Circuit board cleaning apparatus and circuit board cleaning method

Abstract

To provide a board cleaning device and a board cleaning method with which it is possible to reduce down time due to replacement of a cleaning brush.SOLUTION: A board cleaning device 100 comprises: a board rotating-holding unit that holds a board W while rotating; a first cleaning brush that has a first cleaning surface that is inclined so as to be capable of contacting a first bevel region of the board W being held to the board rotating-holding unit; a first drive unit that is constituted so as to move the first cleaning brush between a first contact state in which the first cleaning surface contacts the first bevel region of the board being rotated by the board rotating-holding unit and a first separate state in which the first cleaning surface separates from the first bevel region of the board being rotated by the board rotating-holding unit; and a control unit 60 that, when a predetermined first condition is satisfied, controls the first drive unit so that a contact position of the first cleaning surface with respect to the first bevel region in the first contact state is changed.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a substrate cleaning apparatus and a substrate cleaning method.

Background Art

[0002] In a substrate processing apparatus, a substrate having bevel portions at the peripheries on the upper and lower surfaces may be the object of processing. For example, when performing an exposure process on a substrate with the bevel portion of the substrate contaminated, the exposure stage will be contaminated. Also, in an immersion exposure apparatus that performs exposure using an immersion liquid, when performing exposure with the bevel portion of the substrate contaminated, the lens of the exposure apparatus will be contaminated, and there is a possibility that dimensional defects and shape defects of the exposure pattern will occur. Therefore, for example, as described in Patent Document 1, a substrate cleaning apparatus having a cleaning brush for cleaning the bevel portion is used. Also, various film forming processes are performed on the substrate, and the bevel portion of the substrate may be contaminated during the film forming process.

[0003] The cleaning brush described in Patent Document 1 has a shape that is rotationally symmetric with respect to a vertical axis and includes a lower bevel cleaning surface and an upper bevel cleaning surface. In cleaning the bevel portion of the substrate, the lower bevel cleaning surface of the cleaning brush contacts the bevel portion of the lower surface of the substrate held and rotated by the spin chuck. Similarly, the upper bevel cleaning surface of the cleaning brush contacts the bevel portion of the upper surface of the rotating substrate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, continuous use of the cleaning brush can cause wear grooves to form on the bevel surface due to friction between the bevel of the substrate and the cleaning brush's bevel surface. Furthermore, the cleaning brush's bevel surface can become contaminated. Therefore, it is necessary to replace the cleaning brush periodically. The cleaning brush replacement process involves removing the old brush, replacing it, teaching the new brush, starting up the new brush, and monitoring its operation. This results in significant downtime in the operation of the substrate processing equipment. In recent years, with the increase in device production volume, there has been a growing demand to reduce downtime in substrate processing.

[0006] The object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method that can reduce downtime by replacing the cleaning brush. [Means for solving the problem]

[0007] (1) A substrate cleaning apparatus according to one aspect of the present invention is a substrate cleaning apparatus for cleaning a substrate having a first main surface and a first bevel region on the peripheral edge of the first main surface, comprising: a substrate rotating and holding unit for rotating the substrate while holding it; a first cleaning brush having a first cleaning surface inclined to be able to contact the first bevel region of the substrate held by the substrate rotating and holding unit; a first drive unit configured to move the first cleaning brush between a first contact state in which the first cleaning surface is in contact with the first bevel region of the substrate rotated by the substrate rotating and holding unit and a first separated state in which the first cleaning surface is separated from the first bevel region of the substrate rotated by the substrate rotating and holding unit; and when a predetermined first condition is met, the contact position of the first cleaning surface with respect to the first bevel region in the first contact state is Higher contact position A control unit that controls the first drive unit so that it is modified and , a display unit that displays various information related to the cleaning of the circuit board Equipped with, The control unit stores the number of contact positions of the first cleaning brush, and each time a predetermined first condition is met, it determines whether the contact position can be changed based on the number of contact positions stored. If it determines that the contact position can be changed, it controls the first drive unit to change the contact position of the first cleaning surface with respect to the first bevel area to a higher contact position. If it determines that the contact position cannot be changed, it causes the display unit to indicate that it is time to replace the first cleaning brush. .

[0008] (2) A substrate cleaning method according to another aspect of the present invention is a substrate cleaning method for cleaning a substrate having a main surface and a bevel region on the peripheral edge of the main surface, comprising the steps of sequentially performing for multiple substrates one of the multiple substrates by holding and rotating one of the multiple substrates with a substrate rotation holding unit and bringing the inclined cleaning surface of a cleaning brush into contact with the bevel region of the one substrate with a drive unit, and when predetermined conditions are met, the contact position of the cleaning surface with respect to the bevel region Higher contact position The steps of controlling the drive unit so that it is modified and The steps include displaying various information regarding the cleaning of the circuit board on the display unit. Includes, The step of controlling the drive unit involves storing the number of contact positions of the cleaning brush, and each time a predetermined condition is met, determining whether the contact position can be changed based on the number of stored contact positions. If it is determined that the contact position can be changed, the drive unit is controlled to change the contact position of the cleaning surface with respect to the bevel area to a higher contact position. The step of displaying on the display unit involves indicating that it is time to replace the cleaning brush if it is determined in the step of controlling the drive unit that the contact position cannot be changed. . [Effects of the Invention]

[0009] According to the present invention, downtime due to the replacement of cleaning brushes can be reduced. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic side view of a substrate cleaning apparatus according to one embodiment of the present invention. [Figure 2] This is a schematic cross-sectional view illustrating the shape of the peripheral edge of the substrate. [Figure 3] This figure shows the condition of the substrate and cleaning brush during cleaning of the peripheral edges of the substrate. [Figure 4] This figure shows the condition of the substrate and cleaning brush during cleaning of the peripheral edges of the substrate. [Figure 5] This figure shows examples of changing the contact position of the cleaning brush during cleaning. [Figure 6] This is a flowchart illustrating an example of the operation of the circuit board cleaning device 100. [Figure 7] This is a schematic side view of a substrate cleaning apparatus according to another embodiment. [Figure 8] This figure shows examples of cleaning a substrate with multiple cleaning brushes. [Modes for carrying out the invention]

[0011] Hereinafter, a substrate cleaning apparatus and a substrate cleaning method according to one embodiment of the present invention will be described in detail with reference to the drawings. In the following description, "substrate" refers to semiconductor substrates (semiconductor wafers), FPD (Flat Panel Display) substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, or solar cell substrates. Furthermore, the substrates described below have a circular shape in plan view, excluding the notch formation portion.

[0012] (1) Circuit board cleaning device Figure 1 is a schematic side view of a substrate cleaning apparatus 100 according to one embodiment of the present invention. As shown in Figure 1, the substrate cleaning apparatus 100 comprises a spin chuck 10, a cleaning brush 20, an arm 30, an arm drive unit 40, a brush rotation drive unit 50, a control unit 60, and a display unit 70.

[0013] In the substrate cleaning apparatus 100, a transport robot (not shown) loads and unloads the substrate W into and out of the apparatus 100. The spin chuck 10 includes a holding section 11 and a chuck rotation drive section 12. The substrate W loaded by the transport robot is placed on the holding section 11. The holding section 11 has a plurality of intake passages (not shown), and when the intake passages are exhausted, the lower surface of the substrate W is vacuum-adhered to the holding section 11. As a result, the holding section 11 holds the substrate W in a horizontal position. The chuck rotation drive section 12 is connected to the holding section 11 via a connecting member. The chuck rotation drive section 12 includes, for example, an electric motor and is configured to rotate the holding section 11. As a result, the substrate W held in a horizontal position by the holding section 11 rotates.

[0014] In the vicinity of the holding unit 11, lower surface cleaning nozzles 13 and 14 are provided respectively, and supply cleaning liquid toward the lower surface of the substrate W held in a horizontal posture. Above the holding unit 11, an upper surface cleaning nozzle 15 is provided, and supplies cleaning liquid toward the upper surface of the substrate W held in a horizontal posture. The cleaning liquid discharged from the lower surface cleaning nozzles 13 and 14 and the upper surface cleaning nozzle 15 spreads outward by the centrifugal force caused by the rotation of the substrate W.

[0015] Outside the spin chuck 10, a cleaning brush 20 supported by an arm 30 is arranged. Details of the cleaning brush 20 will be described later. The arm drive unit 40 includes, for example, an actuator, and is configured to be able to move the cleaning brush 20 supported by the arm 30 three-dimensionally. The brush rotation drive unit 50 includes, for example, an electric motor, and is configured to be able to rotate the cleaning brush 20 supported by the arm 30 around an axis in the vertical direction. In the present embodiment, the brush rotation drive unit 50 rotates the cleaning brush 20 in a direction opposite to the direction in which the substrate W held by the holding unit 11 rotates. In this state, the arm drive unit 40 moves the cleaning brush 20 in the horizontal direction. Thereby, the peripheral edge of the substrate W is cleaned by the contact between the cleaning brush 20 and the peripheral edge of the rotating substrate W.

[0016] The control unit 60 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), a storage device, and the like. The control unit 60 controls the operations of the spin chuck 10 and the arm drive unit 40. Details of the control unit 60 will be described later. Various information regarding the cleaning of the substrate W is displayed on the display unit 70.

[0017] FIG. 2 is a schematic cross-sectional view for explaining the shape of the peripheral portion of the substrate W. The peripheral portion of the substrate W carried into the substrate cleaning apparatus 100 of the present embodiment includes an annular bevel portion R. The bevel portion R includes an annular bevel region A that slopes so as to be continuously connected to the upper surface WU of the substrate W and an annular bevel region B that slopes so as to be continuously connected to the lower surface WD of the substrate W. The inclination angle θ1 of the bevel region A with respect to the vertical axis is substantially equal to the inclination angle θ2 of the bevel region B with respect to the vertical axis. The length in the width direction (length in the vertical cross-section) of the bevel region A is set to LA1, and the length in the width direction (length in the vertical cross-section) of the bevel region B is set to LB1.

[0018] FIGS. 3 and 4 are views showing the states of the substrate W and the cleaning brush 20 during cleaning of the peripheral portion of the substrate W. The cleaning brush 20 includes a cleaning surface 21, a cleaning surface 22, and a connecting surface 23. The connecting surface 23 is a cylindrical surface having a vertical axis. The cleaning brush 20 is formed of, for example, polyvinyl alcohol (PVA), but the material of the cleaning brush 20 is not limited to this, and other resin materials or ceramic materials can be used.

[0019] As shown in FIG. 3, the cleaning surface 21 has a tapered shape that slopes outward and obliquely upward from the upper end of the connecting surface 23. The inclination angle θ3 of the cleaning surface 21 of the cleaning brush 20 with respect to the vertical axis is set to be substantially equal to the inclination angle θ1 of the bevel region A of the substrate W. Thereby, it becomes possible to bring the bevel region A of length LA1 of the substrate W into contact with the cleaning surface 21 of the cleaning brush 20. When cleaning the bevel region A of the bevel portion R of the substrate W, the height of the cleaning brush 20 is adjusted by the arm driving unit 40 to a height at which the cleaning surface 21 of the cleaning brush 20 can contact the bevel region A of the substrate W. Thereafter, when the cleaning brush 20 moves horizontally from the outside of the substrate W, the cleaning surface 21 of the cleaning brush 20 contacts the bevel region A of the substrate W. Thereby, the bevel region A of the substrate W is cleaned.

[0020] As shown in Figure 4, the cleaning surface 22 has a tapered shape that extends outward and diagonally downward from the lower end of the connecting surface 23. The inclination angle θ4 of the cleaning surface 22 of the cleaning brush 20 with respect to the vertical axis is set to be substantially equal to the inclination angle θ2 of the bevel region B of the substrate W. This makes it possible to bring the cleaning surface 22 of the cleaning brush 20 into contact with the bevel region B of the substrate W, which has a length LB1. When cleaning the bevel region B of the bevel portion R of the substrate W, the height of the cleaning brush 20 is adjusted by the arm drive unit 40 to a height at which the cleaning surface 22 of the cleaning brush 20 can contact the bevel region B of the substrate W. Then, as the cleaning brush 20 moves horizontally from the outside of the substrate W, the cleaning surface 22 of the cleaning brush 20 comes into contact with the bevel region B of the substrate W. As a result, the bevel region B of the substrate W is cleaned.

[0021] Here, if the cleaning surface 21 of the cleaning brush 20 repeatedly cleans the bevel region A of the substrate W, the contact position of the cleaning surface 21 with respect to the bevel region A becomes contaminated or worn. Similarly, if the cleaning surface 22 of the cleaning brush 20 repeatedly cleans the bevel region B of the substrate W, the contact position of the cleaning surface 22 with respect to the bevel region B becomes contaminated or worn. If the contamination on the cleaning surface 21 or the cleaning surface 22 is not removed by cleaning, or if grooves are formed on the cleaning surface 21 or the cleaning surface 22 due to wear, it is determined that the cleaning brush 20 has reached the end of its lifespan and needs to be replaced. In the operation example described later, it is possible to extend the lifespan of the cleaning brush 20.

[0022] (2) Operation of the circuit board cleaning device 100 As described above, the control unit 60 controls the operation of the arm drive unit 40. Specifically, when cleaning the bevel region A of the bevel portion R of the substrate W, the control unit 60 controls the arm drive unit 40 so that the contact position of the cleaning surface 21 of the cleaning brush 20 with respect to the bevel region A of the substrate W is changed when a predetermined first condition is met. Similarly, when cleaning the bevel region B of the bevel portion R of the substrate W, the control unit 60 controls the arm drive unit 40 so that the contact position of the cleaning surface 22 of the cleaning brush 20 with respect to the bevel region B of the substrate W is changed when a predetermined second condition is met.

[0023] The first and second conditions described above mean that the first and second factors related to contamination or wear of the cleaning surfaces 21 and 22, which may occur due to contact between the cleaning surfaces 21 and 22 and bevel regions A and B, have reached predetermined judgment values. The first and second factors may include the number of substrates W cleaned by the cleaning surfaces 21 and 22, the cleaning force of the cleaning surfaces 21 and 22 on bevel regions A and B (e.g., the pressure applied by the cleaning surfaces 21 and 22 on the substrates W on bevel regions A and B), or the cleaning time of bevel regions A and B by the cleaning surfaces 21 and 22. Alternatively, the first and second factors may include multiple of these factors. For example, the first and second factors may be the number of substrates W cleaned by the cleaning surfaces 21 and 22. In this case, the judgment value may be determined according to the cleaning force of the cleaning surfaces 21 and 22. Specifically, if the cleaning force is large, the judgment value is set to be small, and if the cleaning force is small, the judgment value is set to be large.

[0024] In this embodiment, the first and second factors are the number of substrates W cleaned by the cleaning surfaces 21 and 22. In other words, the first and second conditions are whether or not the number of substrates W cleaned by the cleaning surfaces 21 and 22 has reached a determination value. The determination value is, for example, 1000, but is not limited to this.

[0025] Figure 5 shows an example of changing the contact position of the cleaning brush 20 during cleaning. Figure 6 is a flowchart showing an example of the operation of the substrate cleaning apparatus 100. As shown in Figure 5, multiple positions corresponding to the length LA1 of the bevel region A are set on the cleaning surface 21, and multiple positions corresponding to the length LB1 of the bevel region B are set on the cleaning surface 22. In the example in Figure 5, contact positions la1, la2, la3 are set on the cleaning surface 21 from below in this order, and contact positions lb1, lb2, lb3 are set on the cleaning surface 22 from below in this order. Each of the contact positions la1, la2, la3 is a position in a region having a length of LA1 or more of the bevel region A. Each of the contact positions lb1, lb2, lb3 is a position in a region having a length of LB1 or more of the bevel region B.

[0026] In this embodiment, the contact position of the cleaning surface 21 of the cleaning brush 20 with respect to the bevel region A of the substrate W is changed from bottom to top in the order of contact positions la1, la2, la3. Similarly, the contact position of the cleaning surface 22 of the cleaning brush 20 with respect to the bevel region B of the substrate W is changed from bottom to top in the order of contact positions lb1, lb2, lb3. The number of contact positions on the cleaning surfaces 21 and 22 is determined according to the type of cleaning brush 20. In this embodiment, the number of contact positions on the cleaning surfaces 21 and 22 depending on the type of cleaning brush 20 is stored in advance in the control unit 60.

[0027] First, the control unit 60 obtains the number of contact positions k (where k is an integer of 2 or more) on each of the pre-stored cleaning surfaces 21 and 22 (step S1 in Figure 6). Next, the control unit 60 sets the variable n to 1 (step S2). The spin chuck 10 in Figure 1 holds the loaded substrate W. Next, the arm drive unit 40 adjusts the height of the cleaning brush 20 so that the bevel region B of the substrate W can contact the contact position lbn set on the cleaning surface 22 (step S3). At this point, cleaning liquid is supplied to the underside of the substrate W by the underside cleaning nozzles 13 and 14. In this state, the arm drive unit 40 moves the cleaning brush 20 in the horizontal plane so that the contact position lbn on the cleaning surface 22 and the bevel region B of the substrate W come into contact. As a result, the cleaning brush 20 cleans the bevel region B of the substrate W at the contact position lbn on the cleaning surface 22 (step S4).

[0028] Next, the arm drive unit 40 adjusts the height of the cleaning brush 20 so that the bevel region A of the substrate W can come into contact with the contact position lan set on the cleaning surface 21 (step S5). At this point, the upper cleaning nozzle 15 supplies cleaning fluid to the upper surface of the substrate W. In this state, the arm drive unit 40 moves the cleaning brush 20 in the horizontal plane so that the contact position lan on the cleaning surface 21 comes into contact with the bevel region A of the substrate W. As a result, the cleaning brush 20 cleans the bevel region A of the substrate W at the contact position lan on the cleaning surface 21 (step S6).

[0029] Subsequently, after various processes, the spin chuck 10 releases the substrate W, and the substrate W is discharged by the transport robot. The control unit 60 determines whether the number of substrates W cleaned at contact positions lbn and lan of the cleaning surfaces 21 and 22 has reached a predetermined number (step S8). If the number of substrates W cleaned at contact positions lbn and lan has not reached a predetermined number, the control unit 60 returns to step S3. As a result, cleaning is performed on the other substrates W.

[0030] When the number of substrates W cleaned at contact positions lbn and lan reaches a predetermined number, the control unit 60 adds 1 to the variable n (step S9). Here, the control unit 60 determines whether the variable n is greater than the number of contact positions k on each of the cleaning surfaces 21 and 22 (step S10). If the variable n is less than or equal to the number of contact positions k, the control unit 60 returns to step S3. As a result, the bevel regions A and B of the substrate W are cleaned at the next contact positions lbn and lan (in this embodiment, contact positions higher than before the change) on the cleaning surfaces 21 and 22 of the cleaning brush 20. If the variable n is greater than the number of contact positions k, the control unit 60 causes the display unit 70 to indicate that it is time to replace the cleaning brush 20 (step S11).

[0031] (3) Effects of the embodiment According to the substrate cleaning apparatus 100 of the above embodiment, when the number of substrates W cleaned at each contact position on the cleaning surfaces 21 and 22 reaches a predetermined value, the contact positions of the cleaning surfaces 21 and 22 with respect to the bevel regions A and B are changed. In this case, the bevel regions A and B can be cleaned in areas of the cleaning surfaces 21 and 22 that are not contaminated or worn. This improves the lifespan of the cleaning brush 20. As a result, it becomes possible to reduce the frequency of replacement of the cleaning brush 20 within the substrate cleaning apparatus 100.

[0032] Furthermore, the contact positions of the cleaning surfaces 21 and 22 of the cleaning brush 20 with respect to the bevel regions A and B of the substrate W are changed from downward to upward. This prevents contaminants or particles generated by abrasion from falling onto the substrate W in contact with the new contact position, even if they adhere to the previous contact position. Therefore, it becomes possible to thoroughly clean the bevel regions A and B.

[0033] The contact position of the cleaning surfaces 21 and 22 of the cleaning brush 20 with respect to the bevel regions A and B of the substrate W is changed based on whether the number of substrates W cleaned by the cleaning surfaces 21 and 22 has reached a predetermined value. This allows the contact area of ​​the cleaning surfaces 21 and 22 to be changed before the cleaning of bevel regions A and B becomes insufficient, depending on the degree of contamination or wear of the cleaning surfaces 21 and 22. As a result, it becomes possible to maintain a constant cleaning capacity of bevel regions A and B by the cleaning surfaces 21 and 22 over a long period of time.

[0034] (4) Other embodiments (4-1) In the above embodiment, the bevel regions A and B of the substrate W are cleaned by a single cleaning brush 20, but the present invention is not limited thereto. Figure 7 is a schematic side view of a substrate cleaning apparatus 100a according to another embodiment. As shown in Figure 7, the substrate cleaning apparatus 100a further comprises a cleaning brush 20a, an arm 30a, an arm drive unit 40a, and a brush rotation drive unit 50a. In the example of Figure 7, the cleaning brush 20a is provided so as to face the cleaning brush 20 with the substrate W in between. The configuration of the cleaning brush 20a is the same as that of the cleaning brush 20. The cleaning brush 20a, like the cleaning brush 20, includes cleaning surfaces 21a and 22a corresponding to the inclination of the bevel regions A and B of the substrate W. Furthermore, the operation of the cleaning brush 20a, arm 30a, arm drive unit 40a, and brush rotation drive unit 50a is the same as the operation of the cleaning brush 20, arm 30, arm drive unit 40, and brush rotation drive unit 50 of the substrate cleaning apparatus 100 in Figure 1.

[0035] Figure 8 shows an example of cleaning a substrate W with multiple cleaning brushes 20, 20a. When a predetermined third condition is met, the contact position of the cleaning surface 21a of the cleaning brush 20a with respect to the bevel region A of the substrate W is changed from below to above. When a predetermined fourth condition is met, the contact position of the cleaning surface 22a of the cleaning brush 20a with respect to the second bevel region B of the substrate W is changed from below to above. The third and fourth conditions are set in the same way as the first and second conditions. In this example, the third and fourth conditions are that the number of substrates W cleaned at each contact position on the cleaning surfaces 21a, 22a reaches a predetermined judgment value. The third and fourth conditions may also be that the cleaning time at each contact position on the cleaning surfaces 21a, 22a reaches a judgment value. Alternatively, the judgment values ​​corresponding to the third and fourth conditions may be set based on the cleaning force of the cleaning surfaces 21, 22 with respect to the bevel regions A, B.

[0036] As shown in Figure 8, in this example, when bevel region B is being cleaned by the cleaning surface 22 of cleaning brush 20, bevel region A is being cleaned by the cleaning surface 21a of cleaning brush 20a. Also, when bevel region A is being cleaned by the cleaning surface 21 of cleaning brush 20, bevel region B is being cleaned by the cleaning surface 22a of cleaning brush 20a. This makes it possible to clean bevel regions A and B of the substrate W in a short amount of time.

[0037] In the substrate cleaning apparatus 100a shown in Figure 7, when the bevel region B is being cleaned by the cleaning surface 22 of the cleaning brush 20, the bevel region B may be supplementarily cleaned by the cleaning surface 22a of the cleaning brush 20a, and when the bevel region A is being cleaned by the cleaning surface 21 of the cleaning brush 20, the bevel region A may be supplementarily cleaned by the cleaning surface 21a of the cleaning brush 20a. This makes it possible to improve the cleanliness of the bevel regions A and B of the substrate W in a short time.

[0038] Furthermore, for cleaning the bevel regions A and B of the substrate W, either cleaning brush 20 or 20a may be used, or the other cleaning brush 20 or 20a may be used after the replacement period for one of the cleaning brushes 20 or 20a has arrived. This makes it possible to significantly reduce downtime due to the replacement of cleaning brushes 20 or 20a.

[0039] (4-2) In the above embodiment, the cleaning brushes 20 and 20a include cleaning surfaces 21 and 22 corresponding to bevel regions A and B of the substrate W, but the present invention is not limited thereto. The cleaning brush 20 may have only a cleaning surface corresponding to either bevel region A or B of the substrate W. Similarly, the cleaning brush 20a may have only a cleaning surface corresponding to either bevel region A or B of the substrate W.

[0040] (4-3) In the above embodiment, the first and second conditions are set to the same conditions, but the present invention is not limited thereto. The first and second conditions may be set to different conditions. Similarly, the third and fourth conditions may be set to different conditions. Furthermore, the first to fourth conditions may be set to different conditions.

[0041] (5) Correspondence between each component of the claim and each part of the embodiment The following describes an example of the correspondence between each component of the claim and each component of the embodiment. In the above embodiment, either the upper surface WU or the lower surface WD of the substrate W is an example of the first main surface, the other of the upper surface WU and the lower surface WD of the substrate W is an example of the second main surface, the spin chuck 10 is an example of the substrate rotation holding unit, the cleaning brush 20 is an example of the first cleaning brush, and the arm drive unit 40 is an example of the first drive unit. Also, either the cleaning surface 21 or 22 is an example of the first cleaning surface, the other of the cleaning surfaces 21 or 22 is an example of the second cleaning surface, and cleaning surface 21a, 22a Either one of them is an example of a third cleaning surface, cleaning surface 21a, 22a The other side is an example of a fourth cleaning surface. Also, the cleaning brush 20a is an example of a second cleaning brush, and the arm drive unit 40a is an example of a second drive unit.

[0042] (6) Summary of the Embodiments (Article 1) A substrate cleaning apparatus according to one embodiment is a substrate cleaning apparatus that cleans a substrate having a first main surface and a first bevel region on the peripheral edge of the first main surface, A substrate rotation and holding unit that rotates the substrate while holding it, A first cleaning brush having a first cleaning surface inclined to be in contact with the first bevel region of the substrate held by the substrate rotation holding unit, A first drive unit is configured to move the first cleaning brush from a first contact state in which the first cleaning surface is in contact with the first bevel region of the substrate rotated by the substrate rotation holding unit, to a first separation state in which the first cleaning surface is separated from the first bevel region of the substrate rotated by the substrate rotation holding unit, The system includes a control unit that controls the first drive unit so that the contact position of the first cleaning surface with respect to the first bevel region in the first contact state is changed when a predetermined first condition is met.

[0043] According to the substrate cleaning apparatus described in paragraph 1, the first cleaning brush is moved from a first contact state to a first separated state by a first drive unit. In the first contact state, the first cleaning surface of the first cleaning brush comes into contact with the first bevel region of the rotating substrate. As a result, the first bevel region of the substrate is cleaned. When the cleaning of the first bevel region by the first cleaning surface is repeated, the contact position of the first cleaning surface with respect to the first bevel region becomes contaminated or worn.

[0044] According to the above configuration, when a predetermined first condition is met, the contact position of the first cleaning surface with respect to the first bevel region in the first contact state is changed. In this case, the first bevel region can be cleaned in areas of the cleaning surface that are not contaminated or worn. This improves the lifespan of the first cleaning brush, thereby reducing the frequency of replacement of the first cleaning brush. As a result, downtime due to the replacement of the first cleaning brush can be reduced.

[0045] (Section 2) In the substrate cleaning apparatus described in Section 1, the control unit may, when the first condition is met, control the first drive unit such that the modified contact position of the first cleaning surface with respect to the first bevel region is higher than the contact position of the first cleaning surface with respect to the first bevel region before modification.

[0046] According to the substrate cleaning apparatus described in paragraph 2, even if contaminants or particles generated by abrasion adhere to the contact position of the first cleaning surface before the change, it is prevented that the contaminants or particles fall onto the substrate that comes into contact with the changed contact position of the first cleaning surface after the change. As a result, the changed contact position can be kept clean after the contact position of the first cleaning surface has been changed. Therefore, the first bevel region of the substrate can be cleaned thoroughly.

[0047] (3) In the substrate cleaning apparatus described in paragraph 1 or 2, the first condition may include that a first factor related to contamination or wear of the first cleaning surface that may occur as a result of contact between the first cleaning surface and the first bevel region has reached a predetermined value.

[0048] According to the substrate cleaning apparatus described in paragraph 3, the contact position of the first cleaning surface is changed based on a first factor related to contamination or wear of the first cleaning surface. This makes it possible to change the contact area of ​​the first cleaning surface before the cleaning of the first bevel area becomes insufficient due to contamination or wear of the contact position of the first cleaning surface. This makes it possible to maintain the cleaning capability of the first cleaning surface for the first bevel area.

[0049] (Clause 4) In the substrate cleaning apparatus described in paragraph 3, the first factor may include at least one of the number of substrates cleaned by the first cleaning surface, the cleaning force of the first cleaning surface on the first bevel region, and the cleaning time of the first bevel region by the first cleaning surface.

[0050] According to the substrate cleaning apparatus described in paragraph 4, the contact position of the first cleaning surface is changed based on the number of substrates cleaned by the first cleaning surface, the cleaning force of the first cleaning surface on the first bevel area, or the cleaning time of the first bevel area by the first cleaning surface. This allows the contact area of ​​the first cleaning surface to be changed before the cleaning of the first bevel area becomes insufficient, depending on the degree of contamination or wear of the first cleaning surface. As a result, it becomes possible to maintain a constant cleaning capacity of the first bevel area by the first cleaning surface over a long period of time.

[0051] (Clause 5) In the substrate cleaning apparatus described in Clause 4, the cleaning force of the first cleaning surface against the first bevel region may include the pressing force of the first cleaning surface against the first bevel region.

[0052] According to the substrate cleaning apparatus described in paragraph 5, the contact position of the cleaning surface with respect to the first bevel region can be changed based on the pressing force of the first cleaning surface with respect to the first bevel region. This allows the contact of the first cleaning surface to be changed before grooves caused by wear of the first cleaning surface reduce the cleaning capacity. position This can be changed. As a result, the cleaning ability of the first cleaning surface in the first bevel region can be maintained at a constant level over a longer period of time.

[0053] (Item 6) In the substrate cleaning apparatus described in items 1 to 5, The substrate has a second main surface opposite to the first main surface, and a second bevel region at the periphery of the second main surface. The first cleaning brush has a second cleaning surface that is inclined to be able to contact the second bevel region of the substrate held by the substrate rotation holding part, The first drive unit is configured to move the first cleaning brush between a second contact state in which the second cleaning surface contacts the second bevel region of the substrate rotated by the substrate rotation holding unit, and a second separation state in which the second cleaning surface separates from the second bevel region of the substrate rotated by the substrate rotation holding unit. The control unit may control the first drive unit so that the contact position of the second cleaning surface with respect to the second bevel region in the second contact state is changed when a predetermined second condition is met.

[0054] According to the substrate cleaning apparatus described in Section 6, the first cleaning brush is moved between a second contact state and a second separation state by a second drive unit. In the second contact state, the second cleaning surface of the first cleaning brush comes into contact with the second bevel region of the rotating substrate. As a result, the second bevel region of the substrate is cleaned. If the cleaning of the second bevel region by the second cleaning surface is repeated, the contact position of the second cleaning surface with respect to the second bevel region becomes contaminated or worn.

[0055] According to the above configuration, when a predetermined second condition is met, the contact position of the second cleaning surface with respect to the second bevel region in the second contact state is changed. In this case, the second bevel region can be cleaned in areas of the cleaning surface that are not contaminated or worn. In this case, the lifespan of the first cleaning brush can be improved while cleaning the first and second bevel regions of the substrate, thereby reducing the frequency of replacement of the first cleaning brush. As a result, downtime due to replacement of the first cleaning brush can be reduced.

[0056] (Section 7) In the substrate cleaning apparatus described in Section 6, the control unit, when the second condition is met, the second bevel region 2 The first drive unit may be controlled so that the contact position of the cleaning surface after modification is higher than the contact position of the second cleaning surface with respect to the second bevel region before modification.

[0057] According to the substrate cleaning apparatus described in paragraph 7, even if contaminants or particles generated by abrasion adhere to the contact position of the second cleaning surface before the change, it is prevented that the contaminants or particles will fall to the contact position of the second cleaning surface after the change. 2After changing the contact position of the cleaning surface, the changed contact position can be kept clean. Therefore, the second bevel region of the substrate can be cleaned thoroughly.

[0058] (Clause 8) In the substrate cleaning apparatus described in paragraph 6 or 7, The second condition may include that a second factor related to contamination or wear of the second cleaning surface, which may result from contact of the second cleaning surface with the second bevel region, has reached a predetermined value.

[0059] According to the substrate cleaning apparatus described in paragraph 8, the contact position of the second cleaning surface is changed based on a second factor related to contamination or wear of the second cleaning surface. This makes it possible to change the contact area of ​​the second cleaning surface before the cleaning of the second bevel area becomes insufficient due to contamination or wear of the contact position of the second cleaning surface. This makes it possible to maintain the cleaning capability of the second cleaning surface for the second bevel area.

[0060] (Paragraph 9) The substrate cleaning apparatus described in any one of paragraphs 6 to 8 is: A second cleaning brush having a third cleaning surface inclined to contact the first bevel region of the substrate held by the substrate rotating holder, and a fourth cleaning surface inclined to contact the second bevel region of the substrate held by the substrate rotating holder, The system further comprises a second drive unit configured to move the second cleaning brush from a third contact state in which the third cleaning surface contacts the first bevel region of the substrate rotated by the substrate rotation holding unit, to a third separation state in which the third cleaning surface is separated from the first bevel region of the substrate rotated by the substrate rotation holding unit, and from a fourth contact state in which the fourth cleaning surface contacts the second bevel region of the substrate rotated by the substrate rotation holding unit, to a fourth separation state in which the fourth cleaning surface is separated from the second bevel region of the substrate rotated by the substrate rotation holding unit, The control unit may control the second drive unit such that, when a predetermined third condition is met, the contact position of the third cleaning surface with respect to the first bevel region in the third contact state is changed, and when a predetermined fourth condition is met, the contact position of the fourth cleaning surface with respect to the second bevel region in the fourth contact state is changed.

[0061] According to the substrate cleaning apparatus described in paragraph 9, the first bevel region of the substrate is cleaned by the first cleaning surface of the first cleaning brush, and the second bevel region of the substrate is cleaned by the second cleaning surface of the first cleaning brush. In addition, the first bevel region of the substrate is cleaned by the third cleaning surface of the second cleaning brush, and the second bevel region of the substrate is cleaned by the fourth cleaning surface of the second cleaning brush.

[0062] With respect to the second cleaning brush, if a predetermined third condition is met, the contact position of the third cleaning surface with respect to the first bevel area in the third contact state is changed. Also, if a predetermined fourth condition is met, the contact position of the fourth cleaning surface with respect to the first bevel area in the fourth contact state is changed. In this case, the first and second bevel areas can be cleaned using the uncontaminated and unworn areas of the third and fourth cleaning surfaces. This improves the lifespan of the second cleaning brush, thereby reducing the frequency of replacement of the second cleaning brush.

[0063] Furthermore, after the replacement period for one of the first and second cleaning brushes has arrived, the other cleaning brush can be used. As a result, downtime due to the replacement of the first and second cleaning brushes can be significantly reduced.

[0064] (Clause 10) In the substrate cleaning apparatus described in Clause 9, the control unit may control the first and second drive units such that when the first cleaning surface of the first cleaning brush is in contact with the first bevel region, the fourth cleaning surface of the second cleaning brush is in contact with the second bevel region, and when the second cleaning surface of the first cleaning brush is in contact with the second bevel region, the third cleaning surface of the second cleaning brush is in contact with the second bevel region.

[0065] According to the substrate cleaning apparatus described in Section 10, the first bevel region is cleaned by one of the first and second cleaning brushes, and the second bevel region is cleaned by the other of the first and second cleaning brushes. As a result, the first and second bevel regions of the substrate are cleaned in a short time. In this case as well, it is possible to significantly reduce downtime due to the replacement of the first and second cleaning brushes. As a result, the cleaning efficiency of multiple substrates is improved.

[0066] (Paragraph 11) In the substrate cleaning apparatus described in paragraph 9 or 10, The control unit may control the first and second drive units such that, when the first condition is met, the modified contact position of the first cleaning surface with respect to the first bevel region becomes higher than the contact position of the first cleaning surface with respect to the first bevel region before modification; when the second condition is met, the modified contact position of the second cleaning surface with respect to the second bevel region becomes higher than the contact position of the second cleaning surface with respect to the second bevel region before modification; when the third condition is met, the modified contact position of the third cleaning surface with respect to the first bevel region becomes higher than the contact position of the third cleaning surface with respect to the first bevel region before modification; and when the fourth condition is met, the modified contact position of the fourth cleaning surface with respect to the second bevel region becomes higher than the contact position of the fourth cleaning surface with respect to the second bevel region before modification.

[0067] In the substrate cleaning apparatus described in paragraph 11, even if contaminants or particles generated by abrasion adhere to the contact positions of the first to fourth cleaning surfaces before the change, the contaminants or particles are prevented from falling to the contact positions of the first to fourth cleaning surfaces after the change. As a result, the contact positions of the first to fourth cleaning surfaces can be kept clean after the change. Therefore, the first and second bevel regions of the substrate can be cleaned thoroughly.

[0068] (Clause 12) A substrate cleaning method according to another embodiment is a substrate cleaning method for cleaning a substrate having a main surface and a bevel region on the peripheral edge of the main surface, The steps include sequentially performing the following for each of the multiple substrates: holding and rotating one of the multiple substrates with a substrate rotation holding unit, while bringing the inclined cleaning surface of the cleaning brush into contact with the bevel region of the one substrate using a drive unit; The procedure includes the step of controlling the drive unit so that the contact position of the cleaning surface with respect to the bevel region is changed when predetermined conditions are met.

[0069] According to the substrate cleaning method described in Section 12, the contact position of the cleaning surface with respect to the bevel area in the contact state is changed when predetermined conditions are met. In this case, the bevel area can be cleaned in areas of the cleaning surface that are not contaminated or worn. This improves the lifespan of the cleaning brush, thereby reducing the frequency of cleaning brush replacement. As a result, downtime due to cleaning brush replacement can be reduced. [Explanation of symbols]

[0070] 10...Spin chuck, 11...Holding unit, 12...Chuck rotation drive unit, 13, 14...Bottom cleaning nozzle, 15...Top cleaning nozzle, 20, 20a...Cleaning brush, 21...First cleaning surface, 22...Second cleaning surface, 21a...Third cleaning surface, 22a...Fourth cleaning surface, 23...Connecting surface, 30, 30a...Arm, 40, 40a...Arm drive unit, 50, 50a...Brush rotation drive unit, 60...Control unit, 70...Display unit, 100, 100a...Substrate cleaning device, A...First bevel area, B...Second bevel area, R...Bevel part, W...Substrate, WD...Bottom surface, WU...Top surface, la1~la3,lan...Contact position, lb1~lb3,lbn...Contact position

Claims

1. A substrate cleaning apparatus for cleaning a substrate having a first main surface and a first bevel region on the peripheral edge of the first main surface, A substrate rotation and holding unit that rotates the substrate while holding it, A first cleaning brush having a first cleaning surface inclined to be in contact with the first bevel region of the substrate held by the substrate rotation holding unit, A first drive unit is configured to move the first cleaning brush from a first contact state in which the first cleaning surface is in contact with the first bevel region of the substrate rotated by the substrate rotation holding unit, to a first separation state in which the first cleaning surface is separated from the first bevel region of the substrate rotated by the substrate rotation holding unit, A control unit controls the first drive unit so that, when a predetermined first condition is met, the contact position of the first cleaning surface with respect to the first bevel region in the first contact state is changed to a higher contact position. It includes a display unit that displays various information related to the cleaning of the circuit board, A substrate cleaning apparatus comprising: a control unit that stores the number of contact positions of the first cleaning brush, determines whether the contact positions can be changed based on the number of contact positions stored each time the predetermined first condition is met, controls the first drive unit to change the contact position of the first cleaning surface to a higher contact position with respect to the first bevel region if it is determined that the contact positions cannot be changed, and causes the display unit to indicate that it is time to replace the first cleaning brush.

2. The substrate cleaning apparatus according to claim 1, wherein the first condition includes that a first factor related to contamination or wear of the first cleaning surface, which may result from contact of the first cleaning surface with the first bevel region, has reached a predetermined value.

3. The substrate cleaning apparatus according to claim 2, wherein the first factor includes at least one of the number of substrates cleaned by the first cleaning surface, the cleaning force of the first cleaning surface on the first bevel region, and the cleaning time of the first bevel region by the first cleaning surface.

4. The substrate cleaning apparatus according to claim 3, wherein the cleaning force of the first cleaning surface on the first bevel region includes the pressing force of the first cleaning surface on the first bevel region.

5. The substrate has a second main surface opposite to the first main surface, and a second bevel region at the periphery of the second main surface. The first cleaning brush has a second cleaning surface that is inclined to be able to contact the second bevel region of the substrate held by the substrate rotation holding part, The first drive unit is configured to move the first cleaning brush between a second contact state in which the second cleaning surface contacts the second bevel region of the substrate rotated by the substrate rotation holding unit, and a second separation state in which the second cleaning surface separates from the second bevel region of the substrate rotated by the substrate rotation holding unit. The substrate cleaning apparatus according to claim 1, wherein the control unit controls the first drive unit so that the contact position of the second cleaning surface with respect to the second bevel region in the second contact state is changed when a predetermined second condition is met.

6. The substrate cleaning apparatus according to claim 5, wherein the control unit controls the first drive unit so that, when the second condition is met, the modified contact position of the second cleaning surface with respect to the second bevel region is higher than the contact position of the second cleaning surface with respect to the second bevel region before modification.

7. The substrate cleaning apparatus according to claim 5, wherein the second condition includes that a second factor related to contamination or wear of the second cleaning surface, which may result from contact of the second cleaning surface with the second bevel region, has reached a predetermined value.

8. A second cleaning brush having a third cleaning surface inclined to contact the first bevel region of the substrate held by the substrate rotating holder, and a fourth cleaning surface inclined to contact the second bevel region of the substrate held by the substrate rotating holder, The system further comprises a second drive unit configured to move the second cleaning brush from a third contact state in which the third cleaning surface contacts the first bevel region of the substrate rotated by the substrate rotation holding unit, to a third separation state in which the third cleaning surface is separated from the first bevel region of the substrate rotated by the substrate rotation holding unit, and from a fourth contact state in which the fourth cleaning surface contacts the second bevel region of the substrate rotated by the substrate rotation holding unit, to a fourth separation state in which the fourth cleaning surface is separated from the second bevel region of the substrate rotated by the substrate rotation holding unit, The substrate cleaning apparatus according to claim 5, wherein the control unit controls the second drive unit such that when a predetermined third condition is met, the contact position of the third cleaning surface with respect to the first bevel region in the third contact state is changed, and when a predetermined fourth condition is met, the contact position of the fourth cleaning surface with respect to the second bevel region in the fourth contact state is changed.

9. The substrate cleaning apparatus according to claim 8, wherein the control unit controls the first and second drive units so that when the first cleaning surface of the first cleaning brush is in contact with the first bevel region, the fourth cleaning surface of the second cleaning brush is in contact with the second bevel region, and when the second cleaning surface of the first cleaning brush is in contact with the second bevel region, the third cleaning surface of the second cleaning brush is in contact with the second bevel region.

10. The substrate cleaning apparatus according to claim 8, wherein the control unit controls the first and second drive units such that, when the first condition is met, the modified contact position of the first cleaning surface with respect to the first bevel region becomes higher than the contact position of the first cleaning surface with respect to the first bevel region before modification; when the second condition is met, the modified contact position of the second cleaning surface with respect to the second bevel region becomes higher than the contact position of the second cleaning surface with respect to the second bevel region before modification; when the third condition is met, the modified contact position of the third cleaning surface with respect to the first bevel region becomes higher than the contact position of the third cleaning surface with respect to the first bevel region before modification; and when the fourth condition is met, the modified contact position of the fourth cleaning surface with respect to the second bevel region becomes higher than the contact position of the fourth cleaning surface with respect to the second bevel region before modification.

11. A substrate cleaning method for cleaning a substrate having a main surface and a bevel region on the peripheral edge of the main surface, The steps include sequentially performing the following for each of the multiple substrates: holding and rotating one of the multiple substrates with a substrate rotation holding unit, while bringing the inclined cleaning surface of the cleaning brush into contact with the bevel region of the one substrate using a drive unit; The steps include controlling the drive unit so that the contact position of the cleaning surface with respect to the bevel region is changed to a higher contact position when predetermined conditions are met, The process includes the step of displaying various information regarding the cleaning of the circuit board on a display unit, The step of controlling the drive unit involves storing the number of contact positions of the cleaning brush, determining whether the contact positions can be changed based on the number of contact positions stored each time the predetermined condition is met, and if it is determined that the contact positions can be changed, controlling the drive unit to change the contact position of the cleaning surface with respect to the bevel region to a higher contact position. A circuit board cleaning method in which, if it is determined in the step of controlling the drive unit that it is not possible to change the contact position, the display unit indicates that it is time to replace the cleaning brush.

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