Alignment device and method

Abstract

To provide an alignment device and method capable of preventing generation of an alignment error of a workpiece.SOLUTION: An alignment method includes: detecting a predetermined position of a workpiece (W); calculating a deformation amount of the workpiece from distortion of the workpiece calculated on the basis of deviation from a design value of the predetermined position; calculating a position of a division scheduled line (CL1) of the workpiece on the basis of the deformation amount of the workpiece; and performing alignment of the workpiece and a jig (J1) that absorbs and holds the workpiece so that a line with a width corresponding to a blade thickness of a blade (32) along the division scheduled line is within a jig groove of the jig.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a dicing apparatus and method, and more particularly to a dicing apparatus and method for dividing a workpiece (hereinafter referred to as "workpiece") such as a wafer on which a semiconductor device or electronic component is formed into individual chips. [Background technology]

[0002] A dicing apparatus, which divides a workpiece such as a wafer on which semiconductor devices or electronic components are formed into individual chips, comprises a blade rotated at high speed by a spindle, a worktable that holds the workpiece by suction, and X, Y, Z, and θ drive units that change the relative position between the worktable and the blade. In the dicing apparatus, dicing (cutting) is performed by moving the blade and the workpiece relatively using each drive unit, causing the blade to cut into the workpiece.

[0003] When dicing a workpiece, the workpiece is fixed to a jig by suction, and the planned division line of the workpiece is aligned with the jig groove. This allows the blade to cut deeply through the workpiece, making it possible to completely divide the workpiece.

[0004] When dicing a workpiece using a jig, if the position of the planned division line on the workpiece is misaligned with the position of the jig groove, the blade will interfere with the jig as it detects and processes the planned division line, resulting in a portion of the jig being removed. When a portion of the jig is removed, air leaks when the workpiece is held in place by the jig, making it difficult to stably hold the workpiece in place. Furthermore, the lifespan of the jig is shortened, leading to increased jig replacement frequency and higher costs, and the debris generated by the cutting of the jig can contaminate the cleanroom.

[0005] Patent documents 1 and 2 disclose a method for aligning the workpiece's planned division line with the jig groove, which involves removing the workpiece from the jig and then repositioning it. Specifically, the jig groove and planned division line are detected from images taken before and after the workpiece is placed on the jig, and the amount of displacement between the position of the jig groove and the position of the workpiece's planned division line is calculated. Next, the workpiece is removed from the jig, the workpiece or jig is moved to correct the displacement, and then the workpiece is repositioned on the jig. This aligns the planned division line with the jig groove. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2013-065603 [Patent Document 2] Japanese Patent Publication No. 2016-143861 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] The following (1) and (2) are possible causes of interference between the blade and the jig during the dicing process. (1) Loading error when loading the workpiece into the machining area and holding it in place by suction on the jig. (2) Misalignment of the planned division line due to distortion of the workpiece. Cumulative misalignment resulting from the accumulation of partial misalignments of the planned division line.

[0008] Patent documents 1 and 2 describe a method of aligning a workpiece by calculating the amount of misalignment between the position of the jig groove and the position of the workpiece's planned division line, and then moving the workpiece away from the jig and repositioning it. According to patent documents 1 and 2, it is possible to calculate the amount of misalignment caused by the loading error (1) from images taken before and after the workpiece is placed on the jig, and to correct the amount of misalignment by repositioning it. However, patent documents 1 and 2 require the workpiece to be moved away from the jig and repositioned, which is time-consuming and leads to a loss of time. This has resulted in a problem of reduced throughput for the dicing apparatus.

[0009] Furthermore, Patent Documents 1 and 2 do not take into account the cumulative misalignment of partial deviations of the planned division line caused by the distortion of the workpiece (2), making it difficult to prevent interference between the blade and the jig caused by the cumulative misalignment of partial deviations of the planned division line. If interference between the blade and the jig occurs during dicing, an error will occur when the interference is detected, causing the dicing device to stop. When the dicing device stops due to an error, there is a problem in that the throughput decreases further.

[0010] The present invention has been made in view of these circumstances, and aims to provide a dicing apparatus and method that can prevent the occurrence of workpiece alignment errors during dicing and can prevent interference between the blade and the jig. [Means for solving the problem]

[0011] To solve the above problems, a dicing apparatus according to a first aspect of the present invention includes a handler for holding and transporting a workpiece, a sensor for measuring the outer shape of a workpiece while it is held in the handler, a jig for suction-holding the workpiece, a processing unit including a blade for performing dicing along a planned division line on the workpiece held by the jig, and a control unit that calculates the position of the planned division line of the workpiece based on the measurement result of the outer shape of the workpiece and aligns the workpiece and the jig so that a line of thickness corresponding to the blade thickness along the planned division line fits into the jig groove of the jig.

[0012] In the second aspect of the present invention, the dicing apparatus, in the first aspect, is configured such that the control unit aligns the workpiece with the jig such that lines corresponding to the thickness of the blade along at least two dividing lines closest to two opposing sides of the workpiece fit into the jig grooves of the jig.

[0013] In the third aspect of the present invention, the dicing apparatus, in the first aspect, is configured such that the control unit aligns the workpiece with the jig such that lines of a thickness corresponding to the blade thickness along the planned division lines included in a plurality of division areas provided on the workpiece fit into the jig grooves of the jig.

[0014] In the fourth aspect of the present invention, in the third aspect, the dicing apparatus is configured such that the control unit aligns the workpiece with the jig such that lines corresponding to the thickness of the blade along at least two dividing lines closest to two opposing sides in the dividing area fit into the jig grooves of the jig.

[0015] A dicing method according to a fifth aspect of the present invention includes the steps of: measuring the outer shape of a workpiece while holding it in a handler; calculating the position of the planned division line of the workpiece based on the measurement result of the outer shape of the workpiece; aligning the workpiece and a jig so that a line along the planned division line of the workpiece, with a thickness corresponding to the cutting edge thickness of the blade for dicing the workpiece, fits into the jig groove of the jig; and holding the workpiece with the jig and performing dicing along the planned division line of the workpiece. [Effects of the Invention]

[0016] According to the present invention, even if a deviation in the planned division line occurs due to distortion of the workpiece, the occurrence of alignment errors can be prevented and interference between the blade and the jig can be prevented by pre-measuring the outer shape of the workpiece and calculating the position of the planned division line. [Brief explanation of the drawing]

[0017] [Figure 1] Figure 1 is a plan view showing a dicing apparatus according to one embodiment of the present invention. [Figure 2] Figure 2 is a block diagram showing the control system of a dicing apparatus according to one embodiment of the present invention. [Figure 3] Figure 3 is a perspective view showing an example of a sensor. [Figure 4] Figure 4 is a plan view illustrating the method for measuring the outer shape of a workpiece using the sensor shown in Figure 3. [Figure 5] Figure 5 is a perspective view showing an example of a non-contact sensor. [Figure 6] Figure 6 is a plan view (before alignment) showing the machining stage and workpiece. [Figure 7] Figure 7 is a plan view (after alignment) showing the machining stage and workpiece. [Figure 8] Figure 8 is a magnified perspective view showing a jig provided on the surface of the machining stage. [Figure 9] Figure 9 is a plan view showing the cutting process of the workpiece. [Figure 10] Figure 10 is a cross-sectional view of XX in Figure 9. [Figure 11] Figure 11 is a plan view showing a comparative example. [Figure 12] Figure 12 is a flowchart showing a dicing method according to the first embodiment of the present invention. [Figure 13] Figure 13 is a plan view illustrating a dicing method according to a second embodiment of the present invention. [Figure 14] Figure 14 is a flowchart showing a dicing method according to a second embodiment of the present invention. [Figure 15] Figure 15 is a flowchart showing the dicing process for each divided area in Figure 14. [Modes for carrying out the invention]

[0018] Hereinafter, embodiments of the dicing apparatus and method according to the present invention will be described with reference to the attached drawings.

[0019] [Dicing device] Figure 1 is a plan view showing a dicing apparatus according to one embodiment of the present invention, and Figure 2 is a block diagram showing the control system of the dicing apparatus according to one embodiment of the present invention.

[0020] As shown in Figures 1 and 2, the dicing apparatus 1 according to this embodiment includes a processing unit 20 for dicing a workpiece W and a handler 50. In the dicing apparatus 1 according to this embodiment, before dicing, the outer shape of the workpiece W is measured while the workpiece W is held in the handler 50, and based on the measurement result of the measurement of the outer shape of the workpiece W, alignment is performed between the workpiece W in the processing unit 20 and the jig groove G1 of the jig J1 (see Figures 6 to 10).

[0021] The loading of workpieces W into and out of the processing unit 20 is performed using a handler 50. The handler 50 includes a handler shaft 52, a handler arm 54, and a handler drive unit 56. The handler shaft 52 extends in the Y direction and holds the handler arm 54 so that it can move along the Y and Z directions. The handler arm 54 holds the workpieces W by suction. The handler drive unit 56 includes a power source (e.g., a motor) for moving the handler arm 54 in the Y and Z directions. As a mechanism for moving the handler arm 54 in the Y and Z directions, a ball screw mechanism can be used, which is provided on the handler shaft 52 and the handler arm 54 is provided with a nut that screws into the ball screw, or a mechanism capable of reciprocating linear motion such as a rack and pinion mechanism.

[0022] As shown in Figure 2, the control system of the dicing apparatus 1 according to this embodiment includes a control unit 100, an input unit 102, and a display unit 104. The control system of the dicing apparatus 1 can be implemented using a general-purpose computer such as a personal computer or a microcomputer.

[0023] The control unit 100 includes a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and a storage device (e.g., a hard disk). In the control unit 100, various programs, such as control programs stored in ROM, are loaded into RAM, and the CPU executes the programs loaded into RAM, thereby realizing the functions of each part of the dicing device 1.

[0024] The input unit 102 includes an operating component (e.g., a keyboard, a pointing device, etc.) for receiving user input.

[0025] The display unit 104 is a device that displays a GUI (Graphical User Interface) for operating the dicing device 1, and includes, for example, a liquid crystal display.

[0026] (Measurement of the outer dimensions of the workpiece) As shown in Figure 2, the dicing apparatus 1 according to this embodiment includes a sensor 10 and a sensor control unit 12.

[0027] The sensor 10 detects the outer shape of the workpiece W (e.g., the outer edge, the four corners, etc.) while the workpiece W is held in the handler 50. The sensor 10 can be a camera that photographs the workpiece W from below (-Z side) in the diagram, or a non-contact sensor that uses laser light.

[0028] The sensor control unit 12 includes a processing unit that converts the detection result of the workpiece W's outline by the sensor 10 into a detection signal and transmits it to the control unit 100, and a drive unit for moving the sensor 10 in the XY direction. As the drive unit for the sensor 10, for example, a mechanism capable of reciprocating linear motion as described above can be used.

[0029] The control unit 100 estimates the strain of the workpiece W from the detection signal, which includes the detection result of the workpiece W's outline, received from the sensor control unit 12. Specifically, the control unit 100 estimates the strain of the workpiece W based on the deviation of the detection result of the workpiece W's outline from the design value.

[0030] For example, in the case of a rectangular workpiece W as shown in Figure 1, the sensor 10 is used to detect points P1 to P4 (see Figure 4) at the four corners of the workpiece W. Based on the deviations from the design values ​​of points P1 to P4 at the four corners of the workpiece W, the distortion of the workpiece W in the XY direction and the rotational direction (θ direction) is calculated, and the position of the planned division line CL1 of the workpiece W is calculated based on the distortion of the workpiece W. To calculate the position of the planned division line CL1, for example, it is assumed that the workpiece W deforms linearly in the XYθ direction, and the deviation of the position of the planned division line CL1 from the design value is estimated based on the amount of deformation of the workpiece W.

[0031] In the machining section 20, the workpiece W and the stage ST1 or ST2 are aligned based on the position of the planned division line CL1.

[0032] Figure 3 is a perspective view showing an example of a sensor, and Figure 4 is a plan view illustrating a method for measuring the outer shape of a workpiece using the sensor shown in Figure 3.

[0033] The sensor 10 shown in Figure 3 is a line sensor in which image sensors are arranged in a line (Y direction). The length of the region in the sensor 10 where the image sensors are arranged is longer than the Y-direction length of the workpiece W. Therefore, by capturing an image of the workpiece W while moving the handler arm 54 holding the workpiece W and the sensor 10 relative to each other in the X direction, an image of the -Z side of the workpiece W can be captured. The control unit 100 measures the outer shape of the workpiece W from the image of the -Z side of the workpiece W.

[0034] When capturing an image of the -Z side of the workpiece W, the handler arm 54 holding the workpiece W and the sensor 10 may be moved relative to each other in the X direction while capturing an image of the workpiece W, and the captured images may be stitched together to create an image of the entire surface of the workpiece W. In this case, it becomes possible to calculate the distortion of the entire surface of the workpiece W (for example, the deviation from the design value).

[0035] Alternatively, the handler arm 54 holding the workpiece W and the sensor 10 may be moved relative to each other in the X direction, and images of both ends V1 and V2 of the workpiece W in the X direction may be taken. The four corners of the workpiece W, points P1 to P4, may then be detected from the images of both ends V1 and V2. In this case, the outline of the workpiece W can be calculated from the positions of the four corners P1 to P4 by linear interpolation or least-squares approximation, and the distortion of the workpiece W can be calculated from the outline of the workpiece W.

[0036] In addition to images of both ends V1 and V2, an image of the intermediate section V3 between both ends V1 and V2 may also be taken. In this case as well, the outline of the workpiece W can be calculated from the four corner points P1 to P4 of the workpiece W and the position of the end of the intermediate section V3 by linear interpolation or least-squares approximation, and the distortion of the workpiece W can be calculated from the outline of the workpiece W.

[0037] Furthermore, as shown in Figure 4, if the workpiece W is divided into multiple sections (four sections, A1 to A4, in the example shown in Figure 4), slits (SL1 to SL3) may be formed between each section. In this case, in addition to images of both ends V1 and V2, the region including one of the slits SL1 to SL4 may be captured. In this case, it becomes possible to calculate the distortion for each section of the workpiece W.

[0038] In this embodiment, a line sensor longer than the workpiece W was used as the sensor 10, but the present invention is not limited to this. For example, if a line sensor shorter than the workpiece W is used, the images captured by scanning the sensor 10 in the XY direction can be stitched together.

[0039] Furthermore, although a line sensor was used as the sensor 10 in this embodiment, the present invention is not limited to this. As the sensor 10, for example, an area sensor in which image sensors are arranged in two dimensions, a camera, or a non-contact sensor can also be used.

[0040] Figure 5 is a perspective view showing an example of a non-contact sensor. The non-contact sensor 10-1 shown in Figure 5 includes a light-emitting unit 14 and a light-receiving unit 16. The light-emitting unit 14 is equipped with an element that emits laser light L1, and the light-receiving unit 16 is equipped with a light-receiving element that receives the laser light L1. The light-emitting unit 14 and the light-receiving unit 16 are positioned on the -Z side and +Z side of the workpiece W, respectively, and the light-receiving unit 16 receives the laser light L1 emitted by the light-emitting unit 14 in the +Z direction. The sensor control unit 12 transmits a detection signal to the control unit 100 indicating the position when the laser light L1 is blocked by the workpiece W, and the control unit 100 measures the outer shape of the workpiece W based on the position when the laser light L1 is blocked by the workpiece W.

[0041] Furthermore, when using the non-contact sensor 10-1 shown in Figure 5, four non-contact sensors may be provided corresponding to the four corners of the workpiece W. In this case, it may be possible to detect the four corner points of the workpiece W without moving the non-contact sensor 10-1 relative to the workpiece W.

[0042] Furthermore, although the example shown in Figure 5 describes a non-contact sensor 10-1 in which a light-emitting unit 14 and a light-receiving unit 16 are arranged with the workpiece W in between, a non-contact sensor using the TOF (Time of Flight) method or a phase difference detection method may also be used.

[0043] (Processing department) In the machining section 20, the workpiece W is aligned and blade dicing is performed based on the measurement results of the shape measurement of the workpiece W. As shown in Figures 1 and 2, the machining section 20 includes a first stage ST1, a second stage ST2, a first stage drive unit 22-1, a second stage drive unit 22-2, a machining drive unit 26, a microscope MS, an MS drive unit 28, a first spindle 30-1, a second spindle 30-2, a first blade 32-1, and a second blade 32-2.

[0044] The workpiece W, whose external shape has been measured using the sensor 10, is held by the handler arm 54 and transported to the processing unit 20, where it is placed on the first stage ST1 or the second stage ST2. A jig for holding the workpiece W by suction is provided on the surface of the first stage ST1 or the second stage ST2. In the following description, the workpiece being transported will be referred to as W, and the workpieces held by suction on the first stage ST1 and the second stage ST2 will be referred to as W1 and W2, respectively.

[0045] The first stage drive unit 22-1 includes a motor that rotates the first stage ST1 in the θ1 direction and a pump that sucks in air to attract the workpiece W to the first stage ST1. The second stage drive unit 22-2 includes a motor that rotates the second stage ST2 in the θ2 direction and a pump that sucks in air to attract the workpiece W to the second stage ST2.

[0046] In this embodiment, the processing unit 20 is provided with two stages (first stage ST1 and second stage ST2), but the processing unit 20 may have only one stage.

[0047] A first spindle 30-1 and a second spindle 30-2 are mounted with a first blade 32-1 and a second blade 32-2, respectively. The first spindle 30-1 and the second spindle 30-2 each include a high-frequency motor for rotating the first blade 32-1 and the second blade 32-2 at high speed.

[0048] The first blade 32-1 and the second blade 32-2 are, for example, disc-shaped cutting blades. For the first blade 32-1 and the second blade 32-2, it is possible to use, for example, electroplated blades in which diamond abrasive grains or CBN (Cubic Boron Nitride) abrasive grains are electroplated with nickel, or resin blades bonded with resin. The first blade 32-1 and the second blade 32-2 are interchangeable depending on the type and size of the workpiece W to be processed, as well as the processing content.

[0049] As described above, the first stage ST1 and the second stage ST2 have similar configurations. For this reason, in the following description, the first stage drive unit 22-1 and the second stage drive unit 22-2 may be collectively referred to as the machining stage drive unit 22, the first spindle 30-1 and the second spindle 30-2 as the spindle 30, and the first blade 32-1 and the second blade 32-2 as the blade 32.

[0050] The machining drive unit 26 includes a motor for moving the first spindle 30-1 and the second spindle 30-2 along the machining axis (Y axis).

[0051] The MS drive unit 28 includes a power source (e.g., a motor) for moving the microscope MS along the X1 axis, X2 axis, and MS axis. As a mechanism for moving the microscope MS, a mechanism capable of reciprocating linear motion, such as a ball screw or a rack and pinion mechanism, can be used.

[0052] The microscope (MS) captures images of the surfaces of workpieces W1 and W2, which are adsorbed and held in the first stage ST1 and the second stage ST2. The surface images of workpieces W1 and W2 captured by the microscope (MS) are transmitted to the control unit (100).

[0053] In this embodiment, the microscope MS is moved along the X1 axis, X2 axis, and MS axis, but the first stage ST1 and the second stage ST2 may be moved instead, or the microscope MS, the first stage ST1, and the second stage ST2 may be moved together. In the following description, the first stage ST1 and the second stage ST2 may be referred to as the processing stage ST.

[0054] The control unit 100 performs image processing on the surface images of workpieces W1 and W2 received from the microscope MS to align the planned division lines of workpieces W1 and W2 with the fixtures provided on the surfaces of the first stage ST1 and the second stage ST2.

[0055] In this embodiment, for simplicity, the X1 and X2 axes are parallel to the X axis, and the handler axis 52, MS axis, and machining axis are parallel to the Y axis, but the present invention is not limited thereto. For example, the X1 and X2 axes and the MS axis of the machining unit 20 can each be provided independently.

[0056] (Alignment) First, we will explain the configuration of the processing stage ST and the jig J1 for adsorbing the workpiece W.

[0057] Figures 6 and 7 are plan views showing the machining stage and workpiece. Figures 6 and 7 show the state before and after alignment of the machining stage ST and workpiece W, respectively. Figure 8 is a magnified perspective view showing a jig provided on the surface of the machining stage.

[0058] As shown in Figure 6, the surface of the workpiece W is provided with division lines CL1 for dividing semiconductor devices or electronic components formed on the workpiece W into individual chips. A jig (suction pad) J1 is provided on the surface of the processing stage ST so as to correspond one-to-one with the chips of the workpiece W. The jig J1 is positioned on the surface of the processing stage ST at predetermined intervals W GThey are attached (glued) in a line along the XY direction, with a gap between them. In the following explanation, the space between the fixtures J1 is referred to as the fixture groove G1. Here, the fixtures J1 are replaced according to the type and size of the workpiece W to be machined and the machining content, and the width of the fixture groove G1 W G The width (blade thickness) of blade 32 W B A broader term is used.

[0059] The planar shape of jig J1 is approximately rectangular in the examples shown in Figures 6 and 7, but it can be changed to correspond to the shape of the chip. As shown in Figure 7, the size of jig J1 in plan view is smaller than the size of the chip.

[0060] The jig J1 is made of rubber, for example, and as shown in Figure 8, it is cylindrical (rectangular) with an open top (+Z side) and a closed bottom. A suction hole H1 is formed on the bottom surface of the jig J1, and the workpiece W is held in place by suction of air between the workpiece W and the jig J1 using the pump of the first stage drive unit 22-1 or the second stage drive unit 22-2.

[0061] The shape of the jig J1 is not limited to a cylindrical shape. For example, the jig J1 may be created by dicing a plate-shaped rubber having multiple suction holes H1 formed on it.

[0062] When loading the workpiece W onto the machining stage ST, alignment is performed based on the position of the planned division line CL1 calculated by the control unit 100, as shown in Figure 7. Specifically, the control unit 100 aligns the thickness W along the planned division line CL1 calculated by the control unit 100. B The control unit 100 calculates the X and Y coordinates of the workpiece W and the rotation angle (θ1 or θ2) of the machining stage ST such that all the lines fit within the corresponding jig groove G1. Then, based on the calculated X and Y coordinates and rotation angle (θ1 or θ2), the control unit 100 adjusts the relative position of the handler arm 54 and the machining stage ST to align the workpiece W with the jig groove G1 and hold the workpiece W in place on the jig J1.

[0063] In addition, in this embodiment, alignment is performed so that lines with a thickness W along the planned division line CL1 are all accommodated in the corresponding jig grooves G1. However, the present invention is not limited to this. For example, only a part of the planned division line CL1 (for example, two planned division lines CL B and CL X11 that are closest to the two opposing sides at both ends in the X direction of the workpiece W, two planned division lines (in the example shown in FIG. 7, since the workpiece W is divided into four division areas A1 to A4, a total of eight planned division lines CL X42 Y11 Y12 CL Y21 CL Y22 CL Y31 CL Y32 CL Y41 CL Y42 CL B and CL ) of the workpiece W, or a plurality of lines including these, may be calculated for their positions, and alignment may be performed so that the calculated planned division lines are accommodated in the corresponding jig grooves G1.

[0064] Generally, since the workpiece W is formed of a uniform material, it is considered that the deformation of the workpiece W occurs substantially linearly. In this case, the planned division line CL1 is distributed substantially linearly according to the distortion of the workpiece W. Therefore, even if alignment is performed only so that two planned division lines CL1 closest to the two opposing sides at both ends in the Y direction of the workpiece W are accommodated in the corresponding jig grooves G1, it is possible to make the other planned division lines CL1 be accommodated in the corresponding jig grooves G1.

[0065] FIG. 9 is a plan view showing the cutting state of the workpiece, and FIG. 10 is a cross-sectional view taken along the line X-X of FIG. 9. FIG. 11 is a plan view showing a comparative example.

[0066] In the example shown in FIG. 9, the thickness W along the planned division line CL1 BThe alignment is performed so that all of the lines CT1 fit within the corresponding jig grooves G1. In this case, as shown in Figure 10, when the workpiece W is diced by the blade 32, the blade 32 does not interfere with the jig J1.

[0067] On the other hand, in the example shown in Figure 11, the thickness W along the planned division line CL2 B A portion of line CT2 extends outside the corresponding jig groove G1. In this case, when dicing the workpiece W is performed with the blade 32, the blade 32 interferes with the jig J1 in region E1 shown in the figure. As a result, the blade 32 cuts into the jig J1, causing the jig J1 to break.

[0068] According to this embodiment, the position of the planned division line CL1 is calculated in advance based on the detection result of the outer shape of the workpiece W, and the thickness W along this planned division line CL1 is calculated in advance. B Alignment is performed so that line CT1 fits into the corresponding jig groove G1. This prevents interference between the blade 32 and the jig J1.

[0069] [Dicing method] (First Embodiment) Figure 12 is a flowchart showing a dicing method according to the first embodiment of the present invention.

[0070] First, the control unit 100 controls the handler 50 to cause the handler arm 54 to pick up and hold the workpiece W (step S10). Then, with the workpiece W held by the handler arm 54, the sensor 10 is used to detect the outer shape of the workpiece W (step S12).

[0071] Next, the control unit 100 calculates the strain of the workpiece W based on the detection result of the workpiece W's outer shape. Then, the control unit 100 determines whether alignment is possible based on the calculated strain of the workpiece W (step S14). The determination in step S14 is made, for example, by any of the following (A) to (C).

[0072] (A) Based on the calculation result of the distortion of the workpiece W, the control unit 100 calculates the positions of all planned division lines CL1 of the workpiece W, for example, by linear interpolation or least squares approximation. Next, the control unit 100 calculates the thickness W along the planned division lines CL1. B This determines whether alignment is possible such that all lines CT1 fit within the corresponding jig grooves G1.

[0073] (B) Based on the calculation result of the distortion of the workpiece W, the control unit 100 determines, for example, by linear interpolation or least squares approximation, (B1) the two planned division lines CL closest to the two opposing sides at both ends of the workpiece W in the X direction. X11 and CL X42 (See Figure 7), or (B2) the division line closest to the two opposing sides at both ends of the workpiece W in the Y direction (in the example shown in Figure 7, the workpiece W is divided into four division areas A1 to A4, so there are a total of eight division lines CL). Y11 CL Y12 CL Y21 CL Y22 CL Y31 CL Y32 CL Y41 and CL Y42 Next, the control unit 100 calculates the position of the calculated division line (CL). X11 and CL X42 , or CL Y11 CL Y12 CL Y21 CL Y22 CL Y31 CL Y32 CL Y41 and CL Y42 Thickness W along the curve B This determines whether alignment is possible such that line CT1 fits into the corresponding jig groove G1. Y11 CL Y21 CL Y31 and CL Y41 And, the planned division line CL Y12 CL Y22 CL Y32 and CL Y42 Since each of these is cut in a single scan, they can be treated as separate planned division lines.

[0074] (C) Based on the calculation result of the distortion of the workpiece W, the control unit 100 calculates the position of a portion of the planned division line CL1, for example by linear interpolation or least squares approximation. Next, the control unit 100 calculates the thickness W along the above portion of the planned division line CL1. B It is determined whether alignment is possible such that all lines CT1 fit within the corresponding jig grooves G1. Here, some of the planned division lines CL1 are, for example, (C1) the planned division line (CL) closest to the four sides of the workpiece W. X11 and CL X42 and CL Y11 CL Y12 CL Y21 CL Y22 CL Y31 CL Y32 CL Y41 and CL Y42 (C2) The two dividing lines CL closest to the two opposing sides at both ends of the workpiece W in the X direction. X11 and CL X42 Multiple planned division lines CL1 including (C3) or the planned division line CL closest to the two opposing sides at both ends of workpiece W in the Y direction Y11 CL Y12 CL Y21 CL Y22 CL Y31 CL Y32 CL Y41 and CL Y42 This is CL1, which includes multiple lines scheduled for splitting.

[0075] Next, if the control unit 100 determines in step S14 that alignment is possible, it controls the handler arm 54 to load the workpiece W onto the machining stage ST of the machining unit 20. At this time, the control unit 100 performs alignment based on the determination result of the workpiece W in step S14 and controls the machining stage drive unit 22 to hold the workpiece W on the machining stage ST by suction (step S16). Then, the control unit 100 moves the blade 32 along the planned division line CL1 of the workpiece W held on the machining stage ST to perform dicing (step S18).

[0076] On the other hand, if the control unit 100 determines in step S14 that alignment is impossible, it removes the workpiece W from the handler arm 54 (unloads it) and excludes it from the dicing process (step S20). In this case, the above steps may be repeated for another workpiece W.

[0077] According to this embodiment, even if a shift in the planned division line CL1 occurs due to distortion of the workpiece W, the position of the planned division line can be calculated by pre-measuring the outer shape of the workpiece W. This prevents alignment errors and also prevents interference between the blade 32 and the jig J1.

[0078] (Second embodiment) In the first embodiment, it was determined whether or not the planned division line CL1 of the workpiece W and the jig groove G1 could be aligned in a single alignment. In contrast, in this embodiment, dicing is performed even if alignment is possible for each area of ​​the workpiece W (for example, for each division area A1 to A4).

[0079] Figure 13 is a plan view illustrating a dicing method according to a second embodiment of the present invention.

[0080] In the example shown in Figure 13, the thickness W is along the planned division line CL1. B It is not possible to perform alignment such that all of line CT1 fits within the corresponding jig groove G1. Therefore, the workpiece W is divided into multiple sections A1 to A4, and alignment and dicing are performed for each section A1 to A4.

[0081] Specifically, as shown in Figure 13, first, for the planned division line CL1 included in the division area A1, the thickness W along the planned division line CL1 BAlignment is performed so that all lines CT1 fit within the jig groove G1 of the corresponding jig group JG1. At this time, in the division area A2 to A4, the thickness W along the planned division line CL1n B A portion of line CT1 is interfering with jig J1. Then, dicing is performed on line CL1, which is to be divided and is included in the dividing area A1. This separates the chips included in the dividing area A1 from the workpiece W.

[0082] Next, the suction state of the workpiece W is released, and the workpiece W consisting of division areas A2 to A4 is lifted up by the handler arm 54 and held in place by suction. Then, for the division line CL1 included in division area A2, the thickness W along the division line CL1 is determined. B Alignment is performed so that all lines CT1 fit within the jig grooves G1 of the corresponding jig group JG2. Then, dicing is performed on the lines CL1 to be divided, which are included in the dividing area A2. This separates the chips included in the dividing area A2 from the workpiece W.

[0083] Next, alignment and dicing will be performed sequentially on the divided areas A3 and A4. This will result in a thickness W along the planned dividing line CL1. B Even if it is not possible to align the line CT1 so that it fits entirely within the corresponding jig groove G1, dicing can still be performed while preventing interference between the blade 32 and the jig J1.

[0084] Here, the machining stage drive unit 22 may, for example, release the suction state for each divided area A1 to A4. For example, when the dicing of divided area A1 is completed, the jig group JG1 corresponding to divided area A1 is kept holding the chip by suction. On the other hand, the jig groups JG2 to JG4 corresponding to divided areas A2 to A4 are released, and the workpiece W consisting of divided areas A2 to A4 is lifted from the machining stage ST by the handler arm 54. Then, the same procedure is used to perform dicing on the remaining divided areas A2 to A4, and the chip is collected when the dicing of all divided areas A1 to A4 is completed.

[0085] Furthermore, this method allows for the individual alignment of division areas A2 to A4 when the workpiece W is significantly distorted, and the position adjustments are made to match the jig J1. This corrects the distortion of the workpiece W and corrects the curved division line CL1. As a result, a secondary effect of improved machining accuracy can also be obtained.

[0086] Alternatively, after the dicing process for each divided area A1 to A4 is completed, the chips separated from the workpiece W by the dicing process may be collected.

[0087] In this embodiment, four division areas were used, but the present invention is not limited to this. For example, the thickness W along the planned division line CL1 B The workpiece W may be divided into the largest possible areas such that all of the lines CT1 fit within the corresponding jig grooves G1. Furthermore, although the workpiece W is divided along the X direction, it may also be divided along the Y direction or both the X and Y directions. When dividing the workpiece W into division areas, for example, it may be divided in the direction of greater strain.

[0088] Figure 14 is a flowchart showing a dicing method according to a second embodiment of the present invention. Figure 15 is a flowchart showing the dicing process for each divided area in Figure 14.

[0089] First, the control unit 100 controls the handler 50 to cause the handler arm 54 to pick up and hold the workpiece W (step S50). Then, with the workpiece W held by the handler arm 54, the sensor 10 is used to detect the outer shape of the workpiece W (step S52).

[0090] Next, the control unit 100 calculates the strain of the workpiece W based on the detection result of the workpiece W's outer shape. Then, the control unit 100 determines whether or not the entire workpiece W can be aligned based on the calculated strain of the workpiece W (step S54). The determination in step S54 can be performed in the same way as in step S14 (see Figure 7).

[0091] Next, if the control unit 100 determines in step S54 that alignment is possible, it controls the handler arm 54 to load the workpiece W onto the machining stage ST of the machining unit 20. At this time, the control unit 100 performs alignment based on the determination result of the workpiece W in step S54 and controls the machining stage drive unit 22 to hold the workpiece W on the machining stage ST by suction (step S56). Then, the control unit 100 moves the blade 32 along the planned division line CL1 of the workpiece W held on the machining stage ST to perform dicing (step S58).

[0092] On the other hand, if the control unit 100 determines in step S14 that alignment is impossible, it determines whether alignment is possible for each of the divided areas A1 to A4 (step S60). In step S60, similar to steps S14 and S54, the thickness W along the planned division line CL1 is determined for each of the divided areas A1 to A4. B This determines whether alignment is possible such that line CT1 fits within the corresponding jig groove G1. Specifically, the following from <c>This is done as follows. The position of the planned division line CL1 in the division area A1 to A4 can be calculated, for example, using the detection positions of slits SL1 to SL3 (see Figure 4).

[0093] < / c> For each division area A1 to A4, the thickness W is along all planned division lines CL1 within each division area A1 to A4. B This determines whether alignment is possible such that all lines CT1 fit within the corresponding jig grooves G1.

[0094] For each divided area A1 to A4, <b1>Two planned division lines CL at both ends in the X direction X11 and CL X12 CL X21 and CL X22 CL X31 and CL X32 and CL X41 and CL X42 , or <b2>Two planned dividing lines CL at both ends in the Y direction Y11 and CL Y12 , CL Y21 and CL Y22 , CL Y31 and CL Y32 and CL Y41 and CL Y42 along with a line CT1 with a thickness W B is determined whether it is possible to align so that all of them fit into the jig groove G1 corresponding thereto.

[0095] <c>For each division area from A1 to A4, a thickness W along multiple division lines CL1) including some division lines CL1. B It is determined whether alignment is possible such that all of the lines CT1 fit within the corresponding jig grooves G1. Here, some of the lines to be divided CL1 are, for example, <c1>In the division areas A1 to A4, the four division planned lines (CL X11 CL X12 CL Y11 and CL Y12 CL X21 CL X22 CL Y21 and CL Y22 CL X31 CL X32 CL Y31 and CL Y32 as well as CL X41 CL X42 CL Y41 and CL Y42 ) <c2>In the divided areas A1 to A4, the planned division line (CL) is closest to the two opposing sides at both ends in the X direction. X11 and CL X12 CL X21 and CL X22 CL X31 and CL X32 and CL X41 and CL X42 ) including multiple planned splitting lines CL1, or <c3>In the divided areas A1 to A4, the planned division line (CL) is closest to the two opposing sides at both ends in the Y direction. Y11 and CL Y12 CL Y21 and CL Y22 CL Y31 and CL Y32 and CL Y41 and CL Y42 This is CL1, which includes multiple lines scheduled for splitting.

[0096] Next, if the control unit 100 determines in step S60 that alignment is possible for each divided area A1 to A4, it performs dicing for each divided area A1 to A4 (step S62).

[0097] On the other hand, if the control unit 100 determines in step S60 that alignment for each divided area A1 to A4 is also impossible, it unloads the workpiece W from the handler arm 54 (step S64).

[0098] In step S62, if dicing is performed for each divided area, the control unit 100 first repeatedly performs alignment (step S72) and dicing (step S74) for each divided area Ai starting from i=1 (step S70) (steps S76 and S78). Then, when i=N (step S76), and dicing of all divided areas Ai is completed, the process is terminated.

[0099] According to this embodiment, even if it is not possible to align the entire workpiece W, dicing can be performed while preventing interference between the blade 32 and the jig J1 by repeatedly performing alignment and dicing for each of the multiple divided areas. [Explanation of Symbols]

[0100] 1…Dicing device, 10…Sensor, 12…Sensor control unit, 20…Processing unit, 22-1…First stage drive unit, 22-2…Second stage drive unit, 26…Processing drive unit, 28…MS drive unit, 30-1…First spindle, 30-2…Second spindle, 32-1…First blade, 32-2…Second blade, 50…Handler, 52…Handler shaft, 54…Handler arm, 56…Handler drive unit, ST1…First stage, ST2…Second stage, MS…Microscope, 100…Control unit, 102…Input unit, 104…Display unit < / c>

Claims

1. A control unit that detects the position of a portion of a workpiece, calculates the amount of deformation of the workpiece from the distortion of the workpiece calculated based on the deviation of the position of the portion from the design value, calculates the position of the planned division line of the workpiece based on the amount of deformation of the workpiece, and aligns the workpiece and the jig such that a line with a width corresponding to the blade thickness along the planned division line fits into the jig groove of the jig that holds the workpiece by suction, Alignment device comprising: a control unit that calculates the distortion of each divided area of ​​the workpiece based on an image of a region including a slit formed between a plurality of divided areas provided in the workpiece; a control unit that calculates the position of the planned division line of the workpiece based on the distortion of each divided area of ​​the workpiece; and an alignment device that aligns the workpiece and the jig such that a line with a width corresponding to the blade thickness along the planned division line fits into the jig groove of the jig.

2. The position of a part of the workpiece is detected, The amount of deformation of the workpiece is calculated from the distortion of the workpiece, which is calculated based on the deviation of the position of the aforementioned part from the design value. Based on the deformation amount of the workpiece, the position of the planned division line of the workpiece is calculated. An alignment method for aligning a workpiece and a jig such that a line with a width corresponding to the blade thickness along the planned division line fits into the jig groove of the jig that holds the workpiece by suction, Based on the image of the region including the slit formed between the multiple divided areas provided in the workpiece, the distortion of each divided area of ​​the workpiece is calculated. Based on the distortion of each of the division areas of the workpiece, the position of the planned division line of the workpiece is calculated. An alignment method for aligning the workpiece and the jig such that a line with a width corresponding to the blade thickness along the planned division line fits into the jig groove of the jig.

Images