Circuit board cleaning brush and circuit board cleaning device

Abstract

To provide substrate cleaning brushes and substrate cleaning equipment capable of efficiently cleaning substrates.SOLUTION: A substrate cleaning brush 100 includes cleaning sections 120, 130 and is used to clean substrates. The cleaning sections 120, 130 have a cleaning surface that can be in contact with the substrate when cleaning the substrate. The cleaning surface is formed with a cut 102. The cleaning section 120, 130 is divided into a plurality of cleaning blocks 103 by the cutout 102. When the cleaning surface contacts the substrate, each cleaning block 103 and the cleaning block 103 adjacent to that block 103 contact each other due to elastic deformation of the cleaning sections 120, 130.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a substrate cleaning brush and a substrate cleaning apparatus for cleaning a substrate.

Background Art

[0002] In order to perform various processes on various substrates such as a substrate for a flat panel display (FPD) used in a liquid crystal display device or an organic EL (Electro Luminescence) display device, a semiconductor substrate, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell, a substrate processing apparatus is used. To clean a substrate, a substrate cleaning apparatus is used.

[0003] For example, in the substrate cleaning apparatus described in Patent Document 1, a substrate cleaning apparatus including a bottom brush is described. The bottom brush includes a base portion having a disc shape and first and second cleaning portions protruding upward from the upper surface of the base portion. The first cleaning portion extends in the radial direction of the base portion through the geometric center of the base portion in a plan view. The second cleaning portion is disposed along the outer edge of the base portion. By rotating the base portion while the first and second cleaning portions of the bottom brush are in contact with the lower surface of the substrate, contaminants adhering to the lower surface of the substrate are removed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The underside brush described in Patent Document 1 prevents excessive load from being applied to the substrate while maintaining a large area that can be cleaned. This allows for efficient cleaning of the underside of the substrate. However, the underside brush described in Patent Document 1 may not be able to clean the substrate efficiently. Therefore, it is desirable to improve the cleaning efficiency.

[0006] The object of the present invention is to provide a substrate cleaning brush and a substrate cleaning apparatus capable of efficiently cleaning substrates. [Means for solving the problem]

[0007] This invention First A curved substrate cleaning brush is a substrate cleaning brush used for cleaning a substrate, having a cleaning surface that can come into contact with the substrate during cleaning, and having a cleaning section with notches formed on the cleaning surface. and a base portion having a central point and on which the cleaning portion is formed The cleaning surface is equipped with, A plane parallel to the plane that intersects the axis passing through the aforementioned center point, The aforementioned cuts divide the surface into multiple cleaning blocks, and when the cleaning surface comes into contact with the substrate, the elastic deformation of the cleaning section causes each cleaning block and adjacent cleaning blocks to come into contact with each other. A substrate cleaning brush according to a second aspect of the present invention is a substrate cleaning brush used for cleaning a substrate, comprising a cleaning portion having a cleaning surface that can contact the substrate when cleaning the substrate and having notches formed in the cleaning surface, and a base portion having a center point, wherein the cleaning surface is divided into a plurality of cleaning blocks by the notches, and when the cleaning surface and the substrate come into contact, each cleaning block and adjacent cleaning blocks come into contact with each other due to the elastic deformation of the cleaning portion, wherein the cleaning portion includes a first cleaning portion that protrudes from the base portion and extends in one direction through the center point of the base portion in a plan view, and a second cleaning portion that protrudes from the base portion and has an annular shape centered on the center point of the base portion in a plan view, and the notches are formed on at least one of the cleaning surface of the first cleaning portion and the cleaning surface of the second cleaning portion.

[0008] This invention Third A substrate cleaning apparatus that conforms to the above configuration includes a substrate holding section for holding the substrate and a section for cleaning the substrate held by the substrate holding section. the above It is equipped with a circuit board cleaning brush. A substrate cleaning apparatus according to a fourth aspect of the present invention comprises a substrate holding unit for holding a substrate, a substrate cleaning brush for cleaning the substrate held by the substrate holding unit, and a moving device for moving the substrate cleaning brush between a first horizontal position capable of cleaning the outer lower surface region surrounding the central lower surface region of the substrate and a second horizontal position capable of cleaning the central lower surface region of the substrate, wherein the substrate cleaning brush has a cleaning surface capable of contacting the substrate when cleaning the substrate, and includes a cleaning unit with notches formed in the cleaning surface, the cleaning surface is divided into a plurality of cleaning blocks by the notches, and when the cleaning surface and the substrate come into contact, each cleaning block and adjacent cleaning blocks come into contact with each other due to the elastic deformation of the cleaning unit. [Effects of the Invention]

[0009] According to the present invention, substrates can be cleaned efficiently. [Brief explanation of the drawing]

[0010] [Figure 1] This is an external perspective view of a brush unit including a substrate cleaning brush according to the first embodiment of the present invention. [Figure 2] It is an external perspective view of the substrate cleaning brush in FIG. 1. [Figure 3] It is a plan view of the substrate cleaning brush in FIG. 1. [Figure 4] It is an enlarged perspective view showing a part of the cleaning section. [Figure 5] It is a longitudinal sectional view of the brush unit in FIG. 1. [Figure 6] It is a diagram for explaining the operation of the brush unit. [Figure 7] It is a diagram showing a modified example of the substrate cleaning brush. [Figure 8] It is a diagram showing a modified example of the notch formed on the cleaning surface of the substrate cleaning brush. [Figure 9] It is a plan view of the substrate cleaning brush according to the reference example. [Figure 10] It is a schematic diagram showing the cleaning process of the central region on the lower surface of the substrate by the substrate cleaning brush in FIG. 9. [Figure 11] It is a schematic diagram showing the cleaning process of the outer region on the lower surface of the substrate by the substrate cleaning brush in FIG. 9. [Figure 12] It is a plan view of the substrate cleaning brush according to Example 2. [Figure 13] It is a graph showing the measurement results of the deformation amount of the cleaning surface of the cleaning section in Example 1. [Figure 14] It is a graph showing the measurement results of the deformation amount of the cleaning surface of the cleaning section in Example 2. [Figure 15] It is a graph showing the measurement results of the deformation amount of the cleaning surface of the cleaning section in the comparative example. [Figure 16] It is a schematic plan view of the substrate cleaning apparatus according to the second embodiment of the present invention. [Figure 17] It is an external perspective view showing the internal configuration of the substrate cleaning apparatus in FIG. 16. [Figure 18] It is a block diagram showing the configuration of the control system of the substrate cleaning apparatus in FIG. 16. [Figure 19] It is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus in FIG. 16. [Figure 20] It is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus in FIG. 16. [Figure 21] Figure 16 is a schematic diagram illustrating an example of the operation of a substrate cleaning apparatus. [Figure 22] Figure 16 is a schematic diagram illustrating an example of the operation of a substrate cleaning apparatus. [Figure 23] Figure 16 is a schematic diagram illustrating an example of the operation of a substrate cleaning apparatus. [Figure 24] Figure 16 is a schematic diagram illustrating an example of the operation of a substrate cleaning apparatus. [Figure 25] Figure 16 is a schematic diagram illustrating an example of the operation of a substrate cleaning apparatus. [Figure 26] Figure 16 is a schematic diagram illustrating an example of the operation of a substrate cleaning apparatus. [Figure 27] Figure 16 is a schematic diagram illustrating an example of the operation of a substrate cleaning apparatus. [Figure 28] Figure 16 is a schematic diagram illustrating an example of the operation of a substrate cleaning apparatus. [Figure 29] Figure 16 is a schematic diagram illustrating an example of the operation of a substrate cleaning apparatus. [Figure 30] Figure 16 is a schematic diagram illustrating an example of the operation of a substrate cleaning apparatus. [Modes for carrying out the invention]

[0011] Hereinafter, a substrate cleaning brush and substrate cleaning apparatus according to embodiments of the present invention will be described with reference to the drawings. In the following description, "substrate" refers to semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, substrates for optical discs, substrates for magnetic discs, substrates for magneto-optical discs, substrates for photomasks, ceramic substrates, or substrates for solar cells.

[0012] 1. First Embodiment (1) Configuration of the circuit board cleaning brush Figure 1 is an external perspective view of a brush unit including a substrate cleaning brush according to a first embodiment of the present invention. As shown in Figure 1, the brush unit 300 includes a substrate cleaning brush 100 and a brush base 200. The brush unit 300 is constructed by mounting the substrate cleaning brush 100 on the brush base 200.

[0013] In this example, the substrate cleaning brush 100 is a bottom brush that cleans the underside of the substrate. The substrate cleaning brush 100 may be made of a relatively soft resin material such as PVA (polyvinyl alcohol) or PTFE (polytetrafluoroethylene). The brush base 200 may be made of a relatively hard resin such as PVC (polyvinyl chloride) or PP (polypropylene).

[0014] Figure 2 is an external perspective view of the substrate cleaning brush 100 shown in Figure 1. Figure 3 is a plan view of the substrate cleaning brush 100 shown in Figure 1. As shown in Figures 2 and 3, the substrate cleaning brush 100 includes a base portion 110 and cleaning portions 120 and 130. The base portion 110 has a disc shape. In plan view, the geometric center point 101 (Figure 3) of the base portion 110 is defined.

[0015] The cleaning sections 120 and 130 are formed on the upper surface of the base section 110 so as to protrude upward from the upper surface of the base section 110. The amount of protrusion of the cleaning sections 120 and 130 from the upper surface of the base section 110 is, for example, 5 mm to 6 mm. The upper surfaces of the cleaning sections 120 and 130 serve as cleaning surfaces for cleaning the lower surface of the substrate W.

[0016] The cleaning section 120 has a cleaning surface that extends in one direction and is positioned to extend radially along the base section 110, passing through the center point 101 of the base section 110. The cleaning section 130 has an annular shape and is positioned along the outer edge of the base section 110. The cleaning section 130 may be in contact with both ends of the cleaning section 120. The widths of the cleaning section 120 and the cleaning section 130 may be equal or different.

[0017] Multiple through holes 111, 112, and 113 are formed in the base portion 110. Each of the through holes 111 to 113 extends in the vertical direction. The through holes 111 are used to connect the base portion 110 to the brush base 200 shown in Figure 1, and in this example, 10 are provided. Specifically, eight of the through holes 111 are arranged in the peripheral region of the base portion 110 at approximately equal angular intervals. Two of the through holes 111 are arranged in the central region of the base portion 110 so as to face each other across the cleaning section 120.

[0018] The through holes 112 are used to connect the brush base 200 to a motor that rotates the brush unit 300, and in this example, four are provided. The four through holes 112 are arranged in the central region of the base portion 110 at approximately equal angular intervals, surrounding the center point 101 of the base portion 110. The through holes 113 are used to discharge the cleaning fluid during substrate cleaning, and in this example, ten are provided. The ten through holes 113 are regularly arranged in the peripheral region of the base portion 110, along the cleaning section 130.

[0019] Multiple notches 102 are formed in the cleaning surfaces of the cleaning sections 120 and 130. This divides the cleaning surfaces of the cleaning sections 120 and 130 into multiple cleaning blocks 103. In this example, the cleaning section 120 has one notch 102 that passes through the center point 101 and is parallel to the direction in which the cleaning section 120 extends, as well as numerous notches 102 that are perpendicular to the direction in which the cleaning section 120 extends. The cleaning section 130 has numerous radial notches 102 centered on the center point 101.

[0020] By forming multiple notches 102 on the cleaning surfaces of the cleaning sections 120 and 130, the rigidity of the cleaning surfaces of the cleaning sections 120 and 130 is reduced. Figure 4 is an enlarged perspective view showing a part of the cleaning section 120. As shown in Figure 4, the depth of each notch 102 is d, and the width of each notch 102 is w. The area of ​​the upper surface of each cleaning block 103, which is the cleaning surface, is S. The larger the depth d of the notch 102, the lower the rigidity of the cleaning surfaces of the cleaning sections 120 and 130. Also, the smaller the area S of the cleaning block 103, the lower the rigidity of the cleaning surfaces of the cleaning sections 120 and 130.

[0021] As the rigidity of the cleaning sections 120 and 130 is reduced, the load generated on the cleaning sections 120 and 130 when the cleaning surface contacts the lower surface of the substrate causes them to elastically deform. As a result, the side surface of each cleaning block 103 and the side surface of the adjacent cleaning block 103 are in approximate contact. Thus, in this embodiment, the notch 102 is different from a slit, notch, or groove for allowing a liquid such as cleaning solution to pass through. Therefore, the width w of the notch 102 is small. Specifically, the width w of the notch 102 may be 1 mm or less.

[0022] The brush base 200 is a plate-shaped member having the same external shape as the base portion 110 of the substrate cleaning brush 100. Figure 5 is a longitudinal cross-sectional view of the brush unit 300 of Figure 1. As shown in Figure 5, a recess 210 that is recessed upward is formed in the central region of the lower surface of the brush base 200. In addition, an inclined portion 220 that slopes downward outward is formed in the peripheral region of the lower surface of the brush base 200. Furthermore, the brush base 200 has a plurality of screw holes 201, a plurality of through holes 202 and a plurality of through holes 203.

[0023] Multiple screw holes 201 are provided on the upper surface of the brush base 200 so as to correspond to multiple through holes 111 of the substrate cleaning brush 100. Multiple through holes 202 extend vertically and are arranged so as to correspond to multiple through holes 112 of the substrate cleaning brush 100. Multiple through holes 203 extend vertically and are arranged so as to correspond to multiple through holes 113 of the substrate cleaning brush 100.

[0024] Multiple screw members 310 (Figure 1) are inserted from above into multiple through holes 111 of the substrate cleaning brush 100. The lower end of each screw member 310 is screwed into the corresponding screw hole 201 of the brush base 200. This connects the substrate cleaning brush 100 and the brush base 200, completing the brush unit 300. In the brush unit 300, the multiple through holes 113 of the substrate cleaning brush 100 communicate with the multiple through holes 203 of the brush base 200.

[0025] The brush unit 300 is attached to a rotating shaft 400 of a motor or the like. Specifically, the rotating shaft 400 is fitted into a recess 210 of the brush base 200 from below. The rotating shaft 400 has multiple screw holes 401 that correspond to the through holes 202 of the brush base 200. Multiple screw members 320 (Figure 1) are inserted from above into multiple through holes 112 of the substrate cleaning brush 100. The lower end of each screw member 320 is screwed into the corresponding screw hole 401 of the rotating shaft 400 through the corresponding through hole 202 of the brush base 200.

[0026] (2) Operation of the brush unit In this example, the brush unit 300 is used to clean the underside of the substrate. Hereafter, the central portion of the underside of the substrate will be referred to as the central underside region. The region surrounding the central underside region of the substrate will be referred to as the outer underside region. The underside of the substrate refers to the surface of the substrate that faces downwards. Therefore, if the circuit-forming surface (front surface) of the substrate faces downwards, the front surface of the substrate is the underside, and if the surface opposite to the front surface (back surface) faces downwards, the back surface of the substrate is the underside.

[0027] Figure 6 is a diagram illustrating the operation of the brush unit 300. When cleaning the central region of the lower surface of the substrate W, the brush unit 300 is moved below the central region of the lower surface of the substrate W, as shown in the upper part of Figure 6. Next, the cleaning surfaces of the cleaning parts 120 and 130 (Figure 1) of the substrate cleaning brush 100, which are the upper ends of the brush unit 300, come into contact with the lower surface of the substrate W. Subsequently, the brush unit 300 is rotated around a vertical axis passing through the center point 101 of the base portion 110, thereby removing contaminants adhering to the central region of the lower surface of the substrate W. In this example, the substrate W is not rotated when cleaning the central region of the lower surface of the substrate W, but the substrate W may be rotated.

[0028] When cleaning the lower outer region of the substrate W, the brush unit 300 is moved downwards from the lower outer region of the substrate W, as shown in the lower part of Figure 6. At this time, a part of the brush unit 300 may protrude slightly outward from the substrate W. Next, the cleaning surfaces of the cleaning parts 120 and 130 of the substrate cleaning brush 100, which are the upper ends of the brush unit 300, come into contact with the lower surface of the substrate W. Subsequently, the substrate W is rotated to remove contaminants adhering to the lower outer region of the substrate W. In this example, the brush unit 300 is not rotated when cleaning the lower outer region of the substrate W, but the brush unit 300 may be rotated.

[0029] Here, the substrate W is not a perfectly flat plate, and warping may occur in the substrate W. Also, during cleaning of the substrate W, temporary deformation such as bending may occur in the substrate W due to the load from the substrate cleaning brush 100. Even in such cases, as described above, the rigidity of the cleaning sections 120 and 130 is reduced by forming multiple notches 102 on the cleaning surfaces of the cleaning sections 120 and 130.

[0030] Therefore, when the cleaning surface comes into contact with the underside of the substrate W, the load generated on the cleaning sections 120 and 130 causes them to elastically deform. In this case, it becomes easier to bring the entire cleaning surface of the cleaning sections 120 and 130 into contact with the underside of the substrate W, following the shape of the substrate W. Furthermore, due to the elastic deformation of the cleaning sections 120 and 130, each cleaning block 103 comes into contact with the adjacent cleaning block 103. This prevents the occurrence of areas between adjacent cleaning blocks 103 that do not come into contact with the underside of the substrate W. As a result, the underside of the substrate W can be cleaned efficiently.

[0031] In this example, the diameter of the substrate cleaning brush 100 is greater than 1 / 3 and less than 1 / 2 of the diameter of the substrate W. In this case, the entire underside of the substrate W is efficiently cleaned by the brush unit 300 moving between the lower part of the central region of the underside of the substrate W and the lower part of the outer region of the underside. Therefore, there is no need to make the substrate cleaning brush 100 excessively large. The diameter of the substrate W is, for example, 300 mm. As shown by the dashed line in Figure 6, the area that can be cleaned when the brush unit 300 is moved below the central region of the underside of the substrate W and the area that can be cleaned when the brush unit 300 is moved below the outer region of the underside of the substrate W may slightly overlap.

[0032] When cleaning the underside of the substrate W, cleaning fluid may be supplied to the underside of the substrate W. In this case, contaminants adhering to the underside of the substrate W can be removed more efficiently. The cleaning fluid supplied to the underside of the substrate W is discharged to the underside of the brush base 200 through multiple through holes 113 formed in the substrate cleaning brush 100 and multiple through holes 203 formed in the brush base 200 shown in Figure 5. This prevents the cleaning fluid from accumulating on the substrate cleaning brush 100.

[0033] Furthermore, as shown in Figure 5, an inclined portion 220 is formed on the peripheral region of the lower surface of the brush base 200, sloping downward and outward. Therefore, the cleaning fluid discharged to the lower surface of the brush base 200 is not guided inward, but is guided outward along the inclined portion 220 and discharged from the brush base 200. This prevents the cleaning fluid from adhering to the rotating shaft 400 or motor, etc.

[0034] (3) Modified example of a circuit board cleaning brush In the substrate cleaning brush 100 according to this embodiment, a cleaning section 120 having a cleaning surface extending in one direction and a cleaning section 130 having an annular cleaning surface are provided on a circular base section 110, but the embodiment is not limited thereto. The substrate cleaning brush 100 may have various shapes. Also, the pattern of the notches 102 formed on the cleaning surface of the substrate cleaning brush 100 is not particularly limited.

[0035] Figure 7 shows modified versions of the substrate cleaning brush 100. As shown in Figure 7, in the substrate cleaning brush 100 according to the first modified version, a cleaning section 120 having a cleaning surface extending in one direction is provided on the base section 110. In the substrate cleaning brush 100 according to the second modified version, a cleaning section 130 having an annular cleaning surface is provided on the base section 110. In the substrate cleaning brush 100 according to the third modified version, a cleaning section 140 having a cross-shaped cleaning surface is provided on the base section 110.

[0036] In the fourth modified example of the substrate cleaning brush 100, a cleaning section 130 having an annular cleaning surface and a cleaning section 140 having a cross-shaped cleaning surface are provided on the base section 110. In the fifth modified example of the substrate cleaning brush 100, a cleaning section 150 having a relatively large diameter circular cleaning surface is provided on the base section 110. In the sixth modified example of the substrate cleaning brush 100, a cleaning section 150 having a relatively small diameter circular cleaning surface is provided on the base section 110.

[0037] In the first to fourth modifications, the notches 102 are not shown, but each of the substrate cleaning brushes 100 according to the first to fourth modifications may have notches 102 of various patterns formed on it. Figure 8 shows modified examples of notches 102 formed on the cleaning surface of the substrate cleaning brush 100. In each modification in Figure 8, a plan view of the substrate cleaning brush 100 is shown in the left column, and a perspective view of the substrate cleaning brush 100 is shown in the right column.

[0038] As shown in Figure 8, in the seventh modified example, multiple notches 102 are formed in a grid pattern so as to extend vertically and horizontally at equal intervals. In the example in Figure 8, the notches 102 of the seventh modified example are formed on the cleaning surface of the cleaning section 150 of the substrate cleaning brush 100 according to the fifth modified example. The same applies to the eighth and ninth modified examples described below.

[0039] In the eighth modification, multiple notches 102 are formed so as to extend in one direction at equal intervals. In the ninth modification, multiple notches 102 are formed in a grid pattern so as to extend in the vertical and horizontal directions at unequal intervals. In the ninth modification, notches 102 may be formed at small intervals in areas where it is desired to further reduce the rigidity of the cleaning surface of the cleaning section 150 (for example, areas that are likely to come into contact with the substrate W).

[0040] In the tenth modified example, multiple notches 102 are formed so as to extend radially from the center point 101 (Figure 3) of the base portion 110. In the example shown in Figure 8, the notches 102 of the tenth modified example are formed on the cleaning surface of the cleaning portion 130 of the substrate cleaning brush 100 according to the second modified example.

[0041] (4) Effects In the substrate cleaning brush 100 according to this embodiment, the cleaning surfaces of the cleaning sections 120 and 130 are divided into multiple cleaning blocks 103 by the notches 102. In this case, the rigidity of the cleaning surface is reduced, and each cleaning block 103 becomes independently deformable. Therefore, when the cleaning surface contacts the lower surface of the substrate W, the cleaning sections 120 and 130 elastically deform due to the load generated on them. Consequently, even if the substrate W is deformed, such as warping or bending, it becomes easier to make the cleaning surface contact the lower surface of the substrate W as a whole, following the shape of the substrate W, when cleaning the substrate W.

[0042] Furthermore, due to the elastic deformation of the cleaning sections 120 and 130, each cleaning block 103 and the adjacent cleaning block 103 come into contact with each other. This prevents any gaps between adjacent cleaning blocks 103 that do not come into contact with the underside of the substrate W. As a result, it becomes possible to clean the underside of the substrate W without leaving any contaminants on the underside of the substrate W. Consequently, the underside of the substrate W can be cleaned efficiently.

[0043] The notch 102 may have a width that prevents the cleaning solution from passing through the substrate W. Alternatively, the width of the notch 102 may be 1 mm or less. In these cases, it is more reliably prevented that there will be areas between adjacent cleaning blocks 103 that do not come into contact with the substrate W. This allows the substrate W to be cleaned more efficiently.

[0044] The notches 102 may be formed in a grid pattern on the cleaning surface. Alternatively, the notches 102 may be formed radially on the cleaning surface. In this case, when cleaning the substrate W, the shape of the cleaning surface can be more appropriately deformed to follow the shape of the substrate W. In particular, in this example, the notches 102 are formed in a grid pattern on the cleaning surface of the cleaning section 120 which extends in one direction, and are formed radially on the cleaning surface of the cleaning section 130 which has an annular shape. In this case, when cleaning the substrate W, the shape of the cleaning surfaces of the cleaning sections 120 and 130 can be more appropriately deformed to follow the shape of the substrate W.

[0045] As described above, in this example, since notches 102 are formed on the cleaning surfaces of the cleaning sections 120 and 130, the cleaning sections 120 and 130 can be brought into more sufficient contact with the underside of the substrate W. Furthermore, when cleaning the underside of the substrate W, the substrate cleaning brush 100 is rotated, so that a large area can be cleaned while reducing the contact area between the underside of the substrate W and the substrate cleaning brush 100. Therefore, even when the load applied to the substrate cleaning brush 100 is relatively small, sufficient load is applied for the cleaning surface of the substrate cleaning brush 100 to come into contact with the underside of the substrate W. This allows for more efficient cleaning of the underside of the substrate W.

[0046] (5) Reference example The differences between the reference example substrate cleaning brush and the substrate cleaning brush 100 according to this embodiment will be explained. Figure 9 is a plan view of the reference example substrate cleaning brush. As shown in Figure 9, the reference example substrate cleaning brush 500 includes a base portion 510 and cleaning portions 520 and 530.

[0047] The base portion 510 has the same configuration as the base portion 110 in Figure 3. Therefore, a center point 501 is defined in the base portion 510. In addition, multiple through holes 511, multiple through holes 512, and multiple through holes 513 are formed in the base portion 510. The through holes 511 have the same configuration as the through holes 111 in Figure 3. The through holes 512 have the same configuration as the through holes 112 in Figure 3. The through holes 513 have the same configuration as the through holes 113 in Figure 3.

[0048] The cleaning sections 520 and 530 have the same configuration as the cleaning sections 120 and 130 in Figure 3, respectively, except that the notches 102 are not formed. The width of the cleaning section 520 in the substrate cleaning brush 500 is greater than the width of the cleaning section 120. The brush unit is formed when the substrate cleaning brush 500 is attached to the brush base 200 in Figure 1.

[0049] Figure 10 is a schematic diagram showing the cleaning process of the central region of the lower surface of the substrate W using the substrate cleaning brush 500 shown in Figure 9. As shown in Figure 10, with the substrate cleaning brush 500 in contact with the central region of the lower surface of the substrate W, the brush unit including the substrate cleaning brush 500 is rotated around a vertical axis passing through the center point 501. In this case, similar to the substrate cleaning brush 100 in Figure 3, contaminants adhering to the central region of the lower surface of the substrate W are removed.

[0050] However, the substrate W may warp. Also, deformation may occur in the substrate W when the cleaning surfaces of the cleaning sections 520 and 530 come into contact with the central region of the lower surface of the substrate W. Here, since no notches are formed in the cleaning surfaces of the cleaning sections 520 and 530, the rigidity of the cleaning surfaces of the cleaning sections 120 and 130 is not reduced.

[0051] In this case, as shown by the thick dotted line in Figure 10, a portion of the cleaning surface of the cleaning section 520, 530 comes into contact with the central region of the lower surface of the substrate W, and as shown by the thick dashed line in Figure 10, the cleaning surface of the cleaning section 520, 530 is separated from the central region of the lower surface of the substrate W. Therefore, the central region of the lower surface of the substrate W cannot be cleaned efficiently, and some of the contaminants remain in the central region of the lower surface of the substrate W.

[0052] Figure 11 is a schematic diagram showing the cleaning process of the lower outer region of the substrate W using the substrate cleaning brush 500 shown in Figure 9. As shown in Figure 11, with the substrate cleaning brush 500 in contact with the lower outer region of the substrate W, the brush unit including the substrate cleaning brush 500 is rotated around a vertical axis passing through the center point 501. The substrate W is also rotated by the substrate holding device. In this case, similar to the substrate cleaning brush 100 in Figure 3, contaminants adhering to the lower outer region of the substrate W are removed.

[0053] However, warping may occur in the substrate W. Also, deformation may occur in the substrate W when the cleaning surfaces of the cleaning sections 520 and 530 come into contact with the outer region of the lower surface of the substrate W. Here, since no notches are formed in the cleaning surfaces of the cleaning sections 520 and 530, the rigidity of the cleaning surfaces of the cleaning sections 120 and 130 is not reduced.

[0054] In this case, as shown by the thick dotted line in Figure 11, a portion of the cleaning surface of the cleaning section 520, 530 comes into contact with the lower outer region of the substrate W, and as shown by the thick dashed line in Figure 11, the cleaning surface of the cleaning section 520, 530 is separated from the lower outer region of the substrate W. Therefore, the lower outer region of the substrate W cannot be cleaned efficiently, and some of the contaminants remain in the lower outer region of the substrate W.

[0055] (6) Examples and Comparative Examples In the following Examples 1 and 2 and Comparative Example, the deformability of the cleaning surface of the substrate cleaning brush was evaluated. Specifically, in Example 1, a specified load was applied to the cleaning surfaces of the cleaning sections 120 and 130 of the substrate cleaning brush 100 shown in Figure 3 using a push-pull gauge. The amount of deformation of multiple parts centered on the load application area was measured using a laser displacement meter, and the average value of these measurements was taken as the amount of deformation of the load application area.

[0056] In Example 2, the same measurements as in Example 1 were performed on a different substrate cleaning brush 100 than in Example 1. Figure 12 is a plan view of the substrate cleaning brush 100 according to Example 2. The substrate cleaning brush 100 according to Example 2 in Figure 12 differs from the substrate cleaning brush 100 according to Example 1 in Figure 3 in the following respects: The area S of each cleaning block 103 in Example 2 is larger than the area S of each cleaning block 103 in Example 1.

[0057] Specifically, the spacing between the multiple cuts 102 in Example 2 is greater than the spacing between the multiple cuts 102 in Example 1. Also, the width of the cleaning section 120 in Example 2 is greater than the width of the cleaning section 120 in Example 1. Furthermore, in Example 2, no cuts 102 are formed in the cleaning section 120 parallel to the direction in which the cleaning section 120 extends through the center point 101.

[0058] In the comparative example, the substrate cleaning brush 500 shown in the reference example of Figure 9 was measured in the same manner as in Example 1. The width of the cleaning section 520 in the comparative example is the same as the width of the cleaning section 120 in Example 2.

[0059] Figure 13 is a graph showing the measurement results of the deformation of the cleaning surfaces of cleaning sections 120 and 130 in Example 1. Figure 14 is a graph showing the measurement results of the deformation of the cleaning surfaces of cleaning sections 120 and 130 in Example 2. Figure 15 is a graph showing the measurement results of the deformation of the cleaning surfaces of cleaning sections 520 and 530 in the comparative example. In Figures 13 to 15, the horizontal axis shows the applied load in units of g-force, and the vertical axis shows the measured deformation in units of mm. In Figures 13 to 15, the white bars show the measurement results for cleaning section 120 or cleaning section 520, and the bars with hatching patterns show the measurement results for cleaning section 130 or cleaning section 530.

[0060] As shown in Figure 13, in Example 1, the deformation of the cleaning surface of the cleaning sections 120 and 130 per applied load is large. Also, as shown in Figure 14, in Example 2, the deformation of the cleaning surface of the cleaning sections 120 and 130 per applied load is relatively large. On the other hand, as shown in Figure 15, in the comparative example, the deformation of the cleaning surface of the cleaning sections 520 and 530 per applied load is relatively small.

[0061] From the comparison results between Examples 1 and 2 and the comparative example, it was confirmed that forming notches 102 on the cleaning surfaces of the cleaning sections 120 and 130 reduces the rigidity of the cleaning surfaces of the cleaning sections 120 and 130. Furthermore, from the comparison results between Example 1 and Example 2, it was confirmed that reducing the area S of the cleaning block 103 further reduces the rigidity of the cleaning surfaces of the cleaning sections 120 and 130.

[0062] 2. Second Embodiment (1) Configuration of the circuit board cleaning device As a second embodiment, the detailed configuration of a substrate cleaning apparatus including the substrate cleaning brush 100 according to the first embodiment will be described. Figure 16 is a schematic plan view of the substrate cleaning apparatus according to the second embodiment of the present invention. Figure 17 is an external perspective view showing the internal configuration of the substrate cleaning apparatus 1 of Figure 16. In the substrate cleaning apparatus 1 according to this embodiment, the X, Y, and Z directions are defined as mutually orthogonal to clarify the positional relationship. In Figure 16 and subsequent figures, the X, Y, and Z directions are indicated by arrows as appropriate. The X and Y directions are mutually orthogonal in the horizontal plane, and the Z direction corresponds to the vertical direction.

[0063] As shown in Figure 16, the substrate cleaning apparatus 1 comprises upper holding devices 10A, 10B, lower holding device 20, base device 30, transfer device 40, bottom surface cleaning device 50, cup device 60, top surface cleaning device 70, end surface cleaning device 80, and opening / closing device 90. These components are housed within the unit housing 2. In Figure 17, the unit housing 2 is shown by a dotted line.

[0064] The unit housing 2 has a rectangular bottom surface 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom surface 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall 2b. This opening is the loading / unloading port 2x for the substrate W and is used when loading and unloading the substrate W into and out of the unit housing 2. In Figure 17, the loading / unloading port 2x is shown by a thick dotted line. In the following description, the direction in the Y direction from inside the unit housing 2 through the loading / unloading port 2x toward the outside of the unit housing 2 (the direction from side wall 2c toward side wall 2b) will be called the front, and the opposite direction (the direction from side wall 2b toward side wall 2c) will be called the rear.

[0065] An opening / closing device 90 is provided in the area where the loading / unloading port 2x is formed on the side wall portion 2b and in the vicinity thereof. The opening / closing device 90 includes a shutter 91 configured to open and close the loading / unloading port 2x, and a shutter drive unit 92 that drives the shutter 91. In Figure 17, the shutter 91 is shown by a thick dashed line. The shutter drive unit 92 drives the shutter 91 to open the loading / unloading port 2x when a substrate W is loaded into and unloaded from the substrate cleaning device 1. The shutter drive unit 92 also drives the shutter 91 to close the loading / unloading port 2x when the substrate W is being cleaned in the substrate cleaning device 1.

[0066] A base device 30 is provided in the center of the bottom surface 2a. The base device 30 includes a linear guide 31, a movable base 32, and a base drive unit 33. The linear guide 31 includes two rails and is provided to extend in the Y direction from the vicinity of the side wall 2b to the vicinity of the side wall 2c in a plan view. The movable base 32 is provided to be movable in the Y direction on the two rails of the linear guide 31. The base drive unit 33 includes, for example, a pulse motor and moves the movable base 32 in the Y direction on the linear guide 31.

[0067] A lower holding device 20 and a lower surface cleaning device 50 are arranged on the movable base 32 so as to be aligned in the Y direction. The lower holding device 20 includes a suction holding unit 21 and a suction holding drive unit 22. The suction holding unit 21 is a so-called spin chuck, and has a circular suction surface capable of suction holding the lower surface of the substrate W, and is configured to be rotatable around an axis extending in the vertical direction (axis in the Z direction). In Figure 16, the outline of the substrate W held by the lower holding device 20 is shown by a dashed line.

[0068] The suction holding drive unit 22 includes a motor. The motor of the suction holding drive unit 22 is mounted on a movable base 32 such that its rotation shaft protrudes upward. The suction holding unit 21 is attached to the upper end of the rotation shaft of the suction holding drive unit 22. A suction path for adsorbing and holding the substrate W in the suction holding unit 21 is formed on the rotation shaft of the suction holding drive unit 22. This suction path is connected to an air intake device (not shown). The suction holding drive unit 22 rotates the suction holding unit 21 around the rotation shaft.

[0069] A transfer device 40 is provided on the movable base 32 near the lower holding device 20. The transfer device 40 includes a plurality of support pins 41 (three in this example), a pin connecting member 42, and a pin lifting drive unit 43. The pin connecting member 42 is formed to surround the suction holding unit 21 in a plan view and connects the plurality of support pins 41. The plurality of support pins 41 are connected to each other by the pin connecting member 42 and extend upward from the pin connecting member 42 for a certain length. The pin lifting drive unit 43 raises and lowers the pin connecting member 42 on the movable base 32. As a result, the plurality of support pins 41 move up and down relative to the suction holding unit 21.

[0070] The bottom cleaning device 50 includes a brush unit 300, two liquid nozzles 52, a gas ejection unit 53, a lifting support unit 54, a moving support unit 55, a bottom brush rotation drive unit 55a, a bottom brush lifting drive unit 55b, and a bottom brush moving drive unit 55c. The moving support unit 55 is provided so as to be movable in the Y direction relative to the lower holding device 20 within a certain area on the movable base 32. As shown in Figure 17, the lifting support unit 54 is provided so as to be movable up and down on the moving support unit 55. The lifting support unit 54 has an upper surface 54u that is inclined diagonally downward in the direction away from the suction holding unit 21 (rearward in this example).

[0071] The brush unit 300 includes a substrate cleaning brush 100 according to the first embodiment and a brush base 200. As shown in Figure 16, the brush unit 300 is attached to the upper surface 54u of the lifting support 54 such that the substrate cleaning brush 100 faces upward and is rotatable around an axis that extends vertically through the center point 101 (Figure 3) of the base portion 110. The area of ​​the base portion 110 of the substrate cleaning brush 100 is larger than the area of ​​the suction surface of the suction holding portion 21.

[0072] Each of the two liquid nozzles 52 is mounted on the upper surface 54u of the lifting support unit 54 so as to be located near the brush unit 300 and with the liquid discharge port facing upward. A bottom surface cleaning liquid supply unit 56 (Figure 18) is connected to the liquid nozzles 52. The bottom surface cleaning liquid supply unit 56 supplies cleaning liquid to the liquid nozzles 52. When the substrate W is being cleaned by the brush unit 300, the liquid nozzles 52 supply the cleaning liquid supplied from the bottom surface cleaning liquid supply unit 56 to the bottom surface of the substrate W. In this embodiment, pure water (deionized water) is used as the cleaning liquid supplied to the liquid nozzles 52. In addition to pure water, carbonated water, ozonated water, hydrogen water, electrolyzed ionized water, SC1 (a mixed solution of ammonia and hydrogen peroxide), or TMAH (tetramethylammonium hydroxide) can also be used as the cleaning liquid supplied to the liquid nozzles 52.

[0073] The gas ejection unit 53 is a slit-shaped gas injection nozzle having a gas outlet extending in one direction. The gas ejection unit 53 is mounted on the upper surface 54u of the lifting support unit 54 such that, in a plan view, it is located between the brush unit 300 and the adsorption holding unit 21 and the gas injection port faces upward. A gas ejection supply unit 57 (Figure 18) is connected to the gas ejection unit 53. The gas ejection supply unit 57 supplies gas to the gas ejection unit 53. In this embodiment, nitrogen gas is used as the gas supplied to the gas ejection unit 53. The gas ejection unit 53 injects the gas supplied from the gas ejection supply unit 57 onto the lower surface of the substrate W when the substrate W is being cleaned by the brush unit 300 and when the lower surface of the substrate W is being dried, as described later. In this case, a strip-shaped gas curtain extending in the X direction is formed between the brush unit 300 and the adsorption holding unit 21. Instead of nitrogen gas, an inert gas such as argon gas or helium gas can be used as the gas supplied to the gas ejection section 53.

[0074] The lower brush rotation drive unit 55a includes a motor having a rotating shaft 400 (Figure 5) and rotates the brush unit 300 when the brush unit 300 cleans the substrate W. This allows the area that can be cleaned by the brush unit 300 to be maintained over a large area.

[0075] The lower brush lifting drive unit 55b includes a stepping motor or air cylinder and moves the lifting support unit 54 up and down relative to the moving support unit 55. The lower brush moving drive unit 55c includes a motor and moves the moving support unit 55 in the Y direction on the movable base 32. Here, the position of the lower holding device 20 on the movable base 32 is fixed. Therefore, when the moving support unit 55 is moved in the Y direction by the lower brush moving drive unit 55c, the moving support unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower cleaning device 50 when it is closest to the lower holding device 20 on the movable base 32 will be called the approach position, and the position of the lower cleaning device 50 when it is furthest from the lower holding device 20 on the movable base 32 will be called the distance position.

[0076] A cup device 60 is further provided in the center of the bottom surface 2a. The cup device 60 includes a cup 61 and a cup drive unit 62. The cup 61 is provided so as to surround the lower holding device 20 and the base device 30 in a plan view and so as to be able to move up and down. In Figure 17, the cup 61 is shown by a dotted line. The cup drive unit 62 moves the cup 61 between a lower cup position and an upper cup position depending on which part of the lower surface of the substrate W the brush unit 300 is cleaning. The lower cup position is a height position where the upper end of the cup 61 is located below the substrate W which is held by the suction holding unit 21. The upper cup position is a height position where the upper end of the cup 61 is located above the suction holding unit 21.

[0077] A pair of upper holding devices 10A and 10B are provided at a height above the cup 61, facing each other with the base device 30 in a plan view. Upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck drive unit 13A, and an upper chuck drive unit 14A. Upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck drive unit 13B, and an upper chuck drive unit 14B.

[0078] The lower chucks 11A and 11B are arranged symmetrically with respect to a vertical plane that extends in the Y direction (front-to-back direction) through the center of the suction holding portion 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A and 11B has two support pieces that can support the lower peripheral edge of the substrate W from below the substrate W. The lower chuck drive units 13A and 13B move the lower chucks 11A and 11B so that they move closer to each other or so that they move away from each other.

[0079] The upper chucks 12A and 12B, like the lower chucks 11A and 11B, are symmetrically arranged with respect to a vertical plane that extends in the Y direction (front-to-back direction) through the center of the suction holding portion 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A and 12B has two holding pieces configured to contact two portions of the outer peripheral edge of the substrate W and hold the outer peripheral edge of the substrate W. The upper chuck drive units 14A and 14B move the upper chucks 12A and 12B so that they move closer to each other, or so that they move away from each other.

[0080] As shown in Figure 16, on one side of the cup 61, an upper surface cleaning device 70 is provided so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0081] The rotating support shaft 71 is supported on the bottom surface 2a by the upper surface cleaning drive unit 74 so as to extend vertically, be able to move up and down, and be rotatable. As shown in Figure 17, the arm 72 is provided above the upper holding device 10B and extends horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is attached to the tip of the arm 72.

[0082] An upper surface cleaning fluid supply unit 75 (Figure 18) is connected to the spray nozzle 73. The upper surface cleaning fluid supply unit 75 supplies cleaning liquid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid and gas supplied from the upper surface cleaning fluid supply unit 75 to generate a mixed fluid, and sprays the generated mixed fluid downwards.

[0083] Furthermore, instead of pure water, the cleaning solution supplied to the spray nozzle 73 can be carbonated water, ozonated water, hydrogen water, electrolyzed ionized water, SC1 (a mixed solution of ammonia and hydrogen peroxide), or TMAH (tetramethylammonium hydroxide). In addition, instead of nitrogen gas, an inert gas such as argon gas or helium gas can be used as the gas supplied to the spray nozzle 73.

[0084] The top surface cleaning drive unit 74 includes one or more pulse motors and air cylinders, etc., and raises and lowers the rotating support shaft 71 and rotates the rotating support shaft 71. With the above configuration, the entire top surface of the substrate W can be cleaned by moving the spray nozzle 73 in an arc shape on the top surface of the substrate W which is held and rotated by the suction holding unit 21.

[0085] As shown in Figure 16, on the other side of the cup 61, an end cleaning device 80 is provided so as to be located near the upper holding device 10A in a plan view. The end cleaning device 80 includes a rotating support shaft 81, an arm 82, a bevel brush 83, and a bevel brush drive unit 84.

[0086] The rotating support shaft 81 is supported on the bottom surface 2a by a bevel brush drive unit 84 so as to extend vertically, be vertically movable, and rotatably. As shown in Figure 17, the arm 82 is provided above the upper holding device 10A and extends horizontally from the upper end of the rotating support shaft 81. A bevel brush 83 is provided at the tip of the arm 82 so as to protrude downward and be rotatable around a vertical axis.

[0087] The bevel brush 83 is formed, for example, from a PVA sponge or a PVA sponge with abrasive particles dispersed in it, and has an inverted truncated cone shape in the upper half and a truncated cone shape in the lower half. With this bevel brush 83, the outer edge of the substrate W can be cleaned with the central portion in the vertical direction of the outer surface.

[0088] The bevel brush drive unit 84 includes one or more pulse motors and air cylinders, etc., and raises and lowers the rotation support shaft 81 and rotates the rotation support shaft 81. With the above configuration, the entire outer edge of the substrate W can be cleaned by bringing the central portion of the outer surface of the bevel brush 83 into contact with the outer edge of the substrate W, which is held and rotated by the suction holding unit 21.

[0089] Here, the bevel brush drive unit 84 further includes a motor built into the arm 82. This motor rotates the bevel brush 83, which is provided at the tip of the arm 82, around a vertical axis. Therefore, when cleaning the outer edge of the substrate W, the rotation of the bevel brush 83 improves the cleaning power of the bevel brush 83 at the outer edge of the substrate W.

[0090] Figure 18 is a block diagram showing the configuration of the control system of the substrate cleaning apparatus 1 shown in Figure 16. The control unit 9 in Figure 18 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read-Only Memory), and a storage device. The RAM is used as the CPU's workspace. The ROM stores the system program. The storage device stores the control program. The operation of each part of the substrate cleaning apparatus 1 is controlled by the CPU executing the substrate cleaning program stored in the storage device on the RAM.

[0091] As shown in Figure 18, the control unit 9 primarily controls the lower chuck drive units 13A, 13B and the upper chuck drive units 14A, 14B to receive the substrate W being brought into the substrate cleaning apparatus 1 and to hold it in a position above the suction holding unit 21. The control unit 9 also primarily controls the suction holding drive unit 22 to hold the substrate W by suction and to rotate the held substrate W.

[0092] Furthermore, the control unit 9 controls the base drive unit 33 to move the movable base 32 relative to the substrate W held by the upper holding devices 10A and 10B. The control unit 9 also controls the pin lifting drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the suction holding unit 21.

[0093] Furthermore, the control unit 9 controls the lower brush rotation drive unit 55a, the lower brush lifting drive unit 55b, the lower brush movement drive unit 55c, the lower cleaning liquid supply unit 56, and the ejected gas supply unit 57 in order to clean the lower surface of the substrate W. In addition, the control unit 9 controls the cup drive unit 62 in order to catch the cleaning liquid that splashes from the substrate W when the substrate W, which is held by the adsorption holding unit 21, is being cleaned in the cup 61.

[0094] Furthermore, the control unit 9 controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 in order to clean the upper surface of the substrate W held by the suction holding unit 21. The control unit 9 also controls the bevel brush drive unit 84 in order to clean the outer peripheral edge of the substrate W held by the suction holding unit 21. In addition, the control unit 9 controls the shutter drive unit 92 in order to open and close the loading / unloading port 2x of the unit housing 2 when the substrate W is loaded into and unloaded from the substrate cleaning device 1.

[0095] (2) Operation of the circuit board cleaning device Figures 19 to 30 are schematic diagrams illustrating an example of the operation of the substrate cleaning apparatus 1 shown in Figure 16. In each of Figures 19 to 30, the top section shows a plan view of the substrate cleaning apparatus 1. The middle section shows a side view of the lower holding device 20 and its surrounding area as seen along the Y direction, and the bottom section shows a side view of the lower holding device 20 and its surrounding area as seen along the X direction. The middle section's side view corresponds to the AA line side view in Figure 16, and the bottom section's side view corresponds to the BB line side view in Figure 16. Note that, in order to facilitate understanding of the shape and operating state of each component in the substrate cleaning apparatus 1, the scaling ratio of some components differs between the top section's plan view and the middle and bottom section's side views. Also, in Figures 19 to 30, the cup 61 is shown by a dashed line, and the outline of the substrate W is shown by a thick dashed line.

[0096] In the initial state before the substrate W is loaded into the substrate cleaning device 1, the shutter 91 of the opening / closing device 90 closes the loading / unloading port 2x. Also, as shown in Figure 16, the lower chucks 11A and 11B are maintained in a state where the distance between the lower chucks 11A and 11B is sufficiently larger than the diameter of the substrate W. Similarly, the upper chucks 12A and 12B are maintained in a state where the distance between the upper chucks 12A and 12B is sufficiently larger than the diameter of the substrate W. The movable base 32 of the base device 30 is positioned such that, in a plan view, the center of the suction holding part 21 is located at the center of the cup 61. The bottom surface cleaning device 50 is positioned in a close position on the movable base 32. The lifting support part 54 of the bottom surface cleaning device 50 is positioned such that the upper end of the brush unit 300 is located below the suction holding part 21. The transfer device 40 has multiple support pins 41 located below the suction holding part 21. Furthermore, in the cup device 60, the cup 61 is in the lower cup position. In the following description, the center position of the cup 61 in a plan view is referred to as the planar reference position rp. Also, the position of the movable base 32 on the bottom surface 2a when the center of the suction holding part 21 is at the planar reference position rp in a plan view is referred to as the first horizontal position.

[0097] A substrate W is loaded into the unit housing 2 of the substrate cleaning device 1. Specifically, immediately before loading the substrate W, the shutter 91 opens the loading / unloading port 2x. Then, as shown by the thick solid arrow a1 in Figure 19, the hand (substrate holding part) RH of a substrate transport robot (not shown) loads the substrate W through the loading / unloading port 2x to a position approximately in the center of the unit housing 2. At this time, the substrate W held by the hand RH is positioned between the lower chuck 11A and upper chuck 12A and the lower chuck 11B and upper chuck 12B, as shown in Figure 19.

[0098] Next, as shown by the thick solid arrow a2 in Figure 20, the lower chucks 11A and 11B move closer to each other so that their multiple support pieces are positioned below the lower peripheral edge of the substrate W. In this state, the hand RH descends and exits through the loading / unloading port 2x. As a result, multiple portions of the lower peripheral edge of the substrate W held by the hand RH are supported by the multiple support pieces of the lower chucks 11A and 11B. After the hand RH exits, the shutter 91 closes the loading / unloading port 2x.

[0099] Next, as shown by the thick solid arrow a3 in Figure 21, the upper chucks 12A and 12B move closer to each other so that multiple holding pieces of the upper chucks 12A and 12B contact the outer peripheral edge of the substrate W. As the multiple holding pieces of the upper chucks 12A and 12B contact multiple parts of the outer peripheral edge of the substrate W, the substrate W supported by the lower chucks 11A and 11B is further held by the upper chucks 12A and 12B. In this way, the center of the substrate W held by the upper holding devices 10A and 10B coincides with or approximately coincides with the planar reference position rp in a planar view. Also, as shown by the thick solid arrow a4 in Figure 21, the movable base 32 moves forward from the first horizontal position so that the suction holding part 21 is shifted by a predetermined distance from the planar reference position rp and the center point 101 (Figure 3) of the brush unit 300 is located at the planar reference position rp. At this time, the position of the movable base 32 located on the bottom surface 2a is called the second horizontal position.

[0100] Next, as shown by the thick solid arrow a5 in Figure 22, the lifting support 54 rises so that the brush unit 300 contacts the central region of the lower surface of the substrate W. Also, as shown by the thick solid arrow a6 in Figure 22, the brush unit 300 rotates (spins) around its vertical axis. As a result, contaminants adhering to the central region of the lower surface of the substrate W are physically removed by the brush unit 300.

[0101] The lower part of Figure 22 shows an enlarged side view within the nozzle where the brush unit 300 contacts the underside of the substrate W. As shown within the nozzle, with the brush unit 300 in contact with the substrate W, the liquid nozzle 52 and the gas ejection section 53 are held in a position close to the underside of the substrate W. At this time, the liquid nozzle 52 discharges cleaning liquid toward the underside of the substrate W at a position near the brush unit 300, as indicated by the white arrow a51. As a result, the cleaning liquid supplied from the liquid nozzle 52 to the underside of the substrate W is guided to the contact area between the brush unit 300 and the substrate W, and contaminants removed from the underside of the substrate W by the brush unit 300 are washed away by the cleaning liquid. Thus, in the underside cleaning device 50, the liquid nozzle 52 is attached to the lifting support section 54 together with the brush unit 300. This allows for efficient supply of cleaning liquid to the cleaning portion of the underside of the substrate W by the brush unit 300. Therefore, the consumption of cleaning liquid is reduced and excessive splashing of cleaning liquid is suppressed.

[0102] Furthermore, when cleaning the underside of the substrate W, the rotation speed of the brush unit 300 is maintained at a speed such that the cleaning liquid supplied from the liquid nozzle 52 to the underside of the substrate W does not splash to the sides of the brush unit 300.

[0103] Here, the upper surface 54u of the lifting support section 54 is inclined diagonally downward in the direction away from the adsorption holding section 21. In this case, when cleaning liquid containing contaminants falls onto the lifting support section 54 from the lower surface of the substrate W, the cleaning liquid received by the upper surface 54u is guided away from the adsorption holding section 21.

[0104] Furthermore, when the brush unit 300 cleans the underside of the substrate W, the gas ejection unit 53 ejects gas toward the underside of the substrate W at a position between the brush unit 300 and the adsorption holding unit 21, as indicated by the white arrow a52 within the ejection port in Figure 22. In this embodiment, the gas ejection unit 53 is mounted on the lifting support unit 54 such that the gas ejection port extends in the X direction. In this case, when gas is ejected from the gas ejection unit 53 to the underside of the substrate W, a strip-shaped gas curtain extending in the X direction is formed between the brush unit 300 and the adsorption holding unit 21. This prevents the cleaning liquid containing contaminants from scattering toward the adsorption holding unit 21 when the brush unit 300 cleans the underside of the substrate W. Therefore, when the brush unit 300 cleans the underside of the substrate W, the cleaning liquid containing contaminants is prevented from adhering to the adsorption holding unit 21, and the adsorption surface of the adsorption holding unit 21 is kept clean.

[0105] In the example shown in Figure 22, the gas ejection unit 53 ejects gas diagonally upward toward the brush unit 300, as indicated by the white arrow a52, but the present invention is not limited to this. The gas ejection unit 53 may also eject gas along the Z direction toward the lower surface of the substrate W.

[0106] Next, in the state shown in Figure 22, once cleaning of the central region of the lower surface of the substrate W is complete, the rotation of the brush unit 300 stops, and the lifting support unit 54 lowers so that the upper end of the brush unit 300 is separated from the substrate W by a predetermined distance. At the same time, the discharge of cleaning liquid from the liquid nozzle 52 to the substrate W stops. At this time, the injection of gas from the gas ejection unit 53 to the substrate W continues.

[0107] Subsequently, as shown by the thick solid arrow a7 in Figure 23, the movable base 32 moves backward so that the adsorption holding unit 21 is positioned at the planar reference position rp. That is, the movable base 32 moves from the second horizontal position to the first horizontal position. At this time, the injection of gas from the gas ejection unit 53 onto the substrate W continues, and the central region of the lower surface of the substrate W is sequentially dried by the gas curtain.

[0108] Next, as shown by the thick solid arrow a8 in Figure 24, the lifting support unit 54 descends so that the brush unit 300 is positioned below the suction surface (upper end) of the suction holding unit 21. Also, as shown by the thick solid arrow a9 in Figure 24, the upper chucks 12A and 12B move away from each other so that the multiple holding pieces of the upper chucks 12A and 12B are separated from the outer edge of the substrate W. At this time, the substrate W is supported by the lower chucks 11A and 11B.

[0109] Subsequently, as shown by the thick solid arrow a10 in Figure 24, the pin connecting member 42 rises so that the upper ends of the multiple support pins 41 are positioned slightly above the lower chucks 11A and 11B. As a result, the substrate W supported by the lower chucks 11A and 11B is received by the multiple support pins 41.

[0110] Next, as shown by the thick solid arrow a11 in Figure 25, the lower chucks 11A and 11B move away from each other. At this time, the lower chucks 11A and 11B move to a position where they do not overlap with the substrate W supported by the multiple support pins 41 in a plan view. As a result, the upper holding devices 10A and 10B both return to their initial state.

[0111] Next, as shown by the thick solid arrow a12 in Figure 26, the pin connecting member 42 descends so that the upper ends of the multiple support pins 41 are positioned below the suction holding part 21. As a result, the substrate W supported on the multiple support pins 41 is received by the suction holding part 21. In this state, the suction holding part 21 holds the central region of the lower surface of the substrate W by suction. In this way, the center of the substrate W held by the lower holding device 20 coincides with or approximately coincides with the planar reference position rp in a planar view. Simultaneously with the descent of the pin connecting member 42 or after the descent of the pin connecting member 42 is completed, the cup 61 rises from the lower cup position to the upper cup position, as shown by the thick solid arrow a13 in Figure 26.

[0112] Next, as shown by the thick solid arrow a14 in Figure 27, the suction holding unit 21 rotates around the vertical axis (the axis of rotation of the suction holding drive unit 22). As a result, the substrate W held by the suction holding unit 21 rotates in a horizontal position.

[0113] Next, the rotating support shaft 71 of the top surface cleaning device 70 rotates and descends. As a result, as shown by the thick solid arrow a15 in Figure 27, the spray nozzle 73 moves to a position above the substrate W, and descends until the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of cleaning liquid and gas onto the top surface of the substrate W. The rotating support shaft 71 also rotates. As a result, as shown by the thick solid arrow a16 in Figure 27, the spray nozzle 73 moves to a position above the rotating substrate W. The mixed fluid is sprayed over the entire top surface of the substrate W, cleaning the entire top surface of the substrate W.

[0114] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotation support shaft 81 of the edge cleaning device 80 also rotates and descends. As a result, the bevel brush 83 moves to a position above the outer edge of the substrate W, as shown by the thick solid arrow a17 in Figure 27. The bevel brush 83 also descends so that the central part of its outer surface contacts the outer edge of the substrate W. In this state, the bevel brush 83 rotates (spins) around its vertical axis. As a result, contaminants adhering to the outer edge of the substrate W are physically removed by the bevel brush 83. The contaminants removed from the outer edge of the substrate W are washed away by the cleaning solution, which is a mixed fluid, sprayed onto the substrate W from the spray nozzle 73.

[0115] Furthermore, when the upper surface of the substrate W is being cleaned by the spray nozzle 73, the lifting support unit 54 rises so that the brush unit 300 contacts the outer lower surface area of ​​the substrate W. Also, as shown by the thick solid arrow a18 in Figure 27, the brush unit 300 may rotate (spin) around its vertical axis. Furthermore, the liquid nozzle 52 discharges cleaning liquid toward the lower surface of the substrate W, and the gas ejection unit 53 ejects gas toward the lower surface of the substrate W. In this state, as shown by the thick solid arrow a19 in Figure 27, the movable support unit 55 moves back and forth between an approaching position and a separated position on the movable base 32. As a result, the outer lower surface area of ​​the substrate W, which is held and rotated by the suction holding unit 21, is cleaned by the brush unit 300 over its entirety.

[0116] Next, once cleaning of the top surface, outer edge, and outer lower surface area of ​​the substrate W is complete, the spraying of the mixed fluid from the spray nozzle 73 to the substrate W is stopped. Also, as shown by the thick solid arrow a20 in Figure 28, the spray nozzle 73 moves to a position on one side of the cup 61 (initial position). Also, as shown by the thick solid arrow a21 in Figure 28, the bevel brush 83 moves to a position on the other side of the cup 61 (initial position). Furthermore, the rotation of the brush unit 300 is stopped, and the lifting support unit 54 lowers so that the upper end of the brush unit 300 is separated from the substrate W by a predetermined distance. Also, the discharge of cleaning liquid from the liquid nozzle 52 to the substrate W and the spraying of gas from the gas ejection unit 53 to the substrate W are stopped. In this state, the adsorption holding unit 21 rotates at high speed, shaking off the cleaning liquid adhering to the substrate W, and the entire substrate W is dried.

[0117] Next, as shown by the thick solid arrow a22 in Figure 29, the cup 61 descends from the upper cup position to the lower cup position. Also, in preparation for the loading of a new substrate W into the unit housing 2, the lower chucks 11A and 11B move closer to each other to a position where they can support the new substrate W, as shown by the thick solid arrow a23 in Figure 29.

[0118] Finally, the substrate W is discharged from the unit housing 2 of the substrate cleaning device 1. Specifically, the shutter 91 opens the input / output port 2x immediately before the substrate W is discharged. Then, as shown by the thick solid arrow a24 in Figure 30, the hand (substrate holding part) RH of a substrate transport robot (not shown) enters the unit housing 2 through the input / output port 2x. Subsequently, the hand RH receives the substrate W on the suction holding part 21 and exits through the input / output port 2x. After the hand RH exits, the shutter 91 closes the input / output port 2x.

[0119] (3) Effects In the substrate cleaning apparatus 1 according to this embodiment, the lower surface of the substrate W, held by the upper holding devices 10A, 10B or the lower holding device 20, is cleaned by the substrate cleaning brush 100 according to the first embodiment. Here, when cleaning the outer region of the lower surface of the substrate W and when cleaning the central region of the lower surface, the substrate cleaning brush 100 is moved to the first and second horizontal positions, respectively. When cleaning the outer region of the lower surface of the substrate W, the substrate W is rotated. This makes it possible to efficiently clean the entire lower surface of the substrate W.

[0120] 3. Other Embodiments (1) In the first embodiment, the substrate cleaning brush 100 is a bottom brush that cleans the bottom surface of the substrate W, but the embodiment is not limited thereto. The substrate cleaning brush 100 may also be a top brush that cleans the top surface of the substrate W.

[0121] (2) In the first embodiment, notches 102 are formed in both the cleaning sections 120 and 130, but the embodiment is not limited thereto. Notches 102 may be formed in the cleaning section 120, but not in the cleaning section 130. Even in this case, the rigidity of the cleaning section of the cleaning section 120 can be reduced. Alternatively, notches 102 may be formed in the cleaning section 130, but not in the cleaning section 120. Even in this case, the rigidity of the cleaning section of the cleaning section 130 can be reduced.

[0122] (3) In the first embodiment, multiple notches 102 are formed on the cleaning surfaces of the cleaning sections 120, 130, 140, and 150, but the embodiment is not limited thereto. As long as the cleaning surfaces of the cleaning sections 120, 130, 140, and 150 are divided into multiple cleaning blocks 103, one notch 102 may be formed on the cleaning surfaces of the cleaning sections 120, 130, 140, and 150.

[0123] 4. Correspondence between each component of the claim and each part of the embodiment The following describes examples of the correspondence between each component of the claims and each element of the embodiments, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0124] In the above embodiment, substrate W is an example of a substrate, substrate cleaning brush 100 is an example of a substrate cleaning brush, notch 102 is an example of a notch, and cleaning sections 120, 130, 140, 150 are examples of cleaning sections. Cleaning block 103 is an example of a cleaning block, center point 101 is an example of a center point, base section 110 is an example of a base section, cleaning section 120 is an example of a first cleaning section, and cleaning section 130 is an example of a second cleaning section. Upper holding devices 10A, 10B or lower holding device 20 are examples of substrate holding sections, substrate cleaning device 1 is an example of a substrate cleaning device, and base drive unit 33 is an example of a moving device.

[0125] 5. Summary of the Embodiments (Article 1) The substrate cleaning brush referred to in Article 1 is A circuit board cleaning brush used for cleaning circuit boards, The cleaning unit has a cleaning surface that can come into contact with the substrate during cleaning, and the cleaning surface has notches formed therein. The cleaning surface is divided into a plurality of cleaning blocks by the cuts, When the cleaning surface comes into contact with the substrate, each cleaning block and the adjacent cleaning block come into contact with each other due to the elastic deformation of the cleaning section.

[0126] In this circuit board cleaning brush, the cleaning surface of the cleaning unit is divided into multiple cleaning blocks by cuts. In this case, the rigidity of the cleaning surface is reduced, and each cleaning block can be deformed independently. Therefore, when the cleaning surface contacts the circuit board, the cleaning unit elastically deforms due to the load generated. Consequently, even if the circuit board is warped or bent, it becomes easier to ensure that the cleaning surface follows the shape of the circuit board and makes overall contact with the circuit board during cleaning.

[0127] Furthermore, due to the elastic deformation of the cleaning section, each cleaning block and the adjacent cleaning block come into contact with each other. This prevents any gaps between adjacent cleaning blocks that do not come into contact with the substrate. As a result, it becomes possible to clean the substrate without leaving any contaminants on it. Consequently, the substrate can be cleaned efficiently.

[0128] (Article 2) In the circuit board cleaning brush described in Article 1, The cut may have a width that prevents the cleaning solution from passing through the substrate.

[0129] In this case, it is more reliably prevented that areas between adjacent cleaning blocks will not come into contact with the substrate during cleaning. This allows for more efficient cleaning of the substrate.

[0130] (Article 3) In the substrate cleaning brush described in Article 1 or Article 2, The width of the aforementioned cut may be 1 mm or less.

[0131] In this case, it is more reliably prevented that areas between adjacent cleaning blocks will not come into contact with the substrate during cleaning. This allows for more efficient cleaning of the substrate.

[0132] (Article 4) In the circuit board cleaning brush described in any one of paragraphs 1 to 3, The notches may be formed in a grid pattern on the cleaning surface.

[0133] In this case, when cleaning the substrate, the shape of the cleaning surface can be more appropriately deformed to conform to the shape of the substrate.

[0134] (Article 5) In the circuit board cleaning brush described in any one of paragraphs 1 to 4, The notches may be formed radially on the cleaning surface.

[0135] In this case, when cleaning the substrate, the shape of the cleaning surface can be more appropriately deformed to conform to the shape of the substrate.

[0136] (Article 6) The circuit board cleaning brush described in any one of paragraphs 1 to 3 is: It further comprises a base section having a central point, The aforementioned cleaning unit is A first cleaning section protrudes from the base portion and extends in one direction through the center point of the base portion in a plan view, It includes a second cleaning section that protrudes from the base and has an annular shape centered on the center point of the base in a plan view, The notch may be formed in at least one of the cleaning surface of the first cleaning section and the cleaning surface of the second cleaning section.

[0137] In this case, since notches are formed in at least one of the cleaning surfaces of the first cleaning section and the second cleaning section, at least one of the cleaning surfaces of the first and second cleaning sections can be brought into more sufficient contact with the substrate. Furthermore, when the substrate cleaning brush is rotated, the area that can be cleaned is kept large while the contact area between the substrate and the substrate cleaning brush is reduced. Therefore, even when the load applied to the substrate cleaning brush is relatively small, sufficient load is applied to make contact between the substrate and the cleaning surface of the substrate cleaning brush. This allows the substrate to be cleaned more efficiently.

[0138] (Item 7) In the circuit board cleaning brush described in Item 6, The notches may be formed in a grid pattern on the cleaning surface of the first cleaning section.

[0139] In this case, when cleaning the substrate, the shape of the cleaning surface of the first cleaning section can be more appropriately deformed to follow the shape of the substrate.

[0140] (Clause 8) In the substrate cleaning brush described in paragraph 6 or 7, The notches may be formed radially on the cleaning surface of the second cleaning section.

[0141] In this case, when cleaning the substrate, the shape of the cleaning surface of the first cleaning section can be more appropriately deformed to follow the shape of the substrate.

[0142] (Paragraph 9) The substrate cleaning apparatus relating to Paragraph 9 is A substrate holding portion for holding the substrate, The system includes a substrate cleaning brush according to any one of the first to eighth paragraphs for cleaning the substrate held by the substrate holding portion.

[0143] In this substrate cleaning apparatus, the substrate held by the substrate holding unit is cleaned by the substrate cleaning brush described above. This allows for efficient cleaning of the substrate.

[0144] (Item 10) The substrate cleaning apparatus described in Item 9 is The system may further include a moving device for moving the substrate cleaning brush between a first horizontal position capable of cleaning the outer lower surface region surrounding the central lower surface region of the substrate, and a second horizontal position capable of cleaning the central lower surface region of the substrate.

[0145] In this case, the entire underside of the circuit board can be cleaned efficiently.

[0146] (Item 11) In the substrate cleaning apparatus described in Item 10, The substrate holding unit may rotate the substrate at least when cleaning the outer lower surface area of ​​the substrate with the substrate cleaning brush.

[0147] In this case, the outer area of ​​the underside of the substrate is cleaned more efficiently. This allows for more efficient cleaning of the entire underside of the substrate. [Explanation of Symbols]

[0148] 1...Substrate cleaning device, 2...Unit housing, 2a...Bottom section, 2b~2e...Side wall section, 2x...Loading / unloading exit, 9...Control unit, 10A, 10B...Upper holding device, 11A, 11B...Lower chuck, 12A, 12B...Upper chuck, 13A, 13B...Lower chuck drive unit, 14A, 14B...Upper chuck drive unit, 20...Lower holding device, 21...Suction holding unit, 22...Suction holding drive unit, 30...Base device, 3 1…Linear guide, 32…Movable base, 33…Base drive unit, 40…Transfer device, 41…Support pin, 42…Pin connecting member, 43…Pin lifting drive unit, 50…Bottom cleaning device, 52…Liquid nozzle, 53…Gas ejection unit, 54…Lifting support unit, 55…Movement support unit, 55a…Bottom brush rotation drive unit, 55b…Bottom brush lifting drive unit, 55c…Bottom brush movement drive unit, 56…Bottom cleaning liquid supply unit, 5 7... Gas ejection supply unit, 60... Cup device, 61... Cup, 62... Cup drive unit, 70... Top surface cleaning device, 71, 81... Rotating support shaft, 72, 82... Arm, 73... Spray nozzle, 74... Top surface cleaning drive unit, 80... End cleaning device, 83... Bevel brush, 84... Bevel brush drive unit, 90... Opening / closing device, 100, 500... Substrate cleaning brush, 101, 501... Center point, 102... Cutout Mi, 103…Cleaning block, 110, 510…Base part, 111~113, 202, 203, 511~513…Through hole, 120, 130, 140, 150, 520, 530…Cleaning part, 200…Brush base, 201, 401…Screw hole, 210…Recess, 220…Inclined part, 300…Brush unit, 310, 320…Screw member, 400…Rotation axis, rp…Planar reference position, W…Substrate

Claims

1. A circuit board cleaning brush used for cleaning circuit boards, A cleaning unit having a cleaning surface that can come into contact with the substrate during cleaning, and having notches formed in the cleaning surface, It comprises a base portion having a central point and the cleaning portion formed thereon, The cleaning surface is a plane parallel to the plane intersecting the axis passing through the center point, and is divided into a plurality of cleaning blocks by the cuts. A substrate cleaning brush wherein, upon contact between the cleaning surface and the substrate, each cleaning block and adjacent cleaning blocks come into contact with each other due to the elastic deformation of the cleaning section.

2. The substrate cleaning brush according to claim 1, wherein the notch has a width that prevents the substrate cleaning solution from passing through.

3. The substrate cleaning brush according to claim 1 or 2, wherein the width of the cut is 1 mm or less.

4. The substrate cleaning brush according to claim 1 or 2, wherein the notches are formed in a grid pattern on the cleaning surface.

5. The substrate cleaning brush according to claim 1 or 2, wherein the notches are formed radially on the cleaning surface.

6. A substrate cleaning brush used for cleaning a substrate, A cleaning unit having a cleaning surface that can come into contact with the substrate during cleaning, and having notches formed in the cleaning surface, It comprises a base having a central point, The cleaning surface is divided into a plurality of cleaning blocks by the cuts, When the cleaning surface and the substrate come into contact, the elastic deformation of the cleaning section causes each cleaning block and the adjacent cleaning block to come into contact with each other. The aforementioned cleaning unit is A first cleaning section protrudes from the base and extends in one direction through the center point of the base in a plan view, It includes a second cleaning section that protrudes from the base and has an annular shape centered on the center point of the base in a plan view, The aforementioned notches are formed in at least one of the cleaning surface of the first cleaning section and the cleaning surface of the second cleaning section, and are substrate cleaning brushes.

7. The substrate cleaning brush according to claim 6, wherein the notches are formed in a grid pattern on the cleaning surface of the first cleaning section.

8. The substrate cleaning brush according to claim 6, wherein the notches are formed radially on the cleaning surface of the second cleaning section.

9. A substrate holding portion for holding the substrate, A substrate cleaning apparatus comprising a substrate cleaning brush according to claim 1, 2, or 6 for cleaning the substrate held by the substrate holding portion.

10. A substrate holding part for holding a substrate, A substrate cleaning brush for cleaning the substrate held by the substrate holding part, The system includes a moving device that moves the substrate cleaning brush between a first horizontal position capable of cleaning the outer lower surface region surrounding the central lower surface region of the substrate, and a second horizontal position capable of cleaning the central lower surface region of the substrate. The aforementioned circuit board cleaning brush is The cleaning unit has a cleaning surface that can come into contact with the substrate during cleaning, and the cleaning surface has notches formed therein. The cleaning surface is divided into a plurality of cleaning blocks by the cuts, A substrate cleaning apparatus wherein, upon contact between the cleaning surface and the substrate, each cleaning block and adjacent cleaning blocks come into contact with each other due to the elastic deformation of the cleaning section.

11. The substrate cleaning apparatus according to claim 10, wherein the substrate holding portion rotates the substrate at least when the substrate cleaning brush cleans the lower outer region of the substrate.

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