Linear drive system and component mounting device

Abstract

To suppress heat deformation of each part caused by the heat generation of a mover (armature) of a linear motor.SOLUTION: A component mounting apparatus 1 includes a linear drive device. The linear drive device includes: a Y direction guide member 11 which has a fixed rail 20 and a slider 22; a first beam 12A (mobile body) which is fixed to the slider 22; a first Y-axis linear motor 30A which is provided in the slider 22 and includes a mover 32 consisting of an armature and a stator 34 consisting of a permanent magnet; and an exhaust heat member 40 which exhausts heat generated by the mover 32. The exhaust heat member 40 includes: a refrigerant circulation part 42 which has a refrigerant passage 42c which covers the mover 32 and allows the air (refrigerant) to circulate inside; and a vacuum heat insulation part 44 which is arranged between the refrigerant circulation part 42 and the first beam 12A and has a vacuum space 44a that suppresses heat transfer from the mover 32 side to the first beam 12A side.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a linear drive device that moves a moving body along a rail using a linear motor as a drive source, and a component mounting device equipped with this linear drive device.

Background Art

[0002] For example, Patent Document 1 discloses a component mounting device having the following configuration. That is, the component mounting device includes a pair of rails, a slider movably mounted on each rail, a beam extending in a direction orthogonal to the pair of rails and supported movably on the pair of rails via the slider, a mounting head provided on the beam, and a linear motor that moves the beam along the pair of rails. In this component mounting device, the mounting head together with the beam member moves along the pair of rails by the driving force of the linear motor, and component mounting processing is performed on the substrate by the head.

[0003] The linear motor includes a mover having an armature and a stator composed of a permanent magnet (field magnet). The mover is fixed at a position near the slider in the beam, and the stator is arranged along the rail so as to face the mover. Thus, in a configuration where the mover is arranged near the slider, heat deformation may occur in the beam, slider, and rail due to heat generation of the mover (armature) by energization, which may affect the component mounting accuracy. Therefore, in the component mounting device of Patent Document 1, heat dissipation fins are provided at the end portion of the beam, and it is devised to suppress the temperature rise of the beam and the like by the heat dissipation effect of the heat dissipation fins.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in conventional configurations where heat dissipation fins are provided at the end of the beam, it can be difficult to obtain sufficient heat dissipation for the amount of heat generated by the movable element. Therefore, there is a need for a method that can more effectively suppress thermal deformation of various parts caused by the heat generated by the movable element (armature) of the linear motor.

[0006] The present invention has been made in view of the above circumstances, and aims to provide a linear drive device that can more effectively suppress thermal deformation of various parts caused by heat generation from the movable element (armature) of a linear motor, and a component mounting device equipped with this linear drive device. [Means for solving the problem]

[0007] To solve the above problems, a linear drive device according to one aspect of the present invention is a linear drive device comprising: a guide member having a rail and a slider movably mounted on the rail; a movable body fixed to the slider; and a linear motor having a movable element made of an armature and a stator made of a field, provided on the slider or the movable body, which generates a driving force to move the movable body along the rail, wherein the linear drive device comprises a heat dissipation member for dissipating heat generated by the movable element, the heat dissipation member comprising a refrigerant flow section that covers the movable element and is formed so that a refrigerant passes through the inside, and a vacuum insulation section disposed between the refrigerant flow section and the movable body and having a vacuum space inside.

[0008] With this linear drive system, the heat dissipation member effectively suppresses heat transfer to the moving body. Specifically, the heat generated in the movable element (armature) is suppressed (blocked) from moving to the moving body by the vacuum insulation section of the heat dissipation member, while the refrigerant passing through the refrigerant flow section actively dissipates heat from the movable element and its surroundings. As a result, heat transfer to the moving body is effectively suppressed, and thermal deformation of various parts (slider, moving body, rails, etc.) caused by heat generation in the movable element is effectively suppressed.

[0009] In particular, in configurations where a linear motor is incorporated into the guide member, that is, in configurations where the movable element is provided on the slider and the stator is provided on the rail, the slider, rail, and moving body are adjacent to each other, so there is concern about thermal deformation of these components.

[0010] Therefore, the above-described linear drive system configuration is particularly useful for linear drive systems in which a linear motor is incorporated into the guide member. In other words, with this linear drive system configuration, the heat generated in the movable element is actively dissipated by the movement of air, thereby suppressing heat transfer to the moving body, as well as suppressing the temperature rise of the slider and heat transfer to the rail. This contributes to suppressing thermal deformation of the slider, rail, and moving body. Note that "the stator is provided in the rail" includes not only cases where the stator is incorporated (embedded) in the rail, but also cases where the rail itself is composed of a stator (permanent magnet).

[0011] In the linear drive device described above, the movable element comprises a plurality of electromagnetic coils constituting the armature, and the refrigerant flow section comprises a refrigerant passage formed to meander along the plane on which the electromagnetic coils are arranged.

[0012] In this configuration, the refrigerant flows in a meandering manner along the electromagnetic coil, which promotes heat transfer from the movable element to the refrigerant. As a result, the generated heat can be effectively dissipated from the movable element and its surroundings.

[0013] On the other hand, a component mounting apparatus according to one aspect of the present invention comprises the linear drive device described above, a mounting head attached to the moving body of the linear drive device and capable of holding and releasing components, and a control unit that controls the linear drive device and the mounting head, wherein the control unit holds components from a component supply unit using the mounting head, transports them onto a substrate, and performs a component mounting process in which the components are mounted at predetermined positions on the substrate.

[0014] In this component mounting device, the mounting head moves between the component supply area and the substrate, thereby performing the component mounting process on the substrate. Since the movement of the mounting head is performed by the linear drive mechanism described above, thermal deformation of various parts (slider, moving body, rail, etc.) caused by heat generation from the moving element of the linear motor is effectively suppressed. This suppression of thermal deformation contributes to improving the accuracy of component mounting by the component mounting device.

[0015] While the refrigerant may be a liquid, air is preferable from the standpoint of avoiding risks such as liquid leakage. In particular, in component mounting equipment, air is sometimes used when performing the component mounting process, so a configuration using air as the refrigerant achieves a rational configuration in which the heat generated by the movable element can be dissipated using existing equipment.

[0016] Specifically, the component mounting device comprises a negative pressure generating unit that generates negative pressure and a positive pressure generating unit that generates positive pressure. The mounting head is configured to attract and hold components by receiving negative pressure from the negative pressure generating unit, and to release components by receiving positive pressure from the positive pressure generating unit instead of the negative pressure. The refrigerant flow unit is configured to allow air to pass along the refrigerant passage by receiving at least one of the negative pressure from the negative pressure generating unit and the positive pressure from the positive pressure generating unit.

[0017] This configuration makes it possible to dissipate the heat generated by the movable element using the air used in the component mounting equipment.

[0018] In this case, the control unit is configured to control the supply of at least one of the negative pressure supply and the positive pressure supply so that air passes through the refrigerant flow section during periods other than when the component mounting process is being executed.

[0019] According to this configuration, it is possible to exhaust the heat generated in the mover without affecting the component mounting process. That is, there is no risk of troubles such as poor component adsorption or poor mounting due to pressure fluctuations of negative pressure or positive pressure during the component mounting process.

[0020] Moreover, in the above-mentioned component mounting apparatus, it is preferable to provide an air discharge unit that discharges the air that has passed through the refrigerant flow path directly outside the component mounting apparatus.

[0021] Thus, according to the configuration in which the air that has passed through the refrigerant flow path is directly discharged outside the component mounting apparatus, it is possible to continuously enjoy the heat exhaust effect without providing equipment for regenerating (cooling) the air used as the refrigerant.

Effect of the Invention

[0022] According to the present invention described above, it is possible to provide a linear drive device that can more effectively suppress thermal deformation of each part caused by heat generation of the mover (armature) of the linear motor, and a component mounting apparatus provided with this linear drive device.

Brief Description of the Drawings

[0023] [Figure 1] It is a plan view of a component mounting apparatus according to an embodiment of the present invention. [Figure 2] It is a front view of the component mounting apparatus. [Figure 3] It is a perspective view of a main part of the component mounting apparatus. [Figure 4] It is a cross-sectional view of a main part of the component mounting apparatus. [Figure 5] It is a perspective view of a heat exhaust member. [Figure 6] It is an air circuit diagram of the component mounting apparatus. [Figure 7] It is a timing chart showing an example of valve switching control during production. [Figure 8] It is a timing chart showing an example of valve switching control during production stop. [Figure 9]This is a cross-sectional view of a heat dissipation component illustrating its heat dissipation effect. [Figure 10] This is a schematic perspective view of the refrigerant distribution system. [Figure 11] This is a schematic diagram of the main parts of a component mounting device in a modified form, viewed in the Y direction. [Modes for carrying out the invention]

[0024] Embodiments of the present invention will be described in detail below with reference to the drawings.

[0025] [Overall configuration of the component mounting equipment] Figure 1 is a plan view of the component mounting apparatus 1 according to the present invention (a component mounting apparatus equipped with a linear drive device according to the present invention), and Figure 2 is a front view of the component mounting apparatus 1.

[0026] The component mounting apparatus 1 is equipment that produces component-mounted circuit boards in which electronic components are mounted on a substrate P such as a printed circuit board. Figure 1 shows the XY coordinate axes. The X direction is parallel to the horizontal plane, and the Y direction is perpendicular to the X direction on the horizontal plane. The directions perpendicular to the X and Y directions are the up and down directions.

[0027] The component mounting device 1 comprises a base 2 which is the device frame, a substrate transport unit 3 which transports substrates P on the base 2, a component supply unit 5, two head units 6A and 6B which move in the space above the base 2, and a component recognition camera 8.

[0028] The substrate transport unit 3 is equipped with a pair of conveyors 4 that transport the substrate P in the X direction. The conveyors 4 are belt conveyors. The substrate transport unit 3 receives the substrate P from the right side (X1 side) of Figure 1 and transports it to the work position (the position of the substrate P shown in the figure), and after the mounting work is completed, it transports the substrate P from the work position to the left side (X2 side) of the figure. Although not shown in the figure, the work position is equipped with a substrate holding mechanism that holds the substrate P in a positioned state.

[0029] The component supply unit 5 is provided on both sides of the substrate transport unit 3 in the Y direction. The component supply unit 5 is equipped with feeders for supplying components. In this example, multiple tape feeders 5F are arranged in parallel along the conveyor 4. The tape feeders 5F use ribbon-shaped tape as a carrier to supply small pieces of components (electronic components). The component supply unit 5 may also be equipped with feeders other than tape feeders 5F, such as stick feeders that supply components through the inside of a cylindrical stick, or tray feeders that supply components placed on a tray.

[0030] The two head units 6A and 6B (referred to as the first head unit 6A and the second head unit 6B) are unit components that take components from the component supply unit 5 and mount (mount) them onto the circuit board P. The first head unit 6A is on the Y2 side, and the second head unit 6B is on the Y1 side. Each head unit 6A and 6B moves horizontally (in the X and Y directions) by the operation of the head unit drive mechanism 9.

[0031] The head unit drive mechanism 9 is mainly composed of a linear drive device. Specifically, the head unit drive mechanism 9 includes a Y-direction guide member 11 installed on a pair of elevated frames 10 extending in the Y direction, which are provided on a base 2; two beams 12A and 12B (referred to as the first beam 12A and the second beam 12B) extending parallel to each other in the X direction and supported by the Y-direction guide member 11; a pair of first Y-axis linear motors 30A (shown in Figure 4) that generate a driving force to move the first beam 12A in the Y direction; and a pair of second Y-axis linear motors 30B (shown in Figure 4) that generate a driving force to move the second beam 12B in the Y direction.

[0032] Furthermore, the head unit drive mechanism 9 includes a first X-direction guide member 13A installed on the first beam 12A to support the first head unit 6A, and a first X-axis linear motor (not shown) that generates a driving force to move the first head unit 6A in the X direction. In addition, the head unit drive mechanism 9 includes a second X-direction guide member 13B installed on the second beam 12B to support the second head unit 6B, and a second X-axis linear motor (not shown) that generates a driving force to move the second head unit 6B in the X direction.

[0033] Figure 3 is a perspective view of the main part of the component mounting device 1 near the X2 end of the first beam 12A, and Figure 4 is a cross-sectional view of the main part of the component mounting device 1 near the X2 end of the first beam 12A.

[0034] As shown in Figures 1 to 4, the Y-direction guide member 11 is a so-called linear guide (registered trademark). The Y-direction guide member 11 includes a fixed rail 20 fixed to the upper surface 10a of the elevated frame 10 and extending in the Y direction, and a slider 22 movably mounted on the fixed rail 20. The slider 22 holds balls (not shown) that circulate along a guide groove, and the rolling and circulating movement of these balls causes the slider 22 to move smoothly along the fixed rail 20.

[0035] As shown in Figures 3 and 4, both ends of the first beam 12A in the longitudinal direction (X direction) are fixed to the slider 22 via heat dissipation members 40, which will be described later. Specifically, a flange portion 122 extending in the Y direction is provided at the lower end of the end wall 121 of the first beam 12A. The heat dissipation member 40 and the flange portion 122 of the end wall 121 are stacked on the slider 22 in this order, and the flange portion 122 and the heat dissipation member 40 are fastened together to the slider 22 by a plurality of screws (bolts) B1. With this configuration, the first beam 12A is provided so as to be movable in the Y direction along the fixed rail 20.

[0036] Although detailed diagrams are omitted, both ends of the second beam 12B in the longitudinal direction (X direction) are fixed to the slider 22 via heat dissipation members 40, similar to the first beam 12A. With this configuration, the second beam 12B, like the first beam 12A, is provided to be movable in the Y direction along the fixed rail 20.

[0037] The first Y-axis linear motor 30A is incorporated into the Y-direction guide member 11. Specifically, the first Y-axis linear motor 30A comprises a movable element 32 built into the slider 22 and a stator 34 built into the fixed rail 20. The movable element 32 is an armature comprising a plurality of electromagnetic coils wound around a core, and the stator 34 is a field magnet in which a plurality of permanent magnets 34a, each with alternatingly different magnetic poles on the surface side (movable element side), are arranged in a line in the Y direction.

[0038] On the surface of the slider 22 facing the fixed rail 20, a rectangular groove 22c is formed, recessed upward (towards the side opposite the fixed rail 20) and extending in the Y direction. In addition, a rectangular groove 20a is formed in the center of the fixed rail 20 in the width direction (X direction), recessed downward (towards the side opposite the slider 22) and extending in the Y direction. The movable element 32 is placed in the groove 22c of the slider 22, and the stator 34 is placed in the groove 20a of the fixed rail 20, so that the movable element 32 and the stator 34 can face each other in the vertical direction.

[0039] In this configuration, when a predetermined drive current is applied to the movable element 32 (armature), specifically when three-phase currents with different phases are applied to each electromagnetic coil, a magnetic field is generated in each coil, creating a thrust (driving force) between the stator 34 (field) and the movable element 32 that moves the movable element 32 in the Y direction. This thrust causes the slider 22 to move together with the movable element 32, and as a result, the first beam 12A moves in the Y direction along the fixed rail 20.

[0040] Although detailed diagrams are omitted, the second Y-axis linear motor 30B, like the first Y-axis linear motor 30A, has a movable element 32 consisting of an armature and a stator 34 consisting of a field magnet, and these movable element 32 and stator 34 are incorporated into the Y-direction guide member 11. However, the stator 34 of the second Y-axis linear motor is the same as the stator 34 of the first Y-axis linear motor 30A. In other words, the permanent magnet 34a (field magnet) built into the fixed rail 20 is shared as the stator 34 for both the first Y-axis linear motor 30A and the second Y-axis linear motor 30B.

[0041] The first X-direction guide member 13A installed on the first beam 12A, and the first X-axis linear motor (not shown) that moves the first head unit 6A in the X direction, have substantially the same configuration as the Y-direction guide member 11 and the first Y-axis linear motor 30A described above. That is, as shown in Figures 1 and 2, the first X-direction guide member 13A includes a fixed rail 24 fixed to the first beam 12A and extending in the X direction, and a slider 26 movably mounted on this fixed rail 24. The first X-axis linear motor also includes a movable element built into the slider 26 and a stator built into the fixed rail 24. The movable element is an armature equipped with a plurality of electromagnetic coils, and the stator is a field magnet in which a plurality of permanent magnets are arranged in a line in the X direction.

[0042] The second X-direction guide member 13B installed on the second beam 12B, and the second X-axis linear motor (not shown) that moves the second head unit 6B in the X direction, have the same configuration as the first X-direction guide member 13A and the second X-axis linear motor.

[0043] The first head unit 6A includes a frame member (not shown). This frame member is fixed to the slider 26 of the first X-direction guide member 13A, thereby supporting the first head unit 6A on the first X-direction guide member 13A. Similarly, the second head unit 6B includes a frame member (not shown), and this frame member is fixed to the slider 26 of the second X-direction guide member 13B, thereby supporting the second head unit 6B on the second X-direction guide member 13B. With this configuration, when a predetermined drive current is applied to the movable element (armature) of the first X-axis linear motor, the first head unit 6A moves in the X direction along the fixed rail 24 on the first beam 12A. Similarly, when a predetermined drive current is applied to the movable element (armature) of the second X-axis linear motor, the second head unit 6B moves in the X direction along the fixed rail 24 on the second beam 12B.

[0044] The head unit drive mechanism 9 moves the first beam 12A and the second beam 12B in the Y direction, respectively, with the above configuration. The head unit drive mechanism 9 also moves the first head unit 6A in the X direction on the first beam 12A, and moves the second head unit 6B in the X direction on the second beam 12B. As a result, the first head unit 6A and the second head unit 6B can move to any position in the X and Y directions within a certain range above the base 2.

[0045] In this example, the Y-direction guide member 11, the heat dissipation member 40, and the first beam 12A (moving body) correspond to the Y-direction guide member 11, the heat dissipation member 40, and the second beam 12B (moving body), respectively, which correspond to the linear drive device of the present invention.

[0046] The first head unit 6A and the second head unit 6B are each equipped with a plurality of axial heads 7 (mounted heads) extending in the vertical direction, and a head drive mechanism for driving these heads 7.

[0047] The head drive mechanism individually raises and lowers each head 7, and also rotates each head 7 around its central axis (R direction). Each head 7 is equipped with a nozzle 7a for component suction at its tip. Each nozzle 7a is connected to an air circuit 60, which will be described later. By switching a valve, negative pressure and positive pressure are selectively supplied to the nozzle 7a, thereby enabling the head 7 to suction and hold components and release (mount) components onto the substrate P.

[0048] The component recognition camera 8 is an illumination-integrated camera that captures images from below of components held by the heads 7 of the first head unit 6A and the second head unit 6B. The component recognition camera 8 is positioned between the substrate transport unit 3 and each component supply unit 5.

[0049] In the component mounting apparatus 1 described above, when a substrate P is transported to the work position along the conveyor 4, the head units 6A and 6B alternately move back and forth between the component supply unit 5 and the substrate P positioned at the work position, avoiding interference, to pick up components from the tape feeder 5F and mount them to predetermined positions on the substrate P. At this time, the suction state of the components held by each mounting head 251 is captured by the component recognition camera 8, and the amount of movement of each head unit 6A and 6B is corrected based on the recognition result. When all components have been mounted on the substrate P, the substrate P is removed from the work position, and the next substrate P is transported to the work position. A component-mounted substrate is produced by repeating the operation of each part in this manner.

[0050] The component mounting device 1 is equipped with a control unit 50 (see Figure 2) that controls its operation. The control unit 50 is composed of a CPU, ROM, RAM, and peripheral circuits, and the operation of each part of the component mounting device 1 is comprehensively controlled by this control unit 50.

[0051] In the aforementioned component mounting apparatus 1, in which each beam (12A, 12B) is driven by a linear motor (30A, 30B), continuous energization can cause the movable element 32 (armature) to generate heat, which can lead to thermal deformation of the beams 12A, 12B and the Y-direction guide member 11. To suppress such thermal deformation, a heat dissipation member 40 is provided at the joint between each beam 12A, 12B and the Y-direction guide member 11. The heat dissipation member 40 is a component for dissipating the heat generated by the movable element 32.

[0052] Figure 5 is a perspective view of the heat dissipation member 40. As shown in Figures 3 to 5, the heat dissipation member 40 has a channel shape (groove shape) that covers the slider 22. Specifically, the heat dissipation member 40 includes a web portion 401 that abuts the upper surface 22a of the slider 22 and extends in the Y direction, and flange portions 402 that hang down from both ends of the web portion 401 and abut the side surfaces 22b (side surfaces on both sides in the X direction) of the slider 22. As a result, the heat dissipation member 40 covers the slider 22 from above and from the side, in a state of surface contact with the upper surface 22a and side surfaces 22b of the slider 22.

[0053] The heat dissipation member 40 includes a channel-shaped (groove-shaped) refrigerant flow section 42 that contacts the slider 22 and covers the movable element 32, and a vacuum insulation section 44, also channel-shaped (groove-shaped), that covers the refrigerant flow section 42 from the outside (opposite the slider 22 side). The refrigerant flow section 42 and the vacuum insulation section 44 each have a certain thickness and are provided integrally and in a layered manner. The refrigerant flow section 42 is made of a material with a higher thermal conductivity than the vacuum insulation section 44. For example, the refrigerant flow section 42 is made of copper or aluminum, and the vacuum insulation section 44 is made of a metal material such as stainless steel with a lower thermal conductivity than copper or aluminum.

[0054] As shown in Figures 4 and 5, the refrigerant flow section 42 is equipped with a refrigerant passage 42c for circulating (passing) the refrigerant. Furthermore, a refrigerant introduction port 42a is provided on the Y-direction end face of one flange portion 402 of the refrigerant flow section 42, and a refrigerant outlet port 42b is provided on the Y-direction end face of the other flange portion 402. As shown in Figure 5, the refrigerant passage 42c is formed to meander in the Y direction along the upper surface 22a and side surface 22b of the slider 22 (i.e., the reference surface on which the electromagnetic coils are arranged). Alternatively, the refrigerant passage 42c may be formed to meander in the X direction along the upper surface 22a and side surface 22b of the slider 22. The refrigerant flow section 42 is connected to the air circuit 60 described later, and in this example, compressed air flows along the refrigerant passage 42c as the refrigerant.

[0055] A sealed vacuum space (vacuum space 44a) is provided inside the vacuum insulation section 44. The vacuum space 44a is provided over substantially the entire area of ​​the vacuum insulation section 44 corresponding to the web portion 401 and flange portion 402 of the heat dissipation member 40.

[0056] The heat dissipation member 40 is superimposed on the slider 22, interposed between the slider 22 and the flange portion 122 of the first beam 12A, and is fastened to the slider 22 together with the flange portion 122 by a plurality of screws B1, as described above. Figures 3 and 4 mainly show the heat dissipation member 40 positioned at the joint between the first beam 12A and the Y-direction guide member 11 (slider 22), but the heat dissipation member 40 positioned at the joint between the second beam 12B and the Y-direction guide member 11 (slider 22) has a similar configuration.

[0057] The heat dissipation member 40 is provided, allowing heat generated by the movable element 32 to be efficiently dissipated, thereby suppressing or preventing thermal deformation of each beam 12A, 12B and the Y-direction guide member 11. Specifically, as schematically shown in Figure 9, the heat generated by the movable element 32 (electromagnetic coil) is actively dissipated by compressed air (refrigerant) flowing through the refrigerant flow section 42, while its transfer to the first beam 12A is suppressed (blocked) by the vacuum insulation section 44. As a result, heat transfer from the movable element 32 to each beam 12A and 12B is suppressed. Furthermore, the active dissipation of heat generated by the movable element 32 through the flow of compressed air also suppresses the temperature rise of the slider 22 itself and heat transfer to the fixed rail 24. Therefore, thermal deformation of each beam 12A, 12B and the Y-direction guide member 11 caused by heat generation from the movable element 32 is suppressed.

[0058] Figure 6 is an air circuit diagram of the component mounting device 1. The air circuit 60 shown in Figure 6 is mainly a circuit for supplying negative and positive pressure for component mounting to each head 7 (nozzle 7a) of head units 6A and 6B. The refrigerant flow section 42 (refrigerant passage 42c) of the heat dissipation member 40 is also connected to this air circuit 60.

[0059] The air circuit 60 includes a positive pressure generating unit 70 such as a compressor, a negative pressure generating unit 80 consisting of a vacuum pump, a positive pressure passage 71 that supplies the positive pressure (compressed air) generated by the positive pressure generating unit 70 to the head 7, etc., a negative pressure passage 81 that supplies the negative pressure generated by the negative pressure generating unit 80 to the head 7, etc., and a plurality of switching valves (62-65) consisting of electromagnetic valves. Note that "supplying negative pressure" is synonymous with sucking air from inside the object using a vacuum pump.

[0060] The air circuit 60 includes a first circuit section 61A and a second circuit section 61B. The first circuit section 61A is a circuit section that supplies positive and negative pressure to the head 7 of the first head unit 6A and the heat dissipation member 40 on the first beam 12A side, and the second circuit section 61B is a circuit section for supplying positive and negative pressure to the head 7 of the second head unit 6B and the heat dissipation member 40 on the first beam 12A side. These circuit sections 61A and 61B are configured as follows.

[0061] In the first circuit section 61A, the head 7 is connected to the positive pressure passage 71 via the component suction valve 62 and the component mounting valve 63, and is also connected to the negative pressure passage 81 via the component suction valve 62. Both valves 62 and 63 shown in Figure 6 are in the off state (demagnetized state). When both valves 62 and 63 are off, as shown in the figure, neither the positive pressure passage 71 nor the negative pressure passage 81 is in communication with the head 7, and therefore neither positive pressure nor negative pressure is supplied to the head 7.

[0062] When only the component suction valve 62 is switched ON (energized) from the state shown in Figure 6, the head 7 communicates with the negative pressure passage 81, and negative pressure is supplied to the head 7. On the other hand, when only the component mounting valve 63 is switched ON, the head 7 communicates with the positive pressure passage 71, and positive pressure is supplied to the head 7. By selectively supplying negative and positive pressure to the head 7 in this way, the head 7 is able to suction and hold components and release (mount) components onto the substrate P. The positive pressure generated by the positive pressure generation unit 70 is adjusted to a predetermined pressure (approximately 0.05 MPa) by the regulator 70a and supplied to the positive pressure passage 71.

[0063] In the first circuit section 61A, the refrigerant flow section 42 is connected to the positive pressure passage 71 via the first cooling valve 64 and to the negative pressure passage 81 via the second cooling valve 65. Specifically, the introduction port section 42a of the refrigerant flow section 42 is connected to the positive pressure passage 71 via the first cooling valve 64, and the outlet port section 42b is connected to the negative pressure passage 81 via the second cooling valve 65. Both cooling valves 64 and 65 shown in Figure 6 are in the off state (demagnetized state). When both valves 64 and 65 are off, as shown in the figure, neither the positive pressure passage 71 nor the negative pressure passage 81 is in communication with the head 7, and therefore neither positive pressure nor negative pressure is supplied to the refrigerant flow section 42.

[0064] When the first cooling valve 64 and the second cooling valve 65 are switched on (energized) from the state shown in Figure 6, the inlet port 42a of the refrigerant flow section 42 (refrigerant passage 42c) communicates with the positive pressure passage 71, and the outlet port 42b communicates with the negative pressure passage 81. As a result, positive pressure is supplied to the refrigerant flow section 42 via the inlet port 42a, and negative pressure is supplied to the refrigerant flow section 42 via the outlet port 42b. In other words, compressed air is supplied to the refrigerant passage 42c through the inlet port 42a, while the refrigerant passage 42c is sucked in by a vacuum pump through the outlet port 42b. As a result, the compressed air generated in the positive pressure generation unit 70 flows through the inside of the refrigerant flow section 42 along the refrigerant passage 42c. In other words, as described above, compressed air (hereinafter simply referred to as air) passes through the inside of the refrigerant flow section 42 as a refrigerant.

[0065] As shown in Figure 6, an exhaust duct 82 is connected to the negative pressure generation unit 80. This exhaust duct 82 is provided on one side of the outer cover (panel) that forms the outer casing of the component mounting device 1. Therefore, as described above, the air that has passed through the inside of the refrigerant flow unit 42 is discharged directly outside the component mounting device 1 through the negative pressure generation unit 80 (vacuum pump) and the exhaust duct 82. In this example, this exhaust duct 82 corresponds to the "air discharge unit" of the present invention.

[0066] The configuration of the first circuit section 61A of the air circuit 60 has been described above, and the second circuit section 61B is configured similarly. For convenience, only one of the eight heads 7 is shown in each circuit section 61A and 61B, and the other heads 7 are omitted. However, the other heads 7 are also connected to the positive pressure passage 71 via the component suction valve 62 and component mounting valve 63, and are also connected to the negative pressure passage 81 via the component suction valve 62, similar to the heads 7 described above. Furthermore, for convenience, only one of the heat dissipation members 40 on both sides (X1 side and X2 side) of each beam 12A and 12B is shown in each circuit section 61A and 61B, and the heat dissipation member 40 on the other side is omitted. However, the heat dissipation member 40 on the other side is also connected to the positive pressure passage 71 via the first cooling valve 64, and is also connected to the negative pressure passage 81 via the second cooling valve 65, similar to the heat dissipation member 40 on the first side.

[0067] The switching control of each valve 62 to 65 in the air circuit 60, that is, the adsorption and holding of components by the head 7 and the release (mounting) of components onto the substrate P, as well as the flow of air to the heat dissipation member 40 (refrigerant flow section 42), are comprehensively controlled by the control unit 50.

[0068] Figure 7 is a timing chart showing valve switching control during the production of a component-mounted circuit board, and Figure 8 is a timing chart showing valve switching control during production stoppage.

[0069] During the production of the component mounting board, the control unit 50 controls the valves 62 to 65 so that air flows through the inside of the heat dissipation member 40 (refrigerant flow section 42) at times other than when the head 7 is picking up and mounting components, as shown in Figure 7, i.e., during the period when the component mounting process is not being executed. The reason for this is as follows.

[0070] In this component mounting apparatus 1, negative and positive pressure are supplied to the head 7 and to the heat dissipation member 40 (refrigerant flow section 42) via a common air circuit 60. Therefore, if air is to be circulated to the heat dissipation member 40 during the component mounting process (hereinafter, this process may be referred to as "air circulation process"), pressure fluctuations may occur in the negative and positive pressure supplied to the head 7, which could adversely affect the component suction and holding operation and component release operation by the head 7. For example, this could lead to problems such as components falling off the head 7 or component release errors.

[0071] To avoid such inconveniences, during the production of component-mounted circuit boards, the control unit 50 controls the on / off state of each valve 62-65 so that air flow processing is performed only in between operations (times t3-t4) of the component mounting process by the head 7 (times t1-t2 and t5-t6). Figure 7 shows the control of each valve 62-65 belonging to the first circuit section 61A of the air circuit 60, but the control of each valve 62-65 belonging to the second circuit section 61B is the same.

[0072] As shown in Figure 8, the control unit 50 controls each valve 62-65 so that air flow processing is performed even when production of component mounting boards is stopped. For example, the control unit 50 controls each valve 62-65 so that air flow processing is performed between the production of a preceding lot and the production of a succeeding lot. In the example in Figure 8, the control unit 50 controls each valve 62-65 so that air flow processing is performed for a set time (t12-t13) starting from a certain time elapsed (t12) after the production of the preceding lot (t11). For example, the control unit 50 obtains the interval between the preceding lot and the succeeding lot (t11-t14) based on production plan information, and executes air flow processing if the interval is longer than the aforementioned certain time.

[0073] Furthermore, the period during which production of component-mounted boards is stopped may include not only the period between preceding and succeeding production lots as described above, but also periods of production stoppage due to, for example, a shortage of components. In this case, the control unit 50 performs air circulation processing for a set time starting from the point in time after production has stopped. If production resumes before this set time has elapsed, the control unit 50 controls each valve 62-65 so that the air circulation processing is completed when production resumes.

[0074] [Effects and Effects] The above-described component mounting device 1 includes a Y-direction guide member 11 equipped with a fixed rail 24 and a slider 22, a first beam 12A (second beam 12B) fixed to the slider 22, a first Y-axis linear motor 30A (second Y-axis linear motor 30B) that generates a driving force to move the first beam 12A (second beam 12B) along the fixed rail 24, and a heat dissipation member 40 that dissipates the heat generated by the movable element 32. The heat dissipation member 40 includes a refrigerant flow section 42 that covers the movable element 32 and is formed so that air (refrigerant) passes through its interior, and a vacuum insulation section 44 that is positioned between the refrigerant flow section 42 and the first beam 12A (second beam 12B) and has a vacuum space 44a inside.

[0075] With this configuration, as previously described, the heat generated in the movable element is suppressed (blocked) from moving toward the first beam 12A (second beam 12B) by the vacuum insulation section 44, while the heat is actively dissipated from the movable element 32 and its surroundings by the air (refrigerant) flowing through the refrigerant circulation section 42. As a result, thermal deformation of each beam 12A, 12B and the Y-direction guide member 11 caused by the heat generated in the movable element 32 is suppressed or prevented. This suppression of thermal deformation in each part leads to an improvement in the movement accuracy of each beam 12A, 12B, and consequently contributes to an improvement in the mounting accuracy of components by the component mounting device 1.

[0076] In particular, the component mounting device 1 has a configuration in which the first Y-axis linear motor 30A (second Y-axis linear motor 30B) is incorporated into the Y-direction guide member 11. In this configuration, the slider 22, fixed rail 24, and first beam 12A (second beam 12B) are adjacent to each other, so there is a particular concern about thermal deformation of these due to the heat generated by the movable element 32. However, according to the configuration of the embodiment, as described above, the heat generated by the movable element 32 is actively dissipated from the movable element 32 and its surroundings by air flowing through the heat dissipation member 40 (refrigerant flow section 42). Therefore, thermal deformation of each beam 12A, 12B and the Y-direction guide member 11 is effectively suppressed.

[0077] Furthermore, the refrigerant passage 42c of the refrigerant flow section 42 is formed to meander along the surface on which the electromagnetic coils are arranged (the upper surface 22a and the side surface 22b of the slider 22). With this configuration, the air flows meanderingly along the electromagnetic coils, promoting heat transfer from the movable element to the refrigerant, and enabling effective heat dissipation from the electromagnetic coils and their surroundings.

[0078] Furthermore, a refrigerant flow section 42 equipped with such a refrigerant passage 42c can be constructed, for example, by overlapping and joining a first plate member 45 having a meandering groove 45a formed on its main surface and a second plate member 46 having a meandering groove 46a formed on its main surface that is symmetrical to the first plate member 45, as shown in Figure 10.

[0079] Furthermore, since the air (compressed air) used in the component mounting device 1 is circulated to the heat dissipation member 40 as a refrigerant, a rational configuration is achieved in which the heat generated in the movable element 32 is dissipated using the existing equipment of the component mounting device 1. Specifically, the component mounting device 1 is configured to adsorb and hold components by receiving negative pressure supplied from the negative pressure generation unit 80, and to release components by receiving positive pressure supplied from the positive pressure generation unit 70 instead of negative pressure. Negative pressure is supplied from the negative pressure generation unit 80 to one end (outlet port 42b) of the refrigerant passage 42c, and positive pressure is supplied from the positive pressure generation unit 70 to the other end (outlet port 42b). As a result, air flows through the refrigerant circulation unit 42 along the refrigerant passage 42c. Therefore, the heat generated in the movable element 32 can be dissipated in a rational configuration that utilizes the air used in the component mounting device 1.

[0080] Furthermore, the component mounting device 1 is equipped with first and second cooling valves 64 and 65 that switch between supplying and stopping negative and positive pressure to the refrigerant flow section 42, and the control unit 50 controls the first and second cooling valves 64 and 65 so that air flows through the refrigerant flow section 42 during periods other than when the component mounting process is being executed. As a result, the heat generated by the movable element 32 can be dissipated without affecting the component mounting process by the head 7. In other words, there is no risk of problems such as poor component suction or mounting failure due to pressure fluctuations of negative or positive pressure during the component mounting process.

[0081] Furthermore, the component mounting device 1 is equipped with an exhaust duct 82 that discharges the air that has flowed through the refrigerant flow section 42 directly to the outside of the component mounting device 1 (outside the machine). Therefore, the heat generated by the movable element 32 can be continuously dissipated without the need to install equipment for regenerating (cooling) the air that has flowed through the refrigerant flow section 42 as a refrigerant. [Differentiation] The component mounting apparatus 1 described above is an example of a preferred embodiment of the component mounting apparatus according to the present invention (a component mounting apparatus equipped with a linear drive device according to the present invention), and the specific configuration of the component mounting apparatus 1 and the linear drive device can be changed without departing from the spirit of the present invention. For example, the following configuration can also be adopted.

[0082] (1) The linear drive device for moving the first head unit 6A in the X direction (first X-direction guide member 13A and a first X-axis linear motor not shown) and the linear drive device for moving the second head unit 6B in the X direction (second X-direction guide member 13B and a second X-axis linear motor not shown) may also be provided with a heat dissipation member 40. That is, the first head unit 6A may be configured such that its frame member (moving body) is fixed to the slider 26 of the first X-direction guide member 13A via the heat dissipation member 40. Similarly, the second head unit 6B may be configured such that its frame member (moving body) is fixed to the slider 26 of the second X-direction guide member 13B via the heat dissipation member 40.

[0083] With these configurations, the heat generated in the movable elements of the first and second X-axis linear motors can be actively dissipated from the movable elements and their surroundings by air flowing through the heat dissipation member 40 (refrigerant flow section 42). This contributes to suppressing thermal deformation of the frame member, each X-direction guide member 13A, 13B, and each beam 12A, 12B caused by the heat generated by the movable elements.

[0084] (2) In this embodiment, the first Y-axis linear motor 30A is incorporated into the Y-direction guide member 11. However, the first Y-axis linear motor 30A may be provided separately from the Y-direction guide member 11, as shown in Figure 11.

[0085] Figure 11 is a schematic diagram of a modified component mounting device 1 viewed in the Y direction. As shown in the figure, the first Y-axis linear motor 30A (second Y-axis linear motor 30B) is positioned adjacent to the Y-direction guide member 11. Specifically, a stator 34 is fixed to the elevated frame 10 at a position adjacent to the fixed rail 20, and a movable element 32 is fixed to the lower surface of the first beam 12A (second beam 12B) at a position opposite to the stator 34. The movable element 32 is fixed to the first beam 12A (second beam 12B) via a heat dissipation member 40.

[0086] With this configuration, thermal deformation of the first beam 12A (second beam 12B) caused by heat generation from the movable element 32 is suppressed.

[0087] (3) In this embodiment, air is circulated through the refrigerant flow section 42 by supplying positive pressure to the inlet port section 42a and negative pressure to the outlet port section 42b. However, air may also be circulated through the refrigerant flow section 42 by supplying only positive pressure or negative pressure. Specifically, the inlet port section 42a may be opened to the atmosphere via an air filter or the like, and negative pressure may be supplied to the outlet port section 42b (without supplying positive pressure). Alternatively, the outlet port section 42b may be directly connected to the exhaust duct 82 without going through the negative pressure passage 81, and positive pressure may be supplied to the inlet port section 42a (without supplying negative pressure). Air can also be circulated through the refrigerant flow section 42 with such a configuration. However, in order to circulate air more stably and smoothly to the refrigerant circulation section 42, that is, to promote heat dissipation, it is desirable to circulate air to the refrigerant circulation section 42 by supplying positive pressure to the introduction port section 42a of the refrigerant circulation section 42 while supplying negative pressure to the outlet port section 42b, as in the embodiment.

[0088] (4) In this embodiment, compressed air (gas) is used as the refrigerant and flows through the heat dissipation member 40 (refrigerant flow section 42), but a configuration in which a liquid is used as the refrigerant may also be used. [Explanation of Symbols]

[0089] 1. Component mounting equipment 5. Parts Supply Department 6A First Head Unit 6B Second Head Unit 7 Head (Mounted Head) 9. Head unit drive mechanism 11. Y-direction guide member (guide member) 12A First beam (mobile) 12B Second Beam (Mobile Unit) 20 Fixed rails (rails) 22 Sliders 30A 1st Y-axis linear motor (linear motor) 30B Second Y-axis linear motor (linear motor) 32 Mover 34 Stator 40 Heat dissipation components 42 Refrigerant flow section 42c refrigerant passage 44 Vacuum Insulation Section 44a Vacuum space 50 Control Unit 60 Air Circuit 61A 1st circuit section 61B 2nd circuit section 62-part suction valve 63 Component-mounted valve 64. First cooling valve 65. Second cooling valve 70 Positive pressure generation section 80 Negative pressure generation section 82 Exhaust duct (air discharge section)

Claims

1. A guide member comprising a rail and a slider movably mounted on the rail, A movable body fixed to the slider, A linear drive system comprising a linear motor, which includes a movable element made of an armature and a stator made of a field, provided on the slider or the moving body, and which generates a driving force to move the moving body along the rail, The system includes a heat dissipation member that dissipates the heat generated by the movable element, The linear drive device is characterized in that the heat dissipation member comprises a refrigerant flow section that covers the movable element and is formed so that a refrigerant passes through its interior, and a vacuum insulation section disposed between the refrigerant flow section and the movable body and having a vacuum space inside.

2. In the linear drive device according to claim 1, A linear drive device characterized in that the movable element is provided on the slider and the stator is provided on the rail.

3. In the linear drive device according to claim 2, The movable element comprises a plurality of electromagnetic coils that constitute the armature, The linear drive device is characterized in that the refrigerant flow section includes a refrigerant passage formed to meander along the plane on which the electromagnetic coils are arranged.

4. The linear drive device according to claim 3, A mounting head is attached to the moving body of the linear drive device and is capable of holding and releasing components, The linear drive unit and the control unit for controlling the mounting head are provided, The component mounting apparatus is characterized in that the control unit holds a component from the component supply unit using the mounting head, transports it onto a substrate, and performs a component mounting process in which the component is mounted at a predetermined position on the substrate.

5. In the component mounting apparatus described in claim 4, A component mounting apparatus characterized in that the refrigerant is air.

6. In the component mounting apparatus according to claim 5, A negative pressure generating unit that generates negative pressure, It comprises a positive pressure generating unit that generates positive pressure, The mounting head is configured to hold components by adsorbing them upon receiving negative pressure from the negative pressure generation unit, and to release the components upon receiving positive pressure from the positive pressure generation unit instead of the negative pressure. The component mounting apparatus is characterized in that the refrigerant flow section is configured to receive at least one of the following: a negative pressure supply from the negative pressure generation section and a positive pressure supply from the positive pressure generation section, thereby allowing air to pass along the refrigerant passage.

7. In the component mounting apparatus according to claim 6, The component mounting apparatus is characterized in that the control unit controls the supply of at least one of the negative pressure supply and the positive pressure supply so that air passes through the refrigerant flow section during periods other than when the component mounting process is being executed.

8. In the component mounting apparatus according to claim 6, A component mounting apparatus characterized by having an air discharge unit that discharges the air that has passed through the refrigerant flow unit directly to the outside of the component mounting apparatus.

9. A linear drive device according to claim 1 or 2, A mounting head is attached to the moving body of the linear drive device and is capable of holding and releasing components, The linear drive unit and the control unit for controlling the mounting head are provided, The component mounting apparatus is characterized in that the control unit holds a component from the component supply unit using the mounting head, transports it onto a substrate, and performs a component mounting process in which the component is mounted at a predetermined position on the substrate.

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