Substrate processing equipment

JP7878837B2Active Publication Date: 2026-06-23TOKYO ELECTRON LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
TOKYO ELECTRON LTD
Filing Date
2022-08-25
Publication Date
2026-06-23

AI Technical Summary

Benefits of technology

【0007】 一態様によれば、回転テーブルの載置台に対して基板を安定的に載置することができる。

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Abstract

To provide a technique capable of stably mounting a substrate to a mounting table of a rotary table.SOLUTION: A substrate processing apparatus includes: a vacuum vessel; a rotary table rotatably in the vacuum vessel; a mounting table having a mounting surface for mounting a substrate at a position apart from a rotation center of the rotary table; a lift pin relatively displaced from the mounting table through an open hole of the mounting table to ascend and descend the substrate; and a gas suction part for applying suction force to the substrate through the open hole when descending the lift pin. The mounting table communicating with the open hole includes a groove part on a mounting surface extended closer to a center of the mounting table from the open hole.SELECTED DRAWING: Figure 5
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Claims

1. Vacuum container and A rotating table is provided rotatably inside the vacuum container, A mounting table having a mounting surface on which a substrate is placed at a position away from the rotation center of the aforementioned rotating table, A lift pin, which moves relative to the mounting base and raises or lowers the substrate, is provided through a through hole in the mounting base. The system includes a gas suction unit that applies an attractive force to the substrate through the through hole when the lift pin is lowered, The mounting base has a groove on its mounting surface that communicates with the through hole and extends from the through hole toward the center of the mounting base. Circuit board processing equipment.

2. The groove portion has a part that extends linearly from the through hole toward the center of the base described above. The substrate processing apparatus according to claim 1.

3. The groove portion has a portion that is in communication with the linearly extending portion and that circles a position away from the center of the base described above. The substrate processing apparatus according to claim 2.

4. The aforementioned circumferential portion is formed in an annular shape. The substrate processing apparatus according to claim 3.

5. The mounting platform rotates relative to the rotary table. A substrate processing apparatus according to any one of claims 1 to 4.

6. A housing portion for housing the aforementioned lift pin, When the substrate is placed on the mounting base, the mounting base has a cylindrical member that rises relative to the housing portion together with the lift pin on the back surface of the mounting base and contacts the mounting base, The gas suction section transmits suction force to the through hole and the groove through the inside of the housing section and the inside of the cylindrical member. A substrate processing apparatus according to any one of claims 1 to 4.

7. The gas suction unit is connected to the outer circumference of the vacuum container and transmits suction force to the through-holes, which are among the plurality of through-holes formed in the base described above and are located on the outer circumference side of the rotating table. The substrate processing apparatus according to claim 6.