Electroplating apparatus and electroplating system

Abstract

To provide an electroplating apparatus and electroplating system.SOLUTION: An electroplating apparatus 100 includes a first anode 2 provided in a plating bath 1, and a liquid spraying device 3. The liquid spraying device comprises a main body with at least one inlet for conveying plating solution to the main body, and a plurality of nozzles attached to the main body, and is configured such that the flow direction of the plating solution jetted from the nozzle is substantially parallel to the direction of the power line formed by a first anode 2 and a cathode. The flow direction of the plating solution sprayed from the nozzle is substantially parallel to the direction of the power line formed by the first anode and cathode, which can improve the efficiency of electroplating.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] Cross - reference to Related Applications This application claims priority to Chinese Patent Application No. CN202110133322.3, filed with the China National Intellectual Property Administration on January 29, 2021, the entire disclosure of which is incorporated herein by reference.

[0002] At least one embodiment of the present invention relates to an electroplating apparatus and an electroplating system including the electroplating apparatus.

Background Art

[0003] In the prior art, electroplating methods for electroplating copper, nickel, tin, gold, silver, and related alloys onto workpieces such as connection terminals, locks, and shells mainly include barrel plating and hook plating based on the type of electroplating equipment used. In the process of hook plating, the electroplated workpiece is placed on a strip or hooked onto a special material strip to facilitate continuous electroplating. Conventional continuous electroplating apparatuses mainly include a mother tank and an overflow tank.

[0004] Generally, the overflow tank is suitable for containing electroplating solution. Overflow ports are formed on both sides of the overflow tank, and the material strip of the electroplated workpiece is arranged to continuously pass through the overflow ports so that electroplating, water washing, and other processes of the workpiece are performed between different overflow tanks. At the same time, the electroplating solution overflowing from the overflow tank returns to the mother tank through a pump without contaminating the adjacent overflow sub - tank. The electroplating solution sprays from the bottom to the top in the overflow tank, continuously circulates, and the electroplating solution is exchanged to ensure consistent electroplating quality. By adjusting the flow rate of the pump and the width of the overflow port, the liquid level of the electroplating solution in the overflow tank can be controlled to complete some simple selective electroplating.

[0005] In conventional technology, anodes are provided on both sides of an overflow tank, parallel to both sides of a material strip used as a cathode, and an electric field is formed between the anode and the cathode to achieve electroplating. The flow direction of the electroplating solution near the cathode is unidirectional, and the impact force of the liquid flow is weak, so there is almost no impact of the flow of the electroplating solution on the anode surface, and the electroplating effect on the functional areas of workpieces with complex structures in hidden places (sides, holes, depressions, cup openings, and cavities, etc.) is greatly limited. In addition, the flow direction of the electroplating solution is mainly from bottom to top, perpendicular to the power lines of the electric field, i.e., parallel to the electroplating functional surface of the cathode material strip, so the impact of the electroplating solution on the electroplating functional surface is insufficient, and fog, tip burning, and uneven distribution of film thickness are likely to occur in the planar electroplating area, especially in the thin needles, sharp protrusions, holes, depressions, cup openings, and cavity structures of complex parts. In addition, if the electroplating solution is not replaced quickly enough, or if the amount of electroplating solution on the back side of the material strip opposite to the high-speed travel direction of the material strip is insufficient, in serious cases, missing or incorrect plating (weak coating adhesion) may occur. [Overview of the project] [Problems that the invention aims to solve]

[0006] The present invention has been made to overcome or mitigate at least one of the above-mentioned drawbacks. [Means for solving the problem]

[0007] According to an aspect of the present invention, an electroplating apparatus is provided, comprising an electroplating bath suitable for containing an electroplating solution in which an object to be electroplated, as a cathode, is at least partially immersed; a first anode provided in the electroplating bath; and a liquid spraying device. The liquid spraying device includes a main body portion having at least one inlet for transporting the electroplating solution to the main body portion; and a plurality of nozzles attached to the main body portion, wherein at least a portion of the nozzles are configured such that the flow direction of the electroplating solution ejected from the nozzles is substantially parallel to the direction of the power lines formed by the first anode and the cathode.

[0008] According to an exemplary embodiment of the present invention, a first anode is provided between a liquid spraying device and a workpiece, and a plurality of first through-holes are formed in the first anode, and a portion of the electroplating solution ejected from the nozzle flows through the first through-holes.

[0009] According to another exemplary embodiment of the present invention, a plurality of first anodes are provided, with a gap between two adjacent first anodes.

[0010] According to another exemplary embodiment of the present invention, the nozzle is detachably attached to the main body.

[0011] According to another exemplary embodiment of the present invention, the spray direction of at least a portion of the nozzle is configured to be adjustable.

[0012] According to another exemplary embodiment of the present invention, the nozzles are sparsely arranged in a high current density region and densely arranged in a low current density region.

[0013] According to another exemplary embodiment of the present invention, the nozzle arrangement density in the upper part of the main body is greater than the nozzle arrangement density in the lower part of the main body.

[0014] According to another exemplary embodiment of the present invention, the body portion includes a first portion and two second portions provided at each end of the body portion and extending toward the workpiece. The nozzle includes a plurality of first nozzles attached to the first portion, wherein the flow direction of the electroplating solution ejected from the first nozzle is substantially parallel to the direction of the power lines formed by the first anode and cathode, and a plurality of second nozzles provided inside the two second portions and configured to eject the electroplating solution toward the workpiece.

[0015] According to another exemplary embodiment of the present invention, the workpiece is placed on a material strip configured to move horizontally through an electroplating bath, the flow direction of the electroplating solution ejected from a first nozzle is perpendicular to the direction of movement of the material strip, each of the two opposing side walls of the electroplating bath is provided with an overflow port, and the material strip moves through the overflow port.

[0016] According to another exemplary embodiment of the present invention, the electroplating apparatus further comprises a second anode, the electrolytic potential of the second anode being lower than the electrolytic potential of the first anode.

[0017] According to another exemplary embodiment of the present invention, the second anode is placed in a basket having a plurality of first through-holes.

[0018] According to another exemplary embodiment of the present invention, the electroplating apparatus further includes two partitions configured to separate the electroplating tank into an outer housing portion and an inner housing portion located inside the outer housing portion, wherein a plurality of pairs of first anodes are arranged in the inner housing portion and a plurality of pairs of second anodes are arranged in the outer housing portion, and a plurality of second through-holes are formed in the partitions to allow the electroplating solution from the outer housing portion to flow into the inner housing portion through the second through-holes.

[0019] According to another exemplary embodiment of the present invention, a first anode is mounted to a partition wall by a first bracket, and a second anode is mounted to the side wall of the electroplating bath by a second bracket.

[0020] According to another exemplary embodiment of the present invention, the electroplating apparatus further comprises a power supply configured to supply power to a first anode and a second anode.

[0021] According to another exemplary embodiment of the present invention, the power supply includes a first current regulator and a second current regulator configured to regulate the current supplied to a first anode and a second anode, respectively.

[0022] According to another exemplary embodiment of the present invention, the first and second current regulators are further configured to adjust the ratio of current supplied to the first and second anodes according to the proportion of metal of the alloy being electroplated onto the workpiece.

[0023] According to another exemplary embodiment of the present invention, the electroplating apparatus further comprises an auxiliary cathode, and the power supply further comprises a third current regulator, the cathode of the third current regulator connected to the auxiliary cathode, and the anode of the third current regulator connected to a second anode, the third current regulator being suitable for supplying power to the second anode while the second current regulator is not supplying current to the second anode, so that the second anode has a positive potential and prevents displacement reactions between the second anode and the electroplating solution.

[0024] According to another exemplary embodiment of the present invention, a plurality of first liquid inlet holes substantially aligned with a second anode are arranged in the bottom wall of the electroplating bath, and the first liquid inlet holes are suitable for transporting the electroplating solution vertically toward the second anode.

[0025] According to another exemplary embodiment of the present invention, a plurality of second liquid inlet holes substantially aligned with the workpiece are arranged on the bottom wall of the electroplating tank, and the second liquid inlet holes are suitable for transporting the electroplating solution vertically towards the workpiece.

[0026] According to another exemplary embodiment of the present invention, a pair of adjustment covers are respectively provided on both sides of the second liquid inlet holes, and the adjustment covers are configured to adjust the liquid level of the electroplating solution in the workpiece.

[0027] According to another aspect of the present invention, there is provided an electroplating system comprising the above electroplating apparatus, a tank into which the electroplating solution overflowing from the electroplating tank flows, and a pump configured to send the electroplating solution from the tank through a pipe to the inlet of the liquid spraying device.

[0028] In the electroplating apparatus and the electroplating system according to the embodiment of the present invention, at least a part of the nozzles of the liquid spraying device can strongly spray the electroplating solution at a certain flow rate towards the workpiece to be electroplated as a cathode, and the flow direction of the electroplating solution sprayed from the nozzles is substantially parallel to the direction of the electric power lines formed by the first anode and the cathode, and the electroplating efficiency can be improved.

[0029] By describing the exemplary embodiments in detail while referring to the accompanying drawings, the above other features of the present invention will become clearer.

Brief Description of the Drawings

[0030] [Figure 1] It is an explanatory diagram of an electroplating system according to an exemplary embodiment of the present invention. [Figure 2] It is an explanatory perspective view of an electroplating apparatus according to an exemplary embodiment of the present invention. [Figure 3] It is an explanatory perspective view of a liquid spraying device according to an exemplary embodiment of the present invention. [Figure 4] It is an explanatory perspective view of a first anode according to an exemplary embodiment of the present invention. [Figure 5] This is an explanatory diagram of an electroplating system according to another exemplary embodiment of the present invention, showing an electroplating tank cut in the longitudinal direction. [Figure 6] Figure 5 is another explanatory diagram of the electroplating system, showing the electroplating tank cut horizontally. [Figure 7] This is an explanatory diagram of an electroplating system according to another exemplary embodiment of the present invention, showing an electroplating tank cut horizontally. [Figure 8] This is a descriptive perspective view of an electroplating apparatus according to another exemplary embodiment of the present invention. [Figure 9] This is a descriptive perspective view of an anode and workpiece according to another exemplary embodiment of the present invention. [Figure 10A] This is a perspective view illustrating different mounting configurations of the pipe according to exemplary embodiments of the present invention. [Figure 10B] This is a perspective view illustrating different mounting configurations of the pipe according to exemplary embodiments of the present invention. [Figure 10C] This is a perspective view illustrating different mounting configurations of the pipe according to exemplary embodiments of the present invention. [Figure 10D] This is a perspective view illustrating different mounting configurations of the pipe according to exemplary embodiments of the present invention. [Modes for carrying out the invention]

[0031] Illustrative embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. In the drawings, similar reference numerals refer to similar elements. However, the present disclosure can be embodied in many different forms and should not be construed as being limited to the embodiments described herein. Rather, these embodiments are presented to ensure that the present disclosure is thorough and complete and to fully convey the concepts of the present disclosure to those skilled in the art.

[0032] The following detailed description includes numerous specific details for illustrative purposes to provide a thorough understanding of the disclosed embodiments. However, it will be apparent that one or more embodiments can be carried out without these specific details. In other cases, well-known structures and devices are schematically shown for the sake of simplifying the drawings.

[0033] According to the general concept of the present invention, an electroplating apparatus is provided comprising an electroplating tank suitable for containing an electroplating solution in which an object to be electroplated as a cathode is at least partially immersed; a first anode provided in the electroplating tank; and a liquid spraying device. The liquid spraying device includes a main body portion having at least one inlet for transporting the electroplating solution to the main body portion, and a plurality of nozzles attached to the main body portion, at least a portion of the nozzles being configured such that the flow direction of the electroplating solution ejected from the nozzles is substantially parallel to the direction of the power lines formed by the first anode and the cathode.

[0034] According to another general concept of the present invention, an electroplating system is provided comprising the above-described electroplating apparatus, a tank into which electroplating solution overflowing from the electroplating bath flows, and a pump configured to send the electroplating solution from the tank through a pipe to the inlet of a liquid spraying apparatus.

[0035] Figure 1 is an explanatory diagram of an electroplating system according to an exemplary embodiment of the present invention. Figure 2 is an explanatory perspective view of an electroplating apparatus according to an exemplary embodiment of the present invention. Figure 3 is an explanatory perspective view of a liquid spray apparatus according to an exemplary embodiment of the present invention.

[0036] According to an exemplary embodiment of the present invention, an electroplating system is provided comprising an electroplating apparatus 100 (described in detail below), a tank 20, and a pump 40, as shown in Figures 1 to 3. In the electroplating process, the electroplating solution overflowing from the electroplating tank 1 of the electroplating apparatus 100 flows into the tank 20. The pump 40 is suitable for supplying the electroplating solution from the tank 20 to the electroplating tank 1 through a pipe 401 in order to replenish the electroplating solution in the electroplating tank 1.

[0037] According to exemplary embodiments of the present invention, as shown in Figures 1 to 3, the electroplating apparatus 100 is suitable for electroplating a metal layer onto a workpiece 200 by roll plating or hook plating, and the workpiece 200 to be electroplated may be placed on or directly connected to a material strip and moved together with the material strip. The electroplating apparatus 100 comprises an electroplating tank 1, a first anode 2, and a liquid spraying device 3. The electroplating tank 1 is suitable for containing an electroplating solution in which the workpiece 200 to be electroplated as a cathode is at least partially immersed. The first anode 2 is provided in the electroplating tank 1. The liquid spraying device 3 includes a body portion 31 and a plurality of nozzles 32. The body portion 31 is formed under vacuum and has at least one inlet for transporting the electroplating solution into the body portion 31. Multiple nozzles 32 are attached to the main body portion 31, and at least some of the nozzles 32 are configured such that the flow direction of the electroplating solution ejected from the nozzles 32 is substantially parallel to the direction of the power line formed by the first anode 2 and the cathode.

[0038] Generally, the liquid flow direction of the electroplating solution acting on an electroplating material strip parallel and perpendicular to the power lines is the liquid flow direction that provides the highest electroplating efficiency. According to the above embodiment of the present invention, at least a portion of the nozzle of the liquid spraying device can act as a cathode (i.e., the workpiece 200 to be electroplated) to powerfully spray the electroplating solution at a certain flow rate, and the flow direction of the electroplating solution sprayed from the nozzle is substantially parallel to the direction of the power lines formed by the first anode and cathode, thereby improving the efficiency of electroplating.

[0039] In an exemplary embodiment, as shown in Figure 2, the first anode 2 is positioned between the liquid spray device 3 and the workpiece 200. The first anode 2 provides the metals required for electroplating and may be formed from a single metal or from an alloy material that provides several metals required for alloy electroplating. For example, the first anode may be formed from a material such as an insoluble anode platinum / carbon. Multiple first through-holes 21 are formed in the first anode 2, and a portion of the electroplating solution ejected from the nozzle 32 flows through the first through-holes 21.

[0040] In this embodiment, a plurality of first anodes 2 are provided, with a gap between two adjacent first anodes 2. For example, the first anodes are arranged as a flat plate with a mesh-like structure and multiple through-holes, or the first anodes are composed of multiple parts and slots to allow the penetration of the liquid flow and to act as a buffer to some extent. A portion of the electroplating solution reaches the surface of the workpiece to be electroplated through the first through-holes of the first anodes 2 or the gap between two adjacent first anodes. The flow of the electroplating solution sufficiently impacts the first anodes 2, effectively activating them, accelerating the metal dissolution rate of the first anodes 2, and eventually dispersing in the electroplating solution, further improving the working efficiency of the first anodes 2 and reducing the amount of first anodes. Furthermore, the dissolution by-products of the first anode 2 (such as anode mud) can eventually flow into tank 20, where the electroplating solution can be filtered and washed, thus avoiding roughness of the coating due to impurities.

[0041] In exemplary embodiments, as shown in Figures 2 and 3, for example, the tube 401, the electroplating bath 1, and the nozzle 32 may be formed from non-metallic insulating materials such as polypropylene (PP), polytetrafluoroethylene, and corrosion-resistant materials. The nozzle 32 is detachably attached to the main body portion 31. In this way, nozzles of different models and sizes can be replaced depending on the type of workpiece 200 to be electroplated or the type of electroplating solution. The spray direction of at least a portion of the nozzle is configured to be adjustable. In this way, the spray angle of the liquid flow of the electroplating solution ejected by the nozzle can be changed to adapt to changes in the shape and / or structure of the workpiece 200 to be electroplated.

[0042] In an exemplary embodiment, as shown in Figure 2, the nozzles 32 are sparsely arranged in high current density regions and densely arranged in low current density regions. Multiple nozzles are arranged parallel to each other horizontally, parallel to each other vertically, or intersect. Furthermore, the arrangement density of nozzles 322 in the upper part of the main body portion 31 is greater than the arrangement density of nozzles 321 in the lower part of the main body portion. In this way, by combining an appropriate flow rate of the electroplating solution with an appropriate current density, the uniformity of the electroplated film electroplated on the workpiece 200 can be improved.

[0043] In an exemplary embodiment, as shown in Figure 2, the main body portion 31 of the liquid spraying device 3 includes a first portion 311 and two second portions 312. The two second portions 312 are positioned at both ends of the main body portion 311 and extend toward the workpiece 200. In this way, in the top view, the two opposing main body portions 31 of the liquid spraying devices 3 form approximately the shape of "[]". The nozzle 32 of each liquid spraying device 3 includes a plurality of first nozzles 321, 322 and a plurality of second nozzles 323. The first nozzles 321, 322 are mounted on the first portion 311, and the flow direction of the electroplating solution ejected from the first nozzles is substantially parallel to the direction of the power lines formed by the first anode 2 and cathode. The plurality of second nozzles 323 are positioned inside the two second portions 312 and eject the electroplating solution in opposite directions. Specifically, the second nozzles provided in the two second sections 312 spray the electroplating solution longitudinally toward the workpiece 200. With the workpiece 200 centered, the electroplating solution is sprayed from the first and second nozzles at various angles in the left-right and front-back directions, forming a multi-angle, powerful spray surrounding the workpiece as a cathode. The powerful spray can impact the blind spots in the deep pores of the workpiece, improving the finish of the electroplated film, uniform electroplating capability, and adhesion. The electroplating apparatus according to embodiments of the present invention is particularly suitable for functional areas in hidden locations such as sides, holes, recesses, cup openings, and complex parts of cavities, for example, for electroplating terminals with crimping surfaces on the sides and female terminals with contact surfaces in cup openings or cavity structures.

[0044] In exemplary embodiments, the workpiece 200 is attached to a material belt by direct connection or a removable mounting, for example, the material belt is arranged to move horizontally through the electroplating bath 1, and the flow direction (lateral direction) of the electroplating solution ejected from the first nozzle is perpendicular to the direction of movement (longitudinal direction) of the material belt. The electroplating apparatus according to embodiments of the present invention can improve the efficiency of electroplating by avoiding the phenomenon of reduced liquid on the back surface of the workpiece when the material belt is traveling at high speed.

[0045] In an exemplary embodiment, as shown in Figure 2, the two opposing side walls of the electroplating tank 1 are each provided with an overflow port 11, and the material belt moves through the overflow ports 11. The electroplating solution in the electroplating tank 1 can flow out through the overflow ports 11.

[0046] Figure 4 is an explanatory perspective view of a first anode according to an exemplary embodiment of the present invention. As shown in Figure 4, in one embodiment, the first anode 2 can be attached to the side wall of the electroplating tank 1 by a first bracket 22. For example, a hook 221 can be provided on the first bracket 22 so that the first bracket 22 can be conveniently and detachably hooked onto the side wall of the electroplating tank 1.

[0047] In an exemplary embodiment, as shown in Figure 1, the electroplating apparatus 100 also includes a power supply 5 suitable for supplying power to the first anode 2. The power supply 5 may be a DC power supply or a pulse power supply capable of supplying pulse voltage or pulse current.

[0048] According to an embodiment of the present invention, as shown in Figure 1, the electroplating system comprises an electroplating apparatus 100 according to any of the above embodiments, a tank 20, and a pump 40. The electroplating solution overflowing from the electroplating tank 1 flows into the tank 20. The pump 40 is suitable for sending the electroplating solution from the tank 20 through a pipe 401 to the inlet 301 of the liquid spraying device 3, and the electroplating solution in the liquid spraying device 3 is sprayed into the electroplating tank from each nozzle 32. The electroplating apparatus 100 also includes a transition tank 30, and the electroplating solution overflowing from the electroplating tank 1 flows through the transition tank 30 to the tank 20.

[0049] Referring to Figure 1, the positive electrode of the power supply 5 is connected to the first anode 2, and the negative electrode is connected to the workpiece 200, which acts as the cathode. The arrows in the figure indicate the flow direction of the electroplating solution. In the electroplating process, the workpiece 200 and the first anode 2 are simultaneously immersed in an electroplating solution containing ions to be electroplated. The cathode is reduced, and the ions to be electroplated are reduced to atoms in the workpiece 200, resulting in electroplating of the workpiece surface. The first anode has an oxidation reaction, and the material of the first anode preferentially takes in the metal to be electroplated. This metal is oxidized to become ions to be electroplated, which dissolve in the electroplating solution, maintaining the stability of the concentration of ions to be electroplated in the electroplating solution.

[0050] The electroplating solution from electroplating tank 1 first flows into the transfer tank 30 from the overflow port 11 of the electroplating tank, and then flows into tank 20 through the return pipe 301 of the transfer tank 30, allowing the electroplating solution to be filtered and washed. Next, the electroplating solution from tank 20 is transported by pump 40 through pipe 401 to liquid spraying device 3, and sprayed into the electroplating tank from nozzle 32 for circulation.

[0051] In the embodiment shown in Figure 1, it should be noted that the pipe 401 can deliver the electroplating solution to the electroplating tank 1 through the second liquid inlet hole 12 in the bottom wall of the electroplating tank 1. In addition, the electroplating solution in the electroplating tank 1 can also flow to the transfer tank 30 through other openings in the bottom wall. It can be understood that the electroplating solution can flow into and out of the electroplating tank through multiple liquid inlet holes and openings, and that the electroplating solution can flow in multiple directions.

[0052] The electroplating apparatus 100 of the embodiment of the present invention is suitable for electroplating single metal coatings such as gold, rhodium, silver, palladium, nickel, copper, tin, indium, bismuth, lead, cobalt, iron, and zinc onto precision electronic components such as terminals, locks, and shells. Because the process is relatively stable and controllable, the electronic components can obtain better mechanical properties, electrical properties, corrosion resistance, and other properties.

[0053] Figure 5 is an explanatory diagram of an electroplating system according to another exemplary embodiment of the present invention, showing the electroplating tank cut in the longitudinal direction. Figure 6 is another explanatory diagram of the electroplating system shown in Figure 5, showing the electroplating tank cut in the transverse direction. Figure 7 is an explanatory diagram of an electroplating system according to another exemplary embodiment of the present invention, showing the electroplating tank cut in the transverse direction. Figure 8 is an explanatory perspective view of an electroplating apparatus according to another exemplary embodiment of the present invention. Figure 9 is an explanatory perspective view of an anode and workpiece according to another exemplary embodiment of the present invention.

[0054] As shown in Figures 5 to 9, an electroplating apparatus 300 according to another embodiment of the present invention is based on the electroplating apparatus 100 shown in Figures 1 to 3, further comprising a second anode 4, the electrolytic potential of the second anode 4 being lower than the electrolytic potential of the first anode 2. The same or similar components of the electroplating apparatus 300 shown in Figures 5 to 9 and the electroplating apparatus 100 shown in Figures 1 to 3 use the same reference numerals.

[0055] In one embodiment, as shown in Figures 5 to 9, the electroplating apparatus 300 comprises an electroplating tank 1, a first anode 2, a second anode 4, and a liquid spray device 3. The electroplating tank 1 is suitable for containing an electroplating solution in which the workpiece to be electroplated 200, acting as a cathode, is at least partially immersed. The first anode 2 is provided in the electroplating tank 1. The liquid spray device 3 includes a main body portion 31 and a plurality of nozzles 32. The main body portion 31 is formed under vacuum and has at least one inlet for transporting the electroplating solution into the main body portion 31. The plurality of nozzles 32 are mounted on the main body portion 31, and at least a portion of the nozzles 32 are configured such that the flow direction of the electroplating solution ejected from the nozzles 32 is substantially parallel to the direction of the power lines formed by the first anode 2 and the cathode. The electrolytic potential of the second anode 4 is lower than that of the first anode 2. In addition to realizing the technical effects of the electroplating apparatus 100 described in Figures 1 to 3, the electroplating apparatus 300 according to the embodiment of the present invention can perform alloy electroplating on a workpiece by using two anodes.

[0056] In an exemplary embodiment, as shown in Figures 5, 6, 8, and 9, the electroplating apparatus 300 also includes two partitions 9 suitable for separating the electroplating tank 1 into an outer housing portion 13 and an inner housing portion 14 located inside the outer housing portion 13, with a plurality of pairs of first anodes 2 arranged in the inner housing portion and a plurality of pairs of second anodes 4 arranged in the outer housing portion 13. A plurality of second through-holes 91 are formed in the partitions 9, allowing the electroplating solution from the outer housing portion 13 to flow into the inner housing portion 14 through the second through-holes 91.

[0057] In an exemplary embodiment, as shown in Figures 5, 7, 8, and 9, the second anode 4 is placed in a basket 6 having a plurality of first through-holes, and the electroplating solution can be injected into and out of the basket 6 through the first through-holes, thereby impacting the second anode 4.

[0058] In an exemplary embodiment, as shown in Figure 6, a pair of adjustment covers 7 are provided on either side of the second liquid inlet hole 12. The pair of adjustment covers 7 are suitable for adjusting the level of the electroplating solution in the workpiece 200. The electroplating tank 1 is equipped with nozzles 32, partitions 9, liquid inlet holes, and other mechanisms to promote or block the flow of the electroplating solution, and the level of the electroplating solution in the electroplating tank may differ in different parts. By setting the adjustment covers 7, the level of the electroplating solution in the workpiece 200 can be adjusted.

[0059] In an exemplary embodiment, as shown in Figures 4, 5, 6, 8, and 9, the first anode is attached to the partition wall 9 by the first bracket 22, and the second anode is attached to the side wall of the electroplating tank by the second bracket 41. Hooks 221 and 411 are provided on the first bracket 22 and the second bracket 41, respectively.

[0060] In an exemplary embodiment, as shown in Figures 5 to 8, the electroplating apparatus 300 also includes a power supply unit 5 suitable for supplying power to the first anode 2 and the second anode 4. Furthermore, the power supply unit 5 includes a first current regulator 51 and a second current regulator 52 suitable for adjusting the current supplied to the first anode 2 and the second anode 4, respectively.

[0061] In an exemplary embodiment, the first current regulator 51 and the second current regulator 52 are also configured to adjust the ratio of current supplied to the first anode 2 and the second anode 4 according to the proportion of metal in the alloy being electroplated onto the workpiece 200. In this way, the ratio of current supplied to the first anode 2 and the second anode 4 can be adjusted so that the proportion of metal ions in the electroplating solution is always in equilibrium and the proportion of alloy in the alloy electrodeposited film can be precisely controlled.

[0062] In exemplary embodiments, alloy electrodeposited coatings include tin-silver alloys, gold-cobalt alloys, gold-nickel alloys, palladium-nickel alloys, tin-nickel alloys, zinc-nickel alloys, tin-bismuth alloys, tin-lead alloys, copper-zinc-tin alloys, zinc-nickel-iron alloys, and the like. For example, the electrolytic potential of zinc (Zn(2+)) is -0.76V, the electrolytic potential of nickel (Ni(2+)) is -0.25V, the electrolytic potential of tin (Sn(2+)) is -0.14V, the electrolytic potential of lead (Pb(2+)) is -0.13V, the electrolytic potential of copper (Cu(2+)) is +0.34V, the electrolytic potential of silver (Ag(1+)) is +0.80V, and the electrolytic potential of gold (Au(1+)) is +1.68V.

[0063] In an exemplary embodiment, as shown in Figures 5 to 8, the electroplating apparatus 300 also includes an auxiliary cathode 8, and the power supply also includes a third current regulator 53, the cathode of which is connected to the auxiliary cathode 8, and the anode of which is connected to the second anode 4. The third current regulator 53 is suitable for supplying power to the second anode 4 while the second current regulator 52 is not supplying current to the second anode 4, thereby ensuring that the second anode 4 has a positive potential and prevents displacement reactions between the second anode 4 and the electroplating solution.

[0064] In embodiments of the present invention, the auxiliary cathode 8 is a weak electrolytic electrode formed from an inert conductor such as titanium, carbon, and SUS316 stainless steel. The weak current flowing through the second anode 4 (low-potential metal anode) is controlled by the third current regulator 53 to be approximately 0.01 A, so that the second anode 4 becomes weakly positive without displacing the high-potential metals in the electroplating solution. At the same time, by electroplating the auxiliary cathode with as little alloy film as possible (to reduce losses), the auxiliary cathode also absorbs dissimilar metal contamination in the electroplating solution, thereby purifying the electroplating solution.

[0065] It can be understood that the first and second current regulators may share a single power supply or may be connected to different power supplies. The first, second, and third current regulators may include rectifiers such as silicon-controlled rectifiers or adjustable resistors.

[0066] Figures 10A to 10D are illustrative perspective views illustrating different mounting configurations of the pipe according to exemplary embodiments of the present invention.

[0067] To achieve the flow of electroplating solution in multiple directions, various liquid inlet holes are provided so that the electroplating solution can be delivered to the electroplating tank from different parts. In an exemplary embodiment, as shown in Figures 6, 7, and 10A to 10D, a first liquid inlet hole 15 is formed in the bottom wall of the electroplating tank 1, substantially aligned with the second anode, and the first liquid inlet hole 15 is suitable for delivering the electroplating solution vertically toward the second anode 4. A second liquid inlet hole 12 is formed in the bottom wall of the electroplating tank 1, substantially aligned with the workpiece 200, and the second liquid inlet hole 12 is suitable for delivering the electroplating solution vertically toward the workpiece 200.

[0068] In an exemplary embodiment, as shown in Figure 10A, and with reference to Figures 2 and 7, the pipe 41 includes a first outlet 402 for communicating with the inlet 331 of the liquid spraying device 3, and a second outlet 403 for transporting the electroplating solution from the side wall of the electroplating tank 1 into the electroplating tank.

[0069] In an exemplary embodiment, as shown in Figure 10B and with reference to Figures 2 and 8, the pipe 41 includes a first outlet 402 for communicating with the inlet 331 of the liquid spraying device 3, a second outlet 403 for transporting the electroplating solution from the side wall of the electroplating tank 1 into the electroplating tank, and a third outlet 404 for communicating with the second liquid inlet hole 12 in the bottom wall of the electroplating tank 1.

[0070] In an exemplary embodiment, as shown in Figure 10C and with reference to Figures 2 and 8, the pipe 41 includes a first outlet 402 for communicating with the inlet 331 of the liquid spraying device 3, a second outlet 403 for transporting the electroplating solution from the side wall of the electroplating tank 1 into the electroplating tank, and a fourth outlet 405 for communicating with the first liquid inlet hole 15 in the bottom wall of the electroplating tank 1.

[0071] In an exemplary embodiment, as shown in Figure 10D, and with reference to Figures 2 and 8, the pipe 41 includes a first outlet 402 for communicating with the inlet 331 of the liquid spraying device 3, a second outlet 403 for transporting the electroplating solution from the side wall of the electroplating tank 1 into the electroplating tank, a third outlet 404 for communicating with the second liquid inlet hole 12 in the bottom wall of the electroplating tank 1, and a fourth outlet 405 for communicating with the first liquid inlet hole 15 in the bottom wall of the electroplating tank 1.

[0072] According to another embodiment of the present invention, as shown in Figures 5 and 6, the electroplating system comprises an electroplating apparatus 300 according to any of the above embodiments, a tank 20, and a pump 40, wherein the electroplating solution overflowing from the electroplating tank 1 flows into the tank 20. The pump 40 is suitable for sending the electroplating solution from the tank 20 through a pipe 401 to the inlet 301 of the liquid spraying device 3, and the electroplating solution in the liquid spraying device 3 is sprayed into the electroplating tank from each nozzle 32. The electroplating apparatus 300 also comprises a transition tank 30, and the electroplating solution overflowing from the electroplating tank 1 flows through the transition tank 30 to the tank 20.

[0073] In an exemplary embodiment, the electroplating system further comprises a winding cylinder 201 and an unwinding cylinder 202. A material strip carrying the workpiece is wound onto the winding cylinder 201, and the material strip is unwinded from the unwinding cylinder 202. In this way, the workpiece to be electroplated, placed on the material strip, can be driven by the winding cylinder to move longitudinally in the electroplating bath.

[0074] Those skilled in the art should understand that the embodiments described above are illustrative and not limiting. For example, those skilled in the art can make many modifications to the embodiments without structural or principle contradictions, and can freely combine the various features described in different embodiments.

[0075] While several exemplary embodiments have been illustrated and described, it will be understood by those skilled in the art that various modifications or alterations can be made to these embodiments without departing from the principles and spirit of the disclosure. The scope of the disclosure is defined by the claims and their equivalents.

[0076] Where used herein, elements described in the singular and beginning with the words "a" or "an" should be understood not to exclude the plural form of the element or step unless otherwise specified. Furthermore, references to "one embodiment" of the present invention are not intended to be construed as excluding the existence of additional embodiments that also incorporate the described features. Moreover, unless otherwise specified, embodiments "comprising" or "having" an element or a number of elements having a particular characteristic may include additional such elements that do not have that characteristic.

Claims

1. An electroplating tank (1) suitable for containing an electroplating solution in which the object to be electroplated (200) as a cathode is at least partially immersed, The first anode (2) provided in the electroplating tank (1), The system includes a liquid ejection device (3), and the liquid ejection device (3) is A main body portion (31) having at least one inlet, wherein the at least one inlet is for transporting the electroplating solution to the main body portion (31), This includes a plurality of nozzles (32) attached to the main body portion (31), At least a portion of the nozzle (32) is configured such that the flow direction of the electroplating solution ejected from the nozzle (32) is substantially parallel to the direction of the power line formed by the first anode (2) and the cathode. The nozzle (32) is detachably attached to the main body portion (31), and the ejection direction of at least a portion of the nozzle (32) is configured to be adjustable, in an electroplating apparatus (100).

2. The first anode (2) is provided between the liquid ejection device (3) and the workpiece (200), The electroplating apparatus according to claim 1, wherein a plurality of first through holes (21) are formed in the first anode (2), and a portion of the electroplating solution ejected from the nozzle (32) flows through the first through holes (21).

3. The electroplating apparatus according to claim 2, wherein a plurality of the first anodes (2) are provided, and there is a gap between two adjacent first anodes (2).

4. The electroplating apparatus according to claim 1, wherein the nozzles (32) are sparsely arranged in a high current density region and densely arranged in a low current density region.

5. The electroplating apparatus according to claim 4, wherein the arrangement density of the nozzles (322) in the upper part of the main body portion (31) is greater than the arrangement density of the nozzles (321) in the lower part of the main body portion (31).

6. The main body portion (31) is The first part (311), The main body portion (31) includes two second portions (312) provided at both ends and extending toward the workpiece (200), The nozzle (32) is A plurality of first nozzles (321, 322) attached to the first portion (311), wherein the flow direction of the electroplating solution ejected from the first nozzles (321, 322) is substantially parallel to the direction of the power line formed by the first anode (2) and the cathode, The electroplating apparatus according to claim 1, further comprising a plurality of second nozzles (323) provided inside the two second portions (312) and configured to eject the electroplating solution toward the workpiece (200).

7. The nozzle (32) is The main body portion (31) includes a plurality of first nozzles (321, 322) attached to the first portion (311), wherein the flow direction of the electroplating solution ejected from the first nozzles (321, 322) is substantially parallel to the direction of the power line formed by the first anode (2) and the cathode. The workpiece (200) is placed on a material strip configured to move horizontally through the electroplating bath (1), The flow direction of the electroplating solution ejected from the first nozzles (321, 322) is perpendicular to the direction of movement of the material strip. The electroplating apparatus according to claim 1, wherein each of the two opposing side walls of the electroplating tank (1) is provided with an overflow port (11), and the material strip moves through the overflow port (11).

8. The electroplating apparatus according to claim 1, further comprising a second anode (4), wherein the electrolytic potential of the second anode (4) is lower than the electrolytic potential of the first anode (2).

9. The electroplating apparatus according to claim 8, wherein the second anode (4) is placed in a basket (6) having a plurality of first through holes (21).

10. The electroplating tank (1) further includes two partition walls (9) configured to separate the outer housing portion (13) and the inner housing portion (14) located inside the outer housing portion (13), Multiple pairs of the first anodes (2) are arranged in the inner housing portion (14), and multiple pairs of the second anodes (4) are arranged in the outer housing portion (13), The electroplating apparatus according to claim 8, wherein a plurality of second through holes (91) are formed in the partition wall (9), allowing the electroplating solution in the outer housing portion (13) to flow into the inner housing portion (14) through the second through holes (91).

11. The electroplating apparatus according to claim 10, wherein the first anode (2) is attached to the partition wall (9) by a first bracket (22), and the second anode (4) is attached to the side wall of the electroplating tank (1) by a second bracket (41).

12. The electroplating apparatus according to claim 9, further comprising a power supply device (5) configured to supply power to the first anode (2) and the second anode (4).

13. The electroplating apparatus according to claim 12, wherein the power supply device (5) includes a first current regulator (51) and a second current regulator (52) configured to adjust the current supplied to the first anode (2) and the second anode (4), respectively.

14. The electroplating apparatus according to claim 13, wherein the first current regulator (51) and the second current regulator (52) are also configured to adjust the ratio of current supplied to the first anode (2) and the second anode (4) according to the proportion of metal of the alloy to be electroplated onto the workpiece (200).

15. Further equipped with an auxiliary cathode (8), The power supply unit (5) includes a first current regulator (51) and a second current regulator (52) configured to adjust the current supplied to the first anode (2) and the second anode (4), respectively. The power supply unit (5) further includes a third current regulator (53), the cathode of the third current regulator (53) is connected to the auxiliary cathode (8), and the anode of the third current regulator (53) is connected to the second anode (4). The electroplating apparatus according to claim 12, wherein the third current regulator (53) is suitable for supplying power to the second anode (4) while the second current regulator (52) is stopped supplying current to the second anode (4), so that the second anode (4) has a positive potential and prevents a displacement reaction between the second anode (4) and the electroplating solution.

16. The electroplating apparatus according to claim 8, wherein a plurality of first liquid inlet holes (15) substantially aligned with the second anode (4) are arranged in the bottom wall of the electroplating tank (1), and the first liquid inlet holes (15) are suitable for transporting the electroplating solution vertically toward the second anode (4).

17. The electroplating apparatus according to claim 1, wherein a plurality of second liquid inlet holes (12) substantially aligned with the workpiece (200) are arranged in the bottom wall of the electroplating tank (1), and the second liquid inlet holes (12) are suitable for transporting the electroplating solution vertically toward the workpiece (200).

18. The electroplating apparatus according to claim 17, wherein a pair of adjustment covers (7) are provided on both sides of the second liquid inlet hole (12), and the adjustment covers (7) are configured to adjust the liquid level of the electroplating solution in the workpiece (200).

19. An electroplating tank (1) suitable for containing an electroplating solution in which the object to be electroplated (200) as a cathode is at least partially immersed, The first anode (2) provided in the electroplating tank (1), The system includes a liquid ejection device (3), and the liquid ejection device (3) is A main body portion (31) having at least one inlet, wherein the at least one inlet is for transporting the electroplating solution to the main body portion (31), This includes a plurality of nozzles (32) attached to the main body portion (31), At least a portion of the nozzle (32) is configured such that the flow direction of the electroplating solution ejected from the nozzle (32) is substantially parallel to the direction of the power line formed by the first anode (2) and the cathode. The nozzles (32) are sparsely arranged in a high current density region and densely arranged in a low current density region in an electroplating apparatus (100).

20. An electroplating tank (1) suitable for containing an electroplating solution in which the object to be electroplated (200) as a cathode is at least partially immersed, The first anode (2) provided in the electroplating tank (1), The system includes a liquid ejection device (3), and the liquid ejection device (3) is A main body portion (31) having at least one inlet, wherein the at least one inlet is for transporting the electroplating solution to the main body portion (31), This includes a plurality of nozzles (32) attached to the main body portion (31), At least a portion of the nozzle (32) is configured such that the flow direction of the electroplating solution ejected from the nozzle (32) is substantially parallel to the direction of the power line formed by the first anode (2) and the cathode. The main body portion (31) is The first part (311), The main body portion (31) includes two second portions (312) provided at both ends and extending toward the workpiece (200), The nozzle (32) is A plurality of first nozzles (321, 322) attached to the first portion (311), wherein the flow direction of the electroplating solution ejected from the first nozzles (321, 322) is substantially parallel to the direction of the power line formed by the first anode (2) and the cathode, An electroplating apparatus (100) comprising a plurality of second nozzles (323) provided inside the two second portions (312) and configured to eject the electroplating solution toward the workpiece (200).

21. An electroplating tank (1) suitable for containing an electroplating solution in which the object to be electroplated (200) as a cathode is at least partially immersed, The first anode (2) provided in the electroplating tank (1), The system includes a liquid ejection device (3), and the liquid ejection device (3) is A main body portion (31) having at least one inlet, wherein the at least one inlet is for transporting the electroplating solution to the main body portion (31), This includes a plurality of nozzles (32) attached to the main body portion (31), The nozzle (32) is The main body portion (31) includes a plurality of first nozzles (321, 322) attached to the first portion (311), wherein the flow direction of the electroplating solution ejected from the first nozzles (321, 322) is substantially parallel to the direction of the power line formed by the first anode (2) and the cathode. The workpiece (200) is placed on a material strip configured to move horizontally through the electroplating bath (1), The flow direction of the electroplating solution ejected from the first nozzles (321, 322) is perpendicular to the direction of movement of the material strip. An electroplating apparatus wherein each of the two opposing side walls of the electroplating tank (1) is provided with an overflow port (11), and the material strip moves through the overflow port (11).

22. An electroplating tank (1) suitable for containing an electroplating solution in which the object to be electroplated (200) as a cathode is at least partially immersed, The first anode (2) provided in the electroplating tank (1), The system includes a liquid ejection device (3), and the liquid ejection device (3) is A main body portion (31) having at least one inlet, wherein the at least one inlet is for transporting the electroplating solution to the main body portion (31), This includes a plurality of nozzles (32) attached to the main body portion (31), At least a portion of the nozzle (32) is configured such that the flow direction of the electroplating solution ejected from the nozzle (32) is substantially parallel to the direction of the power line formed by the first anode (2) and the cathode. An electroplating apparatus comprising a plurality of second liquid inlet holes (12) arranged in the bottom wall of the electroplating tank (1) and substantially aligned with the workpiece (200), wherein the second liquid inlet holes (12) are suitable for transporting the electroplating solution vertically toward the workpiece (200).

23. The electroplating apparatus (100) according to any one of claims 1 to 22, A tank (20) into which the electroplating solution overflowing from the electroplating tank (1) flows, An electroplating system comprising a pump (40) configured to send the electroplating solution from the tank (20) through a pipe (401) to the inlet of the liquid ejection device (3).

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