Temperature measuring device, heat treatment apparatus, and temperature measuring method

Abstract

A temperature measuring device according to an aspect of the present disclosure comprises: a SAW sensor that receives an input signal supplied from the outside and that can output a measurement signal in accordance with the ambient temperature; and a first antenna electrically connected to the SAW sensor. The SAW sensor receives, in a state where the first antenna and a second antenna face each other in a prescribed space, the input signal supplied through the first and second antennas, and outputs the measurement signal in accordance with the ambient temperature in the space.

Description

Technical Field

[0001] The present disclosure relates to a temperature measurement device, a heat treatment device, and a temperature measurement method.

Background Art

[0002] Patent Document 1 discloses a temperature measurement device having a plurality of temperature detection means, signal processing means for processing a signal detected by the temperature detection means, and information holding means for storing and holding a result processed by the signal processing means on a semiconductor wafer. This temperature measurement device further has, on the semiconductor wafer, first control means for overall control, and drive means for driving the temperature detection means, the signal processing means, the information holding means, and the first control means.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a temperature measurement device, a heat treatment device, and a temperature measurement method useful for easily measuring the temperature in a space.

Means for Solving the Problems

[0005] A temperature measurement device according to one aspect of the present disclosure includes a SAW sensor capable of receiving a supply of an input signal from the outside and outputting a measurement signal corresponding to the ambient temperature, and a first antenna electrically connected to the SAW sensor. The SAW sensor is configured to receive a supply of an input signal via the first antenna and the second antenna in a state where the first antenna faces the second antenna in a predetermined space, and output a measurement signal corresponding to the ambient temperature in the space.

Effects of the Invention

[0006] This disclosure provides a temperature measuring device, a heat treatment device, and a temperature measuring method that are useful for easily measuring the temperature in a space. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic diagram showing an example of a substrate processing system. [Figure 2] Figure 2 is a schematic side view showing an example of a coating and developing apparatus. [Figure 3] Figure 3 is a schematic diagram showing an example of a heat treatment unit and an example of the functional configuration of a control device. [Figure 4] Figure 4 is a schematic diagram showing an example of a temperature measurement device. [Figure 5] Figure 5 is a schematic diagram showing an example of the first measurement unit. [Figure 6] Figure 6 is a schematic diagram showing an example of a pair of opposing antennas. [Figure 7] Figure 7 is a schematic diagram showing an example of the second measurement unit. [Figure 8] Figure 8 is a schematic diagram showing an example of the configuration of a temperature measurement system. [Figure 9] Figure 9 is a graph showing an example of a measurement signal obtained from a SAW sensor. [Figure 10] Figure 10 is a schematic diagram showing an example of the hardware configuration of a control device. [Figure 11] Figure 11 is a flowchart showing an example of a temperature measurement method. [Figure 12] Figure 12 is a schematic diagram showing an example of a temperature measuring device. [Figure 13] Figure 13 is a schematic diagram showing an example of a pair of opposing antennas. [Modes for carrying out the invention]

[0008] Hereinafter, one embodiment will be described with reference to the drawings. In the description, the same elements or elements having the same function will be denoted by the same reference numeral, and redundant descriptions will be omitted. Some of the drawings show directions Z1 and Z2 corresponding to the vertical direction, where direction Z1 corresponds to the direction moving vertically upward and direction Z2 corresponds to the direction moving vertically downward.

[0009] [Circuit board processing system] The substrate processing system 1 (heat treatment apparatus) shown in Figure 1 is a system that performs the following processes on a workpiece W: formation of a photosensitive film, exposure of the photosensitive film, and development of the photosensitive film. The workpiece W to be processed is, for example, a substrate, or a substrate in which a film or circuit has been formed by a predetermined process. The substrate is, as an example, a silicon wafer. The workpiece W (substrate) may be circular. The workpiece W may also be a glass substrate, a mask substrate, or an FPD (Flat Panel Display). The photosensitive film is, for example, a resist film.

[0010] As shown in Figures 1 and 2, the substrate processing system 1 comprises a coating and developing apparatus 2, an exposure apparatus 3, and a control device 20. The coating and developing apparatus 2 coats the surface of the workpiece W with a resist (chemical solution) to form a resist film before exposure processing by the exposure apparatus 3, and develops the resist film after exposure processing. The exposure apparatus 3 is an apparatus that exposes the resist film (photosensitive coating) formed on the workpiece W (substrate). Specifically, the exposure apparatus 3 irradiates the portion of the resist film to be exposed with energy rays by methods such as immersion exposure. The coating and developing apparatus 2 comprises a carrier block 4, a processing block 5, and an interface block 6.

[0011] Carrier block 4 conducts the introduction of work W into the coating and developing apparatus 2 and the derivation of work W from the coating and developing apparatus 2. For example, carrier block 4 can support a plurality of carriers C for work W and incorporates a transfer device A1 including a transfer arm. Carrier C accommodates, for example, a plurality of circular works W. Transfer device A1 takes out work W from carrier C and delivers it to processing block 5, and receives work W from processing block 5 and returns it into carrier C. Processing block 5 has processing modules 11, 12, 13, 14.

[0012] Processing module 11 incorporates a liquid processing unit U1, a heat treatment unit U2, and a transfer device A3 that transfers work W to these units. Processing module 11 forms a lower layer film on the surface of work W by liquid processing unit U; and heat treatment unit U2. Liquid processing unit U1 applies a processing liquid for forming the lower layer film on the surface of work W. Heat treatment unit U2 performs various heat treatments associated with the formation of the lower layer film.

[0013] Processing module 12 incorporates a liquid processing unit U1, a heat treatment unit U2, and a transfer device A3 that transfers work W to these units. Processing module 12 forms a resist film on the lower layer film by liquid processing unit U1 and heat treatment unit U2. Liquid processing unit U1 applies a processing liquid for forming the resist film on the lower layer film. Heat treatment unit U2 performs various heat treatments associated with the formation of the resist film.

[0014] Processing module 13 incorporates a liquid processing unit U1, a heat treatment unit U2, and a transfer device A3 that transfers work W to these units. Processing module 13 forms an upper layer film on the resist film by liquid processing unit U1 and heat treatment unit U2. Liquid processing unit U1 applies a processing liquid for forming the upper layer film on the resist film. Heat treatment unit U2 performs various heat treatments associated with the formation of the upper layer film.

[0015] The processing module 14 incorporates a liquid processing unit U1, a heat treatment unit U2, and a transfer device A3 that transfers the workpiece W to these units. The processing module 14 performs development processing of the resist film subjected to exposure processing and heat treatment accompanying the development processing by the liquid processing unit U1 and the heat treatment unit U2. The liquid processing unit U1 performs development processing of the resist film by applying a developer onto the surface of the exposed workpiece W and then washing it away with a rinse liquid. The heat treatment unit U2 performs various heat treatments accompanying the development processing. Specific examples of the heat treatment include pre-exposure heating treatment (PEB: Post Exposure Bake), and post-development heating treatment (PB: Post Bake), etc.

[0016] A shelf unit U10 is provided on the side of the carrier block 4 within the processing block 5. The shelf unit U10 is partitioned into a plurality of cells arranged in the vertical direction. A transfer device A7 including a lifting arm is provided in the vicinity of the shelf unit U10. The transfer device A7 raises and lowers the workpiece W between the cells of the shelf unit U10.

[0017] A shelf unit U11 is provided on the side of the interface block 6 within the processing block 5. The shelf unit U11 is partitioned into a plurality of cells arranged in the vertical direction.

[0018] The interface block 6 performs the transfer of the workpiece W with the exposure apparatus 3. For example, the interface block 6 incorporates a transfer device A8 including a transfer arm and is connected to the exposure apparatus 3. The transfer device A8 transfers the workpiece W arranged in the shelf unit U11 to the exposure apparatus 3. The transfer device A8 receives the workpiece W from the exposure apparatus 3 and returns it to the shelf unit U11.

[0019] The control device 20 controls the coating and developing apparatus 2 to execute the coating and developing process according to, for example, the following procedure. First, the control device 20 controls the transfer device A1 to transfer the workpiece W in the carrier C to the shelf unit U10, and controls the transfer device A7 to place this workpiece W in the cell for the processing module 11.

[0020] Next, the control device 20 controls the transport device A3 to transport the workpiece W from the shelf unit U10 to the liquid treatment unit U1 and the heat treatment unit U2 in the processing module 11. The control device 20 also controls the liquid treatment unit U1 and the heat treatment unit U2 to form an underlayer film on the surface of the workpiece W. After that, the control device 20 controls the transport device A3 to return the workpiece W with the underlayer film formed on it back to the shelf unit U10, and controls the transport device A7 to place the workpiece W into a cell for the processing module 12.

[0021] Next, the control device 20 controls the transport device A3 to transport the workpiece W from the shelf unit U10 to the liquid treatment unit U1 and the heat treatment unit U2 in the processing module 12. The control device 20 also controls the liquid treatment unit U1 and the heat treatment unit U2 to form a resist film on the surface of the workpiece W. After that, the control device 20 controls the transport device A3 to return the workpiece W to the shelf unit U10 and controls the transport device A7 to place the workpiece W into a cell for the processing module 13.

[0022] Next, the control device 20 controls the transport device A3 to transport the workpiece W from the shelf unit U10 to each unit in the processing module 13. The control device 20 also controls the liquid processing unit U1 and the heat processing unit U2 to form an upper layer film on the resist film of the workpiece W. After that, the control device 20 controls the transport device A3 to transport the workpiece W to the shelf unit U11.

[0023] Next, the control device 20 controls the transport device A8 to send the workpiece W from the shelf unit U11 to the exposure device 3. Subsequently, the control device 20 controls the transport device A8 to receive the exposed workpiece W from the exposure device 3 and place it in the cell for the processing module 14 in the shelf unit U11.

[0024] Next, the control device 20 controls the transport device A3 to transport the workpiece W from the shelf unit U11 to each unit in the processing module 14, and controls the liquid processing unit U1 and the heat processing unit U2 to perform the resist film development process on the workpiece W. After that, the control device 20 controls the transport device A3 to return the workpiece W to the shelf unit U10, and controls the transport devices A7 and A1 to return the workpiece W to the carrier C. This completes the coating and development process for one workpiece W. The control device 20 then causes the coating and development device 2 to perform the same coating and development process on each of the subsequent workpieces W in the same manner as described above.

[0025] The control device 20 is a device that controls the coating and developing apparatus 2. The control device 20 is composed of one or more control computers. When the control device 20 is composed of multiple control computers, these multiple control computers may be connected to each other in a way that allows them to communicate with one another.

[0026] The control device 20 has a functional configuration (hereinafter referred to as a "functional module"), as shown in Figure 3, which includes a storage unit 22 and a processing control unit 24. The storage unit 22 stores programs for operating various units and devices included in the coating and developing apparatus 2. The storage unit 22 also stores various data (for example, information related to signals for operating processing units included in the coating and developing apparatus 2), as well as information from sensors and other devices provided in each part.

[0027] The processing control unit 24 controls the operation of various units and devices included in the coating and developing apparatus 2 based on the program read from the storage unit 22. The processing control unit 24 controls the operation of various units and devices included in the coating and developing apparatus 2 in order to execute the coating and developing process described above.

[0028] (Heat treatment unit) Next, an example of a heat treatment unit U2 will be described with reference to Figure 3. The heat treatment unit U2 performs heat treatment (heating) on ​​a workpiece W while the workpiece W is placed in the processing space. The heat treatment unit U2 includes, for example, a heating section 51 and a lid 55.

[0029] The heating section 51 is a stage configured to support and heat the workpiece W. The heating section 51 may support the workpiece W so that its surface is horizontal. The heating section 51 includes, for example, a heating plate 52 and a plurality of support pins 53. The heating plate 52 is made of metal. The heating plate 52 includes a heater such as a resistance heating element. The heating plate 52 may be formed in a disc shape. The diameter of the heating plate 52 may be larger than the diameter of the workpiece W. The plurality of support pins 53 are the parts that support the workpiece W. The plurality of support pins 53 are provided on the upper surface of the heating plate 52 and protrude from the upper surface of the heating plate 52.

[0030] The lid portion 55 is a component that forms a space for heating the workpiece W (hereinafter referred to as the "processing space S"). The lid portion 55 is made of metal. The lid portion 55 is configured to surround the workpiece W supported by the heating processing unit 51. The lid portion 55 may be provided so as to be movable in the vertical direction, and the processing space S is formed when the lid portion 55 approaches the heating processing unit 51. When the lid portion 55 moves away from the heating processing unit 51, the space above the heating processing unit 51 is opened. The heating processing unit 51 supports and heats the workpiece W in the processing space S. The lid portion 55 includes a top plate 56 and side walls 57.

[0031] The top plate 56, together with the side wall 57, forms a processing space S and covers the heating processing unit 51. The top plate 56 is formed in a disc shape and has a diameter approximately the same as the diameter of the hot plate 52 of the heating processing unit 51, or a diameter larger than the diameter of the hot plate 52. The top plate 56 is positioned so as to face the upper surface of the hot plate 52 in the vertical direction. In this case, when viewed from vertically above, the top plate 56 overlaps with the upper surface of the hot plate 52. The side wall 57 is a portion formed to extend downward from the outer edge of the top plate 56. When viewed from above, the side wall 57 surrounds the upper surface of the hot plate 52. When viewed from above, at least a part of the side wall 57 may overlap with the peripheral portion of the upper surface of the hot plate 52. In the example shown in Figure 3, the processing space S is composed of the upper surface of the hot plate 52, the inner surface of the side wall 57, and the lower surface of the top plate 56.

[0032] The top plate 56 includes a gas discharge section 58 provided on its underside. The gas discharge section 58 discharges gas downward when heating the workpiece W in the processing space S. The gas discharged by the gas discharge section 58 is, for example, air, a gas containing moisture, or an inert gas. The gas discharge section 58 includes a plurality of discharge holes 58a that open into the processing space S. The plurality of discharge holes 58a may be scattered at a substantially uniform density on the portion of the underside of the top plate 56 that faces the workpiece W on the heating section 51 (see also Figure 7).

[0033] The gas discharge section 58 may, in addition to discharging gas, also have a function (one or more discharge holes) to suck in the atmosphere in the processing space S or sublimated material generated by heat treatment and discharge it outside the processing space S. The top plate 56 may include a discharge section instead of the gas discharge section 58 that sucks in the atmosphere in the processing space S or sublimated material present in the processing space S and discharges it outside the processing space S. This discharge section may have one or more discharge holes (suction holes) opening into the processing space S, similar to the gas discharge section 58.

[0034] (Temperature measuring device) As shown in Figure 4, the substrate processing system 1 includes a temperature measuring device 29. The temperature measuring device 29 is a device that measures the temperature in the processing space S of the heat treatment unit U2. The temperature measuring device 29 may measure the temperature at multiple locations within the processing space S. For example, the temperature measuring device 29 measures the temperature at multiple locations within the processing space S when no heat treatment is being performed on the workpiece W, but the heat treatment unit U2 is performing an operation similar to heat treatment on the workpiece W. The multiple locations where temperature measurements are taken are set to be the locations where the workpiece W is located when heat treatment is performed by the heat treatment unit U2, or to its vicinity.

[0035] The temperature measuring device 29 includes a first measurement unit 70 and a second measurement unit 90. The first measurement unit 70 is a unit that generates signals corresponding to the temperature at multiple locations using a SAW (Surface Acoustic Wave) sensor, which will be described later. The first measurement unit 70 receives signals from the second measurement unit 90 via wireless communication and outputs the signals generated by the SAW sensor to the second measurement unit 90. The second measurement unit 90 is a unit that outputs signals to the first measurement unit 70 for use in measurement via wireless communication and receives measurement signals from the first measurement unit 70. The second measurement unit 90 is connected to the control device 20 by wire.

[0036] The first measurement unit 70 (temperature measuring device) may be a portable unit. When temperature measurement is performed in the processing space S, the first measurement unit 70 may be transported and set into the heat treatment unit U2 by a transport device A3 or by human intervention. When heat treatment is performed on the workpiece W, the first measurement unit 70 may be removed from the heat treatment unit U2. As shown in Figures 4 and 5, the first measurement unit 70 includes, for example, a holding member 72, a plurality of SAW sensors 80, and a plurality of antennas 74.

[0037] The holding member 72 is a member (base material) that holds multiple SAW sensors 80 and multiple antennas 74. Multiple SAW sensors 80 and multiple antennas 74 are attached (fixed) to the holding member 72. In this case, by placing the holding member 72 in the processing space S, the multiple SAW sensors 80 and multiple antennas 74 are also placed in the processing space S. The holding member 72 is formed, for example, in the same way as the workpiece W (substrate). The holding member 72 may be formed in the shape of a disc. The diameter of the holding member 72 may be about the same as the diameter of the workpiece W. The thickness of the holding member 72 may be about the same as the thickness of the workpiece W. The holding member 72 may be made of the same material as the workpiece W (for example, silicon). By forming the holding member 72 in the same way as the workpiece W, it is possible to measure the temperature at multiple locations in the processing space S in a state close to the state in which heat treatment is performed on the workpiece W.

[0038] Multiple SAW sensors 80 are scattered on one main surface of the holding member 72. The multiple SAW sensors 80 are scattered on the main surface of the holding member 72 so that the temperature can be measured at positions corresponding to multiple locations on the main surface of the workpiece W supported by the heating section 51. The distance from the center of the holding member 72 differs between two or more of the multiple SAW sensors 80. The circumferential positions around the center of the holding member 72 differ between two or more of the multiple SAW sensors 80. The mounting positions of the multiple SAW sensors 80 on the holding member 72 are set according to the locations where temperature measurement is to be performed.

[0039] The SAW sensor 80 is a sensor that can receive a signal from an external source and output a signal corresponding to the ambient temperature. The SAW sensor 80 is configured to generate a signal corresponding to the ambient temperature. Hereinafter, the signal that the SAW sensor 80 receives from an external source will be referred to as the "input signal," and the signal generated by the SAW sensor 80 (a signal corresponding to the ambient temperature of the sensor) will be referred to as the "measurement signal." When the SAW sensor 80 receives an input signal, it generates a SAW (surface acoustic wave) and produces a formed signal corresponding to the ambient temperature. A SAW is a wave that propagates by concentrating energy near the surface of a medium.

[0040] The SAW sensor 80 includes, for example, a piezoelectric substrate 82, an electrode 84, and one or more reflectors. In the example shown in Figure 5, the SAW sensor 80 includes one or more reflectors, namely reflector 86a and reflector 86b. The electrode 84 is a lattice-shaped electrode formed on the piezoelectric substrate 82. The electrode 84 includes electrode 84a and electrode 84b. For example, electrode 84a is electrically connected to antenna 74, and electrode 84b is connected to ground potential. Each of electrode 84a and electrode 84b includes one or more protrusions and one or more recesses. Electrodes 84a and 84b are formed in a comb-like shape such that the protrusions of electrode 84a are inserted into the recesses of electrode 84b, and the protrusions of electrode 84b are inserted into the recesses of electrode 84a.

[0041] The signal input to the SAW sensor 80 (the input signal described above) is a high-frequency signal. The SAW sensor 80 is electrically connected to the antenna 74, and the high-frequency input signal is supplied to the SAW sensor 80 via the antenna 74. When the antenna 74 receives the high-frequency input signal (radio wave), the SAW is excited (generated) at the electrode 84 by the inverse piezoelectric effect. The excited SAW propagates toward the reflectors 86a and 86b, respectively, and is reflected by each reflector, with the reflected wave returning to the electrode 84. The reflected wave of the SAW is converted into a voltage by the piezoelectric effect and output to the outside as a radio wave by the antenna 74.

[0042] The propagation time of the SAW changes depending on the temperature of the piezoelectric substrate 82. Therefore, the temperature around the SAW sensor 80 can be measured from the time it takes for the SAW to reflect off the reflector of the SAW sensor 80 and return (propagation delay time). In other words, the measurement signal generated by the SAW sensor 80 contains information corresponding to the temperature around the SAW sensor 80. The length of the propagation path between the electrode 84 and the reflector 86a is different from the length of the propagation path between the electrode 84 and the reflector 86b. This allows the temperature around one SAW sensor 80 to be measured using two propagation paths of different lengths (allowing for two measurements at approximately the same timing), which can improve measurement accuracy.

[0043] As shown in Figure 6, the antenna 74 may be a loop antenna. The shape of the annular antenna 74 may be circular, elliptical, or square. The antenna 74 may be a metal wire, or it may be a circuit pattern formed in an annular shape on a heat-resistant resin substrate or sheet such as polyimide. The antenna 74 may be formed so that its opening is aligned with the main surface of the holding member 72.

[0044] Returning to Figure 4, the second measurement unit 90 may be fixed to the heat treatment unit U2 (lid portion 55). The second measurement unit 90 includes, for example, a plurality of antennas 94 and a line 95. Each of the plurality of antennas 94 corresponds to a plurality of antennas 74 of the first measurement unit 70. The number of plurality of antennas 94 is the same as the number of plurality of antennas 74 (the number of plurality of SAW sensors 80). In the state in which the holding member 72 of the first measurement unit 70 is supported by the heating treatment unit 51 and the processing space S is formed (hereinafter referred to as the "measurement state"), each of the plurality of antennas 94 faces the corresponding antenna 74. In this case, when viewed from a direction perpendicular to the heating plate 52 of the heating treatment unit 51 (for example, the up and down direction), at least a part of the antenna 94 overlaps with at least a part of the corresponding antenna 74.

[0045] Antenna 94 may be a loop antenna. The shape of the annular antenna 94 may be circular, elliptical, or square. The size of the opening of antenna 94 may be approximately the same as the size of the opening of the corresponding antenna 74. When the sizes of the openings are approximately the same, the size of the opening of antenna 94 is 0.95 to 1.05 times the size of the opening of the corresponding antenna 74. As shown in Figure 7, multiple antennas 94 may be attached to the top plate 56 (the underside of the top plate 56). The opening of antenna 94 may be formed to follow the underside of the top plate 56. Note that in Figure 7, only a portion of the multiple antennas 94 (3 antennas 94) are shown, and some antennas 94 are omitted. Antenna 94 may be a metal wire, or it may be a circuit pattern formed in an annular shape on a heat-resistant resin substrate or sheet such as polyimide.

[0046] If both antenna 74 and antenna 94 are loop antennas, signals are transmitted between antenna 74 and antenna 94 by magnetic coupling (electromagnetic induction). Furthermore, antennas 74 and 94 may be positioned such that most of the aperture of antenna 74 faces most of the aperture of antenna 94. That is, in the above measurement state, 50% to 100% of the aperture of antenna 74 may face 50% to 100% of the aperture of antenna 94. In the above measurement state, 70% to 100% of the aperture of antenna 74 may face 70% to 100% of the aperture of antenna 94, and 90% to 100% of the aperture of antenna 74 may face 90% to 100% of the aperture of antenna 94.

[0047] The line 95 is a connecting line that electrically connects one or more of the multiple antennas 94 to the control device 20. Note that lines other than line 95 are also provided for electrically connecting the multiple antennas 94 to the control device 20. In the example shown in Figure 7, line 95 functions as a connecting line that electrically connects three of the multiple antennas 94 to the control device 20. Signals are transmitted between the three antennas 94 and the control device 20 via line 95. Part of line 95 may be a coaxial cable or a microstrip line. Part of line 95 may be provided along the underside of the top plate 56. The portion of line 95 along the underside of the top plate 56 may be a microstrip line.

[0048] In Figure 6, the portion of the transmission line 95 that is a microstrip transmission line is indicated by the symbol "96". The microstrip transmission line 96 includes a dielectric 96a (dielectric substrate) and a strip conductor 96b formed on the dielectric 96a. One end of each of the one or more antennas 94 is electrically connected to the strip conductor 96b. The other end of the antenna 94 may be connected to ground potential. Note that the portion of the transmission line 95 that runs along the underside of the top plate 56 may be a metal wire instead of a microstrip transmission line. If a gas discharge section 58 is formed on the underside of the top plate 56, as shown in Figure 7, the portion of the transmission line 95 that runs along the underside of the top plate 56 and the multiple antennas 94 are arranged so as not to interfere with the multiple discharge holes 58a. If the top plate 56 is provided with one or more discharge holes (suction holes) instead of or in addition to the discharge holes 58a, the multiple antennas 94, etc., may be arranged so as not to interfere with the one or more discharge holes.

[0049] In the temperature measuring device 29 configured as described above, each of the multiple SAW sensors 80 receives the input signal via antennas 74 and 94 while their antennas face each other in the processing space S (a predetermined space). When each of the multiple SAW sensors 80 receives the input signal, it outputs the measurement signal corresponding to the ambient temperature in the processing space S (the temperature around itself). When the antennas 74 and SAW sensors 80 are attached to the holding member 72, the SAW sensors 80 output the measurement signal while the holding member 72 is supported by the heating processing unit 51. In the above measurement state, the antennas 74 and 94 are arranged to face each other in a direction perpendicular to the heating plate 52 of the heating processing unit 51 (for example, in the vertical direction). The direction perpendicular to the heating plate 52 corresponds to the direction perpendicular to the upper surface of the heating plate 52. In the temperature measuring device 29 in this disclosure, one antenna 74, arbitrarily selected from the multiple antennas 74, constitutes the first antenna, and the antenna 94 corresponding to that antenna 74 constitutes the second antenna.

[0050] The frequency of the input signal supplied to the SAW sensor 80 may be 0.2 GHz to 10 GHz. In this case, the frequency of the radio waves propagating between antenna 74 and antenna 94 is 0.2 GHz to 10 GHz. The frequency of the input signal may be 0.4 GHz to 6 GHz or 0.6 GHz to 3 GHz. The wavelength of the input signal may be 30 mm to 1500 mm, 50 mm to 750 mm, or 100 mm to 500 mm. The size of the processing space S in the direction perpendicular to the hot plate 52 (a predetermined direction) may be 1 mm to 15 mm, 2 mm to 13 mm, or 3 mm to 11 mm.

[0051] Figure 8 schematically shows the connection status between three of the multiple SAW sensors 80 and the control device 20. In the following, the symbols "80A", "80B", and "80C" will be used to distinguish the three SAW sensors 80 shown in Figure 8 individually. Antennas 74 and 94 corresponding to SAW sensor 80A will be referred to as "antenna 74A" and "antenna 94A", respectively. Antennas 74 and 94 corresponding to SAW sensor 80B will be referred to as "antenna 74B" and "antenna 94B", respectively, and antennas 74 and 94 corresponding to SAW sensor 80C will be referred to as "antenna 74C" and "antenna 94C", respectively.

[0052] SAW sensor 80A receives input signals via line 95, antenna 94A, and antenna 74A with antenna 74A (first antenna) facing antenna 94A (second antenna) in the processing space S. SAW sensor 80B (another antenna) receives input signals via line 95, antenna 94B, and antenna 74B with antenna 74B (third antenna) facing antenna 94B (fourth antenna) in the processing space S. SAW sensor 80C receives input signals via line 95, antenna 94C, and antenna 74C with antenna 74C facing antenna 94C in the processing space S.

[0053] The branching point 95a (first branching point) to antenna 94A on track 95 and the branching point 95b (second branching point) to antenna 94B on track 95 are adjacent to each other on track 95. That is, there are no branching points to other antennas 94 between branching point 95a and branching point 95b. Branching point 95b and the branching point 95c to antenna 94C on track 95 are adjacent to each other on track 95. That is, there are no branching points to other antennas 94 between branching point 95b and branching point 95c.

[0054] The branching points 95a, 95b, and 95c are arranged in this order on the track 95, starting from the control device 20. The signal transmitted from the control device 20 branches at branching point 95a into a signal directed towards antenna 94A and a signal directed towards antennas 94B and 94C. The signal from branching point 95a toward antennas 94B and 94C branches at branching point 95b into a signal directed towards antenna 94B and a signal directed towards antenna 94C. The signal from branching point 95b toward antenna 94C branches at branching point 95c into a signal directed towards antenna 94C and a signal directed downstream.

[0055] The signal from the control device 20 to the antenna 94A includes a signal Id that travels directly from the control device 20 to the antenna 94A, and a signal Ir that is reflected (more specifically, reflected only once) at branch point 95b adjacent to branch point 95a and travels to the antenna 94A. The distance between branch point 95a and branch point 95b on the transmission line 95 (hereinafter referred to as "distance Xab") may be set to a value such that the phenomenon of signal destructive interference does not occur due to the phase shift of the reflected wave (signal Ir) at branch point 95b, which is 180°. Specifically, twice the value of distance Xab is set to a value different from a value that approximately matches n times the wavelength of the input signal (n is an integer of 1 or more). A value that approximately matches n times the wavelength refers to a value between 0.95 and 1.05 times the value obtained by multiplying the wavelength by n. In other words, twice the distance Xab may be different from the range of 0.95 to 1.05 times the value obtained by multiplying the wavelength by n (it may also be outside the above range). Furthermore, from the viewpoint of more reliably avoiding interference between signals as described later, twice the distance Xab may be different from the range of 0.9 to 1.1 times the value obtained by multiplying the wavelength by n. If twice the distance Xab is n times the wavelength of the input signal, when the signal Ir returns to branch point 95a, its phase will be shifted by the amount obtained by multiplying the wavelength by (n+1 / 2), causing it to cancel out (interfere and attenuate) with the original signal Id. The value of twice the distance on the transmission line 95 between branch point 95b and branch point 95c may also be set to a value different from the value that approximately matches n times the wavelength of the input signal.

[0056] (Measurement processing unit) In addition to controlling the coating and developing apparatus 2, the control device 20 may also have a function to control the temperature measuring device 29 and perform measurement processing for measuring temperature. For example, the control device 20 may have a measurement processing unit 26 as a functional configuration. The measurement processing unit 26 supplies input signals to each of the multiple SAW sensors 80 via antennas 74 and 94 to acquire measurement signals.

[0057] In one example, the measurement processing unit 26 supplies an input signal to the SAW sensor 80A via the line 95, antenna 94A, and antenna 74A, and acquires a measurement signal from the SAW sensor 80A. The measurement processing unit 26 supplies an input signal to the SAW sensor 80B via the line 95, antenna 94B, and antenna 74B, and acquires a measurement signal (another measurement signal) from the SAW sensor 80B. The measurement processing unit 26 supplies an input signal to the SAW sensor 80C via the line 95, antenna 94C, and antenna 74C, and acquires a measurement signal from the SAW sensor 80C.

[0058] The measurement processing unit 26 calculates the temperature around each of the multiple SAW sensors 80 from the acquired measurement signals. Figure 9 schematically shows an example of a measurement signal when focusing on one SAW sensor 80. Figure 9 is a graph schematically representing an example of the time change in the intensity of the measurement signal. In the graph shown in Figure 9, "86a" represents the signal component reflected by the reflector 86a of the SAW sensor 80 and input to the measurement processing unit 26, and "86b" represents the signal component reflected by the reflector 86b of the SAW sensor 80 and input to the measurement processing unit 26. The signal component when the temperature is "T0" is shown by a solid line, and the signal component when the temperature is different from T0, "T1", is shown by a dashed line.

[0059] In the SAW sensor 80, the distance between electrode 84 and reflector 86a is different from the distance between electrode 84 and reflector 86b. Therefore, when the ambient temperature around the SAW sensor 80 is the same, there is a difference in the timing at which the measurement processing unit 26 receives the signal component based on reflection from reflector 86a and the signal component based on reflection from reflector 86b. This allows the measurement processing unit 26 to identify which reflector the signal component is based on. When focusing on either reflector 86a or reflector 86b, the propagation time of the SAW differs depending on whether the temperature is T0 or T1, as described above, and this can result in a difference in the timing at which the measurement processing unit 26 receives the signal.

[0060] The measurement processing unit 26 calculates the temperature according to the timing (propagation time) at which it receives the signal component based on the reflection at each reflector of the SAW sensor 80. The measurement processing unit 26 may calculate the temperature according to the phase of the received signal component, instead of, or in addition to, the timing at which the signal component is received. The storage unit 22 of the control device 20 may store information for each of the multiple SAW sensors 80 that shows the relationship between the temperature and at least one of the timing (propagation time) and phase of the signal component based on the reflection at each reflector. Even among multiple SAW sensors 80 (for example, SAW sensors 80A, 80B, 80C) that receive input signals on the same line, the timing from when the input signal is output until the signal component based on the reflection at each SAW sensor 80 returns is different. Therefore, the measurement processing unit 26 can identify which SAW sensor 80 the signal component is from.

[0061] When multiple SAW sensors 80 are scattered on the holding member 72, the measurement processing unit 26 can calculate the temperature distribution on the surface corresponding to the main surface of the workpiece W by calculating the ambient temperature at each of the multiple SAW sensors 80. The control device 20 may be connected to an output device such as a monitor, and the measurement processing unit 26 may output the calculation results of the ambient temperature at each of the multiple SAW sensors 80 to the output device. In this disclosure, the temperature measurement system is configured by the measurement processing unit 26 and the temperature measuring device 29. Note that the control device 20 may not have the measurement processing unit 26, and a separate computer may have the measurement processing unit 26.

[0062] Figure 10 illustrates the hardware configuration of the control device 20. The control device 20 includes, for example, a circuit 30. The circuit 30 includes one or more processors 32, a memory 34, a storage 36, an input / output port 38, and a timer 39. The storage 36 has a storage medium that can be read by a computer, such as a hard disk. The storage medium stores a program for causing the coating and developing apparatus 2 to perform the coating and developing process, and a program for causing the control device 20 to perform the temperature measurement method described later. The storage medium may be a removable medium such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk.

[0063] Memory 34 temporarily stores the program loaded from the storage medium of storage 36 and the calculation results by processor 32. The processor 32 works in cooperation with memory 34 to execute the above program, thereby configuring each functional module of the control device 20 (for example, the storage unit 22, the processing control unit 24, and the measurement processing unit 26). The input / output port 38 performs input and output of electrical signals to and from the heat treatment unit U2 and the second measurement unit 90 of the temperature measuring device 29, etc., according to commands from processor 32. The timer 39 measures elapsed time, for example, by counting a reference pulse of a fixed period. A circuit for generating an input signal to be supplied to the SAW sensor 80 may be provided inside or outside the input / output port 38.

[0064] If the control device 20 is composed of multiple computers, each functional module may be implemented by an individual computer. Alternatively, each of these functional modules may be implemented by a combination of two or more computers. In these cases, the multiple computers may be connected to each other in a manner that allows them to communicate with one another, and may coordinately execute the coating and developing process and the temperature measurement method described later. The hardware configuration of the control device 20 is not necessarily limited to each functional module being configured by a program. For example, each functional module of the control device 20 may be composed of a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) that integrates such circuits.

[0065] [Temperature measurement method] Next, an example of a temperature measurement method performed using the temperature measuring device 29 and the measurement processing unit 26 will be described. This temperature measurement method is performed during a period when the heat treatment unit U2, whose temperature is to be measured, is not performing heat treatment on the workpiece W. Figure 11 is a flowchart of an example of a temperature measurement method. In this temperature measurement method, step S11 is performed first when the lid 55 has not moved upward to form the processing space S, and no components or workpiece W are placed on the heating processing unit 51.

[0066] In step S11, for example, the control device 20 controls the transport device A3 and the heat treatment unit U2 to set the first measurement unit 70 on the heat treatment unit 51. Alternatively, instead of the device setting the first measurement unit 70, the first measurement unit 70 may be set on the heat treatment unit 51 manually. In step S11, the holding member 72 is placed on the support pins 53 of the heat treatment unit 51 such that the holding member 72 is horizontal and the multiple SAW sensors 80 and multiple antennas 74 face away from the hot plate 52 of the heat treatment unit 51. When the holding member 72 is placed on the support pins 53, the center of the holding member 72 may substantially coincide with the center of the hot plate 52.

[0067] Next, the control device 20 executes step S12. In step S12, for example, the processing control unit 24 controls the heat treatment unit U2 to lower the lid 55 to form the processing space S. In one example, before executing step S12, the control device 20 maintains a state in which heating by the hot plate 52 is possible, and when the processing space S is formed, heat treatment in the processing space S begins. When the processing space S is formed, the holding member 72 is heated, and the area around the holding member 72 becomes almost the same as when heat treatment is performed on the workpiece W. Also, when the lid 55 is lowered to form the processing space S, each of the multiple antennas 94 provided on the lid 55 faces the corresponding antenna 74 attached to the holding member 72.

[0068] Next, the control device 20 executes steps S13 and S14. In step S13, for example, the measurement processing unit 26 waits until a predetermined measurement timing is reached. The measurement timing may be set in advance by the operator. In step S14, for example, the measurement processing unit 26 supplies input signals to each of the multiple SAW sensors 80 via antennas 94 and 74, and acquires measurement signals from the SAW sensors 80.

[0069] Next, the control device 20 executes steps S15 and S16. In step S15, for example, the processing control unit 24 waits until a predetermined termination timing is reached. The termination timing may be set in advance to match the execution time specified in the conditions for performing heat treatment on the workpiece W. In step S16, for example, the processing control unit 24 controls the heat treatment unit U2 to raise the lid 55 to open the space above the heating processing unit 51. This completes the heat treatment for temperature measurement.

[0070] Next, the control device 20 executes steps S17 and S18. In step S17, for example, the measurement processing unit 26 calculates the temperature around each of the multiple SAW sensors 80 from the measurement signals obtained in step S14. This allows the temperature distribution on the upper surface of the holding member 72 to be determined. In step S18, for example, the measurement processing unit 26 outputs the temperature distribution obtained in step S17 to an output device connected to the control device 20. Before, during, or after the execution of steps S17 and S18, the first measurement unit 70 may be removed from the heat treatment unit U2 by a device including the transport device A3 or by human intervention. In the above temperature measurement method, the measurement processing unit 26 acquires measurement signals from the SAW sensors 80 while the holding member 72 is supported by the heating processing unit 51 and the processing space S is being heated by the heating processing unit 51.

[0071] [Differentiation] The series of processes performed using the temperature measurement method described above is an example and can be modified as appropriate. In the above series of processes, the control device 20 may execute one step and the next step in parallel, or execute each step in a different order than the example described above. The control device 20 may omit any of the steps, or perform a different process in any of the steps than the example described above. The control device 20 (measurement processing unit 26) may repeatedly execute step S14 while heating is being performed in the processing space S so as to acquire measurement signals at multiple measurement timings. The control device 20 (measurement processing unit 26) may calculate the temperature from the measurement signals while the processing space S is formed and heat treatment is being performed.

[0072] In the temperature measuring device 29 illustrated above, the transmission path between the control device 20 and the SAW sensor 80 is an unbalanced circuit, but this transmission path may also be a balanced circuit. Figure 12 schematically shows a part of the temperature measuring device 29 when the transmission path between the control device 20 and the SAW sensor 80 is a balanced circuit. In this case, a signal is transmitted between the control device 20 and the SAW sensor 80 using a pair of conductors.

[0073] The temperature measuring device 29 may have a line 95A instead of line 95. Line 95A is, for example, a microstrip line. In line 95A, a strip conductor 96c and a strip conductor 96d are formed on the dielectric 96a. Strip conductors 96c and 96d are electrically connected to the control device 20. In the second measuring unit 90 having line 95A, one end of the antenna 94 is electrically connected to the strip conductor 96c, and the other end of the antenna 94 is electrically connected to the strip conductor 96d.

[0074] Even when line 95A is used, antennas 74 and 94 are positioned opposite each other. One end of antenna 74 is electrically connected to electrode 84a (one electrode) included in electrode 84 of SAW sensor 80. The other end of antenna 74 is electrically connected to electrode 84b (the other electrode) included in electrode 84. By configuring the transmission path between the control device 20 and each of the multiple SAW sensors 80 as a balanced circuit, the effects of noise can be reduced.

[0075] The signal may be transmitted in line 95A such that the phase difference between the signal flowing through strip conductor 96c and the signal flowing through strip conductor 96d is 180°. This doubles the maximum amplitude due to the difference in signals between strip conductor 96c and strip conductor 96d, and even if the same noise components are generated in both strip conductors, they are canceled out when the signal is output, thus enabling highly accurate temperature measurement.

[0076] In the temperature measuring device 29 illustrated above, signals are transmitted between the first measuring unit 70 and the second measuring unit 90 by magnetic coupling (magnetic field coupling). Alternatively, signals may be transmitted between the first measuring unit 70 and the second measuring unit 90 by electrical coupling (capacitive coupling) instead of magnetic coupling. As shown in Figure 13, the first measuring unit 70 has antenna 78Ba (first antenna) and antenna 78Bb (first antenna) instead of antenna 74. Antenna 78Ba and antenna 78Bb are electrically connected to the SAW sensor 80. Antenna 78Ba and antenna 78Bb are metal plates (flat metal plates). Antenna 78Ba and antenna 78Bb may be formed in a rectangular shape.

[0077] The second measurement unit 90 has a transmission line 95B instead of the transmission line 95 and antenna 94. Similar to transmission line 95A, transmission line 95B includes a dielectric 96a, a strip conductor 96c, and a strip conductor 96d. Transmission line 95B also includes an antenna 98Ba (second antenna) electrically connected to the strip conductor 96c, and an antenna 98Bb (second antenna) electrically connected to the strip conductor 96d. Antennas 98Ba and 98Bb are metal plates (flat metal plates). Antennas 98Ba and 98Bb may be formed continuously with the strip conductor on the dielectric 96a. Antennas 98Ba and 98Bb may be formed in a rectangular shape.

[0078] In the measurement state in which the first measurement unit 70, including antennas 78Ba and 78Bb, is set on the heating section 51, antenna 78Ba and antenna 98Ba are facing each other in a parallel state, and antenna 78Bb and antenna 98Bb are facing each other in a parallel state. The size of the main surface of antenna 78Ba may be approximately the same as the size of the main surface of antenna 98Ba, and the size of the main surface of antenna 78Bb may be approximately the same as the size of the main surface of antenna 98Bb. Most of antenna 78Ba (50% to 100% of its main surface) may face most of antenna 98Ba (50% to 100% of its main surface). Most of antenna 78Bb (50% to 100% of its main surface) may face most of antenna 98Bb (50% to 100% of its main surface).

[0079] In the first measurement unit 70 and the second measurement unit 90 shown in Figure 13, a parallel plate capacitor is formed by antennas 78Ba and 98Ba, and another parallel plate capacitor is formed by antennas 78Bb and 98Bb. With the formation of these parallel plate capacitors, signals are transmitted by electrical coupling between antennas 78Ba and 98Ba, and between antennas 78Bb and 98Bb. In this disclosure, an antenna is defined as a component that transmits signals without contact, and the metal plates constituting the parallel plate capacitor also function as antennas.

[0080] In the above description, the substrate processing system 1 was used as an example of a heat treatment apparatus, but the configuration of the heat treatment apparatus is not limited to the substrate processing system 1 described above. The heat treatment apparatus may be configured in any way as long as it includes a heat treatment unit that supports and heats the workpiece W, and a temperature measuring device 29 (or a temperature measuring device 29 and a measurement processing unit 26). In one of the various examples described above, at least some of the matters described in the other examples may be applied.

[0081] [summary] This disclosure includes the configurations or methods described in (1) to (18) below.

[0082] (1) A temperature measuring device 29 comprising SAW sensors 80, 80A that receive an input signal from an external source and output a measurement signal corresponding to the ambient temperature, and antennas 74, 74A, 78Ba, 78Bb (first antenna) electrically connected to the SAW sensors 80, 80A, wherein the SAW sensors 80, 80A are configured to receive an input signal via antennas 74, 74A, 78Ba, 78Bb and antennas 94, 94A, 98Ba, 98Bb when antennas 74, 74A, 78Ba, 78Bb are facing antennas 94, 94A, 98Ba, 98Bb (second antenna) in a predetermined space, and output a measurement signal corresponding to the ambient temperature in the space. Conventionally, various methods have been proposed for measuring the temperature of a workpiece while it is being heat-treated, by placing the workpiece in a space for heat treatment. In these methods, thermocouples, RTDs, or CMOS temperature sensors are placed on the workpiece to measure its temperature. In these methods, if a non-contact signal transmission means is used to acquire the output of the temperature-measuring sensor, a control circuit and a battery (power source) are required, and measurement in high-temperature environments is difficult due to the heat resistance issues of the control circuit and other components. Therefore, in order to perform measurements easily even in high-temperature environments, it is conceivable to use a SAW sensor that receives a signal from an external source via an antenna to measure the temperature. However, if the space is smaller than the wavelength of the signal propagating through the antenna, the propagating signal is attenuated, making it difficult to obtain highly accurate measurement results. In contrast, the above temperature measurement device uses a SAW sensor 80, eliminating the need to place control circuits and other components in the space. Furthermore, by arranging the antennas facing each other in the space, signal attenuation between the antennas in the space is suppressed, making it possible to obtain highly accurate measurement results. Therefore, this temperature measuring device is useful for easily measuring the temperature in a space, as it can measure the temperature in a space with high accuracy using a non-contact signal transmission method even in high-temperature environments.

[0083] (2) The temperature measuring device 29 described in (1) above, wherein signals are transmitted between antennas 74, 78Ba, 78Bb and antennas 94, 98Ba, 98Bb by electrical coupling or magnetic coupling. In this case, a non-contact signal can be transmitted in a portion of the transmission line between the SAW sensor 80 and the other device. Furthermore, if the signal is transmitted by magnetic coupling, the circuit for transmitting the signal to and from the SAW sensor 80 can be miniaturized.

[0084] (3) The temperature measuring device 29 as described in (2) above, further comprising an antenna 94, wherein each of the antennas 74 and 94 is a loop antenna, and the antennas 74 and 94 are arranged such that most of the opening of the antenna 94 faces most of the opening of the antenna 94. In this configuration, even when the small space is formed by a metal component, signal attenuation between antennas is more reliably suppressed. Therefore, high-precision temperature measurement can be performed using the SAW sensor 80.

[0085] (4) The temperature measuring device 29 according to any one of (1) to (3) above, further comprising a plate-shaped holding member 72 to which the SAW sensor 80 and antenna 74 are attached. In this case, by positioning the holding member 72 in space, it becomes possible to measure the temperature using the SAW sensor 80. Therefore, temperature measurement using the SAW sensor 80 can be simplified.

[0086] (5) The temperature measuring device 29 described in (4) above, wherein the space is a processing space S for heating the workpiece W, and the SAW sensor 80 is configured to output a measurement signal when the holding member 72 is supported by the heating processing unit 51 that supports and heats the workpiece W in the processing space S. In this case, even when the workpiece W has not undergone heat treatment, it is possible to measure the temperature corresponding to the temperature of the workpiece W during heat treatment.

[0087] (6) The temperature measuring device 29 according to any one of (1) to (5) above, wherein the space is a processing space S for heating the workpiece W, the antenna 74 and the antenna 94 are arranged to face each other in a predetermined direction perpendicular to the hot plate 52 included in the heating section 51 that supports and heats the workpiece W in the processing space S, the frequency of the input signal is 0.2 GHz to 10 GHz, and the size of the processing space S in the predetermined direction is 1 / 2 or less of the wavelength of the input signal. Due to the small size of the processing space S in the direction perpendicular to the heating plate 52, the signal propagating between the antennas may be attenuated. In contrast, in the above configuration, the antennas are positioned facing each other when temperature measurement is performed, so even if the size of the processing space S in the above direction is small, the degree of signal attenuation is reduced, and highly accurate measurements can be performed.

[0088] (7) The SAW sensor 80B further comprises an antenna 94A, a SAW sensor 80B (another SAW sensor) that receives an input signal from an external source and outputs another measurement signal indicating the ambient temperature, an antenna 74B (third antenna) electrically connected to the SAW sensor 80B, and an antenna 94B (fourth antenna) electrically connected to the antenna 94A via a line 95, wherein the SAW sensor 80B receives an input signal via the antennas 74B and 94B in the above space with the antenna 74B facing the antenna 94B, and in the space The temperature measuring device 29 according to any one of (1) to (6) above, is configured to output the above-mentioned separate measurement signal according to the ambient temperature inside, and the branching point 95a (first branching point) to antenna 94A on the transmission line 95 and the branching point 95b (second branching point) to antenna 94B on the transmission line 95 are adjacent on the transmission line 95, and the value of twice the distance Xab between branching point 95a and branching point 95b on the transmission line 95 is set to a value different from a value that is approximately equal to n times the wavelength of the input signal (where n is an integer of 1 or more). If twice the distance between branching point 95a and branching point 95b on the transmission line 95 approximately coincides with n times the wavelength of the input signal, the signal directly supplied from branching point 95a to antenna 94A may be attenuated due to interference with the signal reflected at branching point 95b and input to antenna 94A. In contrast, in the above configuration, twice the distance Xab does not approximately coincide with n times the wavelength of the input signal, so signal attenuation due to reflection at adjacent branching points is less likely to occur. Therefore, it is useful for high-precision temperature measurement.

[0089] (8) A temperature measuring device 29 according to any one of (1) to (7) above, further comprising antennas 94, 94A, 98Ba, 98Bb, wherein the space is a processing space S for heating a workpiece W, and the antennas 94, 94A, 98Ba, 98Bb are attached to a top plate 56 that covers a heating processing unit 51 that forms the processing space S and supports and heats the workpiece W in the processing space S. In this case, it is not necessary to set the antennas 94 and 94A in the processing space S each time the temperature in the processing space S is measured. Therefore, this is useful for simplifying temperature measurement in the processing space S using the SAW sensor 80.

[0090] (9) A heat treatment apparatus comprising: a heating unit 51 that supports and heats a workpiece W in a processing space S; SAW sensors 80, 80A that receive an input signal from the outside in the processing space S and output a measurement signal corresponding to the ambient temperature; antennas 74, 74A, 78Ba, 78Bb (first antennas) arranged in the processing space S and electrically connected to the SAW sensors 80, 80A; antennas 94, 94A, 98Ba, 98Bb (second antennas) arranged in the processing space S and facing the antennas 74, 74A at a distance; and a measurement unit 26 that supplies an input signal to the SAW sensors 80, 80A via antennas 74, 74A, 78Ba, 78Bb and antennas 94, 94A, 98Ba, 98Bb to acquire a measurement signal. This heat treatment apparatus, like the temperature measuring device 29 described in (1) above, can accurately measure the temperature in the processing space S using wireless communication even in high-temperature environments. Therefore, it is useful for easily measuring the temperature in a space.

[0091] (10) The heat treatment apparatus described in (9) above, wherein signals are transmitted between antennas 74, 74A, 78Ba, 78Bb and antennas 94, 94A, 98Ba, 98Bb by magnetic coupling or electrical coupling. In this case, a non-contact signal can be transmitted in a portion of the transmission line between the measurement processing unit 26 and the SAW sensor 80. Furthermore, if the signal is transmitted by magnetic coupling, the circuit for transmitting the signal between the measurement processing unit 26 and the SAW sensor 80 can be miniaturized.

[0092] (11) The heat treatment apparatus according to (10) above, wherein each of the antennas 74, 74A and 94, 94A is a loop antenna, and the antennas 74, 74A and 94, 94A are arranged such that most of the openings of the antennas 74, 74A face most of the openings of the antennas 94, 94A. In the above configuration, even when the processing space S is small and composed of metal components, signal attenuation between antennas is more reliably suppressed. Therefore, high-precision temperature measurement can be performed using the SAW sensor 80.

[0093] (12) The heat treatment apparatus according to any one of (9) to (11) above, further comprising a plate-shaped holding member 72 to which a SAW sensor 80 and antennas 74, 74A are attached, wherein the measurement processing unit 26 acquires a measurement signal from the SAW sensor 80 while the holding member 72 is supported by the heating processing unit 51. In this case, by positioning the holding member 72 in space, it becomes possible to measure the temperature using the SAW sensor 80. Therefore, temperature measurement using the SAW sensor 80 can be simplified.

[0094] (13) The heat treatment apparatus described in (12) above, wherein the measurement processing unit 26 acquires measurement signals from SAW sensors 80 and 80A while the holding member 72 is supported by the heating processing unit 51 and the processing space S is being heated by the heating processing unit 51. In this case, even when the workpiece W has not undergone heat treatment, it is possible to measure the temperature corresponding to the temperature of the workpiece W during heat treatment.

[0095] (14) The heat treatment apparatus according to any one of (9) to (13) above, wherein antennas 74, 74A and antennas 94, 94A are arranged to face each other in a predetermined direction perpendicular to the hot plate 52 included in the heating section 51, the frequency of the input signal is 0.2 GHz to 10 GHz, and the size of the processing space S in the predetermined direction is 1 / 2 or less of the wavelength of the input signal. Due to the small size of the processing space S in the direction perpendicular to the heating plate 52, the signal propagating between the antennas may be attenuated. In contrast, in the above configuration, the antennas are positioned facing each other when temperature measurement is performed, so even if the size of the processing space S in the above direction is small, the degree of signal attenuation is reduced, and highly accurate measurements can be performed.

[0096] (15) The heat treatment apparatus according to any one of (9) to (14) above, further comprising: a SAW sensor 80B (another SAW sensor) that receives a signal from the outside and outputs a signal indicating the ambient temperature in a processing space S; an antenna 74B (third antenna) arranged in the processing space S and electrically connected to the SAW sensor 80B; an antenna 94B (fourth antenna) arranged in the processing space S and facing the antenna 74B at a distance; a measurement processing unit 26; and a transmission line 95 that electrically connects the antenna 94A and the antenna 94B, wherein the branching point 95a (first branching point) to the antenna 94A in the transmission line 95 and the branching point 95b (second branching point) to the antenna 94B in the transmission line 95 are adjacent on the transmission line 95, and the value of twice the distance Xab between branching point 95a and branching point 95b on the transmission line 95 is set to a value different from a value that approximately matches n times the wavelength of the input signal (where n is an integer of 1 or more). If twice the distance between branching point 95a and branching point 95b on the transmission line 95 approximately coincides with n times the wavelength of the input signal, the signal directly supplied from branching point 95a to antenna 94A may be attenuated due to interference with the signal reflected at branching point 95b and input to antenna 94A. In contrast, in the above configuration, twice the distance Xab does not approximately coincide with n times the wavelength of the input signal, so signal attenuation due to reflection at adjacent branching points is less likely to occur. Therefore, it is useful for high-precision temperature measurement.

[0097] (16) The heat treatment apparatus according to any one of (9) to (15) above, further comprising a top plate 56 that forms a processing space S and covers the heating section 51, and the antennas 94, 94A are attached to the top plate 56. In this case, it is not necessary to set the antennas 94 and 94A in the processing space S each time the temperature in the processing space S is measured. Therefore, this is useful for simplifying temperature measurement in the processing space S using the SAW sensor 80.

[0098] (17) A temperature measurement method comprising: arranging a SAW sensor 80 capable of receiving an input signal from an external source and outputting a measurement signal corresponding to the ambient temperature, and an antenna 74 (first antenna) electrically connected to the SAW sensor 80 in a predetermined space; supplying an input signal to the SAW sensor 80 via antennas 74 and 94 while antenna 74 is facing antenna 94 (second antenna) in the space; and acquiring a measurement signal corresponding to the ambient temperature in the space from the SAW sensor 80 to which the input signal has been supplied. This temperature measurement method, like the temperature measurement device 29 described in (1) above, allows for high-precision measurement of the temperature within a given space using wireless communication, even in high-temperature environments. Therefore, it is useful for easily measuring the temperature within a space.

[0099] (18) The temperature measurement method described in (17) above, wherein the space is a processing space S for heating the workpiece W. The processing space S for heating the workpiece W becomes hot when the workpiece W is heated. With the above method, the temperature can be measured with high accuracy using wireless communication even in a high-temperature environment, so it is possible to perform simple measurements in the environment for heating the workpiece W. [Explanation of Symbols]

[0100] 1...Substrate processing system, 2...Coating and developing device, U2...Heat treatment unit, 20...Control device, 51...Heating section, 52...Heating plate, 55...Lid, 56...Top plate, S...Processing space, 29...Temperature measuring device, 70...First measuring unit, 74, 74A, 74B, 74C, 78Ba, 78Bb...Antenna, 80, 80A, 80B, 80C...SAW sensor, 90...Second measuring unit, 94, 94A, 94B, 94C, 98Ba, 98Bb...Antenna, 95...Train line, 95a, 95b, 95c...Branching point.

Claims

1. A SAW sensor that receives an input signal from an external source and can output a measurement signal corresponding to the ambient temperature, A first antenna electrically connected to the SAW sensor, It is equipped with a second antenna, The SAW sensor is configured to receive the input signal via the first and second antennas while the first antenna, which is mounted on a holding member in a predetermined space, is facing the second antenna, and to output the measurement signal corresponding to the ambient temperature in the space. The aforementioned space is a processing space for heating the substrate, and the lid forming the processing space is made of metal. The frequency of the input signal is 0.2 GHz to 10 GHz. The processing space has a size of 1 / 2 or less of the wavelength of the input signal in a predetermined direction perpendicular to the heating plate included in the heating section that supports and heats the substrate in the processing space. The second antenna is a temperature measuring device provided on the underside of the top plate covering the heating section of the lid, at a position opposite to the first antenna.

2. The temperature measuring device according to claim 1, wherein the second antenna is provided on a member forming the lower surface of the top plate.

3. The temperature measuring device according to claim 1, wherein a signal is transmitted between the first antenna and the second antenna by electrical coupling or magnetic coupling.

4. The first antenna and the second antenna are each loop antennas, The temperature measuring device according to claim 3, wherein the first antenna and the second antenna are arranged such that most of the opening of the first antenna faces most of the opening of the second antenna.

5. Further comprising the holding member, The temperature measuring device according to any one of claims 1 to 4, wherein the holding member is formed in the shape of a plate, and the SAW sensor and the first antenna are attached to the holding member.

6. The temperature measuring device according to claim 5, wherein the SAW sensor is configured to output the measurement signal while the holding member is supported by the heating section.

7. Another SAW sensor that receives the input signal from an external source and outputs another measurement signal indicating the ambient temperature, A third antenna electrically connected to the aforementioned other SAW sensor, The system further comprises a fourth antenna electrically connected to the second antenna via a transmission line, The other SAW sensor is configured to receive the input signal via the third and fourth antennas in the space with the third antenna facing the fourth antenna, and to output the other measurement signal corresponding to the ambient temperature in the space. The first branching point to the second antenna on the aforementioned line and the second branching point to the fourth antenna on the aforementioned line are adjacent to each other on the aforementioned line. The temperature measuring device according to any one of claims 1 to 4, wherein twice the distance on the line between the first branching point and the second branching point is set to a value different from a value that is approximately equal to n times the wavelength of the input signal (where n is an integer of 1 or more).

8. A heating section that supports and heats the substrate in the processing space, The processing space is formed by a lid made of metal, In the processing space, a SAW sensor receives an input signal from an external source and outputs a measurement signal corresponding to the ambient temperature, A first antenna is arranged in the processing space in a manner provided on a holding member and electrically connected to the SAW sensor, A second antenna is arranged in the processing space and faces the first antenna at a distance from it, The system includes a measurement processing unit that supplies the input signal to the SAW sensor via the first antenna and the second antenna to acquire the measurement signal, The frequency of the input signal is 0.2 GHz to 10 GHz. The processing space has a size of 1 / 2 or less of the wavelength of the input signal in a predetermined direction perpendicular to the heating plate included in the heating section. The heat treatment apparatus is provided with the second antenna located on the underside of the top plate covering the heating treatment section of the lid, at a position opposite to the first antenna.

9. The heat treatment apparatus according to claim 8, wherein the second antenna is provided on a member forming the lower surface of the top plate.

10. The heat treatment apparatus according to claim 8, wherein a signal is transmitted between the first antenna and the second antenna by electrical coupling or magnetic coupling.

11. The first antenna and the second antenna are each loop antennas. The heat treatment apparatus according to claim 10, wherein the first antenna and the second antenna are arranged such that most of the opening of the first antenna faces most of the opening of the second antenna.

12. Further comprising the holding member, The holding member is formed in the shape of a plate, and the SAW sensor and the first antenna are attached to the holding member. The heat treatment apparatus according to any one of claims 8 to 11, wherein the measurement processing unit acquires the measurement signal from the SAW sensor while the holding member is supported by the heating processing unit.

13. The heat treatment apparatus according to claim 12, wherein the measurement processing unit acquires the measurement signal from the SAW sensor while the holding member is supported by the heating processing unit and the processing space is being heated by the heating processing unit.

14. In the aforementioned processing space, there is another SAW sensor that receives a signal from the outside and outputs a signal indicating the ambient temperature, A third antenna is arranged in the processing space and electrically connected to the other SAW sensor, A fourth antenna is arranged in the processing space and faces the third antenna at a distance from it, The measurement processing unit and a line electrically connecting the second antenna and the fourth antenna are further provided. The first branching point to the second antenna on the aforementioned line and the second branching point to the fourth antenna on the aforementioned line are adjacent to each other on the aforementioned line. The heat treatment apparatus according to any one of claims 8 to 11, wherein twice the distance on the line between the first branching point and the second branching point is set to a value different from a value that is approximately equal to n times the wavelength of the input signal (where n is an integer of 1 or more).

15. A SAW sensor capable of receiving an input signal from an external source and outputting a measurement signal corresponding to the ambient temperature, and a first antenna electrically connected to the SAW sensor and mounted on a holding member, are arranged in a predetermined space. In the aforementioned space, with the first antenna facing the second antenna, the input signal is supplied to the SAW sensor via the first antenna and the second antenna. This includes obtaining a measurement signal corresponding to the ambient temperature in the space from the SAW sensor to which the input signal is supplied, The aforementioned space is a processing space for heating the substrate, and the lid forming the processing space is made of metal. The frequency of the input signal is 0.2 GHz to 10 GHz. The processing space has a size of 1 / 2 or less of the wavelength of the input signal in a predetermined direction perpendicular to the heating plate included in the heating section that supports and heats the substrate in the processing space. A temperature measurement method wherein the second antenna is provided on the underside of the top plate covering the heating section of the lid, at a position opposite to the first antenna.

16. The temperature measurement method according to claim 15, wherein the second antenna is provided on a member forming the lower surface of the top plate.

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