Getter composition and distributable paste containing the getter composition
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- SAES GETTERS SPA
- Filing Date
- 2022-11-24
- Publication Date
- 2026-07-08
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Figure 0007886942000001 
Figure 0007886942000002
Abstract
Claims
1. A dispersible getter composition comprising a blend of a first getter powder and a second getter powder, The first getter is polyphenylene oxide (PPO) or poly(2,6-diphenyl-p-phenylene oxide) (PPPO), The second getter is a faujasite (FAU) zeolite, or a mixture of faujasite (FAU) zeolite and Linde-type A(LTA) zeolite, wherein the mass ratio of FAU to LTA is between 0.1 and 5.
0. The mass ratio of the first getter to the second getter is between 0.1 and 5.0, and The blend of getter powders comprises D, which is between 1.0 and 50.0 μm. 90 A getter composition characterized by a particle size distribution having a specific value.
2. The blend of getter powder is D 90 The getter composition according to claim 1, characterized by a particle size distribution having values between 1.0 and 20.0 μm.
3. A dispersible paste comprising an epoxy resin, a phenolic resin, or a mixture thereof, and a dispersible getter composition, The dispersible getter composition consists of a blend of a first getter powder and a second getter powder. The first getter is polyphenylene oxide (PPO) or poly(2,6-diphenyl-p-phenylene oxide) (PPPO), The second getter is a faujasite (FAU) zeolite, or a mixture of faujasite (FAU) zeolite and Linde-type A(LTA) zeolite, wherein the mass ratio of FAU to LTA is between 0.1 and 5.
0. The mass ratio of the first getter to the second getter is between 0.1 and 5.
0. The blend of getter powder is characterized by a particle size distribution having a D90 value that comprises between 1.0 and 50.0 μm. A distributable paste in which the epoxy resin, phenolic resin, or mixture thereof containing a curing agent constitutes an amount between 50% by mass and 90% by mass of the total amount of the paste, and the getter composition constitutes an amount between 10% by mass and 50% by mass of the total amount of the paste.
4. The distributable paste according to claim 3, wherein an additional coloring compound is added in an amount comprising 0.1% to 10% by mass relative to the total amount of the paste.
5. The distributable paste according to claim 4, wherein the coloring compound is a rare earth pigment or an organic heterocyclic compound.
6. The distributable paste according to claim 3, wherein the epoxy resin is selected from bisphenol F-type epoxy resin or bisphenol A-type epoxy resin, and the phenol resin is poly[(phenylglycidyl ether)-co-formaldehyde] resin.
7. The distributable paste according to claim 3, wherein the mass ratio of the first getter to the second getter is between 0.1 and 2.
5.
8. A component for an electronic device, comprising at least one surface on which the paste according to any one of claims 3 to 7 is distributed.
9. The component according to claim 8, which is a cover lid for an hermetically sealed package of the electronic device.