Device comprising M.2 assembly and assembly holder, and corresponding manufacturing method

Abstract

The present invention relates to a device having an M.2 assembly, the M.2 assembly having an M.2 module and a heat sink, the device having a frame that holds the M.2 assembly, the heat sink being pressed against the M.2 assembly by the frame. The present invention also relates to an assembly method.

Description

Technical Field

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[0001] M.2, also known as Next Generation Form Factor (NGFF), is a specification for internal computer expansion cards and corresponding ports.

[0002] The M.2 module is usually rectangular with a connector on one side and a semi-circular recess for screwing and fixing in the center of the opposite side.

[0003] The M.2 module is usually inserted into a matching port on the computer system board and fixed there with screws. Components can be attached to the sides on both sides of the module. The module type determines whether components can be attached to one or both sides and how high they can be on each side.

[0004] The M.2 specification was designed to replace mSATA. Due to its smaller and more flexible dimensions combined with extended features, M.2 has advantageous properties compared to mSATA. Therefore, M.2 is, for example, more suitable for connecting SSDs than mSATA.

[0005] The doubling of the transfer speed of future SSDs with PCI Express (PCIe) 5.0 is accompanied by significantly high power consumption. This increases almost proportionally to the transfer speed, and as a result, high-end SSDs with PCIe 5.0 and 14 - 15 gigabytes per second have a power consumption of about 14 watts. Doubling further, the fastest SSDs approach a power consumption of about 30 watts.

[0006] Existing M.2 modules release some of this waste heat through the motherboard, on the one hand via the plug-in connection and on the other hand via the screws typically provided for fixing the module. However, this heat dissipation is not sufficient to cool the module adequately at increasing transfer speeds.

[0007] Therefore, cooling ribs may be positioned on the M.2 module and typically snapped in place by springs. However, spring-based positioning and fastening of ribs tends to be weak and unreliable. [Overview of the project]

[0008] The present invention aims to solve at least some of the above-mentioned problems.

[0009] The present invention relates to a device comprising an M.2 assembly and a frame for holding the M.2 assembly.

[0010] An M.2 assembly comprises an M.2 module and a heatsink, the heatsink being pressed against the M.2 module by a frame.

[0011] The M.2 module and the heatsink are preferably connected by adhesive connections, for example, by an adhesive layer between them or by adhesive glue spots.

[0012] The heatsink is preferably a one-piece design and comprises only a cooling plate. Such a heatsink is easy and inexpensive to manufacture.

[0013] The cooling plate is preferably made as a single unit. The cooling plate is preferably made of a metallic material. In a preferred embodiment, the thermal conductivity of the cooling plate is similar to that of the M.2 module, thereby promoting heat transfer from the M.2 module to the cooling plate. The thermal conductivity of the M.2 module is understood here as the thermal conductivity of the substrate body of the M.2 module.

[0014] An M.2 module preferably comprises an essentially rectangular plate. The thickness of the plate is significantly less than the length and width of the rectangular plate. The short side of the rectangular plate is referred to as the end, short end, or short edge of the M.2 module. The corresponding sides or edges of an M.2 assembly or heatsink are similarly designated.

[0015] The longer side is referred to as the longitudinal edge. Hereafter, the extension along the shorter side will be referred to as the width, and the extension along the longer side will be referred to as the length. An M.2 module has two substantially rectangular surfaces. The corresponding sides or edges of an M.2 assembly or heatsink are similarly designated.

[0016] The heatsink preferably has an essentially rectangular shape, with short edges and long edges, similar to the M.2 module.

[0017] Preferably, the heat sink or the cooling plate for the heat sink is placed flat on the surface of the M.2 module. In particular, the cooling plate is preferably placed directly on the surface of the M.2 module on which the electronic components are mounted.

[0018] In one embodiment, the heat sink or cooling plate has cooling fins. The cooling fins function to increase the surface area of ​​the cooling plate. The cooling fins may have a shape suitable for increasing the surface area. Preferably, the cooling fins are provided on the surface of the cooling plate facing away from the M.2 module.

[0019] Multiple fins may be arranged in columns and rows on a cooling plate. To form the fins, for example, individual sections may be bent out of the cooling plate, and the cooling fins comprise separate components fixed to the cooling plate, preferably by material bonding, for example by welding.

[0020] According to one embodiment, the frame includes a carrier plate on which the M.2 module is placed. The carrier plate and the heatsink are positioned on opposite sides of the M.2 module.

[0021] The carrier plate preferably comprises a flat plate having an essentially rectangular shape. The carrier plate preferably has an essentially rectangular shape, with a short edge and a long edge, similar to the M.2 module.

[0022] The frame is preferably bent perpendicular to a flat plate, but preferably has additional bent sections that are integrated with the carrier plate.

[0023] The two longitudinal bend sections are preferably provided along two longitudinal edges, and the short bend section is preferably provided along one of the short edges of the carrier plate.

[0024] Furthermore, the bent section may be connected by a cover section of the frame parallel to the non-bent section of the carrier plate. In such an embodiment, the M.2 assembly is positioned between the carrier plate and the cover section of the frame. The frame may comprise two or more cover sections.

[0025] The M.2 module includes multiple electrical components substantially arranged on the top surface of a rectangular plate, the top surface being the surface separated from the carrier plate.

[0026] In this specification, the upward direction is away from the carrier plate, and the downward direction is toward the carrier plate. The upper side of the carrier plate is toward the M.2 assembly, and the lower side of the carrier plate is toward the opposite side of the carrier plate.

[0027] Additional electrical components can be placed on the surface of the rectangular plate opposite to the top surface, hereinafter referred to as the bottom surface.

[0028] According to one embodiment, the carrier plate includes knockouts or recesses that provide space for electrical components on the lower surface of the M.2 module facing the carrier plate.

[0029] According to an embodiment, the frame includes a first rib or a first latch lug against which the first section of the M.2 assembly abuts.

[0030] In particular, the bent section of the frame that bends perpendicular to the carrier plate includes a rib or a latch lug.

[0031] According to one embodiment, the first short-side bent section includes a rib or a latch lug, and the first short-side edge of the M.2 assembly abuts against the rib or the latch lug or is snap-fixed by the rib or the latch lug.

[0032] The first rib or latch lug defines the position of the M.2 assembly relative to the frame and fixes the M.2 assembly at this position.

[0033] According to one embodiment, the frame includes a second rib or a second latch lug against which the second section of the M.2 assembly abuts, and the first rib, the second rib and / or the first latch lug, the second latch lug hold the M.2 assembly in a predetermined position of the frame.

[0034] Preferably, the second rib or latch lug is provided in the long bent section, preferably in a section closer to the second short-side edge opposite to the first short-side edge of the M.2 assembly.

[0035] According to one embodiment, the second rib or latch lug presses the heat sink against the M.2 module, and preferably presses the entire M.2 assembly against the carrier plate as well.

[0036] With this configuration, the heat sink and the M.2 assembly are firmly positioned and fixed within the frame.

[0037] The second rib or latch lug may be connected by a cover section of the frame. In such an embodiment, the M.2 assembly is positioned between the carrier plate and the cover section of the frame. The frame may include two or more cover sections connecting the rib or latch lug, or a bent section providing the rib or latch lug.

[0038] According to one embodiment, the frame is equipped with screws that secure the M.2 assembly to the second latch lug and press the heatsink against the M.2 module. This configuration firmly secures the M.2 assembly. The position of the M.2 assembly, predetermined by the rib or latch lug, cannot be shifted or displaced any further.

[0039] According to one embodiment, screws protrude into the heatsink to secure the heatsink and the entire M.2 assembly to the frame.

[0040] The screws may preferably be inserted through a longitudinal bend section or a cover section, and may preferably be located near a second latch lug or rib.

[0041] The heatsink can provide the appropriate recess.

[0042] According to one embodiment, the M.2 assembly includes a thermal pad positioned between the M.2 module and the heatsink.

[0043] A thermal pad is a heat-conducting layer.

[0044] The thermal pad functions to improve heat transfer from the M.2 module to the cooling plate of the heatsink. The thermal conductivity of the thermal pad is preferably similar to that of the M.2 module, and preferably even more preferably similar to that of the cooling plate of the heatsink. Thus, heat transfer from the M.2 module to the heatsink is improved by the thermal pad.

[0045] According to one embodiment, the engraved portion on the surface of the heatsink defines the position of the thermal pad on the heatsink.

[0046] The engraved portion is preferably configured parallel to the outer edge of the cooling plate of the heatsink. Instead of the engraved portion, a projection can be provided that provides the same function.

[0047] Preferably, a carved section parallel to the first short edge and a second carved section parallel to the first long edge may be provided.

[0048] The two sculptural parts may be separate from each other or connected.

[0049] According to one embodiment, the heatsink, thermal pad, and M.2 module are adhesively fixed to each other, and their precise positions are predetermined by the frame.

[0050] The present invention relates to a method for assembling a device, the device comprising an M.2 assembly having an M.2 module and a heatsink, and the device comprising a frame for holding the M.2 assembly.

[0051] The device may be one of the aforementioned devices, and the following description may apply to embodiments of the aforementioned devices.

[0052] This method includes the following steps.

[0053] In the next step, the heatsink is mounted on the M.2 module to provide the M.2 assembly. Preferably, the heatsink is bonded to the M.2 module.

[0054] In step, the M.2 assembly is inserted into the frame until the first section of the M.2 assembly contacts the frame's stop element.

[0055] Preferably, the first section of the M.2 assembly is the first end or first short edge of the M.2 assembly.

[0056] Preferably, the first stop element of the frame comprises or consists of a first rib or a latch lug.

[0057] In step, the M.2 assembly is moved by sliding or pivoting until the second stop element of the frame contacts the M.2 assembly.

[0058] Preferably, the second stop element comprises or consists of a second rib or latch lug.

[0059] Preferably, the second stop element abuts against a second section of the M.2 assembly, which may include the longitudinal edge of the M.2 assembly.

[0060] Multiple second stopping elements may be provided.

[0061] In this step, the heatsink is pressed against the M.2 module by securing the M.2 assembly to the frame.

[0062] According to one embodiment, the M.2 assembly is secured by sliding or pivoting until a second stop element of the frame contacts the M.2 assembly. For example, the second stop element may include a latch lug for snapping the M.2 assembly into place.

[0063] Alternatively or additionally, screws inserted through the second stop element secure the M.2 assembly.

[0064] According to one embodiment, a thermal pad is positioned between the M.2 module and the heat sink by adhesively fixing the thermal pad to the surface of the heat sink. Preferably, the engraved portion or projection is provided on the surface of the heat sink that defines the position of the thermal pad.

[0065] Embodiments of the present invention will be described in more detail below with reference to the drawings. The present invention is not limited to the embodiments and drawings described below. The features described below are illustrative combinations and may exist in other combinations. [Brief explanation of the drawing]

[0066] [Figure 1] Figure 1 shows a first embodiment of a device comprising an M.2 module assembly and a frame. [Figure 2] Figure 2 shows a second embodiment of a device comprising an M.2 module assembly and a frame. [Figure 3a] Figure 3a is a top view of an embodiment of the M.2 module. [Figure 3b] Figure 3b is a bottom view of an embodiment of the M.2 module. [Figure 4] Figure 4 shows an embodiment of a frame with a knockout. [Figure 5a] Figures 5a to 5d show a first assembly method for the first embodiment. [Figure 5b] Figures 5a to 5d show a first assembly method for the first embodiment. [Figure 5c] Figures 5a to 5d show a first assembly method for the first embodiment. [Figure 5d] Figures 5a to 5d show a first assembly method for the first embodiment. [Figure 6a]Figures 6a to 6d show a second assembly method for a second embodiment. [Figure 6b] Figures 6a to 6d show a second assembly method for a second embodiment. [Figure 6c] Figures 6a to 6d show a second assembly method for a second embodiment. [Figure 6d] Figures 6a to 6d show a second assembly method for a second embodiment. [Modes for carrying out the invention]

[0067] Figure 1 shows an example of a first embodiment of device 1 comprising an M.2 assembly 2 and a frame 3. The M.2 assembly 2 comprises an M.2 module 4 and a heatsink 5.

[0068] The heatsink 5 comprises a cooling plate and cooling ribs 6, the cooling ribs 6 protruding from the surface of the cooling plate opposite to the M.2 module 4.

[0069] The M.2 module 4 essentially consists of a rectangular plate. The thickness of the plate is significantly smaller than the length and width of the rectangular plate. The short side of the rectangular plate is referred to as the end or short edge of the M.2 module 4. The long side is referred to as the long edge.

[0070] The heat sink 5 preferably has an essentially rectangular shape, with short edges and long edges, similar to the M.2 module 4.

[0071] The heatsink 5 or the cooling plate of the heatsink is placed flat on the surface of the M.2 module 4. In particular, the cooling plate is placed directly on the surface of the M.2 module on which the electronic components are mounted.

[0072] Frame 3 comprises a carrier plate 7 and bent sections 8a and 8b. These bent sections are bent perpendicular to the carrier plate 7 but are integrally formed with the carrier plate 7. The carrier plate and heat sink are located on opposite sides of the M.2 module.

[0073] The M.2 assembly 2, in particular the M.2 module 4, is placed on the flat surface of the carrier plate 7.

[0074] Furthermore, two longitudinal bend sections 8a are provided along two longitudinal edges, and a short bend section 8b is provided along one of the short edges of the carrier plate.

[0075] In this embodiment, the longitudinally bent section is connected by one, two, or more cover sections 9 of the frame 3, which are parallel to the non-bent section of the carrier plate 7.

[0076] The M.2 assembly 2 is firmly positioned between the carrier plate 7 and the cover section 9 of the frame 3.

[0077] In the positioned device 1, the M.2 assembly 2 abuts against the first end rib 10 provided on the inner surface of the short bent section 8a of the frame 3.

[0078] Furthermore, two parts of the M.2 module, including the longitudinal end face and the upper surface of the heatsink 5 opposite to the carrier plate 7, abut against the second stop element, which includes the cover portion 9.

[0079] Furthermore, the frame 3 is equipped with screws 11 for securing the M.2 assembly 2 to the cover section 9, and the cover section 9 presses against the top surface of the heatsink 5, thereby pressing the heatsink 5 against the M.2 module 4 and the entire M.2 assembly 2 against the frame 3. This firmly secures the M.2 assembly 2.

[0080] Figure 2 shows a second alternative embodiment. The second embodiment is similar to the first embodiment except for the following features.

[0081] According to the second embodiment shown in Figure 2, the screw is inserted through the longitudinal bent section 8a.

[0082] Furthermore, the longitudinal bent section 8a is not connected by the cover section 9, but has a protruding latch lug 13 on its inner surface for snapping the M.2 assembly 4 into place.

[0083] Furthermore, the M.2 module 4 includes a plurality of electrical components 12 arranged on its upper or lower surface, as shown in Figures 3a and 3b. Figure 3a shows the upper surface of the M.2 module 4, and Figure 3b shows the lower surface of the M.2 module 4.

[0084] Therefore, as shown in Figure 4, the carrier plate 7 has a knockout 14 or recess on the lower surface of the M.2 module 4 facing the carrier plate 7 that provides space for electrical components.

[0085] The following diagram illustrates a first exemplary assembly method of a first embodiment of the device.

[0086] In the first step shown in Figure 5a, the thermal pad 15 is adhesively fixed to the lower surface of the heatsink 5.

[0087] An engraved portion 16 or projection is provided on the surface of the heat sink 5 to define the position of the thermal pad. The engraved portion 16 pre-defines the position of the thermal pad 15. The thermal pad 15 is a flat pad that is placed flat on the heat sink 5.

[0088] For precise alignment, increased heat transfer between the thermal pad 15 and the heatsink 5 necessitates a smaller thermal pad 15. A smaller thermal pad size also reduces manufacturing costs.

[0089] In the second step shown in Figure 5b, the heatsink 5, which has a fixed thermal pad 15, is placed on top of the M.2 module 4 and bonded to it to form the M.2 assembly 2. The edges of the heatsink 5 are aligned with the short and long edges of the M.2 module 4. Precise alignment improves heat transfer from the electronic components 12 to the heatsink 5.

[0090] In the third step shown in Figure 5c, the fixed M.2 assembly 2 is inserted into the frame 3 and slides into the empty space between the carrier plate 7, the bent sections 8a and 8b, and the cover section 9, with the M.2 module facing the carrier plate 7 and the upper cooling ribs 6 of the heatsink 5 facing the cover section 9.

[0091] The M.2 assembly 2 is inserted from the short side of the frame where there is no bent section.

[0092] The M.2 assembly 2 is inserted into the short bend section 8b of the frame 3 until it abuts against the rib 10.

[0093] In this embodiment, the heat sink 5 provides two protruding tabs 17 that contact the rib 10.

[0094] The position of the M.2 assembly within the frame 3 is precisely defined by the ribs 10, the bent edges 8a and 8b, and the cover portion 9. Furthermore, the longitudinal bent section 8a may provide a snap latch lug 13 for snapping the M.2 assembly 2 toward the carrier plate 7.

[0095] In this embodiment, the screws 11 are inserted through the cover section 9 of the frame 3. The screws press against the corresponding upper section of the heatsink 5. Cooling ribs 6 do not need to be provided on these corresponding sections.

[0096] The screws 11 further press the heatsink 5 against the M.2 module 4 and the entire M.2 assembly 2 against the carrier plate 7 of the frame 3. Thus, the entire assembly is firmly fixed within the frame 3, and the relative positions between the individual elements of device 1 can no longer be changed.

[0097] Furthermore, tighter fixation improves contact and heat transport between individual elements.

[0098] A top view of the fully assembled device 1 is shown in Figure 5d.

[0099] The following diagram shows an alternative assembly method for the second embodiment. The assembly of assembly 4 M.2 is the same as in the first method.

[0100] Subsequently, as shown in Figure 6a, the first end of the M.2 assembly, on which the tab 17 of the heatsink 5 is located on the first side, is inserted into the first latch lug 13 on the short bent edge 8b of the frame 3. This hinges the tab 17 to the latch lug 13.

[0101] Subsequently, the entire M.2 assembly 2 is rotated into the frame 3 and positioned within the frame 3, as described above.

[0102] Unlike the method described above, in the second embodiment, the cover section 9 is not provided.

[0103] In the second embodiment, a latch lug 13 is provided on the longitudinal edge 8a, which snaps the M.2 assembly 4 into place, pivots into the frame 3, and then presses the M.2 assembly 4 toward the carrier plate 7.

[0104] Furthermore, in the next step, screws are inserted into the heatsink 5 through the longitudinal latch lugs 13 to securely fasten the M.2 assembly 2 to the frame 3. This step is shown in Figure 6c.

[0105] To be firmly fixed means that a single element of device 1 cannot move relative to another.

[0106] The swivel insertion or slide insertion technique can be easily performed by any operator. The device assembly is precisely predetermined. After assembly, the relative positions can no longer be changed. [Explanation of Symbols]

[0107] 1 device 2 M.2 Assembly 3 frames 4 M.2 modules 5 Heatsink 6 Cooling Ribs 7. Carrier Plate 8a Longitudinal flexed section 8b Short arm flexion section 9. Cover Section 10 Ribs 11 screws 12 Electrical components 13 Latch lugs 14 Knockouts 15 Thermal Pads 16. Sculpture Department 17 tabs

Claims

1. A device having an M.2 assembly, The aforementioned M.2 assembly comprises an M.2 module and a heatsink. The device comprises a frame that holds the M.2 assembly, With the M.2 assembly fixed within the frame, the frame is configured to press the heatsink against the M.2 module. device.

2. The frame is equipped with a carrier plate, and the M.2 module is arranged on the carrier plate. The carrier plate and the heat sink are arranged on opposite sides of the M.2 module. The device according to claim 1.

3. The carrier plate provided on the frame includes knockouts on the surface of the M.2 module facing the carrier plate, providing space for electrical components. The device according to claim 1 or 2.

4. The frame comprises a first rib or first latch lug against which the first section of the M.2 assembly abuts. The device according to claim 1 or 2.

5. The frame comprises a second rib or second latch lug that abuts against the second section of the M.2 assembly, The first rib and the second rib, and / or the first latch lug and the second latch lug hold the M.2 assembly in a predetermined position on the frame. The device according to claim 4.

6. The second rib or the second latch lug presses the heat sink against the M.2 module. The device according to claim 5.

7. The frame is provided with screws, which secure the M.2 assembly to the second latch lug and press the heatsink against the M.2 module. The device according to claim 5.

8. The screw protrudes into the heat sink. The device according to claim 7.

9. The M.2 assembly comprises a thermal pad positioned between the M.2 module and the heatsink. The device according to claim 1 or 2.

10. A device having an M.2 assembly, The aforementioned M.2 assembly comprises an M.2 module and a heatsink. The device comprises a frame that holds the M.2 assembly, The frame is configured to press the heatsink against the M.2 module. The M.2 assembly comprises a thermal pad positioned between the M.2 module and the heatsink. The engraved portion on the surface of the heat sink defines the position of the thermal pad on the heat sink. device.

11. The heat sink, the thermal pad, and the M.2 module are bonded together. The device according to claim 9.

12. A method for assembling a device, The device comprises an M.2 module and an M.2 assembly having a heatsink, and a frame for holding the M.2 assembly, and the method is: - A heatsink is adhesively fixed onto the M.2 module to provide an M.2 assembly; - The step of inserting the M.2 assembly into the frame until the first section of the M.2 assembly abuts against the first stop element of the frame; - A step of sliding or pivoting the M.2 assembly until the second stop element of the frame contacts the M.2 assembly; - By positioning and fixing the M.2 assembly within the frame, the frame presses the heatsink against the M.2 module, A method that includes this.

13. The M.2 assembly is fixed by sliding or pivoting until the second stop element of the frame contacts the M.2 assembly. The method according to claim 12.

14. The M.2 assembly is secured by a screw inserted through the second stop element. The method according to claim 12 or 13.

15. A method for assembling a device, The device comprises an M.2 module and an M.2 assembly having a heatsink, and a frame for holding the M.2 assembly, and the method is: - A heatsink is adhesively fixed onto the M.2 module to provide an M.2 assembly; - The step of inserting the M.2 assembly into the frame until the first section of the M.2 assembly abuts against the first stop element of the frame; - A step of sliding or pivoting the M.2 assembly until the second stop element of the frame contacts the M.2 assembly; - The step of pressing the heat sink against the M.2 module by fixing the M.2 assembly within the frame, Includes, By adhesively fixing the thermal pad onto the surface of the heat sink, the thermal pad is positioned between the M.2 module and the heat sink. A method for defining the position of the thermal pad by the engraved portion on the surface of the heat sink.

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