A positioning device for sheet material, a positioning method, and a method for forming a shielding layer for electronic components.
The positioning device and method address the issue of inaccurate sheet material placement by using a support and detection system to ensure precise alignment, enabling effective shielding layer formation on electronic components.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- TOWA
- Filing Date
- 2022-09-06
- Publication Date
- 2026-07-09
Smart Images
Figure 0007887322000001 
Figure 0007887322000002 
Figure 0007887322000003
Abstract
Description
Technical Field
[0001] The present invention relates to a positioning device for a sheet material, a positioning method, and a method for forming a shielding layer for an electronic component.
Background Art
[0002] Patent Document 1 discloses a transport mechanism that fixes a release film cut to a predetermined length to a sheet table and then transports it to a resin molding device. More specifically, the release film is fed out from a roll by a predetermined length, then cut, and fixed to the sheet table. Thereafter, the release film of a predetermined length is transported to the resin molding device by the transport mechanism.
Prior Art Document
Patent Document
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] However, the release film is not accurately positioned with respect to the sheet table and is simply placed on the sheet table. Therefore, such a mechanism is not suitable for equipment that requires accuracy in the position of the release film in subsequent processes. Note that such a problem can occur not only with release films but also with all sheet materials that require high-precision positioning with respect to the sheet table. Also, the process after transportation as described above is not limited to the resin molding device, and various processes can be applied.
[0005] The present invention has been made to solve this problem, and an object thereof is to provide a positioning device for a sheet material, a positioning method, and a method for forming a shielding layer for an electronic component, which enable highly accurate positioning when disposing the sheet material on the sheet table. [Means for solving the problem]
[0006] The sheet material positioning device according to the present invention is a sheet material positioning device having a base material and a functional material disposed on the base material, comprising a support mechanism for supporting the sheet material, a sheet table for fixing the sheet material, and a detection unit for detecting the position of the functional material in the planar direction on the sheet material supported by the support mechanism, and is configured to fix the sheet material to the sheet table after positioning is completed by moving the sheet material relative to the sheet table so that the functional material is positioned at a predetermined position relative to the sheet table based on the position of the functional material detected by the detection unit.
[0007] The method for positioning a sheet material according to the present invention is a method for positioning a sheet material having a base material and a functional material disposed on the base material, comprising the steps of: positioning the sheet material above a sheet table; detecting the position of the functional material in the planar direction on the sheet material; performing a positioning operation by moving the sheet material relative to the sheet table based on the detected position of the functional material so that the functional material is positioned at a predetermined position relative to the sheet table; and fixing the sheet material to the sheet table after the positioning is completed. Positioning method.
[0008] The method for forming a shielding layer on an electronic component according to the present invention comprises the steps of: preparing opposing first and second types; transporting the sheet material from the sheet table via a transport mechanism after the positioning method described above, and placing the sheet material on the installation surface of the first type with the functional material facing the second type; arranging a plurality of electronic components at predetermined intervals on the carrier; placing the carrier on the installation surface of the second type with the electronic components facing the first type; and bringing the first and second types close together and pressing the functional material onto the surface of the electronic component to form a shielding layer on the surface of the electronic component. [Effects of the Invention]
[0009] According to the present invention, high-precision positioning can be achieved when placing sheet material on a sheet table. [Brief explanation of the drawing]
[0010] [Figure 1] This is a schematic plan view of a resin molding apparatus. [Figure 2] This is a cross-sectional view of an electronic component. [Figure 3] This is a cross-sectional view showing a carrier on which electronic components are arranged. [Figure 4] This is a cross-sectional view of the support member that supported the carrier. [Figure 5] This is a plan view of a sheet material wound into a roll. [Figure 6] This is a side view of Figure 5. [Figure 7] This is a side view of the positioning device. [Figure 8] This is a plan view of Figure 7. [Figure 9] This is a side view showing the operation of the positioning device. [Figure 10] This is a side view showing the operation of the positioning device. [Figure 11] This is a side view showing the operation of the positioning device. [Figure 12]It is a side view showing the operation of the positioning device. [Figure 13] It is a plan view showing the operation of the positioning device. [Figure 14] It is a side view showing the operation of the positioning device. [Figure 15] It is a cross-sectional view explaining the operation of transferring the sheet material from the sheet table to the carrier. [Figure 16] It is a cross-sectional view explaining the operation of transferring the sheet material from the sheet table to the carrier. [Figure 17] It is a cross-sectional view explaining the operation of transferring the sheet material from the sheet table to the carrier. [Figure 18] It is a cross-sectional view explaining the operation of transferring the sheet material from the sheet table to the carrier. [Figure 19] It is a cross-sectional view showing the upper and lower molds of Module B. [Figure 20] It is a cross-sectional view showing the crimping process of the shielding material. [Figure 21] It is a cross-sectional view showing the crimping process of the shielding material. [Figure 22] It is a cross-sectional view showing the crimping process of the shielding material. [Figure 23] It is a perspective view showing the operation of another example of the positioning device. [Figure 24] It is a perspective view showing the operation of another example of the positioning device. [Figure 25] It is a perspective view showing the operation of another example of the positioning device. [Figure 26] It is a perspective view showing the operation of another example of the positioning device. [Figure 27] It is a cross-sectional view showing another example of the lower mold of Module B. [Figure 28] It is a plan view showing another example of the lower mold of Module B.
Modes for Carrying Out the Invention
[0011] Hereinafter, an embodiment of a shielding layer formation system for electronic components, including a sheet material positioning device according to the present invention, will be described in detail with reference to the drawings. Furthermore, for ease of understanding, some parts of the drawings may be omitted or exaggerated as appropriate.
[0012] <1. Configuration of a system for forming a shielding layer on electronic components> Figure 1 is a schematic plan view of the shielding layer formation system 100 for electronic components according to this embodiment. This system is for forming an electromagnetic shielding layer on the surface of an electronic component. As shown in Figure 1, the system 100 comprises modules A, B, and C, arranged from left to right in Figure 1.
[0013] Figure 2 is a cross-sectional view of an electronic component on which a shielding layer is formed. As shown in Figure 2, this electronic component 1 comprises a substrate 11 and a chip portion 12, such as an IC chip, disposed on the substrate 11. The substrate 11 can be in various forms; for example, it can be a substrate that electrically relays the electronic component 1 from a motherboard and the chip portion 12, such as an interposer. Specifically, it can be made up of laminated conductive patterns, a ground layer, and an insulating layer, which are not shown in the figure. As will be described later, a shielding layer 13 is pressed onto the top and side surfaces of the chip portion 12 in this electronic component 1 and the side surfaces of the substrate 11. The following describes each module that constitutes this system 100.
[0014] <2. Module A> Module A is a handler module that places multiple electronic components on a carrier. As shown in Figure 3, in Module A, a carrier 2 on which multiple electronic components 1 are placed is prepared.
[0015] The carrier 2 can be made of a film, sheet, or substrate on which the electronic component 1 can be mounted, as long as it can withstand the depressurization process and heating described later. For example, it can be made of metal, glass, etc. An adhesive layer or tack layer for bonding the electronic component 1 is formed on the surface of the carrier 2. The substrate 11 of the electronic component 1 is then fixed to this adhesive layer or tack layer.
[0016] The number of electronic components 1 placed on the carrier 2 is not particularly limited and can be 1 or more. In this embodiment, they are arranged in an array of N × M (where N and M are integers of 2 or more).
[0017] As shown in Figure 4, such a carrier 2 is supported by a plate-shaped support member 3 and transported to module B. Multiple suction ports 31 are opened on the lower surface of the support member 3, and are configured to attract the side of the carrier 2 opposite to the side on which the electronic components 1 are placed. The support member 3, having attracted the carrier 2 in this way, is transported to module B by a transport device (not shown).
[0018] <3. Module C> Before discussing Module B, let's explain Module C. Module C is a module that prepares the electromagnetic shielding material (functional material) that is pressed onto the surface of electronic component 1. First, let's explain the sheet material to which the shielding material is attached.
[0019] <3-1. Sheet material> Figure 5 is a plan view of the wound sheet material, and Figure 6 is a side view of Figure 5. As shown in Figures 5 and 6, the sheet material 4 is wound and held as a roll 40, and has a sheet-like base material 41 and a plurality of shielding materials 42 arranged on this base material 41. The roll 40 on which the sheet material is wound is rotatably held in a roll holding section 511, as will be described later.
[0020] The base material 41 only needs to have release properties so that the shielding material 42 can be peeled off later, and can be formed from a resin film or the like. It is particularly preferable that the base material 41 includes an expandable base material. By being expandable, in module B described later, when the upper mold 61 and the lower mold 62 are in close proximity, the base material 41 can expand and contract to conform to the shape of the electronic component 1. The base material 41 may also be formed from a thermoplastic resin with cushioning properties.
[0021] The thickness of the base material 41 is not particularly limited, but can be, for example, 50 to 550 μm, preferably 50 to 400 μm, and more preferably 100 to 350 μm. Furthermore, as the material constituting the base material 41, it is preferable to use, for example, thermoplastic polystyrene, polymethylpentene, polybutylene terephthalate, polypropylene, and cyclic olefin polymers, with cyclic olefin polymers being even more preferable, and polymethylpentene being particularly preferable.
[0022] The shielding material 42 is formed in a rectangular shape having a width narrower than the width of the base material 41. Multiple shielding materials 42 are arranged on the base material 41 at predetermined intervals in the direction of the roll 40's feed. The shielding material is a sheet-like member for forming a shielding layer on the surface of the electronic component 1, thereby shielding the electronic component 1 from electromagnetic waves. The shielding material 42 may, for example, contain a binder resin, a crosslinking agent, and a conductive filler, and may also contain other additives as needed.
[0023] The binder resin preferably includes a thermosetting resin selected from, for example, epoxy resins, phenolic resins, alkyd resins, melamine resins, acrylate resins, silicone resins, or mixtures thereof.
[0024] Crosslinking agents are used to crosslink binder resins. Specifically, they include those containing one or more structures of hydroxyl groups, phenols, carboxylic acids, amines, epoxys, isocyanates, and aziridines, with those containing epoxys, phenols, hydroxyl groups, and carboxylic acids being preferred in terms of product life and reactivity.
[0025] Examples of conductive fillers include (1) metal powders of conductive metals such as gold, copper, silver, and nickel; (2) alloy powders of conductive metal alloys; and (3) core-shell type particles of silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, and gold-coated nickel powder. The conductive filler may be spherical, ellipsoidal, flake-shaped, dendritic, grape-shaped, and / or needle-shaped.
[0026] <3-2. Sheet material positioning device> Next, the sheet material positioning device 5 provided in module C will be described. Figure 7 is a side view of the positioning device, and Figure 8 is a plan view of Figure 7. This positioning device 5 is a device that cuts sheet material 4 of a predetermined length from a roll 40 and places it on a sheet table 52. As shown in Figures 7 and 8, this positioning device 5 has a support mechanism 51 that supports the sheet material 4, a sheet table 52 that fixes the sheet material 4, a sensor unit 53 that detects the position of the shield material 42 of the sheet material 4, and a cutting mechanism (cutting section) 54 that cuts the sheet material 4. Furthermore, these configurations are controlled by a control unit (not shown) composed of a computer such as a PLC. These configurations will be described in detail below. Also, for the sake of convenience of explanation, the following description will be given in the direction shown in Figures 7 and 8, but the positioning device according to the present invention is not limited to this direction.
[0027] <3-2-1.Support mechanism> The support mechanism 51 includes a roll holding section 511 that rotatably holds the roll 40 on which the sheet material 4 has been wound, and a feed section 512 that holds the end of the sheet material 4 and moves closer to and further away from the roll 40 in the left-right direction (first direction). The roll holding section 511 includes a bearing (not shown) that rotatably supports the roll 40 and a drive section (not shown) that drives this bearing. The feed section 512 is configured to be movable in the left-right direction. Specifically, it is configured to unwind the sheet material 4 from the roll 40 by moving to the right while holding the end of the sheet material 4 wound as a roll 40 with a chuck. When the sheet material 4 is unwinded in this way, as shown in Figure 8, one shield material 42 is exposed in the unwinded sheet material 4.
[0028] <3-2-2. Seat Table> The sheet table 52 is formed in a rectangular shape in plan view and is positioned below the sheet material 4 unwound from the roll 40. Multiple suction ports (not shown) are formed on the upper surface of the sheet table 52, and the sheet material 4 is adsorbed onto the upper surface of the sheet table 52 by drawing air in through these ports. Furthermore, the sheet table 52 is movable horizontally (in the plane of the paper in Figure 8) while holding the sheet material 4, and is configured to transport the sheet material 4 to the module B described above.
[0029] <3-2-3. Sensor Unit> The sensor unit 53 is positioned above the sheet material 4 unwound from the roll 40. The sensor unit 53 has a base 531 formed in a plate shape and supported so as to be able to move up and down, and a first sensor 532 and a second sensor 533 positioned on the base 531. Furthermore, a first pressing portion 534 extending in the front-rear direction is provided at the left end (roll 40 side) of the lower surface of the base 531. As the base 531 descends, this first pressing portion 534 comes into contact with the vicinity of the left end of the upper surface of the sheet table 52. This allows the unwound sheet material 4 to be sandwiched between the sheet table 52 and the first pressing portion 534.
[0030] The sensor unit 53 is positioned close to the upper surface of the sheet material 4 unwound from the roll 40 and is configured to detect the horizontal position of the shield material 42. Specifically, the first sensor 532 detects the rear edge of the shield material 42 extending in the left-right direction, and the second sensor 533 detects the left edge of the shield material 42 extending in the front-rear direction. The control unit then determines whether the detected edge is located within a predetermined range.
[0031] <3-2-4. Cutting mechanism> The cutting mechanism 54 is configured to cut the left side of the sheet material 4 unwound from the roll 40. More specifically, it is configured to cut the portion of the unwound sheet material 4 that is a predetermined distance from the left edge of the exposed shield material 42 in the front-rear direction (second direction). That is, it is configured to cut the base material 41 between adjacent shield material 42s. For this purpose, the cutting mechanism 54 has a cutter 541 for cutting the sheet material 4, a second pressing part 542 for pressing the sheet material 4 from above, and a support part 543 for supporting the sheet material 4 from below. The second pressing part 542 and the support part 543 are formed to extend in the front-rear direction between the sheet table 52 and the roll 40.
[0032] Then, when the sheet material 4 is fed out, the left side of the fed sheet material 4 is pressed by the second pressing section 542 and the support section 543. On the right side of the second pressing section 542 and the support section 543, the sheet material 4 is pressed by the first pressing section 534 and the sheet table 52. In this state, the cutter 541 moves back and forth between the second pressing section 542 and the first pressing section 534, thereby cutting the base material 41. Note that the means for cutting the sheet material do not have to be the cutter 541; for example, it can also be cut by heat, such as with a laser.
[0033] <3-2-5. Operation of the positioning device> Next, the operation of the positioning device 5 configured as described above will be explained with reference to Figures 9 to 14. First, as shown in Figure 9, the feed unit 512 holds the end of the sheet material 4 wound onto the roll 40. Next, as shown in Figure 10, the feed unit 512 is moved to the right, and the sheet material 4 is unfurled from the roll 40. As a result, one shield material 42 of the unfurled sheet material 4 is positioned above the sheet table 52.
[0034] Next, as shown in Figure 11, the sensor unit 53 is lowered, and the position of the shield material 42 is detected by the first sensor 532 and the second sensor 533. That is, as shown in Figure 8, the first sensor 532 and the second sensor 533 are positioned above the rear and left edges of the shield material 42, respectively, and the positions of these edges are detected. At this time, if the detected position of the left edge is not within the specified range, the roll holding unit 511 and the feed unit 512 are driven to adjust the unwinding distance of the sheet material 4, thereby adjusting the left-right position of the shield material 42. As a result, the shield material 42 is positioned at the specified left-right position relative to the sheet table 52.
[0035] On the other hand, if the position of the detected rear edge is not within the specified range, the front-to-back position of the sheet table 52 is adjusted. This ensures that the shielding material 42 is positioned at the specified front-to-back position relative to the sheet table 52.
[0036] Once the shield material 42 is positioned as specified, the sensor unit 53 is lowered further, as shown in Figure 12, and the sheet material 4 is pressed by the first pressing part 534. As a result, the base material 41 on the left side of the shield material 42 is sandwiched between the first pressing part 534 and the sheet table 52. At the same time, air is drawn in from the upper surface of the sheet table 52, and the sheet material 4 is attracted to it. The second pressing part 542 is also lowered relative to the support part 543, and these press the left side of the sheet material 4 beyond the first pressing part 534. Subsequently, as shown in Figure 13, the portion of the sheet material 4 between the first pressing part 534 and the second pressing part 542 is cut by the cutter 541.
[0037] Subsequently, as shown in Figure 14, the sensor unit 53 is raised and the second pressing portion 542 is separated from the support portion 543. In this way, a single sheet material 4 is formed in which the shield material 42 is correctly positioned on the sheet table 52.
[0038] Next, the sheet material 4 on the sheet table 52 is transferred to the transport mechanism. This will be explained with reference to Figures 15 to 18. After the sheet material 4 has been positioned on the sheet table 52 as described above, the transport body 8 of the transport mechanism is placed above the sheet material 4, as shown in Figure 15. The transport body 8 is movable between modules B and C and has a main body 81 with multiple suction ports 811 formed on its lower surface for holding the sheet material 4. In addition, a first holding part 82 is provided on the side of the main body 81 to sandwich the main body 81 from the side, and a second holding part 83 that can be raised and lowered is provided below this first holding part 82.
[0039] As shown in Figure 16, the transporter 8 is positioned above the sheet table 52 and then lowered. This causes the lower surface of the main body 81 to come into contact with the sheet material 4 on the sheet table 52. In this state, as shown in Figure 17, the sheet material 4 is held by air sucked in from the suction port 811, and the second holding part 83 is raised to grip the periphery of the sheet material 4 with the first and second holding parts 82 and 83. After that, the air suction from the sheet table 52 is stopped, and as shown in Figure 18, the transporter 8 is raised. In this way, the sheet material 4 is transferred from the sheet table 52 to the transporter 8. In this state, the transporter 8 is moved to transport the sheet material 4 to module B.
[0040] Afterward, the sheet table 52 is returned to its initial position as shown in Figure 8, and the feed unit 512 is moved to the vicinity of the second pressing unit 542 to hold the end of the sheet material 4, and the behavior shown in Figures 9 to 18 is repeated. In this way, the individual sheets of sheet material 4 positioned at predetermined positions on the sheet table 52 are sequentially transported to module B.
[0041] <4. Module B> Next, module B will be described. Module B is a module for pressing a shielding material 42, transported from module C, onto the surface of an electronic component 1, which has been transported from module A. As shown in Figure 19, module B has an upper mold (second type) 61 on which the carrier 2 is placed, and a lower mold (first type) 62 on which the sheet material 4 is placed, and these are arranged in a chamber that can be depressurized. The upper mold 61 and lower mold 62 will be described below.
[0042] <4-1. Overview of Upper and Lower Types> As shown in Figure 19, the lower surface of the upper mold 61 is formed flat so that the carrier 2 can be placed on it, and multiple suction ports 611 are formed on this lower surface. The carrier 2, which has been transported from module A by the transport device, is placed on the lower surface of the upper mold 61 and is attracted to it.
[0043] The lower mold 62 has a base 621 with a rectangular top surface and a rectangular support plate 622 positioned on the top surface of the base 621. The support plate 622 is smaller than the top surface of the base 621, and a suction port 623 is formed on the top surface of the base 621 in an area outside the support plate 622. By drawing air in through this suction port 623, the sheet material 4 conveyed from module C is adsorbed.
[0044] Multiple rectangular recesses 624 are formed on the upper surface of the support plate 622. These recesses 624 are formed in positions opposite to the electronic components 1 fixed to the upper mold 61 via the carrier 2. That is, each recess 624 is formed in a rectangular shape that is slightly larger than the planar shape of the electronic component 1, so that when the upper mold 61 and the lower mold 62 are close together, each electronic component 1 fits into the recess 624.
[0045] <4-2. Shielding material compression process using upper and lower dies> Next, the process of compressing the shielding material will be explained with reference to Figures 20 and 22. First, as shown in Figure 20, the carrier 2 is placed on the upper die 61 and the sheet material 4 is placed on the lower die 62. The sheet material 4 is positioned on the sheet table 52 in module C and then transported to module B by the transporter 8. This positioning ensures that when the sheet material 4 is transferred from the transporter 8 to the lower die 62, the shielding material 42 of the sheet material 4 is positioned to cover all the recesses 624.
[0046] Next, the pressure inside the chamber is reduced. At this time, the vacuum level inside the chamber can be set to 4000 Pa or less, preferably 2000 Pa or less, more preferably 1000 Pa or less, and even more preferably 100 Pa or less. By reducing the pressure in this way, the electronic component 1 and the shielding material 42 can be firmly adhered to each other.
[0047] Next, as shown in Figure 21, the upper mold 61 and the lower mold 62 are brought close together, and each electronic component 1 is inserted into the recess 624. This causes the shielding material 42 to adhere closely to the surface (bottom and side) of each electronic component 1. Subsequently, when the upper mold 61 and the lower mold 62 are heated, the shielding material 42 that has adhered to the electronic component 1 hardens, and a shielding layer 13 is formed on the bottom and side of the electronic component 1. Alternatively, the upper mold 61 and the lower mold 62 may be heated beforehand before being brought close together.
[0048] Furthermore, pressurization may be applied during heating. For example, the upper mold 61 and lower mold 62 can be used to pressurize the electronic component 1 and the shielding material 42. The pressure at this time can be, for example, 1 to 10 MPa. This allows for the formation of a stronger and more reliable shielding layer 13 on the electronic component 1.
[0049] The heating temperature and curing time can be set appropriately depending on the selected binder resin and other conditions, but for example, it may be 90 to 180 seconds at 100 to 180°C. Here, the curing time may be the time from completion of mold clamping to peeling as described below. Alternatively, mold clamping may be performed by pressing only at room temperature or ambient temperature without heating.
[0050] Then, as shown in Figure 22, when the upper mold 61 and the lower mold 62 are separated, the shielding material 42 of the sheet material 4 peels off from the base material 41 and is transferred to the electronic component 1. In this way, an electronic component 1 with a shielding layer 13 formed on it is obtained.
[0051] Next, carrier 2 is removed from the upper mold, separating the carrier 2 from the carrier 2 on which each electronic component 1 is mounted. The separation method is not particularly limited, but for example, each electronic component 1 can be grasped with a picking device and the electronic components can be separated into individual pieces along with carrier 2. Alternatively, the electronic components 1 and carrier 2 can be separated into individual pieces by dicing. That is, carrier 2 can be cut between adjacent electronic components 1 to separate them into individual pieces.
[0052] <5. Features> The positioning device 5 configured as described above provides the following effects. (1) In the above crimping process, in order to accurately adhere the shielding material 42 to the surface of each electronic component 1, it is necessary to accurately position the shielding material 42 on the lower die 62. In this embodiment, since the shielding material 42 is positioned at a predetermined position on the sheet table 52 in module C, when the sheet material 4 is transferred from the sheet table 52 to the lower die 62, the positioning of the shielding material 42 on the lower die 62 is already completed. Therefore, in the crimping process, the shielding material 42 can be accurately crimped to the electronic component 1 without having to position the shielding material 42.
[0053] (2) In this embodiment, two sensors 532 and 533 are used to detect the edges of two orthogonal sides of the shield material 42. Therefore, the position of the shield material 42 in the planar direction can be accurately detected. If the shield material 42 is not located within a predetermined range, the shield material 42 can be positioned at a specified location on the sheet table 52 by driving at least one of the support mechanism 51 and the sheet table 52.
[0054] (3) Since the sensor unit 53 is provided with a first pressing part 534, by lowering the sensor unit 53, in addition to detecting the position of the shield material 42, the first pressing part 534 can be pressed against the sheet table 52. This allows the sheet material 4 to be sandwiched between the first pressing part 534 and the sheet table 52. Therefore, there is no need to provide a separate mechanism to press the sheet material 4 when cutting.
[0055] <6. Variation> Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the spirit of the invention. For example, the following modifications are possible. Furthermore, the gist of the following modifications can be combined as appropriate.
[0056] (1) In the above embodiment, the sheet material 4 is unwound from the roll 40, the shield material 42 is positioned on the sheet table 52, and then cut to form a single sheet material 4. Alternatively, a single sheet material 4 with one shield material 42 already placed on it can be prepared and positioned on the sheet table 52.
[0057] For example, as shown in Figure 23, a transport unit 7 having four rod-shaped suction members 71 is moved to an initial position where single-leaf sheet materials are stacked. Then, the four corners of the topmost single-leaf sheet material 4 are picked up by the suction members 71, and then, as shown in Figure 24, it is placed above the sheet table 52. Next, as shown in Figure 25, a sensor unit 53 is placed on the sheet material 4 to detect the position of the shield material 42. The detection method can be, for example, a method using two sensors 532 and 533 as shown in the above embodiment. At this time, if the position of the shield material 42 is not within the specified range, the transport unit 7 is moved horizontally to position the shield material 42 at the specified position on the sheet table 52.
[0058] Next, the sensor unit 53 is moved out of the way above the sheet material 4, the transport unit 7 is lowered, and as shown in Figure 26, the sheet material 4 is attracted to the sheet table 52, after which the transport unit 7 is moved away from the sheet material 4. In this way, the sheet material 4, with the shield material 42 positioned, is placed on the sheet table 52. After that, the transport unit 7 is returned to the initial position where the single sheets of sheet material 4 are stacked, and the same process is repeated.
[0059] (2) In the above embodiment, the sheet table 52 is moved in the front-rear direction when positioning the sheet material 4 in the front-rear direction. However, for example, the front-rear positioning can also be achieved by moving the roll holding section 511 and the feed section 512 simultaneously in the front-rear direction while maintaining synchronization.
[0060] (3) In the above embodiment, the position of the shielding material 42 is detected by two sensors 532 and 533, but the type, position, and number of sensors are not particularly limited as long as the position of the shielding material 42 relative to the sheet table 52 can be detected, and various configurations are possible. Therefore, the sensors can be provided not on the base 531, but on, for example, the sheet table 52 or other components.
[0061] (4) In the above embodiment, the first pressing portion 534 is provided on the base 531 of the sensor unit 53, but it may be provided on another part instead of the sensor unit 53.
[0062] (5) In the above embodiment, the electronic component 1 is placed in the upper mold 61 and the sheet material 4 is placed in the lower mold 62 in module B, but this can also be reversed.
[0063] (6) The lower mold 62 on which the sheet material 4 is placed may be in other configurations, for example, as shown in Figures 27 and 28. As shown in Figures 27 and 28, this lower mold 62 does not have a support plate, and recesses 625 are formed directly on the upper surface of the base 627 of the lower mold 62. In addition to the suction port 623 described above, a plurality of suction ports 626 are formed on the upper surface of the base 627 in order to adsorb the sheet material 4. As shown in Figure 28, these suction ports 626 are formed linearly between adjacent recesses 625 in one direction (the vertical direction in Figure 28), connecting the recesses 625 to each other. The sheet material 4 can be firmly fixed by these linear suction ports 626. The configuration of the lower mold 62 may be other than that, and the position, shape, and number of suction ports are not particularly limited as long as the sheet material 4 can be firmly fixed.
[0064] (7) In the above embodiment, the electronic component 1 is placed in the upper mold 61 and the sheet material 4 is placed in the lower mold 62 in module B, but this can also be reversed.
[0065] (8) In the above embodiment, an example was described in which pre-cut electronic components 1 were placed on the carrier 2 and then the shielding material 42 was pressed onto the electronic components 1, but the invention is not limited to this. For example, a semiconductor substrate can be cut in half and placed in the upper mold 61. Then, after placing the sheet material 4 in the lower mold 62 as described above, the upper mold 61 and the lower mold 62 are brought close together, so that the shielding material can be pressed tightly against the groove formed by the half-cut and the top surface of the semiconductor substrate. This allows a shielding layer to be formed. After that, by dicing along the groove, individual electronic components with a shielding layer can be obtained.
[0066] (9) In the above embodiment, a positioning device 5 for positioning the shielding material 42 in a sheet material 4 having a base material 41 and a shielding material 42 disposed on the base material 41 was described, but the configuration of the sheet material 4 is not limited to this. That is, it can be applied to all sheet materials in which a sheet-like functional material of a smaller size is disposed on a base material. That is, it can be applied to all processes in which a functional material having a predetermined function needs to be positioned with high precision relative to a sheet table. Furthermore, the post-positioning process can also be applied to various processes other than the crimping described above. [Explanation of Symbols]
[0067] 1 Electronic components 2 carriers 4 Sheet material 41 Base material 42 Shielding material (functional material) 5 Positioning device 51 Support mechanism 52 Seat Table 53 Sensor unit (detection unit) 532,533 sensors 534 First pressing section 54 Cutting mechanism
Claims
1. A positioning device for a sheet material, comprising a base material and a sheet-like functional material disposed on the base material, A support mechanism for supporting the aforementioned sheet material, A sheet table for fixing the aforementioned sheet material, A detection unit for detecting the position of the functional material in the planar direction on the sheet material supported by the support mechanism, Equipped with, Based on the position of the functional material detected by the detection unit, the sheet material is moved relative to the sheet table so that the functional material is positioned at a predetermined position relative to the sheet table. After this positioning is completed, the functional material is fixed to the sheet table. The aforementioned support mechanism is A roll holding section that holds the roll on which the sheet material is wound, A feed section that holds the end of the sheet material wound onto the aforementioned roll and unwinds the sheet material, Equipped with, Multiple functional materials are arranged on the base material of the sheet material at intervals in the direction of unwinding. After the positioning of the unwound sheet material is completed, the system further includes a cutting section for cutting the unwound sheet material from the roll. The detection unit is configured to detect the position of the edge of the functional material in a first direction for unwinding the sheet material and in a second direction perpendicular to the first direction. The detection unit has a pressing unit for pressing the unwound sheet material, The detection unit is configured to move up and down from above with respect to the unfurled sheet material. After the positioning described above, the detection unit descends, and the cutting unit cuts the sheet material while it is sandwiched between the pressing unit and the sheet table. A positioning device for sheet materials.
2. The positioning is configured to be performed by moving at least one of the support mechanism and the seat table. A positioning device for sheet material according to claim 1.
3. A method for positioning a sheet material having a base material and a plurality of functional materials arranged on the base material at predetermined intervals, The steps include: positioning the sheet material above a sheet table using a roll holding section that holds the roll on which the sheet material is wound, and a feed section that holds the end of the sheet material wound on the roll and unwinds the sheet material; A step of detecting the position of the edge of the functional material by a detection unit positioned above the sheet material in a first direction for unwinding the sheet material and a second direction perpendicular to the first direction, Based on the detected position of the functional material, the step of positioning the sheet material relative to the sheet table so that the functional material is positioned at a predetermined position relative to the sheet table, After the positioning is completed, the detection unit is lowered, and the sheet material that has been fed out is sandwiched between the pressing unit provided on the detection unit and the sheet table, thereby fixing the sheet material to the sheet table. The steps include cutting the sheet material fixed on the sheet table from the roll, It is equipped with Method for positioning sheet material.
4. The aforementioned functional material is an electromagnetic wave shielding material. The steps include preparing the opposing Type 1 and Type 2, The positioning method described in claim 3 is followed by the step of transporting the sheet material from the sheet table via a transport mechanism and placing the sheet material on the installation surface of the first type with the functional material facing the second type, The steps include: arranging multiple electronic components on a carrier at predetermined intervals, The steps include: positioning the carrier on the mounting surface of the second type with the electronic components facing the first type; The steps include bringing the first type and the second type close together and pressing the functional material onto the surface of the electronic component to form a shield layer on the surface of the electronic component, A method for forming a shielding layer for electronic components, comprising the features described above.