Heat treatment apparatus and heat treatment method

The heat treatment apparatus addresses the challenge of sublimated substance recovery and film thickness distribution by using a partitioned chamber with controlled gas discharge, ensuring efficient and precise heat treatment outcomes.

JP7891390B2Active Publication Date: 2026-07-16TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
TOKYO ELECTRON LTD
Filing Date
2022-08-16
Publication Date
2026-07-16

AI Technical Summary

Technical Problem

Existing heat treatment apparatuses face challenges in efficiently recovering sublimated substances while minimizing the impact on film thickness distribution.

Method used

A heat treatment apparatus with a chamber divided into two spaces by a partition, utilizing a switching mechanism to control gas discharge through separate outlets, effectively managing sublimation recovery and reducing film thickness variations.

Benefits of technology

The apparatus achieves efficient recovery of sublimated material and minimizes its impact on film thickness distribution, enhancing the precision of heat treatment processes.

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Patent Text Reader

Abstract

To achieve both of an effective collection of a sublimate and reduction of influence on film thickness distribution.SOLUTION: A heat treatment apparatus comprises: a heating unit; a chamber; an exhaust unit; a partition unit; and a switching unit. The heating unit supports and heats a substrate on which a film of a processing liquid is formed. The chamber is arranged in such a manner that it surrounds the substrate supported by the heating unit. The exhaust unit is configured to discharge a gas from an inner space of the chamber through a discharge opening located in the circumference of the heating unit. The partition unit is configured to partition the inner space of the chamber into a first space where the substrate on the heating unit is exposed and a second space located above the first space. The switching unit is configured to switch between a first state where the gas is discharged by the exhaust unit through the first space and a second state where the gas is discharged through the second space.SELECTED DRAWING: Figure 3
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