Laminated structures, cured products, and printed circuit boards

The use of a laminated structure with a support made of specific resins addresses issues of pattern indentations and contamination in PET film-based structures, ensuring adequate insulation and coverage in miniaturized circuits without peeling marks.

JP7870063B2Active Publication Date: 2026-06-04TAIYO HOLDINGS CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
TAIYO HOLDINGS CO LTD
Filing Date
2022-03-31
Publication Date
2026-06-04

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Abstract

To provide a laminated structure which solves a problem when a conventional PET film is used as a support film, can obtain a pattern with no recess and rattling, has sufficient embedding property and covering property, and enables formation of a solder resist without causing contamination and a lack.SOLUTION: A laminated structure has (A) a support and (B) a curable resin composition layer, wherein (A) the support contains at least one or more resins selected from a saponified product of polyvinyl acetate, a polyethylene oxide, a copolymer of a polyethylene oxide and a polystyrene sulfonic acid, (B) the curable resin composition layer contains an alkali-soluble resin, and a tensile elastic modulus of (A) the support is within a range of 100 to 2,500 MPa.SELECTED DRAWING: Figure 1
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