Component mounting machine and method for mounting leaded components onto a circuit board.

Abstract

This component mounting machine is provided with a gripper for gripping an electronic component with a pair of gripping claws and releases the electronic component gripped by the gripper by moving the gripper in a direction intersecting with a vertical direction after having mounted the electronic component gripped by the gripper onto a substrate. This method is for mounting a leaded component onto a substrate by executing: an insertion process in which when mounting a leaded component, the gripper not equipped with a pusher for pushing a component body of a leaded component grips the component body with the pair of gripping claws and inserts leads of the leaded component into insertion holes formed in the substrate; and a release process in which after the insertion process is executed, the pair of gripping claws are separated from the component body and the gripper is moved in the direction intersecting with the vertical direction, whereby the leaded component is released from the gripper.

Description

Technical Field

[0001] The present invention relates to a component mounting machine or the like for mounting an electronic component on a substrate.

Background Art

[0002] The following patent documents describe a technique for mounting an electronic component on a substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] <松000027>In this specification, an object is to appropriately mount an electronic component on a substrate.

Means for Solving the Problems

[0005] To solve the above problems, this specification includes a gripper that grips an electronic component with a pair of gripping claws, and after mounting the electronic component gripped by the gripper on a substrate, the gripper is With an upward angle and travel distance set for each type of electronic component moved in a direction intersecting the vertical direction to disclose a component mounting machine that detaches the electronic component gripped by the gripper.

[0006] Also, to solve the above problems, this specification includes a gripper that does not include a pusher for pushing the component body of a lead component when mounting the lead component, and the gripper grips the component body with a pair of gripping claws and inserts a lead included in the lead component into an insertion hole formed in a substrate in an insertion step, and after executing the insertion step, the pair of gripping claws separate from the component body and , with the upward angle and travel distance set for each type of lead component,A method for mounting a lead component to a substrate is disclosed, which involves performing a detachment step of moving the gripping tool in a direction intersecting the vertical direction to detach the lead component from the gripping tool. [Effects of the Invention]

[0007] According to this disclosure, after attaching an electronic component held by a gripping tool having a pair of gripping claws to a substrate, the electronic component can be released from the gripping tool by moving the gripping tool in a direction intersecting the vertical direction, thereby enabling proper attachment of the electronic component to the substrate. [Brief explanation of the drawing]

[0008] [Figure 1] A perspective view showing a component mounting machine. [Figure 2] This is a perspective view showing a component mounting machine / device. [Figure 3] This is a side view showing a component holder. [Figure 4] This figure shows leaded components mounted on a circuit board. [Figure 5] This figure shows leaded components mounted on a circuit board. [Figure 6] This diagram shows a component holder that moves diagonally upward after a leaded component has been mounted on a circuit board. [Figure 7] This diagram shows a component holder that moves diagonally upward after a leaded component has been mounted on a circuit board. [Figure 8] This diagram shows a component holder that moves laterally after a leaded component has been mounted on a circuit board. [Figure 9] This diagram shows a component holder that moves laterally after a leaded component has been mounted on a circuit board. [Figure 10] This diagram shows the movement directions of the component holder in the X and Y directions after the leaded component has been mounted on the circuit board. [Modes for carrying out the invention]

[0009] Hereinafter, embodiments of the present invention will be described in detail with reference to the figures, as embodiments for carrying out the present invention.

[0010] Figure 1 shows a component mounting machine 10. The component mounting machine 10 is a device for mounting components onto a circuit board 12. The component mounting machine 10 comprises a main unit 20, a substrate transport and holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a loose component supply device 30, and a component supply device 32. The circuit board 12 can be a circuit board, a three-dimensional structured substrate, etc., and the circuit board can be a printed wiring board, a printed circuit board, etc.

[0011] The main body of the device 20 consists of a frame 40 and a beam 42 mounted on the frame 40. The substrate transport and holding device 22 is located in the center of the frame 40 in the front-rear direction and has a transport device 50 and a clamping device 52. The transport device 50 is a device for transporting the circuit substrate 12, and the clamping device 52 is a device for holding the circuit substrate 12. As a result, the substrate transport and holding device 22 transports the circuit substrate 12 and also holds the circuit substrate 12 fixedly in a predetermined position. In the following description, the transport direction of the circuit substrate 12 will be referred to as the X direction, the horizontal direction perpendicular to that direction will be referred to as the Y direction, and the vertical direction will be referred to as the Z direction. In other words, the width direction of the component mounting machine 10 is the X direction, and the front-rear direction is the Y direction.

[0012] The component mounting device 24 is mounted on the beam 42 and has two work heads 60 and 62 and a work head moving device 64. As shown in Figure 2, the work head moving device 64 has an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. The two work heads 60 and 62 are moved together to any position on the frame 40 by the X-direction moving device 68 and the Y-direction moving device 70. In addition, each work head 60 and 62 is detachably mounted on sliders 74 and 76, and the Z-direction moving device 72 moves the sliders 74 and 76 individually in the vertical direction. In other words, the work heads 60 and 62 are moved individually in the vertical direction by the Z-direction moving device 72.

[0013] Furthermore, a parts holder 77 is attached to the lower end surface of each work head 60, 62. The parts holder 77 is a so-called chuck and, as shown in Figure 3, includes a main body 78, a pair of gripping claws 80, and a stopper 82. The pair of gripping claws 80 are arranged to extend downward from the lower surface of the main body 78 and slide linearly toward and toward each other. The stopper 82 is fixed to the lower surface of the main body 78 between the pair of gripping claws 80. As a result, the parts holder 77 grips a part by bringing the pair of gripping claws 80 closer together. At this time, the parts holder 77 grips the part with the pair of gripping claws 80 while the lower surface of the stopper 82 is in contact with the upper surface of the part. As a result, the parts holder 77 can grip the part while stabilizing its orientation. The part holder 77 releases the part from between the pair of gripping claws 80 by separating the pair of gripping claws 80. A pair of rubber plates 86 are attached to the lower ends of the opposing sides of the pair of gripping claws 80. This prevents slippage between the part and the gripping claws 80 when gripping a part, allowing the pair of gripping claws 80 to grip the part stably. Furthermore, even if the dimensions of the parts differ slightly from part to part due to tolerances, the rubber plates 86 elastically deform, allowing the pair of gripping claws 80 to grip the parts appropriately. The part holder 77 is detachable from the work heads 60 and 62, and any part holder can be selectively attached to the work heads 60 and 62. Furthermore, each work head 60, 62 is provided with a rotation device (not shown) that rotates the part holder 77 around its vertical axis, and by operating the rotation device, it is possible to change the orientation of the part held by the part holder 77.

[0014] As shown in FIG. 2, the mark camera 26 is attached to the slider 74 in a downward-facing state and moves in the X, Y, and Z directions together with the work head 60. As a result, the mark camera 26 images any position on the frame 40. Further, as shown in FIG. 1, the parts camera 28 is disposed in an upward-facing state between the base material conveyance and holding device 22 and the parts supply device 32 on the frame 40. As a result, the parts camera 28 images the parts held by the part holders 77 of the work heads 60 and 62.

[0015] The loose parts supply device 30 is disposed at one end of the frame 40 in the front-rear direction. The loose parts supply device 30 is a device that aligns a plurality of parts scattered in a scattered state and supplies the parts in an aligned state. That is, it is a device that aligns a plurality of parts in an arbitrary posture into a predetermined posture and supplies the parts in the predetermined posture.

[0016] The parts supply device 32 is disposed at the other end of the frame 40 in the front-rear direction. The parts supply device 30 has a tray-type parts supply device 87 and a feeder-type parts supply device 88. The tray-type parts supply device 87 is a device that supplies parts placed on a tray (not shown). The feeder-type parts supply device 88 is a device that supplies parts by a tape feeder 90.

[0017] In the component mounter 10, the component mounting operation is performed on the circuit board 12 held by the board conveyance and holding device 22 according to the above-described configuration. In the component mounter 10, various components can be mounted on the circuit board 12. The case of mounting a lead component (see FIGS. 4 and 5) 100 on the circuit board 12 will be described below.

[0018] Specifically, the circuit board 12 is transported to the work position by the transport device 50 and fixedly held there by the clamp device 52. Next, the mark camera 26 moves above the circuit board 12 and images the circuit board 12. This provides information about the position of a pair of through holes (see Figures 4 and 5) 102 formed in the circuit board 12. In addition, the loose parts supply device 30 or the parts supply device 32 supplies leaded parts 100 at a predetermined supply position. As shown in Figures 4 and 5, the leaded parts 100 generally include a block-shaped part body 106 and two leads 108 extending in the same direction from the bottom surface of the part body 106. In other words, the leaded parts 100 are so-called radial leaded parts.

[0019] Then, either the work head 60 or 62 moves above the supply position of the part, and as shown in Figures 4 and 5, the pair of gripping claws 80 of the part holder 77 grips the part body 106 of the lead part 100. More specifically, when the work heads 60 or 62 are moved above the lead part 100, the pair of gripping claws 80 of the part holder 77 are spaced apart, and the distance between these pair of gripping claws 80 is greater than the distance between the pair of side surfaces 110 of the part body 106 of the lead part 100 that are to be gripped. The pair of side surfaces 110 of the part body 106 that are to be gripped are a pair of side surfaces parallel to the direction in which the two leads 108 are aligned. Then, as the work heads 60 or 62 descend, the pair of gripping claws 80 face the pair of side surfaces 110 of the part body 106 that are to be gripped, and the lower surface of the backing plate 82 comes into contact with the upper surface of the part body 106. Then, as the pair of gripping claws 80 approach each other, the main body 106 of the lead component 100 is gripped by the pair of gripping claws 80. At this time, the pair of rubber plates 86 attached to the opposing sides of the pair of steel gripping claws 80 come into close contact with the pair of side surfaces 110 of the main body 106 of the lead component 100.

[0020] Next, the work heads 60 and 62, holding the lead component 100, move above the part camera 28, and the part camera 28 images the lead component 100 held by the part holder 77. This provides information about the tip positions of the pair of leads 108. Subsequently, the work heads 60 and 62, holding the lead component 100, move above the circuit board 12, and adjust the holding posture of the held component based on information such as the position of the through hole 102 formed in the circuit board 12 and the tip positions of the leads 108 of the lead component 100 held by the part holder 77. At this time, the movement and holding posture of the work heads 60 and 62 are adjusted so that the position of the pair of through holes 102 formed in the circuit board 12 and the tip positions of the pair of leads 108 of the lead component 100 held by the part holder 77 coincide in the vertical direction.

[0021] Then, when the work heads 60 and 62 move so that the positions of the pair of through holes 102 and the tip positions of the pair of leads 108 coincide in the vertical direction, the work heads 60 and 62 descend. As a result, as shown in Figures 4 and 5, the pair of leads 108 of the lead component 100 are inserted into the pair of through holes 102 of the circuit board 12. Since the component holder 77 does not have a pusher, the work heads 60 and 62 descend so that the leads 108 are inserted all the way into the through holes 102 of the circuit board 12. After the leads 108 are inserted all the way into the through holes 102 of the circuit board 12, the pair of gripping claws 80 of the component holder 77 separate. As a result, the component body 106 of the lead component 100 is released from the component holder 77. At the same time that the pair of gripping claws 80 separate, the work heads 60 and 62 rise. As a result, the lead component 100 is mounted on the circuit board 12 with the lead 108 inserted all the way to the base in the through hole 102.

[0022] However, when the lead component 100 is held by the component holder 77, the rubber plate 86 of the gripping claw 80 is in close contact with the side surface 110 of the component body 106. Therefore, even if the pair of gripping claws 80 of the component holder 77 separate, the rubber plate 86 of the gripping claw 80 and the side surface 110 of the component body 106 may stick together, preventing the lead component 100 from detaching from the component holder 77. In such cases, as the work heads 60 and 62 rise, the lead 108 inserted into the through-hole 102 of the circuit board 12 is pulled out of the through-hole 102, causing the component holder 77 to take the lead component 100 back, resulting in a faulty installation of the lead component 100. In addition, when the component holder 77 takes the lead component 100 back, the lead component 100 may detach from the component holder 77 due to its own weight, vibration, etc. In such cases, the lead component 100 will be scattered on the circuit board.

[0023] Therefore, in the component holder 77 that is holding the lead component 100, when the pair of gripping claws 80 separate, the component body 108 can be easily detached from the side surface 110 of the rubber plate 86 of the gripping claws 80 by changing the material, hardness, or surface treatment of the rubber plate 86. However, changing the material, hardness, or surface treatment of the rubber plate 86 would reduce the original effect of the rubber plate 86, which is to stably hold the component by the pair of gripping claws 80. In light of this, in the component mounting machine 10, after the lead 108 is inserted into the through hole 102, the component holder 77 moves laterally to detach the lead component 100 from the component holder 77. Specifically, for example, as shown in Figure 6, after the lead 108 is inserted into the through hole 102 and the lead component 100 is mounted on the circuit board 12, the work heads 60 and 62 move so that the component holder 77 moves diagonally upward. In other words, after the lead 108 is inserted into the through hole 102 and the lead component 100 is attached to the circuit board 12, the work heads 60 and 62 move diagonally upward. At this time, the work head moving device 64 moves the work head in the XY direction, i.e., laterally, by the operation of at least one of the X-direction moving device 68 and the Y-direction moving device 70, while moving the work head upward by the operation of the Z-direction moving device 72. The work head moving device 64 also moves the work head diagonally upward such that the upward angle of the work head is α1 and the distance of diagonal upward movement is L1. In other words, after the lead 108 is inserted into the through hole 102 and the lead component 100 is attached to the circuit board 12, the component holder 77 moves diagonally upward at an upward angle α1 and a distance of L1 by the operation of the work head moving device 64. Also, when the component holder 77 moves diagonally upward, the pair of gripping claws 80 of the component holder 77 separate. In other words, when the pair of gripping claws 80 of the part holder 77 separate, the part holder 77 moves diagonally upward. To put it another way, the part holder 77 moves diagonally upward as the pair of gripping claws 80 separate. To put it another way, the part holder 77 moves diagonally upward at the same time as the pair of gripping claws 80 separate. In this case, for example, the part holder 77 may move diagonally upward at the same time as the pair of gripping claws 80 of the part holder 77 separate.Alternatively, for example, the diagonal upward movement of the part holder 77 may begin at the same time that the separation movement of the pair of gripping claws 80 begins. Alternatively, for example, the diagonal upward movement of the part holder 77 may begin at the same time that the separation movement of the pair of gripping claws 80 is completed.

[0024] Thus, when the pair of gripping claws 80 of the component holder 77 separate, the component holder 77 moves diagonally upward, causing the rubber plate 86 of the gripping claws 80 to detach from the side surface 110 of the component body 106, even if they are in contact. In other words, when the lead component 100 is mounted on the circuit board 12 with the lead 108 inserted into the through hole 102, if the pair of gripping claws 80 separate and the component holder 77 moves diagonally upward, the lead 108 inserted into the through hole is pulled diagonally upward along with the component body 106 moving diagonally upward, if the side surface 110 of the component body 106 is in contact with the rubber plate 86 of the gripping claws 80. At this time, the lead 108 resists the diagonally upward pulling force by catching on the through hole 102. Therefore, even if the side surface 110 of the part body 106 and the rubber plate 86 of the gripping claw 80 are adhered to each other, the rubber plate 86 of the gripping claw 80 will detach from the side surface 110 of the part body 106. In this way, when the pair of gripping claws 80 separate, the part holder 77 moves diagonally upward, allowing the lead part 100 to be properly released from the part holder 77. The part holder 77 moves diagonally upward by a distance L1 at an upward angle α1, and then rises further due to the operation of the Z-direction moving device 72.

[0025] Furthermore, the upward angle and upward movement distance of the component holder 77 are set for each type of lead component. For example, in the lead component 100a shown in Figure 7, the upward angle of the component holder 77 is set to α2, and the upward movement distance is set to L2. By setting the upward angle and upward movement distance for each type of lead component 100 in this way, each of the multiple types of lead components 100 can be appropriately released from the component holder 77.

[0026] Furthermore, depending on the type of lead component 100, the component holder 77 releases the held lead component by moving not diagonally upward, but in the XY direction, i.e., horizontally. Specifically, for example, in the lead component 100b shown in Figure 8, after the lead 108 is inserted into the through hole 102 and the lead component 100 is mounted on the circuit board 12, the work heads 60 and 62 move so that the component holder 77 moves horizontally. In other words, after the lead component 100 is mounted on the circuit board 12, the work heads 60 and 62 move laterally. At this time, the work head moving device 64 moves the work head in the XY direction by operating at least one of the X direction moving device 68 and the Y direction moving device 70. The work head moving device 64 moves the work head laterally so that the lateral movement distance of the work head is L3. In other words, after the lead component 100 is mounted on the circuit board 12, the component holder 77 moves laterally by a distance L3 due to the operation of the work head moving device 64. Also, when the component holder 77 moves laterally after the lead component 100 has been mounted on the circuit board 12, the component holder 77 moves laterally when the pair of gripping claws 80 of the component holder 77 separates, similar to when the component holder 77 moves diagonally upward. After the component holder 77 moves laterally, it rises due to the operation of the Z-direction moving device 72. In this way, the component holder 77 and the lead component 100 are properly separated by the lateral movement of the component holder 77 when the pair of gripping claws 80 separate.

[0027] Furthermore, the lateral movement distance of the component holder 77 is set for each type of lead component. For example, in the lead component 100c shown in Figure 9, the lateral movement distance of the component holder 77 is set to L4. By setting the lateral movement distance for each type of lead component 100 in this way, each of the multiple types of lead components 100 can be appropriately released from the component holder 77.

[0028] Furthermore, when the component holder 77 moves diagonally upward or sideways, the direction of movement of the component holder 77 is set to be the same as the direction along the side surface 110 of the component body 106 of the lead component 100 mounted on the circuit board 12, as shown in Figure 10. Specifically, after the lead component 100d is mounted on the circuit board 12, the direction in which the component holder 77 moves in the XY direction is set to the direction of arrow 120a. Also, after the lead component 100e is mounted on the circuit board 12, the direction in which the component holder 77 moves in the XY direction is set to the direction of arrow 120b.

[0029] Note that the component mounting machine 10 is an example of a component mounting machine. The circuit board 12 is an example of a circuit board. The component holder 77 is an example of a gripping device. The gripping claw 80 is an example of a gripping claw. The leaded component 100 is an example of a leaded component and electronic component. The through hole 102 is an example of an insertion hole. The component body 106 is an example of a component body. The lead 108 is an example of a lead.

[0030] Furthermore, the present invention is not limited to the above embodiments, and can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, the component holder 77 moves laterally when the lead component 100 held by the component holder 77 is released from the component holder 77 after it has been mounted on the circuit board 12. On the other hand, the component holder 77 may also move laterally when an electronic component without leads, such as a chip component, held by the component holder 77 is released from the component holder 77 after it has been mounted on the circuit board 12.

[0031] Furthermore, in the above embodiment, a sheet of rubber 86 is attached to each of the pair of gripping claws 80, but it does not have to be in the shape of a sheet, and it may be made of a different material. Also, rubber or another material does not have to be attached to the gripping claws, and the gripping claws do not have to be made of steel.

[0032] Furthermore, in the above embodiment, after the lead component is mounted on the circuit board 12, the component holder 77 moves laterally when the pair of gripping claws 80 are separated, releasing the lead component held by the component holder 77. Alternatively, after the lead component is mounted on the circuit board 12, the component holder 77 may move laterally without separating the pair of gripping claws 80, releasing the lead component held by the component holder 77. For example, the component holder may hold the component by elastically deforming the pair of gripping claws or by using a coil spring similar to a clip.

[0033] Furthermore, in the above embodiment, after the lead component is mounted on the circuit board 12, the component holder 77 moves diagonally upward or sideways to release the lead component held by the component holder 77. However, the component holder 77 may move in various directions, as long as they intersect with the vertical direction, to release the lead component held by the component holder 77. For example, the component holder 77 may move diagonally downward or downward to release the lead component held by the component holder 77.

[0034] Furthermore, in the above embodiment, the main body 106 of the lead component is gripped by a pair of gripping claws 80, but the leads 108 of the lead component may also be gripped by a pair of gripping claws 80. When the pair of gripping claws 80 separate after the leads 108 of the lead component are gripped by a pair of gripping claws 80 and the lead component is mounted on the circuit board 12, the component holder 77 moves laterally, but the amount of separation of the pair of gripping claws only needs to be greater than the wire diameter of the leads. On the other hand, when the pair of gripping claws 80 separate after the leads 108 of the lead component are gripped by a pair of gripping claws 80 and the lead component is mounted on the circuit board 12, if the component holder 77 rises instead of moving laterally, the amount of separation of the pair of gripping claws is greater than the width dimension of the main body of the lead component in order to prevent interference between the component body and the gripping claws. Therefore, when the pair of gripping claws 80 separate after the lead 108 has been gripped by the pair of gripping claws 80 and the lead component has been mounted on the circuit board 12, the component holder 77 moves laterally, thereby reducing the amount of separation between the pair of gripping claws. [Explanation of symbols]

[0035] 10: Component mounting machine (component mounting machine) 12: Circuit board (substrate) 77: Component holder (gripping device) 80: Gripping claw 100: Leaded component (electronic component) 102: Through hole (insertion hole) 106: Component body 108: Lead (terminal)

Claims

1. A gripping device equipped with a pair of gripping claws for gripping electronic components, A component mounting machine that, after mounting an electronic component held by the gripping tool onto a substrate, moves the gripping tool in a direction intersecting the vertical direction at an upward angle and movement distance set for each type of electronic component to release the electronic component held by the gripping tool.

2. The component mounting machine according to claim 1, wherein when mounting an electronic component gripped by the gripping tool onto a substrate and separating the pair of gripping claws, the gripping tool is moved in a direction intersecting the vertical direction to release the electronic component gripped by the gripping tool.

3. A component mounting machine according to claim 1 or 2, wherein after mounting an electronic component gripped by the gripping tool onto a substrate, the gripping tool is moved laterally to release the electronic component gripped by the gripping tool, and then the gripping tool is raised.

4. An insertion step in which a gripping device that does not have a pusher for pressing the main body of the lead component grips the main body of the lead component with a pair of gripping claws and inserts the leads provided by the lead component into an insertion hole formed in the substrate, After performing the insertion step, the pair of gripping claws separate from the main body of the component, and the gripping tool is moved in a direction intersecting the vertical direction at an upward angle and movement distance set for each type of lead component, thereby releasing the lead component from the gripping tool. A method for mounting leaded components onto a circuit board by executing this process.

Images