bonded portion of the end of the pillar 15 and the first electrode support layer 11. An adhesive layer may be formed over the entire bonded portion of the end of the pillar 15. An adhesive layer may be formed on only a portion of the end of the bonded portion of the pillar 15.

[0056] The first electrode support layer 11, the second electrode support layer 12, and the pillar 15 can all be made of the same material. The first electrode support layer 11, the second electrode support layer 12, and the pillar 15 are formed from the same elastomer as in the first embodiment. The first electrode 13 and the second electrode 14, the third conductive wiring 15a, the first conductive wiring 13a, the first conductive wiring 13b, the second conductive wiring 14a, and the second conductive wiring 14b all use the same elastomer as the first electrode support layer 11, the second electrode support layer 12, and the flexible substrate 15A.

[0057] In this embodiment, the first electrode 13 is connected to the circuit board 19 via the first conductive wiring 13a, the third conductive wiring 15a, and the second conductive wiring 14b. The second electrode 14 is connected to the circuit board 19 via the second conductive wiring 14a. The second conductive wiring 14b and the second conductive wiring 14a are arranged on the same surface of the second electrode support layer 12 and are connected to the circuit board 19 via connecting wires (cables) 19a, respectively.

[0058] Figure 5 is a cross-sectional view illustrating the operation of the capacitive sensor in this embodiment. Figure 6 is a cross-sectional view illustrating the operation of the capacitive sensor in this embodiment. In this embodiment, as shown in Figure 4, when no external load F is applied, the overlapping area of ​​the first electrode 13 and the second electrode 14 in a plan view is S. In contrast, when a leftward external load F is applied as shown in Figure 5, the overlapping area of ​​the first electrode 13 and the second electrode 14 becomes S - ΔS. Similarly, as shown in Figure 6, when an external load F is applied, the overlapping area of ​​the first electrode 13, located on the left side, with the second electrode 14 becomes S - ΔS. This causes a change in the capacitance formed by the first electrode 13 and the second electrode 14, and by detecting this change in capacitance, it becomes possible to measure the external load F.

[0059] Furthermore, as shown in Figures 5 and 6, even when an external load F acting as a shear force is applied, the third conductive wiring flexes along with the pillar 15, thereby maintaining electrical conduction between layers and preventing disconnection. In this embodiment, the capacitive sensor 10 is bonded by a plurality of pillars 15 spaced apart in the in-plane direction, compared to the first embodiment in which the entire surface of the first electrode support layer 11 and the second electrode support layer 12 is bonded by a flexible substrate 15A. Therefore, it is easier for the in-plane positional changes between the first electrode support layer 11 and the second electrode support layer 12 to occur. In other words, the sensitivity as a sensor characteristic can be improved.

[0060] In this configuration, the first electrode support layer 11, the second electrode support layer 12, and the pillar 15 are all made of the same elastomer material. Furthermore, the first electrode 13, the first conductive wiring 13a, the third conductive wiring 15a, and the second conductive wiring 14b are also made of the same flexible conductive material. Therefore, the first electrode support layer 11, the second electrode support layer 12, and the pillar 15 all have the same stress characteristics. Consequently, they do not exhibit deformation peculiarities such as locally varying hardness or localized softness. The first electrode support layer 11, the second electrode support layer 12, and the pillar 15 exhibit a uniform degree of deformation.

[0061] In other words, the first electrode support layer 11 and the second electrode support layer 12 deform in the same way in response to the applied external load F. As a result, the first electrode 13, the first conductive wiring 13a, the third conductive wiring 15a, and the second conductive wiring 14b also deform in the same way, preventing disconnection. This makes it possible to accurately detect the change in capacitance between the first electrode 13 and the second electrode 14.

[0062] Similar to the first embodiment, the capacitive sensor 10 according to this embodiment can also detect changes in capacitance between the first electrode 13 and the second electrode 14 by changing the distance d between the electrodes.

[0063] This embodiment can also achieve the same effects as the embodiment described above.

[0064] A third embodiment of the capacitive sensor (stacked flexible circuit device) according to the present invention will be described below with reference to the drawings. Figure 7 is a schematic cross-sectional view showing the capacitive sensor in this embodiment. Figure 8 is a schematic top view showing the capacitive sensor in this embodiment. In this embodiment, the difference from the first and second embodiments described above is the fourth conductive wiring, and other components corresponding to the first and second embodiments described above are denoted by the same reference numerals and their descriptions are omitted.

[0065] In this embodiment, as shown in Figures 7 and 8, the capacitive sensor 10 has a first electrode support layer 11 with two rows of three first electrodes 13, for a total of six electrodes. The three first electrodes 13 in each row are spaced evenly apart. The pillars 15 are arranged so that the six first electrodes 13 overlap when viewed in the stacking direction.

[0066] A first conductive wire 13a is connected to the first electrode 13 located at the right end of Figure 8. The first conductive wire 13a extends in the direction in which the row formed by the three first electrodes 13 extends. A third conductive wire 15a is connected to the first electrode 13, which is located in the center of Figure 8, at a position that is the center of the contour of the first electrode 13 when viewed in the stacking direction. The third conductive wire 15a penetrates the pillar 15 in the stacking direction and is connected to a second conductive wire 14b formed in the second electrode support layer 12. The second conductive wire 14b extends to the surface of the second electrode support layer 12 facing the first electrode support layer 11. The second conductive wire 14b is arranged parallel to the first conductive wire 13a. The second conductive wire 14b and the first conductive wire 13a are in a position that overlaps when viewed in the stacking direction.

[0067] A third conductive wire 15b is connected to the first electrode 13, located at the left end of Figure 8, at a position that is the center of the contour of the first electrode 13 when viewed in the stacking direction. The third conductive wire 15b penetrates the pillar 15 in the stacking direction and is connected to a fourth conductive wire 16a formed in the second electrode support layer 12. The fourth conductive wire 16a penetrates the second electrode support layer 12 in the thickness direction. The fourth conductive wire 16a extends parallel to the third conductive wire 15b. When viewed in the stacking direction, the direction in which the fourth conductive wire 16a and the third conductive wire 15b extend coincides.

[0068] One end of the fourth conductive wiring 16a is connected to the third conductive wiring 15b at the same layer as the surface of the second electrode support layer 12. The other end of the fourth conductive wiring 16a is connected to the second conductive wiring 14c at the same layer as the back surface of the second electrode support layer 12. The second conductive wiring 14c extends to the back surface of the second electrode support layer 12 on the side that is separated from the first electrode support layer 11. The second conductive wiring 14c is arranged parallel to the second conductive wiring 14b and the first conductive wiring 13a. The second conductive wiring 14c, the second conductive wiring 14b, and the first conductive wiring 13a are in positions that overlap when viewed in the stacking direction.

[0069] The fourth conductive wiring 16a, the third conductive wiring 15a, the third conductive wiring 15b, the first conductive wiring 13a, the second conductive wiring 14b, and the second conductive wiring 14c can all be made of conductors having the same elasticity as the first electrode 13 and the second electrode 14.

[0070] These second conductive wirings 14c, 14b, and 13a are formed in positions that overlap when viewed in the stacking direction, but because they are at different layers, they are spaced apart from each other. Furthermore, the second conductive wiring 14c, the second conductive wiring 14b, and the first conductive wiring 13a are formed in two sets parallel to each other, corresponding to the two rows of the first electrode 13. Note that in Figure 8, some configurations, such as pillar 15, are omitted from the illustration.

[0071] Figure 9 is a schematic top view showing a capacitive sensor for comparison. The capacitive sensor 010 shown in Figure 9, like the capacitive sensor 10, has six first electrodes 13 arranged in two rows when viewed from above. However, in this capacitive sensor 010, the conductive wiring 014b connected to the central first electrode 13 and the conductive wiring 014c connected to the rightmost first electrode 13 are all located at the same level as the first electrode 13, just as the first conductive wiring 13a connected to the rightmost first electrode 13 is located at the same level as the first electrode 13. Therefore, these conductive wirings 014b and 014c are arranged in parallel between the rows formed by the first electrodes 13.

[0072] In this embodiment, in the capacitive sensor 10 shown in Figure 8, the width dimension of the first electrode 13 in the vertical direction of the paper is set to W13. In contrast, in the capacitive sensor 010 shown in Figure 9, the width dimension of the first electrode 13 in the vertical direction of the paper is set to W013. As shown in Figures 8 and 9, the width dimension W013 is larger than the width dimension W13.

[0073] This is because, in the capacitive sensor 010 shown in Figure 9, two conductive wires 014b and two conductive wires 014c are spaced apart from each other between the rows of first electrodes 13. This spacing cannot be smaller than a predetermined dimension in order to reduce crosstalk between the conductive wires 014b and 014c, or to suppress a decrease in the signal-to-noise ratio.

[0074] Therefore, in the configuration shown in Figure 9, where conductive wiring 014b and conductive wiring 014c are placed on the same hierarchical level, the width dimension W013 must be larger than the width dimension W13 of the capacitive sensor 10 shown in Figure 8. In other words, by adopting a wiring layout that spans multiple levels, the capacitive sensor 10 can be easily miniaturized.

[0075] Thus, in this embodiment, it is possible to easily miniaturize the capacitive sensor 10. Furthermore, since wiring layouts spanning multiple layers are possible, the degree of freedom in wiring is improved, and the distance between wires can be increased, making it easy to reduce crosstalk and improve the signal-to-noise ratio.

[0076] This embodiment can also achieve the same effects as the embodiment described above.

[0077] A fourth embodiment of the capacitive sensor (stacked flexible circuit device) according to the present invention will be described below with reference to the drawings. Figure 10 is a schematic cross-sectional view showing the capacitive sensor in this embodiment. The difference in this embodiment from the first to third embodiments described above is the third conductive wiring; other components corresponding to the first to third embodiments described above are denoted by the same reference numerals and their descriptions may be omitted.

[0078] In this embodiment, as shown in Figure 10, the capacitive sensor 10 has two third conductive wires 15a and 15b formed on a single pillar 15. The third conductive wires 15a and 15b are connected to different second conductive wires 14a and 14b, respectively.

[0079] One third conductive wire 15a has one end connected to the first electrode 13 or the first conductive wire 13a. The other end of the third conductive wire 15a is connected to the second conductive wire 14a. Another third conductive wire 15b has one end connected to the first electrode 13 or the first conductive wire 13a. The other end of the third conductive wire 15b is connected to the second conductive wire 14b. The second conductive wiring 14a and the second conductive wiring 14b extend in a direction perpendicular to the plane of the paper.

[0080] In the capacitive sensor 10 of this embodiment, by making the thickness of the pillar 15 sufficiently large, the distance between the second conductive wiring 14a and the second conductive wiring 14b can be sufficiently large, thereby suppressing the occurrence of crosstalk and sufficiently increasing the signal-to-noise ratio. Furthermore, since the third conductive wiring 15a and the third conductive wiring 15b that connect the layers can be arranged on a single pillar, the degree of freedom in wiring layout can be further improved.

[0081] In this embodiment, the third conductive wiring 15a and the third conductive wiring 15b only need to be spaced apart to the extent that crosstalk can be suppressed, and the thickness of each wiring or their position in the cross-section of the pillar 15 is not particularly limited.

[0082] Furthermore, the third conductive wiring 15a and the third conductive wiring 15b of this embodiment can each be arranged on opposite surfaces of a rectangular pillar. Alternatively, the third conductive wiring 15a and the third conductive wiring 15b of this embodiment can be arranged at opposite corners. Moreover, if the pillar 15 has a large diameter, the third conductive wiring 15a and the third conductive wiring 15b of this embodiment can be arranged on the same surface.

[0083] This embodiment can also achieve the same effects as the embodiment described above.

[0084] A fifth embodiment of the capacitive sensor (stacked flexible circuit device) according to the present invention will be described below with reference to the drawings. Figure 11 is a schematic cross-sectional view showing the capacitive sensor in this embodiment. In this embodiment, the difference from the first to fourth embodiments described above is the third conductive wiring, and other components corresponding to the first to fourth embodiments described above are denoted by the same reference numerals and their descriptions may be omitted.

[0085] In this embodiment, as shown in Figure 11, the entire cross-section of a single pillar 15 of the capacitive sensor 10 is a third conductive wire 15d. One end of the third conductive wire 15d is connected to the first electrode 13 or the first conductive wire 13a. Note that it is sufficient for a portion of one end of the third conductive wire 15d to be connected to the first electrode 13 or the first conductive wire 13a, and the entire surface can also be connected to the first electrode 13 or the first conductive wire 13a.

[0086] In a pillar 15 where the entire cross-section is the third conductive wiring 15d, the other end of the third conductive wiring 15d is connected to the second electrode 14 or the second conductive wiring 14b. It is also acceptable for only a portion of the other end of the third conductive wiring 15d to be connected to the second electrode 14 or the second conductive wiring 14b, or for the entire surface to be connected to the second electrode 14 or the second conductive wiring 14b.

[0087] This embodiment can also achieve the same effects as the embodiment described above.

[0088] A sixth embodiment of the capacitive sensor (stacked flexible circuit device) according to the present invention will be described below with reference to the drawings. Figure 12 is a schematic cross-sectional view showing the capacitive sensor in this embodiment. Figure 13 is a schematic cross-sectional view showing the pillar of the capacitive sensor in this embodiment. In this embodiment, the difference from the first to fifth embodiments described above is the third conductive wiring, and other components corresponding to the first to fifth embodiments described above are denoted by the same reference numerals and their descriptions may be omitted.

[0089] In this embodiment, as shown in Figures 12 and 13, the capacitive sensor 10 has a third conductive wiring 15a formed in the center of a single pillar 15. In addition, a third conductive wiring 15e is formed around the pillar 15. The third conductive wire 15a has one end connected to the first electrode 13 or the first conductive wire 13a. The other end of the third conductive wire 15a is connected to the second conductive wire 14b. The third conductive wire 15a constitutes a signal line connected to the first electrode 13.

[0090] One end of the third conductive wiring 15e is connected to the first conductive wiring 13c. The third conductive wiring 15e is not connected to the first electrode 13. The other end of the third conductive wiring 15e is not connected to a conductor of the same hierarchical level as the second conductive wiring 14b.

[0091] The first conductive wire 13c is at ground potential. The third conductive wire 15e, which is connected to the first conductive wire 13c, is also at ground potential. The third conductive wire 15e is formed around the entire circumference of the pillar 15. One end of the third conductive wire 15e is spaced apart from the first electrode 13 or the first conductive wire 13a so as not to connect to the first electrode 13 or the first conductive wire 13a. The other end of the third conductive wire 15e is spaced apart from the second conductive wire 14b so as not to connect to the second conductive wire 14b.

[0092] The third conductive wire 15e runs along the entire length of the third conductive wire 15a, surrounding its entire circumference. Furthermore, the third conductive wire 15e is at ground potential. As a result, the third conductive wire 15e can act as a ground shield for the third conductive wire 15a. Therefore, crosstalk to the signal line, the third conductive wire 15a, is reduced, noise immunity is improved, and the signal-to-noise ratio (S / N ratio) can be enhanced.

[0093] Alternatively, a second conductive wiring that is at ground potential can be formed in the second electrode support layer 12, and the other end of the third conductive wiring 15e can be connected to it.

[0094] This embodiment can also achieve the same effects as the embodiment described above.

[0095] A seventh embodiment of the capacitive sensor (stacked flexible circuit device) according to the present invention will be described below with reference to the drawings. Figure 14 is a schematic cross-sectional view showing the capacitive sensor in this embodiment. Figure 15 is a schematic cross-sectional view showing the pillar arrangement of the capacitive sensor in this embodiment. In this embodiment, the difference from the first to sixth embodiments described above is the third conductive wiring, and other components corresponding to the first to sixth embodiments described above are denoted by the same reference numerals and their descriptions may be omitted.

[0096] In this embodiment, as shown in Figures 14 and 15, the entire cross-section of a single pillar 15 of the capacitive sensor 10 is a third conductive wire 15d. One end of the third conductive wire 15d is connected to the first electrode 13 or the first conductive wire 13a. Note that it is sufficient for a portion of one end of the third conductive wire 15d to be connected to the first electrode 13 or the first conductive wire 13a, and the entire surface can also be connected to the first electrode 13 or the first conductive wire 13a. The third conductive wire 15d constitutes a signal line connected to the first electrode 13.

[0097] The other end of the third conductive wiring 15d is connected to the second electrode 14 or the second conductive wiring 14b. Alternatively, it is sufficient for only a portion of the other end of the third conductive wiring 15d to be connected to the second electrode 14 or the second conductive wiring 14b; the entire length of the third conductive wiring 15d may also be connected to the second electrode 14 or the second conductive wiring 14b.

[0098] Around a pillar 15 whose entire cross-section is the third conductive wiring 15d, multiple pillars 15 whose entire cross-section is the third conductive wiring 15f are arranged spaced apart in the in-plane direction of the first electrode support layer 11 and the second electrode support layer 12. The third conductive wire 15f has one end connected to the first conductive wire 13c. The third conductive wire 15d only needs to have a portion of one end connected to the first conductive wire 13c, or its entire length may be connected to the first conductive wire 13c. The third conductive wire 15f does not have one end connected to the first electrode 13 or the first conductive wire 13a. That is, one end of the third conductive wire 15f is separated from the first electrode 13 or the first conductive wire 13a. The first conductive wire 13c is at ground potential.

[0099] The other end of the third conductive wire 15f is connected to the second conductive wire 14e. Note that it is sufficient for only a portion of the other end of the third conductive wire 15f to be connected to the second conductive wire 14e, or the entire length of the third conductive wire 15f may be connected to the second conductive wire 14e. The other end of the third conductive wire 15f is not connected to the second electrode 14 or the second conductive wire 14b. That is, the other end of the third conductive wire 15f is spaced apart from the second electrode 14 or the second conductive wire 14b. The second conductive wire 14e is at ground potential.

[0100] A pillar 15 whose entire cross-section is the third conductive wiring 15f surrounds the entire circumference of a pillar 15 whose entire cross-section is the third conductive wiring 15d, along the entire length of the pillar 15 whose entire cross-section is the third conductive wiring 15d. Furthermore, all of the third conductive wiring 15f is at ground potential. As a result, the third conductive wiring 15f can act as a ground shield for the third conductive wiring 15d. Therefore, crosstalk to the signal line, the third conductive wiring 15d, can be reduced, noise immunity can be improved, and the signal-to-noise ratio can be improved.

[0101] Although the pillars 15, which are the third conductive wiring 15f, are spaced apart from each other, these distances are not particularly limited as long as they can function as a ground shield for the third conductive wiring 15d. Furthermore, in this embodiment, since there is no need to form a third conductive wiring 15a inside the pillar 15, it is possible to reduce the manufacturing process while still having the function of a ground shield.

[0102] In Figure 15, to show that the third conductive wire 15f is at ground potential, GND is shown to be connected separately to all third conductive wires 15f; however, the configuration is not limited to this.

[0103] This embodiment can also achieve the same effects as the embodiment described above.

[0104] Hereinafter, an eighth embodiment of the capacitive sensor (stacked flexible circuit device) according to the present invention will be described with reference to the drawings. Figure 16 is a schematic cross-sectional view showing the capacitive sensor in this embodiment. The only difference in this embodiment from the first to seventh embodiments described above is the circuit board; other components corresponding to the first to seventh embodiments described above are denoted by the same reference numerals and their descriptions may be omitted.

[0105] In the capacitive sensor 10 of this embodiment, a circuit board 19 is connected to the back surface of the second electrode support layer 12, as shown in Figure 16. A wiring 19b is formed on the circuit board 19. A fourth conductive wiring 16a is connected to wiring 19b. A third conductive wiring 15b is connected to the fourth conductive wiring 16a. The third conductive wiring 15b is connected to the first electrode 13 or the first conductive wiring 13a.

[0106] In this embodiment, a third conductive wiring 15b is connected to the first electrode 13 or the first conductive wiring 13a at a position that is the center of the contour of the pillar 15 when viewed in the stacking direction. The third conductive wiring 15b penetrates the pillar 15 in the stacking direction and is connected to a fourth conductive wiring 16a formed in the second electrode support layer 12. The fourth conductive wiring 16a penetrates the second electrode support layer 12 in the thickness direction. The fourth conductive wiring 16a extends parallel to the third conductive wiring 15b. When viewed in the stacking direction, the direction in which the fourth conductive wiring 16a and the third conductive wiring 15b extend coincides.

[0107] One end of the fourth conductive wiring 16a is connected to the third conductive wiring 15b at the same level as the surface of the second electrode support layer 12. The other end of the fourth conductive wiring 16a is connected to wiring 19b at the same level as the surface of the circuit board 19. The wiring 19b is in contact with the back surface of the second electrode support layer 12 on the side that is separated from the first electrode support layer 11. The wiring 19b is arranged parallel to the first conductive wiring 13a. The wiring 19b, the fourth conductive wiring 16a, the third conductive wiring 15b, and the first electrode 13 or the first conductive wiring 13a are in positions that overlap when viewed in the stacking direction.

[0108] Figure 17 is a schematic cross-sectional view showing a capacitive sensor for comparison. In Figure 17, components other than those necessary are omitted. As shown in Figure 17, the capacitive sensor 10 of this embodiment has shorter wiring to the circuit board (measurement board) 19 compared to a configuration where it is connected to the circuit board 19 by a cable 19a. In other words, the capacitive sensor 10 of this embodiment shown in Figure 16 allows for further miniaturization and density reduction of the sensor. Alternatively, the shorter wiring can suppress crosstalk.

[0109] The circuit board 19 can be a rigid board, or it can be a flexible board.

[0110] This embodiment can also achieve the same effects as the embodiment described above.

[0111] Furthermore, in this embodiment, the second electrode support layer 12 can be omitted, and the other end of the third conductive wiring 15b can be directly connected to the wiring 19b of the circuit board 19.

[0112] A ninth embodiment of the capacitive sensor (stacked flexible circuit device) according to the present invention will be described below with reference to the drawings. Figure 18 is a schematic cross-sectional view showing the capacitive sensor in this embodiment. The difference in this embodiment from the first to eighth embodiments described above lies in the laminated structure; other components corresponding to the first to eighth embodiments described above are denoted by the same reference numerals and their descriptions may be omitted.

[0113] As shown in Figure 18, the capacitive sensor 10 of this embodiment has a first electrode support layer 11, a second electrode support layer 12, and in addition, a third electrode support layer 11B and a fourth electrode support layer 12B laminated together. In the figure, the flexible substrate 15 is shown as an integral part of the second electrode support layer 12, the third electrode support layer 11B, and the fourth electrode support layer 12B. The first electrode support layer 11 includes the first electrode 13. The second electrode support layer 12 includes the second electrode 14. The third electrode support layer 11B includes the first electrode 13B. The fourth electrode support layer 12B includes the second electrode 14B.

[0114] The capacitive sensor 10 has a third conductive wiring 15a that penetrates the second electrode support layer 12 in the stacking direction, a third conductive wiring 15a that penetrates the third electrode support layer 11B in the stacking direction, and a third conductive wiring 15a that penetrates the fourth electrode support layer 12B in the stacking direction. The third conductive wiring 15a connects the layers. In this embodiment, the arrangement of the first electrode 13, second electrode 14, first electrode 13B, second electrode 14B, and third conductive wiring 15a is not limited to this configuration. Also, the third conductive wiring 15a is shown including the fourth conductive wiring 16a.

[0115] The capacitive sensor 10 of this embodiment has a multilayer structure, which allows for a finer wiring layout and enables miniaturization and increased density of the entire sensor.

[0116] This embodiment can also achieve the same effects as the embodiment described above.

[0117] Hereinafter, a tenth embodiment of the capacitive sensor (stacked flexible circuit device) according to the present invention will be described with reference to the drawings. Figure 19 is a cross-sectional view showing the capacitive sensor in this embodiment. The difference in this embodiment from the first to ninth embodiments described above lies in the layers and the stacking of electrodes.

[0118] As shown in Figure 19, the capacitive sensor 20 in this embodiment includes a first electrode support layer 21, a second electrode support layer 22, a third electrode support layer 23, and a fourth electrode support layer 24. The first electrode support layer 21 has a first electrode (first conductive part) 25. The second electrode support layer 22 has a second electrode (second conductive part) 26. The third electrode support layer 23 has a third electrode (third conductive part) 27. The fourth electrode support layer 24 has a fourth electrode (third conductive part) 28.

[0119] The first electrode support layer 21, the second electrode support layer 22, the third electrode support layer 23, and the fourth electrode support layer 24 correspond to the first electrode support layer 11 and the second electrode support layer 12 of the first and second embodiments, and are laminated together and bonded by adhesive layers. The first electrode support layer 21, the second electrode support layer 22, the third electrode support layer 23, the fourth electrode support layer 24, and the flexible substrate are all formed from the same elastomer, as in each embodiment. The formation of the flexible substrate and the bonding of each electrode support layer are the same as in each embodiment. Note that the flexible substrate and the third wiring electrode are not shown in the figures. The flexible substrate can be a pillar or have other structures. The configuration of the third wiring electrode can also be appropriately selected from the above embodiments.

[0120] The first electrode support layer 21 and the second electrode support layer 22 constitute a proximity sensor. The third electrode support layer 23 and the fourth electrode support layer 24 constitute a three-axis force sensor. Here, the second electrode 26 constitutes a GND shield layer. The second electrode 26 can be formed over the entire surface of the first electrode support layer 21, the second electrode support layer 22, the third electrode support layer 23, and the fourth electrode support layer 24 so as to electrically shield the first electrode 25, the third electrode 27, and the fourth electrode 28. As a result, the upper proximity sensor composed of the first electrode support layer 21 and the second electrode support layer 22, and the three-axis force sensor composed of the third electrode support layer 23 and the fourth electrode support layer 24 can perform proximity detection on the upper side of the capacitive sensor 20, and three-axis force detection of vertical force Fz and shear forces Fx,Fy on the lower side, respectively.

[0121] In this embodiment, the capacitive sensor 20 can have electrode support layers corresponding to each electrode formed separately from the same material, and these layers bonded together with the same elastomer. Here, for each electrode formed at different positions in the thickness direction of the capacitive sensor 20, it is possible to form each electrode support layer as a divided structure in the thickness direction. In other words, each layer can be decomposed into multiple stages according to the electrode positions arranged according to the required sensor characteristics, and these can be bonded together. This facilitates the manufacturing of the capacitive sensor 20, improves sensor sensitivity, and improves peel resistance. In this case, electrodes can be placed within the same electrode support layer at different thickness positions so that they do not overlap when viewed from above.

[0122] At the same time, the manufacturing of the complex multilayer capacitive sensor 20 becomes easier, making it possible to provide a configuration that further combines sensors with different characteristics. Here, if necessary, pillars such as those in the second embodiment can be formed between each electrode support layer to easily improve sensor characteristics.

[0123] In this embodiment, the capacitive sensor 20 is formed from the same elastomer as the multiple layers and the adhesive layers between the multiple layers, making it possible to achieve the same effects as in the embodiment described above. Furthermore, the first electrode 25 can measure proximity data with respect to the outside of the sensor, and the third electrode 27 and fourth electrode 28 can measure the triaxial force of the applied load. In this case, the second electrode 26 is a ground electrode for separating the proximity sensor and the three-axis force sensor, and can provide a GND shielding effect.

[0124] In this case, a sensor that acquires proximity by changing capacitance values ​​and pressure by changing resistance values ​​requires separate data acquisition circuits. In contrast, in this embodiment, both proximity and three-axis force can be acquired by a single capacitive sensor, the capacitive sensor 20. Therefore, the capacitive sensor 20 in this embodiment can reduce the size of the measurement circuit and has the effect of enabling system miniaturization.

[0125] Alternatively, the first electrode 25 can be omitted, and the second electrode 26 can be used as a self-capacitive proximity sensor. In this case, the timing for acquiring pressure with the third electrode 27 and fourth electrode 28 and the timing for acquiring proximity data with the second electrode 26 can be switched using time-division multiplexing.

[0126] Hereinafter, an eleventh embodiment of the capacitive sensor (stacked flexible circuit device) according to the present invention will be described with reference to the drawings. Figure 20 is a schematic perspective view showing the capacitive sensor (stacked flexible circuit device) in this embodiment. Figure 21 is a schematic cross-sectional view showing the capacitive sensor (stacked flexible circuit device) in this embodiment. This embodiment differs from the first to tenth embodiments described above in terms of the layers and electrode arrangement.

[0127] In this embodiment, the capacitive sensor 30 is formed on the arm sleeve 39, as shown in Figures 20 and 21. The capacitive sensor 30 is integrally formed with a cylindrical arm sleeve 39. The capacitive sensor 30, together with the arm sleeve 39, has flexibility that allows for folding, bending, and other deformations. The arm sleeve 39 is made of a flexible material with elasticity, such as a resin sheet or cloth.

[0128] The capacitive sensor 30 has a first electrode support layer 31 and a second electrode support layer 32. The first electrode support layer 31 and the second electrode support layer 32 are laminated together as an arm sleeve 39. The first electrode support layer 31 includes a first electrode (first conductive part) 33Aa, a first connector (first conductive part) 33A, a first conductive wiring 33b, and a first connector (first conductive part) 33B. The second electrode support layer 32 includes a second electrode (second conductive part) 34a. A flexible substrate 15A is formed between the first electrode support layer 31 and the second electrode support layer 32. Instead of the flexible substrate 15A, a pillar 15 may be formed between the first electrode support layer 31 and the second electrode support layer 32. The flexible substrate 15A and the pillar 15 are not shown in the illustration.

[0129] The first electrode 33Aa is connected to the first connector 33A. The first conductive wire 33b has both ends connected to the first connector 33B and the third conductive wire 35a. The third conductive wire 35a is connected to the second electrode 34a. The first electrode 33A is connected to the first conductive wire 33b. The first electrode 33, the first electrode 33Aa, the first connector 33A, the first conductive wire 33b, and the first connector 33B are formed at the same hierarchical level.

[0130] The first electrode 33Aa and the second conductive wiring 34a are arranged to overlap when viewed in the stacking direction of the first electrode support layer 31 and the second electrode support layer 32. The first electrode 33Aa and the second conductive wiring 34a are electrodes that detect capacitance in a capacitance sensor. Similarly, a circuit board 19 and the like are connected to the first connector 33A and the first connector 33B.

[0131] The first electrode support layer 31 corresponds to the first electrode support layer 11. The second electrode support layer 32 corresponds to the second electrode support layer 12. The first electrode 33 corresponds to the first electrode 13. The first electrode 33A corresponds to the first electrode 13. The first conductive wiring 33a corresponds to the first conductive wiring 13a and others. The first conductive wiring 33b corresponds to the first conductive wiring 13b and others. The second conductive wiring 34a corresponds to the second conductive wiring 14b and others.

[0132] In the capacitive sensor 30, the first electrode 33Aa and the second conductive wiring 34a are located at the joint portion, such as the elbow, in an arm sleeve 39 worn on the arm. When an external force is applied to the arm sleeve 39, such as when the wearer bends their elbow, the arm sleeve 39 folds and deforms integrally with the elbow. As a result, the capacitive sensor 30 folds as shown in Figure 21. Consequently, the positional change between the first electrode 33Aa and the second conductive wiring 34a causes a change in their capacitance. By detecting this change in capacitance, it becomes possible to measure arm movement and other movements as an external load F, similar to the embodiments described above.

[0133] Furthermore, the capacitive sensor 30 can not only measure arm movement due to elbow bending, but also measure contact forces between the arm and the external environment, such as contact with the external environment or being touched by a person, regardless of elbow bending. In measuring contact force, the external load F can be considered as both the contact force between the arm and the outside, and the force of the arm's movement, applied to the arm sleeve 39. In this case, the two force factors may be separated. When separating the causes of two forces, other sensors such as joint angle sensors can be used in conjunction with the capacitive sensor 30, and a method using data from both can be employed. Alternatively, when separating the causes of two forces, a machine learning method can be used on the output data of the capacitive sensor 30.

[0134] The capacitive sensor 10 according to this embodiment can also detect changes in capacitance between the first electrode 13 and the second electrode 14 by changing the distance d between the electrodes, similar to the embodiments described above.

[0135] This embodiment can also achieve the same effects as the embodiment described above.

[0136] Hereinafter, a twelfth embodiment of the flexible actuator (stacked flexible circuit device) according to the present invention will be described with reference to the drawings. Figure 22 is a schematic perspective view showing the flexible actuator (stacked flexible circuit device) in this embodiment. In this embodiment, the differences from the first to eleventh embodiments described above are in the layers and the arrangement of electrodes. Other components corresponding to the embodiments described above are denoted by the same reference numerals, and their descriptions may be omitted.

[0137] As shown in Figure 22, the flexible actuator 40 in this embodiment consists of a tactile actuator sheet 49 that is worn on the palm and a sack 48 that is worn on the fingertip. The tactile actuator sheet 49 consists of a flexible sheet formed in the shape of a glove. The sack 48 consists of a flexible sheet formed in the shape of a cup.

[0138] The tactile actuator sheet 49 has a plurality of first electrodes 13, similar to the third embodiment shown in Figure 8. The plurality of first electrodes 13 form a circuit connected to the circuit board 19 by first conductive wiring 13a and second conductive wiring 14a formed in the first electrode support layer 11 and second electrode support layer 12, and third conductive wiring 15a and fourth conductive wiring 16a formed between these layers. The plurality of first electrodes 13 are in contact with the wearer's palm.

[0139] The sack 48 also has a plurality of first electrodes 13. The plurality of first electrodes 13 form a circuit connected to the circuit board 19 by first conductive wiring 13a and second conductive wiring 14a formed in the first electrode support layer 11 and second electrode support layer 12, and third conductive wiring 15a and fourth conductive wiring 16a formed between these layers. The plurality of first electrodes 13 are in contact with the wearer's fingertips. In the tactile actuator sheet 49 and sack 48, the multiple first electrodes 13 form an electrode array.

[0140] The flexible actuator 40 generates a fine tactile sensation by directly applying electrical stimulation to the skin of the palm and fingertips in conjunction with the tactile actuator sheet 49 and sack 48. Here, by reducing the area of ​​the first electrode 13 and increasing the number of first electrodes 13, it is possible to provide high-resolution stimulation to the skin. By providing high-resolution stimulation to the skin, a finer tactile sensation can be generated.

[0141] The flexible actuator 40 can flexibly deform in the tactile actuator sheet 49 and sack 48 to follow the movements of the palm and fingertips. As a result, even when the tactile actuator sheet 49 and sack 48 deform, the contact state with the skin of the palm and fingertips is maintained. The flexible actuator 40 can be easily miniaturized by employing a wiring layout that spans multiple layers. It can achieve high-resolution skin stimulation and generate a finer tactile sensation.

[0142] This embodiment can also achieve the same effects as the embodiment described above.

[0143] Hereinafter, a thirteenth embodiment of the flexible battery (stacked flexible circuit device) according to the present invention will be described with reference to the drawings. Figure 23 is a schematic perspective view showing the flexible battery (stacked flexible circuit device) in this embodiment. Figure 24 is a schematic cross-sectional view showing the flexible battery (stacked flexible circuit device) in this embodiment. In this embodiment, the differences from the first to twelfth embodiments described above are in the arrangement of layers and electrodes, and other components corresponding to the embodiments described above are denoted by the same reference numerals and their descriptions may be omitted.

[0144] In this embodiment, the flexible battery 50 is formed integrally with the arm sleeve 39 together with the capacitive sensor 10, as shown in Figures 23 and 24. The flexible battery 50 supplies power to the circuit board 19 for driving the capacitive sensor 10. The flexible battery 50 includes a first electrode 13, a second electrode 14, and a separator layer 56.

[0145] The first electrode 13 is connected to the first conductive wiring 13a. The first conductive wiring 13a is connected to the third conductive wiring 15a. The third conductive wiring 15a is connected to the second conductive wiring 14a. The second conductive wiring 14a is connected to the circuit board 19. The second electrode 14 is connected to the second conductive wiring 14b. The second conductive wiring 14b is connected to the circuit board 19. The second conductive wiring 14a and the second conductive wiring 14b may be arranged on the same layer. The second conductive wiring 14a and the second conductive wiring 14b may be arranged on different layers within the second electrode support layer 12.

[0146] The flexible battery 50 in this embodiment is, for example, an aqueous stretchable zinc manganese dioxide (Zn-MnO2) secondary battery. The flexible battery 50 is a single polymer-based battery that is stretchable. The first electrode 13 is designated as the cathode (positive electrode). The second electrode 14 is designated as the anode (negative electrode). A separator layer 56 is stacked between the first electrode 13 and the second electrode 14. Alternatively, the first electrode 13 may be designated as the anode (negative electrode) and the cathode (positive electrode) of the second electrode 14 may be designated as the cathode (positive electrode).

[0147] The first electrode 13 consists of a carbon conductive layer (current collector) 13ct containing carbon nanofibers and a Zn layer (electrolyte layer) 13zn containing Zn particles and carbon black particles. The second electrode 14 consists of a carbon conductive layer (current collector) 14an containing carbon nanofibers and a MnO2 layer (electrolyte layer) 14mn containing MnO2 particles and carbon black particles. The separator layer 56 is a porous membrane using SIBS as an elastomer, polymer, and binder. The separator layer 56 is a stretchable membrane with high porosity and electrical insulation capability. The separator layer 56 corresponds to the flexible substrate 15A. Note that if the carbon conductive layer (current collector) 13ct is considered as the first electrode support layer 11 and the carbon conductive layer (current collector) 14an is considered as the second electrode support layer 12, then the Zn layer 13zn and the MnO2 layer 14mn may correspond to the flexible substrate 15A.

[0148] The Zn layer 13Zn and the MnO2 layer 14mn are in contact with the front and back surfaces of the separator layer 56, respectively. The carbon conductive layer 13ct, the Zn layer 13Zn, the separator layer 56, the MnO2 layer 14mn, and the carbon conductive layer 14an constitute the cell of the flexible battery 50. Each cell of the flexible battery 50 is formed by encapsulating the aforementioned battery particles and other components within a biocompatible polymer, such as poly(styrene-isobutylene-styrene)SIBS, which is a triblock thermoplastic copolymer, to create each layer. As a result, the cells of the flexible battery 50 have sufficient flexibility. In the arm sleeve 39, a flexible base material 15A and a pillar 15 can be placed between the first electrode support layer 11 and the second electrode support layer 12, except in the area corresponding to the flexible battery 50.

[0149] The flexible battery 50 can be positioned in the arm sleeve 39 attached to the arm, at a joint such as the elbow. Alternatively, it may be positioned at a location offset from the elbow. When an external force is applied to the arm sleeve 39, such as when the wearer bends their elbow, the arm sleeve 39 folds and deforms together with the elbow. As a result, the flexible battery 50 folds as shown in Figure 23. This causes the first electrode 13, the separator layer 56, and the second electrode 14 to fold. Because the flexible battery 50 has sufficient flexibility, these layers do not separate from each other, and the electromotive force can be maintained regardless of deformation. As a result, even when the flexible battery 50 deforms together with the arm sleeve 39, the power supply for driving the capacitive sensor 10 can be maintained by the flexible battery 50.

[0150] This embodiment can also achieve the same effects as the embodiment described above.

[0151] Furthermore, in the present invention, it is also possible to individually select the various configurations in each of the embodiments described above and combine them as appropriate. [Explanation of Symbols]

[0152] 10, 20, 30… Capacitive sensors (Stacked flexible circuit devices) 11,31...First electrode support layer (first layer) 12,32...Second electrode support layer (second layer) 13,25,33Aa...First electrode (first conductive part) 13a, 13b, 13c, 33b...first conductive wiring 14,26,34a...Second electrode (second conductive part) 14a, 14b, 14c, 14e… Second conductive wiring 15... Pillar 15A…Flexible base material 15a, 15b, 15d, 15e, 15f, 35a... Third conductive wiring 15b, 15d, 15e... Third conductive wiring 16a...Fourth conductive wiring 19…Circuit board (measurement board) 19a...Connecting wire (cable) 19b...Wiring 21...First electrode support layer 22...Second electrode support layer 23…Third electrode support layer 24...Fourth electrode support layer 27...Third electrode 28…4th electrode 40... Flexible actuator (Stacked flexible circuit device) 50... Flexible battery (Stacked flexible circuit device) 56... Separator layer

Claims

1. A stacked flexible circuit device consisting of multiple stacked layers, First conductive part and A second conductive portion is arranged opposite the first conductive portion, A first conductive wiring at the same level as the first conductive part, A second conductive wiring at the same level as the second conductive part, A flexible substrate having dielectric properties and elasticity, disposed between the first conductive portion and the second conductive portion, A first layer including the first conductive portion and the first conductive wiring, The second layer includes the second conductive portion and the second conductive wiring, Equipped with, The flexible substrate has a plurality of pillars that extend in the lamination direction between the first layer and the second layer and are spaced apart from each other in a direction intersecting the lamination direction. Of the multiple pillars, at least one of the pillars is: A third conductive wiring that connects the first conductive part or the first conductive wiring and the second conductive part or the second conductive wiring between layers, The third conductive wiring and the third conductive wiring at different cross-sectional positions of the pillar, It was placed, The third conductive wiring is arranged inside the pillar. The third conductive wiring is arranged around at least one of the pillars so as to be in contact with the pillar. A stacked flexible circuit device characterized by the following features.

2. The flexible substrate and at least one of the first or second layer are made of the same material as the flexible substrate. The stacked flexible circuit device according to claim 1, characterized by its features.

3. At least one of the pillars is formed such that the third conductive wiring and the third conductive separate wiring are integrated, and in the cross-section of the pillar, the third conductive wiring is formed in the center and the third conductive separate wiring is formed around the pillar. The stacked flexible circuit device according to claim 1, characterized by its features.

4. The first conductive portion has a first electrode, and the second conductive portion has a second electrode. Among the multiple pillars, the pillar in which the third conductive wiring is not arranged has one end in the stacking direction in contact with the first electrode and the other end in contact with the second electrode. The stacked flexible circuit device according to claim 1, characterized by its features.

5. The third conductive wiring is set to ground potential. The stacked flexible circuit device according to claim 1, characterized by its features.

6. The third conductive wiring is arranged in a manner that intersects the stacking direction, with multiple connections between them, and spaced apart from each other. The arrangement includes a third conductive wiring connected to the first conductive part or the second conductive part, surrounded by a third conductive wiring not connected to the first conductive part or the second conductive part. The stacked flexible circuit device according to claim 1, characterized by its features.

7. The device comprises a fourth conductive wiring that penetrates at least one of the first or second layers in the stacking direction, The stacked flexible circuit device according to claim 1, characterized by its features.

8. At least one of the first or second layer is connected to a circuit board that overlaps with the first or second layer in the stacking direction. The stacked flexible circuit device according to claim 1, characterized by its features.

9. A stacked flexible circuit device as described in any one of claims 1 to 8, The first conductive portion and the second conductive portion have overlapping portions when viewed in the stacking direction, and the capacitance between the first conductive portion and the second conductive portion is detected. A capacitive sensor characterized by the following features.

10. A stacked flexible circuit device as described in any one of claims 1 to 8, The first conductive portion or the first conductive wiring and the second conductive portion or the second conductive wiring have portions that overlap when viewed in the stacking direction. A flexible actuator characterized by the following features.

11. A stacked flexible circuit device as described in any one of claims 1 to 8, The first conductive portion and the second conductive portion have portions that overlap when viewed in the stacking direction, The first conductive part is an anode, and the second conductive part is a cathode. A separator layer is provided between the first conductive portion and the second conductive portion. A flexible battery characterized by the following features.

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