Wafer rotation mechanism, wafer rotation clamping mechanism, and wafer cleaning and drying system

Abstract

The present invention discloses a wafer rotation mechanism, which includes a lower mechanism used to output rotational power and an upper mechanism connected to a wafer rotation pedestal. The upper mechanism and the lower mechanism have an operating state and a separated state. When in the operating state, the upper mechanism is driven by the lower mechanism to rotate. When in the separated state, the upper mechanism and the lower mechanism are separated. Under a power failure state, the upper mechanism and the lower mechanism are switched from the operating state to the separated state, and the upper mechanism rotates together with the wafer rotation pedestal until it stops under the inertia effect. The present invention further discloses a wafer rotation clamping mechanism. The present invention further discloses a wafer drying system and a wafer cleaning system. The wafer rotation clamping mechanism of the present invention has stable and reliable transmission under an energized state. When a sudden power failure occurs, the clutch mechanism can be immediately disconnected, and the upper body where the wafer clamping mechanism is located slowly decelerates and stops rotating under the inertia effect, ensuring the placement stability of the wafer and avoiding wafer fragments.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor integrated circuit chip manufacturing, and particularly relates to a wafer rotation mechanism, a wafer rotation clamping mechanism, and a wafer cleaning and drying system.

Background Art

[0002] With the development of the electronics industry and the semiconductor industry, the industry's requirements for the quality and processing accuracy of semiconductor silicon chips, ceramics, and optical glass surfaces are further increasing. This promotes the corresponding wafer processing equipment to become more and more advanced. In the conventional semiconductor processing process, some equipment uses a wafer rotation mechanism. For example, a monolithic cleaner, a cleaning and drying system, etc. The wafer rotation mechanism of such equipment夹holds the wafer by the method of centrifugal force. The principle of this method is to fix the wafer on a pedestal that can rotate at a high speed, use a motor to reach a higher rotation speed, and the clamping mechanism夹holds the wafer under the action of centrifugal force. For example, in a wafer cleaning and drying system, the wafer shakes off the liquid adhering to it to the outside of the wafer by centrifugal force to achieve a drying effect. Furthermore, there is a method of directly driving the rotating pedestal by a servo motor, which has a simple structure and reliable transmission, but at the same time has an obvious drawback. That is, when the power supply of the pedestal fails, the motor stops and locks accordingly, or decelerates very quickly. At this time, the wafer may be detached from the clamping mechanism, causing fragments, which has a great impact on the normal use of the equipment.

Summary of the Invention

[0003] In order to overcome the deficiencies of the prior art, the present invention enables the upper mechanism to maintain a rotating state with the wafer rotating pedestal in a power outage situation, enables the wafer to decelerate slowly and stop, and provides a wafer rotation mechanism, a wafer rotation clamping mechanism, and a wafer cleaning and drying system that avoid wafer fragments.

[0004] The technical solutions adopted by the present invention to solve its technical problems are as follows. A wafer rotation mechanism, A lower mechanism used to output rotational power, Includes an upper mechanism that can be connected to a wafer rotating base. The upper and lower mechanisms described above have both an operating state and a separated state. When in the operating state, the upper mechanism rotates driven by the lower mechanism, and when in the separated state, the upper and lower mechanisms separate. Under power outage conditions, the upper and lower mechanisms switch from an operational state to a separated state, and the upper mechanism rotates under inertial force until it stops, accompanied by the wafer rotation base.

[0005] Furthermore, the lower mechanism is provided separately from the power source, and the lower mechanism can rotate in accordance with the power source.

[0006] Furthermore, under the condition of a power outage, the lower mechanism described above stops outputting rotational power.

[0007] Furthermore, a clutch structure is provided between the upper mechanism and the lower mechanism. When energized, the lower mechanism and the upper mechanism are connected via the clutch structure by a non-contact transmission, causing the lower mechanism to move the upper mechanism and rotate synchronously.

[0008] Furthermore, the clutch structure includes contact surfaces provided on the lower and upper mechanisms, and an electromagnetic sensing assembly. When the electromagnetic sensing assembly is energized, a repulsive force exists between the lower and upper mechanisms, realizing a non-contact transmission connection between the lower and upper mechanisms.

[0009] Furthermore, the electromagnetic sensing assembly includes electromagnets spaced apart in the lower mechanism and permanent magnets spaced apart in the upper mechanism, wherein the magnetic properties of the permanent magnets and the electromagnets are the same and intersecting.

[0010] Furthermore, a clutch structure is provided between the upper mechanism and the lower mechanism, and the lower mechanism and the upper mechanism are connected by a contact-type transmission via the clutch structure, causing the lower mechanism to move the upper mechanism and rotate synchronously.

[0011] Furthermore, the clutch structure includes a magnetic material and a metal member, and a reset member, which are arranged in the upper and lower mechanisms, respectively. Under a power outage, the magnetic material and the metal member disconnect their adsorption connection.

[0012] Furthermore, the clutch structure includes an upper contact surface provided on the upper mechanism, a lower contact surface provided on the lower mechanism, an elastic member, and a push rod. The elastic member drives the lower and upper contact surfaces to transmit contact. Under a power outage, the push rod drives either the lower or upper contact surface to compress the elastic member, separating the upper and lower contact surfaces.

[0013] Furthermore, the clutch structure includes an upper gear plate provided in the upper mechanism and a lower gear plate provided in the lower mechanism. The upper gear plate and the lower gear plate mesh together to transmit power.

[0014] Furthermore, the clutch structure includes a push rod and a groove provided in the upper and lower mechanisms, respectively. Under a power outage, the push rod disengages from the groove, separating the upper and lower mechanisms.

[0015] Furthermore, when in the separated position, the distance between the upper mechanism and the lower mechanism is 0.1-5 mm.

[0016] The present invention also discloses a wafer rotation clamping mechanism, which includes the wafer rotation mechanism, a wafer rotation base, a wafer support mechanism provided on the outer circumference of the wafer rotation base, and a wafer clamping mechanism. In a power outage, the upper mechanism and the lower mechanism switch from an operating state to a separated state, the upper mechanism rotates under inertial action along with the wafer rotation base, the wafer clamping mechanism maintains a state under centrifugal force, its bottom is held to move outward, its end presses against the wafer, and in cooperation with the wafer support mechanism fixes the wafer, and the wafer clamping mechanism releases pressure on the wafer until the rotation of the wafer rotation base stops.

[0017] The present invention further discloses a wafer drying system, which includes the wafer rotation clamping mechanism described above.

[0018] The present invention further discloses a wafer cleaning system, which includes the wafer rotation clamping mechanism described above.

[0019] The beneficial effects of the present invention are as follows: 1) When the wafer rotation clamping mechanism is energized, the clutch mechanism ensures a rigid connection between the lower mechanism connected to the power source and the upper mechanism on which the wafer clamping mechanism is located, resulting in stable and reliable power transmission. 2) In the event of a sudden power outage, the clutch mechanism can be immediately disengaged, at which point the upper body on which the wafer clamping mechanism is located is not subjected to the braking force of the motor. It slowly decelerates under inertial action and stops rotating, ensuring the stability of wafer placement and avoiding wafer fragmentation. 3) There is no friction or impact between the actuator parts of the non-contact clutch mechanism, reducing the generation of impurity particles and lowering the risk of damage to the clutch mechanism. 4) The clutch mechanism is driven by an electromagnetic induction module, and the electromagnet has a fast response (fastest 14ms). It loses its magnetism at the moment of power outage, and the motor braking force on the upper body on which the wafer clamping mechanism is located is small. 5) A clutch mechanism employing a friction disc type has a fast disengagement speed, reducing the bonding force and instantaneously decreasing the moment that can transmit instantaneous frictional force, so that the upper body where the wafer clamping mechanism is located immediately enters an inertial rotation state. 6) An upper and lower gear plate or top pin type clutch mechanism is employed, and the clutch surfaces make contact in an inclined form. When engaging, the inclination acts as a guide, allowing the upper and lower clutch surfaces to connect smoothly. When disengaged, the clutch surface on the clamp jaw side slides against the clutch surface on the motor side by the inclination, releasing the linkage. [Brief explanation of the drawing]

[0020] [Figure 1] This is a schematic diagram showing the upper and lower mechanisms of the wafer rotation mechanism of the present invention in an operational state. [Figure 2] This is a schematic diagram showing the upper and lower mechanisms of the wafer rotation mechanism of the present invention in a separated state. [Figure 3] This is a front view of the wafer rotation clamping mechanism in Embodiment 1 of the present invention. [Figure 4] This is a schematic diagram of the clutch structure in Embodiment 1 of the present invention, showing it in operation. [Figure 5] It is a sectional view taken along the A-A line in the operating state of the upper mechanism and the lower mechanism in Example 2 of the present invention. [Figure 6] It is a sectional view taken along the A-A line in the separated state of the upper mechanism and the lower mechanism in Example 2 of the present invention. [Figure 7] It is a front view in the separated state of the upper mechanism and the lower mechanism in Example 3 of the present invention. [Figure 8] It is a sectional view in the separated state of the upper mechanism and the lower mechanism in Example 3 of the present invention. [Figure 9] It is a front view in the operating state of the upper mechanism and the lower mechanism in Example 3 of the present invention. [Figure 10] It is a sectional view in the operating state of the upper mechanism and the lower mechanism in Example 3 of the present invention. [Figure 11] It is a front view in the separated state of the upper mechanism and the lower mechanism in Example 4 of the present invention. [Figure 12] It is a front view in the separated state of the upper dental plate and the lower dental plate in Example 4 of the present invention. [Figure 13] It is a front view in the operating state of the upper mechanism and the lower mechanism in Example 4 of the present invention. [Figure 14] It is a front view in the meshing and operating state of the upper dental plate and the lower dental plate in Example 4 of the present invention. [Figure 15] It is a sectional view in the operating state of the upper mechanism and the lower mechanism in Example 5 of the present invention.

Modes for Carrying Out the Invention

[0021] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative labor should belong to the protection scope of the present invention.

[0022] As shown in Figures 1 and 2, the wafer rotation mechanism includes a power source 1, a lower mechanism 2 connected to the power source 1, and an upper mechanism 3 connected to a wafer rotation base 4. The lower mechanism 2 can rotate according to the power source 1, and in practical applications, it often rotates at high speeds exceeding 1000 revolutions per minute. The power source 1 may specifically be a motor output shaft. The lower mechanism 2 and the power source 1 are installed separately, and of course, in other embodiments, the power source 1 and the lower mechanism 2 may be an integrated structure, as long as they have the function of outputting rotational power.

[0023] The upper mechanism 3 and the lower mechanism 2 have both an operating state and a separated state. When in the operating state, the upper mechanism 3 rotates driven by the lower mechanism 2, and may rotate synchronously at high speed. When in the separated state, the upper mechanism 3 and the lower mechanism 2 are separated, meaning the upper mechanism 3 loses the power output of the lower mechanism 2.

[0024] Under a power outage, the upper mechanism 3 and lower mechanism 2 switch from an operating state to a separated state. At this time, the lower mechanism 2 stops outputting rotational power, meaning that the power source 1 and lower mechanism 2 stop rotating, or the rotational speed of the power source 1 and lower mechanism 2 rapidly decreases. However, the upper mechanism 3 continues to rotate, along with the wafer rotating base 4, until it stops due to inertia. In other words, because the upper mechanism 3 and lower mechanism 2 are not connected, when the rotation of the lower mechanism 2 stops slowly, the upper mechanism 3 does not immediately stop accordingly. Conversely, when no external force is acting, the upper mechanism 3 continues to maintain its rotational state due to inertia.

[0025] As shown in Figure 3, the wafer rotation clamping mechanism includes the wafer rotation mechanism, a wafer rotation base, a wafer support mechanism provided on the outer circumference of the wafer rotation base, and a wafer clamping mechanism 41. Both the wafer support mechanism and the wafer clamping mechanism 41 may have conventional structures. The wafer clamping mechanism 41 has the following characteristics: its center of gravity is close to the bottom, so when the wafer clamping mechanism 41 rotates circumferentially along the wafer rotation base, the bottom lifts upward, bringing the wafer clamping mechanism 41, which is originally in a vertical state, closer to a horizontal lateral state, and thereby its upper end presses down on the wafer 42.

[0026] Under a power outage, the upper mechanism 3 and lower mechanism 2 switch from an operational state to a separated state. The upper mechanism 3 rotates under inertial force, carrying the wafer rotating base 4, while the wafer clamping mechanism 41 remains in a state subject to centrifugal force, meaning its bottom moves outward and lifts upward, with its end contacting the wafer 42 downward. Through the cooperation of the wafer support mechanism and the wafer clamping mechanism 41, the wafer 42 is firmly clamped until the wafer rotating base 4 stops rotating. The wafer clamping mechanism 41 then releases its pressure on the wafer 42, at which point the wafer 42 also stops rotating. Even without the wafer clamping mechanism 41 generating a downward force on the wafer 42, the wafer 42 does not rotate and detach from the wafer rotating base 4.

[0027] Example 1 As shown in Figure 4, there is a clutch structure between the upper mechanism 3 and the lower mechanism 2. When energized, the lower mechanism 2 moves the upper mechanism 3 through a non-contact transmission connection of the clutch structure, causing them to rotate synchronously.

[0028] Specifically, the clutch structure includes contact surfaces 51 and 52 provided on the lower mechanism 2 and the upper mechanism 3, and an electromagnetic sensing assembly 53. The electromagnetic sensing assembly 53 includes electromagnets 531 spaced apart on the lower mechanism 2 and permanent magnets 532 spaced apart on the upper mechanism 3. The magnetic properties of the permanent magnets 532 and the electromagnets 531 are the same, and the permanent magnets 532 and the electromagnets 531 are arranged in an intersecting pattern. When the electromagnetic sensing assembly 53 is energized, a repulsive force exists between the lower mechanism 2 and the upper mechanism 3, specifically between the intersecting permanent magnets 532 and the electromagnets 531, causing the lower mechanism 2 and the upper mechanism 3 to rotate relative to each other in the circumferential direction, thereby realizing a non-contact transmission connection between the lower mechanism 2 and the upper mechanism 3. Of course, the positions of the permanent magnets 532 and the electromagnets 531 are interchangeable.

[0029] When a power outage occurs, the electromagnet 531 loses its magnetism, the repulsive force between the permanent magnet 532 and the electromagnet 531 disappears, the repulsive force between the contact surface 51 of the lower mechanism 2 and the contact surface 52 of the upper mechanism 3 disappears, and the lower mechanism 2 and the upper mechanism 3 cannot be connected. At this time, the lower mechanism 2 stops rotating or rotates slowly, and the upper mechanism 3 continues to rotate under the influence of inertia until it stops rotating.

[0030] Example 2 As shown in Figures 3, 5, and 6, there is a clutch structure between the upper mechanism 3 and the lower mechanism 2. When energized, the lower mechanism 2 and the upper mechanism 3 are connected by a contact-type transmission of the clutch structure, and the lower mechanism 2 moves the upper mechanism 3 to rotate synchronously.

[0031] Specifically, the clutch structure includes contact surfaces 51 and 52 provided on the lower mechanism 2 and the upper mechanism 3, respectively, a magnetic body 542 and a metal member 543 provided on the lower mechanism 2 and the upper mechanism 3, respectively, and a reset member 541. In this embodiment, the magnetic body 542 is located on the lower mechanism 2 and is an electromagnetic coil, the metal member 543 is located on the upper mechanism 3, and the reset member 541 is connected between the upper mechanism 3 and the metal member 543. Of course, in other embodiments, the positions of the magnetic body 542 and the metal member 543 are interchangeable.

[0032] Under energized conditions, the magnetic material 542 overcomes the elasticity of the reset member 541 under magnetic force and is attracted to the metal member 543. The magnetic force generates sufficiently large static friction, transmitting motor torque and motor rotation speed to the wafer rotation base 4, which drives the wafer 42 to rotate according to the power source 1.

[0033] When a power outage occurs, the magnetic material 542 instantly loses its magnetism, the metal member 543 moves upward under the action of the reset member 541, and the magnetic material 542 and the metal member 543, having lost their magnetism, release their magnetic connection. As shown in Figure 6, the contact surface 51 of the lower mechanism 2 and the contact surface 52 of the upper mechanism 3 separate, and they maintain a separation gap of 0.1 to 1 mm, i.e., H1 = 0.1 to 1 mm in the figure, and the lower mechanism 2 and the upper mechanism 3 can no longer transmit power. At this time, the lower mechanism 2 stops rotating or rotates slowly, and the upper mechanism 3 continues to rotate under inertial action until it stops rotating.

[0034] Example 3 As shown in Figures 7 to 10, in the embodiment, the clutch structure may be a contact-type transmission connection. Specifically, the clutch structure includes a lower contact surface 552 provided on the lower mechanism 2, an upper contact surface 551 provided on the upper mechanism 3, an elastic member 56, and a push rod 57. The elastic member 56 drives the lower contact surface 552 upward, causing it to contact and transmit power to the upper contact surface 551. In this embodiment, both the upper contact surface 551 and the lower contact surface 552 are friction disc structures, and there is no relative sliding between them during power transmission; that is, they approximate a single rigid body. The push rod 57 may be installed to move downward to drive the lower contact surface 552, or it may be installed to move upward to drive the upper contact surface 551. In this case, the elastic member 56 works in conjunction with the upper contact surface 551. In this embodiment, it is driven to move the lower contact surface 552.

[0035] Figures 9 and 10 show that in the energized operation state, the push rod 57 is in a retracted state under the action of the cylinder, meaning there is a distance between the push rod 57 and the lower contact surface 552, and therefore no force is acting on either of them.

[0036] In the event of a power outage, the push rod 57 drives the lower contact surface 552 downward under the action of the cylinder, compressing the elastic member 56 and separating the upper contact surface 551 and the lower contact surface 552 from each other, meaning that no power is transmitted between them, and they maintain a separation gap of 0.1 to 5 mm, i.e., H2 = 0.1 to 5 mm in Figure 8. At this time, the lower mechanism 2 stops rotating or rotates slowly, while the upper mechanism 3 continues to rotate under inertial action until it stops rotating.

[0037] The operating cylinder of the pushrod 57 may be a single-acting cylinder. In this case, the connected solenoid valve is normally open, and in the operating state, the cylinder does not allow air to pass through. Under the action of an internal spring, the pushrod 57 is pulled back. During a power outage, the solenoid valve allows air to pass through, and under the action of air pressure, the pushrod 57 extends and performs the separation. The operating cylinder of the pushrod 57 may also be a dual-acting cylinder. In this case, the connected solenoid valve is a single-electronically controlled 5-way 2-position type, and in the operating state, the pushrod 57 is retracted by pneumatic control. During a power outage, the solenoid valve changes the direction of the airflow, causing the pushrod 57 to protrude and perform the separation operation.

[0038] Example 4 As shown in Figures 11 to 14, the clutch structure in this embodiment may be a contact-type transmission connection. Specifically, the clutch structure includes an upper gear plate 581 provided on the upper mechanism 3 and a lower gear plate 582 provided on the lower mechanism 2. The upper gear plate 581 and the lower gear plate 582 mesh together to transmit power, and at this time, inter-tooth thrust exists between the upper gear plate 581 and the lower gear plate 582.

[0039] When the rotation of the lower pelvis 582 stops, the upper pelvis 581 continues to rotate counterclockwise along the left slope. In operation, the lower gear plate 582 meshes with the upper gear plate 581 under the action of the bottom support force, and the power source 1 rotates the lower gear plate 582. At this time, the lower gear plate 582 forms a driving force for the rotation of the upper gear plate 581 in the same direction with respect to the resultant force of the interplanar thrust and frictional force generated by the upper gear plate 581 on the right-side slope. In the event of a power outage, the lower gear plate 582 and the upper gear plate 581 separate along the slope, preventing the upper mechanism 3 from being affected by the braking force of the motor.

[0040] Example 5 As shown in Figure 15, the clutch structure in this embodiment may be a contact-type transmission connection. Specifically, the clutch structure includes a push rod 591 and a groove 592 provided in the upper mechanism 3 and the lower mechanism 2, respectively. In operation, the push rod 591 is inserted into the groove 592, and the rotational torque of the power source 1 is transmitted through the matching surface between the side of the push rod 591 and the groove 592 to rotate the upper mechanism 3. In the event of a power outage, the push rod 591 is withdrawn from the groove 592, preventing the upper mechanism 3 from being affected by the braking force of the motor.

[0041] A chamfer is made at the opening of the groove 592, and a chamfer or arc-shaped surface is also designed on the top of the push rod 591 to ensure smooth insertion.

[0042] Example 6 The wafer drying system includes a wafer rotation clamping mechanism of the arbitrary structure described above. Other structures are prior art and do not need to be described again.

[0043] Example 7 The wafer cleaning system includes a wafer rotation clamping mechanism of the arbitrary structure described above. Other structures are prior art and do not need to be described again.

[0044] Example 8 A single-wafer washing machine that combines wafer washing and wafer drying functions, and includes a wafer rotation clamping mechanism of the arbitrary structure described above. Other structures are prior art and do not need to be described again.

[0045] The above-described specific embodiments are for illustrative purposes only and do not limit the present invention. Any modifications and alterations made to the present invention within the spirit and scope of the claims are also included within the scope of the protection of the present invention.

Claims

1. A wafer rotation mechanism, A lower mechanism (2) used to output rotational power, It includes an upper mechanism (3) that can be connected to a wafer rotating base (4), The upper mechanism (3) and the lower mechanism (2) have an operating state and a separated state. When in the operating state, the upper mechanism (3) rotates driven by the lower mechanism (2), and when in the separated state, the upper mechanism (3) and the lower mechanism (2) are separated. A wafer rotating mechanism characterized in that, under a power outage, the upper mechanism (3) and the lower mechanism (2) switch from an operating state to a separated state, and the upper mechanism (3) rotates with the wafer rotating base (4) under inertial action until it stops.

2. The wafer rotating mechanism according to claim 1, characterized in that the lower mechanism (2) is provided separately from the power source (1), and the lower mechanism (2) can rotate according to the power source (1).

3. The wafer rotating mechanism according to claim 1, characterized in that the lower mechanism (2) stops outputting rotational power when there is a power outage.

4. The wafer rotating mechanism according to claim 1, wherein a clutch structure is provided between the upper mechanism (3) and the lower mechanism (2), and when energized, the lower mechanism (2) and the upper mechanism (3) are connected by a non-contact transmission via the clutch structure, causing the lower mechanism (2) to move the upper mechanism (3) to rotate synchronously.

5. The wafer rotating mechanism according to claim 4, wherein the clutch structure includes contact surfaces (51, 52) provided on the lower mechanism (2) and the upper mechanism (3), and an electromagnetic sensing assembly (53), and when the electromagnetic sensing assembly (53) is energized, a repulsive force exists between the lower mechanism (2) and the upper mechanism (3), thereby realizing a non-contact transmission connection between the lower mechanism (2) and the upper mechanism (3).

6. The wafer rotating mechanism according to claim 5, wherein the electromagnetic sensing assembly (53) includes an electromagnet (531) spaced apart in the lower mechanism (2) and a permanent magnet (532) spaced apart in the upper mechanism (3), and the permanent magnet (532) and the electromagnet (531) are identical and are installed intersectingly.

7. The wafer rotation mechanism according to claim 1, characterized in that it has a clutch structure between the upper mechanism (3) and the lower mechanism (2), the lower mechanism (2) and the upper mechanism (3) are connected by a contact-type transmission via the clutch structure, and the lower mechanism (2) moves the upper mechanism (3) to rotate synchronously.

8. The wafer rotation mechanism according to claim 7, wherein the clutch structure includes a magnetic material (542) and a metal member (543) and a reset member (541) disposed in the upper mechanism (3) and the lower mechanism (2), respectively, and in the event of a power outage, the magnetic material (542) and the metal member (543) disconnect their adsorption connection.

9. The wafer rotation mechanism according to claim 7, wherein the clutch structure includes an upper contact surface (551) provided on the upper mechanism (3), a lower contact surface (552) provided on the lower mechanism (2), an elastic member (56), and a push rod (57), wherein the elastic member (56) drives the lower contact surface (552) and the upper contact surface (551) to transmit contact, and in the event of a power outage, the push rod (57) drives the lower contact surface (552) or the upper contact surface (551) to compress the elastic member (56) and separate the upper and lower contact surfaces.

10. The wafer rotation mechanism according to claim 7, characterized in that the clutch structure includes an upper gear plate (581) provided on the upper mechanism (3) and a lower gear plate (582) provided on the lower mechanism (2), and the upper gear plate (581) and the lower gear plate (582) mesh together to transmit power.

11. The wafer rotating mechanism according to claim 7, characterized in that the clutch structure includes a push rod (591) and a groove (592) provided in the upper mechanism (3) and the lower mechanism (2), respectively, and in the event of a power outage, the push rod (591) disengages from the groove (592) to separate the upper mechanism (3) and the lower mechanism (2).

12. The wafer rotation mechanism according to claim 1, characterized in that when positioned in the separation position, the distance between the upper mechanism (3) and the lower mechanism (2) is 0.1-5 mm.

13. A wafer rotation clamping mechanism, A wafer rotating clamp mechanism comprising a wafer rotating base (4), a wafer support mechanism provided on the outer circumference of the wafer rotating base, and a wafer clamp mechanism (41), wherein, in the event of a power outage, the upper mechanism (3) and the lower mechanism (2) switch from an operating state to a separated state, the upper mechanism (3) rotates under inertial action together with the wafer rotating base (4), the wafer clamp mechanism (41) maintains a state in which it is subjected to centrifugal force, its bottom is held to move outward, its end presses against the wafer (42), and in cooperation with the wafer support mechanism fixes the wafer (42), and the wafer clamp mechanism (41) releases pressure on the wafer (42) until the rotation of the wafer rotating base (4) stops.

14. A wafer drying system, characterized by including the wafer rotation clamping mechanism described in claim 12.

15. A wafer cleaning system, characterized by including the wafer rotation clamping mechanism described in claim 12.

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