Junction structure, photonic integrated circuit, and method for actively aligning the optical axis of a semiconductor optical device with the optical axis of an optical circuit on a substrate.

The bonding structure with porous metal and rigid fixation ensures precise optical axis alignment in photonic devices, addressing misalignment issues and enhancing signal transmission efficiency.

JP7891552B2Active Publication Date: 2026-07-16TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
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Patent Information

Application Number
JP2024575355
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2022-06-29
Filing Date
2023-05-31
Publication Date
2026-07-16
Estimated Expiration
2043-05-31

AI Technical Summary

Technical Problem

Existing photonic devices face misalignment issues between the optical axis of a semiconductor optical device and the optical circuit due to manufacturing defects, bonding errors, and process variations, leading to inefficient signal transmission.

Method used

A bonding structure utilizing porous metal as the first bonding member for plastic deformation during active alignment, followed by a second bonding member for a rigid fixation, ensuring precise optical axis alignment between the semiconductor optical device and the optical circuit.

Benefits of technology

Achieves highly reliable and controlled optical alignment, enabling efficient signal coupling between the semiconductor optical device and the optical circuit, improving device functionality and performance.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

A bonding structure (100) and method for actively aligning the optical axis (OAX1) of a semiconductor optical device (20) with the optical axis (OAX2) of an optical circuit (30) on a substrate (10), and a photonic integrated circuit (110). The bonding structure (100) includes at least one first bonding member (11) on the substrate (10) for initially bonding the semiconductor optical device (20) to the substrate (10), and the first bonding member (11) is made of a material such as a porous metal that exhibits plastic deformation to enable deformation of the at least one first bonding member (11) during active alignment. Further, the bonding structure (100) includes at least one second bonding member (12) on the substrate (10) for secondarily bonding the semiconductor optical device (20) to the substrate (10) upon completion or after active alignment.
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Citation Information

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