Electronic components and electronic equipment

Abstract

To provide electronic components that reduce the occurrence of short circuits. The electronic component comprises a laminate of multiple internal electrode layers and multiple dielectric layers, and two external electrodes. In the laminate, the stacking direction is defined as the first direction, the direction in which the two external electrodes are aligned is defined as the second direction, the planes parallel to the first and second directions are defined as main planes, and the planes perpendicular to the second direction are defined as end planes. The external electrodes are in contact with the laminate at least on a portion of the main plane. The internal electrode layers have a capacitance forming portion and a lead portion. The lead portion has a first end furthest from the end plane in the second direction and a second end closest to the end plane. The first end of the lead portion 92 is curved to approach the center in the first direction.

Description

Technical Field

[0006] ,

[0001] The present disclosure relates to electronic components and electronic devices.

Background Art

[0002] In an electronic component including a laminate of an internal electrode layer and a dielectric layer, for example, Patent Document 1 discloses a configuration in which an external electrode is formed at an exposed portion of the internal electrode layer.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0007] (4) The first end of the pull-out portion is more curved as it approaches the main surface, an electronic component according to any one of (1) to (3).

[0008] (5) An electronic component according to any one of (1) to (4), wherein in a plurality of internal electrode layers connected to the external electrode of the same pole, the spacing between the first ends of the lead-out portions is smaller than the spacing between the third ends of the capacitance forming portions.

[0009] (6) When the laminate has a surface perpendicular to the first direction as a side surface, The side surface has a recess in a plane view where only the dielectric layer is stacked, according to any one of (1) to (5).

[0010] (7) The electronic component according to any one of (1) to (6), wherein the main surface has a recess where the dielectric layer is exposed.

[0011] (8) The electronic component according to any one of (1) to (7), wherein, when viewed from a cross section parallel to the main surface and in which the capacitance forming portion is exposed, the second end of the lead portion is curved so as it approaches the capacitance forming portion that it moves away from the center in the first direction.

[0012] (9) The electronic component according to any one of (1) to (8), wherein the distance between the two external electrodes is less than or equal to half the length of the electronic component in the second direction.

[0013] (10) The electronic component according to (9), wherein the distance between the two external electrodes is 1 / 6 or less of the length of the electronic component in the second direction.

[0014] (11) The electronic component according to any one of (1) to (10), wherein the external electrode is a plated film.

[0015] (12) The curved shape at the first end of the lead-out portion is line-symmetric with respect to the center in the first direction. The electronic component according to any one of (1) to (11).

[0016] (13) An electronic device including a circuit board on which the electronic component according to any one of (1) to (12) is mounted.

Advantages of the Invention

[0017] According to the present disclosure, it is possible to provide an electronic component and an electronic device that improve the adhesion between an external electrode and an internal electrode layer while reducing the occurrence of shorts.

Brief Description of the Drawings

[0018] [Figure 1] It is a perspective view of the capacitor of this embodiment. [Figure 2] It is a cross-sectional view taken along line II-II of FIG. 1. [Figure 3] It is a cross-sectional view taken along line III-III of FIG. 1. [Figure 4A] It is a view of the layers included in the effective portion as seen from the W-axis direction. [Figure 4B] It is a view of the layers included in the effective portion as seen from the W-axis direction. [Figure 5A] It is a view of the layers included in the effective portion as seen from the W-axis direction. [Figure 5B] It is a view of the layers included in the effective portion as seen from the W-axis direction. [Figure 6] It is a schematic diagram showing the shape of the internal electrode layer when the effective portion is viewed from the main surface. [Figure 7] It is an explanatory diagram of a method for determining whether the internal electrode layer is curved. [Figure 8] It is a schematic diagram explaining the intervals in a plurality of internal electrode layers. [Figure 9] It is a diagram explaining the position of the cross-section. [Figure 10] It is a cross-sectional view taken along line X-X of the effective portion. [Figure 11]This is a cross-sectional view of the effective portion along the line XI-XI. [Figure 12] This is a cross-sectional view of the effective section along line XII-XII. [Figure 13] This is a diagram showing the effective portion viewed from the second side. [Figure 14] This diagram shows the points where pressure is applied in the effective area. [Figure 15] This is an explanatory diagram showing a press jig used to apply pressure to a capacitor, viewed from the T-axis direction. [Figure 16] This is an explanatory diagram showing a press jig used to apply pressure to a capacitor, viewed from the L-axis direction. [Figure 17] This is a diagram illustrating an electronic device with a capacitor installed. [Modes for carrying out the invention]

[0019] The electronic components of the embodiments of this disclosure will be described below with reference to the drawings. Note that the figures used in the following description are schematic diagrams, and the dimensional ratios, etc., shown in the drawings do not necessarily correspond to actual values. Similarly, the dimensional ratios, etc., between the drawings do not necessarily correspond to actual values. Furthermore, in this specification, numerical ranges represented using "~" mean a range that includes the values ​​written before and after "~" as the lower and upper limits, respectively.

[0020] [Electronic equipment] Figure 17 illustrates an electronic device 100 on which a capacitor 1 is mounted as an example of this embodiment. The capacitor 1 is, for example, a chip-type electronic component mounted inside a circuit board, and is electrically connected to the circuit board 40 by its first external electrode 5A and second external electrode 5B. However, the electronic component in this embodiment is not limited to being mounted inside a circuit board, and may, for example, be mounted on the circuit board, or may be a through-hole mounting type.

[0021] When capacitor 1 is mounted on a circuit board, for example, it is housed in a housing portion 32 between insulating layers 31 provided on the circuit board 40, and then the housing portion 32 is sealed with resin 33. A first via 34 and a second via 35 are formed on top of the resin 33 by a laser at positions overlapping with the first external electrode 5A or the second external electrode 5B of capacitor 1. The vias may be formed at positions overlapping with both the first external electrode 5A and the second external electrode 5B. Then, wiring is formed on the vias by plating, thereby making electrical contact between the wiring in the circuit board 40 and capacitor 1. When capacitor 1 is mounted on the circuit board 40, for example, it is positioned with its upper or lower surface facing the circuit board 40. Two pads on the circuit board 40 and the first external electrode 5A and the second external electrode 5B of capacitor 1 are joined by a conductive bonding material (not shown), such as solder, thereby making electrical contact with the wiring.

[0022] Electronic devices may include, for example, servers, personal computers, digital still cameras, smartphones, tablet devices, watches including smartwatches, printers, wearable devices such as HMDs (head-mounted displays), televisions, video cameras, video tape recorders, car navigation systems, pagers, electronic organizers, electronic dictionaries, calculators, electronic game devices, word processors, workstations, video phones, security television monitors, electronic binoculars, POS terminals, medical equipment, fish finders, various measuring instruments, vehicles, aircraft, ships, base stations for mobile devices, flight simulators, etc.

[0023] [Overview of Capacitors] Capacitor 1 is an example of an electronic component in this embodiment, and is a multilayer ceramic capacitor.

[0024] Figure 1 is a perspective view of the capacitor 1 of this embodiment. The capacitor 1 includes, for example, a roughly rectangular parallelepiped body 3, a first external electrode 5A, and a second external electrode 5B.

[0025] In the main body 3, the stacking direction is defined as the first direction (W-axis), the direction in which the first external electrode 5A and the second external electrode 5B are aligned is defined as the second direction (L-axis), and the direction perpendicular to the first and second directions is defined as the third direction (T-axis). The L-axis is perpendicular to the W-axis direction. The plane parallel to the L-axis and W-axis will be referred to as the LW plane, the plane parallel to the T-axis and W-axis as the TW plane, and the plane parallel to the T-axis and L-axis as the TL plane, and these will be described below.

[0026] The first external electrode 5A and the second external electrode 5B are located at or near both ends of the main body 3 in the L-axis direction. The first external electrode 5A and the second external electrode 5B are located at least on the LW plane. The first external electrode 5A and the second external electrode 5B may or may not be located on the TW plane. If it is not necessary to distinguish between the first external electrode 5A and the second external electrode 5B, the distinction between A and B is omitted, and they are referred to as external electrode 5. The capacitor 1 may further include an outer resin (not shown) that covers the entire structure shown in Figure 1, and lead wires (not shown) that are connected to the external electrodes 5 and extend from the outer resin.

[0027] In capacitor 1, the two main surfaces parallel to the LW plane are designated as the upper surface 41 and the lower surface 42, respectively. In capacitor 1, the two surfaces parallel to the TW plane are designated as the first end surface 43 and the second end surface 44, respectively. In capacitor 1, the two surfaces parallel to the TL plane are designated as the first side surface 45 and the second side surface 46, respectively. Note that if there is no need to distinguish between the first and second surfaces, the distinction between the first and second surfaces is omitted. Here, the area of ​​the end surfaces may be smaller than that of the main surfaces and side surfaces. Also, the main surface may be the surface with the largest area among the six surfaces of the roughly rectangular main body 3.

[0028] Figure 2 is a cross-sectional view taken along line II-II in Figure 1. Figure 3 is a cross-sectional view taken along line III-III in Figure 1. The cross-sections are planes parallel to the LW plane. The cross-section along line III-III is the exposed surface of the main body 3 alone. In Figures 2 and 3, the external electrode 5 is shown not in contact with the cover portion 13, which will be described later, but the example is not limited to this. For example, the external electrode 5 may be in contact with the cover portion 13 by extending in the W-axis direction more than in the configurations of Figures 2 and 3.

[0029] The main body 3 has an effective section 11 that directly performs the function of a capacitor. The effective section 11 has a plurality of alternatingly overlapping dielectric layers 7 and a plurality of internal electrode layers 9. The plurality of internal electrode layers 9 include at least one first internal electrode layer 9A and at least one second internal electrode layer 9B. The first lead section 92A and the first dummy section 93A shown in Figure 3 are parts of the first internal electrode layer 9A and will be described in detail later. The second lead section 92B and the second dummy section 93B are parts of the second internal electrode layer 9B and will be described in detail later. The first internal electrode layer 9A does not necessarily have the first dummy section 93A, and the second internal electrode layer 9B does not necessarily have the second dummy section 93B.

[0030] The number of layers of dielectric layer 7 and internal electrode layer 9 does not necessarily match the number shown in Figures 2 and 3. In Figures 2 and 3, the thickness of the external electrode 5, i.e., the length in the L-axis direction, is made relatively long to make the cross-sectional structure easier to understand.

[0031] The dimensions of capacitor 1 are not particularly limited. If capacitor 1 is relatively small, the length in the T-axis, L-axis, and W-axis directions may all be within the range of 0.03 to 0.20 mm.

[0032] [Capacitor configuration] The following describes the various components that make up capacitor 1.

[0033] (1) Main body The main body 3 has an effective portion 11. The main body 3 may also have two overlapping cover portions 13 on the upper and lower parts of the effective portion 11 in the stacking direction (W-axis direction), i.e., on the two side sides.

[0034] The shape of the main body 3 is not particularly limited and may be roughly rectangular. The rectangular prism may be square or rectangular in any plan view in the T-axis, L-axis, or W-axis direction. In one embodiment of this disclosure, the main body 3 may be thin, in other words, the thickness of the main body in the T-axis direction may be smaller than the length in the L-axis direction and the width in the W-axis direction.

[0035] (1.1) Effective part As shown in Figures 2 and 3, the effective portion 11 is a laminate in which a dielectric layer 7 and an internal electrode layer 9 are stacked in the W-axis direction.

[0036] The thickness of the dielectric layer 7 is not particularly limited and is appropriately selected according to the characteristics required of the capacitor 1. The thickness between adjacent internal electrode layers 9 may be in the range of 0.1 to 3.0 μm, 0.5 to 2.0 μm, or 0.5 to 1.0 μm. Furthermore, an upper and lower limit may be appropriately selected from these values. Note that the thickness between adjacent internal electrode layers 9 here refers to the thickness between the first internal electrode layer 9A and the second internal electrode layer 9B.

[0037] The shape of the dielectric layer 7 is not particularly limited in a plan view in the W-axis direction, and may be square or rectangular. In a plan view in the W-axis direction, the shape and dimensions of the dielectric layer 7 are basically the same as those of the effective portion 11.

[0038] The material of the dielectric layer 7 is, for example, a ceramic. The type of ceramic is not particularly limited and is arbitrary. The ceramic may be, for example, a compound having a perovskite structure represented by the general formula ABO3 containing Ba, Ca, Zr, or Ti. Specifically, the ceramic may be CaZrO3, BaTiO3, BaZrO3, CaTiO3, etc. In addition to ceramics, the material of the dielectric layer 7 may contain additives depending on the purpose. The additive may be, for example, an oxide of Mn, Mg, Dy, Cr, or V, or an oxide of rare earth elements such as Sm, Eu, Gd, Tb, Ho, Er, Tm, Yb, Y. The additive may be an oxide of Co, Ni, Li, B, Na, K, or Si, or it may be glass, etc.

[0039] The thickness of the internal electrode layer 9 is not particularly limited. The thickness of the internal electrode layer 9 may be in the range of 0.3 to 3.0 μm, 0.5 to 2.0 μm, or 0.5 to 1.0 μm. Furthermore, upper and lower limits may be appropriately selected from these values.

[0040] The material of the internal electrode layer 9 is, for example, a metal. The type of metal is not particularly limited. The metal used as the material for the internal electrode layer 9 may be entirely or primarily composed of a base metal. Base metals include Ni, Cu, etc., and alloys of these may be used. The term "primary component" refers to a component that accounts for 60% or more of the total mass. In addition, the internal electrode layer 9 may contain a dielectric co-material to adjust sintering. The material of the dielectric co-material may be the same material as the primary component of the dielectric layer 7.

[0041] Figures 4 and 5 show the layers included in the effective portion 11 as viewed from the W-axis direction. The effective portion 11 is, for example, a laminate of layers of pattern A and layers of pattern B. Pattern A and pattern B each comprise a first internal electrode layer 9A and a second internal electrode layer 9B on the dielectric layer 7. As a result, the first internal electrode layer 9A and the second internal electrode layer 9B face each other with the dielectric layer 7 in between. Pattern A and pattern B may be laminated alternately one layer at a time, or multiple layers at a time. Alternatively, pattern A and pattern B may be laminated alternately in most of the laminate, and pattern A (or pattern B) may be laminated continuously in a portion. The number of layers of pattern A and pattern B is not particularly limited and may be 100 layers or less in total, or in the range of 200 to 400 layers. Hereafter, if there is something common to both pattern A and pattern B and there is no need to distinguish between them, the distinction between A and B will be omitted.

[0042] The internal electrode layer 9 has a capacitance forming section 91, a lead-out section 92, and a dummy section 93. The lead-out section 92 connects the external electrode 5 to the capacitance forming section 91. The first capacitance forming section 91A and the second capacitance forming section 91B form capacitance by overlapping in the stacking direction (W-axis direction). The lead-out section 92 does not overlap with the capacitance forming section 91 in the stacking direction (W-axis direction) and does not contribute to capacitance formation. The dummy section 93 is not directly connected to the capacitance forming section 91 and the lead-out section 92; in other words, they are spaced apart. Note that the internal electrode layer 9 does not necessarily have to have the dummy section 93.

[0043] In the first internal electrode layer 9A, the first lead portion 92A is led out from the first capacitance forming portion 91A to the outer edge of the dielectric layer 7 and is further connected to the first external electrode 5A (not shown). The first lead portion 92A is led out at least in the T-axis direction. In one example shown in Figure 4A, the first lead portion 92A is led out in both the T-axis direction and the L-axis direction, and in one example shown in Figure 5A, the first lead portion 92A is led out only in the T-axis direction. When the first lead portion 92A is led out from the first capacitance forming portion 91A in the T-axis direction, it may be led out in both directions in the T-axis direction, or it may be led out in only one direction in the T-axis direction. In other words, the first lead portion 92A may have a portion led out from the first capacitance forming portion 91A to the upper surface 41 in the T-axis direction, a portion led out to the lower surface 42 in the T-axis direction, and a portion led out to the first end surface 43 or the second end surface 44 in the L-axis direction.

[0044] The first capacitance forming section 91A has a third end portion 911A. The third end portion 911A is located at the end of the L-axis direction to which the first capacitance forming section 91A extends. The first lead-out section 92A has a first end portion 921A furthest from the end face (the surface parallel to the TW plane) in the L-axis direction, and a second end portion 922A closest to the end face. The first end portion 921A is located in the portion of the first capacitance forming section 91A that extends in the T-axis direction and connects to the external electrodes 5A located on the upper surface 41 and the lower surface 42. In the example shown in Figure 4A, the second end portion 922A may be located in the portion of the first capacitance forming section 91A that extends in the L-axis direction and connect to the external electrodes 5A located on the second end face 44. In the example shown in Figure 5A, the second end portion 922A is located in the portion of the first capacitance forming section 91A that extends in the T-axis direction and connects to the external electrodes 5A located on the upper surface 41 and the lower surface 42.

[0045] In the second internal electrode layer 9B, the second lead portion 92B is led out from the second capacitance forming portion 91B to the outer edge of the dielectric layer 7 and is further connected to the other second external electrode 5B (not shown). The second lead portion 92B is led out at least in the T-axis direction. In one example shown in Figure 4B, the second lead portion 92B is led out in both the T-axis and L-axis directions, and in one example shown in Figure 5B, the second lead portion 92B is led out only in the T-axis direction. When the second lead portion 92B is led out from the second capacitance forming portion 91B in the T-axis direction, it may be led out in both directions in the T-axis direction, or it may be led out in only one direction in the T-axis direction.

[0046] The second capacitance forming section 91B has a third end portion 911B. The third end portion 911B is located at the L-axis end of the extension of the second capacitance forming section 91B. The second lead-out section 92B has a first end portion 921B furthest from the end face (a surface parallel to the TW plane) in the L-axis direction, and a second end portion 922B closest to the end face. The first end portion 921B is located in the portion of the second capacitance forming section 91B that extends in the T-axis direction and connects to the external electrodes 5B located on the upper surface 41 and the lower surface 42. In the example shown in Figure 4B, the second end portion 922B may be located in the portion of the second capacitance forming section 91B that extends in the L-axis direction and connect to the external electrode 5B located on the first end face 43. In the example shown in Figure 5B, the second end portion 922B is located in the portion of the second capacitance forming section 91B that extends in the T-axis direction and connects to the external electrodes 5A located on the upper surface 41 and the lower surface 42.

[0047] The multiple first dummy portions 93A and the multiple second dummy portions 93B each function as a dummy electrode as a whole. Having dummy electrodes improves the connection strength between the main body portion 3 and the external electrode 5. Also, when the external electrode 5 is formed by a plating method, the dummy electrodes function as a base layer. Note that, for example, if the thickness of the dielectric layer 7 is small and the distance between the first internal electrode layers 9A and the distance between the second internal electrode layers 9B are close, the external electrode 5 can be formed by a plating method even without the dummy portions 93.

[0048] The shape and dimensions of the internal electrode layer 9 are not particularly limited. As shown in Figure 4, the capacitance forming portion 91, the lead portion 92, and the dummy portion 93 may all be rectangular. The internal electrode layer 9 may be symmetrical with respect to a line parallel to the L-axis direction. The first internal electrode layer 9A may have the shape of the second internal electrode layer 9B inverted with respect to the T-axis direction.

[0049] In the example shown in Figures 4 and 5, the capacitance forming section 91 and the lead section 92, excluding the dummy section 93, are T-shaped, but this shape is not particularly limited. For example, the capacitance forming section 91 and the lead section 92, excluding the dummy section 93, may be L-shaped. In the case of a T-shape, there are two first end portions 921 for one internal electrode layer 9, but in the case of an L-shape, there is one first end portion 921 for one internal electrode layer 9.

[0050] (1.2) Cover section The cover portion 13 protects the effective portion 11 and improves the strength of the main body portion 3.

[0051] The shape of the cover portion 13 is not particularly limited in a plan view in the W-axis direction. The shape of the cover portion 13 is basically the same as the shape of the effective portion 11 in a plan view in the W-axis direction.

[0052] The material of the cover portion 13 is not particularly limited. The material of the cover portion 13 may be the same as or different from the material of the dielectric layer 7. The material of the cover portion 13 may be, for example, ceramics, or it may contain materials other than ceramics as a secondary component.

[0053] The shape and dimensions of the cover portion 13 are not particularly limited, and it may be layered having a shape and dimensions that overlap the effective portion 11 without excess or deficiency. When the cover portions 13 are located on both sides in the W-axis direction as shown in Figures 2 and 3, the thickness of one cover portion 13 may be in the range of 1% to 40%, 5% to 30%, 10% to 25%, or 15% to 20% of the thickness of the main body portion 3. Furthermore, upper and lower limits may be appropriately selected from these values. Specifically, the thickness of one cover portion 13 may be in the range of 50 to 150 μm. The cover portion 13 may have multiple layers made of multiple materials. In this case, it may have a dielectric layer, and the thickness of the dielectric layer in the cover portion 13 may be in the range of 2 to 10 μm. Note that the thickness of the cover portion 13 here refers to the thickness of the cover portion 13 in the W-axis direction.

[0054] (2) External electrode The shape of the external electrode 5 is not particularly limited and may be layered with a certain thickness. For example, as shown in Figure 1, it may be in contact with the two end faces 43 and 44 of the main body 3, and also in contact with a portion of the upper surface 41 and the lower surface 42. Alternatively, it may not be in contact with the two end faces 43 and 44 of the main body 3, but only in contact with a portion of the upper surface 41 and the lower surface 42. This allows the external electrode 5 to be connected to the lead portion 92 in the internal electrode layer 9 at the upper surface 41 and the lower surface 42 of the main body 3, and enables in-board mounting of the capacitor 1 on the circuit board 40 using either the upper surface 41 or the lower surface 42. When the external electrode 5 is in contact with only a portion of the upper surface 41 and the lower surface 42, for example, there may be two first external electrodes 5A connected to the first internal electrode layer 9A, one in contact with the upper surface 41 and one in contact with the lower surface 42, and two second external electrodes 5B connected to the second internal electrode layer 9B, one in contact with the upper surface 41 and one in contact with the lower surface 42. The shape of the portion of the external electrode 5 located on the upper surface 41 or lower surface 42 of the main body 3 may be rectangular in length α in the W-axis direction when viewed from above in the T-axis direction. Similarly, the shape of the portions of the external electrode 5 located on the end faces 43 and 44 of the main body 3 may be rectangular in length α in the W-axis direction when viewed from above in the L-axis direction. The value of length α is not particularly limited.

[0055] The material of the external electrode 5 is, for example, a metal. The type of metal is not particularly limited. The metal used as the material of the external electrode 5 may be entirely or primarily composed of a base metal. Base metals include Ni, Cu, Sn, Su, etc., and alloys of these may be used. In one embodiment of this disclosure, the material of the external electrode 5 is Cu. The external electrode 5 may also be made up of layers of different materials, if necessary. For example, the external electrode 5 may be a three-layer structure in which Cu, Ni, and Sn are layered in that order. The material of the external electrode 5 may be the same as or different from the material of the other electrodes.

[0056] The thickness of the external electrode 5 is not particularly limited and may be thicker than the other electrodes. The thickness of the external electrode 5 may be in the range of 1 to 300 μm, 3 to 100 μm, 5 to 30 μm, or 7 to 20 μm. Furthermore, upper and lower limits may be appropriately selected from these values.

[0057] The direction in which the two external electrodes (first external electrode 5A and second external electrode 5B) are aligned is defined as the first direction (L-axis direction). In this case, the distance between the two external electrodes may be half or less of the length of the capacitor 1 in the L-axis direction, or one-quarter or less, or one-sixth or less. Even if the distance between the two external electrodes is short relative to the size of the capacitor 1, the occurrence of short circuits can be sufficiently reduced in this embodiment.

[0058] The external electrode 5 may be a plated film. By using a plated film, a thin and uniform layer can be formed. By reducing the thickness, the capacitor 1 can be miniaturized. The plated film may be formed by electrolytic plating or by electroless plating. Alternatively, an electroless plated film may be formed, and then a electroplated film may be formed on top of it to create a laminate.

[0059] [Capacitor shape] The shape of capacitor 1, particularly the effective portion 11, will be described below.

[0060] Figure 6 is a schematic diagram showing the shape of the internal electrode layer 9 when the effective portion 11 is viewed from the main surface. In other words, Figure 6 schematically illustrates only the effective portion 11 of the capacitor 1 shown in Figure 3. In Figure 6, for explanatory purposes, the dielectric layer 7 and the dummy portion 93 are omitted, and only the lead portion 92 is shown. Note that the dummy portion 93 is not essential in the capacitor 1 of this disclosure. Therefore, Figure 6 can be used to explain embodiments that do not have the dummy portion 93. Similarly, Figures 7, 8, 10, 11, and 12, which will be described later, can also be used to explain embodiments that do not have the dummy portion 93.

[0061] In the stacking direction (W-axis direction), the internal electrode layer located at the center of the effective portion 11 is defined as the "center layer". Specifically, when the position of the first side surface 45 is defined as W=0% and the position of the second side surface 46 is defined as W=100%, the internal electrode layer 9 located at W=50%, or the closest to W=50%, is defined as the center layer 20.

[0062] In this embodiment, the multiple internal electrode layers 9 are curved at the first end 921 of the lead-out portion 92 so as to approach the center in the stacking direction, i.e., the central layer 20. Whether the first end 921 is curved can be confirmed by the following method.

[0063] Figure 7 is an explanatory diagram of a method for determining whether the internal electrode layer 9 is curved. For a specific internal electrode layer 9, the distance between the first ends 921 and the distance between the second ends 922 are compared, using the central layer 20, which has the same polarity as the connected external electrode 5, as a reference. If the distance between the first ends 921 is smaller, it can be determined that the first ends 921 of the internal electrode layer 9 are curved to approach the central layer 20.

[0064] In this embodiment, the effective portion 11 is viewed from the main surface. However, when viewing the effective portion 11 from the main surface in a capacitor 1 where the external electrodes 5 have already been formed, it is necessary to remove the external electrodes 5 formed on the main surface. In this case, a cross-section may be obtained in which not only the external electrodes 5 but also a part of the main body portion 3 has been removed on a plane parallel to the main surface. Even in such a cross-section, if the first end portion 921 of the lead portion 92 is exposed in that cross-section, it is possible to determine whether the first end portion 921 is curved to approach the central layer 20.

[0065] In this embodiment, when the effective portion 11 is viewed from the main surface, the first end portion 921 of the lead portion 92 is curved. As a result, the conductor density increases in the area where the first end portion 921, which functions as a base conductor for electroless plating (external electrode 5), is exposed. As shown in Figure 6, it can be seen that the conductor density is higher at the first end portion 921 compared to the second end portion 922. When the conductor density increases at the exposed area of ​​the first end portion 921, the adhesion with the formed external electrode 5 is improved. As a result, for example, it becomes unnecessary to extend the area of ​​the external electrode 5 beyond the lead portion 92, which reduces accidental contact between the external electrodes 5 in the gap and is thought to reduce the occurrence of short circuits.

[0066] Furthermore, in this embodiment, the external electrode 5 is less likely to peel off even at the boundary between the main surface (upper surface 41 and lower surface 42) and the end surface (first end surface 43 and second end surface 44), i.e., at the corners of the effective portion 11 (main body portion 3). Therefore, the intrusion of moisture between the effective portion 11 and the external electrode 5 can be reduced, and the moisture resistance reliability can be improved.

[0067] Figure 8 is a schematic diagram illustrating the spacing between multiple internal electrode layers 9. In adjacent internal electrode layers 9 in the stacking direction, the spacing d1 of the first end 921 of the lead-out portion 92 may be smaller than the spacing d2 of the second end 922. Note that all of the multiple internal electrode layers 9 here are connected to an external electrode 5 (not shown) of the same polarity. Here, it is not necessary for this relationship to hold for all internal electrode layers 9. For example, if the relationship d2 > d1 holds for five or more locations among the internal electrode layers 9 located at both ends in the W-axis direction, then it can be determined that this relationship holds.

[0068] In multiple internal electrode layers 9, the curvature of the first end portion 921 located at the edge in the stacking direction may be greater than that of the first end portion 921 located at the center (center layer 20) in the stacking direction. For example, the average (or maximum) curvature of the first end portion 921 located at W 0-20% or 80-100% may be greater than the average (or maximum) curvature of the first end portion 921 located at W 40-60%. Also, in multiple internal electrode layers 9 adjacent to each other in the stacking direction, the curvature of the first end portion 921 of the first end portion 921 may increase as it moves away from the center (center layer 20) in the stacking direction. The further the internal electrode layer 9 is from the center layer 20, the greater the curvature of the first end portion 921 as it approaches the center layer 20, thereby increasing the conductor density of the exposed portion of the first end portion 921. Whether the curvature increases as it moves away from the center layer 20 can be confirmed by the following method.

[0069] For each internal electrode layer 9, the distance between the first ends 921 and the distance between the second ends 922 are compared, using the central layer 20, which has the same polarity as the connected external electrode 5, as a reference. From this comparison, the degree of curvature at the first ends 921 can be calculated, and from this degree, it can be determined whether the curvature increases as the distance from the central layer 20 increases. Also, if the spacing d2 of the second ends 922 is the same between multiple adjacent internal electrode layers 9, it can be determined that the curvature is large if the spacing d1 of the first ends 921 narrows as the distance from the central layer 20 increases. Here, it is not necessary for this relationship to hold for all internal electrode layers 9. For example, if the above relationship of curvature magnitude holds for five or more locations among the internal electrode layers 9 located on one end side in the W-axis direction from the central layer 20, it can be determined that this relationship holds.

[0070] The first end portion 921 of the lead portion 92 may be more curved as it approaches the main surface. The further the first end portion 921 is from the capacitance forming portion 91, the more it curves and approaches the central layer 20, thereby increasing the conductor density of the exposed portion of the first end portion 921. Also, by reducing the curvature of the first end portion 921 as it approaches the capacitance forming portion 91, the probability of unnecessary curvature being transmitted to the capacitance forming portion 91 is reduced, and the capacitor 1 can form a sufficient capacitance close to the design value. In addition, the risk of a decrease in insulation resistance due to the reduction in the distance between the internal electrode layers 9 in the capacitance forming portion 91, and consequently the risk of short-circuit failure due to contact between opposing internal electrode layers 9, can be reduced. Whether the curvature is more or less as it moves away from the capacitance forming portion 91 can be confirmed by the following method.

[0071] Figure 9 is a diagram illustrating the position of the cross-section. In Figure 9, the effective portion 11 is viewed from the second side surface 46. Figure 10 is a cross-sectional view of the effective portion 11 along line XX. Figure 11 is a cross-sectional view of the effective portion 11 along line XI-XI. Note that line XI-XI is closer to the capacitance forming portion 91 than line XX.

[0072] For a specific first internal electrode layer 21A, the cross-sectional view along line XX (Figure 10) shows a relatively large curvature at the first end 921A. On the other hand, the cross-sectional view along line XI-XI (Figure 11) shows a small curvature at the first end 921A, making it almost flat. Thus, in the same internal electrode layer 9, if the curvature at the first end 921 is greater in the cross-sectional view along line XX than in the cross-sectional view along line XI-XI, it can be determined that the curvature increases as it moves away from the capacitance forming section 91.

[0073] In the embodiments shown in Figures 10 and 11, the first end portions 921 of the internal electrode layers 9 located at the upper and lower ends in the W-axis direction (stacking direction) are curved to a similar degree. However, this disclosure is not limited to this example. For example, the curvature of the first end portion 921 of the internal electrode layer 9 located at one end in the W-axis direction may differ from that of the internal electrode layer 9 located at the other end. Specifically, the curvature of the first end portion 921 located at W 0-20% may differ from that of the first end portion 921 located at W 80-100%. Alternatively, one end may be curved while the other end is not.

[0074] In the multiple internal electrode layers 9 connected to the same polarity external electrode 5, the spacing between the first ends 921 of the lead-out portions 92 may be smaller than the spacing between the third ends 911 of the capacitance forming portions 91. In other words, using d1 and d3 described later, d3 > d1 may also be the case. Here, this relationship does not need to hold for all internal electrode layers 9. For example, if the relationship d3 > d1 holds for five or more locations among the internal electrode layers 9 located at both ends in the W-axis direction, then this relationship can be considered to hold.

[0075] Figure 10 illustrates the spacing d1 between the first end portions 921B. Note that the first dummy portion 93A is not shown in Figure 10, so in reality, the first dummy portion 93A is located between adjacent first end portions 921B. If the spacing d1 between the first end portions 921B narrows, the first end portions 921B and the first dummy portion 93A may come into contact. However, since both the first end portions 921B and the first dummy portion 93A are connected to the second external electrode 5B (not shown), a short circuit will not occur. Also, the dummy portion 93 is not essential, and the first dummy portion 93A does not need to be located between adjacent first end portions 921B. In this case, even if the first end portions 921B are connected to each other, a short circuit will not occur because both are connected to the second external electrode 5B.

[0076] On the other hand, Figure 12 is a cross-sectional view of the effective portion 11 along the line XII-XII shown in Figure 9, illustrating the gap d3 of the third end 911B of the second capacitance forming portion 91B. If the gap d3 of the third end 911B of the second capacitance forming portion 91B narrows, the third end 911B and the second end 922A of the second capacitance forming portion 91B may come into contact. Since the third end 911B of the second capacitance forming portion 91B is connected to the second external electrode 5B and the second end 922A is connected to the first external electrode 5A, a short circuit will occur if they come into contact.

[0077] In other words, by making the spacing d1 of the first end 921 of the lead-out portion 92 narrower than the spacing d3 of the third end 911 of the capacitance forming portion 91, it is possible to increase the conductor density at the exposed portion of the first end 921 while reducing the occurrence of short circuits. Also, for example, the spacing d1 may be narrower than half of the spacing d1 ((d1) / 2) between the third end 911A of the first internal electrode layer 9A and the adjacent second internal electrode layer 9B.

[0078] When viewed from a cross-section parallel to the main surface of the effective portion 11 and where the capacitance forming portion 91 is exposed, the second end portion 922 of the lead portion 92 may be curved away from the center (center layer 20) in the stacking direction of the effective portion 11. For example, as shown in the internal electrode layer 22 of Figure 12, the second end portion 922B may be curved so as it approaches the second capacitance forming portion 91B, gradually moving away from the center layer 20. This allows the portion of the second capacitance forming portion 91B to remain relatively flat even if the number of stacks increases, so that the capacitor 1 can form sufficient capacitance. There may be multiple curved internal electrode layers 9, and the same or similar configuration may be adopted for the second end portion 922A as well.

[0079] When viewed from the side of the effective portion 11, as shown in Figure 3, the first side surface 45 of the capacitor 1 may have a first recess 451 in the area where only the dielectric layer 7 is stacked in a planar perspective view. The second side surface 46 may have a second recess 461 in the area where only the dielectric layer 7 is stacked in a planar perspective view. When viewed from the main surface, the side surface of the capacitor 1 may have a shape that constricts toward the center in the stacking direction (W-axis direction) near the center in the L-axis direction. Here, the area near the center in the L-axis direction is the area where only the dielectric layer 7 is stacked. In other words, the first side surface 45 may have a first recess 451 in the center in the L-axis direction, and the second side surface 46 may have a second recess 461 in the center in the L-axis direction. The first recess 451 and the second recess 461 can be determined by observing a cross-section parallel to the LW plane near the center in the T-axis direction.

[0080] In this way, the cover portion 13 curves along with the curvature of the first end portion 921 of the internal electrode layer 9, making it easier to achieve a uniform thickness for the cover portion 13. As a result, the occurrence of cracks that are likely to occur due to uneven thickness of the cover portion 13 can be reduced.

[0081] Figure 13 shows the effective portion 11 as viewed from the second side surface 46. As shown in Figure 13, the upper surface 41 (main surface) of the effective portion 11 may have a third recess 411 where the dielectric layer 7 is exposed. The lower surface 42 (main surface) may have a fourth recess 421 where the dielectric layer 7 is exposed. The third recess 411 and the fourth recess 421 can be determined by observing a cross-section parallel to the LT plane near the center in the W-axis direction. If it is difficult to confirm the recesses in the cross-section, they can be confirmed by measuring the main surface with a white light interferometer.

[0082] Capacitor 1 is mounted by pressing it against a circuit board using, for example, a suction nozzle provided on a mounter (mounting machine), so that its main surface is in contact with the circuit board. At this time, the presence of a recess on the main surface allows for the distribution and relaxation of stress on capacitor 1, thereby reducing the occurrence of cracks in areas where the dielectric layer is exposed.

[0083] The curved shape at the first end 921 of the lead portion 92 may be symmetrical with respect to the center (center layer 20) in the stacking direction of the effective portion 11. By making the internal configuration of the capacitor 1 symmetrical with respect to the center layer 20 in this way, the change in the rate of crack occurrence can be reduced when it is mounted on the circuit board 40 with the upper surface 41 and when it is mounted on the circuit board 40 with the lower surface 42.

[0084] [Capacitor manufacturing method] The method for manufacturing capacitor 1 is not particularly limited, and various methods can be used. Below, a basic method for manufacturing a capacitor will be described, followed by a description of a manufacturing method applicable to this embodiment.

[0085] (Green sheet manufacturing process) First, a ceramic green sheet corresponding to the dielectric layer 7 is fabricated. Here, the ceramic green sheet is the size of a base substrate from which multiple capacitors 1 can be mounted.

[0086] (coating process) Next, a conductive paste prepared using Ni powder and BaTiO3 ceramic powder, which is a common material for the dielectric layer 7, is applied to the fabricated ceramic green sheet by screen printing or gravure printing to form the internal electrode layer 9. Here too, the conductive paste is applied in such a way that multiple capacitors 1 can be made.

[0087] (Lamination process) Next, ceramic green sheets coated with conductive paste are stacked so that, for example, patterns A and B shown in Figure 4 or 5 are alternated, to create a laminate. Here, a laminate corresponding only to the effective portion 11 may be created, or a laminate corresponding to the effective portion 11 and the cover portion 13, i.e., the main body portion 3, may be created. If a laminate corresponding only to the effective portion 11 is created, a layer corresponding to the cover portion may be stacked separately afterward.

[0088] (Singulation process) A laminate made of stacked ceramic green sheets is cut or otherwise separated into individual pieces corresponding to the size of capacitor 1.

[0089] (Firing process) The individualized laminates are subjected to a debinder treatment, for example, in a nitrogen atmosphere, and then fired. Here, the binder refers to organic substances added for purposes such as facilitating handling. The firing may be carried out in a reducing atmosphere. The firing conditions may be, for example, 1220°C or lower, for 10 minutes to 2 hours.

[0090] Furthermore, degreasing may be performed before firing. Re-oxidation heat treatment may be performed after firing. The laminate may be polished (barrel polishing, etc.) before and after firing. During polishing, the edges of the laminate may be chamfered, and the end faces and sides may be polished. If the fired laminate corresponds only to the effective portion 11, a layer corresponding to the cover portion 13 is laminated onto the fired laminate to form the main body portion 3.

[0091] (External electrode formation process) A metal film is deposited on the obtained main body 3 to form the external electrode 5. Various methods may be used to form the external electrode 5. For example, metal may be deposited on the surface of a dummy electrode by electroless plating or electrolytic plating. For example, metal may be deposited on the edges of the internal electrode layer 9 that are exposed to the outside by electroless plating or electrolytic plating. Alternatively, the external electrode 5 may be formed by depositing metal by electroless plating and then increasing the thickness by electrolytic plating. Furthermore, the metal film may be deposited using thin-film formation methods such as the dip method, printing method, CVD (Chemical Vapor Deposition), or PVD (Physical Vapor Deposition). The dummy electrode may or may not contribute to the deposition of the metal. Thus, a capacitor 1 is obtained.

[0092] In this embodiment, as described above, the internal electrode layer 9 is curved at the first end 921 of the lead-out portion 92. Two methods can be used to curve the first end 921.

[0093] (Manufacturing method 1) As shown in Figure 14, pressure is applied to the resulting effective portion 11 in the stacking direction (W-axis direction), centering on the area where only the dielectric layer 7 is stacked when the capacitor 1 is viewed from the side with planar projection. This applies pressure in the stacking direction (W-axis direction) near the first end 921 of the lead portion 92. It is preferable to apply a force to the laminate before firing, when plastic deformation is possible. Figure 15 is an explanatory diagram of the press jig 50 used to apply pressure to the capacitor 1, viewed from the T-axis direction. Figure 16 is an explanatory diagram of the press jig 50 used to apply pressure to the capacitor 1, viewed from the L-axis direction. By applying pressure using the press jig 50, pressure is applied to the capacitor 1 near the first end 921 from the stacking direction. The magnitude of the pressure applied by the press jig 50 and the area over which pressure is applied are not particularly limited. The degree of curvature of the first end 921 can be controlled by appropriately adjusting the magnitude of the pressure and the area over which pressure is applied.

[0094] (Manufacturing method 2) During the printing of the conductive paste, the dielectric paste is also printed in the region of the dielectric layer 7 that contacts the first end 921 of the draw-out portion 92. The dielectric paste has a greater shrinkage rate than the ceramic green sheet. For example, the dielectric particle size generated by the dielectric paste is designed to be within a range of 1 / 3 to 1 / 2 the size of the dielectric particle size generated by the ceramic green sheet. In addition, the dielectric paste has a higher content of glass, sintering aids, etc., than the ceramic green sheet. As a result, the dielectric layer 7 that contacts the first end 921 shrinks significantly, and this shrinkage allows the curved shape of the first end 921 to be formed.

[0095] As described above, the electronic component (capacitor 1) of this embodiment comprises a laminate (effective portion 11) of a plurality of internal electrode layers 9 and a plurality of dielectric layers 7, and two external electrodes (first external electrode 5A and second external electrode 5B). In the laminate, the stacking direction is the first direction (W-axis direction), the direction in which the two external electrodes 5 are aligned is the second direction (L-axis direction), the surfaces parallel to the first and second directions are the main surfaces (upper surface 41 and lower surface 42), and the surfaces perpendicular to the second direction are the end surfaces (first end surface 43 and second end surface 44). The external electrodes 5 are in contact with the laminate at least in part of the main surfaces. The internal electrode layer 9 has a capacitance forming portion 91 and a lead portion 92. The lead portion 92 has a first end portion 921 furthest from the end surface in the second direction and a second end portion 922 closest to the end surface. The first end portion 921 of the lead-out portion 92 is curved to approach the center (center layer 20) in the first direction (W-axis direction). This increases the conductor density where the first end portion 921 is exposed, thereby reducing the occurrence of short circuits and improving the adhesion between the external electrode 5 and the internal electrode layer 9.

[0096] Furthermore, in multiple internal electrode layers 9 adjacent to each other in the first direction, the spacing d1 of the first end portions 921 of the lead-out portions 92 may be smaller than the spacing d2 of the second end portions 922. This allows for an increase in conductor density where the first end portions 921 are exposed, thereby reducing the occurrence of short circuits while improving the adhesion between the external electrode 5 and the internal electrode layer 9.

[0097] Furthermore, in multiple internal electrode layers 9 adjacent to each other in the first direction, the first end portion 921 of the lead portion 92 may be more curved as it moves away from the center in the first direction. This allows for an increase in conductor density where the first end portion 921 is exposed, thereby reducing the occurrence of short circuits and improving the adhesion between the external electrode 5 and the internal electrode layer 9.

[0098] Furthermore, the first end portion 921 of the lead-out portion 92 may be more curved as it approaches the main surface. This allows for an increase in conductor density where the first end portion 921 is exposed, thereby reducing the occurrence of short circuits and improving the adhesion between the external electrode 5 and the internal electrode layer 9.

[0099] Furthermore, in the multiple internal electrode layers 9 connected to the same polarity external electrode 5, the spacing d1 of the first end portions 921 of the lead-out portions 92 may be smaller than the spacing d3 of the third end portions 911 of the capacitance forming portions 91. This reduces the occurrence of short circuits.

[0100] Furthermore, in the laminate, a surface perpendicular to the first direction may be used as a side surface. In this case, the side surfaces (first side surface 45 and second side surface 46) may have recesses (first recess 451 and second recess 461) in areas where only the dielectric layer 7 is laminated in a planar view. This allows for a uniform thickness of the cover portion 13 and reduces the occurrence of cracks.

[0101] Furthermore, the main surface may have recesses (third recess 411 and fourth recess 421) where the dielectric layer 7 is exposed. This allows for the distribution and relaxation of stresses applied during the mounting of the capacitor 1, thereby reducing the occurrence of cracks.

[0102] Furthermore, when viewed from a cross-section parallel to the main surface and where the capacitance forming portion 91 is exposed, the second end portion 922 of the lead portion 92 may be curved so as it approaches the capacitance forming portion 91, moving away from the center in the first direction. This allows the capacitor 1 to form sufficient capacitance.

[0103] Furthermore, the distance between the two external electrodes 5 may be less than or equal to half the length of the electronic component (capacitor 1) in the second direction. In this embodiment, even if the distance between the two external electrodes 5 is short relative to the size of the capacitor 1, the adhesion between the external electrodes 5 and the internal electrode layer 9 can be improved while sufficiently reducing the occurrence of short circuits.

[0104] Furthermore, the distance between the two external electrodes 5 may be 1 / 6 or less of the length of the electronic component in the second direction. In this embodiment, even if the distance between the two external electrodes 5 is short relative to the size of the capacitor 1, the adhesion between the external electrodes 5 and the internal electrode layer 9 can be improved while sufficiently reducing the occurrence of short circuits.

[0105] Furthermore, the external electrode 5 may be a plated film. This allows for miniaturization of the capacitor 1.

[0106] Furthermore, the curved shape at the first end 921 of the pull-out portion 92 may be symmetrical with respect to the center in the first direction. This reduces the change in the rate of crack occurrence when the circuit board 40 is mounted on the upper surface 41 and when it is mounted on the circuit board 40 on the lower surface 42.

[0107] The electronic device 100 of this embodiment includes a circuit board 40 on which an electronic component (capacitor 1) is mounted. This reduces failures caused by short circuits of the electronic component.

[0108] In this embodiment, a multilayer ceramic capacitor was used as an example of an electronic component, but the applicable electronic components are not limited to multilayer ceramic capacitors. Furthermore, the electronic component may be a multilayer electronic component such as a multilayer composite component, or an electronic component other than a multilayer electronic component. The electronic components as a whole may constitute an electronic circuit such as a resonant circuit.

[0109] Furthermore, the specific configurations, structures, positional relationships, materials, etc., shown in the above embodiments can be modified as appropriate without departing from the spirit of this disclosure. The scope of the present invention includes the scope of the invention as described in the claims and its equivalents. [Industrial applicability]

[0110] This disclosure enables improved adhesion between external electrodes and internal electrode layers in electronic components while reducing the occurrence of short circuits. Furthermore, it can reduce failures caused by short circuits in electronic devices. [Explanation of symbols]

[0111] 1 Capacitor 3. Main body 5 External electrode 5A 1st external electrode 5B 2nd external electrode 7. Dielectric layer 9 Internal electrode layer 9A 1st internal electrode layer 9B 2nd internal electrode layer 11 Effective part 40 Circuit boards 91 Capacity forming part 92 Drawer section 921 First end 922 Second end 93 Dummy section 100 Electronic equipment

Claims

1. An electronic component comprising a laminate of multiple internal electrode layers and multiple dielectric layers, and two external electrodes, In the laminate, when the stacking direction is defined as the first direction, the direction in which the two external electrodes are aligned is defined as the second direction, the direction perpendicular to the first and second directions is defined as the third direction, the plane parallel to the first and second directions is defined as the main plane, and the plane perpendicular to the second direction is defined as the end plane, The external electrode is in contact with the laminate at least in part of the main surface, The internal electrode layer has a capacitance forming portion and a draw portion that is drawn out from the capacitance forming portion in at least the third direction, The extension portion has, in the second direction, a first end furthest from the end face and a second end closest to the end face. The first end is located in the region of the draw-out portion that is drawn out in the third direction from the volume forming portion. An electronic component, wherein the first end of the pull-out portion is curved to approach the center in the first direction.

2. The electronic component according to claim 1, wherein in a plurality of internal electrode layers adjacent in the first direction, the spacing between the first ends of the lead-out portions is smaller than the spacing between the second ends.

3. The electronic component according to claim 1 or claim 2, wherein in a plurality of internal electrode layers adjacent to each other in the first direction, the first end of the lead portion is more curved as it moves away from the center in the first direction.

4. The electronic component according to claim 1 or claim 2, wherein the first end of the pull-out portion is more curved as it approaches the main surface.

5. The electronic component according to claim 1 or claim 2, wherein in a plurality of internal electrode layers connected to the external electrode of the same polarity, the spacing between the first ends of the lead-out portions is smaller than the spacing between the third ends of the capacitance forming portions.

6. When the surface perpendicular to the first direction in the laminate is considered a side surface, The electronic component according to claim 1 or claim 2, wherein the side surface has a recess in a location where only the dielectric layer is stacked when viewed from above.

7. The electronic component according to claim 1 or claim 2, wherein the main surface has a recess in the portion where the dielectric layer is exposed.

8. The electronic component according to claim 1 or claim 2, wherein, when viewed from a cross-section parallel to the main surface and in which the capacitance forming portion is exposed, the second end of the lead portion is curved so as it approaches the capacitance forming portion that it moves away from the center in the first direction.

9. The electronic component according to claim 1 or claim 2, wherein the distance between the two external electrodes is less than or equal to half the length of the electronic component in the second direction.

10. The electronic component according to claim 9, wherein the distance between the two external electrodes is 1 / 6 or less of the length of the electronic component in the second direction.

11. The electronic component according to claim 1 or claim 2, wherein the external electrode is a plated film.

12. The curved shape at the first end of the extension portion is symmetrical with respect to the center in the first direction, according to claim 1 or claim 2.

13. An electronic device including a circuit board on which the electronic component described in claim 1 or claim 2 is mounted.

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