Liquid dispensing head, liquid dispensing unit, and device for dispensing liquid

Abstract

To suppress damage to a damper of a liquid discharge head.SOLUTION: A liquid discharge head drives an electromechanical transducer held by an actuator substrate 70 to discharge liquid in a pressure chamber from a nozzle. The liquid discharge head includes: an actuator substrate; and a damper 66 disposed between the actuator substrate and a damper holding substrate 65. The damper is joined, with an adhesive 90, to one of the actuator substrate and the damper holding substrate. When a substrate that is joined with the damper is defined as a joint objective substrate, the damper is formed with recesses or through holes 66a in a facing region facing a bonding surface of the joint objective substrate 70.SELECTED DRAWING: Figure 11

Description

Technical Field

[0001] The present invention relates to a liquid ejection head, a liquid ejection unit, and an apparatus for ejecting a liquid.

Background Art

[0002] Conventionally, there has been known a liquid ejection head that drives an electromechanical conversion element held on an actuator substrate to eject a liquid in a pressure chamber from a nozzle.

[0003] For example, Patent Document 1 discloses a liquid ejection head in which a damper is disposed between a common liquid chamber member constituting an actuator substrate and a damper plate (damper holding substrate). The damper constitutes a damper member together with the damper plate and is joined to the common liquid chamber member.

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a conventional liquid ejection head, when a damper is adhered to an actuator substrate or a damper holding substrate with an adhesive, the damper may be damaged by fillers or foreign substances contained in the adhesive.

Means for Solving the Problems

[0005] In order to solve the above-described problems, the present invention is a liquid ejection head that drives an electromechanical conversion element held on an actuator substrate to eject a liquid in a pressure chamber from a nozzle, having a damper disposed between the actuator substrate and a damper holding substrate, the damper being joined to one of the actuator substrate and the damper holding substrate with an adhesive, and when the substrate to which the damper is joined is defined as a joining target substrate, the damper has a recess or a through hole formed in a facing region facing the adhesive surface of the joining target substrate. Furthermore, the substrate to be bonded has a recess formed in a region facing the bonding surface portion of the damper where the recess or through hole is not formed, and the recess extends to the region facing the recess or through hole of the damper. It is characterized by the above.

Effects of the Invention

[0006] According to the present invention, damage to the damper can be suppressed. [Brief explanation of the drawing]

[0007] [Figure 1] An external perspective view illustrating the liquid dispensing head in the embodiment. [Figure 2] Disassembled perspective view of the liquid dispensing head. [Figure 3] A cross-sectional perspective view of the liquid dispensing head. [Figure 4] An exploded perspective view of the liquid dispensing head, excluding the frame components. [Figure 5] A cross-sectional perspective view illustrating the flow path portion of the liquid discharge head. [Figure 6] An enlarged cross-sectional perspective view illustrating the flow path portion of the liquid discharge head. [Figure 7] A plan view illustrating the flow path portion of the liquid discharge head. [Figure 8] A perspective view showing a damper member in an embodiment. [Figure 9] This diagram illustrates the stacking configuration of the nozzle plate, flow path plate, vibrating plate member, common flow path member, damper member, and frame member in a typical conventional liquid discharge head. [Figure 10] A schematic, enlarged view of the cross-sectional structure of the part indicated by the symbol A in Figure 9. [Figure 11] (a) is a schematic diagram illustrating the cross-sectional structure of the joint between the partition wall of the common flow path member, the damper plate, and the partition wall of the damper frame substrate in the liquid discharge head of the embodiment. (b) is a schematic diagram of the damper member consisting of the damper plate and the damper frame substrate in Figure (a) as seen from the damper plate side. [Figure 12] (a) is a schematic diagram illustrating the cross-sectional structure of the joint between the partition wall of the common flow path member, the partition wall of the damper plate, and the partition wall of the damper frame substrate in a liquid discharge head in an example in which a linear through-hole is formed in the damper plate. (b) is a schematic diagram of the damper member consisting of the damper plate and the damper frame substrate in Figure (a), as seen from the damper plate side. [Figure 13]In a liquid ejection head in an example where a through-hole of a damper plate is formed so as to surround an island portion, a schematic view when a damper member including the damper plate and a damper frame substrate is viewed from the damper plate side. [Figure 14] In a liquid ejection head in an example where a through-hole of a damper plate has a tapered shape that tapers toward the depth direction, an explanatory view schematically showing a cross-sectional structure of a joint portion between a partition wall of a common flow path member, the damper plate, and a partition wall of a damper frame substrate. [Figure 15] In a liquid ejection head in an example where a recess of a damper frame substrate has a tapered shape that tapers toward the depth direction, an explanatory view schematically showing a cross-sectional structure of a joint portion between a partition wall of a common flow path member, the damper plate, and a partition wall of a damper frame substrate. [Figure 16] In a modified example, an explanatory view schematically showing a cross-sectional structure of a joint portion between a partition wall of a common flow path member, the damper plate, and a partition wall of a damper frame substrate. [Figure 17] An explanatory view schematically showing a cross-sectional structure of a joint portion in an example where no through-hole is formed in a damper plate in a modified example. [Figure 18] An exploded perspective explanatory view of a head module of an embodiment. [Figure 19] An exploded perspective explanatory view of a head module of an embodiment as viewed from the nozzle surface side. [Figure 20] A schematic explanatory view of a printing apparatus in an embodiment. [Figure 21] A plan explanatory view of an example of a head unit of a printing apparatus. [Figure 22] A plan explanatory view of a main part of an example of a printing apparatus.} [Figure 23] A side explanatory view of a main part of an example of a printing apparatus. ] [Figure 24] A plan explanatory view of a main part of an example of a liquid ejection unit. [Figure 25] A front explanatory view of an example of a liquid ejection unit.

Embodiments for Carrying Out the Invention

[0008] Hereinafter, an embodiment in which the present invention is applied to a liquid ejection head provided in a liquid ejection device will be described. FIG. 1 is an external perspective explanatory view of the liquid ejection head in the present embodiment. FIG. 2 is an exploded perspective explanatory view of the liquid ejection head. FIG. 3 is a cross-sectional perspective explanatory view of the liquid ejection head. FIG. 4 is an exploded perspective explanatory view of the liquid ejection head excluding the frame member. FIG. 5 is a cross-sectional perspective explanatory view of the flow path portion of the liquid ejection head. FIG. 6 is an enlarged cross-sectional perspective explanatory view of the flow path portion of the liquid ejection head. FIG. 7 is a plan explanatory view of the flow path portion of the liquid ejection head.

[0009] The liquid ejection head 1 of the present embodiment includes a nozzle plate 10, a flow path plate 20 which is an individual flow path member, a diaphragm member 30, a common flow path member 50, a damper member 60, a frame member 80, and a flexible wiring board 101 on which a drive circuit 102 is mounted.

[0010] The nozzle substrate constituting the nozzle plate 10, the substrate constituting the flow path plate 20 and the diaphragm member 30, the sub-frame substrate constituting the common flow path member 50, and the damper substrate constituting the damper member 60 all use a single crystal Si wafer as the substrate material. These substrates are manufactured by微细加工技术 of MEMS and semiconductor devices to simultaneously produce a plurality of chips (liquid ejection heads) on the Si wafer, and each substrate after chip formation is joined to form the liquid ejection head 1.

[0011] As shown in FIGS. 4 and 5, the nozzle plate 10 is provided with a plurality of nozzles 11 for ejecting a liquid (liquid droplets). The plurality of nozzles 11 are arranged in a two-dimensional matrix, and as shown in FIG. 7, they are arranged side by side in three directions of the first direction F, the second direction S, and the third direction T.

[0012] As shown in Figures 5 and 6, the flow path plate 20 has pressure chambers 21, which are individual liquid chambers that communicate with each of the nozzles 11, individual supply flow paths 22 that lead to each of the pressure chambers 21, and individual recovery flow paths 23 that lead to each of the pressure chambers 21. As shown in Figure 7, one pressure chamber 21 and the individual supply flow paths 22 and individual recovery flow paths 23 that lead to it are collectively called an individual flow path 25.

[0013] The diaphragm member 30 forms a diaphragm 31, which is a deformable wall surface of the pressure chamber 21, and a piezoelectric element 40 is integrally provided on the diaphragm 31. The diaphragm member 30 also has a supply-side opening 32 that leads to an individual supply channel 22 and a recovery-side opening 33 that leads to an individual recovery channel 23. The piezoelectric element 40 is an electromechanical conversion element and is a pressure generating means that deforms the diaphragm 31 to pressurize the liquid in the pressure chamber 21.

[0014] It should be noted that the channel plate 20 and the diaphragm member 30 are not limited to being separate components. For example, the channel plate 20 and the diaphragm member 30 can be integrally formed from the same component using an SOI (Silicon On Insulator) substrate. That is, an SOI substrate in which a silicon oxide film, a silicon layer, and another silicon oxide film are deposited in that order can be used, with the silicon substrate as the channel plate 20 and the silicon oxide film, silicon layer, and silicon oxide film forming the diaphragm 31. In this configuration, the layer configuration of silicon oxide film, silicon layer, and silicon oxide film on the SOI substrate constitutes the diaphragm member 30. Thus, the diaphragm member 30 includes those composed of materials deposited on the surface of the channel plate 20.

[0015] The common flow channel member 50 has multiple common supply channel branches 52 leading to two or more individual supply channels 22 and multiple common recovery channel branches 53 leading to two or more individual recovery channels 23, which are formed alternately adjacent to each other in the second direction S of the nozzle 11. The common flow channel member 50 has through holes that serve as supply ports 54 through which the supply-side openings 32 of the individual supply channels 22 and the common supply channel branches 52 pass, and through holes that serve as recovery ports 55 through which the recovery-side openings 33 of the individual recovery channels 23 and the common recovery channel branches 53 pass.

[0016] Furthermore, the common flow channel member 50 forms one or more common supply channel main channels 56 that lead to a plurality of common supply channel branches 52, and one or more common recovery channel main channels 57 that lead to a plurality of common recovery channel branches 53.

[0017] The damper member 60 has a supply-side damper 62 that faces (opposes) the supply port 54 of the common supply channel branch 52, and a recovery-side damper 63 that faces (opposes) the recovery port 55 of the common recovery channel branch 53.

[0018] The common supply channel tributary 52 and the common recovery channel tributary 53 are constructed by sealing grooves arranged alternately on the common channel member 50, which is the same component, with damper plates 66 made of thin plates. The supply-side damper 62 is constructed by the damper plate 66 corresponding to the common supply channel tributary 52, and the recovery-side damper 63 is constructed by the damper plate 66 corresponding to the common recovery channel tributary 53.

[0019] Furthermore, it is preferable to use a thin metal film or an inorganic film that is resistant to organic solvents as the damper plate 66, and its thickness is preferably 10 [μm] or less. It is also preferable that the damper plate 66 has a laminated structure consisting of multiple layers. In addition, the damper plate 66 should have a compliance of 7 × 10 in order to satisfy the necessary functions as a damper. -17 Preferably, the material has a density of [m / N] or greater, a Young's modulus of 3 [GPa] or more and 200 [GPa] or less, and a thickness of 2 [μm] or more and 10 [μm] or less.

[0020] In this embodiment, the liquid discharge head 1 is provided with a damper member 60 to suppress the influence (e.g., crosstalk) that pressure fluctuations in the liquid flow path (e.g., individual supply flow path 22) that occur when liquid is discharged from the nozzle 11 have on the liquid discharge from other nozzles 11. By properly performing its damping function, the damper member 60 can suppress the occurrence of crosstalk, in which vibrations (pressure fluctuations) during liquid discharge propagate through the liquid and affect the liquid discharge of adjacent nozzles, thereby stabilizing the liquid discharge accuracy from each nozzle 11.

[0021] Figure 8 is a perspective view showing the damper member 60 in this embodiment. As shown in Figure 8, the damper member 60 is mainly composed of a damper frame substrate 65, which is a damper holding substrate made of a rectangular plate-shaped member. Through holes 61A and 61B are formed in the damper frame substrate 65 along its long side, communicating with the common supply channel main flow 56 and the common recovery channel main flow 57 of the common flow channel member 50. A supply-side damper 62 and a recovery-side damper 63 are formed in the region between the through holes 61A and 61B of the damper frame substrate 65, thereby constituting the damper member 60.

[0022] Here, we will explain the problems with conventional liquid dispensing heads. Figure 9 is an explanatory diagram showing the stacking configuration of the nozzle plate 10, flow path plate 20, vibrating plate member 30, common flow path member 50, damper member 60, and frame member 80 in a typical conventional liquid discharge head 1'. In Figure 9, the piezoelectric element holding substrate 70, which serves as the actuator substrate, is composed of the flow channel plate 20, the diaphragm member 30, and the common flow channel member 50. A typical damper member 60, as shown in Figure 9, is constructed by overlapping a damper plate 66 onto a damper frame substrate 65, which has a displacement space (gap) 64 formed therein to allow the displacement of the damper plate 66, and joining the two together with an adhesive. This gap 64 is formed by partitions 69 formed on the damper frame substrate 65.

[0023] In Figure 9, the common flow channel member 50 also has multiple voids 58 to allow displacement (vibration) of the damper plate 66. These voids 58 are separated and formed by multiple partition walls 59 formed in the common flow channel member 50. The voids 64 in the damper frame substrate 65 and the voids 58 in the common flow channel member 50 are arranged to face each other via the damper plate 66.

[0024] Figure 10 is a schematic enlarged view showing the cross-sectional structure of the joint between the partition wall 59 of the common flow channel member 50 constituting the piezoelectric element holding substrate 70, the damper plate 66, and the partition wall 69 of the damper frame substrate 65, which is indicated by the symbol A in Figure 9. As shown in Figure 10, the portion of the partition wall 59 (adhesion surface) of the common flow channel member 50 (piezoelectric element holding substrate 70), which is the substrate to be joined, and the opposing region of the damper plate 66 facing that portion are bonded together by an adhesive 90. The adhesive 90 used here preferably contains a filler 91, which is a filler, for purposes such as improving adhesion or bonding strength. The adhesive 90 used in this embodiment contains a plurality of spherical fillers 91, each with a maximum particle size of 10 [μm].

[0025] As shown in Figure 10, if the diameter of the filler 91 is large and the filler 91 is sandwiched between the bulkhead 59 and the damper plate 66, a localized stress will act on the damper plate 66 due to the filler 91, causing a crack as indicated by the symbol B in Figure 10, which can lead to damage to the damper plate 66. This problem is not limited to the filler 91; if any foreign matter is mixed in and that foreign matter is sandwiched between the bulkhead 59 and the damper plate 66 in the same way as the filler 91, it can occur in a similar manner.

[0026] Figure 11(a) is a schematic explanatory diagram showing the cross-sectional structure of the joint between the partition wall 59 of the common flow path member 50, the damper plate 66, and the partition wall 69 of the damper frame substrate 65 in the liquid discharge head 1 of this embodiment. Figure 11(b) is a schematic diagram of the damper member 60, which consists of a damper plate 66 and a damper frame substrate 65, as seen from the damper plate 66 side in Figure 11(a).

[0027] As shown in Figure 11(a), the liquid discharge head 1 of this embodiment has a through hole 66a formed in the damper plate 66 at the joint between the damper plate 66 and the common flow channel member 50 (piezoelectric element holding substrate 70). As a result, even if filler 91 or foreign matter is interposed between the damper plate 66 and the common flow channel member 50, which would get stuck in the conventional liquid discharge head 1', with the liquid discharge head 1 of this embodiment, at least a portion of the filler 91 or foreign matter can enter the through hole 66a and not get stuck between them. Therefore, according to this embodiment, the probability of filler 91 or foreign matter getting stuck between the damper plate 66 and the common flow channel member 50 can be reduced, and damage to the damper plate 66 can be suppressed.

[0028] Furthermore, by providing such through holes 66a in the damper plate 66, the bonding area between the damper plate 66 and the adhesive 90 can be increased. As a result, the bonding strength between the damper member 60, including the damper plate 66, and the common flow channel member 50 (piezoelectric element holding substrate 70), which is the substrate to be bonded to it by the adhesive 90, can be increased.

[0029] In this embodiment, the example is described in which a through hole 66a is provided in the damper plate 66. However, instead of a through hole 66a, a recess may be formed in the area of ​​the damper plate 66 facing the common flow channel member 50 at the joint. Even with this configuration, at least a portion of the filler 91 and foreign matter can enter the recess, reducing the probability of the filler 91 and foreign matter getting trapped between the damper plate 66 and the common flow channel member 50, thereby suppressing damage to the damper plate 66. Furthermore, when a recess is provided, similar to when a through hole 66a is provided, the bonding area between the damper plate 66 and the adhesive 90 can be increased, thereby increasing the bonding strength between the damper member 60 including the damper plate 66 and the common flow channel member 50 (piezoelectric element holding substrate 70) which is bonded to it by the adhesive 90.

[0030] Furthermore, in this embodiment, as shown in Figure 11(a), a recess 69a is formed in the partition wall 69 of the damper frame substrate 65, which is the other substrate, so as to be opposite to the through hole 66a formed in the damper plate 66. In other words, in this embodiment, the damper frame substrate 65, which is the other substrate located on the opposite side of the common flow channel member 50 (piezoelectric element holding substrate 70), which is the substrate to be bonded to the damper plate 66 by the adhesive 90, has a recess 69a formed in the opposing region opposite to the through hole 66a of the damper plate 66. As a result, the adhesive 90 can enter the recess 69a of the damper frame substrate 65 through the through hole 66a of the damper plate 66. Therefore, the bonding area between the damper member 60 including the damper frame substrate 65 and the adhesive 90 is increased, and the bonding strength between the damper member 60 and the common flow channel member 50 (piezoelectric element holding substrate 70) can be further increased.

[0031] In particular, in this embodiment, as shown in Figures 11(a) and (b), the opening area of ​​the through hole 66a in the damper plate 66 is formed to be larger than the opening area of ​​the recess 69a in the damper frame substrate 65. As a result, a step is created between the through hole 66a and the recess 69a, further increasing the bonding area and enabling the achievement of higher bonding strength.

[0032] In this embodiment, the opening shape of the through-hole 66a is hexagonal, as shown in Figure 11(b). However, it is not limited to this, and may be a polygon other than a hexagon, such as a triangle, square, pentagon, or heptagon, or it may be circular or elliptical. Furthermore, the opening shape of the through-hole 66a may be a straight line along the substrate surface of the damper frame substrate 65 (the plane of the paper in Figure 12(b)), as shown in Figures 12(a) and (b).

[0033] Furthermore, in this embodiment, as shown in Figure 11(b), a plurality of through holes 66a formed at a distance from each other are arranged in a two-dimensional distribution. However, the configuration is not limited to this, and at least some of the plurality of through holes 66a may be connected to each other.

[0034] Furthermore, in this embodiment, as shown in Figure 13, the through-hole 66a of the damper plate 66 may be formed in a region facing the partition wall 59 (adhesive surface) of the common flow path member 50 (piezoelectric element holding substrate 70), so as to surround the damper portion (island portion) 66b where the through-hole 66a is not formed. This allows excess adhesive 90 used to bond the island portion 66b of the damper plate 66 to be taken into the through-hole 66a, reducing the likelihood of excess adhesive 90 overflowing from the partition wall 59.

[0035] Furthermore, in this embodiment, the through-hole 66a of the damper plate 66 may have a tapered shape that narrows towards the depth direction, as indicated by the reference numeral T1 in Figure 14. In this case, the filler 91 and foreign matter can more easily penetrate further into the inside and deeper parts of the through-hole 66a, further reducing the risk of damage to the damper plate 66. Similarly, the recess 69a of the partition wall 69 of the damper frame substrate 65 may also have a tapered shape that narrows towards the depth direction, as indicated by the reference numeral T2 in Figure 15. In this case as well, the filler 91 and foreign matter can more easily penetrate further into the inside and deeper parts of the recess 69a, further reducing the risk of damage to the damper plate 66.

[0036] [Variation] Next, a modified example of the joint between the partition wall 59 of the common flow path member 50, the damper plate 66, and the partition wall 69 of the damper frame substrate 65 in the liquid discharge head 1 of the above-described embodiment will be explained. Figure 16 is a schematic explanatory diagram showing the cross-sectional structure of the joint between the partition wall 59 of the common flow path member 50, the damper plate 66, and the partition wall 69 of the damper frame substrate 65 in this modified example.

[0037] In this modified example, as shown in Figure 16, a recess 59a is formed in the partition wall 59 of the common flow channel member 50 (piezoelectric element holding substrate 70), which is the substrate to be joined in the liquid discharge head 1 of the above-described embodiment. More specifically, in this modified example, the recess 59a is formed in the partition wall 59 of the common flow channel member 50 so as to face the portion of the damper plate 66 where the through hole 66a is not formed. As a result, even if filler 91 or foreign matter is interposed between the damper plate 66 and the common flow channel member 50, which would get stuck in the conventional liquid discharge head 1', in this modified example, at least a portion of the filler 91 or foreign matter can enter not only the through hole 66a of the damper plate 66 but also the recess 59a of the common flow channel member 50. Therefore, according to this modified example, the probability of filler 91 or foreign matter getting stuck between the damper plate 66 and the common flow channel member 50 can be reduced, and damage to the damper plate 66 can be suppressed.

[0038] Furthermore, by providing such recesses 59a in the common flow channel member 50, the bonding area between the common flow channel member 50 and the adhesive 90 can be increased. As a result, the bonding strength between the damper member 60 and the common flow channel member 50 (piezoelectric element holding substrate 70) can be further increased.

[0039] In this modified example, the recess 59a of the common flow channel member 50 may be formed to extend to the region opposite the through hole 66a of the damper plate 66. In this case, the number of locations where the distance between the common flow channel member 50 and the damper plate 66 is shortest can be reduced, and the probability of filler 91 or foreign matter getting stuck between the damper plate 66 and the common flow channel member 50 can be further reduced. Therefore, damage to the damper plate 66 can be further suppressed.

[0040] In this modified example, as in the embodiment described above, a through hole 66a is formed in the damper plate 66. However, the effect of providing a recess 59a in the common flow channel member 50 can be obtained in the same way even if a through hole 66a is not formed in the damper plate 66.

[0041] For example, as shown in Figure 17, a damper plate 66 without through holes 66a may be used in the common flow channel member 50 (piezoelectric element holding substrate 70), and a recess 59a may be formed in the opposing region of the damper plate 66 that faces the adhesive surface. Even with this configuration, if filler 91 or foreign matter that would get stuck between the damper plate 66 and the common flow channel member 50 in a conventional liquid discharge head 1' is present, at least a portion of the filler 91 or foreign matter can enter the recess 59a of the common flow channel member 50, preventing it from getting stuck between them. Therefore, the example in Figure 17 can also reduce the probability of filler 91 or foreign matter getting stuck between the damper plate 66 and the common flow channel member 50, thereby suppressing damage to the damper plate 66. Furthermore, by providing the recess 59a in the common flow channel member 50, the adhesive area can be increased, thus increasing the adhesive strength between the damper member 60 and the common flow channel member 50 (piezoelectric element holding substrate 70).

[0042] In particular, in the example shown in Figure 17, since no through-hole 66a is formed in the damper plate 66, the rigidity of the damper plate 66 is not reduced, and there is an advantage in that the rigidity of the damper plate 66 is easily ensured. Also, in the example shown in Figure 17, since no recess 69a is formed in the damper frame substrate 65, the rigidity of the damper frame substrate 65 is not reduced, and there is an advantage in that the rigidity of the damper frame substrate 65 is easily ensured.

[0043] Next, we will describe a liquid dispensing unit equipped with each of the liquid dispensing heads 1 described above. As shown in Figures 18 and 19, the liquid discharge unit 100 includes a liquid discharge head 1, a base member 103 that holds multiple liquid discharge heads 1, and a cover member 113 that serves as a nozzle cover for the liquid discharge heads 1. Furthermore, the liquid discharge unit 100 includes a heat dissipation member 104, a manifold 105 that forms a flow path for supplying liquid to the multiple liquid discharge heads 1, a printed circuit board (PCB) 106 connected to a flexible wiring board 101, and a module case 107.

[0044] Next, we will describe a device for dispensing liquid, equipped with each of the liquid dispensing heads 1 described above. As shown in Figures 20 and 21, the printing apparatus 500, which is a device for discharging liquid, includes a loading means 501 for loading the continuous body 510, which is the recording medium, and a guiding and transporting means 503 for guiding and transporting the continuous body 510 loaded by the loading means 501 toward the printing means 505. The printing apparatus 500 also includes a printing means 505 that performs a printing operation to form an image by discharging liquid onto the continuous body 510, a drying means 507 for drying the continuous body 510 to which the liquid has adhered, and an unloading means 509 for unloading the continuous body 510.

[0045] The continuous material 510 is fed out from the main winding roller 511 of the loading means 501, guided and transported by rollers of the loading means 501, the guiding and transporting means 503, the drying means 507, and the unloading means 509, and then wound onto the winding roller 591 of the unloading means 509. In the printing means 505, the continuous material 510 is transported on the transport guide member 559 facing the head unit 550, which is a liquid discharge unit, and an image is printed by the liquid discharged from the head unit 550.

[0046] The printing apparatus 500 is equipped with the liquid ejection units 100A and 100B described above on the head unit 550, and each liquid ejection unit 100A and 100B is mounted on a common base member 552. Each liquid dispensing unit 100A and 100B, when the direction of arrangement of the liquid dispensing heads 1 in a direction perpendicular to the continuum transport direction is defined as the head arrangement direction, will dispense liquid of the same color from the head row 1A1 and 1A2 of liquid dispensing unit 100A. Similarly, the head row 1B1 and 1B2 of liquid dispensing unit 100A, the head row 1C1 and 1C2 of liquid dispensing unit 100B, and the head row 1D1 and 1D2 of liquid dispensing unit 100B will dispense liquid of the desired color, respectively.

[0047] Next, other examples of printing apparatus, which are devices that dispense liquids, will be described based on Figures 22 and 23. The printing apparatus 400, which dispenses liquid, is a serial printing apparatus, and the carriage 403 reciprocates in the main scanning direction by the main scanning movement mechanism 493. The main scanning movement mechanism 493 includes a guide member 401, a main scanning motor 405, a timing belt 408, etc. The guide member 401 is stretched across the left and right side plates 491A and 491B and holds the carriage 403 in a movable position. The carriage 403 reciprocates in the main scanning direction by receiving the driving force of the main scanning motor 405 via the timing belt 408 stretched between the drive pulley 406 and the driven pulley 407.

[0048] The carriage 403 is equipped with a liquid dispensing unit 440 which integrally includes a liquid dispensing head 1 and a head tank 441. Here, the liquid dispensing head 1 dispenses liquids of various colors, such as yellow (Y), cyan (C), magenta (M), and black (K). The liquid dispensing head 1 is mounted with a nozzle row consisting of multiple nozzles arranged in a sub-scanning direction perpendicular to the main scanning direction, and with the liquid dispensing direction facing downwards. The liquid dispensing head 1 is connected to a liquid circulation device, and the liquid of the desired color is circulated and supplied to the liquid dispensing head 1.

[0049] The printing apparatus 400 is equipped with a transport mechanism 495 for transporting the paper 410, which is the recording medium. The transport mechanism 495 includes a transport belt 412, which is the transport means, and a sub-scanning motor 416 that drives the transport belt 412. The transport belt 412, which is an endless belt, is stretched between a transport roller 413 and a tension roller 414, and is used to pick up the paper 410 and transport it to a position facing the liquid discharge head 1. Pickup is performed by electrostatic attraction or air suction, etc. The transport belt 412 is moved circumferentially in the sub-scanning direction by the driving force of the sub-scanning motor 416 being transmitted via a timing belt 417 and a timing pulley 418.

[0050] A maintenance and recovery mechanism 420 for maintaining and restoring the liquid discharge head 1 is positioned on one side of the carriage 403 in the main scanning direction and to the side of the conveyor belt 412. The maintenance and recovery mechanism 420 consists of, for example, a cap member 421 that caps the nozzle surface of the liquid discharge head 1, and a wiper member 422 that wipes the nozzle surface. The main scanning movement mechanism 493, the maintenance and recovery mechanism 420, and the conveyor mechanism 495 are mounted on a housing that includes side plates 491A, 491B, and a back plate 491C.

[0051] In the printing apparatus 400 with the above configuration, the paper 410 is held in place by the transport belt 412, and the paper 410 is transported in the sub-scanning direction by the circular movement of the transport belt 412. At this time, the liquid ejection head 1 is driven in accordance with the image signal while the carriage 403 is moved in the main scanning direction, thereby ejecting liquid onto the stationary paper 410 to form an image.

[0052] Next, the liquid dispensing unit 440 described above will be explained based on Figure 24. The liquid ejection unit 440 is composed of a housing portion consisting of side plates 491A, 491B and a back plate 491C, as well as a main scanning movement mechanism 493, a carriage 403, a liquid ejection head 1, and other components that make up the printing apparatus 400, which is a device for ejecting liquid. Furthermore, it is also possible to configure a liquid dispensing unit in which the maintenance and recovery mechanism 420 described above is further attached to, for example, the side plate 491B of the liquid dispensing unit 440.

[0053] Next, another example of a liquid dispensing unit will be described based on Figure 25. The liquid discharge unit 450 shown in Figure 25 has a liquid discharge head 1 to which a flow path component 444 is attached, and a tube 456 connected to the flow path component 444. The flow path component 444 is located inside a cover 442, and a connector 443 for electrical connection to the liquid discharge head 1 is provided on the upper part of the flow path component 444. A configuration including a head tank 441 instead of the flow path component 444 is also possible.

[0054] In the liquid ejection units 100, 100A, 100B, 440, 450, and printing devices 400, 500, which are devices for ejecting liquid, including the liquid ejection head 1 described above, the same effects and benefits as those of the liquid ejection head 1 described above can be obtained.

[0055] In the present invention, the liquid used is not particularly limited as long as it has a viscosity and surface tension that can be dispensed from the head, but it is preferable that its viscosity becomes 30 [mPa·s] or less at room temperature and atmospheric pressure, or upon heating and cooling. More specifically, this includes solvents such as water and organic solvents, colorants such as dyes and pigments, polymerizable compounds, resins, functional materials such as surfactants, biocompatible materials such as DNA, amino acids and proteins, and calcium, edible materials such as natural pigments, and solutions, suspensions, and emulsions containing these. These can be used, for example, in inkjet inks, surface treatment liquids, and three-dimensional molding material liquids.

[0056] The energy source for discharging the liquid includes piezoelectric actuators (multilayer piezoelectric elements and thin-film piezoelectric elements), thermal actuators using electrothermal conversion elements such as heating resistors, and electrostatic actuators consisting of a diaphragm and a counter electrode.

[0057] A "liquid discharge unit" is a liquid discharge head with integrated functional components and mechanisms, and includes an assembly of parts related to liquid discharge. For example, a "liquid discharge unit" may include a combination of a liquid discharge head with at least one of the following components: a head tank, carriage, supply mechanism, maintenance and recovery mechanism, main scanning movement mechanism, and liquid circulation device. Here, integration includes, for example, cases where a liquid dispensing head and functional components or mechanisms are fixed to each other by fastening, bonding, engaging, etc., or where one is held movably relative to the other. Furthermore, the liquid dispensing head and functional components or mechanisms may be detachable from each other.

[0058] Liquid dispensing units can be configured with an integrated liquid dispensing head and head tank, or with the two integrated by being connected to each other via tubing or similar means. It is also possible to add a unit containing a filter between the liquid dispensing head and head tank of these liquid dispensing units.

[0059] Furthermore, liquid dispensing units include those in which the liquid dispensing head and carriage are integrated, and those in which the liquid dispensing head, carriage, and main scanning movement mechanism are integrated. Additionally, some liquid dispensing units have the liquid dispensing head movably held by a guide member that constitutes part of the scanning movement mechanism, and the liquid dispensing head and scanning movement mechanism are integrated.

[0060] Some liquid discharge units integrate the liquid discharge head, carriage, and maintenance / recovery mechanism by fixing a cap component, which is part of the maintenance / recovery mechanism, to a carriage to which the liquid discharge head is attached. Other liquid discharge units integrate the liquid discharge head and supply mechanism by connecting a tube to a liquid discharge head to which a head tank or flow path component is attached. Liquid from a liquid storage source is supplied to the liquid discharge head via this tube.

[0061] The main scanning movement mechanism shall include the guide member alone. The supply mechanism shall include the tube alone and the loading section alone.

[0062] In this invention, the liquid discharge unit is described in combination with a liquid discharge head, but the liquid discharge unit also includes a head module that includes the liquid discharge head described above, and a head unit in which the functional components and mechanisms described above are integrated.

[0063] Liquid dispensing devices include those equipped with a liquid dispensing head, liquid dispensing unit, head module, head unit, etc., which drive the liquid dispensing head to dispense liquid. Liquid dispensing devices include not only those capable of dispensing liquid onto surfaces to which liquid can adhere, but also those capable of dispensing liquid into gases or liquids.

[0064] The liquid dispensing device may also include means related to the feeding, conveying, and paper discharge of materials to which liquid can adhere, as well as other pre-processing and post-processing devices. Examples of liquid dispensing devices include image forming devices that dispense ink to form an image on a recording medium, and three-dimensional molding devices that dispense molding liquid onto a powder layer formed in layers of powder to create three-dimensional objects.

[0065] Furthermore, devices that dispense liquid are not limited to those that visualize meaningful images such as letters or figures through the dispensed liquid. For example, they also include devices that form patterns that do not have meaning in themselves, or devices that create three-dimensional images.

[0066] The above-mentioned objects to which liquid can adhere refer to objects to which liquid can adhere, at least temporarily, including those to which liquid adheres and solidifies or adheres and penetrates. Specific examples include recording media such as paper, film, and cloth; electronic components such as electronic circuit boards and piezoelectric elements; powder layers; organ models; and testing cells. Unless otherwise specified, all objects to which liquid can adhere are included. The materials to which liquid can adhere may be any material, such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, and ceramics, as long as liquid can adhere to them, even temporarily.

[0067] A device for dispensing liquid includes a configuration in which a liquid dispensing head and an object to which the liquid can adhere move relative to each other, but the object that moves is not limited to either one or the other. Specific examples include serial-type devices in which the liquid dispensing head moves, and line-type devices in which the liquid dispensing head does not move.

[0068] Other examples of devices that dispense liquids include processing liquid coating devices that dispense processing liquid onto the surface of paper for purposes such as modifying the surface of the paper, and injection granulation devices that spray a composition liquid, in which raw materials are dispersed in a solution, through a nozzle to granulate fine particles of the raw materials.

[0069] Although preferred embodiments of the present invention have been described above, the present invention is not limited to these specific embodiments, and various modifications and changes are possible within the scope of the spirit of the present invention as described in the claims, unless otherwise specifically limited in the above description. The effects described in the embodiments of the present invention are merely examples of the most preferred effects that can result from the present invention, and the effects of the present invention are not limited to those described in the embodiments of the present invention.

[0070] The above is just one example; each of the following embodiments produces its own unique effects. [First aspect] The first embodiment is a liquid discharge head 1 that drives an electromechanical conversion element (e.g., piezoelectric element 40) held on an actuator substrate (e.g., piezoelectric element holding substrate 70) to discharge liquid (e.g., ink) in a pressure chamber 21 from a nozzle 11, and has a damper (e.g., damper plate 66) disposed between the actuator substrate and a damper holding substrate (e.g., damper frame substrate 65), wherein the damper is bonded to one of the actuator substrate and the damper holding substrate with adhesive 90, and when the object to which the damper is bonded is the substrate to be bonded (e.g., the common flow path member 50 of the piezoelectric element holding substrate 70 which is the actuator substrate), the damper is characterized in that a recess or through hole 66a is formed in the opposing region facing the adhesive surface of the substrate to be bonded. In conventional liquid dispensing heads, the damper may be bonded to the actuator substrate or damper holding substrate with adhesive. In this case, fillers contained in the adhesive or foreign matter (shavings, fragments, etc. generated during the manufacturing process) may be interposed between the substrate that is bonded to the damper (the substrate to be bonded) and the damper. When such fillers or foreign matter are present, they can get trapped between the damper and the substrate to be bonded, causing localized stress on the damper and potentially leading to damage to the damper, such as cracking. In this embodiment, the damper has a recess or through-hole formed in the region facing the bonding surface of the substrate to be bonded. As a result, even fillers or foreign matter that would get trapped between the damper and the substrate to be bonded if such a recess or through-hole were not formed can enter the recess or through-hole and not get trapped between the damper and the substrate to be bonded. Therefore, the probability of fillers or foreign matter getting trapped between the damper and the substrate to be bonded can be reduced, and thus damage to the damper can be suppressed.

[0071] [Second aspect] The second embodiment is a liquid discharge head 1 that drives an electromechanical conversion element (e.g., piezoelectric element 40) held on an actuator substrate (e.g., piezoelectric element holding substrate 70) to discharge liquid (e.g., ink) in a pressure chamber 21 from a nozzle 11, and comprises a damper (e.g., damper plate 66) disposed between the actuator substrate and a damper holding substrate (e.g., damper frame substrate 65), and an adhesive 90 that bonds the bonded substrate (e.g., a common flow path member 50 of the piezoelectric element holding substrate 70, which is the actuator substrate) to the damper, wherein the bonded substrate has a recess 59a formed in a region facing the bonding surface of the damper. In this embodiment, the substrate to be bonded has a recess formed in the region facing the adhesive surface of the damper. Therefore, even fillers or foreign matter that would get trapped between the substrate and the damper if such a recess were not formed can enter the recess and not get trapped between the damper and the substrate. Consequently, the probability of fillers or foreign matter getting trapped between the damper and the substrate can be reduced, thereby suppressing damage to the damper.

[0072] [Third aspect] The third embodiment is characterized in that, in the first embodiment, a recess 59a is formed in the substrate to be bonded in a region facing the adhesive surface portion of the damper where the recess or through hole is not formed. In this embodiment, the substrate to be bonded has a recess formed in the region facing the adhesive surface of the damper. Therefore, even fillers or foreign matter that would get trapped between the substrate and the damper if such a recess were not formed can enter the recess and not get trapped between the damper and the substrate. Consequently, the probability of fillers or foreign matter getting trapped between the damper and the substrate can be reduced, thereby suppressing damage to the damper.

[0073] [Fourth aspect] The fourth aspect is characterized in that, in the third aspect, the recess extends to the region of the damper opposite to the recess or the through hole. This method reduces the number of points where the distance between the substrate to be bonded and the damper is shortest, further lowering the probability of filler or foreign matter getting trapped between the damper and the substrate. Therefore, damage to the damper can be further suppressed.

[0074] [Fifth aspect] The fifth embodiment is characterized in that, in the first, third, or fourth embodiment, the other substrate of the actuator substrate and the damper holding substrate (for example, the damper frame substrate 65) has a recess 69a formed in a region facing the through hole of the damper. According to this, the adhesive can penetrate into the recess of the other substrate through the through-hole of the damper. Therefore, the bonding area between the bonding member formed by joining the other substrate and the damper and the adhesive is increased, and the bonding strength between the bonding member and the substrate to be joined can be further enhanced.

[0075] [Sixth aspect] The sixth embodiment is characterized in that, in the fifth embodiment, the opening area of ​​the through hole is larger than the opening area of ​​the recess of the other substrate. According to this, a step is created between the through-hole of the damper and the recess of the other substrate, further increasing the bonding area and achieving higher bonding strength.

[0076] [Seventh aspect] The seventh aspect is characterized in that, in any of the first to sixth aspects, the adhesive contains a filler. According to this embodiment, even when the adhesive contains a filler for purposes such as improving adhesion or adhesive strength, damage to the damper due to the filler can be suppressed.

[0077] [8th aspect] The eighth aspect is characterized in that, in the seventh aspect, the thickness of the damper is greater than the maximum diameter of the filler. According to this embodiment, damage to the damper due to filler can be suppressed.

[0078] [Ninth aspect] The ninth aspect is characterized in that, in any of the first to eighth aspects, the recess or through hole of the damper includes having an opening shape that is linear, circular, or polygonal along the substrate surface of the damper holding substrate. According to this, the shape of the recess or the opening of the through hole in the damper can be appropriately selected.

[0079] [Tenth aspect] The tenth embodiment is characterized in that, in any of the first to ninth embodiments, the recess or through-hole of the damper is formed in a facing region facing the adhesive surface of the substrate to be bonded, so as to surround the portion of the damper in which the recess or through-hole is not formed. According to this, any excess adhesive used to bond the damper portion where the recess or through-hole is not formed is incorporated into the recess or through-hole of the damper, making it less likely for the excess adhesive to spill out onto the bonding surface of the substrate to be bonded.

[0080] [Phase 11] The eleventh embodiment is characterized in that, in any of the first to tenth embodiments, the recess or through hole of the damper has a tapered shape that narrows towards the depth. According to this, fillers and foreign objects can more easily penetrate deeper into the recesses or through holes of the damper, further reducing the risk of damper damage.

[0081] [12th aspect] The twelfth aspect is that in any of the first to eleventh aspects, the damper has a compliance of 7 × 10 -17 It is characterized by having a density of [m / N] or more, a Young's modulus of 3 [GPa] or more and 200 [GPa] or less, and a thickness of 2 [μm] or more and 10 [μm] or less. According to this, it can fully fulfill the necessary functions as a damper.

[0082] [The 13th aspect] The 13th embodiment is characterized in that, in any of the 1st to 12th embodiments, the damper has a laminated structure consisting of multiple layers. According to this, the damper characteristics can be easily adjusted.

[0083] [Aspect 14] The fourteenth embodiment is a liquid dispensing unit characterized by including a liquid dispensing head according to any of the first to thirteenth embodiments. According to this embodiment, it is possible to provide a liquid discharge unit in which damage to the damper of the liquid discharge head is suppressed.

[0084] [Aspect 15] The 15th embodiment is a liquid dispensing device characterized by comprising a liquid dispensing head according to any of the 1st to 13th embodiments, or a liquid dispensing unit according to the 14th embodiment. According to this embodiment, it is possible to provide a liquid dispensing device in which damage to the damper of the liquid dispensing head is suppressed. [Explanation of symbols]

[0085] 1,1': Liquid dispensing head 10: Nozzle plate 11: Nozzle 20: Flow channel plate 21: Pressure chamber 22: Individual supply channels 23: Individual recovery channel 25: Individual channel 30: Diaphragm component 31: Vibration plate 32: Supply side opening 33: Recovery side opening 40: Piezoelectric element 50: Common flow path member 52: Common supply channel tributary 53: Common recovery channel tributary 54: Supply port 55: Collection port 56: Common supply channel main flow 57: Common recovery channel main stream 58 :Void 59: Bulkhead 59a: recess 60: Damper component 61A, 61B: Through hole 62: Supply-side damper 63: Recovery side damper 64 :Void 65: Damper frame substrate 66: Damper plate 66a: Through hole 69: Bulkhead 69a: Recess 70: Piezoelectric element holding substrate 80: Frame component 90: Adhesive 91: Filler 100: Liquid dispensing unit 400:Printing device 410: Paper 420: Maintenance and recovery mechanism 440: Liquid Dispensing Unit 441: Head Tank 450: Liquid Dispensing Unit 500:Printing device 550: Head Unit [Prior art documents] [Patent Documents]

[0086] [Patent Document 1] Japanese Patent Publication No. 2017-132237

Claims

1. A liquid discharge head that drives an electromechanical conversion element held on an actuator substrate to discharge liquid from a nozzle in a pressure chamber, The actuator substrate has a damper that is disposed between the damper holding substrate, The damper is bonded to one of the actuator substrate and the damper holding substrate with an adhesive. When the object to which the damper is joined is a substrate to be joined, the damper has a recess or through hole formed in the opposing region facing the bonding surface of the substrate to be joined. The substrate to be bonded has a recess formed in a region facing the adhesive surface portion of the damper where the recess or through hole is not formed. The liquid discharge head is characterized in that the recess extends to the region of the damper opposite to the recess or the through hole.

2. In the liquid discharge head according to Claim 1, A liquid discharge head characterized in that the other substrate of the actuator substrate and the damper holding substrate has a recess formed in a region facing the through hole of the damper.

3. In the liquid discharge head according to Claim 2, A liquid dispensing head characterized in that the opening area of ​​the through hole is larger than the opening area of ​​the recess of the other substrate.

4. In the liquid dispensing head according to Claim 1, A liquid dispensing head characterized in that the adhesive contains a filler.

5. A liquid discharge head that drives an electromechanical conversion element held on an actuator substrate to discharge liquid in a pressure chamber from a nozzle, The actuator substrate has a damper that is disposed between the damper holding substrate, The damper is bonded to one of the actuator substrate and the damper holding substrate with an adhesive. When the object to which the damper is joined is a substrate to be joined, the damper has a recess or through hole formed in the opposing region facing the bonding surface of the substrate to be joined. A liquid dispensing head characterized in that the adhesive contains a filler.

6. A liquid discharge head that drives an electromechanical conversion element held on an actuator substrate to discharge liquid from a nozzle in a pressure chamber, A damper is disposed between the actuator substrate and the damper holding substrate, The system includes an adhesive for bonding the substrate to be bonded, which is one of the actuator substrate and the damper holding substrate, to the damper. The substrate to be bonded has a recess formed in the region facing the bonding surface of the damper. A liquid dispensing head characterized in that the adhesive contains a filler.

7. In the liquid dispensing head according to any one of claims 4 to 6, A liquid dispensing head characterized in that the thickness of the damper is greater than the maximum diameter of the filler.

8. In the liquid discharge head according to claim 1, A liquid discharge head characterized in that the recess or through hole of the damper has an opening shape that is linear, circular, or polygonal along the substrate surface of the damper holding substrate.

9. In the liquid discharge head according to claim 1, A liquid dispensing head characterized in that the recess or through-hole of the damper is formed so as to surround the portion of the damper where the recess or through-hole is not formed, within a facing region that faces the adhesive surface of the substrate to be bonded.

10. In the liquid discharge head according to claim 1, A liquid discharge head characterized in that the recess or through hole of the damper has a tapered shape that narrows towards the depth direction.

11. In the liquid dispensing head according to any one of claims 1, 2, 3, 4, 5, 6, 8, 9, or 10, The damper has a compliance of 7 x 10 －１７ A liquid dispensing head characterized by having a density of [m / N] or greater, a Young's modulus of 3 [GPa] or more and 200 [GPa] or less, and a thickness of 2 [μm] or more and 10 [μm] or less.

12. A liquid discharge head that drives an electromechanical conversion element held on an actuator substrate to discharge liquid in a pressure chamber from a nozzle, The actuator substrate has a damper that is disposed between the damper holding substrate, The damper is bonded to one of the actuator substrate and the damper holding substrate with an adhesive. When the object to which the damper is joined is a substrate to be joined, the damper has a recess or through hole formed in the opposing region facing the bonding surface of the substrate to be joined. The damper is characterized by having a compliance of 7 × 10⁻¹⁷ [m / N] or more, a Young's modulus of 3 [GPa] or more and 200 [GPa] or less, and a thickness of 2 [μm] or more and 10 [μm] or less.

13. A liquid discharge head that drives an electromechanical conversion element held on an actuator substrate to discharge liquid in a pressure chamber from a nozzle, A damper is disposed between the actuator substrate and the damper holding substrate, The system includes an adhesive for bonding the substrate to be bonded, which is one of the actuator substrate and the damper holding substrate, to the damper. The substrate to be bonded has a recess formed in the region facing the bonding surface of the damper. The damper is characterized by having a compliance of 7 × 10⁻¹⁷ [m / N] or more, a Young's modulus of 3 [GPa] or more and 200 [GPa] or less, and a thickness of 2 [μm] or more and 10 [μm] or less.

14. In the liquid dispensing head according to any one of claims 1, 2, 3, 4, 5, 6, 8, 9, 10, 12, or 13, The liquid discharge head is characterized in that the damper has a laminated structure consisting of multiple layers.

15. A liquid dispensing unit characterized by including a liquid dispensing head according to any one of claims 1, 2, 3, 4, 5, 6, 8, 9, 10, 12, or 13.

16. A liquid dispensing device characterized by comprising a liquid dispensing head according to any one of claims 1, 2, 3, 4, 5, 6, 8, 9, 10, 12, or 13.

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