Electronic devices and methods for manufacturing electronic devices
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- DAI NIPPON PRINTING CO LTD
- Filing Date
- 2022-08-02
- Publication Date
- 2026-06-25
Smart Images

Figure 0007880043000002 
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Abstract
Claims
1. An electronic device comprising a first display area and a second display area located at a different position from the first display area in a plan view, circuit board and A plurality of first electrodes located on the substrate, Multiple organic layers located on the first electrode, The system comprises a second electrode located on the organic layer and extending so as to overlap the plurality of first electrodes in a plan view, The second electrode located in the second display area has multiple openings formed in positions that do not overlap with the first electrode in a plan view. The second display area includes a central area located in the center of the second display area and a peripheral area located outside the central area and at the periphery of the second display area. The plurality of openings located in the central region have a first opening ratio, The plurality of openings located in the peripheral region have a second opening ratio that is larger than the first opening ratio. In the central region, the number of apertures is located that is obtained by multiplying the number of first electrodes in the central region by the first numerical aperture ratio. An electronic device wherein the peripheral region contains a number of apertures obtained by multiplying the number of first electrodes in the peripheral region by a second numerical aperture ratio that is larger than the first numerical aperture ratio.
2. One of the openings located in the central region has a first opening area, The electronic device according to claim 1, wherein one of the openings located in the peripheral region has a second opening area that is larger than the first opening area.
3. The electronic device according to claim 1 or 2, wherein the ratio of the first aperture ratio to the second aperture ratio is 0 or more and 0.9 or less.
4. The electronic device according to claim 2, wherein the ratio of the first aperture area to the second aperture area is 0 or more and 0.9 or less.
5. The electronic device according to claim 1, wherein the ratio of the first numerical aperture ratio to the second numerical aperture ratio is 0 or more and 0.9 or less.
6. The electronic device according to claim 1, wherein the peripheral region is positioned along the outer edge of the second display region.
7. The second display region includes an intermediate region located between the central region and the peripheral region. The electronic device according to claim 1, wherein the plurality of openings located in the intermediate region have a third opening ratio that is larger than the first opening ratio and smaller than the second opening ratio.
8. The substrate includes a first surface on which a plurality of the first electrodes are located, and a second surface located on the opposite side of the first surface. The electronic device according to claim 1, wherein the second display area overlaps with the optical component located on the second surface side in a plan view.
9. The plurality of first electrodes include a plurality of first color electrodes, a plurality of second color electrodes, and a plurality of third color electrodes. The plurality of organic layers include a plurality of first-color organic layers located on the first color electrode, a plurality of second-color organic layers located on the second color electrode, and a plurality of third-color organic layers located on the third color electrode. The first color electrode and the second color electrode are arranged alternately along a first direction and alternately along a second direction perpendicular to the first direction. The electronic device according to claim 1, wherein the third color electrode is arranged along the first direction so as to be located between the first color electrode and the second color electrode in the first direction, and is arranged along the second direction so as to be located between the first color electrode and the second color electrode in the second direction.
10. The electronic device according to claim 1, wherein an organic layer opening is formed in the organic layer at a position that overlaps with the opening in a plan view.
11. The substrate comprises an insulating layer located between the substrate and the organic layer in the direction normal to the substrate, The electronic device according to claim 1, wherein the insulating layer includes a first insulating layer opening that overlaps the first electrode in a plan view.
12. The electronic device according to claim 11, wherein the insulating layer includes a second insulating layer opening that overlaps the opening in a plan view.
13. A method for manufacturing an electronic device, comprising a first display area and a second display area located at a different position from the first display area in a plan view, A preparation step of preparing a laminate comprising a substrate, a plurality of first electrodes located on the substrate, and a plurality of organic layers located on the first electrodes, A second electrode formation step in which a second electrode is formed on the organic layer so as to overlap the plurality of first electrodes in a plan view, The process includes forming an opening in the second electrode located in the second display area, at a position that does not overlap with the first electrode in a plan view, The second display area includes a central area located in the center of the second display area and a peripheral area located outside the central area and at the periphery of the second display area. The plurality of openings located in the central region have a first opening ratio, The plurality of openings located in the peripheral region have a second opening ratio that is larger than the first opening ratio. In the central region, the number of apertures is located that is obtained by multiplying the number of first electrodes in the central region by the first numerical aperture ratio. A method for manufacturing an electronic device, wherein the peripheral region is located in a number of apertures obtained by multiplying the number of first electrodes in the peripheral region by a second numerical aperture ratio that is larger than the first numerical aperture ratio.
14. The method for manufacturing an electronic device according to claim 13, wherein the opening formation step includes a removal step of forming the opening by removing a part of the second electrode.
15. The method for manufacturing an electronic device according to claim 14, wherein the removal step includes an irradiation step of irradiating the second electrode with a laser to form the aperture.
16. A method for manufacturing an electronic device according to claim 13, comprising a suppression layer formation step of forming a suppression layer that suppresses the formation of the second electrode at the position where the opening is formed on the substrate, prior to the second electrode formation step.