Multilayer substrate and manufacturing method of multilayer substrate

Abstract

To provide a multilayer substrate and a method for manufacturing a multilayer substrate that can suppress a decrease in yield.SOLUTION: A multilayer substrate includes a first wiring substrate, a plurality of second wiring substrates stacked side by side on the first wiring substrate, and a third wiring substrate stacked on the plurality of second wiring substrates, a first insulating resin layer located between the first wiring substrate and the plurality of second wiring substrates, and a second insulating resin layer located between the plurality of second wiring substrates and the third wiring substrate.SELECTED DRAWING: Figure 2

Claims

1. First wiring board and A plurality of second wiring boards are stacked side by side on the first wiring board, A third wiring board stacked on top of the plurality of second wiring boards, A first insulating resin layer located between the first wiring board and the plurality of second wiring boards, A second insulating resin layer located between the plurality of second wiring boards and the third wiring board, A third insulating resin layer covering the side surface of the first wiring board, the side surfaces of the plurality of second wiring boards, and the side surface of the third wiring board, A laminated substrate characterized by having the following features.

2. The laminated substrate according to claim 1, characterized in that the first insulating resin layer, the second insulating resin layer, and the third insulating resin layer are integrated together.

3. A first conductive bonding material for joining the first wiring board and the plurality of second wiring boards, A second conductive bonding material for joining the plurality of second wiring boards and the third wiring board, A laminated substrate according to claim 1 or 2, characterized by having the following features.

4. It has a fourth wiring board, The first wiring board is laminated on the fourth wiring board, The laminated substrate according to claim 1 or 2, characterized by having a fourth insulating resin layer located between the first wiring board and the fourth wiring board.

5. The laminated substrate according to claim 4, characterized by having a third conductive bonding material for joining the first wiring board and the fourth wiring board.

6. It has a fourth wiring board, The first wiring board is laminated on the fourth wiring board, A fourth insulating resin layer located between the first wiring board and the fourth wiring board, It has, The laminated substrate according to claim 1, wherein the first insulating resin layer, the second insulating resin layer, the third insulating resin layer, and the fourth insulating resin layer are integrated together.

7. The laminated substrate according to claim 6, characterized in that it is provided on the fourth wiring board and has a resin outflow limiting member that surrounds the third insulating resin layer in a plan view.

8. The laminated substrate according to claim 1 or 2, characterized in that the second wiring board includes a line and space pattern with a pattern width and inter-pattern distance of less than 20 μm.

9. Multiple of the first wiring boards are stacked on top of each other, The laminated substrate according to claim 1 or 2, characterized by having a fifth insulating resin layer located between a plurality of the first wiring boards.

10. A process for manufacturing a first wiring board, a plurality of second wiring boards, and a third wiring board, A step of forming a laminate by laminating a plurality of second wiring boards on the first wiring board with a first fluid insulating resin layer in between, and laminating a third wiring board on the plurality of second wiring boards with a second fluid insulating resin layer in between, The process of compressing the laminated body, It has, The step of compressing the laminated body is, A step of forming a first insulating resin layer located between the first wiring board and the plurality of second wiring boards from the first fluid insulating resin layer, A step of forming a second insulating resin layer located between the plurality of second wiring boards and the third wiring board from the second fluid insulating resin layer, It has, A method for manufacturing a laminated substrate, characterized in that the step of crimping the laminated bodies includes the step of forming a third insulating resin layer from the first fluid insulating resin layer and the second fluid insulating resin layer, which covers the side surface of the first wiring board, the side surfaces of the plurality of second wiring boards, and the side surface of the third wiring board.

11. A step of manufacturing a first wiring board, a plurality of second wiring boards, and a third wiring board, A step of forming a laminate by laminating a plurality of second wiring boards on the first wiring board with a first fluid insulating resin layer in between, and laminating a third wiring board on the plurality of second wiring boards with a second fluid insulating resin layer in between, The process of compressing the laminated body, It has, The step of compressing the laminated body is, A step of forming a first insulating resin layer located between the first wiring board and the plurality of second wiring boards from the first fluid insulating resin layer, A step of forming a second insulating resin layer located between the plurality of second wiring boards and the third wiring board from the second fluid insulating resin layer, It has, The process includes manufacturing a fourth wiring board, The step of forming the laminate includes the step of laminating the first wiring board on the fourth wiring board, with a third fluid insulating resin layer in between, A method for manufacturing a laminated substrate, characterized in that the step of crimping the laminated bodies includes the step of forming a fourth insulating resin layer located between the fourth wiring substrate and the first wiring substrate from the third fluid insulating resin layer.

12. The method for manufacturing a laminated substrate according to claim 11, further comprising the step of forming a resin outflow limiting member on the fourth wiring substrate, which surrounds the region where the first wiring substrate is laminated, away from the region in a plan view, before the step of pressing the laminated substrate together.

13. A step of manufacturing a first wiring board, a plurality of second wiring boards, and a third wiring board, A step of forming a laminate by laminating a plurality of second wiring boards on the first wiring board with a first fluid insulating resin layer in between, and laminating a third wiring board on the plurality of second wiring boards with a second fluid insulating resin layer in between, The process of compressing the laminated body, It has, The step of compressing the laminated body is, A step of forming a first insulating resin layer located between the first wiring board and the plurality of second wiring boards from the first fluid insulating resin layer, A step of forming a second insulating resin layer located between the plurality of second wiring boards and the third wiring board from the second fluid insulating resin layer, It has, Multiple of the first wiring boards are manufactured, A method for manufacturing a laminated substrate, characterized in that the step of forming the laminate comprises stacking a plurality of the first wiring boards on top of each other while providing a fourth fluid insulating resin layer between them.

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