Fixing jig and fixing method for securing sensors

The fixing jig with a cushioning material and adjustable band member secures sensors to pipes, addressing adhesive deterioration in high-temperature environments by maintaining pressing force and reducing thermal stress effects.

JP7873605B2Active Publication Date: 2026-06-12MITSUBISHI HEAVY IND LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
MITSUBISHI HEAVY IND LTD
Filing Date
2022-09-09
Publication Date
2026-06-12

AI Technical Summary

Technical Problem

Existing methods for attaching sensors using inorganic ceramic adhesives in high-temperature environments suffer from adhesive deterioration due to thermal stress, leading to reduced adhesive strength.

Method used

A fixing jig comprising a cushioning material with slits and a band member, optionally with a metal plate, is used to secure the sensor to a pipe, maintaining pressing force through adjustable ring-shaped band members and materials with controlled thermal expansion.

Benefits of technology

The sensor is securely fixed to the pipe, maintaining adhesion even in high-temperature environments, with improved stability and reduced risk of loosening or disconnection.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a fixing jig which can fix a sensor for a long time even under a high temperature environment, and to provide a fixing method.SOLUTION: A fixing jig for fixing a sensor to a surface of a pipe includes: at least one buffer material; a band member attached to a pipe along a surface; and an adjustment part that adjusts a diameter of a ring shape obtained by combining a first end portion including one end part of the band member with a second end portion including the other end part of the band member to form the band member into the ring shape. Two slits are formed spaced apart from each other in the at least one buffer material. The first end portion of the band member is inserted through one of the two slits from a first surface which is one surface of the at least one buffer material, the first end portion of the band member is inserted through the other of the two slits from a second surface which is the other surface of the at least one buffer material, and the at least one buffer material is attached to the band member in a state in which the first end portion and second end portion of the band member are positioned on the first surface side.SELECTED DRAWING: Figure 1
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