Method for manufacturing a light-emitting device and a light-emitting device

Abstract

To provide a manufacturing method of a light-emitting device and a light-emitting device which enhance a contrast ratio between a lighting time and a non-lighting time.SOLUTION: A manufacturing method of a light-emitting device includes the steps of: preparing an intermediate body having light-emitting elements 20, a bottom part 100 where the light-emitting elements 20 are arranged, and first walls 300 which are separated from the top of the bottom part 100 and the side faces of the light-emitting elements 20 and surrounds the light-emitting elements 20; arranging translucent members 500 which have heights exceeding the heights of the first walls 300, and cover the upper surfaces of the first walls 300 and the light-emitting elements 20; removing a part of the translucent members 500 so as to expose at least a part of the upper surfaces of the first walls 300, and forming first grooves; arranging first resins 410 in the first grooves, and forming second walls 400; and cutting the second walls 400 along the first grooves in plan view, and individualizing the second walls 400.SELECTED DRAWING: Figure 7H

Description

[Technical Field]

[0001] This disclosure relates to a method for manufacturing a light-emitting device and to a light-emitting device. [Background technology]

[0002] For example, Patent Document 1 discloses a package comprising a molded body having a plate-shaped base on which an LED chip is arranged, a wall portion rising from the plate-shaped base such as having an inner circumferential surface that surrounds the entire periphery of the LED chip, and first and second leads attached to the molded body. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] International Publication No. 2016-194120 [Overview of the project] [Problems that the invention aims to solve]

[0004] The embodiments relating to this disclosure aim to provide a method for manufacturing a light-emitting device and a light-emitting device that enhances the contrast ratio between when the device is lit and when it is not. [Means for solving the problem]

[0005] A method for manufacturing a light-emitting device disclosed in the embodiment includes the steps of: preparing an intermediate body having a light-emitting element, a bottom on which the light-emitting element is arranged, and a first wall arranged on the bottom and spaced apart from the side surface of the light-emitting element and surrounding the light-emitting element; arranging a translucent member that is taller than the height of the first wall and covers the upper surface of the first wall and the light-emitting element; removing a part of the translucent member so as to expose at least a part of the upper surface of the first wall to form a first groove; arranging a first resin in the first groove to form a second wall; and cutting the second wall in the first groove in the direction in which the first groove extends to form individual pieces.

[0006] Furthermore, the light-emitting device disclosed in the embodiment comprises a base having a first wall, a light-emitting element disposed on the base and surrounded by the first wall in a plan view, a second wall having a light-shielding portion and a light-reflecting portion having a higher light reflectivity than the light-shielding portion disposed on the upper surface of the first wall, and a light-transmitting member disposed in a recess defined by the base and the second wall, wherein both the light-shielding portion and the light-reflecting portion contain resin, the outer surface of the second wall and the outer surface of the first wall are formed continuously, the light-reflecting portion constitutes a part of the inner surface of the second wall, and the light-shielding portion constitutes the outer surface of the second wall and the upper surface of the second wall. [Effects of the Invention]

[0007] According to embodiments of this disclosure, it is possible to provide a method for manufacturing a light-emitting device and a light-emitting device that enhances the contrast ratio between when the device is lit and when it is not lit. [Brief explanation of the drawing]

[0008] [Figure 1A] This is a perspective view illustrating a schematic of the light-emitting device according to the first embodiment. [Figure 1B] This is a plan view illustrating the schematic of a light-emitting device according to the first embodiment. [Figure 1C] Figure 1B is a cross-sectional view illustrating a schematic of the IC-IC line. [Figure 2A] This is a cross-sectional view illustrating the general outline of a light-emitting device according to a modified example of the second wall. [Figure 2B] This is a cross-sectional view illustrating the general outline of a light-emitting device relating to a second modified example of the second wall. [Figure 3A] This is a cross-sectional view illustrating a schematic of a light-emitting device relating to a modified example of a light-transmitting member. [Figure 3B] This is a cross-sectional view illustrating a schematic of a light-emitting device relating to a modified example of a light-transmitting member. [Figure 4A] This is a plan view illustrating a schematic of a light-emitting device according to the second embodiment. [Figure 4B] Figure 4A is a cross-sectional view illustrating the schematic of the IVB-IVB line. [Figure 5]It is a flowchart exemplifying a method for manufacturing a light-emitting device. [Figure 6A] It is a plan view exemplifying an outline of an intermediate body in the manufacturing method according to the embodiment. [Figure 6B] It is a cross-sectional view exemplifying an outline in the VIB-VIB line shown in FIG. 6A. [Figure 7A] It is a schematic cross-sectional view exemplifying a method for manufacturing a light-emitting device according to the first embodiment. [Figure 7B] It is a schematic cross-sectional view exemplifying a method for manufacturing a light-emitting device according to the first embodiment. [Figure 7C] It is a schematic cross-sectional view exemplifying a method for manufacturing a light-emitting device according to the first embodiment. [Figure 7D] It is a schematic cross-sectional view exemplifying a method for manufacturing a light-emitting device according to the first embodiment. [Figure 7E] It is a schematic cross-sectional view exemplifying a method for manufacturing a light-emitting device according to the first embodiment. [Figure 7F] It is a schematic cross-sectional view exemplifying a method for manufacturing a light-emitting device according to the first embodiment. [Figure 7G] It is a schematic cross-sectional view exemplifying a method for manufacturing a light-emitting device according to the first embodiment. [Figure 7H] It is a schematic cross-sectional view exemplifying a method for manufacturing a light-emitting device according to the first embodiment. [Figure 7I] It is a schematic cross-sectional view exemplifying a method for manufacturing a light-emitting device according to the first embodiment. [Figure 8] It is a flowchart exemplifying a method for manufacturing a light-emitting device. [Figure 9A] It is a schematic cross-sectional view exemplifying a method for manufacturing a light-emitting device according to the second embodiment. [Figure 9B] It is a schematic cross-sectional view exemplifying a method for manufacturing a light-emitting device according to the second embodiment. [Figure 9C] It is a schematic cross-sectional view exemplifying a method for manufacturing a light-emitting device according to the second embodiment. [Figure 9D] It is a schematic cross-sectional view exemplifying a method for manufacturing a light-emitting device according to the second embodiment. [Figure 9E]This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting device according to the second embodiment. [Figure 9F] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting device according to the second embodiment. [Figure 9G] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting device according to the second embodiment. [Figure 9H] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting device according to the second embodiment. [Figure 9I] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting device according to the second embodiment. [Figure 9J] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting device according to the second embodiment. [Figure 9K] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting device according to the second embodiment. [Figure 9L] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting device according to the second embodiment. [Figure 9M] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting device according to the second embodiment. [Figure 10A] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting device according to a second modified example of the second wall. [Figure 10B] This is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting device according to a second modified example of the second wall. [Figure 11A] This is a cross-sectional view illustrating a schematic of a state in which the first layer has been formed in a modified example of the process of arranging the light-transmitting member. [Figure 11B] This is a cross-sectional view illustrating a schematic of a modified example of the process for arranging a translucent member, showing a state in which an activated layer has been formed. [Figure 11C] This is a cross-sectional view illustrating a schematic of the state in which plasma is irradiated in a modified example of the process of arranging a translucent member. [Figure 11D] This is a cross-sectional view illustrating a schematic of a modified example of the process for arranging the translucent member, showing the state in which the second layer has been formed. [Modes for carrying out the invention]

[0009] The embodiments of this disclosure will be described below with reference to the drawings. However, the embodiments described below are intended to embody the technical idea of ​​this disclosure and, unless otherwise specified, the invention is not limited to the embodiments described below. The content described in one embodiment is applicable to other embodiments and modifications. In addition, the drawings provide a schematic representation of the embodiments, and in order to clarify the explanation, the scale, spacing, positional relationships of each component may be exaggerated, or some components may be omitted from the illustration. The directions shown in each figure indicate the relative positions between components and are not intended to indicate absolute positions. In principle, the same names and reference numerals indicate the same or similar components, and detailed explanations are omitted as appropriate. In addition, in the embodiments, "covering" is not limited to direct contact, but also includes indirect covering, for example, through other components. In this specification, "perpendicular" does not mean strictly perpendicular, but includes variations in the manufacturing process, for example, and is sufficient if substantially perpendicular. Substantially perpendicular here means that an angular deviation of about 5° is acceptable.

[0010] [Light-emitting device according to the first embodiment] The light-emitting device 1 according to the first embodiment will be described with reference to Figures 1A to 1C. Figure 1A is a perspective view illustrating the schematic of the light-emitting device 1. Figure 1B is a plan view illustrating the schematic of the light-emitting device 1. Figure 1C is a cross-sectional view illustrating the schematic of the IC-IC line in Figure 1B.

[0011] Figures 1A to 1C also show, for reference, arrows indicating the mutually orthogonal x, y, and z directions. These arrows may also be shown in other drawings of this disclosure as arrows indicating these directions.

[0012] In the following, unless otherwise specified, "vertical direction" refers to the direction along the z-direction, "cross-sectional view" refers to the cross-section of the xz-plane including the x and z-directions, and "planar view" refers to the view of the xy-plane including the x and y-directions from the +z-direction. Furthermore, "width" refers to the length in the x-direction in the cross-section of the xz-plane, and "height" refers to the length in the z-direction in the cross-section of the xz-plane.

[0013] The light-emitting device 1 comprises a base 15 having a first wall 30, a light-emitting element 20 positioned on the base 15 and surrounded by the first wall 30 in a plan view, a second wall 40 having a light-shielding portion 41 and a light-reflecting portion 42 with a higher light reflectivity than the light-shielding portion 41 positioned on the upper surface of the first wall 30, and a light-transmitting member 50 positioned in a recess 60 defined by the base 15 and the second wall 40. The light-shielding portion 41 and the light-reflecting portion 42 both contain resin, the outer surface of the second wall 40 and the outer surface of the first wall 30 are formed continuously, the light-reflecting portion 42 constitutes a part of the inner surface of the second wall 40, and the light-shielding portion 41 constitutes the outer surface of the second wall 40 and the upper surface of the second wall 40. The various components of the light-emitting device 1 will be described below.

[0014] (Base) The base 15 is a component on which the light-emitting element 20 is placed. The base 15 has a bottom 10 and a first wall 30. The bottom 10 and the first wall 30 may be a single unit or separate parts. In plan view, the base 15 is, for example, a rectangle. The planar shape of the base 15 may be a polygon such as a circle, ellipse, or hexagon, or a shape in which the corners of these polygons are rounded. In cross-sectional view, the base 15 has a concave shape with the bottom 10 as the bottom surface and the first wall 30 as the side surface.

[0015] The bottom portion 10 has an arrangement surface on which the light-emitting element 20 is placed. The arrangement surface is located on the upper surface of the bottom portion 10.

[0016] The first wall 30 is a component positioned on the base 10. The first wall 30 is positioned on the periphery of the upper surface of the base 10. In plan view, the first wall 30 surrounds the light-emitting element 20, separated from its sides. In the example shown in Figure 1B, the rectangular annular first wall 30 surrounds all four sides of the light-emitting element 20. The base 15 has an opening defined by the first wall 30. The planar shape of the opening is, for example, a rectangle. The planar shape of the opening may also be a polygon such as a circle, ellipse, or hexagon, or a polygon with rounded corners. In plan view, the distance between the inner and outer surfaces on the upper surface of the first wall 30 is approximately constant, except at the corners.

[0017] The cross-sectional shape of the first wall 30 is a trapezoid with one bottom angle being approximately right and the other bottom angle being acute. Furthermore, in a cross-sectional view, it is preferable that the inner surface of the first wall 30 has an inclined surface that extends in the direction from the bottom 10 toward the light extraction surface side of the light-emitting device 1 (the +z direction in Figure 1C). The inner surface of the first wall 30 is inclined such that the inner circumference of the concave shape in a plan view increases as it moves upward from the bottom 10. As a result, if the first wall 30 is light-reflecting, it becomes easier to reflect light from the side of the light-emitting element 20 toward the upper surface which is the light extraction surface, thereby improving the light extraction of the light-emitting device 1. Furthermore, in a cross-sectional view, the outer surface of the first wall 30 has a surface perpendicular to the bottom 10.

[0018] It is preferable that the upper surface of the first wall 30 be higher than the upper surface of the light-emitting element 20. In the light-emitting device 1, it is more preferable that the upper surface of the first wall 30 be higher than the highest part of the wire 13. It is even more preferable that the upper surface of the first wall 30 be 0.2 mm or more higher than the upper surface of the light-emitting element 20. The upper surface of the first wall 30 may be flat or may have parts of different heights. If the upper surface of the first wall 30 has parts of different heights, it is sufficient that the highest point of the first wall 30 is higher than the upper surface of the light-emitting element 20.

[0019] The first wall 30 preferably has light reflectivity. The first wall 30 preferably has a light reflectance of 60% or more, more preferably 70% or more, and even more preferably 80% or more, with respect to the emission peak wavelength of the light emitted by the light-emitting element 20. This allows the first wall 30 to reflect light emitted laterally from the light-emitting element 20. Therefore, the light extraction of the light-emitting device 1 can be improved. In addition, light leakage to the outside from the side of the first wall 30 can be reduced. The first wall 30 is, for example, white.

[0020] Furthermore, the first wall 30 may have light-absorbing properties. The first wall 30 may be, for example, black or gray.

[0021] In the light-emitting device 1, the base 15 includes, for example, a lead 11 and a resin part 14. The resin part 14 fixes and supports the lead 11 by embedding a portion of the lead 11. The lead 11 can be electrically connected to the negative or positive electrode of a pair of element electrodes of the light-emitting element 20, thereby supplying power to the light-emitting element 20.

[0022] The first wall 30 is part of the resin portion 14. The first wall 30 is the resin portion 14 located above the upper surface of the lead 11.

[0023] The bottom portion 10 is formed by the lead 11 and a part of the resin portion 14. The surface of the bottom portion 10 is a part of the lead 11 that is exposed from a part of the resin portion 14. The surface of the bottom portion 10 may consist of a part of the resin portion 14 and a part of the lead 11, or it may consist of only a part of the resin portion 14.

[0024] In a plan view, the resin portion 14 of the bottom 10 is positioned between the lead 11 on which the light-emitting element 20 is placed and the lead 11 to which the wire 13 electrically connected to the light-emitting element 20 is connected. This allows the resin portion 14 to electrically insulate the separated leads 11. There may be only one pair of leads 11, or two or more pairs. The light-emitting device 1 has three pairs of leads 11. The light-emitting element 20 is positioned on one lead 11. If multiple light-emitting elements 20 are to be placed, they may be positioned one on each of the multiple leads 11.

[0025] A portion of the lower surface of the light-emitting device 1 may be made up of leads 11. This makes it easier to transfer the heat emitted by the light-emitting device 1 from the leads 11 to the external mounting board on which the light-emitting device 1 is mounted, thereby improving the heat dissipation of the light-emitting device 1. In addition, a portion of the leads 11 may be exposed on the side surface of the first wall 30. A portion of the leads 11 may be exposed on the lower surface of the bottom 10. The portion of the leads 11 exposed on the lower surface of the bottom 10 can be used as an external connection terminal.

[0026] The resin part 14 is, for example, a resin base material into which a light diffusing material is incorporated. The resin part 14 preferably has a light reflectance of 60% or more with respect to the emission peak wavelength of the light emitted by the light-emitting element 20, and more preferably 90% or more. The light reflectance of the resin part 14 can be appropriately adjusted by the type and amount of light diffusing material. Furthermore, the viscosity of the resin part 14 can be adjusted by incorporating a light diffusing material.

[0027] The resin used as the base material for the resin part 14 can be a thermosetting resin such as epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, or urethane resin. Alternatively, the resin used as the base material for the resin part 14 can be a thermoplastic resin such as acrylic resin, polycarbonate resin, cyclic polyolefin resin, polyethylene terephthalate resin, or polyester resin. As a light diffusing material, for example, titanium dioxide, silicon dioxide, aluminum oxide, zinc oxide, or glass can be used. It is preferable that the resin part 14 is made of a resin with a silicone resin or epoxy resin base material and contains silicon dioxide as a light diffusing material. This makes it possible to reduce the difference in the coefficient of linear expansion with the light-emitting element 20.

[0028] As the material for lead 11, metals such as copper, iron, nickel, tungsten, chromium, aluminum, titanium, palladium, rhodium, silver, platinum, and gold, or alloys thereof, can be used. Lead 11 may be a single layer or a laminated structure. It is preferable to use copper for lead 11 as it is inexpensive and has high heat dissipation properties. In addition, a single-layer or laminated plating may be applied to part or all of lead 11. For the purpose of improving reflectivity, silver, aluminum, copper, and gold may be used for the plating. When the silver-containing metal layer is the outermost surface of lead 11, it is preferable to place a protective layer such as silicon oxide on the surface of the silver-containing metal layer. This makes it less likely for the silver-containing metal layer to discolor due to sulfur components in the atmosphere.

[0029] (light-emitting element) The light-emitting element 20 is positioned on the base 15. The light-emitting element 20 is a semiconductor element that emits light on its own when a voltage is applied, and a known semiconductor element made of nitride semiconductors or the like can be used.

[0030] The light-emitting element 20 includes at least a semiconductor structure and has a positive and negative pair of element electrodes. The semiconductor structure includes an n-side semiconductor layer, a p-side semiconductor layer, and an active layer sandwiched between the n-side semiconductor layer and the p-side semiconductor layer. The active layer may be a single quantum well (SQW) structure or a multiple quantum well (MQW) structure including multiple well layers. The semiconductor structure includes multiple semiconductor layers made of nitride semiconductors. The nitride semiconductor is In x Al y Ga 1-x-y The semiconductor comprises all compositions in which the composition ratios x and y are varied within their respective ranges in the chemical formula N (0 ≤ x, 0 ≤ y, x + y ≤ 1). The emission peak wavelength of the active layer can be appropriately selected depending on the purpose. The active layer is configured to emit, for example, visible light or ultraviolet light.

[0031] A semiconductor structure may include multiple light-emitting sections, each containing an n-side semiconductor layer, an active layer, and a p-side semiconductor layer. When a semiconductor structure includes multiple light-emitting sections, each light-emitting section may include well layers with different emission peak wavelengths, or well layers with the same emission peak wavelength. Note that "same emission peak wavelength" includes variations of a few nanometers. The combination of emission peak wavelengths of the multiple light-emitting sections can be selected as appropriate. For example, when a semiconductor structure includes two light-emitting sections, possible combinations of light emitted by each section include blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light. For example, when a semiconductor structure includes three light-emitting sections, possible combinations of light emitted by each section include blue light, green light, and red light. Each light-emitting section may include one or more well layers with emission peak wavelengths different from the other well layers.

[0032] The light-emitting element 20 placed on the base 15 may be one or multiple. When multiple light-emitting elements 20 are placed, the emission peak wavelength or emission color of the light-emitting elements 20 may be the same. The emission peak wavelength or emission color of the light-emitting elements 20 may be different. The light-emitting device 1, as an example, includes a light-emitting element 21 that emits blue light, a light-emitting element 22 that emits green light, and a light-emitting element 23 that emits red light. Note that the light-emitting elements 21, 22, and 23 may not be distinguished, or may be described collectively as the light-emitting element 20.

[0033] The light-emitting element 20 may have a pair of element electrodes on the same surface. Alternatively, the light-emitting element 20 may have a pair of element electrodes on opposing surfaces. For example, in the light-emitting device 1, the light-emitting elements 21 and 22 have a pair of element electrodes on their upper surfaces, and the light-emitting element 23 has a pair of element electrodes on its upper and lower surfaces. The light-emitting elements 21 and 22 are connected to their leads 11 by a wire 13. The light-emitting element 23 has its lower surface element electrode and lead 11 connected with a conductive adhesive, and its upper surface element electrode and lead 11 connected with a wire 13. In the example shown in Figure 1B, the light-emitting elements 21, 22, and 23 are arranged in a straight line, but they may also be arranged so that each of them is located at the vertex of a triangle.

[0034] The light-emitting element 20 may be mounted using a flip-chip design. In addition to the light-emitting element 20, the light-emitting device 1 may also have protective elements such as Zener diodes.

[0035] (Second wall) The second wall 40 is a component positioned on the upper surface of the first wall 30. The second wall 40 is rectangular and annular in shape. In a plan view, the second wall 40 is spaced apart from the side surface of the light-emitting element 20. The second wall 40 is located on the periphery of the light-emitting device 1 and surrounds the light-emitting surface of the light-emitting device 1. In a plan view, the outer shape of the second wall 40 is, for example, a rectangle. However, the outer shape of the second wall 40 in a plan view may be a polygon such as a circle, ellipse, or hexagon, or a polygon with rounded corners. In a plan view, the inner shape of the second wall 40 is similar to the outer shape. However, the inner shape of the second wall 40 may be different from the outer shape.

[0036] Furthermore, in the example shown in Figure 1B, a portion of the upper surface of the first wall 30 is located inward from the inner surface of the second wall 40. More specifically, a portion of the corner of the rectangular ring-shaped upper surface of the first wall 30 is located inward from the inner surface of the second wall 40. In this way, by having a portion of the inner surface of the second wall 40 at the same position as the inner surface of the first wall 30, or located further outward, the light emitted from the light-emitting element 20 can be made less likely to be blocked by the second wall 40.

[0037] The cross-sectional shape of the second wall 40 is rectangular. Furthermore, it is preferable that the inner and outer surfaces of the second wall 40 are perpendicular to the bottom 10. The inner surface of the second wall 40 may protrude from the inner surface of the first wall 30 so that, in a cross-sectional view, it is located outside the area directly above the light-emitting element 20. It is preferable that the inner surface of the second wall 40 is not located inside (towards the light-emitting element) of the inner surface of the first wall 30 in a cross-sectional view. This makes it less likely for the light emitted from the light-emitting element 20 to be blocked by the inner surface of the second wall 40. In a cross-sectional view, the inner surface of the second wall 40 may be located outside the inner surface of the first wall 30. The outer surface of the second wall 40 is formed to be continuous with the outer surface of the first wall 30. The outer surface of the second wall 40 is aligned with the outer surface of the first wall 30 and is coplanar with it. The outer surface of the first wall 30 and the outer surface of the second wall 40 are flush. In a cross-sectional view, the length of the second wall 40 in the x-direction is the same as, or shorter than, the length of the first wall 30 at the top surface of the first wall 30 in the x-direction. In a cross-sectional view, it is preferable that the length of the second wall 40 in the x-direction is constant. The height of the light-emitting device 1 can be adjusted by changing the height of the second wall 40. Furthermore, since the second wall 40 is positioned on the top surface of the first wall 30 to adjust the height, the height of the light-emitting device 1 can be adjusted without changing its size in the x and y directions.

[0038] The upper surface of the second wall 40 is formed flat. The upper surface of the second wall 40 may have portions of different heights.

[0039] The second wall 40 of the light-emitting device 1 has a light-shielding portion 41 and a light-reflecting portion 42.

[0040] (Light-blocking part) The light-shielding portion 41 is a component that provides light shielding against light from the light-emitting element 20. The light-shielding portion 41 is located on the upper surface of the first wall 30. The light-shielding portion 41 has a lower light transmittance with respect to the peak wavelength of the light-emitting element 20 than the light-reflecting portion 42.

[0041] The cross-sectional shape of the light-shielding portion 41 has an upper surface 41a, a lower surface 41b, an inner surface 41c, and an outer surface 41d, with a step in a part of the inner surface 41c. The step of the light-shielding portion 41 has a stepped upper surface 41e and a stepped side surface 41f that connects the lower surface 41b and the stepped upper surface 41e of the light-shielding portion 41. The step of the light-shielding portion 41 is recessed on the inner surface 41c from the light-emitting element 20 side toward the outer surface 41d of the light-shielding portion 41.

[0042] In a cross-sectional view, the length in the x-direction at the upper surface 41a of the light-shielding portion 41 is different from the length in the x-direction at the lower surface 41b of the light-shielding portion 41. The length in the x-direction at the upper surface 41a of the light-shielding portion 41 may be longer than the length in the x-direction at the lower surface 41b of the light-shielding portion 41.

[0043] The upper surface of the second wall 40 is formed by the upper surface 41a of the light-shielding portion 41, and the outer surface of the second wall 40 is formed by the outer surface 41d of the light-shielding portion 41. This reduces the appearance of the light-emitting device 1 as whitish when viewed from a distance. Therefore, the contrast ratio between when the light-emitting device 1 is lit and when it is not lit can be increased. A high contrast ratio between when the light-emitting device 1 is lit and when it is not lit means that it appears dark when the light-emitting device 1 is not emitting light. A portion of the inner surface of the second wall 40 is formed by the inner surface 41c of the light-shielding portion 41.

[0044] The light-shielding portion 41 is preferably black. The light-shielding portion 41 is, for example, a resin base material containing a light-absorbing material. The light-shielding portion 41 is preferably made of a material that absorbs 70% or more of the light or visible light emitted from the light-emitting element 20, and more preferably a material that absorbs 90% or more. The light-shielding portion 41 may also have a light transmittance of 40% or less with respect to the peak wavelength of the light-emitting element 20.

[0045] The resin used as the base material for the light-shielding portion 41 can be the same material as that used for the resin portion 14. Furthermore, carbon black, pigments, dyes, or glass fillers colored with carbon black can be used as light-absorbing materials. For example, the light-shielding portion 41 can be made from a resin with a silicone resin base material containing carbon black as a light-absorbing material.

[0046] (Light reflecting part) The light-reflecting portion 42 is a component that has a higher light reflectivity to light from the light-emitting element 20 than the light-shielding portion 41. The light-reflecting portion 42 constitutes a part of the inner surface of the second wall 40. In a plan view, the distance between the inner surface and the outer surface of the light-reflecting portion 42 is approximately constant. In a plan view, the light-reflecting portion 42 is approximately rectangular and annular in shape. The light-reflecting portion 42 is located on the upper surface of the first wall 30. In a plan view, the light-reflecting portion 42 overlaps with the light-shielding portion 41.

[0047] The shape of the light-reflecting portion 42 in cross-sectional view is, for example, rectangular. However, the cross-sectional shape of the light-reflecting portion 42 may be a quadrilateral such as a trapezoid. The upper surface and the outer surface of the light-reflecting portion 42 are in contact with the light-shielding portion 41. The light-reflecting portion 42 is positioned in a recess defined by the stepped upper surface 41e and the stepped side surface 41f of the light-shielding portion 41.

[0048] The lower end of the light-reflecting portion 42 constitutes the lower end of the second wall 40. In a cross-sectional view, the length in the z-direction from the lower end to the upper end of the light-reflecting portion 42 is shorter than half the length in the z-direction from the lower end to the upper end of the second wall 40. This increases the contrast ratio between when the light-emitting device 1 is lit and when it is not. The length of the light-reflecting portion 42 in the z-direction is, for example, 35% to 45% of the inner surface of the second wall 40. In a cross-sectional view, the length of the light-reflecting portion 42 in the x-direction is the same as or longer than half the length of the second wall 40 in the x-direction. This makes it less likely for light emitted by the light-emitting element 20 to leak from the light-reflecting portion 42 in the light-emitting device 1. Note that the length of the light-reflecting portion 42 in the x-direction may be shorter than half the length of the second wall 40 in the x-direction.

[0049] The light-reflecting portion 42 is preferably white. The material of the light-reflecting portion 42 can be the same as that of the resin portion 14. For example, the light-reflecting portion 42 can be made of a resin with a silicone resin base material containing titanium oxide as a light-diffusing material. Alternatively, the light-reflecting portion 42 can be made of the same base material as the light-shielding portion 41. This makes it possible to match physical properties such as the coefficient of linear expansion. Therefore, the stability of the light-emitting device 1 against temperature changes can be improved.

[0050] The second wall 40 has a light-shielding portion 41 and a light-reflecting portion 42, which allows the light-reflecting portion 42 to reflect the light emitted from the light-emitting element 20 towards the light-extraction surface, and the light-shielding portion 41 to increase the contrast ratio between when the light-emitting device 1 is lit and when it is not.

[0051] (recess) The recess 60 is defined by the bottom 10 of the base 15, the first wall 30, and the second wall 40. In the light-emitting device 1, the inner surface defining the recess 60 is composed of the first wall 30, the light-reflecting portion 42, and the light-shielding portion 41. Furthermore, on the inner surface defining the recess 60, the light-reflecting portion 42 is located between the light-shielding portion 41 and the first wall 30. That is, on the inner surface defining the recess 60, the first wall 30, the light-reflecting portion 42, and the light-shielding portion 41 are arranged in that order from the bottom 10 side of the base 15 upwards.

[0052] (Translucent member) The translucent member 50 is positioned within the recess 60 and covers the light-emitting element 20 positioned on the base 15. The upper surface of the translucent member 50 is a flat surface. The upper surface of the translucent member 50 is the light-emitting surface in the light-emitting device 1. The upper surface of the translucent member 50 is flush with the upper surface of the second wall 40. The upper surface of the translucent member 50 may have portions of different heights. For example, a portion of the translucent member 50 may be positioned on a portion of the upper surface of the second wall 40. The position of the upper surface of the translucent member 50 positioned on the upper surface of the second wall 40 may be higher than the position of the upper surface of the translucent member 50 covering the light-emitting element 20.

[0053] In cross-sectional view, the translucent member 50 may be a single layer or multiple layers. The inner surface that defines the recess 60 is formed by the first wall 30 and the second wall 40, which increases the z-direction length of the translucent member 50. This improves the color mixing in the light-emitting device 1. For example, if the light-emitting device 1 has light-emitting elements 21, 22, and 23 that emit different emission peak wavelengths, the light emitted by the light-emitting elements 21, 22, and 23 will mix in the translucent member 50. Therefore, a longer z-direction length of the translucent member 50 allows for better mixing of the light emitted by the light-emitting elements 21, 22, and 23.

[0054] The light-transmitting member 50 is, for example, a resin base material containing a light-diffusing material. The light-transmitting member 50 preferably has a light transmittance of 60% or more, and more preferably 80% or more, for light from the light-emitting element 20. The base material and light-diffusing material of the light-transmitting member 50 can be the same materials as those used for the resin part 14. It is preferable that the light-shielding part 41, the light-reflecting part 42, and the light-transmitting member 50 use the same base material. This makes it less likely for delamination to occur between the light-shielding part 41, the light-reflecting part 42, and the light-transmitting member 50. As a result, light leakage from between each member can be reduced. In addition, moisture is less likely to penetrate into the light-emitting device 1 from the delamination points between each member. As a result, deterioration of the light-emitting element 20 and the like can be reduced, and reliability can be improved.

[0055] The light-transmitting member 50 contains, for example, 20% to 40% of a light-diffusing material relative to the base material. When heat is applied to the light-transmitting member 50, it may shrink. As a result, for example, the light-emitting device 1 may warp. By setting the content of the light-diffusing material in the light-transmitting member 50 to 20% or more, the shrinkage of the light-transmitting member 50 can be reduced.

[0056] The light-transmissive member 50 may contain a wavelength conversion substance. The wavelength conversion substance is a member that absorbs at least a part of the primary light emitted by the light-emitting element 20 and emits secondary light having a wavelength different from that of the primary light. For example, by mixing the primary light emitted by the light-emitting element 20 and the secondary light emitted by the wavelength conversion substance, white light can be obtained.

[0057] Examples of the wavelength conversion substance include yttrium aluminum garnet-based phosphors (e.g., Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphors (e.g., Ca8MgSi4O 16 Cl2:Eu), silicate-based phosphors (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon phosphors (e.g., (Si,Al)3(O,N)4:Eu), or α-sialon phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu) and other oxynitride-based phosphors, LSN-based phosphors (e.g., (La,Y)3Si6N 11 :Ce), BSESN-based phosphors (e.g., (Ba,Sr)2Si5N8:Eu), SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu) or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu) and other nitride-based phosphors, KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K(Al 1-x Al x )F 6-x:Mn where x satisfies 0 < x < 1), or fluoride-based phosphors such as MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 where FA and MA represent formamidinium and methylammonium, respectively), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2), etc. can be used.

[0058] In addition, the wavelength conversion material can be used alone with one of these phosphors or in combination of two or more of these phosphors.

[0059] The light-emitting device 1 includes a base 15 having a first wall 30 and a light-emitting element 20 disposed on the base 15 and surrounded by the first wall 30 in a plan view. The light-emitting device 1 has a second wall 40 disposed on the upper surface of the first wall 30. Also, the light-emitting device 1 can have different inclinations on the inner surface of the first wall 30 and the inner surface of the second wall 40 in a cross-sectional view. Thereby, the light extraction of the light-emitting device 1 can be improved and the reliability can be enhanced. The light extraction can be improved by the inclination of the inner surface of the first wall 30. Also, the peeling between the light-transmitting member 50 and the second wall 40 due to sunlight or the like can be reduced by the fact that the inner surface of the second wall is not inclined and is perpendicular.

[0060] The light-emitting device 1 has a light-reflecting portion 42 having a higher light reflectance than the light-shielding portion 41 disposed as a part of the inner surface of the second wall 40. Thereby, the light extraction efficiency of the light-emitting device 1 can be further improved.

[0061] In the light-emitting device 1, the inner surface defining the recess 60 is composed of a first wall 30, a light-reflecting portion 42, and a light-shielding portion 41. On the inner surface defining the recess 60, the light-reflecting portion 42 is positioned between the light-shielding portion 41 and the first wall 30. Therefore, in the region up to the middle in the depth direction (-z direction) of the recess 60, the brightness can be improved by the first wall 30 and the light-reflecting portion 42, and in the upper region close to the light-emitting surface of the light-emitting device 1, the contrast ratio between when the light-emitting device 1 is lit and when it is not lit can be improved by the light-shielding portion 41.

[0062] In the light-emitting device 1, the outer surface of the first wall 30 and the outer surface of the second wall 40 are flush. Therefore, in a plan view, the outer dimensions of the first wall 30 and the outer dimensions of the second wall 40 are basically the same.

[0063] The light-emitting device 1 has a basic configuration as a light-emitting device, with a light-emitting element 20 placed on a base 15 and connected by wires 13, etc., and a light-transmitting member 50 etc. placed inside the first wall 30. In such a light-emitting device, changing the height of the first wall 30 itself may increase the overall size of the light-emitting device. However, the light-emitting device 1 of this disclosure can increase the height of the light-emitting device 1 in the z direction by using a second wall 40 without making any changes to the base 15.

[0064] (A variation of the second wall) Next, the light-emitting devices 1A and 1B relating to modified versions of the second wall 40 will be described with reference to Figures 2A and 2B. Figure 2A is a cross-sectional view illustrating the general outline of the light-emitting device 1A. Figure 2B is a cross-sectional view illustrating the general outline of the light-emitting device 1B. Note that the wire 13 is not shown in the cross-sectional views from Figure 2A onward.

[0065] In a cross-sectional view, the light-emitting device 1A differs from light-emitting device 1 in that the length in the z-direction from the lower end to the upper end of the light-reflecting portion 42, which constitutes the inner surface of the second wall 40, is different. In other respects, it is the same as light-emitting device 1. In a cross-sectional view, the length in the z-direction from the lower end to the upper end of the light-reflecting portion 42 is equal to or longer than half the length of the second wall 40. The length in the z-direction from the lower end to the upper end of the light-reflecting portion 42 is, for example, 50% to 90% of the inner surface of the second wall 40.

[0066] The light-emitting device 1A can further enhance the brightness-improving effect of the light-reflecting portion 42 by increasing the proportion of the area of ​​the light-reflecting portion 42 on the inner surface of the second wall 40.

[0067] The light-emitting device 1B differs from light-emitting devices 1 and 1A in that the second wall 40 does not have a light-reflecting portion 42. In other respects, it is the same as light-emitting device 1. In light-emitting device 1B, the inner surface of the second wall 40 consists only of a light-shielding portion 41.

[0068] The light-emitting device 1B can make the light-emitting surface darker when not lit by making the inner surface of the second wall 40 only the light-shielding portion 41, thereby increasing the contrast ratio between when it is lit and when it is not.

[0069] (Example of a light-transmitting material) Next, light-emitting devices 3A and 3B relating to modified versions of the translucent member 50 will be described with reference to Figures 3A and 3B. Figure 3A is a cross-sectional view illustrating the general outline of light-emitting device 3A. Figure 3B is a cross-sectional view illustrating the general outline of light-emitting device 3B relating to modified versions of the translucent member 50.

[0070] The light-emitting device 3A differs from the light-emitting device 1 in that its translucent member 50. Other aspects are the same as those of the light-emitting device 1. The translucent member 50 of the light-emitting device 3A consists of a lower part 51 that covers the light-emitting element 20 and an upper part 52 located above the lower part 51. The light-emitting device 3A may have an interface 55 between the upper part 52 and the lower part 51.

[0071] The lower part 51 is the lower portion of the translucent member 50 located within the recess 60. The lower part 51 is located on the bottom 10 side and covers the light-emitting element 20. The lower part 51 is located in the portion defined by the first wall 30 and the bottom 10. The upper part 52 is the upper portion of the translucent member 50 located within the recess 60. The upper part 52 forms the light-emitting surface. The upper part 52 is located in the portion defined by the upper surface of the lower part 51 and the second wall 40. In other words, the lower part 51 and the upper part 52 are two stacked layers in the translucent member 50.

[0072] The materials for the lower part 51 and the upper part 52 can be resins containing a light-diffusing material as the base material. The base materials for the lower part 51 and the upper part 52 may be different, or the base materials may be the same but the type or amount of light-diffusing material differs.

[0073] The light-emitting device 3A is a translucent member 50 consisting of a lower part 51 that covers the light-emitting element 20 and an upper part 52 located on the lower part 51. This allows for the stacking of translucent members 50 with different properties for light on the side closer to the light-emitting element 20 and the side closer to the light-emitting surface. Therefore, the light from the light-emitting device 3A can be adjusted more precisely. In addition, the physical properties of the lower part 51 can be set to match the first wall 30, and the upper part 52 can be set to match the second wall 40. Therefore, the reliability of the light-emitting device 3A can be further improved.

[0074] The light-emitting device 3B differs from the light-emitting device 3A in that the upper surface of the lower part 51 of the light-transmitting member 50 is located at a higher position than the upper surface of the first wall 30, as shown in Figure 3B. In a cross-sectional view, the lower part 51 covers the boundary between the first wall 30 and the second wall 40. In a cross-sectional view, the upper part 52 covers the boundary between the light-reflecting part 42 and the light-shielding part 41.

[0075] As shown in Figures 3A and 3B, the light-emitting device 3B allows for more precise adjustment of the characteristics of the stacked light-transmitting members 50 by arranging the light-transmitting members 50 in a stacked structure of two or more layers, such as an upper layer 52 and a lower layer 51.

[0076] [Light-emitting device according to the second embodiment] The light-emitting device 2 according to the second embodiment will be described with reference to Figures 4A and 4B. Figure 4A is a plan view illustrating the schematic of the light-emitting device 2. Figure 4B is a cross-sectional view illustrating the schematic along the line IVB-IVB in Figure 4A.

[0077] The light-emitting device 2 differs from the light-emitting device 1 in its translucent member 50, but its other components are the same as those of the light-emitting device 1. The translucent member 50 of the light-emitting device 2 consists of a lower part 51 that covers the light-emitting element 20 and upper parts 52A, 52B, and 52C located above the lower part 51. Note that the upper parts 52A, 52B, and 52C may not be distinguished, or may be described collectively as the upper part 52.

[0078] In the light-emitting device 2, the upper part 52 contains a coloring agent. In a plan view, the upper part 52 is divided into three regions: upper part 52A, 52B, and 52C. In a plan view, the three regions 52A, 52B, and 52C divide the translucent member 50 into approximately three equal parts in the direction in which the light-emitting elements 20 are aligned. In a cross-sectional view, upper part 52A is positioned above the light-emitting element 22, upper part 52B is positioned above the light-emitting element 21, and upper part 52C is positioned above the light-emitting element 23. In a plan view, the light-emitting element 20 does not overlap with the boundary between upper part 52A and upper part 52B, or the boundary between upper part 52B and upper part 52C. It is preferable that upper parts 52A, 52B, and 52C have different chromaticities from adjacent regions, and it is more preferable that all three regions have different chromaticities.

[0079] The light-emitting device 2 preferably has upper parts 52 having a chromaticity corresponding to the light-emitting color of the light-emitting element 20. A blue upper part 52B is located above the light-emitting element 21 that emits blue light, a green upper part 52A is located above the light-emitting element 22 that emits green light, and a red upper part 52C is located above the light-emitting element 23 that emits red light. By including a coloring agent in the upper parts 52, the contrast ratio between when the light is on and when it is not can be increased.

[0080] In a cross-sectional view, the lower end of the upper part 52 is at the same height as, or higher than, the upper surface of the first wall 30. This makes it easier for the light emitted from the side of the light-emitting element 20 to be reflected by the first wall 30.

[0081] In a cross-sectional view, the lower end of the upper section 52A is positioned higher than the other two sections. The higher position of the lower end of the upper section 52A allows for better light extraction from the light-emitting device 2. The shorter z-direction length of the upper section 52A above the light-emitting element 22, which emits green light (the most bright of the red, blue, and green light), reduces the amount of light absorbed by the coloring agent. The lower ends of the upper section 52B and the upper section 52C may be at the same height or at different heights. Furthermore, the lower end positions may be lower or higher in the order of upper sections 52B, 52A, and 52C.

[0082] As a coloring agent, one containing either a pigment or a dye may be used.

[0083] While there are no particular limitations on the type of pigment used, examples include those made from inorganic or organic materials, and the following are some examples of materials used:

[0084] Examples of inorganic materials include red iron oxide (Fe2O3), red lead (Pb3O4), titanium nickel antimony oxide, titanium nickel barium oxide, titanium chromium antimony oxide, and titanium chromium niobium oxide.

[0085] Examples of organic materials include copper phthalocyanates, anthraquinones, azos, quinacridones, perylenes, diketopyrrolopyrroles, monoazos, disazos, pyrazolones, benzimidazolones, quinoxalines, azomethines, isoindolinones, and isoindolines.

[0086] While there are no particular limitations on the types of dyes used, examples include anthraquinone dyes, methine dyes, azomethine dyes, oxazine dyes, azo dyes, styryl dyes, coumarin dyes, porphyrin dyes, dibenzofuranone dyes, diketopyrrolopyrrole dyes, rhodamine dyes, xanthene dyes, and pyromethene dyes.

[0087] Furthermore, the pigments and dyes should ideally not convert the light from the light-emitting element 20 to a different wavelength. This is because they should not affect the wavelength conversion element when it is included in the light-transmitting member 50.

[0088] The lower part 51 does not contain a coloring agent. There is an interface 55 between the upper part 52 and the lower part 51. It is preferable that the lower part 51 and the upper part 52 are made of the same base material. This makes it less likely for delamination to occur between the lower part 51 and the upper part 52.

[0089] In a plan view, the upper part 52 of the light-emitting device 2 is divided into three regions, and these three regions have different chromaticities. As a result, even in the presence of ambient light, the light-emitting surface when not lit appears black due to subtractive color mixing. Therefore, the contrast ratio between when the light-emitting device is lit and when it is not lit can be increased.

[0090] Furthermore, the modified versions of the second wall described in light-emitting devices 1A and 1B and the modified versions of the light-transmitting members described in light-emitting devices 3A and 3B can be combined with each other. They can also be combined with light-emitting device 2 according to the second embodiment.

[0091] [Manufacturing method for a light-emitting device according to the first embodiment] Next, the manufacturing method of the light-emitting device 1 according to the first embodiment will be described with reference to Figures 5 to 7I. Figure 5 is a flowchart illustrating the manufacturing method of the light-emitting device. Figure 6A is a plan view illustrating the outline of the intermediate in the manufacturing method of the light-emitting device 1. Figure 6B is a cross-sectional view illustrating the outline along the VIB-VIB line shown in Figure 6A. Figures 7A to 7I are cross-sectional views illustrating the outline of the state at each step.

[0092] A method for manufacturing the light-emitting device 1 includes the steps of: preparing an intermediate body 800 having a light-emitting element 20, a bottom portion 100 on which the light-emitting element 20 is placed, and a first wall 300 that surrounds the light-emitting element 20 on the bottom portion 100 and spaced apart from the side surface of the light-emitting element 20; placing a translucent member 500 that is taller than the height of the first wall 300 and covers the upper surface of the first wall 300 and the light-emitting element 20; removing a part of the translucent member 500 so as to expose at least a part of the upper surface of the first wall 300 to form a first groove 71; placing a first resin 410 in the first groove 71 to form a second wall 400; and cutting the second wall 400 along the first groove 71 in a plan view to form individual pieces.

[0093] (Steps to prepare the intermediate) Step S10, which involves preparing the intermediate, will be explained mainly based on Figures 6A and 6B. Step S10 is a step in which an intermediate 800 having a light-emitting element 20, a bottom 100, and a first wall 300 is prepared. The bottom 100 and the first wall 300 of the intermediate 800 are the parts that become the base 15 of the light-emitting device 1. The intermediate 800 may have one or more parts that become the light-emitting device 1. Here, a part of the intermediate 800 will be explained in detail.

[0094] As shown in Figure 6A, the intermediate body 800 is connected to the first wall 300 by a lead 111 which is part of the bottom 100. In the intermediate body 800, the bottom 100 is arranged in the x and y directions.

[0095] The intermediate body 800 has light-emitting elements 21, 22, and 23. Hereafter, as in the description of the light-emitting device 1, the light-emitting elements 21, 22, and 23 may not be distinguished, or may be described collectively as the light-emitting element 20. As shown in Figure 6B, the light-emitting elements 21, 22, and 23 are arranged on the upper surface of the bottom 100 along the x-direction.

[0096] The process may include a step of forming a frame F1 surrounding the intermediate body 800 before or after the step of preparing the intermediate body 800. In a plan view, the frame F1 is positioned around the intermediate body 800 or on the outer circumference of the upper surface of the intermediate body 800. As shown in Figure 6A, the frame F1 is positioned to surround multiple sets of light-emitting elements 21, 22, and 23 arranged in the x-direction. The frame F1 may also be positioned to surround multiple sets arranged in the y-direction, or to surround each set individually. When arranging the translucent member 500, which will be described later, the frame F1 can block the material of the translucent member 500 before it hardens. The frame F1 can be formed, for example, by drawing on a flat intermediate body 800 and then hardening it. Alternatively, the frame F1 can be formed by attaching a pre-formed frame-shaped or rod-shaped molded body onto the intermediate body 800 using a joining member or the like. Examples of materials for the frame F1 include silicone resin. Frame F1 is removed in the first groove formation step S30 and the second groove formation step S42, which will be described later. Note that the frame F1 is not shown in Figure 7A and subsequent figures.

[0097] (Step of arranging light-transmitting members) Step S20, which involves arranging the light-transmitting member, will be explained mainly with reference to Figures 7A and 7B. Step S20 is the step of arranging the light-transmitting member 500 on the upper surface of the intermediate body 800. The light-transmitting member 500 is arranged to cover the light-emitting element 20. Preferably, the light-transmitting member 500 is also arranged to cover the upper surface of the bottom 100 and the inner surface 301 of the first wall 300. The light-transmitting member 500 may be arranged to cover the upper surface of the first wall 300, or it may be arranged to cover only the upper surface of the bottom 100 and the inner surface 301 of the first wall 300.

[0098] The height of the translucent member 500 is set higher than the height of the upper surface of the first wall 300. The height of the translucent member 500 may be the same as the height of the translucent member 50 in the light-emitting device 1. In this case, the step of exposing the upper surface of the translucent member 500 can be omitted. The height of the translucent member 500 may be higher than the height of the translucent member 50 in the light-emitting device 1.

[0099] The translucent member 500 is formed by placing an uncured translucent member 500 and allowing it to cure. The material of the translucent member 500 before curing is liquid or paste-like. The translucent member 500 before curing can be placed, for example, by printing, potting, spraying, etc. The material of the translucent member 500 before curing may be placed in a single step. This simplifies the manufacturing process. The material of the translucent member 500 before curing may be placed in multiple steps. This reduces the generation of air bubbles. For example, Figures 7A and 7B show the material of the translucent member 500 before curing being placed in two steps. First, as shown in Figure 7A, the translucent member 500 is placed from the top surface of the bottom 100 to approximately the height of the top surface of the first wall 300. Next, as shown in Figure 7B, the translucent member 500 is positioned from the upper surface of the translucent member 500 formed in Figure 7A to a position higher than the upper surface of the first wall 300. In Figure 7B, the boundary between the translucent member 500 formed in Figure 7A and the translucent member 500 formed in Figure 7B is represented by a dotted line.

[0100] The placed translucent members 500 may be cured all at once or in multiple stages. As an example, the placed translucent members 500 are placed once, then immediately placed a second time, and then cured all at once after the second placement. Alternatively, the curing process may be performed after the first placement but before the second placement.

[0101] (Step of forming the first groove) The first groove formation step S30 will be explained mainly with reference to Figure 7C. The first groove formation step S30 is the step of forming a first groove 71 in the translucent member 500. The first groove 71 is formed by removing a part of the translucent member 500 so that at least a part of the upper surface of the first wall 300 is exposed. When forming the first groove 71, a part of the upper surface of the first wall 300 may also be removed. In this case, the surface of the first wall 300 that is exposed by forming the first groove 71 is a different surface from the upper surface before the first groove 71 was formed, but this surface is also referred to as the upper surface of the first wall 300.

[0102] The first groove 71 is formed in the direction of extension of the upper surface of the first wall 300. Preferably, the center of the first groove 71 coincides with the center of the upper surface of the first wall 300 in a cross-section perpendicular to the direction of extension of the first groove 71. In a cross-sectional view, it is preferable that the length of the first groove 71 in the x-direction coincides with the length of the upper surface of the first wall 300 in the x-direction. However, the length of the first groove 71 in the x-direction may be formed to be smaller than the length of the upper surface of the first wall 300 in the x-direction. This allows the translucent member 500 to be placed on a part of the upper surface of the first wall 300. Furthermore, a part of the upper surface of the first wall 300 can be exposed from the second wall 400 formed in a later process. The bottom surface defining the first groove 71 is the upper surface of the first wall 300. The side surface defining the first groove 71 is the surface of the translucent member 500.

[0103] The first groove 71 can be formed, for example, using a blade. In step S30, which involves forming the first groove, a blade with a thickness of 100 μm or more and 900 μm or less is used. It is preferable to form the first groove 71 using a blade with a flat tip. This makes it possible to form a first groove 71 perpendicular to the bottom portion 100. The first groove 71 may also be formed using laser processing or the like.

[0104] (Process of forming the second wall) The process S40 for forming the second wall will be explained mainly with reference to Figures 7D to 7H. The process S40 for forming the second wall is a process of forming the second wall 400 by placing the first resin 410 in the first groove 71. The process S40 for forming the second wall includes the process S41 for placing the second resin in the first groove 71, the process S42 for removing a portion of the second resin 420 along the first groove 71 with a width narrower than the first groove 71 in a plan view to expose the upper surface of the first wall 300 and form the second groove, and the process S43 for placing the first resin in the second groove 72.

[0105] Step S41, which involves placing the second resin, will be explained primarily with reference to Figure 7D. Step S41 is the step of placing the second resin 420 in the first groove 71. The second resin 420 is placed so as to cover at least the upper surface of the first wall 300 and the side surface of the translucent member 500, which are exposed by forming the first groove 71. The second resin 420 may also be placed so as to cover the upper surface of the translucent member 500. In this case, the step of exposing the upper surface of the translucent member 500, which will be described later, is included. Therefore, variations in the height of the translucent member 500 can be reduced. The second resin 420 may also be placed only inside the first groove 71.

[0106] The height of the second resin 420 may be set higher than the height of the upper surface of the light-transmitting member 500. Alternatively, the height of the second resin 420 may be the same as the height of the upper surface of the light-transmitting member 500.

[0107] The second resin 420 is, for example, a resin that is light-reflective. The second resin 420 is formed by placing uncured second resin 420 and curing it. The second resin 420 is placed using methods such as potting or spray coating.

[0108] The process S42 for forming the second groove will be explained mainly with reference to Figures 7E and 7F. The process S42 for forming the second groove is the process of forming the second groove 72 in the second resin 420. The process S42 for forming the second groove may be performed in one step or in multiple steps. For example, Figures 7E and 7F show the second groove 72 being formed in two steps.

[0109] As shown in Figure 7E, step S42 for forming the second groove includes a first step of removing a portion of the second resin 420 to expose at least a portion of the upper surface of the first wall 300. When removing a portion of the second resin 420, a portion of the upper surface of the first wall 300 may also be removed. In this case, the surface of the first wall 300 exposed by removing the second resin 420 is a different surface from the upper surface of the first wall 300 before the formation of the second groove 72, but this surface is also referred to as the upper surface of the first wall 300. In the first step, the second groove 72 is formed in the direction in which the first wall 300 extends. Preferably, the center of the second groove 72 coincides with the center of the upper surface of the first wall 300 in a cross-section perpendicular to the direction in which the second groove 72 extends. More preferably, the center of the second groove 72 coincides with the center of the first groove 71. As shown in Figure 7E, the width of the second groove 72 is formed to be narrower than the width of the first groove 71. The bottom surface defining the second groove 72 is the top surface of the first wall 300. The side surface defining the second groove 72 is the surface of the second resin 420.

[0110] As shown in Figure 7F, the step S42 for forming the second groove may include a second step after the first step in which a portion of the side surface of the translucent member 500 is exposed. The second step is to remove the upper portion of the second resin 420 that covers the side surface of the translucent member 500. As a result, a portion of the side surface of the translucent member 500 is exposed from the second resin 420. Note that when forming the second groove 72, a portion of the side surface of the translucent member 500 may be removed at the same time. In this case, the surface of the translucent member 500 exposed by forming the second groove 72 is a different surface from the side surface before forming the second groove 72, but such a surface is also referred to as the side surface of the translucent member 500. The width of the second groove 72 formed in the first step is formed to be narrower than the width of the first groove 71. By having the first step and the second step, the step S42 for forming the second groove can adjust the width and height of the second resin 420 of the second wall 400, respectively. This allows the light-emitting device 1 to be manufactured according to the desired characteristics. Note that the first step may be performed after the second step.

[0111] The second groove 72 can be formed using the same method as the first groove 71. The first step uses, for example, a blade with a thickness of 100 μm to 600 μm. The second step uses, for example, a blade with a thickness of 100 μm to 900 μm. The shape of the blade used in the first step may be the same as or different from the shape of the blade used in the second step. For example, it is preferable to use a blade with a flat tip in both the first and second steps. This makes it possible to form a second groove 72 perpendicular to the bottom 100. Furthermore, the width of the light reflecting portion 42 in the light-emitting device 1 can be adjusted by adjusting the thickness of the blade that forms the second groove 72.

[0112] The first resin placement step S43 will be explained mainly with reference to Figure 7G. The first resin placement step S43 is the step of placing the first resin 410 in the second groove 72. In the first resin placement step S43, the second wall 400 is formed by placing the first resin 410 in the second groove 72. The second wall 400 is the part that becomes the second wall 40 in the light-emitting device 1. The first resin 410 is placed so as to cover at least the upper surface of the first wall 300, the upper surface of the second resin 420, the side surface of the second resin 420, and the side surface of the light-transmitting member 500, which are exposed by forming the second groove 72. The first resin 410 may also be placed so as to cover the upper surface of the light-transmitting member 500. In this case, the process includes a step to expose the upper surface of the light-transmitting member 500, which will be described later. Therefore, variations in the height of the light-transmitting member 500 can be reduced. The first resin 410 may also be placed only inside the second groove 72. When the first resin 410 covers the light-transmitting member 500, it covers it via the upper surface of the second resin 420 which is positioned on the upper surface of the light-transmitting member 500.

[0113] The height of the first resin 410 can be set higher than the height of the upper surface of the light-transmitting member 500. In this case, the process includes a step of aligning the height of the upper surface of the first resin 410 with the height of the upper surface of the light-transmitting member 500, or a step of exposing the upper surface of the light-transmitting member 500, as described later. Alternatively, the height of the first resin 410 can be the same as the height of the upper surface of the light-transmitting member 500. Alternatively, the height of the first resin 410 can be the same as the height of the upper surface of the second resin 420 that covers the upper surface of the light-transmitting member 500.

[0114] The first resin is, for example, a light-shielding resin. The first resin 410 is formed by placing uncured first resin 410 and curing it. The first resin 410 may be formed using the same method as the second resin 420, or it may be formed using a different method.

[0115] The process of exposing the upper surface of the translucent member 500 will be explained mainly with reference to Figure 7H. The process of exposing the upper surface of the translucent member 500 may be included after the process S40 of forming the second wall. The upper surface of the translucent member 500 is exposed by removing the first resin 410 and the second resin 420. Here, since the second resin 420 and the first resin 410 are arranged on the upper surface of the translucent member 500, these are removed, and a part of the upper surface of the translucent member 500 is also removed. The removed upper surface of the translucent member 500 becomes the light-emitting surface in the light-emitting device after individualization. Note that the upper surface of the translucent member 500 may already be exposed after the formation of the second wall 400. In that case, instead of the process of exposing the upper surface of the translucent member 500, a process of matching the height of the already exposed upper surface of the translucent member 500 with the height of the upper surface of the second wall 400 can be performed.

[0116] The step of exposing the upper surface of the translucent member 500 involves, for example, polishing the first resin 410 and the second resin 420, which are positioned on the upper surface of the translucent member 500, after the formation of the second wall 400, to expose the upper surface of the translucent member 500. The upper surface of the translucent member 500 is made uneven by polishing, making it possible to manufacture a light-emitting device 1 that reduces the scattering of ambient light on the upper surface of the translucent member 500. For polishing the upper surface of the translucent member 500, for example, abrasive paper, buffing, or a diamond grinding wheel can be used.

[0117] (The process of separating the pieces into individual segments) The individualization process S50 will be explained mainly with reference to Figure 7I. The individualization process S50 is a process of cutting into light-emitting devices 1. If there are multiple intermediate bodies 800, the individualization process S50 results in multiple light-emitting devices 1, each having side walls consisting of a first wall 30 and a second wall 40, and a translucent member 50 placed in a recess 60 defined by the first wall 30, the second wall 40, and the bottom portion 10. Note that if the intermediate body 800 has only one portion that becomes a light-emitting device 1, the individualization process S50 can be omitted.

[0118] Step S50, which is the process of separating into individual pieces, involves cutting in the direction in which the first groove 71 or the second groove 72 extends. Preferably, step S50 is performed by cutting at the center of the first groove 71 or the second groove 72 in a cross section perpendicular to the direction in which the first groove 71 or the second groove 72 extends. Step S50 is performed by cutting the second wall 400, the first wall 300, and the bottom 100.

[0119] Methods for individualizing the material include, for example, dicing, die cutting, die cutting, ultrasonic cutting, and laser cutting.

[0120] The manufacturing method for the light-emitting device 1 can reduce the warping of the base 15. When the first wall 300 and the second wall 400 are formed at once using a mold or the like, the base 15 tends to warp significantly because the wall with the combined height of the first wall 300 and the second wall 400 is formed all at once. In contrast, the manufacturing method for the light-emitting device 1 forms the second wall 400 on top of the first wall 300, thus reducing the warping of the base 15.

[0121] The manufacturing method for the light-emitting device 1 allows for the production of a light-emitting device 1 with good light extraction and a small external shape in plan view. When the first wall 300 and the second wall 400 are formed in one step using a mold or the like, if the goal is to form a wall with a slope similar to that of the inner surface of the first wall 300 shown in Figure 6B, the external shape in plan view will be large. In contrast, the manufacturing method for the light-emitting device 1 forms the first wall 300 and the second wall 400 in separate steps. Therefore, the inner surface of the first wall 300 can be formed with a slope to facilitate the reflection of light from the light-emitting element 20, and the inner surface of the second wall 400 can be formed to be approximately vertical so as not to increase the external shape in plan view. Thus, a light-emitting device 1 with good light extraction can be manufactured without increasing the external shape in plan view.

[0122] The manufacturing method for the light-emitting device 1 facilitates the mounting of the light-emitting element 20. In the manufacturing method for the light-emitting device 1, the inner surface of the second wall 400 is formed to be approximately vertical, so the jig for mounting the light-emitting element 20 is likely to come into contact with the inner surface of the second wall 400. However, in the manufacturing method for the light-emitting device 1, the first wall 300 and the second wall 400 are formed in separate processes. Therefore, in the manufacturing method for the light-emitting device 1, the light-emitting element 20 can be mounted before the second wall 400 is formed, making the mounting of the light-emitting element 20 easy.

[0123] According to the manufacturing method of the light-emitting device 1, by using a light-reflective resin as the second resin 420 and a light-shielding resin as the first resin 410, a second wall 400 can be formed that combines a light-shielding region and a light-reflective region. This makes it possible to increase the contrast ratio between when the light is on and when it is not.

[0124] [Manufacturing method for a light-emitting device according to the second embodiment] Next, the manufacturing method of the light-emitting device 2 according to the second embodiment will be described with reference to Figures 8 to 9M. Figure 8 is a flowchart illustrating the manufacturing method of the light-emitting device. Figures 9A to 9M are cross-sectional views illustrating the general state of each step.

[0125] The manufacturing method of the light-emitting device 2 differs from the manufacturing method of the light-emitting device 1 in that, after the step S20 of arranging the light-transmitting member, it includes the steps of: S61 of arranging a first colored resin on the light-transmitting member 500; S62 of removing a portion of the first colored resin 520A to expose a portion of the light-transmitting member; S63 of arranging a second colored resin on the partially exposed light-transmitting member 500; S64 of removing another portion of the first colored resin 520A to expose another portion of the light-transmitting member; and S65 of arranging a third colored resin on the partially exposed light-transmitting member 500. Note that the steps from the first groove formation step S30 onwards are performed after the step of arranging the third colored resin S65.

[0126] Step S10, which involves preparing the intermediate, is basically the same as the manufacturing method for the light-emitting device 1.

[0127] Step S20 for arranging the translucent member in the manufacturing method of the light-emitting device 2 will be explained with reference to Figure 9A. Step S20 for arranging the translucent member is basically the same as in the manufacturing method of the light-emitting device 1. In the step described later, a member containing a coloring agent is placed on the upper surface of the translucent member 500. Therefore, it is preferable that the height of the translucent member 500 to be placed is half or less of the height of the light-emitting device 2.

[0128] (Step of placing the first colored resin) Step S61, which involves placing the first colored resin, will be explained mainly with reference to Figure 9B. Step S61 is the step of placing the first colored resin 520A on the translucent member 500. Preferably, the height of the placed first colored resin 520A is greater than the height of the upper part 52A of the completed light-emitting device 2. In cross-sectional view, the first colored resin 520A is placed so as to cover the upper surface of the translucent member 500, at least the upper surface of the translucent member 500 located above the light-emitting element 20. The first colored resin 520A may cover the entire upper surface of the translucent member 500. Step S61 is the step of placing the material of the first colored resin 520A containing the first coloring agent and curing it. Alternatively, a sheet-like or block-like molded body containing a pre-molded coloring agent may be attached to the upper surface of the translucent member 500 using a bonding member or the like.

[0129] (A process to expose a portion of the light-transmitting material) Step S62, which exposes a portion of the translucent member, will be explained mainly with reference to Figure 9C. Step S62, which exposes a portion of the translucent member, is a step in which a portion of the first colored resin 520A is removed to expose a portion of the translucent member 500. The first portion 75 is a groove-shaped portion formed by removing a portion of the first colored resin 520A. The first portion 75 is formed so as to expose the upper surface of the translucent member 500. Note that when forming the first portion 75, a portion of the upper surface of the translucent member 500 may also be removed. In this case, the upper surface of the translucent member 500 exposed by forming the first portion 75 is a different surface from the upper surface of the translucent member 500 before forming the first portion 75, but such a surface is also referred to as the upper surface of the translucent member 500.

[0130] In step S62, which exposes a portion of the translucent member, it is preferable to remove the first colored resin 520A to a position lower than the interface between the lower surface of the first colored resin 520A and the upper surface of the translucent member 500 in a cross-sectional view. This allows the colored resin to be placed in a later step to be placed on the upper surface of the translucent member 500 without going through the first colored resin 520A. Furthermore, in step S62, which exposes a portion of the translucent member, it is preferable to expose the translucent member 500, that is, the bottom surface defining the first portion 75, so that it is located above the upper surface of the first wall 300. This prevents a portion of the first wall 300 from being removed together with the first colored resin 520A when forming the first portion 75.

[0131] In a plan view, the first portion 75 is formed in one of the non-central regions when the space between the first wall 300 is equally divided into three regions in the direction in which the light-emitting elements 20 are arranged. In a plan view, the first portion 75 overlaps with one of the light-emitting elements 20 via the translucent member 500.

[0132] The first portion 75 can be formed using the same method as the first groove 71. The first portion 75 is formed, for example, using a blade with a thickness of 100 μm or more and 600 μm or less. The shape of the blade used in the first portion 75 is formed, for example, using a blade with a flat tip.

[0133] (Step of applying the second colored resin) Step S63, which involves placing the second colored resin, will be explained mainly with reference to Figure 9D. Step S63 is the step of placing the second colored resin 520B in the first portion 75. The second colored resin 520B is placed so as to cover at least the upper surface of the translucent member 500 that is exposed by forming the first portion 75. The second colored resin 520B is placed so as to cover the side surface of the translucent member 500 and the side surface of the first colored resin 520A that are exposed by forming the first portion 75. The second colored resin 520B may also be placed so as to cover the upper surface of the first colored resin 520A. In this case, the step of exposing the upper surface of the first colored resin 520A, which will be described later, is included. Therefore, variations in the height of the first colored resin 520A, the height of the second colored resin 520B, and the height of the third colored resin 520C can be reduced. Note that the second colored resin 520B may be placed only inside the first portion 75.

[0134] The height of the second colored resin 520B can be set higher than the height of the top surface of the first colored resin 520A. In this case, the process includes either a step of aligning the height of the top surface of the first colored resin 520A with the height of the top surface of the second wall 400, or a step of exposing the top surface of the first colored resin 520A. Alternatively, the height of the second colored resin 520B can be the same as the height of the top surface of the first colored resin 520A. In this case, the step of exposing the top surface of the first colored resin 520A can be omitted.

[0135] Step S63, in which the second colored resin is placed, can be performed using the same method as in step S61, in which the first colored resin is placed. The second colored resin 520B contains the second coloring agent.

[0136] (A process to expose another part of the light-transmitting material) Step S64, which exposes another part of the translucent member, will be explained mainly with reference to Figure 9E. Step S64, which exposes another part of the translucent member, is a step in which another part of the first colored resin 520A is removed to expose another part of the translucent member 500. Step S64, which exposes another part of the translucent member, is basically the same as step S62, which exposes a part of the translucent member. The second part 76 is a groove-shaped part formed by removing a part of the first colored resin 520A. The second part 76 is formed so as to expose the upper surface of the translucent member 500. Note that when forming the second part 76, a part of the upper surface of the translucent member 500 may be removed at the same time. In this case, the upper surface of the translucent member 500 exposed by forming the second part 76 is a different surface from the upper surface of the translucent member 500 before forming the second part 76, but such a surface is also referred to as the upper surface of the translucent member 500. Furthermore, if the second colored resin 520B covers the upper surface of the first colored resin 520A, when forming the second portion 76, the second colored resin 520B covering the upper surface of the first colored resin 520A to be removed is also removed.

[0137] In step S64, which exposes another part of the translucent member, it is preferable that, in a cross-sectional view, the first colored resin 520A is removed to a position lower than the interface between the lower surface of the first colored resin 520A and the upper surface of the translucent member 500. In a cross-sectional view, the bottom surface defining the first portion 75 and the bottom surface defining the second portion 76 may be formed at the same height or at different heights.

[0138] In a plan view, the second portion 76 is formed in the other half of the region that is not in the center when the space between the first wall 300 is divided into three equal parts in the direction in which the light-emitting elements 20 are lined up. In a plan view, the second portion 76 overlaps with one of the light-emitting elements 20.

[0139] The second portion 76 can be formed using the same method as the first groove 71. Preferably, the second portion 76 is formed using the same blade as the first portion 75.

[0140] (Step of applying the third colored resin) Step S65, which involves placing the third colored resin, will be explained mainly with reference to Figure 9F. Step S65 is the step of placing the third colored resin 520C in the second portion 76. The third colored resin 520C is placed so as to cover at least the upper surface of the translucent member 500 that is exposed by forming the second portion 76. The third colored resin 520C is placed so as to cover the side surface of the translucent member 500 and the side surface of the first colored resin 520A that are exposed by forming the second portion 76. The third colored resin 520C may also be placed so as to cover the upper surface of the second colored resin 520B. In this case, the process includes a step to expose the upper surface of the first colored resin 520A, which will be described later. Therefore, variations in the height of the first colored resin 520A, the height of the second colored resin 520B, and the height of the third colored resin 520C can be reduced. Note that the third colored resin 520C may be placed only inside the second portion 76.

[0141] The height of the third colored resin 520C may be set higher than the height of the top surface of the first colored resin 520A. The height of the third colored resin 520C may be set higher than the height of the top surface of the second colored resin 520B, which is placed on the top surface of the first colored resin 520A. The height of the third colored resin 520C may be the same as the height of the top surface of the second colored resin 520B. If the height of the third colored resin 520C is greater than or equal to the height of the top surface of the first colored resin 520A, the process includes a step of aligning the height of the top surface of the first colored resin 520A with the height of the second wall 400, or a step of exposing the top surface of the first colored resin 520A. Alternatively, the height of the third colored resin 520C may be the same as the height of the top surface of the first colored resin 520A. In this case, the step of exposing the top surface of the first colored resin 520A can be omitted.

[0142] Step S65, in which the third colored resin is placed, can be performed using the same method as in step S61, in which the first colored resin is placed. The third colored resin 520C contains a third coloring agent.

[0143] In a cross-sectional view after step S65, in which the third colored resin is placed, the first colored resin 520A is located between the second colored resin 520B and the third colored resin 520C. The lower surface of the first colored resin 520A is located above the lower surfaces of the second colored resin 520B and the third colored resin 520C.

[0144] In this example, the first colored resin 520A is green, the second colored resin 520B is blue, and the third colored resin 520C is red. The blue second colored resin 520B is formed above the light-emitting element 21 that emits blue light, the green first colored resin 520A is formed above the light-emitting element 22 that emits green light, and the red third colored resin 520C is formed above the light-emitting element 23 that emits red light. The green first colored resin 520A, which is initially placed on the light-transmitting member 500, is formed in a position sandwiched between the blue second colored resin 520B and the red third colored resin 520C.

[0145] The steps from step S30 onward, which involves forming the first groove, are basically the same as those used to manufacture the light-emitting device 1. The following paragraphs will only describe the differences from the manufacturing method of the light-emitting device 1. Furthermore, the following paragraphs will use an example in which the second colored resin 520B and the third colored resin 520C are laminated on the upper surface of the first colored resin 520A, as shown in Figure 9G. The upper surface of the first colored resin 520A to the third colored resin 520C, located above the light-transmitting member 500, is the third colored resin 520C.

[0146] (Step of forming the first groove) The process of forming the first groove, step S30, will be explained mainly with reference to Figure 9G. The manufacturing method of the light-emitting device 2 differs from the manufacturing method of the light-emitting device 1 in that the first colored resin 520A, the second colored resin 520B, and the third colored resin 520C, which are arranged on the upper surface of the light-transmitting member 500, are removed together with the light-transmitting member 500.

[0147] (Process of forming the second wall) Step S41, in which the second resin is placed, will be explained mainly with reference to Figure 9H. The manufacturing method of the light-emitting device 2 differs from the manufacturing method of the light-emitting device 1 in that the second resin 420 is placed so as to cover the upper surface of the first wall 300, the side surface of the light-transmitting member 500, the side surface of the first colored resin 520A, the side surface of the second colored resin 520B, and the side surface of the third colored resin 520C, which are exposed by forming at least the first groove 71. In the example shown in Figure 9H, the second resin 420 is placed so as to cover the upper surface of the third colored resin 520C.

[0148] The process S42 for forming the second groove will be explained mainly with reference to Figures 9I and 9J. The manufacturing method of the light-emitting device 2 differs from the manufacturing method of the light-emitting device 1 in that, of the second resins 420 that cover the sides of the first colored resin 520A, the second colored resin 520B, and the third colored resin 520C, the upper second resin 420 is removed.

[0149] Step S43, in which the first resin is placed, will be explained mainly with reference to Figure 9K. The manufacturing method of the light-emitting device 2 differs from the manufacturing method of the light-emitting device 1 in that the first resin 410 is placed so as to cover the upper surface of the first wall 300, the upper surface of the second resin 420, the side surface of the second resin 420, the side surface of the light-transmitting member 500, the side surface of the first colored resin 520A, the side surface of the second colored resin 520B, and the side surface of the third colored resin 520C, which are exposed by forming the second groove 72. In the example shown in Figure 9K, the first resin 410 is placed so as to cover the upper surface of the third colored resin 520C via the second resin 420. The third colored resin 520C is placed so as to cover the upper surface of the second colored resin 520B. Furthermore, the third colored resin 520C is placed so as to cover the upper surface of the first colored resin 520A via the second colored resin 520B.

[0150] The process of exposing the upper surface of the first colored resin 520A will be explained mainly with reference to Figure 9L. The manufacturing method of the light-emitting device 2 differs from the manufacturing method of the light-emitting device 1 in that it includes a step of exposing the upper surface of the first colored resin 520A after the step S40 of forming the second wall. The upper surface of the first colored resin 520A is exposed by removing the second colored resin 520B, the third colored resin 520C, the second resin 420, and the first resin 410 which are arranged on the upper surface of the first colored resin 520A. This also exposes the upper surfaces of the second colored resin 520B and the third colored resin 520C. In addition, the example shown in Figure 9L also shows that a portion of the upper surface of the first colored resin 520A is removed.

[0151] The manufacturing method for the light-emitting device 2 can provide a light-emitting device with an increased contrast ratio between when it is lit and when it is not. The manufacturing method for the light-emitting device 2 involves forming a third colored resin 520C from a first colored resin 520A, and then forming a second wall 400. This allows for the formation of a region containing a coloring agent above the light-emitting element 20.

[0152] The manufacturing method for the light-emitting device 2 can provide a light-emitting device with a wide light distribution. The manufacturing method for the light-emitting device 2 includes a step of exposing the upper surface of the first colored resin 520A after the formation of the second wall 400. Therefore, the height of the light-emitting surface of the light-emitting device 2, which is formed from the first colored resin 520A, the second colored resin 520B, and the third colored resin 520C, can be made to match the upper surface of the second wall 400. This makes it possible to provide a light-emitting device with a wide light distribution.

[0153] [Manufacturing method of a light-emitting device according to a modified example] Next, a method for manufacturing the light-emitting device 1B according to a modified example of the second wall 40 will be described with reference to Figures 10A and 10B. Figures 10A and 10B are cross-sectional views illustrating the general state of each step.

[0154] The manufacturing method of light-emitting device 1B differs from that of light-emitting device 1 in that the step S40 for forming the second wall does not include the step S41 for arranging the second resin and the step S42 for forming the second groove. Other manufacturing methods are basically the same as those of light-emitting device 1. The following paragraphs will only explain the differences from the manufacturing method of light-emitting device 1.

[0155] The step S30 for forming the first groove will be explained mainly with reference to Figure 10A. The manufacturing method of the light-emitting device 1B differs from the manufacturing method of the light-emitting device 1 in that the first groove 71 is formed to be narrower than the upper surface of the first wall 300.

[0156] Step S43, in which the first resin is placed, will be explained mainly with reference to Figure 10B. The manufacturing method of the light-emitting device 1B differs from the manufacturing method of the light-emitting device 1 in that the first resin 410 is placed so as to cover the upper surface of the first wall 300 and the side surface of the light-transmitting member 500, which are exposed by forming at least the first groove 71. This makes it possible to form the inner surface of the second wall 40 which consists only of the first resin 410. The first resin 410 is, for example, a light-shielding resin. In the example shown in Figure 10B, the first resin 410 is placed so as to cover the upper surface of the light-transmitting member 500.

[0157] [Modified example of the process for arranging light-transmitting members] Next, a modified example of step S20, in which the translucent member is placed, will be described with reference to Figures 11A to 11D. Figures 11A to 11D are cross-sectional views illustrating the general state of each step. Step S20, in which the translucent member is placed, as already described, can also be performed by this modified example.

[0158] A modified version of step S20 for arranging the light-transmitting member includes a step of arranging the light-transmitting member 500 in multiple steps. For example, a modified version of step S20 for arranging the light-transmitting member includes a step of forming a first layer that covers the light-emitting element 20, and a step of forming a second layer that is arranged on the first layer 530A.

[0159] The process of forming the first layer will be explained mainly with reference to Figure 11A. The process of forming the first layer is basically the same as the process S20 for arranging the translucent member in the manufacturing method of the light-emitting device 1, except for the height of the first layer 530A of the translucent member 500 that is to be arranged. In a cross-sectional view, it is preferable that the height of the arranged first layer 530A matches the height of the first wall 300. This makes it possible to reduce the voids that occur when joining with the second layer 530B, which will be described later.

[0160] In a cross-sectional view, the height of the first layer 530A may be greater than the height of the first wall 300. In this case, it is preferable to position it so as to cover the upper surface of the first wall 300. Furthermore, it is more preferable to form the upper surface of the first layer 530A to be flat above the first wall 300 and above the light-emitting element 20. This makes it possible to omit the step of forming the activation layer 530C, which will be described later. The first layer 530A is cured before the step of forming the second layer. If the step of forming the activation layer, which will be described later, is performed, the first layer 530A is cured before the step of forming the activation layer.

[0161] The process of forming the activation layer will be explained mainly with reference to Figure 11B. The activation layer 530C may be formed between the process of forming the first layer and the process of forming the second layer. The process of forming the activation layer can be carried out in the process of forming the second layer. The activation layer 530C is formed on the first layer 530A. Preferably, the activation layer 530C is also formed on the upper surface of the first wall 300. This makes it possible to form a continuous plane across the first layer 530A and the upper surface of the first wall 300. Therefore, the number of voids that occur when joining with the second layer 530B, which will be described later, can be reduced.

[0162] The activation layer 530C is, for example, SiO2. The activation layer 530C can be formed using methods such as vapor deposition and sputtering. The film thickness of the activation layer 530C is, for example, 5 nm to 100 nm.

[0163] The process of forming the second layer will be explained mainly based on Figures 11C and 11D. The process of forming the second layer is to bond the second layer 530B onto the first layer 530A. The second layer 530B is a pre-hardened plate-shaped member. The first layer 530A and the second layer 530B are bonded using atmospheric pressure plasma bonding. Atmospheric pressure plasma bonding is a method in which the surface of the first layer 530A or the activated layer 530C is cleaned and activated by irradiating it with atmospheric pressure plasma P1, and the second layer 530B and the first layer 530A or the activated layer 530C are pressed together to bond them.

[0164] The material of the second layer 530B can be the same as that of the light-transmitting member 500. The material of the second layer 530B may be the same as or different from the material of the first layer 530A.

[0165] In the manufacturing method of the light-emitting device 2, if a modified version of step S20 for arranging the light-transmitting member is used, step S61 for arranging the first colored resin is changed. The first colored resin 520A is used as the second layer 530B and is arranged on the light-transmitting member 500 by atmospheric pressure plasma bonding.

[0166] A modified version of step S20 for arranging the translucent member can reduce the warping of the intermediate body 800 when a material prone to warping is used for the translucent member 500. For example, this is the case when epoxy resin is used as the translucent member 500. In this modified version of step S20 for arranging the translucent member, the cured first layer 530A and the cured second layer 530B are joined together. Therefore, the effect of shrinkage during curing of the translucent member 500 can be suppressed. Thus, the warping of the intermediate body 800 on which the translucent member 500 is arranged can be reduced.

[0167] Furthermore, the manufacturing method of the light-emitting device 1 according to the first embodiment, the manufacturing method of the light-emitting device 2 according to the second embodiment, the manufacturing method of the light-emitting device 1B according to a modified example of the second wall 40, and the modified example of step S20 for arranging the light-transmitting member described above can be combined with each other.

[0168] This disclosure includes embodiments of the following items: [Section 1] A step of preparing an intermediate body having a light-emitting element, a bottom on which the light-emitting element is arranged, and a first wall arranged on the bottom and spaced apart from the side surface of the light-emitting element and surrounding the light-emitting element, A step of arranging a light-transmitting member that is taller than the height of the first wall and covers the upper surface of the first wall and the light-emitting element, The process involves removing a portion of the translucent member so as to expose at least a portion of the upper surface of the first wall, thereby forming a first groove. The process involves placing a first resin in the first groove to form a second wall, A method for manufacturing a light-emitting device, comprising the step of cutting the second wall in the first groove in the direction in which the first groove extends to form individual pieces. [Section 2] The process of forming the two aforementioned walls is as follows: The process involves further distributing a second resin in the first groove, A step of removing a portion of the second resin in the direction in which the first groove extends, with a width narrower than the first groove, to expose the upper surface of the first wall and form a second groove, A method for manufacturing a light-emitting device according to item 1, comprising the step of placing the first resin in the second groove. [Section 3] The method for manufacturing a light-emitting device according to item 2, wherein in the step of forming the second wall, the second resin is a light-reflective resin. [Section 4] The step of forming the second wall further involves placing the first resin on the upper surface of the light-transmitting member, A method for manufacturing a light-emitting device according to any one of claims 1 to 3, wherein after the step of forming the second wall, the first resin is removed to expose the upper surface of the light-transmitting member. [Section 5] After the step of arranging the light-transmitting member, A step of placing a first colored resin on the light-transmitting member, A step of removing a portion of the first colored resin to expose a portion of the light-transmitting member, A step of placing a second colored resin on the light-transmitting member in which a portion is exposed, A step of removing the other part of the first colored resin to expose the other part of the light-transmitting member, A method for manufacturing a light-emitting device according to any one of claims 1 to 4, comprising the step of arranging a third colored resin on the light-transmitting member in which the other part is exposed. [Section 6] The step of placing the second colored resin further involves placing the second colored resin on top of the first colored resin, The step of placing the third colored resin further involves placing the third colored resin on top of the second colored resin, The method for manufacturing a light-emitting device according to item 5, wherein the step of forming the first groove is to remove the first colored resin, the second colored resin, and the third colored resin from the light-transmitting member to expose the upper surface of the first wall. [Section 7] A method for manufacturing a light-emitting device according to claim 5 or 6, wherein in the step of forming the second wall, the first resin is also placed on the upper surfaces of the first colored resin, the second colored resin, and the third colored resin, and after the step of forming the second wall, the upper surfaces of the first colored resin, the second colored resin, and the third colored resin are exposed. [Section 8] The step of arranging the light-transmitting member is: The process includes the steps of forming a first layer that covers the light-emitting element, and forming a second layer that is disposed on the first layer. A method for manufacturing a light-emitting device according to any one of claims 1 to 7, wherein in the step of forming the second layer, the first layer and the second layer are fixed by atmospheric pressure plasma bonding. [Section 9] The process of forming the above two layers is: The method for manufacturing a light-emitting device according to item 8, wherein an activation layer is formed on the first layer before performing the atmospheric pressure plasma bonding. [Section 10] A method for manufacturing a light-emitting device according to any one of claims 1 to 9, wherein in the step of forming the second wall, the first resin is a light-shielding resin. [Section 11] A method for manufacturing a light-emitting device according to any one of claims 1 to 10, comprising the step of making the device into individual pieces, wherein the light-emitting device has a side wall consisting of a first wall and a second wall, and the light-transmitting member is disposed in a recess defined by the first wall, the second wall and the bottom portion. [Section 12] A base having a first wall, A light-emitting element is placed on the base and surrounded by the first wall in a plan view, A second wall having a light-shielding portion and a light-reflecting portion with a higher light reflectivity than the light-shielding portion arranged on the upper surface of the first wall, A light-transmitting member is disposed in a recess defined by the base and the second wall, The light-shielding portion and the light-reflecting portion both contain resin. The outer surface of the second wall and the outer surface of the first wall are formed in a continuous manner. The light-reflecting portion constitutes a part of the inner surface of the second wall, The light-shielding portion is a light-emitting device that comprises the outer surface of the second wall and the upper surface of the second wall. [Section 13] The inner surface of the recess consists of the first wall, the light-reflecting portion, and the light-shielding portion. The light-emitting device according to item 12, wherein the light-reflecting portion is located between the light-shielding portion and the first wall on the inner surface of the recess. [Section 14] The light-emitting device according to claim 12 or 13, wherein the light-reflecting portion is white and the light-shielding portion is black. [Section 15] The light-transmitting member consists of a lower part that covers the light-emitting element and an upper part located above the lower part. The lower part is positioned in the portion defined by the base, The light-emitting device according to any one of claims 12 to 14, wherein the upper part is located in the portion defined by the upper surface of the lower part and the second wall. [Section 16] There is an interface between the upper part and the lower part. In a plan view, the upper part is divided into three regions. The light-emitting apparatus according to item 15, wherein the three regions have different chromaticities from each other. [Section 17] The light-emitting device according to any one of claims 12 to 16, wherein the light-shielding portion, the light-reflecting portion, and the light-transmitting member are made of the same base material. [Section 18] The light-emitting device according to any one of claims 12 to 17, wherein the outer surface of the first wall and the outer surface of the second wall are flush. [Explanation of Symbols]

[0169] 1. Light-emitting device (first embodiment) 2. Light-emitting device (second embodiment) 10 bottom 11 Reed 13 wires 14 Resin part 15 base 20 Light-emitting elements 21. Light-emitting element (blue) 22. Light-emitting element (green) 23. Light-emitting element (red) 30, 300 1st wall 40, 400 2nd wall 41 Light-shielding part 42 Light reflecting part 50 Translucent material 51 Lower part 52 Top 60 recesses 71 First groove 72 Second groove 100 Bottom (intermediate) 410 First resin 420 Second resin 500 Translucent material 520A First colored resin 520B 2nd colored resin 520C 3rd colored resin 530A 1st layer 530B 2nd layer 530C activation layer

Claims

1. A step of preparing an intermediate body having a light-emitting element, a bottom on which the light-emitting element is arranged, and a first wall arranged on the bottom and spaced apart from the side surface of the light-emitting element and surrounding the light-emitting element, A step of arranging a light-transmitting member that is taller than the height of the first wall and covers the upper surface of the first wall and the light-emitting element, The process involves removing a portion of the translucent member so as to expose at least a portion of the upper surface of the first wall, thereby forming a first groove. The process involves placing a first resin in the first groove to form a second wall, A method for manufacturing a light-emitting device, comprising the step of cutting the second wall within the first groove in the direction in which the first groove extends to form individual pieces.

2. The process of forming the two aforementioned walls is as follows: The process involves further distributing a second resin in the first groove, A step of removing a portion of the second resin in the direction in which the first groove extends, with a width narrower than the first groove, to expose the upper surface of the first wall and form a second groove, A method for manufacturing a light-emitting device according to claim 1, comprising the step of placing the first resin in the second groove.

3. The method for manufacturing a light-emitting device according to claim 2, wherein in the step of forming the second wall, the second resin is a light-reflective resin.

4. The step of forming the second wall further involves placing the first resin on the upper surface of the light-transmitting member, A method for manufacturing a light-emitting device according to claim 1, wherein, after the step of forming the second wall, the first resin is removed to expose the upper surface of the light-transmitting member.

5. After the step of arranging the light-transmitting member, A step of placing a first colored resin on the light-transmitting member, A step of removing a portion of the first colored resin to expose a portion of the light-transmitting member, A step of placing a second colored resin on the light-transmitting member with a portion of it exposed, A step of removing the other part of the first colored resin to expose the other part of the light-transmitting member, A method for manufacturing a light-emitting device according to claim 1, comprising the step of arranging a third colored resin on the light-transmitting member, the other part of which is exposed.

6. The step of placing the second colored resin further involves placing the second colored resin on top of the first colored resin, The step of placing the third colored resin further involves placing the third colored resin on top of the second colored resin, The method for manufacturing a light-emitting device according to claim 5, wherein the step of forming the first groove is to remove the first colored resin, the second colored resin, and the third colored resin from the light-transmitting member to expose the upper surface of the first wall.

7. A method for manufacturing a light-emitting device according to claim 5, wherein in the step of forming the second wall, the first resin is also placed on the upper surfaces of the first colored resin, the second colored resin, and the third colored resin, and after the step of forming the second wall, the upper surfaces of the first colored resin, the second colored resin, and the third colored resin are exposed.

8. The step of arranging the light-transmitting member is: The process includes the steps of forming a first layer that covers the light-emitting element, and forming a second layer that is disposed on the first layer. The method for manufacturing a light-emitting device according to claim 1, wherein, in the step of forming the second layer, the first layer and the second layer are fixed by atmospheric pressure plasma bonding.

9. The process of forming the two aforementioned layers is as follows: The method for manufacturing a light-emitting device according to claim 8, wherein an activation layer is formed on the first layer before performing the atmospheric pressure plasma bonding.

10. The method for manufacturing a light-emitting device according to claim 1, wherein in the step of forming the second wall, the first resin is a light-shielding resin.

11. A method for manufacturing a light-emitting device according to any one of claims 1 to 10, wherein the step of performing the individualization step is to manufacture a light-emitting device having a side wall consisting of the first wall and the second wall, and the light-transmitting member being disposed in a recess defined by the first wall, the second wall and the bottom portion.

12. A base having a first wall, A light-emitting element is placed on the base and surrounded by the first wall in a plan view, A second wall having a light-shielding portion and a light-reflecting portion with a higher light reflectivity than the light-shielding portion arranged on the upper surface of the first wall, A light-transmitting member is disposed in a recess defined by the base and the second wall, The light-shielding portion and the light-reflecting portion both contain resin. The outer surface of the second wall and the outer surface of the first wall are formed in a continuous manner. The light-reflecting portion constitutes a part of the inner surface of the second wall, The light-shielding portion is a light-emitting device that comprises the outer surface of the second wall and the upper surface of the second wall.

13. The inner surface of the recess consists of the first wall, the light-reflecting portion, and the light-shielding portion. The light-emitting device according to claim 12, wherein on the inner surface of the recess, the light-reflecting portion is located between the light-shielding portion and the first wall.

14. The light-emitting device according to claim 12, wherein the light-reflecting portion is white and the light-shielding portion is black.

15. The light-transmitting member consists of a lower part that covers the light-emitting element and an upper part located above the lower part. The lower part is positioned in the portion defined by the base, The light-emitting device according to claim 12, wherein the upper part is located in the portion defined by the upper surface of the lower part and the second wall.

16. There is an interface between the upper part and the lower part. In a plan view, the upper part is divided into three regions. The light-emitting device according to claim 15, wherein the three regions have different chromaticities from each other.

17. The light-emitting device according to any one of claims 12 to 16, wherein the light-shielding portion, the light-reflecting portion, and the light-transmitting member are made of the same base material.

18. The light-emitting device according to claim 12, wherein the outer surface of the first wall and the outer surface of the second wall are flush with each other.

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