MEMS device and method for manufacturing the same
The MEMS device addresses the issue of isolation joint damage by ensuring the movable part contacts the cavity bottom before the joint, using a two-step etching process to create a recess with a tapered structure, maintaining insulation and preventing joint damage.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- ROHM CO LTD
- Filing Date
- 2022-09-20
- Publication Date
- 2026-07-22
AI Technical Summary
Conventional MEMS devices face issues where the trench isolation joint protrudes below the beam structure and contacts the silicon substrate when the beam deforms, leading to damage and reduced insulation performance.
The MEMS device design ensures that the shortest distance between the movable part and the recess bottom is less than the distance between the movable part and the isolation joint, with a tapered structure preventing contact between the isolation joint and the cavity bottom, and includes a manufacturing process involving two etching steps to form a recess with a smaller depth for the side wall of the second trench.
This design prevents damage to the isolation joint and maintains insulation performance by ensuring the isolation joint does not contact the cavity bottom, resulting in a highly reliable MEMS device.
Smart Images

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