Planarization method, planarization system, and method for manufacturing articles

Abstract

To disclose substrate processing, in particular, planarization of a surface in semiconductor manufacturing.SOLUTION: A method for planarizing a substrate includes: dispensing a formable material 124 onto a substrate 102; contacting a superstrate 108 held by a superstrate chuck 118 with the formable material 124 on the substrate 102, thereby forming a multilayer structure including the superstrate 108, a film of the formable material 124, and the substrate 102; releasing the multilayer structure from the superstrate chuck 118; providing a space between the superstrate chuck 118 and the multilayer structure after the releasing; locating a light source between the superstrate chuck 118 and the multilayer structure; and curing the film of the multilayer structure by exposing the film to light emitted from the light source.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to substrate processing, and more particularly to planarization of surfaces in semiconductor manufacturing.

Background Art

[0002] Planarization techniques are useful in manufacturing semiconductor devices. For example, the process for creating a semiconductor device includes repeatedly applying materials to a substrate and removing materials from the substrate. This process generates a layered substrate with irregular height variations (i.e., topography), and as more layers are added, the substrate height variations can increase. The height variations have a negative impact on the performance of adding additional layers to the layered substrate. Separately, a semiconductor substrate (e.g., a silicon wafer) itself is not always perfectly flat and may include initial surface height variations (i.e., topography). One way to address this problem is to planarize the substrate during the stacking process. Various lithography patterning methods benefit from patterning on a planar surface. In ArFi laser-based lithography, planarization improves the depth of focus (DOF), critical dimension (CD), and critical dimension uniformity. In extreme ultraviolet lithography (EUV), planarization improves feature placement and DOF. In nanoimprint lithography (NIL), planarization improves feature filling and CD control after pattern transfer.

[0003] A planarization technique sometimes called inkjet-based adaptive planarization (IAP) includes dispensing a variable droplet pattern of a polymeric material between a substrate and a superstrate, where the droplet pattern varies depending on the substrate topography. Next, the superstrate is contacted with the polymeric material, then the material is polymerized on the substrate, and the superstrate is removed. Improvements to planarization techniques, including the IAP technique, are desired to improve, for example, full wafer processing and semiconductor device manufacturing.

[0004] In some known planarization systems and methods, the curing process is performed by transmitting UV light radiation through a transparent superstraight chuck. When curing through a transparent superstraight chuck, the structure of the superstraight chuck can cause uneven transmission of UV light radiation to the moldable material located at the edges of the substrate. In particular, transparent superstraight chucks contain geometric features such as recesses, lands, and channels that cause uneven transmission of passing UV light. Furthermore, Fresnel diffraction at the edges of geometric features can produce high-intensity peaks at the sharp edges of the superstraight chuck, which can affect uniformity. Uneven transmission can lead to unsatisfactory curing performance. Therefore, there is a need in the art for planarization systems and methods that prevent these drawbacks. [Overview of the project]

[0005] A method for planarizing a substrate includes the steps of: dispensing a moldable material onto the substrate; bringing a superstraight held by a superstraight chuck into contact with the moldable material on the substrate, thereby forming a multilayer structure including the superstraight, a film of the moldable material, and the substrate; releasing the multilayer structure from the superstraight chuck; creating a space between the superstraight chuck and the multilayer structure after the release; positioning a light source within the space provided between the superstraight chuck and the multilayer structure; and curing the film of the multilayer structure by exposing it to light emitted from the light source.

[0006] The planarization system comprises a substrate chuck for holding a substrate, a superstraight chuck for holding a superstraight, a first positioning system configured to bring the superstraight into contact with a formable material dispensed on the substrate to form a multilayer structure including the superstraight, a film of the formable material, and the substrate, and to provide a space between the superstraight chuck and the multilayer structure after the multilayer structure is released from the superstraight chuck, a light source, and a second positioning system configured to move the light source into the space provided between the superstraight chuck and the multilayer structure.

[0007] A method for manufacturing an article includes the steps of: dispensing a moldable material onto a substrate; bringing a superstraight held by a superstraight chuck into contact with the moldable material on the substrate, thereby forming a multilayer structure including the superstraight, a film of the moldable material, and the substrate; releasing the multilayer structure from the superstraight chuck; creating a space between the superstraight chuck and the multilayer structure after the release; positioning a light source within the space provided between the superstraight chuck and the multilayer structure; curing the film of the multilayer structure by exposing it to light emitted from the light source; and manufacturing an article by processing the cured film.

[0008] These and other purposes, features, and advantages of this disclosure will become apparent upon reading the following detailed description of exemplary embodiments of this disclosure in conjunction with the accompanying drawings and the claims provided. [Brief explanation of the drawing]

[0009] To allow for a more detailed understanding of the features and merits of this disclosure, a more specific description of embodiments of this disclosure may be made by reference to embodiments shown in the accompanying drawings. However, it should be noted that the accompanying drawings only illustrate typical embodiments of this disclosure and therefore should not be considered to limit the scope of this disclosure, as other equally valid embodiments may be permitted.

[0010] [Figure 1] A schematic cross-sectional view of an exemplary planarization system according to one aspect of the present disclosure.

[0011] [Figure 2] A schematic plan view of an example radiation source, including an array of light-emitting diodes according to one aspect of the present disclosure.

[0012] [Figure 3] A flowchart of a planarization method according to the embodiments of this disclosure.

[0013] [Figure 4A] A schematic cross-sectional view of the operation of the flattening system when the method shown in Figure 3 is performed. [Figure 4B] A schematic cross-sectional view of the operation of the flattening system when the method shown in Figure 3 is performed. [Figure 4C] A schematic cross-sectional view of the operation of the flattening system when the method shown in Figure 3 is performed. [Figure 4D] A schematic cross-sectional view of the operation of the flattening system when the method shown in Figure 3 is performed. [Figure 4E] A schematic cross-sectional view of the operation of the flattening system when the method shown in Figure 3 is performed. [Figure 4F] A schematic cross-sectional view of the operation of the flattening system when the method shown in Figure 3 is performed. [Figure 4G] A schematic cross-sectional view of the operation of the flattening system when the method shown in Figure 3 is performed. [Figure 4H] A schematic cross-sectional view of the operation of the flattening system when the method shown in Figure 3 is performed. [Figure 4I]Schematic cross-sectional view of the operation of the flattening system when executing the method of FIG. 3. [Figure 4J] Schematic cross-sectional view of the operation of the flattening system when executing the method of FIG. 3.

[0014] [Figure 5] A series of schematic cross-sectional views of a first exemplary embodiment for inserting a radiation source according to one aspect of the present disclosure.

[0015] [Figure 6] A series of schematic cross-sectional views of a second exemplary embodiment for inserting a radiation source according to one aspect of the present disclosure.

[0016] [Figure 7] A series of schematic cross-sectional views of a third exemplary embodiment for inserting a radiation source according to one aspect of the present disclosure.

[0017] [Figure 8A] Schematic cross-sectional view of a fourth exemplary embodiment for inserting a radiation source according to one aspect of the present disclosure, showing the radiation source in a non-inserted position.

[0018] [Figure 8B] Schematic plan view of a fourth exemplary embodiment for inserting a radiation source according to one aspect of the present disclosure, showing the radiation source in a non-inserted position.

[0019] [Figure 9A] Schematic cross-sectional view of a fourth exemplary embodiment for inserting a radiation source according to one aspect of the present disclosure, showing the radiation source in an inserted position.

[0020] [Figure 9B] Schematic plan view of a fourth exemplary embodiment for inserting a radiation source according to one aspect of the present disclosure, showing the radiation source in an inserted position.

[0021] This disclosure is described herein in detail with reference to the drawings, in relation to exemplary embodiments. It is intended that changes and modifications may be made to the exemplary embodiments described without departing from the true scope and spirit of the disclosure of subject matter as defined by the appended claims. [Modes for carrying out the invention]

[0022] Flattening system Figure 1 shows an example of a planarization system 100 according to one aspect of the present disclosure. The planarization system 100 is used to planarize a film on a substrate 102. The substrate 102 may be coupled to a substrate chuck 104. The substrate chuck 104 may be, but is not limited to, a vacuum chuck, a pin chuck, a grooved chuck, an electrostatic chuck, an electromagnetic chuck, etc.

[0023] The substrate 102 and substrate chuck 104 may be further supported by a substrate positioning stage 106. The substrate positioning stage 106 can provide translational and / or rotational motion along one or more of the Cartesian x, y, z axes and three tilt axes. The substrate positioning stage 106, substrate 102, and substrate chuck 104 may also be positioned on a surface plate (not shown). The movement of the stage 106 can be controlled by a controller 140, which will be described later. The combination of features provided for relative movement and a controller for controlling the movement of the substrate is referred to herein as the first positioning system.

[0024] The planarization system 100 may include a fluid dispenser 122. The fluid dispenser 122 is used to deposit droplets of liquid moldable material 124 (e.g., photocurable polymerizable material) onto a substrate 102, and the volume of material deposited varies over the region of the substrate 102, at least partially based on its topographic profile. Different fluid dispensers 122 can use different techniques to dispense the moldable material 124. If the moldable material 124 is jettable, an inkjet-type dispenser can be used to dispense the moldable material. For example, thermal inkjetting, microelectromechanical system (MEMS) based inkjetting, valve jetting, and piezoelectric inkjetting are common techniques for dispensing jettable liquids.

[0025] As shown in Figure 1, the planarization system 100 may include a superstraight 108 having a working surface 112 positioned opposite and spaced apart from the substrate 102. The superstraight 108 may be formed from materials including, but not limited to, fused silica, quartz, silicon, organic polymers, siloxane polymers, borosilicate glass, fluorocarbon polymers, metals, and hardened sapphire. In one embodiment, the superstraight 108 is transparent to UV light radiation. The surface 112 is generally the same area size as the surface of the substrate 102, or slightly larger.

[0026] The planarization system 100 may further include a superstraight chuck 118 and a planarization head 120. A superstraight 108 may be connected to or held by the superstraight chuck 118. As described above, the superstraight chuck 118 may include geometric features such as recesses, lands, and channels that cause non-uniform transmission if UV light passes through them when the recesses, lands, and channels are close to the focal plane of UV light emission. According to one embodiment, as will be described later, UV light is not emitted through the superstraight chuck 118 as part of the curing process, so the superstraight chuck 118 does not need to be transparent to UV light. That is, in one embodiment, the superstraight chuck 118 may be semi-transparent or opaque to UV light. Since UV light does not pass through the superstraight chuck 118, non-uniform transmission of UV light is avoided. However, in another embodiment, the superstraight chuck 118 may still be transparent to UV light.

[0027] The superstraight chuck 118 may be coupled to a planar head 120. The planar head 120 may be movably coupled to a bridge (not shown). The planar head 120 may include one or more actuators such as a voice coil motor, a piezoelectric motor, a linear motor, a nut, and a screw motor, which are configured to move the superstraight chuck 118 relative to the substrate 102 in at least the z-axis direction and potentially in other directions (e.g., the x-axis, y-axis, and three tilt axes). An embodiment of the planar head that enables this movement, as controlled by the controller 140, is also a component of the first positioning system. During operation, the planar head 120 or the substrate positioning stage 106, or both, vary the distance between the superstraight 108 and the substrate 102 to define a desired space (a bounded physical extent in three dimensions) to be filled with the formable material 124. For example, the planarization head 120 can be moved toward the substrate, and force can be applied to the superstraight 108 so that the superstraight comes into contact with droplets of the formable material 124 and spreads them out, as will be further detailed herein. The same effect can be achieved by moving the substrate 102 toward the superstraight 108, or by moving both together.

[0028] The planarization system 100 may further include a camera 136 positioned to observe the spreading of the formable material 124 as the superstraight 108 comes into contact with the formable material 124 during the planarization process. The camera 136 may include one or more of a CCD, a sensor array, a line camera, and a photodetector, which are configured to collect light at wavelengths that show contrast between the region under the superstraight 108 and the region under the formable material 124, but do not come into contact with the formable material 124. The camera 136 may be configured to provide an image of the spreading of the formable material 124 under the superstraight 108 and / or the separation of the superstraight 108 from the cured formable material 124. The camera 136 may also be configured to measure interference fringes that change as the formable material 124 spreads between the surface 112 and the substrate surface.

[0029] The fluid dispenser 122 may be movably connected to the bridge. In one embodiment, the fluid dispenser 122 and the flattening head 120 share one or more or all of the positioning components, which are part of the first positioning system. In an alternative embodiment, the fluid dispenser 122 and the flattening head 120 move independently of each other. The fluid dispenser 122 and the flattening head 120 are movable so that each can perform its respective function without interfering with the other.

[0030] The planarization system 100 may include a radiation source 126 (Figures 2, 4E-4G, and 6-9B) that directs chemical ray energy, such as UV light emission, along an exposure path 128 (Figure 4F). In one embodiment, the radiation source 126 includes an array of light-emitting diodes (LEDs) 127 mounted on a support 129. Figure 2 shows a schematic plan view of an example radiation source 126 including an array of light-emitting diodes 127 on a support 129. As shown in Figure 2, the LEDs 127 may be arranged linearly on the support 129. According to one embodiment, the support 129 has a circular shape and may be the same size as the substrate 102 or slightly larger (e.g., Figures 5-7). In another embodiment, the radiation source 126 may have two semicircular divisions (hereinafter referred to as the first body 126a and the second body 126b), which together form a radiation source 126 the same size as the substrate 102 or slightly larger (e.g., Figures 8A-9B). Figure 2 further shows the regions of the light range 130 for each of the LEDs 127. The radiation source 126 may also include a diffuser (not shown). The diffuser is positioned close to the light output of the LEDs and can help achieve uniformity of the target. The wavelength of the emitted light may be 300-400 nm. In an alternative embodiment, one or more sensors of the camera 136 can be integrated with the LEDs 127 of the radiation source 126. In another alternative embodiment, an optical combiner (not shown) can be used to guide light from the radiation source 126 through the superstraight 108 while allowing light from the substrate 102 to be collected by the camera 136.

[0031] The radiation source 126 can be inserted in the space between the superstraight chuck 118 and the superstraight 108, as described later. Such a configuration reduces the overall space required by the planarization system 100 (by avoiding external optical elements) and eliminates the need to transmit light through the superstraight chuck 118. Furthermore, for the array of LEDs 127 to be most effective, the array of LEDs 127 must be close to the surface of the moldable material 124 being cured. The array of LEDs 127 of the radiation source 126 can be directed downward (Figure 4F), i.e., in the Z direction. More specifically, the center of the beam emitted by each LED 127 moves within a vertical line parallel to the Z direction.

[0032] The planarization system 100 can be coordinated, controlled, and / or directed by one or more processors 140 (controllers) that communicate with one or more components and / or subsystems, such as a substrate chuck 104, a substrate positioning stage 106, a superstraight chuck 118, a fluid dispenser 122, a planarization head 120, a camera 136, a radiation source 126, and a positioning system. The processors 140 can operate based on instructions in a computer-readable program stored in non-temporary computer memory 142. The processors 140 may be one or more of a CPU, MPU, GPU, ASIC, FPGA, DSP, and a general-purpose computer, or may include them. The processors 140 may be a general-purpose controller, or a general-purpose computing device configured to be a controller. Examples of non-temporary computer-readable memory include, but are not limited to, RAM, ROM, CD, DVD, Blu-ray®, hard drives, network-attached attached storage (NAS), intranet-connected non-temporary computer-readable storage devices, and internet-connected non-temporary computer-readable storage devices. All method steps described herein may be performed by processor 140. A feature that provides movement and control of movement for various components of the system is a positioning system.

[0033] Flattening method Figure 3 shows a flowchart of the planarization method 200 according to one embodiment. Figures 4A-4J show schematic cross-sections of the operation of the planarization system 100 when performing method 200. Planarization method 200 begins with step S202, in which the moldable material 124 is dispensed onto the substrate 102 in the form of droplets. As described above, the surface of the substrate 102 has several topographies, which may be known based on previous processing operations or can be measured using an optical interferometry-based surface profiler such as the Zygo NewView 8200, AFM, SEM, or optical surface profiler. The local volume density of the deposited moldable material 124 varies depending on the substrate topography. Step S202 can be performed using a dispenser 122 at the same location as the planarization head 120, or at a different location by transporting the substrate 102 to the dispensing position. Figure 1 shows the substrate 102 after the moldable material has been dispensed. Figure 4A shows a schematic cross-section of the substrate 102 immediately before the superstraight 108 contacts the moldable material 124, i.e., after the completion of step S202 and immediately before step S204. That is, at the moment shown in Figure 4A, the superstraight 108 is held by the superstraight chuck 118 and has not yet contacted the moldable material 124. To reach the position shown in Figure 4A, at least one of the planar head 120 and the stage 106 is moved in the Z direction using the first positioning system so that the distance between the planar head 120 and the substrate 102 having the moldable material 124 decreases. Preferably, only one of the planar head 120 and the stage 106 is moved in the Z direction, while the other remains stationary. In a preferred embodiment, the planar head 120 moves downward in the Z direction while the stage 106 remains stationary. However, in some cases, both may be moved.

[0034] Next, the planarization method 200 proceeds to step S204, where the substrate 102 having the moldable material 124 is planarized using the planarization head 120 to form a multilayer structure 111. As described above, the first positioning system can be used to move the planarization head 120 toward the substrate 102 and apply force to the superstraight 108 so that it contacts and spreads the droplets of the moldable material 124. Figure 4B shows the post-contact process after the superstraight 108 has made full contact with the moldable material 124. When the superstraight 108 contacts the moldable material 124, the droplets merge to form a moldable material film 144 that fills the space between the superstraight 108 and the substrate 102. Preferably, the filling process is carried out uniformly without trapping air or bubbles between the superstraight 108 and the substrate 102 in order to minimize non-filling defects. According to one embodiment, the substrate 102 and / or superstraight 108 are supported by controlled back pressure from the substrate chuck 106 and / or superstraight chuck 118, spreading the moldable material 124 without trapping any voids. The spreading begins from the center of the substrate 102 and ends at the boundary of the active region of the substrate 102. At the moment shown in Figure 4B, step S204 is completed. Furthermore, at this point, the multilayer structure 111 is formed while the superstraight 108 is still in contact with the moldable material 124. In particular, the multilayer structure 111 includes or consists of the superstraight 108, the moldable material film 144, and the substrate 102 in this order. In another embodiment, the multilayer structure may also be considered to comprise or consist of the superstraight 108, the moldable material film 144, the substrate 102, and the substrate chuck 104 in that order. In either case, as shown in Figure 4B, in the multilayer structure 111, the lower surface 112 of the superstraight 108 is in direct contact with the upper part of the moldable material film 144, while the lower surface of the moldable material film 144 is in direct contact with the upper part of the substrate 102.

[0035] Next, the process proceeds to step S206, in which the superstraight 108 is released from the superstraight chuck 118, while the superstraight 108 remains in contact with the moldable material film 144. Figure 4C shows a schematic cross-section of the planarization system 100 immediately after the release of the superstraight 108. This action of releasing the superstraight 108 from the superstraight chuck 118 frees the multilayer structure 111 from the planarization head 120. Releasing the superstraight 108 from the superstraight chuck 118 is also called de-chucking. As a result of releasing the superstraight 108 from the superstraight chuck 118, the multilayer structure 111 (i.e., the superstraight 108, the moldable material film 144, and the substrate 102 in that order) remains in contact only with the substrate chuck 106.

[0036] Next, the method proceeds to step S208, in which the first positioning system is used to create a space 132 (Figure 4D) between the superstraight chuck 118 and the multilayer structure 111. More specifically, the space 132 is created by making a distance D in the Z direction between the lower surface 133 of the superstraight chuck 118 and the upper surface 138 of the superstraight 108. The distance D is selected so that there is just enough space to insert the radiation source 126 into the space 132. The distance D can be 10 mm to 200 mm, preferably 30 mm to 150 mm. The ratio of the distance D to the thickness of the radiation source can be 1.6:1 to 1.4:1 or 2:1 to 1.1:1, preferably 1.5:1.

[0037] Using the first positioning system, space 132 can be provided by moving at least one of the flattening head 120 and the stage 106 in the Z direction until a distance D is reached between the super straight chuck 118 and the multilayer structure 111. As described above, preferably, only one of the flattening head 120 and the stage 106 is moved in the Z direction, while the other remains stationary. In a preferred embodiment, the flattening head 120 moves upward in the Z direction while the stage 106 remains stationary. Thus, once distance D is reached, space 132 is provided.

[0038] Next, the process proceeds to step S210, in which the radiation source 126 is inserted into the provided space 132. Figure 4E shows a schematic cross-section of the planarization system 100 after the radiation source 126 has been inserted into the space 132. Meanwhile, the multilayer structure 111 remains at a distance D from the superstraight chuck 118. The radiation source 126 can be inserted into the space 132 by various methods.

[0039] Figure 5 shows a series of schematic cross-sections of a first embodiment for inserting a radiation source 126 into space 132. In the first embodiment of Figure 5, the planarization system 100 includes an arm 134 configured to carry the radiation source 126. In the embodiment shown in Figure 5, the arm 134 is movable laterally in the X dimension. As shown in Figure 5, the insertion process begins with the arm 134 positioned where the radiation source 126 has not yet been inserted into space 132. Once process S208 is completed so that a distance D is created and thereby space 132 is provided, the controller 140 can instruct the arm 134 to move in the direction 148 along the X dimension. The arm 134, the controller 140, and all components that enable the arm 134 to move along the X dimension collectively form a second positioning system, namely the structure and control that enables the positioning of the radiation source 126 into space 132. As shown in Figure 5, the arm 134 may be controlled by the control device 140 to continue moving in the direction 148 along the X dimension until the radiation source 126 is fully positioned within the space 132.

[0040] Figure 6 shows a series of schematic cross-sections of a second embodiment for inserting a radiation source 126 into space 132. In the second embodiment of Figure 6, the planarization system 100 includes the same arm 134 as in the first embodiment, which similarly carries the radiation source 126. However, in the second embodiment shown in Figure 6, the arm 134 is rotatable about the Z dimension. As shown in Figure 6, the insertion process begins with the arm 134 positioned in an orientation in which the radiation source 126 has not yet been inserted into space 132. Once process S208 is completed so that a distance D is created and thereby space 132 is provided, the controller 140 can instruct the arm 134 to rotate about the Z dimension in direction 150. The arm 134, the controller 140, and all components that enable the arm 134 to rotate about the Z dimension collectively form a second positioning system. That is, the second positioning system is a structure and control that enables the positioning of the radiation source 126 into space 132 via rotation. As shown in Figure 6, the arm 134 can be controlled by the control device 140 to continue rotating in direction 150 around the Z dimension until the radiation source 126 is fully positioned within space 132.

[0041] Figure 7 shows a series of schematic cross-sections of a third embodiment for inserting a radiation source 126 into space 132. In the third embodiment of Figure 7, the planarization system 100 uses a substrate robot loading arm 135 to insert the radiation source 126 into space 132. As shown in Figure 7, the substrate robot loading arm 135 includes a first articulated arm 137 connected to a second articulated arm 139. The substrate robot loading arm 135 further includes a hand 141 connected to the second articulated arm 139. The hand 141 is also known as an end effector. As part of the planarization process, the hand 141 is configured to support and position the substrate 102 in a predetermined position on the substrate stage 106 before dispensing the moldable material 124. However, in the third embodiment, the hand 141 is also configured to pick up and carry the radiation source 126. Therefore, in the third embodiment, the existing structure is used to insert the radiation source 126 by modifying the substrate robot loading arm 135 so that the hand 141 (end effector) carries the radiation source 126. In other words, in the first and second embodiments of Figures 5 and 6, a dedicated arm is used separately from the substrate robot loading arm to carry the radiation source 126, but in the third embodiment of Figure 7, the existing substrate robot loading arm 135 is configured to carry the radiation source 126 in addition to the substrate 102. Once process S208 is completed so that distance D is created and thereby space 132 is provided, the controller 140 can instruct the substrate robot loading arm 135 to pick up the radiation source 126 via the hand 141 and insert the radiation source 126 into space 132. As shown in Figure 7, the substrate robot loading arm 135 carrying the radiation source 126 can move from a position where the radiation source 126 is not in space 132 to a position where the radiation source 126 is inserted into space 132. The substrate robot loading arm 135 can translate and / or rotate along one or more of the x, y, z axes and three tilt axes, as needed, via the first articulated arm 137 and the second articulated arm 139 to reach the insertion position.The substrate robot loading arm 135, the controller 140, and all components that enable the substrate robot loading arm 135 to pick up and position the radiation source 126 in space 132 collectively form a second positioning system. That is, the second positioning system is the structure and control that enables the positioning of the radiation source 126. In an alternative embodiment, the robot loading arm 135 is used not only for the radiation source but also for loading the superstraight 108 into the superstraight chuck 118 and for transporting the radiation source 126, and not for loading the substrate. In an alternative embodiment, the robot loading arm 135 does not transport the radiation source 126 which is integrated into the robot loading arm 135.

[0042] Figures 8A to 9B show a fourth embodiment for inserting the radiation source 126 into space 132. Figure 8A is a schematic cross-sectional view of the fourth embodiment for inserting the radiation source 126, showing the case where the radiation source 126 is in a non-insertion position. Figure 8B is a schematic plan view of the fourth embodiment for inserting the radiation source, showing the case where the radiation source 126 is in a non-insertion position. Figure 9A is a schematic cross-sectional view of the fourth embodiment for inserting the radiation source 126, showing the case where the radiation source 126 is in an insertion position. Figure 9B is a schematic plan view of the fourth embodiment for inserting the radiation source 126, showing the case where the radiation source 126 is in an insertion position.

[0043] In the fourth exemplary embodiment shown in Figures 8A–9B, the radiation source 126 includes two separate components that, when placed together, are the same as the radiation source of the other embodiments. More specifically, the radiation source 126 includes a first body 126a supporting a portion of the LED and a second body 126b supporting another portion of the LED. As best shown in Figure 8B, the first body 126a and the second body 126b are each semicircular in shape and may be the same size. As best shown in Figure 9B, when the respective linear edges of the first body 126a and the second body 126b are brought into contact with each other, they form a complete circle. This completed circle is the same size and shape as the integrated radiation source shown in Figure 2. In alternative embodiments, the radiation source 126 includes three or more components that are subsections of a circle, which are joined together by one or more arms to form a complete circle. For example, the number of components may be two to six.

[0044] The planarization system 100 in the embodiments shown in Figures 8A to 9B further includes a first pivot arm 143 connected to a first body 126a and a second pivot arm 145 connected to a second body 126b. The first pivot arm 143 is coupled to the first body 126a at a first end, while the opposite second end of the first pivot arm 143 is coupled to a pivot point 147. Similarly, the second pivot arm 145 is coupled to the second body 126b at a first end, while the opposite second end of the first pivot arm 145 is coupled to a pivot point 147. By rotating the first pivot arm 143 and the second pivot arm 145 around the pivot point 147, the first pivot arm 143 can move the first body 126a along the arc path 151, while the second pivot arm 145 can move the second body 126b along the arc path 151 (Figure 8B). The first pivot arm 143 and the second pivot arm 145 may be rotated around the pivot point 147 via one or more motors. Preferably, there is a separate motor for each pivot arm.

[0045] As described above, Figures 8A and 8B show the orientation of a fourth exemplary embodiment in which the first body 126a and second body 126b of the radiation source 126 are outside the space 132. Figures 9A and 9B show the orientation of a fourth exemplary embodiment in which the first body 126a and second body 126b of the radiation source 126 are inserted into the space 132. As shown in Figures 8A and 8B, the insertion process begins with the first body 126a and second body 126b positioned in a location where the radiation 126 has not yet been inserted into the space 132. Once process S208 is completed so that distance D is created and thereby space 132 is provided, the controller 140 can instruct the first pivot arm 143 and the second pivot arm 145 to rotate about the pivot point 147 so that the first body 126a and the second body 126b move along the arc path 151 facing each other. The first pivot arm 143, the second pivot arm 145, the motor, the controller 140, and all components that enable the first body 126a and the second body 126b to move along the arc path 151 form a second positioning system. That is, the second positioning system is a structure and control that enables the positioning of the radiation source 126 into space 132. The first pivot arm 143 and the second pivot arm 145 may be controlled by the control device 140 to continue moving the first body 126a and the second body 126b toward each other along the arc path 151 until the first body 126a and the second body 126b (forming the radiation source 126) are fully positioned in space 132.

[0046] As described above, Figures 9A and 9B show the orientation of a fourth exemplary embodiment in which the first body 126a and the second body 126b of the radiation source 126 are completely inside the space 132. As shown in Figure 9A, in the cross-sectional view, each of the first body 126a and the second body 126b is rotated completely around the arc path 151 until their flat edges abut each other. Thus, the first body 126a and the second body 126b together form a completed radiation source 126 that covers the entire surface area of ​​the multilayer structure 111. As shown in Figure 9B, in the plan view, once the first body 126a and the second body 126b forming the radiation source 126 are fully inserted into the space 312, they are located completely below the flattening head 120.

[0047] After step S210 is completed and the radiation source 126 is inserted into space 132, the method then proceeds to step S212, in which the formed film layer 144 is cured while maintaining the distance D between the multilayer structure 111 and the superstraight chuck 118. Figure 4F shows a schematic cross-section of the planarization system 100 at the moment the curing process is initiated while the distance D is maintained. The polymerization process or curing of the moldable material 124 may be initiated with a chemical beam (e.g., UV light). For example, the radiation source 126 provides a chemical beam to cure, solidify, and / or crosslink the moldable material film 144 and define a cured layer 146 on the substrate 102. As described above, the radiation source 126 is oriented so that the center of the light beam is directed downward, i.e., parallel to the Z direction. As shown in Figure 4F, since the radiation source 126 is located between the superstraight chuck 118 and the multilayer structure 111, the UV light does not need to pass through the superstraight chuck 118. The aforementioned non-uniformity problem is avoided by preventing UV light from passing through the superstraight chuck 118. Furthermore, since UV light does not pass through the superstraight chuck 118, the superstraight chuck 118 can be made of a material that is translucent or opaque to UV light.

[0048] As further shown in Figure 4F, the superstraight 108 is configured to be transparent to UV light radiation emitted from the array of LEDs 127 of the radiation source 126, so that the UV light radiation passes through the superstraight 108 and acts on the moldable material film 144, curing the moldable material film 144, and as a result a cured layer 146 is obtained.

[0049] Figure 4G shows a schematic cross-section of the planarization system 100 at the moment the curing process is completed. As shown in Figure 4G, once the curing process is complete, the moldable material film 144 has become a cured layer 146. Similarly, the multilayer structure 111 has become a cured multilayer structure 113. The cured multilayer structure 113 differs from the multilayer structure 111 in that the multilayer structure 111 includes a moldable material film 144 between the top plate 108 and the substrate 102, while the cured multilayer structure 113 includes a cured layer 146 between the top plate 108 and the substrate 102. In other words, the cured multilayer structure 113 includes, or consists of, the top plate 108, the cured layer 146, and the substrate 102 in this order. In another embodiment, the cured multilayer structure 113 can also be considered to include, or consist of, the top plate 108, the cured layer 146, the substrate 102, and the substrate chuck 104 in this order.

[0050] After curing is completed in step S212, the method proceeds to step S214, in which the radiation source 126 is retracted from space 132. Figure 4H shows a schematic cross-section of the planarization system 100 at the moment the radiation source 126 is retracted from space 132 while distance D still exists. To remove the radiation source 126 from space 132, insertion step S210 is reversed. That is, the steps described above for each of the embodiments shown in Figures 5 to 9B are reversed to retract the radiation source 126.

[0051] As shown in Figure 5, the retraction step for the first embodiment involves moving the arm 134 in the opposite direction 160 to direction 148 using the second positioning system. As shown in Figure 6, the retraction step for the second embodiment involves rotating the arm 134 in the opposite direction 162 to direction 150 using the second positioning system. As shown in Figure 7, the retraction step for the third embodiment involves moving the substrate robot mounting arm 135 from the insertion position via the first articulated arm 137 and the second articulated arm 139 using the second positioning system and returning it to the starting position. The retraction step of the fourth exemplary embodiment involves using a second positioning system to rotate the first swivel arm 143 and the second swivel arm 145 around a swivel point 147 opposite to the insertion rotation, so that the first body 126a moves along an arc path 151 opposite to the direction of the insertion step, and the second body 126b moves along the arc path 151 opposite to the direction of the insertion step until the first body 126a and the second body 126b return to the orientation shown in Figures 8A and 8B.

[0052] After the radiation source is removed from space 132, the planarization method 200 proceeds to the next step S216, where the superstraight 108 is separated from the hardened layer 146. To separate the superstraight 108 from the hardened layer 146, the superstraight chuck 118 is re-joined to the superstraight 108 via the operation of the planarization head 120 (i.e., re-chucks the superstraight 108), while the superstraight 108 is still in contact with the hardened layer 146. Figure 4I shows a schematic cross-section of the planarization system 100 at the moment the superstraight chuck 118 is re-joined to the superstraight 108. To join the superstraight chuck 118 to the superstraight 108, a positioning system is used to move at least one of the planarization head 120 and the stage 106 in the Z direction until the superstraight chuck 118 is in contact with the superstraight 108. Preferably, only one of the planarization head 120 and the stage 106 is moved in the Z direction using the positioning system, while the other remains stationary. In a preferred embodiment, the flattening head 120 moves downward in the Z direction while the stage 106 remains stationary. However, in some cases, both can be moved.

[0053] Once the superstraight 108 is coupled to the superstraight chuck 118 (Figure 4I), the superstraight chuck 118 can begin to lift upward from the substrate 102 by using the positioning system to move the planarization head 120 upward or by using the positioning system to move the stage 106 downward in the Z direction. As described above, both may be moved. Since the superstraight 108 is coupled to the superstraight chuck 118, the lifting force (or lowering force) will separate the superstraight 108 from the cured layer 146.

[0054] Figure 4J shows a schematic cross-section of the planarization system 100 at the moment after the superstraight 108 has separated from the cured layer 146. As shown in Figure 5J, at this point the superstraight 108 is again in the starting position shown in Figure 1, while the cured layer 146 is exposed on the substrate 102. The substrate 102 and the cured layer 146 can then undergo additional known steps and processes for device (article) manufacturing, including, for example, patterning, curing, oxidation, layering, deposition, doping, planarization, etching, moldable material removal, dicing, bonding, and packaging. The substrate 102 may be processed to manufacture multiple articles (devices). These additional steps can be performed by unloading the substrate 102 with the exposed cured layer 146 from the housing 114 to a separate location. Once the substrate 102 with the exposed cured layer 146 has been unloaded, the planarization system 100 is ready to receive a new substrate with moldable material and repeat the above process.

[0055] Further modifications and alternative embodiments of various aspects will be apparent to those skilled in the art upon consideration of this description. Therefore, this description should be interpreted as illustrative only. It should be understood that the forms shown and described herein should be interpreted as examples of embodiments. Elements and materials can be replaced with those illustrated and described herein, parts and processes can be reversed, and certain features can be utilized independently, all of which will be apparent to those skilled in the art after benefiting from this description.

Claims

1. A planaring method for planaring a moldable material on a substrate using a planaring apparatus having a chuck for holding a super straight, A step of applying the moldable material onto the substrate, A step of bringing the superstraight held by the chuck into contact with the moldable material on the substrate to form a multilayer structure including the superstraight, a film of the moldable material, and the substrate, The steps include releasing the multilayer structure from the chuck and creating a space between the chuck and the multilayer structure, The steps include: positioning a light source within the aforementioned space; A step of curing the film by exposing the multilayer film to light emitted from the light source, It has, The planarizing apparatus is A first body supporting a first array of light-emitting diodes as the light source, A second body supporting a second array of light-emitting diodes as the light source, A rotation axis extending in the height direction of the space at a position outside the space, A first arm, one end of which is connected to the rotation shaft and the other end of which is connected to the first body, It has a second arm, one end of which is connected to the rotation axis and the other end of which is connected to the second body, The step of positioning the light source within the space is: The process includes rotating the first arm and the second arm around the rotation axis, starting from a state where the angle between the first arm and the second arm is a first angle that positions the first body and the second body outside the space, to a state where the angle between the first arm and the second arm is a second angle that positions the first body and the second body inside the space. A method for flattening, characterized by the following features.

2. The flattening method according to claim 1, characterized in that the step of providing the space includes a step of moving at least one of the chuck and the multilayer structure so that a distance is provided between the chuck and the multilayer structure.

3. The planarization method according to claim 2, characterized in that the aforementioned distance is 30 mm to 150 mm.

4. The planarization method according to claim 2, characterized in that the ratio of the distance to the thickness of the light source is 1.4:1 to 1.6:

1.

5. The planarization method according to claim 1, further comprising the step of retracting the light source from the space by rotating the first arm and the second arm around the rotation axis, respectively, after the hardening step, so that the angle between the first arm and the second arm becomes the first angle.

6. The planarization method according to claim 5, further comprising the step of moving at least one of the chuck and the multilayer structure so that the chuck comes into contact with the superstraight after the step of retracting the light source.

7. The planarization method according to claim 5, further comprising the step of separating the superstraight from the hardened film after the step of retracting the light source.

8. The planarization method according to claim 1, characterized in that the light-emitting diode is configured to emit the light downward toward the multilayer structure.

9. The planarization method according to claim 1, characterized in that the chuck is semi-transparent or opaque to ultraviolet light.

10. The planarization method according to claim 1, characterized in that the chuck is transparent to ultraviolet light.

11. A planarization system, A circuit board chuck that holds the circuit board, Super Straight Chuck, who holds Super Straight, It has, The Super Straight is brought into contact with the moldable material coated on the substrate to form a multilayer structure including the Super Straight, a film of the moldable material, and the substrate. The multilayer structure is released from the super straight chuck, a space is created between the super straight chuck and the multilayer structure, and the light source is moved into the space. The film is configured to be cured by exposing the multilayer film to light emitted from the light source, A first body supporting a first array of light-emitting diodes as the light source, A second body supporting a second array of light-emitting diodes as the light source, A rotation axis extending in the height direction of the space at a position outside the space, A first arm, one end of which is connected to the rotation shaft and the other end of which is connected to the first body, The present invention further comprises a second arm, one end of which is connected to the rotation axis and the other end of which is connected to the second body, The light source is moved into the space by rotating the first arm and the second arm around the rotation axis, starting from a state where the angle between the first arm and the second arm is a first angle that positions the first body and the second body outside the space, to a state where the angle between the first arm and the second arm is a second angle that positions the first body and the second body inside the space. A planarization system characterized by the following features.

12. A step of planarizing a moldable material coated on a substrate using the planarization method described in any one of claims 1 to 10, A step of processing the substrate that has been flattened in the planarization step, It has, A method for manufacturing an article, characterized by manufacturing an article from the substrate processed in the aforementioned processing step.

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