Mold apparatus including mold sensor cooling structure

Abstract

To provide a mold device adapted to prevent damage to a detection module at higher mold temperature and to improve an availability of the mold device in different processes.SOLUTION: A mold device includes a mold, a cooling passage 160, and a detection module. The mold has a cavity. The detection module is adapted to sense at least one of temperature and pressure within the cavity. The detection module is surrounded by the cooling passage.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a mold device, and more particularly to a mold device including a mold sensor cooling structure.

Background Art

[0002] In an injection molding process, the temperature of the mold is raised to a specific temperature according to different materials. Depending on the high-temperature material, the mold temperature may exceed the upper limit of the sensor, or the mold temperature may rise to a higher temperature according to different product requirements. Such a high mold temperature damages the sensor, so the use of the sensor is restricted by the mold temperature. Therefore, how to prevent the sensor from being damaged at a higher mold temperature is an issue to be solved in the art.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The present disclosure provides a mold device adapted to prevent damage to the detection module at a higher mold temperature and improve the availability of the mold device in different processes.

Means for Solving the Problems

[0004] A mold device according to an embodiment of the present disclosure includes a mold, a cooling channel, and a detection module. The mold has a cavity. The detection module is adapted to detect at least one of the temperature and pressure in the cavity. The detection module is surrounded by the cooling channel.

[0005] In one embodiment of the present disclosure, the mold device further includes a bearing structure. The detection module includes a temperature sensor and a pressure sensor. The temperature sensor has a detection part and a contact part. The detection part is disposed in the mold, and the contact part is disposed in the bearing structure. The pressure sensor is disposed in the bearing structure and corresponds to the contact part. The contact part is adapted to contact the pressure sensor by the pressure in the cavity.

[0006] In one embodiment of the present disclosure, the cooling channel is located within the bearing structure.

[0007] In one embodiment of this disclosure, the temperature sensor is a protruding pin type temperature sensor, and the bearing structure is a protruding plate structure.

[0008] In one embodiment of the present disclosure, the temperature sensor is an optical fiber temperature sensor and includes a light receiving unit, the light receiving unit is located at the contact portion.

[0009] In one embodiment of the present disclosure, the mold apparatus further includes a protective structure, the protective structure covers the contact portion, and the cooling channel is located within the protective structure.

[0010] In one embodiment of the present disclosure, the mold apparatus further includes a protective structure. The protective structure is located within the mold, a sensing module is located within the mold and covered by the protective structure, and a cooling channel is located within the protective structure. [Effects of the Invention]

[0011] Based on the above, in the mold apparatus of this disclosure, the sensing module is cooled by a cooling channel surrounding the sensing module. Therefore, the mold apparatus can be used in higher temperature processes, improving the applicability of the mold apparatus in different processes.

[0012] To make the above content easier to understand, some embodiments accompanied by drawings are described in detail below. [Brief explanation of the drawing]

[0013] [Figure 1A] This is a schematic diagram of a mold apparatus according to one embodiment of the present disclosure.

[0014] [Figure 1B] Figure 1A is a schematic diagram of some of the components of the mold apparatus shown.

[0015] [Figure 2A] These are some components of the mold device according to other embodiments of the present disclosure. [Figure 2B] These are some components of the mold device according to other embodiments of the present disclosure. [Figure 2C] These are some components of the mold device according to other embodiments of the present disclosure.

[0016] [Figure 3] This is a schematic diagram of a mold device according to another embodiment of the present disclosure.

[0017] [Figure 4] This is a cross-sectional view of the mold device of FIG. 1A.

[0018] [Figure 5] This is a schematic diagram of a mold device according to another embodiment of the present disclosure.

Mode for Carrying Out the Invention

[0019] The present disclosure will be more fully described with reference to the drawings of the embodiments. However, the present disclosure may be implemented in various forms and should not be limited to the embodiments described herein. The same or similar reference numerals indicate the same or similar components and will not be repeatedly described in the following paragraphs.

[0020] Figure 1A is a schematic diagram of a mold apparatus according to one embodiment of the present disclosure. The XYZ coordinate axes are provided herein to facilitate the description of the components. Referring to Figure 1A, the mold apparatus 100a of this embodiment includes a mold 110, a bearing structure 120a, and a sensing module 130a1. In Figure 1A, the cavity 112 of the mold 110 is schematically shown by a dashed line, but its shape and arrangement are not limited thereto. The bearing structure 120a is adapted to provide structural support for the sensing module 130a1. The sensing module 130a1 is adapted to detect at least one of temperature and pressure in the cavity 112. In this embodiment, the bearing structure 120a is an ejector plate structure 140a, and the sensing module 130a1 is located within the bearing structure 120a (ejector plate structure 140a) to improve the space utilization of the mold apparatus 100a. The ejector plate structure 140a includes a pair of ejector plates 142a and a plurality of ejector pins 144. The pair of ejector plates 142a are positioned on the outside of the mold 110, and the ejector pins 144 extend from the pair of ejector plates 142a toward the cavity 112 of the mold 110. The ejector pins 144 are adapted to eject components (not shown) within the cavity 112 from the cavity 112. The mold apparatus 100a of this embodiment is adapted to an injection molding process, but is not limited thereto.

[0021] As shown in FIG. 1A, the mold device 100a includes two detection modules 130a1 arranged corresponding to the two protruding pins 144. A part of the detection module 130a1 is arranged on a pair of protruding plates 142a, and another part of the detection module 130a1 is arranged on the protruding pins 144 and extends to the cavity 112 of the mold 110. Here, one detection module 130a1 extends to the position B1 of the cavity 112 and measures the temperature and pressure at the position B1. Another detection module 130a1 extends to another position B2 of the cavity 112 and measures the temperature and pressure at the position B2. The mold device 100a measures the temperatures and pressures at the two positions B1 and B2 through the two detection modules 130a1 respectively. Here, the positions B1 and B2 are arbitrary positions within the cavity 112. In addition, the number of the protruding pins 144 of the protruding plate structure 140a is not limited to this, and the number and arrangement of the detection modules 130a1 are also not limited to this. The user can arrange the detection modules 130a1 as needed to detect the temperatures and pressures at multiple positions of the cavity 112. This contributes to the production of the mold device 100a, the monitoring of process stability, and the reduction of manufacturing costs, and at the same time provides a good data source for the development of future smart manufacturing and smart molding.

[0022] Figure 1B is a schematic diagram of some components of the mold apparatus shown in Figure 1A. Figure 1B is a partial cross-sectional view of Figure 1A showing the arrangement of one detection module 130a1, a bearing structure 120a, and a mold 110. Referring to Figure 1B, the detection module 130a1 includes a temperature sensor 132 and a pressure sensor 136. In this embodiment, the temperature sensor 132 is an ejector pin type temperature sensor. The temperature sensor 132 has an extension structure 133 and a contact portion P2. The extension structure 133 extends from the contact portion P2 along the moving axis M1. The pressure sensor 136 and the contact portion P2 are located in a housing space 122 within the bearing structure 120a (within a pair of ejector plates 142a), and the extension structure 133 is located on the ejector pin 144 and extends toward the mold 110. The detection unit P1 of the temperature sensor 132 is located in the extension structure 133 and is situated inside the mold 110. The detection unit P1 corresponds to position B1 within the cavity 112. The temperature sensor 132 detects the temperature at position B1 within the cavity 112 via the detection unit P1.

[0023] The pressure sensor 136 corresponds to the contact portion P2 of the temperature sensor 132. Here, the temperature sensor 132 is movably positioned within the mold 110 and bearing structure 120a along the moving axis M1, and the sensing portion P1 and contact portion P2 are located at two opposing ends of the temperature sensor 132 on the moving axis M1, respectively. When the sensing portion P1 of the temperature sensor 132 receives pressure from position B1 in the cavity 112, the temperature sensor 132 is pushed and adapted to move along the moving axis M1 toward the pressure sensor 136, and the contact portion P2 of the temperature sensor 132 moves to push the pressure sensor 136. That is, the pressure sensor 136 is compressed by the movement of the temperature sensor 132 and measures the pressure it receives at position B1.

[0024] Specifically, the pressure sensor 136 and the temperature sensor 132 are arranged coaxially (on the moving axis M1), and the detection projection 137 of the pressure sensor 136 is also located on the moving axis M1. In other words, the pressure sensor 136 and the temperature sensor 132 are built in coaxially. The pressure sensor 136 detects pressure based on the pressure received by the detection projection 137. As shown in Figure 1B, the detection projection 137 in this embodiment faces the contact portion P2 of the temperature sensor 132 and is adapted to be in direct contact with the contact portion P2. Therefore, the detection module 130a1 is adapted to simultaneously measure the temperature and pressure at position B1 in the cavity 112 via the temperature sensor 132 and the pressure sensor 136.

[0025] Figures 2A to 2C show some components of a mold apparatus according to other embodiments of the present disclosure. Some components (e.g., ejector pin 144) have been omitted from the diagrams of the embodiments in Figures 2A to 2C in order to clearly show the arrangement of the temperature sensor 132 and the pressure sensor 136. Referring to Figures 1B and 2A together, the detection module 130b of this embodiment is similar to that of the above embodiment, the difference being that the detection projection 137 of this embodiment faces away from the contact portion P2 of the temperature sensor 132, and the contact portion P2 contacts the pressure sensor 136 so that the detection projection 137 contacts the bearing structure 120a. Specifically, the detection projection 137 faces the inner surface of the bearing structure 120a, and the pressure sensor 136 has a contact surface 138 facing the detection projection 137, and the contact surface 138 faces the contact portion P2. As the temperature sensor 132 moves along the moving axis M1 under pressure, the contact portion P2 directly contacts the contact surface 138 such that the detection projection 137 directly contacts the inner surface of the bearing structure 120a. That is, at this time, the detection projection 137 actually contacts the inner surface of the bearing structure 120a. Therefore, it can be seen that the detection projection 137 may be directly or indirectly contacted by the contact portion P2 so that the pressure sensor 136 can detect the pressure. Thus, the detection module 130b of this embodiment achieves the same effects as the embodiment described above.

[0026] Referring simultaneously to Figures 1B and 2B, the detection module 130c of this embodiment is similar to that of the above embodiment, the difference being that the mold apparatus of this embodiment further includes a protective structure 150a, which covers the contact portion P2 of the temperature sensor 132 and provides structural protection. Here, the protective structure 150a has a substantially C-shape so as to cover the contact portion P2. The protective structure 150a is located within the bearing structure 120a and is positioned between the temperature sensor 132 and the pressure sensor 136. As shown in Figure 2B, the temperature sensor 132, the protective structure 150a, and the pressure sensor 136 are arranged coaxially (on the moving axis M1), and the protective structure 150a is movably positioned in the bearing structure 120a and adapted to be pressed by the temperature sensor 132. Specifically, when the temperature sensor 132 moves under pressure, the protective structure 150a directly contacts the pressure sensor 136 as the temperature sensor 132 moves. Here, the detection projection 137 faces the protective structure 150a, and the protective structure 150a directly contacts the detection projection 137. Of course, the arrangement of the detection projection 137 is not limited to this. For example, as shown in Figure 2A, the detection projection 137 may face away from the protective structure 150a (i.e., it may face the inner surface of the bearing structure 120a) so that the detection projection 137 directly contacts the inner surface of the bearing structure 120a.

[0027] In addition, to prevent deformation of the protective structure 150a due to pressure from the detection projection 137, the hardness of the protective structure 150a is greater than the hardness of the detection projection 137. For example, if the hardness of the detection projection 137 is 38 HRC, the hardness of the protective structure 150a is greater than 38 HRC. Of course, the hardness of the detection projection 137 is not limited to this. Therefore, the mold apparatus of this embodiment achieves the same effects as the embodiment described above.

[0028] Referring simultaneously to Figures 2B and 2C, the detection module 130d and protective structure 150b of this embodiment are similar to those of the above embodiment, the difference being that the protective structure 150b of this embodiment has a projection 152 extending along the moving axis M1 toward the pressure sensor 136 (i.e., toward the temperature sensor 132). The protective structure 150b is in contact with the pressure sensor 136 via the projection 152. Here, the detection projection 137 is in direct contact with the projection 152, but the disclosure is not limited thereto. For example, the detection projection 137 may be oriented away from the protective structure 150b (i.e., facing the inner surface of the bearing structure 120a) so that the detection projection 137 is in direct contact with the inner surface of the bearing structure 120a, as shown in Figure 2A. Thus, the protective structure 150b of this embodiment achieves the same effects as the protective structure 150a of the above embodiment. Of course, the configurations of protective structures 150a and 150b are not limited to the embodiments described above, and users can design protective structures 150a and 150b according to their structural design requirements.

[0029] According to the above, the temperature sensor 132 and the pressure sensor 136 may be arranged in multiple possible ways, and the mold apparatus may include protective structures 150a and 150b. The arrangement of the mold apparatus 100a and the detection module 130a1 shown in Figure 1A may be one of the arrangements of the detection modules 130a1, 130b, 130c, and 130d shown in Figures 1B to 2C, or a combination thereof.

[0030] Specifically, the detection projection 137 and the contact portion P2 are located on the same moving axis M1, and the detection projection 137 corresponds to the pressure detection surface. The pressure detection surface changes depending on the arrangement of the detection projection 137. The pressure sensor 136 is adapted to receive the contact force applied by the contact portion P2 so that the detection projection 137 contacts the pressure detection surface. For example, in the embodiment shown in Figure 1B, the pressure detection surface S1 is the surface of the contact portion P2. In the embodiment shown in Figure 2A, the pressure detection surface S2 is the inner surface of the bearing structure 120a. In the embodiment shown in Figure 2B, the pressure detection surface S3 is the surface of the protective structure 150a. In the embodiment shown in Figure 2C, the pressure detection surface S4 is the surface of the projection 152 of the protective structure 150b. Thus, the detection modules 130a1, 130b, 130c, and 130d can coaxially measure the temperature and pressure at any position B1 within the cavity 112.

[0031] Figure 3 is a schematic diagram of a mold apparatus according to another embodiment of the present disclosure. Referring to Figures 1A and 3 together, the mold apparatus 100b of this embodiment is similar to the embodiment described above, the difference being that the bearing structure 120b of this embodiment is not the ejector plate structure 140b. A pair of ejector plates 142b have through holes 143, and the sensing module 130a2 is inserted into the ejector plate structure 140b through the through holes 143. The bearing structure 120b is connected to one end of the sensing module 130a2 by a sleeve to provide structural protection, and the other end of the sensing module 130a2 extends into the cavity 112 (shown by a dotted line) of the mold 110 to measure the temperature and pressure at position B3 of the cavity 112. The arrangement of the temperature sensor 132 and pressure sensor 136 and / or protective structures 150a and 150b in detection module 130a2 is the same as the arrangement of detection modules 130a1, 130b, 130c and 130d shown in Figures 1B to 2C, and will not be repeated here.

[0032] Of course, the arrangement of the detection module 130a2 is not limited to this. For example, in another embodiment (not shown), the detection module 130a2 is positioned outside the ejector plate structure 140b, and the projection of the detection module 130a2 onto the mold 110 does not overlap with the projection of the ejector plate structure 140b onto the mold 110. In another embodiment (not shown), the mold apparatus 100b includes both detection modules 130a1 and 130a2. The detection modules 130a1 and 130a2 and the bearing structures 120a and 120b may be arranged in a number of possible ways, and the user can arrange them according to their requirements.

[0033] Figure 4 is a cross-sectional view of the mold apparatus of Figure 1A. Figure 4 is a cross-sectional view taken along line A in Figure 1A. Referring to Figures 1A and 4, in order to prevent damage to the temperature sensor 132 (shown in Figure 1B) due to high temperatures and to limit the availability of the temperature sensor 132 in different processes, the mold apparatus 100a includes a cooling channel 160, and the sensing module 130a1 is surrounded by the cooling channel 160. The cooling channel 160 can be considered a mold sensor cooling structure adapted to lower the temperature of the sensing module 130a1. More specifically, the cooling channel 160 surrounds the portion of the temperature sensor 132 other than the sensing part P1 (shown in Figure 1A), allowing for localized cooling of the temperature sensor 132. Thus, the temperature sensor 132 can withstand higher mold temperatures, which improves the availability of the temperature sensor 132 in different processes. Here, the temperature sensor 132 is an optical fiber temperature sensor and includes a light receiving unit LR (shown in Figures 1B to 2C). The light receiving unit LR is positioned at the contact point P2 and receives the temperature signal from the detection unit P1. Since the temperature sensor 132 is an optical fiber temperature sensor, the temperature signal from the detection unit P1 is not affected by the local temperature drop of the temperature sensor 132, and therefore the temperature detected by the temperature sensor 132 is not distorted.

[0034] As shown in Figure 4, the cooling channel 160 is located within the bearing structure 120a (a pair of protruding plates 142a of the protruding plate structure 140a) and surrounds the extension structure 133 of the temperature sensor 132. Here, the cooling channel 160 has a channel 161, which has a water inlet 162 and a water outlet 164. Cooling liquid with a lower temperature flows into the channel 161 through the water inlet 162, exchanges heat with the two extension structures 133, and then the hotter cooling liquid exits through the water outlet 164. The channel 161 has a substantially C-shape and surrounds and cools the two extension structures 133 simultaneously. Of course, the design and placement of the channel 161 of the cooling channel 160 are not limited to this.

[0035] For example, in another embodiment (not shown), the cooling channel 160 includes two channels 161 for surrounding and cooling two extension structures 133, respectively. In another embodiment (not shown), the cooling channel 160 is located within bearing structures 120a and 120b and has a helical channel covering the contact portion P2 and / or extension structure 133. In another embodiment (not shown), the cooling channel 160 is located within protective structures 150a and 150b shown in Figures 2B and 2C to cool the contact portion P2 of the temperature sensor 132. The user can configure the cooling channel 160 according to structural design requirements to achieve the effect of lowering the temperature of the temperature sensor 132, thereby allowing the mold apparatus 100a to be used in higher temperature processes and improving the availability of the mold apparatus 100a in different processes. Since the cooling channel 160 is not located within the mold 110, the temperature of the mold 110 is not affected by the cooling channel 160, and the mold 110 is not prevented from reaching its operating temperature.

[0036] Figure 5 is a schematic diagram of a mold apparatus according to another embodiment of the present disclosure. Referring to Figure 5, the detection module 130e and protective structure 150c of this embodiment are located within the mold 110. Specifically, the detection module 130e is covered by the protective structure 150c, and the cooling channel 160 is located within the protective structure 150c. Here, the temperature sensor does not have to be an ejector pin type temperature sensor. The detection module 130e and cooling channel 160 of this embodiment achieve the same effects as in the above embodiment.

[0037] In summary, in the detection module of the mold apparatus of this disclosure, the temperature sensor and pressure sensor are arranged coaxially (on the moving axis), so the detection module is adapted to simultaneously measure temperature and pressure at any position in the cavity, which reduces the installation and manufacturing costs of the sensors in the mold apparatus. Here, the temperature sensor and pressure sensor can be combined in several possible ways. Specifically, the temperature sensor is movably positioned along the moving axis in the mold and bearing structure. The sensing part of the temperature sensor detects the temperature at any position in the cavity and transmits a temperature signal to the contact part of the temperature sensor. When the temperature sensor receives pressure from this position, the contact part of the temperature sensor moves along the moving axis, compressing the pressure sensor and detecting the pressure at this position. The sensing projection and contact part of the pressure sensor are located on the same moving axis, and the sensing projection corresponds to the pressure sensing surface. The pressure sensing surface varies depending on the arrangement of the sensing projection. For example, if the sensing projection faces the contact part, the pressure sensing surface is the surface of the contact part. When the sensing projection faces the bearing structure, the pressure sensing surface is the inner surface of the bearing structure. In addition, the mold apparatus includes a protective structure positioned between the temperature sensor and the pressure sensor, which provides protection for the contact area. When the protective structure contacts the pressure sensor and the sensing projection faces the contact area, the pressure sensing surface is the surface of the contact area. The hardness of the protective structure is greater than the hardness of the sensing projection.

[0038] In addition, the mold apparatus of this disclosure further includes a cooling channel for cooling the temperature sensor and preventing damage to the temperature sensor due to high temperatures. The cooling channel is located in the bearing structure and / or protective structure and can locally lower the temperature of the temperature sensor by exchanging heat with the portion covering the temperature sensor other than the sensing part. Thus, the temperature sensor can withstand higher mold temperatures, and as a result, the usability of the temperature sensor in different processes can be improved.

[0039] It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the scope or spirit of this disclosure. In consideration of the foregoing, this disclosure is intended to include modifications and variations, provided that they fall within the scope of the following claims and their equivalents. [Industrial applicability]

[0040] The mold apparatus of the present invention can be applied to molding processes such as injection molding processes and smart molding processes. [Explanation of Symbols]

[0041] 100a, 100b, 100c: Mold equipment 110: Mold 112: Cavity 120a, 120b: Bearing structure 122: Storage space 130a1, 130a2, 130b, 130c, 130d, 130e: Detection module 132: Temperature sensor 133: Extension structure 136: Pressure sensor 137: Detection protrusion 138: Contact surface 140a, 140b: Protruding plate structure 142a, 142b: Protruding plate 143: Through hole 144: Protruding pin 150a, 150b, 150c: Protective structure 152: Protrusion 160: Cooling channel 161: Flow channel 162: Water inlet 164: Water outlet A: Line B1, B2, B3:Position LR: Light receiving unit M1: Movement axis P1: Detection unit P2: Contact part S1, S2, S3, S4: Pressure sensing surfaces

Claims

1. A mold having a cavity, Cooling channel and A sensing module surrounded by the aforementioned cooling channel and adapted to detect at least one of the temperature and pressure within the cavity, Bearing structure and, Equipped with, The detection module includes a temperature sensor and a pressure sensor. The temperature sensor has an extension structure, a detection part, and a contact part. The detection unit is located within the mold, the contact portion is located within the bearing structure, and the pressure sensor is located within the bearing structure, corresponding to the contact portion, and adapted so that the contact portion contacts the pressure sensor due to the pressure in the cavity. The extension structure extends from the contact portion along the movable axis, A mold apparatus in which the cooling channel is located within the bearing structure and surrounds the extension structure of the temperature sensor.

2. The mold apparatus according to claim 1, wherein the temperature sensor further has a detection unit, the detection unit is located within the mold, and the pressure sensor is located within the bearing structure and corresponds to the contact unit, and is adapted so that the contact unit contacts the pressure sensor due to the pressure in the cavity.

3. The mold apparatus according to claim 2, wherein the cooling channel is located in the bearing structure.

4. The mold apparatus according to claim 2, wherein the temperature sensor is a protruding pin type temperature sensor and the bearing structure is a protruding plate structure.

5. The mold apparatus according to claim 2, wherein the temperature sensor is an optical fiber temperature sensor, and comprises a light receiving unit, the light receiving unit is arranged in the contact portion.

6. The mold apparatus according to claim 2, further comprising a protective structure, wherein the protective structure covers the contact portion and the cooling channel is located within the protective structure.

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