A double-sided metal-based thermoelectric separation circuit board

Abstract

The utility model discloses a double -faced metal base thermoelectric separation circuit board, include: metal base material layer, the through -hole groove is established in metal base material layer inside, metal base material layer is connected with through -hole cover through the through -hole groove, the boss groove is established in metal base material layer inside, metal base material layer is connected with boss main part through boss groove inside, metal base material layer includes first metal base plate and second metal base plate, and first metal base plate is spliced with second metal base plate, the utility model has the following advantages: through -hole cover cooperation first electroplating layer can effectively in increase circuit board through -hole's heat dissipation area, and boss main part cooperation second electroplating layer can make circuit board's heat can pass both sides and radiate, enter the heat dissipation performance of reinforcing circuit board, first metal base plate and second metal base plate press together mode, guarantee the stability of through -hole cover and boss main part and metal base material layer between connection, in the enhancement heat dissipation performance's simultaneously, effectively avoid through -hole cover and boss main part and the condition of appearing and circuit board between the separation of welding.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a double-sided metal-based thermoelectric separation circuit board. Background Technology

[0002] Currently, when manufacturing double-sided metal-based thermoelectric separation circuit boards, boss pads are usually formed on the metal substrate layer. By creating hollow grooves on the insulating layer and the circuit layer that correspond to the boss pads, the metal substrate layer, insulating layer and circuit layer are pressed together and heat is transferred using the boss pads. Chinese patent CN221509844U discloses a high thermal conductivity thermoelectric separation circuit board, including a metal substrate layer and an insulating layer. The key feature is that a first through-hole and a second through-hole are respectively formed on the metal substrate layer and the insulating layer. Metal bosses are embedded within the first and second through-holes, and an electroplated layer is formed on the inner walls of the first and second through-holes. The surface of the metal bosses is tightly attached to the electroplated layer. A circuit layer is also fixed on the insulating layer. This invention solves the problems of low material utilization and low heat dissipation efficiency in existing circuit boards. By connecting metal bosses within the through-holes, material utilization is improved. The electroplated layer on the walls of the first and second through-holes increases the heat transfer efficiency between the insulating layer and the metal bosses, while also transferring heat to the metal substrate layer, further improving heat transfer efficiency.

[0003] The existing technology has the following shortcomings: While welding the metal bosses to the metal substrate in the existing technology can avoid the waste caused by etching the metal substrate, it can lead to the metal bosses and the metal substrate separating during use. Therefore, a double-sided metal-based thermoelectric separation circuit board is provided to solve the above problems. Utility Model Content

[0004] To solve the problems mentioned above, the technical solution adopted by this utility model is: a double-sided metal-based thermoelectric separation circuit board, comprising: a metal substrate layer, wherein a through-hole groove is formed inside the metal substrate layer, a through-hole sleeve is connected to the metal substrate layer through the through-hole groove, a boss groove is formed inside the metal substrate layer, a boss body is connected to the metal substrate layer through the boss groove, the metal substrate layer includes a first metal substrate and a second metal substrate, the first metal substrate and the second metal substrate are pressed and spliced, the through-hole sleeve includes a sleeve body and a sleeve head, both ends of the sleeve body are provided with sleeve heads, the boss body includes a boss seat and a boss head, both ends of the boss seat are provided with boss heads.

[0005] As a preferred embodiment of this utility model, the sleeve has an elliptical cross-section, the boss seat has a conical disk structure, and the first metal substrate and the second metal substrate have the same size and structure.

[0006] As a preferred embodiment of this utility model, a first electroplating layer is provided between the through hole groove and the through hole sleeve, and a second electroplating layer is provided between the boss groove and the boss body.

[0007] As a preferred embodiment of the present invention, an insulating layer is provided on the opposite outer sides of both the first metal substrate and the second metal substrate, and a circuit layer is provided on the outer side of the insulating layer.

[0008] As a preferred embodiment of the present invention, a green oil layer is provided on the side opposite to the insulation layer of the circuit layer, a first groove is provided on the side of the green oil layer and the circuit layer facing the through hole groove, and a second groove is provided on the side of the green oil layer and the circuit layer facing the boss groove.

[0009] In a preferred embodiment of this utility model, the metal substrate layer, the through-hole sleeve, the boss body, the first electroplating layer, and the second electroplating layer are all made of copper.

[0010] The present invention has the following advantages: the present invention can effectively increase the heat dissipation area of ​​the circuit board through hole sleeve in combination with the first electroplating layer, and enable the insulating layer to directly transfer heat to the through hole sleeve for heat dissipation. The boss body in combination with the second electroplating layer can enable the heat of the circuit board to be dissipated through both sides, thereby enhancing the heat dissipation performance of the circuit board.

[0011] By bonding the first metal substrate and the second metal substrate together, the stability of the connection between the through-hole sleeve and the boss body and the metal substrate layer is ensured. While enhancing heat dissipation performance, it also effectively avoids the situation of desoldering between the through-hole sleeve and the boss body and the circuit board. Attached Figure Description

[0012] Figure 1 This is a schematic cross-sectional view of the circuit board structure according to a preferred embodiment of the present invention;

[0013] Figure 2 This is a schematic diagram of a partial disassembled structure of the circuit board according to a preferred embodiment of the present invention;

[0014] Figure 3 This is a schematic diagram of the through-hole sleeve structure of a preferred embodiment of the present invention.

[0015] Explanation of reference numerals in the attached drawings: 1. Metal substrate layer; 101. First metal substrate; 102. Second metal substrate; 2. Through-hole groove; 3. Through-hole sleeve; 301. Sleeve body; 302. Sleeve head; 4. Boss groove; 5. Boss body; 501. Boss seat; 502. Boss head; 6. First electroplating layer; 7. Second electroplating layer; 8. Insulating layer; 9. Circuit layer; 11. First groove; 12. Second groove; 13. Green oil layer. Detailed Implementation

[0016] The technical solution of this utility model will now be clearly and completely described in conjunction with the accompanying drawings. In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0017] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0018] The present invention will be further described below with reference to the accompanying drawings.

[0019] Please refer to the following: Figures 1-3 This utility model discloses a double-sided metal-based thermoelectric separation circuit board, comprising: a metal substrate layer 1, a through-hole groove 2 formed inside the metal substrate layer 1, a through-hole sleeve 3 connected to the metal substrate layer 1 through the through-hole groove 2, a boss groove 4 formed inside the metal substrate layer 1, a boss body 5 connected to the metal substrate layer 1 through the boss groove 4, the metal substrate layer 1 including a first metal substrate 101 and a second metal substrate 102, the first metal substrate 101 and the second metal substrate 102 being pressed and spliced, the through-hole sleeve 3 including a sleeve body 301 and a sleeve head 302, the sleeve body 301 having sleeve heads 302 at both ends, the boss body 5 including a boss seat 501 and a boss head 502, the boss seat 501 having boss heads 502 at both ends.

[0020] Combination Figure 1 and Figure 2As shown, the sleeve 301 has an elliptical cross-section, the boss seat 501 has a conical disk structure, the first metal substrate 101 and the second metal substrate 102 are the same size and structure, a first electroplated layer 6 is provided between the through-hole groove 2 and the through-hole sleeve 3, and a second electroplated layer 7 is provided between the boss groove 4 and the boss body 5. During manufacturing, the through-hole sleeve 3 and the boss body 5 are respectively placed in the through-hole groove 2 and the boss groove 4 between the first metal substrate 101 and the second metal substrate 102. Then, the first metal substrate 101 and the second metal substrate 102 are pressed and bonded together. Next, an insulating layer 8, a circuit layer 9, and a green oil layer 13 are provided on the surfaces of the pressed-together first metal substrate 101 and second metal substrate 102. After the above processes are completed, the circuit board is electroplated to produce the first electroplated layer 6 and the second electroplated layer 7. This allows the circuit board to effectively increase its strength during use through the through-hole sleeve 3 in conjunction with the first electroplated layer 6. The through-hole provides a large heat dissipation area, allowing the insulating layer 8 to directly transfer heat to the through-hole sleeve 3 for heat dissipation. The boss body 5, in conjunction with the second electroplated layer 7, allows the heat of the circuit board to be dissipated through both sides. Furthermore, by pressing and bonding the first metal substrate 101 and the second metal substrate 102 together, it not only avoids the need to purchase additional thick substrate boards for etching to form boss pads, saving materials, but also ensures the stability of the connection between the through-hole sleeve 3 and the boss body 5 and the metal substrate layer 1. While enhancing heat dissipation performance, it also effectively prevents the through-hole sleeve 3 and the boss body 5 from detaching from the circuit board.

[0021] In this circuit board, an insulating layer 8 is provided on the opposite outer side of the first metal substrate 101 and the second metal substrate 102. A circuit layer 9 is provided on the outer side of the insulating layer 8. A green oil layer 13 is provided on the opposite side of the circuit layer 9 and the insulating layer 8. A first groove 11 is formed on the side of the green oil layer 13 and the circuit layer 9 facing the through hole groove 2. A second groove 12 is formed on the side of the green oil layer 13 and the circuit layer 9 facing the boss groove 4. The metal substrate layer 1, the through hole sleeve 3, the boss body 5, the first electroplating layer 6, and the second electroplating layer 7 are all made of copper, which facilitates the heat conduction and heat dissipation of the circuit board.

[0022] The above are merely preferred embodiments of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

[0023] All other parts of this utility model that are not described in detail belong to the prior art, and therefore will not be described in detail here.

[0024] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A double-sided metal-based thermoelectric separation circuit board, comprising: A metal substrate layer (1) is characterized in that a through-hole groove (2) is provided inside the metal substrate layer (1), a through-hole sleeve (3) is connected to the metal substrate layer (1) through the through-hole groove (2), a boss groove (4) is provided inside the metal substrate layer (1), a boss body (5) is connected to the metal substrate layer (1) through the boss groove (4), the metal substrate layer (1) includes a first metal substrate (101) and a second metal substrate (102), the first metal substrate (101) and the second metal substrate (102) are pressed and spliced, the through-hole sleeve (3) includes a sleeve body (301) and a sleeve head (302), both ends of the sleeve body (301) are provided with sleeve heads (302), the boss body (5) includes a boss seat (501) and a boss head (502), both ends of the boss seat (501) are provided with boss heads (502).

2. The double-sided metal-based thermoelectric separation circuit board as described in claim 1, characterized in that, The sleeve (301) has an elliptical cross-section, the boss seat (501) has a conical disk structure, and the first metal substrate (101) and the second metal substrate (102) have the same size and structure.

3. The double-sided metal-based thermoelectric separation circuit board as described in claim 1, characterized in that, A first electroplating layer (6) is provided between the through hole groove (2) and the through hole sleeve (3), and a second electroplating layer (7) is provided between the boss groove (4) and the boss body (5).

4. The double-sided metal-based thermoelectric separation circuit board as described in claim 1, characterized in that, An insulating layer (8) is provided on the opposite outer side of the first metal substrate (101) and the second metal substrate (102), and a circuit layer (9) is provided on the outer side of the insulating layer (8).

5. A double-sided metal-based thermoelectric separation circuit board as described in claim 4, characterized in that, A green oil layer (13) is provided on the side opposite to the insulation layer (8) of the circuit layer (9). A first groove (11) is provided on the side of the green oil layer (13) and the circuit layer (9) facing the through hole groove (2). A second groove (12) is provided on the side of the green oil layer (13) and the circuit layer (9) facing the boss groove (4).

6. The double-sided metal-based thermoelectric separation circuit board as described in claim 1, characterized in that, The metal substrate layer (1), through hole sleeve (3), boss body (5), first electroplating layer (6) and second electroplating layer (7) are all made of copper.

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