Modular multi-chamber processing tool with link chamber for ultra-high vacuum processes

Abstract

Provided herein are embodiments of a link chamber for use in a multi-chamber processing tool or a multi-chamber processing system. In some embodiments, a link chamber for use in a multi-chamber processing tool includes a link chamber body having a plurality of facets extending between a bottom plate and a top plate, at least seven of the plurality of facets having a chamber opening for forming a plurality of chamber openings, the plurality of chamber openings being sized to pass a substrate therethrough, and each of the plurality of chamber openings being configured to be coupled to a slit valve, a load lock chamber, a cover plate, a processing chamber, or a second link chamber body.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to substrate processing apparatuses.

Background Art

[0002] The manufacture of semiconductor devices typically involves performing a series of procedures on a substrate or "wafer" such as a silicon substrate or a glass plate. These steps may include polishing, deposition, etching, photolithography, heat treatment, and the like. Usually, a number of different processing steps may be performed in a single processing system or "tool" that includes multiple processing chambers. However, other processes may be performed at other processing locations within the manufacturing facility, and thus it is necessary to transport the substrate from one processing location to another within the manufacturing facility. Depending on the type of semiconductor device being manufactured, a relatively large number of processing steps may be performed at many different processing locations within the manufacturing facility.

[0003] Substrates have conventionally been transported from one processing location to another within a substrate carrier such as a sealed pod, cassette, or container. Such substrate transport typically requires exposing the substrate to the air in the room or at least non-vacuum conditions. In either case, there is a possibility of exposing the substrate to undesirable environments (e.g., oxidation nuclides) and / or contaminants.

[0004] Therefore, the inventors have provided embodiments of an improved multi-chamber processing tool for minimizing the exposure of substrates to undesirable environments when transferring substrates between processing systems.

Summary of the Invention

[0005] Embodiments of link chambers for use in multi-chamber processing tools are provided herein. In some embodiments, the link chamber for use in a multi-chamber processing tool includes a link chamber body having a plurality of facets extending between a bottom plate and an upper plate, at least seven of the plurality of facets having chamber openings for forming a plurality of chamber openings, the plurality of chamber openings being sized to allow a substrate to pass through, and each of the plurality of chamber openings being configured to be coupled to a slit valve, a load lock chamber, a cover plate, a processing chamber, or a second link chamber body.

[0006] In some embodiments, the multi-chamber processing tool includes: a factory interface (FI) having one or more load ports configured to receive a substrate; a link chamber coupled to the FI and extending between a bottom plate and an upper plate, comprising a plurality of facets, the link chamber having at least seven of the plurality of facets having chamber openings for forming a plurality of chamber openings, the bottom plate comprising one or more pump ports, and the bottom plate comprising a plurality of valve openings adjacent to the corresponding chamber openings among the chamber openings; a plurality of processing chambers coupled to the link chamber via each of the chamber openings among the chamber openings; one or more load lock chambers coupled to the link chamber via each of the one or more chamber openings; and a link robot positioned in the link chamber and configured to facilitate the transfer of substrates from the FI to the plurality of processing chambers via one or more load lock chambers.

[0007] In some embodiments, the multi-chamber processing tool includes: a factory interface (FI) having one or more load ports configured to receive a substrate; a link chamber coupled to the FI and extending between a bottom plate and an upper plate, having a plurality of facets, the plurality of which at least seven of the plurality of facets have chamber openings for forming a plurality of similarly sized chamber openings, the bottom plate includes one or more pump ports, and the bottom plate includes a plurality of valve openings adjacent to the corresponding chamber openings among the chamber openings; a plurality of processing chambers coupled to the link chamber via each of the chamber openings among the chamber openings; one or more load lock chambers coupled to the link chamber via each of the one or more chamber openings; and a link robot positioned in the link chamber and configured to facilitate the transfer of substrates from the FI to the plurality of processing chambers via one or more load lock chambers.

[0008] Other and further embodiments of this disclosure are described below.

[0009] The embodiments of this disclosure, which are briefly summarized above and discussed in more detail below, can be understood by referring to the exemplary embodiments of this disclosure shown in the accompanying drawings. However, the accompanying drawings show only typical embodiments of this disclosure and should not be considered limiting in scope, as this disclosure may allow for other equally valid embodiments. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic top view of a multi-chamber processing tool having a link chamber according to at least some embodiments of the present disclosure. [Figure 2] This is a schematic top view of a multi-chamber processing tool having a link chamber according to at least some embodiments of the present disclosure. [Figure 3]This is a schematic perspective view of a link chamber according to at least some embodiments of the present disclosure. [Figure 4] This is a perspective view of the link chamber body according to at least some embodiments of the present disclosure. [Figure 5] This is a schematic top view of a plurality of connected multi-chamber processing tools having link chambers, according to at least some embodiments of the present disclosure. [Figure 6] This is a schematic top view of a multi-chamber processing tool coupled to a second processing tool, according to at least some embodiments of the present disclosure. [Modes for carrying out the invention]

[0011] For ease of understanding, the same reference numerals are used to indicate identical elements common to multiple drawings, where possible. The drawings are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be incorporated into other embodiments without further detail.

[0012] Embodiments of link chambers for use in multi-chamber processing tools are provided herein. The link chamber includes a factory interface and multiple facets for modular and customizable coupling to multiple processing chambers to form a multi-chamber processing tool. The link chambers provided herein are generally configurable to facilitate coupling to multiple processing chambers, such as deposition chambers, etching chambers, cleaning chambers, degassing chambers, measurement chambers, or any other suitable chambers for ultra-high vacuum processing. Thus, the link chambers described herein advantageously provide a central hub for transferring substrates from the factory interface to multiple processing chambers via the link chamber. The link chambers are configured to offer a smaller footprint and lower cost than typical multi-chamber architectures.

[0013] Link chambers can be used to support systems of varying degrees of complexity. The link chambers provided herein are also advantageously configured to be coupled to one or more other link chambers or one or more other multi-chamber processing tools via transfer vias positioned between them, in order to support more complex substrate processing while minimizing floor space and processing downtime. Thus, the link chambers provided herein facilitate the formation of multi-chamber processing tools for any desired substrate process, or links between multiple multi-chamber processing tools. In some embodiments, the desired substrate process may be an ultra-high vacuum metallization process, such as a copper interconnection process. However, any suitable process requiring a vacuum or ultra-high vacuum environment can be performed using the tools provided herein.

[0014] Figure 1 shows a schematic top view of a multi-chamber processing tool having a link chamber according to at least some embodiments of the present disclosure. The multi-chamber processing tool 100 comprises a plurality of facets 114. In some embodiments, the plurality of facets 114 include at least seven facets. Each of the facets 114 has a chamber opening (see plurality of chamber openings 304 in Figure 3) that is connectable to or coupled to a load lock chamber 130, one of the plurality of processing chambers 110 (a plurality of processing chambers 110A to 110F shown in Figure 1), or a transfer via (see transfer via 508 in Figure 5). The link chamber 104 includes a transfer robot 106 located inside it. In some embodiments, the transfer robot 106 is operable to transfer one or more substrates 112 between the load lock chamber 130 and the plurality of processing chambers 110, and between the plurality of processing chambers 110. In some embodiments, the transfer robot 106 is configured to transfer one or more substrates 112 between the plurality of processing chambers 110 and the transfer via 508.

[0015] The multi-chamber processing tool 100 includes a factory interface (FI) 120 having one or more load ports 122 configured to receive one or more substrates 112. The link chamber 104 is coupled to the FI 120 via one or more load lock chambers 130. One or more substrates 112 can be transferred from the FI 120 to one or more load lock chambers 130 via an FI robot 124 positioned in the FI 120. In some embodiments, one or more load lock chambers 130 include one load lock chamber as shown in Figure 1. In some embodiments, one or more load lock chambers 130 include a substrate transfer mechanism configured to move one or more substrates 112 from a position close to the FI 120 to a position close to the link chamber 104. One or more load lock chambers 130 are generally vacuum chambers coupled to their respective vacuum pumps to facilitate the transfer of one or more substrates 112 from the ambient pressure of the FI 120 to the vacuum pressure of the link chamber 104. One or more load lock chambers 130 may be coupled to their respective vacuum pumps.

[0016] In some embodiments, the substrate transfer mechanism is a substrate carousel 136, as shown in Figure 1. The substrate carousel 136 may generally comprise one or more substrate supports 134 configured to rotate within a load lock chamber to move one or more substrates 112. In some embodiments, one or more substrate supports 134 are coupled to a base plate 132. In some embodiments, the substrate carousel 136 comprises three substrate supports that rotate around a rotation axis 138.

[0017] In some embodiments, the multiple processing chambers 110 include six processing chambers. In some embodiments, the multiple processing chambers 110 include four deposition chambers, e.g., processing chambers 110A to 110D, and two washing chambers, e.g., processing chambers 110E to 110F. In some embodiments, the four deposition chambers are physical vapor deposition (PVD) chambers. In some embodiments, the four deposition chambers are any suitable combination of PVD chambers, chemical vapor deposition (CVD) chambers, or atomic layer deposition (ALD) chambers. In some embodiments, the multiple processing chambers 110 are vacuum chambers coupled to their respective vacuum pumps.

[0018] Figure 2 shows a schematic top view of a multi-chamber processing tool 100 having a link chamber 104 according to at least some embodiments of the present disclosure. In some embodiments, as shown in Figure 2, one or more load lock chambers 130 comprise two load lock chambers coupled at a first end to each facet of a plurality of facets 114 and coupled at a second end to FI 120. In some embodiments, a plurality of processing chambers 110 comprises four processing chambers. In some embodiments, the substrate transfer mechanism comprises a load lock transfer robot 210. In some embodiments, the substrate transfer mechanism comprises a servo-controlled shutter 220. In some embodiments, the servo-controlled shutter 220 comprises a shutter 224 coupled to a servo motor 226. The servo motor 226 may be coupled to the shutter 224 via an arm 228, and the rotation of the servo motor 226 moves the shutter 224 toward or away from the link chamber 104.

[0019] Referring to Figures 1 and 2, in some embodiments, the slit valve 115 is positioned at the interface between a plurality of processing chambers 110 and the link chamber 104, and at the interface between the load lock chamber 130 and the link chamber 104, and is configured to selectively seal one or more of a plurality of facets 114. In some embodiments, one or more of the slit valves 115 include a linear motion actuator that moves the slit valve door to selectively seal or open the slit opening, facilitating the transfer of one or more substrates 112 through the slit opening. In some embodiments, one or more of the slit valves 115 include an "L" motion actuator that moves the slit valve door in an "L" motion (vertical and horizontal motion) to selectively seal or open the slit opening in order to facilitate the transfer of one or more substrates 112 through the slit opening.

[0020] The slit valve 115 allows the link chamber 104 to be isolated individually from the multiple processing chambers 110 and one or more load lock chambers 130. To pump down the link chamber 104, a vacuum pump 160, such as a cryopump or turbopump, can be coupled to the link chamber 104 via a pump port 108. The vacuum pump 160 is operable to maintain the vacuum level of the link chamber 104. In some embodiments, the link chamber 104 includes two pump ports 108, one pump port coupled to a cryopump and the second pump port coupled to a turbopump.

[0021] In some embodiments, the link chamber 104 includes a controller 150 coupled to the link chamber 104 and operable to receive data from a plurality of processing chambers 110 and provide instructions to the multi-chamber processing tool 100 for processing commands relating to the processing and transfer of one or more substrates 112. The controller 150 includes a centralized server that can perform predictive modeling such as machine learning, artificial intelligence, and / or deep learning to improve the throughput and efficiency of the multi-chamber processing tool 100 and any tools or systems linked to the multi-chamber processing tool 100, such as a second multi-chamber processing tool having a second link chamber (e.g., a second multi-chamber processing tool 502) or a second processing tool (e.g., a second processing tool 602). In some embodiments, the controller 150 is configured to communicate with a second controller 550 of the second multi-chamber processing tool 502 or a second controller 650 of the second processing tool 602. Controller 150 is operable to receive and / or transmit data from second controllers 550, 650, apply predictive modeling to the data, and provide the second controllers 550, 650 with instructions corresponding to processing commands for processing in the processing chambers of the linked first multi-chamber processing tool 100 and second processing tools 502, 602, and for the transfer of one or more substrates from these processing chambers.

[0022] The controller 150 generally includes a central processing unit (CPU) 152 having one or more processors, a memory 154, and support circuitry 156. The CPU 152 may be any form of general-purpose computer processor that can be used in an industrial environment. The support circuitry 156 may conventionally be coupled to the CPU 152 and may include a cache, a clock circuit, an input / output subsystem, a power supply, and the like. Software routines, such as the methods described herein, are stored in the memory 154 and, when executed by the CPU 152, can transform the CPU 152 into a dedicated computer (the controller 150). The software routines may also be stored and / or executed by a second controller (not shown) located remotely from the multi-chamber processing tool 100.

[0023] Memory 154 may be in the form of a non-temporary computer-readable storage medium containing instructions that, when executed by the CPU 152, facilitate the operation of the multi-chamber processing tool 100. The instructions in memory 154 are in the form of a program product, such as a program that implements the method of the present principle. The program code may conform to one of several different programming languages. In one example, the present disclosure may be implemented as a program product stored on a computer-readable storage medium for use with a computer system. The program in the program product defines the function of the embodiment (including the method described herein). Exemplary computer-readable storage media include, but are not limited to, non-writable storage media on which information is stored permanently (e.g., read-only memory devices in a computer, such as CD-ROM disks, flash memory, ROM chips, or any type of solid non-volatile semiconductor memory, readable by a CD-ROM drive) and writable storage media on which modifiable information is stored (e.g., floppy disks in a diskette drive, or hard disk drives, or any type of solid random-access semiconductor memory). Such a computer-readable storage medium is an embodiment of the present principle if it carries computer-readable instructions that direct the function of the method described herein.

[0024] FIG. 3 shows a schematic perspective view of a link chamber body 310 according to at least some embodiments of the present disclosure. The link chamber 104 generally includes a link chamber body 310 having a plurality of facets 114 extending between a bottom plate 306 and an upper plate 308. In some embodiments, the link chamber body 310 has an octagonal shape. In some embodiments, the controller 150 is coupled to the link chamber body 310 on a side surface 312 of the link chamber body 310 that does not include one of the plurality of facets 114. Each of the plurality of facets 114 includes a chamber opening for forming a plurality of chamber openings 304. The plurality of chamber openings 304 are sized to pass a substrate. In some embodiments, the plurality of chamber openings 304 are sized to be similar.

[0025] Each of the plurality of chamber openings 304 is configured to be coupled to a slit valve (e.g., slit valve 115), a load lock chamber (e.g., load lock chamber 130), a processing chamber (e.g., processing chamber 110), a cover plate (e.g., cover plate 410), or a transfer via (e.g., transfer via 508). In some embodiments, each of the plurality of facets 114 includes a seal groove 320 configured to house a seal and disposed around the chamber opening 304.

[0026] The bottom plate 306, the upper plate 308, and the plurality of facets 114 together define an internal volume 302 of the link chamber 104. In some embodiments, the bottom plate 306 includes a central opening 318 for accommodating the transfer robot 106. In some embodiments, one or more pump ports 108 are disposed through the bottom plate 306. In some embodiments, one or more pump ports 108 are disposed radially outside the central opening 318.

[0027] In some embodiments, the bottom plate 306 includes a plurality of actuator openings 326 configured to be adjacent to corresponding openings among a plurality of chamber openings 304 and to allow actuators of one or more slit valves 115 to pass through. For slit valves with linear motion actuators, the bottom plate 306 includes actuator openings 326A that extend substantially parallel to the vertical axis 350 of the link chamber body. For slit valves with "L" motion actuators, the bottom plate 306 includes angled actuator openings 326B that extend at an angle other than 90 degrees with respect to the vertical axis 350 of the link chamber body 310.

[0028] In some embodiments, the upper plate 308 includes one or more recesses 330 adjacent to each of the multiple chamber openings 304. In some embodiments, one or more recesses 330 have two recesses for each of the multiple chamber openings 304. In some embodiments, each of the one or more recesses 330 includes a fastener opening 332 extending from one or more recesses 330 to the outer side wall 338 of the link chamber body 310. The fastener opening 332 facilitates coupling the link chamber to a chamber component, such as one or more slit valves 115, any of the chambers disclosed herein, or a cover plate 410. In some embodiments, the link chamber body 310 includes a lower recess 354 to facilitate coupling of a chamber component of the link chamber 104, such as one or more slit valves 115, any of the chambers disclosed herein, or a cover plate 410. In some embodiments, the upper plate 308 includes a lid opening 342. The lid opening 342 is selectively sealed via a lid (see lid 402) that is removably coupled to the upper plate 308, allowing for easy access to the internal volume 302.

[0029] Figure 4 shows a perspective view of a link chamber 104 according to at least some embodiments of the present disclosure. In some embodiments, the link chamber 104 includes a lid 402 coupled to an upper plate 308 of the link chamber body 310. In some embodiments, the lid 402 is pivotally coupled to the upper plate 308. In some embodiments, a support device 408 is coupled to the lid 402 and the upper plate 308 to facilitate opening and closing the lid 402. In some embodiments, the lid 402 includes a handle 428 for manually opening and closing the lid 402. In some embodiments, the support device 408 is coupled to the upper plate 308 in a first position 432. In some embodiments, the support device 408 is coupled to the upper plate 308 in a second position 434. In some embodiments, the upper plate 308 includes fastener openings 438 in the first position 432 and the second position 434 so that the support device 408 can be coupled to the upper plate 308 in various positions as desired.

[0030] In some embodiments, one or more slit valves 115 are coupled to the link chamber body 310 via fasteners 440 or pins extending through a fastener opening 332. In some embodiments, one or more slit valves 115 include fastener recesses 470 corresponding to the locations of one or more recesses 330. In some embodiments, the link chamber 104 includes a recess cover 416 configured to cover one or more recesses 330 and any exposed fasteners or pins. One or more slit valves 115 may also be mounted on a lower recess 354 for further securing. Each of the one or more slit valves 115 may include an actuator 422 configured to move a slit valve door 454 to selectively open and close a slit opening 456 for substrate passage. In some embodiments, any unused facets of the plurality of facets 114 may be covered by a cover plate 410.

[0031] Figure 5 shows a schematic top view of a plurality of connected multi-chamber processing tools having link chambers according to at least some embodiments of the present disclosure. In some embodiments, the multi-chamber processing tool 100 is coupled to a second multi-chamber processing tool 502 having a second link chamber 504 to facilitate more complex processing. In some embodiments, the second link chamber 504 is similar to or identical to the link chamber 104 described above. A plurality of second processing chambers 510 may be coupled to the second link chamber 504. In some embodiments, a second FI 520 is coupled to the second link chamber 504 via one or more second load lock chambers 530. A second controller 550 may be coupled to the second link chamber 504 and configured to operably control the second multi-chamber processing tool 502. In some embodiments, the second controller 550 may be configured to communicate with a controller 150 of the multi-chamber processing tool 100. In some embodiments, the controller 150 is configured to control the multi-chamber processing tool 100 and the second multi-chamber processing tool 502 in an operable manner.

[0032] In some embodiments, the multi-chamber processing tool 100 is coupled to a second multi-chamber processing tool 502 via a transfer via 508 coupled to one of the chamber openings 304 of a plurality of chamber openings and to the corresponding chamber opening of a second link chamber 504. In some embodiments, three or more link chambers can be coupled together in the same way to expand processing capacity. In some embodiments, the transfer via 508 includes a substrate alignment device 506 positioned in one or more staging positions. The substrate alignment device 506 is configured to orient one or more features (i.e., wafer notches) on a substrate 112 in the correct orientation for processing in the processing chambers of the multi-chamber processing tool 100 and the second multi-chamber processing tool 502. In some embodiments, the transfer via 508 may be angled to favorably reduce floor space when multiple processing tools are coupled. In some embodiments, the transfer via 508 is coupled to a vacuum pump 560 for depressurizing the transfer via 508.

[0033] Figure 6 shows a schematic top view of a multi-chamber processing tool 100 coupled to a second processing tool 602, according to at least some embodiments of the present disclosure. In some embodiments, the link chamber 104 of the multi-chamber processing tool 100 may be coupled to the second processing tool 602 via a transfer via 508. In some embodiments, the second processing tool 602 may include an Endura2 or Endura3 mainframe, available from Applied Materials, Inc. in Santa Clara, California. In some embodiments, the second processing tool 602 may comprise any suitable mainframe having a plurality of processing chambers. The second processing tool 602 may generally include an FI620 coupled to one or more transfer chambers 608 via one or more load lock chambers 630. A plurality of processing chambers 610 may be coupled to one or more transfer chambers 608. Substrates may be transported between the FI620, the transfer chambers 608, and the plurality of processing chambers 610 via the FI620 and a transfer robot (not shown) located in one or more of the transfer chambers 608. One or more substrates 112 may be transferred from the multi-chamber processing tool 100 to a second processing tool 602 via transfer vias 508 to enhance processing while advantageously minimizing floor space. The second processing tool 602 may include a second controller 650 configured to operably control the second processing tool 602 and communicate with the controller 150 of the multi-chamber processing tool 100. In some embodiments, the controller 150 is configured to operably control both the multi-chamber processing tool 100 and the second processing tool 602.

[0034] While the foregoing applies to embodiments of the present disclosure, other and further embodiments of the present disclosure can be conceived without departing from the fundamental scope of the present disclosure.

Claims

1. A link chamber body having a plurality of facets extending between a bottom plate and an upper plate, wherein at least seven of the plurality of facets have chamber openings for forming a plurality of chamber openings, the plurality of chamber openings are sized to allow a substrate to pass through, and each of the plurality of chamber openings is configured to be coupled to a slit valve, a load lock chamber, a cover plate, a processing chamber, or a second link chamber body, comprising a link chamber body, A link chamber for use in a multi-chamber processing tool, wherein the upper plate of the link chamber body includes one or more recesses adjacent to each of the plurality of chamber openings, and each of the one or more recesses includes a fastener opening extending from the side wall of the one or more recesses to the radially outer side wall of the link chamber body.

2. The link chamber according to claim 1, further comprising one or more slit valves coupled to the link chamber and configured to selectively seal one or more of the plurality of facets.

3. The link chamber according to claim 1, further comprising a transfer robot disposed in the internal volume of the link chamber body and coupled to the bottom plate.

4. The link chamber according to claim 1, further comprising one or more pump ports arranged through the bottom plate.

5. The link chamber according to claim 4, further comprising a pump coupled to one or more of the pump ports.

6. The link chamber according to any one of claims 1 to 5, wherein the bottom plate of the link chamber body is adjacent to one of the corresponding chamber openings and includes a plurality of actuator openings configured to allow the actuator of a slit valve to pass through.

7. The link chamber according to any one of claims 1 to 5, wherein the one or more recesses include two recesses.

8. The link chamber according to any one of claims 1 to 5, further comprising a lid that is removably coupled to the upper plate, the upper plate including a lid opening.

9. A factory interface (FI) having one or more load ports configured to accept a substrate, A link chamber according to any one of claims 1 to 5, coupled to the FI, A plurality of processing chambers connected to the link chamber via each of the chamber openings, One or more load lock chambers coupled to the link chamber via one or more chamber openings, A link robot is positioned in the link chamber and configured to facilitate the transfer of the substrate from the FI to the plurality of processing chambers via one or more load lock chambers, A multi-chamber processing tool equipped with the following features.

10. The multi-chamber processing tool according to claim 9, wherein the plurality of processing chambers include four deposition chambers and two washing chambers.

11. The multi-chamber processing tool according to claim 9, further comprising a transfer via coupled to one of the chamber openings, wherein the transfer via is connectable to the transfer chamber of a second processing tool.

12. The multi-chamber processing tool according to claim 9, wherein the plurality of processing chambers include four processing chambers, and the one or more load lock chambers include two load lock chambers.

13. The multi-chamber processing tool according to claim 9, wherein a vacuum pump is coupled to the link chamber, the plurality of processing chambers, and the one or more load lock chambers.

14. The multi-chamber processing tool according to claim 9, wherein the one or more load lock chambers include one load lock chamber, and the one load lock chamber includes a substrate transfer mechanism configured to move the substrate from a position close to the FI to a position close to the link chamber.

15. The multi-chamber processing tool according to claim 14, wherein the substrate transfer mechanism is a substrate carousel, a load lock transfer robot, or a servo-controlled shutter.

16. The multi-chamber processing tool according to claim 9, wherein the bottom plate includes a plurality of valve openings adjacent to corresponding chamber openings among the chamber openings.

17. The multi-chamber processing tool according to claim 9, wherein the plurality of processing chambers include six processing chambers, and one or more load lock chambers include one load lock chamber having a substrate transfer mechanism configured to move the substrate from a position close to the FI to a position close to the link chamber.

18. The multi-chamber processing tool according to claim 9, further comprising a transfer via coupled to one of the chamber openings, wherein the transfer via is connectable to the transfer chamber of a second processing tool.

19. The multi-chamber processing tool according to claim 9, further comprising a controller coupled to the link chamber and operable to receive data from the plurality of processing chambers and to provide the multi-chamber processing tool with instructions for processing commands relating to the processing and transfer of the substrate.

20. The multi-chamber processing tool according to claim 9, wherein the plurality of processing chambers include four physical gas phase deposition chambers.

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