Method for adjusting a polishing device and pressure control unit

Abstract

To provide a polishing device capable of reducing variations in responsiveness of multiple pressure regulators.SOLUTION: The polishing device includes multiple buffer tanks T1 to T6. Each of the buffer tanks T1 to T6 includes a tank section 120 made of a rigid body, and a volume adjustment device 122 which adjusts a volume of the buffer tank.SELECTED DRAWING: Figure 4

Claims

1. A polishing apparatus, A polishing table that supports the polishing pad, A top ring having multiple pressure chambers for pressing the substrate against the polishing surface of the polishing pad, Multiple pressure regulators for controlling the pressure of gases in the multiple pressure chambers, Multiple pressure sensors for detecting the pressure adjusted by the multiple pressure regulators, The system comprises a plurality of pressure chambers, a plurality of pressure regulators, and a plurality of buffer tanks connected to a plurality of gas transfer lines connecting them, Each of the aforementioned buffer tanks is A tank section made of rigid bodies, The system includes a volume adjustment device for adjusting the volume of the buffer tank, The volume adjustment device is A blocking member is disposed inside the tank section and closes off a portion of the internal space of the tank section, A reciprocating mechanism for moving the aforementioned blocking member back and forth, A polishing apparatus comprising a positioning member for positioning the blocking member moved by the reciprocating movement mechanism.

2. A polishing apparatus, A polishing table that supports the polishing pad, A top ring having multiple pressure chambers for pressing the substrate against the polishing surface of the polishing pad, Multiple pressure regulators for controlling the pressure of gases in the multiple pressure chambers, Multiple pressure sensors for detecting the pressure adjusted by the multiple pressure regulators, The system comprises a plurality of pressure chambers, a plurality of pressure regulators, and a plurality of buffer tanks connected to a plurality of gas transfer lines connecting them, Each of the aforementioned buffer tanks is A tank section made of rigid bodies, The system includes a volume adjustment device for adjusting the volume of the buffer tank, The polishing apparatus includes a control device that controls the pressure in each of the multiple pressure chambers through each of the multiple pressure regulators. The control device is The secondary pressure of each of the aforementioned multiple pressure regulators is measured. A polishing apparatus that determines the volume of the buffer tank such that the change in the secondary pressure when the target pressure value of each of the plurality of pressure regulators changes falls within a predetermined allowable range.

3. The polishing apparatus according to claim 2, wherein the control device adjusts the control parameters input to the plurality of pressure regulators after adjusting the volume.

4. If each of the aforementioned plurality of pressure sensors is defined as a first pressure sensor, and each of the aforementioned plurality of pressure regulators is defined as a first pressure regulator, The polishing apparatus is A second pressure sensor provided in place of the first pressure sensor, The polishing apparatus according to claim 1 or claim 2, further comprising a second pressure regulator provided in place of the first pressure regulator.

5. The polishing apparatus includes a control device that controls the pressure in each of the multiple pressure chambers through each of the multiple pressure regulators. The control device is A predetermined control parameter is input to the second pressure regulator. Based on the second pressure sensor, the secondary pressure of the second pressure regulator is measured. The polishing apparatus according to claim 4, wherein the volume of the buffer tank is determined such that the change in the secondary pressure when the target pressure value of the second pressure regulator changes falls within a predetermined allowable range.

6. A method for adjusting a pressure control unit that supplies gas to multiple pressure chambers built into a top ring for polishing a substrate, The pressure control unit is Multiple pressure regulators for controlling the gas pressure in the multiple pressure chambers, Multiple pressure sensors for detecting the pressure adjusted by the multiple pressure regulators, The system comprises the aforementioned plurality of pressure chambers, the aforementioned plurality of pressure regulators, and a plurality of buffer tanks connected to a plurality of gas transfer lines that connect them, A method for adjusting a pressure control unit, wherein the volume of each of the plurality of buffer tanks is variable, and the volume is determined based on the pressure value measured by each of the corresponding plurality of pressure sensors.

7. The method according to claim 6, wherein the volume is determined such that the change in the secondary pressure of each of the plurality of pressure regulators when the target pressure value of each of the plurality of pressure regulators changes falls within a predetermined allowable range.

8. The method according to claim 7, wherein the control parameters of the pressure regulator are adjusted after the volume has been adjusted.

9. If each of the aforementioned plurality of pressure sensors is defined as a first pressure sensor, and each of the aforementioned plurality of pressure regulators is defined as a first pressure regulator, The pressure in the plurality of pressure chambers is controlled using a second pressure regulator instead of the first pressure regulator. The method according to claim 8, wherein a second pressure sensor is installed in place of the first pressure sensor to measure the pressure.

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