Pickup device and method for controlling the pickup device

Abstract

To provide a pickup device that has a simpler constitution and can change the number of thrust-up pins.SOLUTION: A pickup device has a first thrust-up pin with a first tip which presses a chip member with a reverse surface of a dicing tape interposed, and a second thrust-up pin with a second tip. The second thrust-up pin is provided in parallel with the first thrust-up pin, and the height of the second tip is a first length shorter than the height of the first tip. The pickup device also has a thrust-up plate which supports the first thrust-up pin and second thrust-up pin movably along the dicing tape, first energizing means which energizes the first thrust-up pin away from the thrust-up plate, and thrust-up means which moves the thrust-up plate so that the first tip presses a center part of a reverse surface of the chip component with the reverse surface of the dicing tape interposed.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a pickup device and the like.

Background Art

[0002] In the manufacture of chip components such as semiconductors, generally, a plurality of chip components are formed on a single wafer. Then, the wafer is divided into individual chip components using a division method such as dicing. In general dicing, a dicing tape is used. The dicing tape is a film having adhesiveness on one side. The dicing tape is also called a dicing sheet, a wafer sheet, an adhesive sheet, etc.

[0003] When performing dicing, first, the back surface of the wafer is attached to the dicing tape. Next, the wafer is divided into individual chip components by dicing. Next, a process of stretching the dicing tape called expand is performed, and a gap is formed between the chip components. Next, the adhesiveness of the dicing tape is reduced by ultraviolet irradiation or the like. Next, the surface of the chip component is adsorbed by a pickup device provided with an adsorption means called a collet, and the chip component is picked up. At this time, in order to promote the peeling of the chip component from the dicing tape, it is common to push up the back surface of the dicing tape with a pin. By the pushing up, the force applied to the chip component during peeling is reduced. Thereby, breakage of the chip component is prevented.

[0004] By the way, chip components come in various sizes. For picking up small chip components, for example, one push-up pin is sufficient. On the other hand, for picking up large chip components, it is desirable to have a plurality of push-up pins. Thereby, stress concentration on one place of the chip component is avoided.

[0005] Given the above background, a pickup device has been proposed that can switch the number of push-up pins used depending on the size of the chip component. For example, Patent Document 1 discloses a technology for a pickup device (semiconductor element pickup device) that switches the number of push-up pins used depending on the size of the chip component. The pickup device of Patent Document 1 has a square-shaped case in which multiple housing chambers are formed in a grid pattern. Push-up pins are arranged in each housing chamber. Multiple actuators are arranged below each push-up pin. Each actuator is controlled independently. By controlling each actuator, the push-up pin to be pushed up is selected.

[0006] Furthermore, a similar technology is disclosed in Patent Document 2. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2003-289084 [Patent Document 2] Japanese Patent Application Publication No. 09-097807 [Overview of the project] [Problems that the invention aims to solve]

[0008] In the pickup device described in Patent Document 1, an actuator was provided for each individual push-up pin. This resulted in a problem of structural complexity. Patent Document 2 also had a similar problem.

[0009] This invention has been made in view of the above-mentioned problems, and aims to provide a pickup device, etc., that has a simpler structure and allows for switching of the number of push-up pins. [Means for solving the problem]

[0010] To solve the above problems, the present invention provides a pickup device for picking up a chip component attached to a dicing tape from the dicing tape, comprising: a first push-up pin having a first tip for pressing the chip component through the lower surface of the dicing tape at one end on the dicing tape side; a second push-up pin having a second tip for pressing the chip component through the lower surface of the dicing tape at one end on the dicing tape side, provided parallel to a first direction which is the axial direction of the first push-up pin, and the height of the second tip being first length lower than the height of the first tip; a push-up plate that supports the first push-up pin and the second push-up pin so as to be movable in the first direction; a first biasing means for biasing the first push-up pin away from the push-up plate; and a push-up means for moving the push-up plate in the first direction so that the first tip presses the lower surface of the chip component through the lower surface of the dicing tape.

[0011] Furthermore, the present invention relates to a control method for a pickup device for picking up a chip component attached to a dicing tape from the dicing tape, wherein the pickup device comprises: a first push-up pin having a first tip for pressing the chip component through the lower surface of the dicing tape at one end on the dicing tape side; a second push-up pin having a second tip for pressing the chip component through the lower surface of the dicing tape at one end on the dicing tape side, provided parallel to a first direction which is the axial direction of the first push-up pin, and the height of the second tip being first length lower than the height of the first tip; a push-up plate that supports the first push-up pin and the second push-up pin so as to be movable in the first direction; and a first biasing means that biases the first push-up pin away from the push-up plate, wherein the push-up plate is moved in the first direction so that the first tip presses the center of the lower surface of the chip component through the lower surface of the dicing tape. [Effects of the Invention]

[0012] The advantage of the present invention is that it provides a pickup device with a simpler structure and the ability to switch the number of push-up pins. [Brief explanation of the drawing]

[0013] [Figure 1] This is a partial cross-sectional view showing a pickup device according to the first embodiment. [Figure 2] This is a schematic plan view showing the configuration of the push-up pin of the pickup device according to the first embodiment. [Figure 3] This is a partial cross-sectional view showing the first operating state of the pickup device according to the first embodiment. [Figure 4] This is a partial cross-sectional view showing a second operating state of the pickup device according to the first embodiment. [Figure 5] This is a partial cross-sectional view showing a modified example 1 of the pickup device according to the first embodiment. [Figure 6] This is a schematic plan view showing a modified example 1 of the pickup device according to the first embodiment. [Figure 7] This is a partial cross-sectional view showing a first state of operation of a modified example 1 of the pickup device according to the first embodiment. [Figure 8] This is a partial cross-sectional view showing a second state of operation of a modified example 1 of the pickup device according to the first embodiment. [Figure 9] This is a schematic plan view showing a modified example 2 of the pickup device according to the first embodiment. [Figure 10] This is a partial cross-sectional view showing a pickup device according to a second embodiment. [Figure 11] This is a schematic plan view showing the configuration of the push-up pin of the pickup device in the second embodiment. [Figure 12] This is a partial cross-sectional view showing the first state of operation of the pickup device according to the second embodiment. [Figure 13] This is a partial cross-sectional view showing a pickup device according to a second embodiment. [Modes for carrying out the invention]

[0014] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, although the embodiments described below have technically preferable limitations for implementing the present invention, they do not limit the scope of the invention below. The same reference numerals are given to similar components in each drawing, and the description may be omitted in some cases.

[0015] (First Embodiment) FIG. 1 is a partial cross-sectional view showing a pickup device according to the first embodiment. Further, FIG. 2 is a schematic plan view showing the configuration of pins according to the first embodiment. The pickup device 100 is a device for picking up chip components 300 attached on a dicing tape 200. The pickup device 100 includes a first push-up pin 10, a first biasing means 11, a second push-up pin 20, a second biasing means 21, a push-up plate 30, a push-up means 31, a guide 40, a collet 90, and a collet driving means 91.

[0016] The first push-up pin 10 has a first tip 10a at one end on the side of the dicing tape 200. The first tip 10a presses the chip component 300 through the lower surface of the dicing tape 200. Here, the direction of the axis of the first push-up pin 10 is defined as the first direction. Further, the first push-up pin 10 has a first flange portion 10b in the middle.

[0017] The second push-up pin 20 has a second tip 20a at one end on the side of the dicing tape 200. The second tip 20a presses the chip component 300 through the lower surface of the dicing tape 20). The axis of the second push-up pin 20 is parallel to the first direction. The height of the second tip 20a is lower than the height of the first tip 10a by a first length D1. Here, being lower means being farther from the dicing tape 200. Further, the second push-up pin 20 has a second flange portion 20b in the middle.

[0018] The push-up plate 30 supports the first push-up pin 10 and the second push-up pin 20 so as to be movable in the first direction.

[0019] The guide 40 supports the first tip 10a side of the first push-up pin 10 and the second tip 20a side of the second push-up pin 20 so that they can move in the first direction.

[0020] A first biasing means 11 is attached between the first flange portion 10b and the push-up plate 30. The first biasing means 11 biases the first push-up pin 10. As a result, the first push-up pin 10 is biased in a direction away from the push-up plate 30. In addition, a second biasing means 21 is attached between the second flange portion 20b and the push-up plate 30. The second biasing means 21 biases the second push-up pin 20. As a result, the second push-up pin 20 is biased in a direction away from the push-up plate 30.

[0021] The push-up mechanism 31 moves the push-up plate 30 toward the dicing tape 200 in the first direction such that the first tip 10a presses against the lower surface of the chip component 300 via the lower surface of the dicing tape 200. The push-up mechanism 31 corresponds to the actuator described in Patent Document 1.

[0022] The collet 90 is positioned opposite the upper surface of the chip component 300. The collet 90 then attracts the chip component 300.

[0023] The collet driving means 91 moves the collet 90 in a first direction. The collet driving means 91 is configured to adjust the force applied to the collet.

[0024] Next, the operation of the pickup device 100 will be described. Figure 3 is a schematic side view showing the first operating state of the pickup device of the first embodiment. Figure 3 shows the operation when the size of the chip component 300 is smaller than the distance between the first push-up pin 10 and the second push-up pin 20. The shape of the chip component 300 is, for example, rectangular. In this case, "small size" means that the length of the sides of the chip component 300 is smaller than the distance between the first push-up pin 10 and the second push-up pin 20.

[0025] When the size of the chip component 300 is smaller than the interval between the first lifting pin 10 and the second lifting pin 20, first, the first tip 10a is aligned with the center of the lower surface of the chip component. Next, by the lifting means 31, the lifting plate 30 is moved toward the dicing tape 200 side. By this movement, the first tip 10a of the first lifting pin 10 presses the lower surface of the chip component 300 through the dicing tape 200. At this time, if the force F by which the collet driving means 91 pushes the collet 90 downward is smaller than the biasing force of the first biasing means 11, the collet 90 and the chip component 300 rise, and peeling is promoted. Here, the spring constant of the first biasing means 11 is taken as k1. Also, the compression amount of the first biasing means 11 is taken as d1. Then, the force relationship is F < k·d1. The rise of the collet 90 is detected by a collet rise detection means (not shown). When the rise of the collet 90 is detected, the lifting (rise) of the lifting means 31 is stopped. In order to stop the rise of the lifting means 31, the second tip 20a of the second lifting pin 20 does not contact the dicing tape 200. And then, with the collet 90 sucking the chip component 300, the collet 90 is raised. By this operation, the chip component 300 is picked up.

[0026] Next, the operation of the pickup device 100 when the size of the chip component 300 is large will be described. FIG. 4 is a schematic side view showing a second operation state of the pickup device according to the first embodiment. FIG. 4 shows the operation when the size of the chip component 300 is larger than the interval between the first lifting pin 10 and the second lifting pin 20.

[0027] When the size of the chip component 300 is larger than the interval between the first push-up pin 10 and the second push-up pin 20, the first tip 10a and the second tip 20a are aligned within the lower surface of the chip component. Next, the push-up plate 30 is moved toward the dicing tape 200 by the push-up means 31. Then, the first tip 10a of the first push-up pin 10 and the second tip 20a of the second push-up pin 20 press the lower surface of the chip component 300 through the dicing tape 200. At this time, the first biasing means 11 and the second biasing means 21 contract. At this time, if the force F by which the collet presses the chip component 300 is smaller than the sum of the first biasing force of the first biasing means 11 and the biasing force of the second biasing means 21, the chip component 300 and the collet 90 rise. Here, the spring constant of the second biasing means 21 is set as k2, and the compression amount of the second biasing means 21 is set as d2. Then, the force relationship is F < k1·d1 + k2·d2. The rise of the collet 90 is detected by a collet rise detection means (not shown). When the rise of the collet 90 is detected, the push-up by the push-up means 31 is stopped. Then, with the collet 90 sucking the chip component 300, the collet 90 is raised. By this operation, the chip component 300 is picked up.

[0028] As described above, when the chip component 300 is small, only the first push-up pin 10 is used to push up the chip component 300. On the other hand, when the chip component 300 is large, the first push-up pin 10 and the second push-up pin 20 are used to push up the chip component 300. That is, according to the size of the chip component 300, the number of push-up pins is switched, and the push-up of the chip component 300 is executed. At this time, the actuator that drives the push-up pin is only the push-up means 31. For this reason, the pickup device 100 of the present embodiment can switch the number of push-up pins with a simpler configuration than in Patent Document 1.

[0029] (Modification 1) In the above example, the number of the second push-up pins 20 is one. However, the present invention is not limited to this example, and the number of the second push-up pins 20 may be plural.

[0030] Figure 5 is a partial cross-sectional view showing a modified example 1 of the pickup device according to the first embodiment. Figure 6 is a schematic plan view showing a modified example 1 of the pickup device according to the first embodiment. In this example, two second push-up pins 20 are provided in a straight line with respect to the first push-up pin 10. The first tip 10a of the first push-up pin 10 corresponds to the center of the lower surface of the chip component 300. The two second push-up pins 20 correspond to both ends of the lower surface of the chip component 300. In this example, the two second push-up pins 20 and the second biasing means 21 are the same.

[0031] In the pickup device 100, the number of push-up pins used for pushing up is switched according to the size of the chip component 300. As described above, when the second push-up pin 20 is arranged symmetrically with respect to the first push-up pin 10, the size of the chip component 300 is determined by the following criteria. First, with the projection direction as the first direction, the first push-up pin 10 and the second push-up pin 20 are projected onto the surface including the bottom surface of the chip component 300. This projection yields multiple points. Of these multiple points, a figure is assumed by connecting the outermost multiple points with straight or curved lines. The area enclosed by this figure becomes the criterion for determining the size of the chip component 300.

[0032] FIG. 7 is a partial cross-sectional view showing a first state of the operation of Modification 1 of the pickup device according to the first embodiment. Through the dicing tape 200, the first tip 10a of the first push-up pin 10 is pushing up the center of the lower surface of the chip component 300. Also, through the dicing tape 200, two second push-up pins 20 are pushing up both end portions of the lower surface of the chip component 300. At this time, if the force F by which the collet pushes the chip component 300 downward is smaller than the sum of the first biasing force of the first biasing means 11 and the biasing force of the second biasing means 21, the chip component 300 and the collet 90 rise. That is, the relationship of the forces is F < k1·d1 + 2(k2·d2). The rise of the collet 90 is detected by a collet rise detection means (not shown). When the rise of the collet is detected, the pushing-up by the pushing-up means 31 is stopped. Then, with the collet 90 sucking the chip component 300, the collet 90 is raised. By this operation, the chip component 300 is picked up.

[0033] FIG. 8 is a partial cross-sectional view showing a second state of the operation of Modification 1 of the pickup device according to the first embodiment. In this example, in the state of FIG. 7, the chip component 300 is not picked up. Then, the collet driving means 91 gradually weakens the force F for pushing the collet 90 downward. Then, the first tip 10a rises by the first biasing force of the first biasing means 11. Similarly, the second tip 20a rises by the second biasing force of the second biasing means 21. By this operation, the peeling of the chip component 300 from the dicing tape 200 progresses. Then, the collet driving means 91 raises the collet 90 to a predetermined height, and the chip component 300 is picked up. In the example of FIG. 8, the predetermined height is set as the top dead center of the first push-up pin 10.

[0034] (Modification 2) There may be three or more second push-up pins 20. Figure 9 is a schematic plan view showing a modified example 1 of the pickup device of the first embodiment. In modified example 2, the second push-up pins 20 are provided at the four corners of a rectangle centered on the first push-up pin 10. With this configuration, when the chip component 300 is rectangular, the four second push-up pins 20 can press the four corners of the lower surface of the chip component 300. Therefore, the stress applied to the chip component 300 during push-up is reduced. In this example, the four second push-up pins 20 and the second biasing means 21 are the same. In this configuration, the area surrounded by the four second push-up pins 20 becomes the criterion for determining the size of the chip component 300. That is, if the chip component 300 is included in this area, only the first push-up pin 10 performs the push-up. On the other hand, if at least a portion of the chip component 300 is not included in this area, the first push-up pin 10 and the four second push-up pins 20 will perform the push-up.

[0035] The pickup device 100 and other components of this embodiment have been described above.

[0036] The pickup device 100 and other components of this embodiment have been described above.

[0037] The pickup device 100 of this embodiment is a device for picking up chip components 300 that are attached to a dicing tape 200. The pickup device 100 is equipped with a first push-up pin 10, a second push-up pin 20, a push-up plate 30, and a push-up means 31. The first push-up pin 10 has a first tip 10a at one end on the dicing tape 200 side. The first tip 10a presses against the chip component 300 via the lower surface of the dicing tape 200. Here, the axial direction of the first push-up pin 10 is referred to as the first direction. The second push-up pin 20 has a second tip 20a at one end on the dicing tape side. The second tip 20a presses against the chip component 300 via the lower surface of the dicing tape 200. The axis of the second push-up pin 20 is parallel to the first direction. The height of the second tip 20a is lower than the height of the first tip 10a by a first length. The push-up plate 30 supports the first push-up pin 10 and the second push-up pin 20 so that they can move in a first direction. The first biasing means 11 biases the first push-up pin 10 away from the push-up plate 30. The push-up means 31 controls the movement of the push-up plate 30. As a result, the lower surface of the chip component 300 is pressed against the first tip 10a. The pressing is performed via the lower surface of the dicing tape 200. The direction is towards the dicing tape 200 in the first direction.

[0038] In the pickup device 100 described above, one push-up mechanism 31 is driven. The operation of the push-up mechanism 31 causes the first push-up pin 10 and the second push-up pin 20 to move in the first direction. When the chip component 300 is small in size, the chip component 300 is pushed up by the first push-up pin 10 alone. When the chip component 300 is large in size, the chip component 300 is pushed up by both the first push-up pin 10 and the second push-up pin 20. In other words, the pickup device 100 of this embodiment allows for switching the number of push-up pins with a simpler structure.

[0039] In another embodiment, the pickup device 100 has multiple second push-up pins 20 arranged around the first push-up pin 10. By providing multiple second push-up pins 20, it becomes possible to push up the chip component 300 with reduced stress.

[0040] In another embodiment, the pickup device 100 is provided with a plurality of second biasing means. The second biasing means bias the second push-up pin 20. The second push-up pin 20 is biased in a direction away from the push-up plate 30. The provision of the second biasing means 21 makes it easy to adjust the height at which the chip component 300 is pushed up.

[0041] In another embodiment, the pickup device 100 is provided with a collet 90 positioned opposite the upper surface of the chip component 300. The collet 90 attracts the chip component. A collet driving means 91 is also provided to move the collet 90 in at least a first direction. The collet 90 attracts the chip component 300, and the collet driving means 91 moves the collet 90 upward, thereby picking up the chip component 300.

[0042] In another embodiment, the collet driving means 91 of the pickup device 100 applies a force to the collet 90 in the direction of the first push-up pin 10. When the size of the chip component 300 is small, a force smaller than the first biasing force of the first biasing means 11 is applied. Here, "small size" means that the following conditions are met. First, the first push-up pin 10 is aligned with the center of the lower surface of the chip component 300. This is the case when the following area is included on the lower surface of the chip component 300. This area is obtained by projecting the following configuration onto the surface including the lower surface of the chip component 300. The configuration consists of the first push-up pin 10 and the second push-up pin 20. The direction of projection is the first direction. With this configuration, when the size of the chip component 300 is small, the first push-up pin 10 and the second push-up pin 20 are used for push-up.

[0043] In another embodiment, the collet driving means 91 of the pickup device 100 applies a force to the collet 90 in the direction of the first push-up pin 10. When the size of the chip component 300 is large, a force greater than the first biasing force of the first biasing means 11 is applied. Here, "large size" means that the following conditions are met. First, the first push-up pin 10 is aligned with the center of the lower surface of the chip component 300. In this case, the following area is not included in the lower surface of the chip component 300. This area is obtained by projecting the following configuration onto a surface including the lower surface of the chip component 300. The configuration consists of the first push-up pin 10 and the second push-up pin 20. The direction of projection is the first direction. With this configuration, when the size of the chip component 300 is large, the chip component 300 is pushed up by the first push-up pin 10 and the second push-up pin 20. That is, the chip component 300 is pushed up by increasing the number of push-up pins.

[0044] Furthermore, in the control method for the pickup device 100 of this embodiment, the pickup device 100 is controlled. The pickup device 100 is a device for picking up chip components 300 that are attached to a dicing tape 200. The pickup device 100 is equipped with a first push-up pin 10, a second push-up pin 20, a push-up plate 30, and a push-up means 31. The first push-up pin 10 has a first tip 10a at one end on the dicing tape 200 side. The first tip 10a presses against the chip component 300 via the lower surface of the dicing tape 200. Here, the axial direction of the first push-up pin 10 is referred to as the first direction. The second push-up pin 20 has a second tip 20a at one end on the dicing tape side. The second tip 20a presses against the chip component 300 via the lower surface of the dicing tape 200. The axis of the second push-up pin 20 is parallel to the first direction. The height of the second tip 20a is lower than the height of the first tip 10a by a first length. The push-up plate 30 supports the first push-up pin 10 and the second push-up pin 20 so that they can move in a first direction. The first push-up pin 10 is biased by the first biasing means 11. The biasing direction is away from the push-up plate 30. In the control method of the pickup device 100 of this embodiment, the push-up plate 30 is moved toward the dicing tape 200 in the first direction. This movement causes the lower surface of the chip component 300 to be pressed against the first tip 10a. The pressing is performed via the lower surface of the dicing tape 200.

[0045] (Second embodiment) Figure 10 is a partial cross-sectional view showing a pickup device of the second embodiment. Figure 11 is a schematic plan view showing the configuration of the push-up pins of the pickup device of the second embodiment. In addition to the configuration of the pickup device 100 of the first embodiment, the pickup device 101 of this embodiment is provided with a third push-up pin 50 on the outside of the second push-up pin 20. Here, "outside" means the side that is further away from the second push-up pin 20 when viewed from the first push-up pin 10. The height of the third tip 50a of the third push-up pin 50 is lower than the second tip 20a of the second push-up pin 20 by a second length D2. A third flange portion 50b is provided in the middle of the third push-up pin 50. A third biasing means 51 is attached between the push-up plate 30 and the third flange portion 50b. The third biasing means 51 biases the third push-up pin 50 in a direction away from the push-up plate 30.

[0046] Furthermore, as shown in Figure 11, four second push-up pins 20 are provided around the first push-up pin 10. In addition, four third push-up pins 50 are provided on the outside of the second push-up pins 20.

[0047] In the pickup device 101, the number of push-up pins used for pushing up is switched according to the size of the chip component 300. In the example in Figure 11, the second push-up pin 20 is positioned symmetrically with respect to the first push-up pin 10. Also, the third push-up pin 50 is positioned symmetrically with respect to the first push-up pin 10. The size of the chip component 300 is determined by the following criteria. First, the projection direction is taken as the first direction. The first push-up pin 10, the second push-up pin 20, and the third push-up pin 50 are projected onto a plane that includes the bottom surface of the chip component 300. Multiple points are obtained from this projection. Of these multiple points, the region enclosed by the projection points of the second push-up pin 20 becomes the first region. The region enclosed by the projection points of the third push-up pin 50 becomes the second region.

[0048] The number of push-up pins used for push-up is switched based on the size of the chip component 300 and these regions. For example, if the size of the bottom surface of the chip component 300 is smaller than the first region, only the first push-up pin 10 will perform the push-up. Also, if at least a portion of the bottom surface of the chip component 300 is not included in the first region, but the bottom surface of the chip component 300 is included in the second region, the first push-up pin 10 and the second push-up pin 20 will perform the push-up. And if at least a portion of the bottom surface of the chip component 300 is not included in the second region, the first push-up pin 10, the second push-up pin 20, and the third push-up pin 50 will perform the push-up.

[0049] Next, the operation of the pickup device 101 will be described. FIG. 12 is a partial cross-sectional view showing the first state of the operation of the pickup device according to the second embodiment. Through the dicing tape 200, the first tip 10a of the first push-up pin 10 is pushing up the center of the lower surface of the chip component 300. Also, through the dicing tape 200, the second push-up pin 20 is pushing up the middle part of the lower surface of the chip component 300. Further, through the dicing tape 200, the third push-up pin 50 is pushing up the end part of the lower surface of the chip component 300. At this time, if the force F by which the collet 90 pushes down the chip component 300 is smaller than the biasing force, the chip component 300 and the collet 90 will rise. The sum of the first biasing force, the second biasing force, and the third biasing force becomes the biasing force. Here, the first biasing force is the biasing force of the first biasing means 11. Also, the biasing force of the second biasing means 21 is the second biasing force. Also, the biasing force of the third biasing means 51 is the third biasing force. Here, the spring constant of the third biasing means 51 is set as k3. Also, the compression amount of the third biasing means 51 is set as d3. Also, in this example, as shown in FIG. 11, there is 1 first push-up pin 10, 4 second push-up pins 20, and 4 third push-up pins 50. Therefore, when the force relationship is F < k1·d1 + 4(k2·d2) + 4(k3·d3), the collet 90 will rise. Then, a predetermined amount of rise of the collet 90 is detected by collet rise detection means (not shown). And when the rise is detected, the pushing-up by the pushing-up means 31 is stopped. After that, with the collet 90 sucking the chip component 300, the collet 90 is raised. By this operation, the chip component 300 is picked up.

[0050] In the pickup device 101, a third push-up pin 50 is provided outside the second push-up pin 20. Therefore, it is easier to pick up larger chip components 300 than in the pickup device 100 of the first embodiment. In the above example, the configuration up to the provision of a third push-up pin 50 has been illustrated. However, the range in which push-up pins are provided can be extended further outwards, such as a fourth push-up pin, a fifth push-up pin, and so on. In this case, similar to the relationship between the second push-up pin 20 and the third push-up pin 50, the height of the tip of the fourth push-up pin is set lower by a predetermined length than the third tip 50a of the third push-up pin 50. Similarly, the height of the tip of the fifth push-up pin is set lower by a predetermined length than the tip of the fourth push-up pin. In this case, a fourth biasing means is attached to the fourth push-up pin. The fourth biasing means biases the fourth push-up pin in a direction away from the push-up plate 30.

[0051] The pickup device 101 and other components of the second embodiment have been described above.

[0052] The pickup device 101 of this embodiment is provided with a third push-up pin. The third push-up pin 50 is positioned further from the first push-up pin 10 than the second push-up pin 20. Here, "further" means farther in the direction perpendicular to the first direction. The third push-up pin 50 has a third tip 50a. The end of the third push-up pin 50 on the dicing tape side is the third tip 50a. The third tip 50a is provided to press the chip component 300 through the lower surface of the dicing tape 200. The axis of the third push-up pin 50 is parallel to the first direction. The height of the third tip 50a is lower than the height of the second tip 20a by a second length.

[0053] In the pickup device 101 described above, a single pushing mechanism 31 simultaneously transmits a driving force in the first direction to multiple pushing pins. Here, the first pushing pin 10, the second pushing pin 20, and the third pushing pin 50 are the multiple pushing pins described above. When the chip component 300 is smaller than the size corresponding to the second pushing pin 20, the first pushing pin 10 and the second pushing pin 20 push up the chip component 300. When the chip component 300 is larger, the first pushing pin 10, the second pushing pin 20, and the third pushing pin 50 push up the chip component 300. In other words, the pickup device 101 of this embodiment allows for switching the number of pushing pins with a simpler structure.

[0054] In another embodiment, a collet 90 is provided on the pickup device 101. The collet 90 faces the upper surface of the chip component 300. At this position, the collet 90 attracts the chip component. A collet driving means 91 is also provided to move the collet 90 in at least a first direction. The chip component 300 is picked up by attracting the chip component 300 with the collet 90 and moving the collet 90 upward with the collet driving means 91.

[0055] In another embodiment, the pickup device 101 applies a force to the collet driving means 91 in the direction of the first push-up pin 10. This force is less than the sum of the first and second biasing forces. The biasing force of the first biasing means 11 is the first biasing force. The biasing force of the second biasing means 21 is the second biasing force. This configuration occurs when the chip component 300 is larger than the size corresponding to the second push-up pin and smaller than the size corresponding to the third push-up pin. Here, "smaller size" means that the following conditions are met. First, the first push-up pin 10 is aligned to the center of the lower surface of the chip component 300. In this case, the following first region is included in the lower surface of the chip component 300, and the second region is not included in the lower surface of the chip component 300. The first region is obtained by projecting the following configuration onto a surface including the lower surface of the chip component 300. The configuration consists of a first push-up pin 10 and a second push-up pin 20. The second region is obtained by projecting the following configuration onto a surface including the bottom surface of the chip component 300. The configuration consists of a first push-up pin 10, a second push-up pin 20, and a third push-up pin 50. The direction of projection is the first direction.

[0056] In this configuration, the chip component 300 is pushed up by the first push-up pin 10 and the second push-up pin 20. Furthermore, if the chip component 300 is large, a force greater than the biasing force is applied to the collet 90. Here, a large size of the chip component 300 means that the second region mentioned above is included in the lower surface of the chip component 300. The biasing force is the sum of the first biasing force and the second biasing force. The biasing force of the first biasing means 11 is the first biasing force. The biasing force of the second biasing means 21 is the second biasing force. In this configuration, if the chip component 300 is large, the chip component 300 is pushed up by the first push-up pin 10, the second push-up pin 20, and the third push-up pin 50. That is, the chip component 300 is pushed up by increasing the number of push-up pins. In this case, only the push-up means 31 drives the above set of push-up pins. In other words, the number of push-up pins can be switched according to the size of the chip component 300, with a simpler configuration than the technology described in Patent Document 1.

[0057] (Third embodiment) Figure 13 is a partial cross-sectional view showing a pickup device 100 of a third embodiment. The pickup device 100 is a device for picking up chip components 300 that are attached to a dicing tape 200. The pickup device 100 is equipped with a first push-up pin 10, a second push-up pin 20, a push-up plate 30, and a push-up means 31. The pickup device 100 of the first embodiment and the pickup device 101 of the second embodiment are specific examples of the pickup device 100 of this embodiment.

[0058] The first push-up pin 10 has a first tip 10a at one end on the dicing tape 200 side. The first tip 10a presses against the chip component 300 via the lower surface of the dicing tape 200. Here, the axial direction of the first push-up pin 10 is referred to as the first direction.

[0059] The second push-up pin 20 has a second tip 20a at one end facing the dicing tape 200. The second tip 20a presses against the chip component 300 through the underside of the dicing tape 200. The axis of the second push-up pin 20 is parallel to the first direction. The height of the second tip 20a is first length lower than the height of the first tip 10a. Here, lower means farther from the dicing tape 200.

[0060] The push-up plate 30 supports the first push-up pin 10 and the second push-up pin 20 so that they can move in the first direction.

[0061] The first pushing pin 10 is biased by the first biasing means 11. The biasing direction is away from the pushing plate 30.

[0062] The pushing mechanism 31 moves the pushing plate 30 toward the dicing tape 200 in the first direction so that the first tip 10a presses against the lower surface of the chip component 300 via the lower surface of the dicing tape 200.

[0063] Next, the operation of the pickup device 100 will be explained.

[0064] If the size of the chip component 300 is smaller than the distance between the first push-up pin 10 and the second push-up pin 20, first, the first tip 10a is aligned to the center of the lower surface of the chip component. The above size refers to the length of the sides of the first push-up pin 10 and the second push-up pin 20 in the alignment direction. Next, the push-up mechanism 31 moves the first push-up pin 10 and the second push-up pin 20 toward the dicing tape 200. Then, the first tip 10a of the first push-up pin 10 presses against the lower surface of the chip component 300 via the dicing tape 200. This pressing causes the chip component 300 to peel away from the dicing tape 200.

[0065] If the size of the chip component 300 is greater than the distance between the first push-up pin 10 and the second push-up pin 20, the first tip 10a and the second tip 20a are aligned within the lower surface of the chip component. Next, the push-up means 31 moves the first push-up pin 10 and the second push-up pin 20 toward the dicing tape 200. Then, the first tip 10a of the first push-up pin 10 presses against the lower surface of the chip component 300 via the dicing tape 200. At this point, if the chip component 300 does not move in the pressing direction, the first biasing means 11 contracts. This causes the second tip 20a of the second push-up pin 20 to make contact. For example, this state is formed when the collet is pushing the chip component 300 from above downwards. In this case, the force with which the collet pushes the chip component 300 is greater than the first biasing force of the first biasing means 11. Then, the first tip 10a and the second tip 20a press against the underside of the chip component 300 via the dicing tape 200. This pressing causes the chip component 300 to peel off from the dicing tape 200.

[0066] As explained above, when the chip component 300 is small, the first push-up pin 10 alone pushes the chip component 300 upward from the dicing tape 200, causing the chip component 300 to be detached. When the chip component 300 is large, both the first push-up pin 10 and the second push-up pin 20 push the chip component 300 upward from the dicing tape 200, causing the chip component 300 to be detached. In the above operation, the push-up operation of the first push-up pin 10 and the second push-up pin 20 is performed by a single push-up means 31. In other words, the configuration is simpler than a device that pushes up the first push-up pin 10 and the second push-up pin 20 by separate actuators, as in Patent Document 1. Therefore, according to this embodiment, a pickup device is provided that has a simpler structure and allows switching of the number of push-up pins.

[0067] The pickup device 100 and other components of this embodiment have been described above.

[0068] The pickup device 100 of this embodiment is a device for picking up chip components 300 that are attached to a dicing tape 200. The pickup device 100 is equipped with a first push-up pin 10, a second push-up pin 20, a push-up plate 30, and a push-up means 31. The first push-up pin 10 has a first tip 10a at one end on the dicing tape 200 side. The first tip 10a presses against the chip component 300 via the lower surface of the dicing tape 200. Here, the axial direction of the first push-up pin 10 is referred to as the first direction. The second push-up pin 20 has a second tip 20a at one end on the dicing tape side. The second tip 20a presses against the chip component 300 via the lower surface of the dicing tape 200. The axis of the second push-up pin 20 is parallel to the first direction. The height of the second tip 20a is lower by a first length than the height of the first tip 10a. The push-up plate 30 supports the first push-up pin 10 and the second push-up pin 20 so that they can move in a first direction. The first biasing means 11 biases the first push-up pin 10. The biasing direction is away from the push-up plate 30. The push-up means 31 moves the push-up plate 30 toward the dicing tape 200 in the first direction so that the first tip 10a presses against the lower surface of the chip component 300 via the lower surface of the dicing tape 200.

[0069] In the pickup device 100 described above, a single pushing mechanism 31 moves multiple pushing pins in a first direction. The first pushing pin 10 and the second pushing pin 20 are the multiple pushing pins described above. When the size of the chip component 300 is small, the chip component 300 is pushed up by the first pushing pin 10 alone. When the size of the chip component 300 is large, the chip component 300 is pushed up by both the first pushing pin 10 and the second pushing pin 20. In other words, the pickup device 100 of this embodiment allows for switching the number of pushing pins with a simpler structure.

[0070] Furthermore, in the control method for the pickup device 100 of this embodiment, the pickup device 100 is controlled. The pickup device 100 is a device for picking up chip components 300 that are attached to a dicing tape 200. The pickup device 100 is equipped with a first push-up pin 10, a second push-up pin 20, a push-up plate 30, and a push-up means 31. The first push-up pin 10 has a first tip 10a at one end on the dicing tape 200 side. The first tip 10a presses against the chip component 300 via the lower surface of the dicing tape 200. Here, the axial direction of the first push-up pin 10 is referred to as the first direction. The second push-up pin 20 has a second tip 20a at one end on the dicing tape side. The second tip 20a presses against the chip component 300 via the lower surface of the dicing tape 200. The axis of the second push-up pin 20 is parallel to the first direction. The height of the second tip 20a is lower than the height of the first tip 10a by a first length. The push-up plate 30 supports the first push-up pin 10 and the second push-up pin 20 so that they can move in a first direction. The first biasing means 11 biases the first push-up pin 10. The biasing direction is the direction away from the push-up plate 30. The control method of the pickup device 100 in this embodiment moves the push-up plate 30 toward the dicing tape 200 in the first direction so that the first tip 10a presses against the lower surface of the chip component 300 via the lower surface of the dicing tape 200.

[0071] The present invention also includes programs that cause a computer to execute the processing of the first to third embodiments described above, and recording media storing said programs. Examples of recording media include magnetic disks, magnetic tapes, optical disks, magneto-optical disks, semiconductor memory, and the like.

[0072] The present invention has been described above using the embodiments described above as exemplary examples. However, the present invention is not limited to the above embodiments. That is, the present invention can be applied in various forms that can be understood by those skilled in the art within the scope of the present invention.

[0073] Some or all of the above embodiments may also be described as follows, but are not limited to the following:

[0074] (Note 1) A pickup device for picking up chip components attached to a dicing tape from the dicing tape, A first push-up pin is provided at one end of the dicing tape side, with a first tip for pressing the chip component through the lower surface of the dicing tape, A second tip for pressing the chip component through the lower surface of the dicing tape is provided at one end of the dicing tape, and is provided parallel to the first direction which is the axial direction of the first push-up pin, and the height of the second tip is lower than the height of the first tip by a first length, A push-up plate that supports the first push-up pin and the second push-up pin so as to be movable in the first direction, A first biasing means that biases the first push-up pin in a direction away from the push-up plate, A push-up means for moving the push-up plate in the first direction such that the first tip presses against the lower surface of the chip component via the lower surface of the dicing tape, A pickup device characterized by having the following features.

[0075] (Note 2) Multiple second push-up pins are provided around the first push-up pin. The pickup device described in Appendix 1, characterized by the features described herein.

[0076] (Note 3) A second biasing means for biasing the second push-up pin in a direction away from the push-up plate, A pickup device according to Appendix 1 or 2, characterized by having the following features.

[0077] (Note 4) A collet is provided at a position opposite to the upper surface of the chip component and is used to attract the chip component, A collet driving means for moving the collet in at least the first direction, A pickup device according to any one of the appendices 1 to 3, characterized by having the following features.

[0078] (Note 5) When the first push-up pin is aligned with the center of the lower surface of the chip component, if the region obtained by projecting the first push-up pin and the second push-up pin in the first direction onto a surface including the lower surface of the chip component is included on the lower surface of the chip component, The collet driving means The collet is subjected to a force smaller than the first biasing force of the first biasing means in the direction of the first push-up pin. The pickup device described in Appendix 4, characterized by the features described herein.

[0079] (Note 6) When the first push-up pin is aligned with the center of the lower surface of the chip component, if a portion of the area obtained by projecting the first push-up pin and the second push-up pin in the first direction onto a surface including the lower surface of the chip component is not included on the lower surface of the chip component, The collet driving means Apply a force greater than the first biasing force to the collet in the direction of the first push-up pin. The pickup device according to Appendix 4 or 5, characterized by the features described herein.

[0080] (Note 7) A third push-up pin is provided in a direction perpendicular to the first direction and at a position further from the first push-up pin than the second push-up pin. The aforementioned third push-up pin is A third tip for pressing the chip component through the lower surface of the dicing tape is provided at one end of the dicing tape, The axis of the third push-up pin is parallel to the first direction, The third tip is lower than the height of the second tip by a second length. The pickup device described in Appendix 3, characterized by the features described herein.

[0081] (Note 8) A collet is provided at a position opposite to the upper surface of the chip component and is used to attract the chip component, A collet driving means for moving the collet in at least the first direction, The pickup device according to Appendix 7, characterized by having the following features.

[0082] (Note 9) When the first push-up pin is aligned to the center of the lower surface of the chip component, if the region obtained by projecting the first push-up pin and the second push-up pin in the first direction onto a surface including the lower surface of the chip component is included in the lower surface of the chip component, and the region obtained by projecting the first push-up pin, the second push-up pin and the third push-up pin in the first direction onto a surface including the lower surface of the chip component is not included in the lower surface of the chip component, The collet driving means The collet is subjected to a force in the direction of the first push-up pin that is less than the sum of the first biasing force of the first biasing means and the second biasing force of the second biasing means. The pickup device described in Appendix 8, characterized by the features described herein.

[0083] (Note 10) When the first push-up pin is aligned with the center of the lower surface of the chip component, if the region obtained by projecting the first push-up pin, the second push-up pin, and the third push-up pin in the first direction onto a surface including the lower surface of the chip component is included on the lower surface of the chip component, The collet driving means is Apply a force to the collet that is greater than the sum of the first biasing force and the second biasing force, in the direction of the first push-up pin. The pickup device according to Appendix 9, characterized in that it is a pickup device.

[0084] (Note 11) A control method for a pickup device for picking up chip components attached to a dicing tape from the dicing tape, The pickup device is A first push-up pin is provided at one end of the dicing tape side, with a first tip for pressing the chip component through the lower surface of the dicing tape, A second tip for pressing the chip component through the lower surface of the dicing tape is provided at one end of the dicing tape, and is provided parallel to the first direction which is the axial direction of the first push-up pin, and the height of the second tip is lower than the height of the first tip by a first length, A push-up plate that supports the first push-up pin and the second push-up pin so as to be movable in the first direction, A first biasing means that biases the first push-up pin in a direction away from the push-up plate, It has, The push-up plate is moved in the first direction such that the first tip presses against the lower surface of the chip component via the lower surface of the dicing tape. A control method for a pickup device, characterized by the following features. [Explanation of symbols]

[0085] 10. First thrust pin 10a First tip 11 First biasing means 20. Second upward-pushing pin 20a Second tip 21 Second biasing means 30 Push-up plate 31. Thrusting mechanism 40 Guide 50 Third thrust pin 50a Third tip 51 Third biasing means 90 Colette 91 Collet driving means 100, 101 Pickup device 200 dicing tapes 300 chip components

Claims

1. A pickup device for picking up chip components attached to a dicing tape from the dicing tape, A first push-up pin is provided at one end of the dicing tape side, with a first tip for pressing the chip component through the lower surface of the dicing tape, A second tip for pressing the chip component through the lower surface of the dicing tape is provided at one end of the dicing tape, and is provided parallel to the first direction which is the axial direction of the first push-up pin, and the height of the second tip is lower than the height of the first tip by a first length, A push-up plate that supports the first push-up pin and the second push-up pin so as to be movable in the first direction, A first biasing means that biases the first push-up pin in a direction away from the push-up plate, A pushing means for moving the pushing plate in the first direction such that the first tip presses against the lower surface of the chip component via the lower surface of the dicing tape, A collet is provided at a position opposite to the upper surface of the chip component and is used to attract the chip component, A collet driving means for moving the collet in at least the first direction, It has, When the first push-up pin is aligned with the center of the lower surface of the chip component, if the region obtained by projecting the first push-up pin and the second push-up pin in the first direction onto a surface including the lower surface of the chip component is included on the lower surface of the chip component, The collet driving means The collet is subjected to a force smaller than the first biasing force of the first biasing means in the direction of the first push-up pin. A pickup device characterized by the following features.

2. Multiple second push-up pins are provided around the first push-up pin. The pickup device according to feature 1.

3. A plurality of second biasing means for biasing each of the plurality of the second push-up pins in a direction away from the push-up plate, The pickup device according to claim 2, characterized by having the following features.

4. When the first push-up pin is aligned with the center of the lower surface of the chip component, if the region obtained by projecting the first push-up pin and the second push-up pin in the first direction onto a surface including the lower surface of the chip component is not included on the lower surface of the chip component, The collet driving means Apply a force to the collet greater than the first biasing force of the first biasing means in the direction of the first push-up pin. The pickup device according to feature 1.

5. A pickup device for picking up chip components attached to a dicing tape from the dicing tape, A first push-up pin is provided at one end of the dicing tape side, with a first tip for pressing the chip component through the lower surface of the dicing tape, Multiple push-up pins are provided around the first push-up pin, each having a second tip at one end on the dicing tape side for pressing the chip component through the lower surface of the dicing tape, positioned parallel to the first direction which is the axial direction of the first push-up pin, and the height of the second tip being lower than the height of the first tip by a first length, A push-up plate that supports the first push-up pin and the second push-up pin so as to be movable in the first direction, A first biasing means that biases the first push-up pin in a direction away from the push-up plate, A pushing means for moving the pushing plate in the first direction such that the first tip presses against the lower surface of the chip component via the lower surface of the dicing tape, A plurality of second biasing means for biasing each of the plurality of the second push-up pins in a direction away from the push-up plate, It has, A third push-up pin is provided in a direction perpendicular to the first direction and at a position further from the first push-up pin than the second push-up pin. The third push-up pin is, A third tip for pressing the chip component through the lower surface of the dicing tape is provided at one end of the dicing tape, The axis of the third push-up pin is parallel to the first direction, The third tip is lower than the height of the second tip by a second length. A pickup device characterized by the following features.

6. A collet is provided at a position opposite to the upper surface of the chip component and is used to attract the chip component, A collet driving means for moving the collet in at least the first direction, The pickup device according to claim 5, characterized by having the following features.

7. When the first push-up pin is aligned to the center of the lower surface of the chip component, if the region obtained by projecting the first push-up pin and the second push-up pin in the first direction onto a surface including the lower surface of the chip component is included in the lower surface of the chip component, and the region obtained by projecting the first push-up pin, the second push-up pin and the third push-up pin in the first direction onto a surface including the lower surface of the chip component is not included in the lower surface of the chip component, The collet driving means The collet is subjected to a force in the direction of the first push-up pin that is less than the sum of the first biasing force of the first biasing means and the second biasing force of the second biasing means. The pickup device according to feature 6.

8. A control method for a pickup device for picking up chip components attached to a dicing tape from the dicing tape, The pickup device is A first push-up pin is provided at one end of the dicing tape side, with a first tip for pressing the chip component through the lower surface of the dicing tape, A second tip for pressing the chip component through the lower surface of the dicing tape is provided at one end of the dicing tape, and is provided parallel to the first direction which is the axial direction of the first push-up pin, and the height of the second tip is lower than the height of the first tip by a first length, A push-up plate that supports the first push-up pin and the second push-up pin so as to be movable in the first direction, A first biasing means that biases the first push-up pin in a direction away from the push-up plate, A collet is provided at a position opposite to the upper surface of the chip component and is used to attract the chip component, A collet driving means for moving the collet in at least the first direction, It has, The push-up plate is moved in the first direction such that the first tip presses against the lower surface of the chip component via the lower surface of the dicing tape. When the first push-up pin is aligned with the center of the lower surface of the chip component, if the region obtained by projecting the first push-up pin and the second push-up pin in the first direction onto a surface including the lower surface of the chip component is included on the lower surface of the chip component, The collet driving means, The collet is subjected to a force smaller than the first biasing force of the first biasing means in the direction of the first push-up pin. A control method for a pickup device, characterized by the following features.

9. A control method for a pickup device for picking up chip components attached to a dicing tape from the dicing tape, The pickup device is A first push-up pin is provided at one end of the dicing tape side, with a first tip for pressing the chip component through the lower surface of the dicing tape, Multiple push-up pins are provided around the first push-up pin, each having a second tip at one end on the dicing tape side for pressing the chip component through the lower surface of the dicing tape, positioned parallel to the first direction which is the axial direction of the first push-up pin, and the height of the second tip being lower than the height of the first tip by a first length, A push-up plate that supports the first push-up pin and the second push-up pin so as to be movable in the first direction, A first biasing means that biases the first push-up pin in a direction away from the push-up plate, A plurality of second biasing means for biasing each of the plurality of the second push-up pins in a direction away from the push-up plate, It has, A third push-up pin is provided in a direction perpendicular to the first direction and at a position further from the first push-up pin than the second push-up pin. The third push-up pin is, A third tip for pressing the chip component through the lower surface of the dicing tape is provided at one end of the dicing tape, The axis of the third push-up pin is parallel to the first direction, The third tip is lower than the height of the second tip by a second length. The control method described above is The push-up plate is moved in the first direction such that the first tip presses against the lower surface of the chip component via the lower surface of the dicing tape. A control method for a pickup device, characterized by the following features.

Images