Manufacturing method of wiring boards

The method forms via holes and trenches in wiring boards using a plasma-treated thermoplastic film mask, addressing the complexity and integrity issues of conventional methods, achieving improved taper angles and electrical performance.

JP7868757B2Active Publication Date: 2026-06-02AJINOMOTO CO INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
AJINOMOTO CO INC
Filing Date
2024-04-12
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Conventional methods for forming via holes and trenches in insulating layers of wiring boards fail to achieve the desired 90° taper angles and are cumbersome, involving complex procedures and potential damage to the insulating layer due to chemical treatments.

Method used

A manufacturing method involving a laminate of substrate, insulating layer, and thermoplastic film, where via holes and trenches are formed by plasma treatment through a thermoplastic film mask, followed by peeling, reducing the need for chemical treatments and simplifying the process.

Benefits of technology

This method enables the formation of via holes and trenches with improved taper angles, reduces process complexity, and maintains the insulating layer's integrity and electrical performance, allowing for fine circuit wiring and high integration.

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Patent Text Reader

Abstract

This method for manufacturing a wiring board includes: a step (I) of preparing a laminate including a substrate, an insulating layer, and a thermoplastic film in this order; a step (II) of forming a recess in the thermoplastic film; a step (III) of forming one or both of a via hole and a trench in the insulating layer by plasma processing; and a step (IV) of peeling the thermoplastic film in this order.
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