Substrate processing apparatus, transport teaching method

Abstract

To enable teaching to be performed without introducing a teaching substrate from outside a substrate processing device.SOLUTION: A substrate processing device has a processing chamber, a transfer robot that transfers substrates to be processed in the processing chamber, a teaching substrate for teaching the position of the substrate to the transfer robot, and a storage location where the teaching substrate is stored.SELECTED DRAWING: Figure 11

Description

Technical Field

[0005]

[0001] The present disclosure relates to a substrate processing apparatus and a transfer teaching method. In the substrate processing apparatus, the substrate is transferred, and the transfer teaching method contributes to the transfer.

Background Art

[0002] For example, in a substrate processing apparatus that processes a substrate by a method commonly called a single wafer method, a transfer robot transfers the substrate into a processing chamber. The substrate processing apparatus includes a processing chamber. In the processing chamber, the substrate is placed at a predetermined position and undergoes a predetermined process. In order to reduce non-uniformity of the process, damage to the substrate during transfer, and the possibility of attachment of unnecessary particles, it is desirable to accurately place the substrate at a predetermined position.

[0003] As one of the maintenance of the processing chamber, for example, a mechanism that supports the substrate during processing, such as a chuck that grips the substrate from the side, is replaced. For example, due to a positioning error when attaching the chuck to be replaced, the replaced chuck is not necessarily attached at the same position as the chuck before replacement. It is desirable that the transfer robot accurately place the substrate on the chuck so that the chuck after replacement also accurately grips the substrate.

[0004] In order to accurately place the substrate by the transfer robot, teaching about the transfer and placement of the substrate is performed. Teaching about the transfer robot is disclosed in, for example, Patent Documents 1, 2, and 3 below. For example, instead of the substrate to be processed, the transfer robot holds a teaching substrate (hereinafter referred to as the "teaching substrate"), and teaching data is created.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Patent Document 3

[0006] Let's consider a scenario where a transport robot is instructed to hold a teaching board for the purpose of teaching the processing room to be maintained. In this case, for the operator to have the transport robot hold the teaching board, the operator needs to enter the path in which the transport robot will move.

[0007] This disclosure has been made in view of the above-mentioned problems, and aims to provide a technology that enables teaching without introducing a teaching substrate from outside the substrate processing device. [Means for solving the problem]

[0008] A substrate processing apparatus according to the first embodiment comprises a processing chamber, a transport robot for transporting substrates to be processed in the processing chamber, a teaching substrate for teaching the transport robot the position of the substrates, and a storage location for storing the teaching substrate. The teaching substrate has a first sensor and a second sensor. The first sensor detects the position of the teaching substrate in a first direction parallel to the normal direction of the substrate placed in the processing chamber and outputs the result of the detection. The second sensor detects the position of the teaching substrate in a plane perpendicular to the first direction and outputs the result of the detection. The teaching substrate further has conductive pins to which the outputs from the first sensor and the second sensor are transmitted. The transport robot has a hand that supports the substrate, a wall provided on the hand, a pusher that moves toward the substrate to press the substrate against the wall and hold the substrate, and moves away from the substrate to release the hold on the substrate, and a conductor provided on the pusher that contacts and conducts with the pins when the teaching substrate is held by the transport robot.

[0011] The 2 The substrate processing apparatus according to the embodiment is the 1 A substrate processing apparatus according to the embodiment thereof, wherein the teaching substrate further includes an amplifier that amplifies the outputs from the first sensor and the second sensor and transmits them to the pins.

[0012] The 3 The transport teaching method relating to the manner is the 1 A substrate processing apparatus according to the embodiment of the above. A method of transport and teaching by The transport robot comprises a first step of taking out and holding the teaching substrate from the storage location, and a second step of teaching the position of the substrate in a first direction based on the output of the first sensor and teaching the position of the substrate on the surface based on the output of the second sensor.

[0013] The 4The transfer instruction method according to the aspect is the 3 instruction method according to the aspect, wherein a plurality of processing chambers are provided, and the second step for one of the processing chambers is performed in parallel with the processing on the substrate in the processing chamber that is not the target for which the second step is to be executed.

Effects of the Invention

[0014] The substrate processing apparatus according to the first aspect can execute instructions without introducing an instruction substrate from outside the substrate processing apparatus.

[0015] The 1 substrate processing apparatus according to the aspect can execute instructions in a first direction parallel to the normal direction of the substrate and instructions in a plane perpendicular to the first direction.

[0016] The 1 outputs from the first sensor and the second sensor of the instruction substrate are transmitted to the transfer robot in the substrate processing apparatus according to the aspect.

[0017] The 2 outputs from the first sensor and the second sensor are amplified and transmitted to a conductor in the substrate processing apparatus according to the aspect.

[0018] The 3 transfer instruction method according to the aspect can execute instructions without introducing an instruction substrate from outside the substrate processing apparatus.

[0019] The 4 transfer instruction method according to the aspect contributes to speeding up the processing of the entire substrate processing apparatus.

Brief Description of the Drawings

[0020] [Figure 1] It is a plan view schematically showing an example of the configuration of a substrate processing apparatus. [Figure 2] It is a side view schematically showing an example of the configuration of a substrate processing apparatus. [Figure 3]This is a functional block diagram that schematically shows an example of the internal configuration of the control unit. [Figure 4] This is a plan view illustrating the positional relationship between a transport robot and a substrate held by the transport robot. [Figure 5] This is a side view illustrating a hand. [Figure 6] This is a side view illustrating a pusher. [Figure 7] This is a plan view illustrating the configuration of a teaching circuit board. [Figure 8] This is a side view illustrating the positional relationship between the pusher and the plate. [Figure 9] This is a plan view illustrating the positional relationship between the connector and the conductive terminal. [Figure 10] This is a plan view illustrating the positional relationship between the connector and the conductive terminal. [Figure 11] This is a side view illustrating the indexer section, the transfer section, and the transport section. [Figure 12] This is a plan view illustrating the configuration of a target wafer. [Figure 13] This is a side view showing the target wafer in a held position. [Figure 14] This is a cross-sectional view showing the stage and the chuck. [Figure 15] This is a perspective view showing the substrate mounting area and the target for the mounting area. [Figure 16] This flowchart illustrates the sequence in which maintenance, teaching, and board transport are performed. [Figure 17] This is a flowchart showing a specific example of Step S15. [Figure 18] This is a flowchart showing a specific example of step S151. [Figure 19] This is a cross-sectional view illustrating the positional relationship between the teaching substrate and the columnar body. [Figure 20] This is a cross-sectional view illustrating the positional relationship between the teaching substrate and the columnar body. [Figure 21] This is a cross-sectional view illustrating the positional relationship between the teaching substrate and the columnar body. [Figure 22]This is a cross-sectional view illustrating the positional relationship between the teaching substrate and the columnar body. [Figure 23] This is a cross-sectional view illustrating the positional relationship between the teaching substrate and the columnar body. [Figure 24] This is a cross-sectional view illustrating the positional relationship between the teaching substrate and the columnar body. [Figure 25] This is a flowchart showing a specific example of step S152. [Figure 26] This is a flowchart showing a specific example of step S152A. [Figure 27] This is a cross-sectional view illustrating the positional relationship between the teaching substrate and the columnar body. [Figure 28] This is a cross-sectional view illustrating the positional relationship between the teaching substrate and the columnar body. [Figure 29] This is a plan view illustrating the positional relationship between the teaching substrate, the columnar body, and the recess. [Figure 30] This is a flowchart showing a specific example of step S152B. [Figure 31] This is a plan view illustrating the movement of the teaching board during R-axis teaching and Θ-axis teaching. [Figure 32] This is a flowchart showing a specific example of step S152C. [Modes for carrying out the invention]

[0021] The embodiments of this disclosure will be described below with reference to the attached drawings. The components described in each embodiment are for illustrative purposes only, and this does not mean that the scope of this disclosure is limited to illustrative purposes only. The drawings are for illustrative purposes only. In the drawings, the dimensions and number of parts may be exaggerated or simplified as necessary to facilitate understanding. In the drawings, parts having similar configurations and functions are denoted by the same reference numerals, and redundant explanations are omitted as appropriate.

[0022] In this specification, expressions indicating relative or absolute positional relationships (e.g., "parallel," "orthogonal," "centered"), unless otherwise specified, describe not only the precise positional relationship but also a state including tolerances, as well as a state where relative displacement in terms of angle or distance is achieved within a range where comparable functionality is attained. Expressions indicating that two or more things are equivalent (e.g., "identical," "equal," "homogeneous"), unless otherwise specified, describe not only a state where things are quantitatively exactly equivalent but also a state where tolerances or differences exist that allow for comparable functionality to be attained.

[0023] Unless otherwise specified, expressions describing shapes (for example, "square shape" or "cylindrical shape") shall not only represent geometrically precise shapes but also shapes with features such as concaves or chamfers, to the extent that a similar effect can be achieved.

[0024] Expressions such as "to possess," "to be equipped with," "to have," "to include," or "to have" a single component are not exclusive expressions that exclude the existence of other components.

[0025] Unless otherwise specified, the term "connected" includes not only the state in which two elements are in contact, but also the state in which two elements are separated by another element.

[0026] <1. Overview of substrate processing equipment> Figure 1 is a schematic plan view showing an example of the configuration of a substrate processing apparatus 700. The substrate processing apparatus 700 is a single-wafer processing apparatus that processes substrates W one at a time. For example, the substrate W is a roughly disc-shaped semiconductor substrate.

[0027] For convenience, the following explanation will introduce a right-handed XYZ coordinate system. The Z direction is vertically upward, and the -Z direction is vertically downward. Figure 1 is a plan view along the -Z direction.

[0028] -The X direction is the opposite direction to the X direction. -The Y direction is the opposite direction to the Y direction.

[0029] Furthermore, the substrate W is not necessarily limited to a semiconductor substrate. For example, various substrates such as photomask glass substrates, liquid crystal display glass substrates, plasma display glass substrates, FED (Field Emission Display) substrates, optical disc substrates, magnetic disc substrates, and magneto-optical disc substrates can be applied to the substrate W. Also, the shape of the substrate is not limited to a disc shape, but can be various shapes such as a rectangular plate shape.

[0030] The substrate processing apparatus 700 comprises a load port 5, an indexer section 2, a processing section 3, a transfer section 4, and a transport section 6. The load port 5, the indexer section 2, and the processing section 3 are arranged in this order along the X direction. The indexer section 2, the transfer section 4, and the transport section 6 are arranged in this order along the X direction.

[0031] The substrate processing apparatus 700 includes a control unit 79 located below the indexer section 2 (towards the -Z direction). The control unit 79 comprehensively controls the operation of the components of the substrate processing apparatus 700 outside of the control unit 79.

[0032] Figure 2 is a schematic side view showing an example of the configuration of the substrate processing apparatus 700. Figure 2 is a plan view along the Y direction. The substrate processing apparatus 700 is equipped with a graphic user interface 20 on the -Y direction side of the indexer section 2. The graphic user interface 20 has the function of performing input and output between the control unit 79 and the operator.

[0033] The processing section 3 has multiple towers 30, for example, four. In plan view, the four towers 30 are arranged around the transport section 6. Each tower 30 has multiple chambers 31, for example, three, stacked in the Z direction. The chambers 31 function as processing chambers for processing the substrate W.

[0034] Multiple carriers C, for example four, are loaded into the load port 5. The carriers C may include FOUP (Front Opening Unified Pod), SMIF (Standard Mechanical Interface) pods that enclose the substrate W in a sealed space, or OC (Open Cassette) that exposes the substrate W to the outside air.

[0035] The substrate processing apparatus 700 includes an indexer robot 9. The indexer robot 9 moves mainly in the X direction, -X direction, Y direction, and -Y direction in the indexer section 2 and the transfer section 4.

[0036] The indexer robot 9 has the function of holding the substrate W. The indexer robot 9 transports the substrate W between itself and the carrier C in the indexer section 2. The indexer robot 9 transports the substrate W between itself and the transport robot 8 in the transfer section 4. The indexer robot 9 has the function of rotating around a rotation axis CA2 parallel to the Z direction.

[0037] The substrate processing apparatus 700 includes a transport robot 8. The transport robot 8 has the function of holding the substrate W. The transport robot 8 moves mainly in the X direction and -X direction in the transfer section 4. The transport robot 8 transports the substrate W between itself and the indexer robot 9 in the transfer section 4. The transport robot 8 has the function of rotating around a rotation axis CA1 parallel to the Z direction.

[0038] The transport robot 8 has the function of moving in the XY plane within the transport section 6. The transport robot 8 transports the substrate W between each of the chambers 31.

[0039] The transport robot 8 receives the substrates W to be processed from the indexer robot 9 and places them into one of the chambers 31. The transport robot 8 also unloads the processed substrates W from the chamber 31 and hands them over to the indexer robot 9.

[0040] Figure 3 is a functional block diagram schematically showing an example of the internal configuration of the control unit 79. The control unit 79 is an electronic circuit and includes, for example, a data processing unit 791 and a storage medium 792. In the specific example shown in Figure 3, the data processing unit 791 and the storage medium 792 are interconnected via a bus 793.

[0041] The data processing unit 791 is, for example, an arithmetic processing unit such as a CPU (Central Processor Unit). The storage medium 792 includes, for example, a non-temporary storage medium (e.g., ROM (Read Only Memory) or hard disk) 792a and a temporary storage medium (e.g., RAM (Random Access Memory)) 792b. The non-temporary storage medium 792a stores, for example, a program that defines the processing to be performed by the control unit 79. By executing this program, the data processing unit 791 executes the processing defined in the program. For example, part or all of the processing performed by the control unit 79 is performed by hardware.

[0042] In the specific example shown in Figure 3, an indexer robot 9, a transport robot 8, and a plurality of chambers 31 are schematically shown as an example in which they are connected to the bus 93.

[0043] For example, a host computer 500 is connected to bus 793 from outside the board processing unit 700. For example, the host computer 500 is operated by a user. For example, the above program or instructions from the user are provided from the host computer 500 to the control unit 79. For example, the operating status of the board processing unit 700 is provided from the control unit 79 to the host computer 500, and the operating status is presented to the user.

[0044] <2. Configuration of the teaching board> Figure 4 is a plan view illustrating the positional relationship between the transport robot 8 and the substrate W held by the transport robot 8. Figure 4 is a plan view along the -Z direction. To improve visibility, the held substrate W is depicted with a dashed line.

[0045] The transport robot 8 has the function of rotating around a rotation axis CA1 (see Figure 1) parallel to the Z direction. From this perspective, a unique coordinate system is set for the transport robot 8. Specifically, a left-handed RΘZ coordinate system is adopted.

[0046] The Z direction in the RΘZ coordinate system is parallel to the Z direction in the XYZ coordinate system described above. The direction obtained by rotating 90 degrees counterclockwise from the R direction along the Z direction is parallel to the Θ direction. The -R direction is the opposite direction to the R direction. The -Θ direction is the opposite direction to the Θ direction.

[0047] The transport robot 8 has hands 81 and 82, a pusher 84, and a support section 80. Hand 81 is located on the Θ side relative to hand 82. Hands 81 and 82 extend substantially parallel to the R direction and are fixed to the support section 80.

[0048] The support portion 80 supports the pusher 84 while restricting its movement in the Θ and Z directions.

[0049] Figure 5 is a side view illustrating the hand 81. Figure 6 is a side view illustrating the pusher 84. Both Figures 5 and 6 are side views taken along the Θ direction.

[0050] Walls 801a and 801b are provided on hand 81. Walls 802a and 802b are provided on hand 82. The positions of walls 801a, 801b, 802a, and 802b in the Z direction are approximately the same. Walls 801a, 801b, 802a, and 802b function as guides to position the end faces of the substrate W.

[0051] The pusher 84 has the function of moving in the R direction and the -R direction. The pusher 84 extends substantially parallel to the R direction side. The R-direction end of the pusher 84 is provided with a protrusion 85 and a conductive end 83. The conductive end 83 is conductive and exchanges signals with the control unit 79 via wiring (not shown) that passes through the support part 80 (see Figure 3).

[0052] A wall 85d is provided on the protrusion 85. The positions of walls 85d, 801a, 801b, 802a, and 802b in the Z direction are almost identical. When the transport robot 8 holds the substrate W, the pusher 84 moves in the R direction, and wall 85d pushes the substrate W in the R direction. As a result, the substrate W is held by at least walls 801a, 802a, and 52, or further by walls 801b and 802b. The holding of the substrate W by walls 85d, 801a, 802a, or further by walls 801b and 802b can be said to be the holding of the substrate W by hands 81 and 82 and pusher 84, and by extension, the holding of the substrate W by the transport robot 8.

[0053] The holding of the substrate W by the transport robot 8 means fixing the substrate W in the RΘ plane, which is parallel to both the R and Θ directions. However, this holding does not necessarily mean fixing the substrate in the Z direction. When the transport robot 8 releases its hold on the substrate W, the pusher 84 moves in the -R direction.

[0054] The conductive end 83 is located on the -Z side of the protrusion 85, and does not come into contact with the substrate W held by the hands 81, 82 and pusher 84. When the transport robot 8 holds the substrate W, the conductive end 83 does not necessarily function.

[0055] Figure 7 is a plan view illustrating the configuration of the teaching substrate 100. Figure 7 is a plan view along the -Z direction. In the process of teaching the position of the substrate W, the teaching substrate 100 is held by the transport robot 8, more specifically by hands 81, 82 and pushers 84, and even more specifically by walls 85d, 801a, 801b, 802a, and 802b. In Figure 7, for improved visibility, hands 81, 82 and pushers 84 are depicted with dashed lines.

[0056] The teaching substrate 100 has a sensing function that outputs information about its positional relationship with the target object (described later). Due to this function and the fact that it is held by the transport robot 8, similar to the substrate W, the teaching substrate 100 is sometimes referred to as a sensing wafer.

[0057] In this embodiment, the teaching board 100 includes sensors 101 and 102, a connector 104, and a board 105. For example, the teaching board 100 further includes an amplifier 103.

[0058] The edges of the plate 105 are guided and positioned by the walls 801a, 801b, 802a, and 802b. In this embodiment, the plate 105 is exemplified as having a shape that does not protrude from the hand 81 in the Θ direction and does not protrude from the hand 82 in the -Θ direction.

[0059] Sensors 101 and 102, amplifier 103, and connector 104 are mounted on board 105. Sensors 101 and 102 transmit their respective outputs to connector 104, either directly or indirectly via amplifier 103.

[0060] Sensor 101 is used to measure position in the Z direction. Specifically for the substrate W, sensor 101 is used to detect the position of the teaching substrate 100 in a direction parallel to the normal direction of the substrate W when it is placed in the chamber 31.

[0061] The sensor 101 includes, for example, a light emitter 101a and a light receiver 101b. The light emitter 101a and the light receiver 101b are both mounted, for example, on the -Z-direction side surface 105b of the plate 105. In this embodiment, the sensor 101 has the function of being ON when the light receiver 101b receives light L1 (see Figures 19, 21, 23, and 24 described later) emitted from the light emitter 101a, and OFF when it does not receive light. More specifically, the OFF state when light L1 is blocked between the light emitter 101a and the light receiver 101b, and the ON state when the light receiver 101b receives light L1, are output from the sensor 101 in the form of signals as a result of position detection.

[0062] Sensor 102 is used to measure position in the R and Θ directions. In relation to the substrate W, sensor 102 is used to detect the position of the teaching substrate 100 on a plane parallel to the substrate W when it is placed in the chamber 31 (which can also be said to be a plane perpendicular to the Z direction).

[0063] Sensor 102 is, for example, a limited reflection type photoelectric sensor that detects the presence or absence of an object on the -Z direction side of plate 105. For example, sensor 102 is installed by penetrating plate 105.

[0064] In this embodiment, the sensor 102 has a function that turns ON when it receives the light L2 it emits (see Figures 27 and 28 described later) and OFF when it does not receive light. These ON and OFF states are output from the sensor 102 in the form of a signal as a result of position detection.

[0065] The amplifier 103 amplifies the signals obtained from sensors 101 and 102 and transmits them to the connector 104. The connector 104 contacts the conductive terminal 83 and transmits the signal to the conductive terminal 83. The amplifier 103 is mounted, for example, on the Z-direction side surface 105a of the plate 105. The connector 104 is mounted, for example, on surface 105b.

[0066] Figure 8 is a side view illustrating the positional relationship between the pusher 84 and the plate 105. Figure 8 is a side view taken along the Θ direction. Figure 8 shows the state in which the teaching substrate 100 is held by the transport robot 8, with the pusher 84 pushing the teaching substrate 100 in the R direction, causing the plate 105 to contact the wall 85d. At this time, the connector 104 is in contact with the conductive end 83, and this contact does not hinder the contact between the plate 105 and the wall 85d.

[0067] Figures 9 and 10 are plan views illustrating the positional relationship between the connector 104 and the conductive terminal 83. Figures 9 and 10 are plan views along the -Z direction. Figure 9 illustrates a state where the wall 85d is not in contact with the plate 105. Figure 10 illustrates a state where the wall 85d is in contact with the plate 105.

[0068] The connector 104 has a support 104a and a plurality of pins 104b. The pins 104b are conductive and conduct to the amplifier 103. When the plate 105 is positioned in the RΘ plane by the walls 801a, 801b, 802a, 802b, the plurality of pins 104b are aligned along the Θ direction. The support 104a holds the pins 104b while allowing them to move in the R and -R directions.

[0069] When pin 104b is pushed along the R direction, it moves in the -R direction, and a portion of it on the support 104a side is housed in the support 104a. When pin 104b is not pushed along the R direction, it protrudes with a length b1 in the -R direction by, for example, an elastic mechanism (not shown).

[0070] The conductive end 83 has a support 83a and a plurality of bumps 83b. The bumps 83b are aligned along the Θ direction on the support 83a. The bumps 83b protrude from the support 83a in the R direction with a length b2. The bumps 83b are conductors and exchange signals with the control unit 79 via wiring (not shown) that passes through the support 83a and the support portion 80.

[0071] When the plate 105 is positioned in the RΘ plane by the walls 801a, 801b, 802a, and 802b, the bump 83b and the pin 104b face each other along the R direction. In Figure 9, this facing is indicated by a dashed line.

[0072] Let's consider a scenario where the pusher 84 moves in the R direction, starting from a state where the plate 105 is located on the R side of the wall 85d and the connector 104 is located away from the conductive end 83 on the R side (see Figure 9). In this situation, there is a first state in which the pin 104b and the bump 83b make contact before the plate 105 and the wall 85d make contact. From the first state, the pusher 84 moves further in the R direction, and the pin 104b makes contact with the bump 83b, and a portion of the R side of the pin 104b is housed in the support 104a, bringing the plate 105 and the wall 85d closer together in the R direction. Then, the pusher 84 moves further in the R direction, and there is a second state in which the bump 83b makes contact with the pin 104b and conducts electricity, and a portion of the R side of the pin 104b is housed in the support 104a, and the plate 105 and the wall 85d make contact (see Figure 10).

[0073] In the second state, the outputs from sensors 101 and 102 are transmitted either directly or amplified via amplifier 103 to pin 104b, then to bump 83b, then to transport robot 8, and finally to control unit 79. In the second state, the teaching board 100 is positioned and held by hands 81 and 82, and consequently to transport robot 8.

[0074] The first and second states described above are achieved by appropriately designing the lengths b1 and b2, the length (not shown) to which the pin 104b is housed in the support 104a along the -R direction, the positional relationship between the wall 85d and the bump 83b in the R direction, and the positional relationship between the plate 105 and the pin 104b in the -R direction. Since such a design can be achieved by well-known techniques, the details are omitted in this embodiment.

[0075] As described above, the holding of the board 105 by the hands 81, 82 and the pusher 84 and the contact between the connector 104 and the conductive end 83 do not interfere with each other. In this way, the transport robot 8 holds the teaching substrate 100 while obtaining signals from the sensors 101 and 102.

[0076] Contact and separation between the connector 104 and the conductive terminal 83 is achieved by the relative movement of the pin 104b and the bump 83b in the R and -R directions. In such movement, the component of the stress applied to the pin 104b and the bump 83b in the direction perpendicular to the R direction is small. Reducing this component helps to lower the possibility of large displacement of the plate 105 in the hands 81 and 82, both when the pusher 84 contacts the plate 105 and when it separates from the plate 105.

[0077] <3. Storage of the teaching board 100> Figure 11 is a side view illustrating the indexer section 2, the transfer section 4, and the transport section 6. Figure 11 is a side view taken along the Y direction.

[0078] Figure 11 illustrates the posture of the indexer robot 9 in indexer section 2 when it is exchanging the substrate W in the -X direction, for example, with the load port 5.

[0079] A shelf 40 is provided in the transfer section 4. For example, a substrate mounting section 41 and an inversion unit 42 are arranged on the shelf 40. In this embodiment, the teaching substrate 100 is stored in the transfer section 4, more specifically, on the shelf 40. The shelf 40 functions as a storage location for the teaching substrate 100.

[0080] The inversion unit 42 is a mechanism that has the function of inverting the front and back sides of the substrate W. The substrate W is transferred between the inversion unit 42 and the transport robot 8 or the indexer robot 9. For example, the inversion unit 42 inverts the substrate W received from the indexer robot 9, and the inverted substrate is then passed to the transport robot 8.

[0081] A buffer station may be used instead of the inversion unit 42. The buffer station has the function of temporarily storing the substrate W. Alternatively, both the inversion unit 42 and the buffer station may be omitted.

[0082] The substrate mounting section 41 intervenes in the transfer of the substrate W between, for example, the indexer robot 9 and the transport robot 8. For example, the indexer robot 9 takes the substrate W from the load port 5 (more specifically, the carrier C) and places the substrate W on the substrate mounting section 41. The transport robot 8 takes the substrate W placed on the substrate mounting section 41 and stores the substrate W in the chamber 31. For example, the transport robot 8 takes the substrate W from the chamber 31 and places the substrate W on the substrate mounting section 41. The indexer robot 9 takes the substrate W placed on the substrate mounting section 41 and stores the substrate W in the load port 5 (more specifically, the carrier C).

[0083] In this embodiment, the teaching board 100 is stored in the shelf 40, aligned in the Z direction between the inversion unit 42 and the board mounting section 41. As will be described later, the hands 81 and 82 are movable in the Z direction and the -Z direction, and also movable in the R direction and the -R direction. Therefore, the transport robot 8 can transfer the board W to and from the inversion unit 42, transfer the board W to and from the board mounting section 41, and acquire and store the teaching board 100.

[0084] <4. Example configuration of transport robot 8> The transport robot 8 includes a support column 87, a rotating mechanism 842, linear motion mechanisms 843 and 844, a vertical drive mechanism 845, and hands 81 and 82. The vertical drive mechanism 845 is attached to the support column 87, and the rotating mechanism 842 and linear motion mechanisms 843 and 844 are provided between the vertical drive mechanism 845 and the hands 81 and 82.

[0085] The hands 81 and 82 move in three dimensions by a rotary mechanism 842, linear motion mechanisms 843 and 844, and a vertical drive mechanism 845.

[0086] The support part 80 is positioned on the linear motion mechanism 843 on the Z-direction side of the linear motion mechanism 843. The linear motion mechanism 843 is positioned on the rotary mechanism 842 on the Z-direction side of the rotary mechanism 842. The linear motion mechanism 843 has the function of moving in the R-direction and -R-direction relative to the rotary mechanism 842. Due to this function, the support part 80, and consequently the hands 81, 82 and pusher 84, move in the R-direction and -R-direction.

[0087] The rotating mechanism 842 is positioned on the linear motion mechanism 844 on the Z-direction side. The rotating mechanism 842 has the function of rotating the linear motion mechanism 843 relative to the linear motion mechanism 844 around a rotation axis CA1 parallel to the Z-direction. This function causes the support part 80, and consequently the hands 81, 82 and pusher 84, to rotate around the rotation axis CA1. This rotation causes the angle between the R-direction and the X-direction to change.

[0088] The linear motion mechanism 844 is positioned on the stage 853 on the Z-direction side. The linear motion mechanism 844 has the function of moving the rotary mechanism 842 in the Y-direction and -Y-direction relative to the stage 853. Through this function, the rotary mechanism 842, and the linear motion mechanism 843, the support part 80, and consequently the hands 81, 82 and pusher 84, move in the Θ-direction and -Θ-direction.

[0089] The vertical drive mechanism 845 includes a lifting body 851. The lifting body 851 is connected to the linear drive mechanism 844 via a stage 853. The lifting body 851 is driven by a motor (not shown) and has the function of moving in the Z and -Z directions, guided by a vertically extending rail (not shown) provided on a support column 87. This function causes the support section 80, and consequently the hands 81, 82 and pusher 84, to move in the Z and -Z directions.

[0090] These functions allow hands 81 and 82 to move in the X and -X directions (see arrow F3 in Figure 1) and to move closer to or further away from chamber 31 (see arrow F4 in Figure 1).

[0091] The movement of the hands 81 and 82 allows the transport robot 8 to transfer the substrate W or the teaching substrate 100 between the transfer section 4 and the processing section 3. More specifically, for example, the transport robot 8 transfers the substrate W between the chamber 31 and the substrate mounting section 41, between the chamber 31 and the inversion unit 42, and between the chamber 31 and the shelf 40.

[0092] <5. Example configuration of Indexer Robot 9> The indexer robot 9 includes a support column 97, linear motion mechanisms 95 and 96, a rotary mechanism 94, a hand 91, and a support section 90. The support column 97 supports the linear motion mechanism 96 from the -Z direction side and has the function of moving the linear motion mechanism 96 in the Z direction and -Z direction. The rotary mechanism 94 is connected to the Z direction side of the linear motion mechanism 96. The linear motion mechanism 96 has the function of moving the rotary mechanism 94 in the Y direction and -Y direction.

[0093] The linear motion mechanism 95 is connected to the Z-direction side of the rotary mechanism 94. The support part 90 is connected to the Z-direction side of the linear motion mechanism 95. The hand 91 has the function of holding the substrate W. The hand 91 is supported by the support part 90. The rotary mechanism 94 has the function of rotating the linear motion mechanism 95 about a rotation axis CA2 parallel to the Z-direction. The linear motion mechanism 95 has the function of moving the support part 90 in the direction in which the hand 91 extends and in the opposite direction (in the state illustrated in Figure 11, the -X direction and the X direction, respectively).

[0094] These functions allow the hand 91 to move in the Y and -Y directions (see arrow F1 in Figure 1) and in the X and -X directions (see arrow F2 in Figure 1). Through this movement of the hand 91, the indexer robot 9 transfers the substrate W between the load port 5 and the transfer section 4, more specifically between the carrier C and the substrate mounting section 41 or the inversion unit 42.

[0095] <6. Examples of Target Objects> The teaching board 100 is used to teach the positional relationship between the transport robot 8 and the target object. For example, the case where the target object is a holding mechanism provided in the chamber 31 is described. The holding mechanism has the function of holding the board W during processing in the chamber 31. The position in which the holding mechanism holds the board W may differ before and after maintenance of the chamber 31. Therefore, after the maintenance of the chamber 31 is completed, the teaching process (hereinafter also simply referred to as "teaching") is performed.

[0096] <6-1. Target Wafer> Figure 12 is a plan view illustrating the configuration of a target wafer 200 used in teaching with a teaching substrate 100. The target wafer 200 comprises a main surface 201 and a columnar body 202. Figure 12 is a plan view of the target wafer 200 as seen along the -Z direction when the main surface 201 is positioned perpendicular to the Z direction. The target wafer 200 is, for example, identical in shape to the substrate W in a plan view.

[0097] Figure 13 is a side view showing the target wafer 200 being held by the chuck 304 above the stage 301, for example, on the Z-direction side of the stage 301. Figure 13 is a cross-sectional view in a section parallel to the Z-direction. For example, Figure 13 is a cross-sectional view of the target wafer 200 at position DD in Figure 12.

[0098] Stage 301 is provided in chamber 31. Stage 301 has the function of rotating about a rotation axis Q parallel to the Z direction.

[0099] Multiple chucks 304, for example six, are provided on the Z-axis side of the stage 301. The chucks 304 are columnar and extend substantially parallel to the Z-axis. Each chuck 304 has a recess 304m. The recess 304m opens in a direction perpendicular to the Z-axis. The periphery of the substrate W (not shown) is held perpendicular to the Z-axis by being sandwiched between multiple recesses 304m. Each chuck 304 is supported on the stage 301 so as to be able to rotate about an axis of rotation parallel to the Z-axis. This rotation changes the direction in which the recess 304m opens, thereby enabling the holding and release of the substrate W.

[0100] The substrate W is held by the chuck 304, and the chuck 304 is supported by the stage 301. Therefore, the chuck 304 itself, or the chuck 304 and stage 301 as a whole, can be considered as the holding mechanism 300 for holding the substrate.

[0101] Similar to the substrate W, the chuck 304 is used to hold and release the target wafer 200. Figure 13 illustrates the state in which the target wafer 200 is held by the chuck 304.

[0102] The main surface 201 is, for example, circular in plan view, and its radius is equal to the radius of the arc or circle at the periphery of the substrate W. The columnar body 202 has a recess 203 that opens on the side opposite to the main surface 201. For example, the recess 203 penetrates the columnar body 202 along the Z direction. The recess 203 surrounds the circular center J1 of the main surface 201. The center J1 is located within the recess 203 in plan view.

[0103] Figure 13 illustrates the case where the target wafer 200 is held by the chuck 304 and its center J1 rests on the rotation axis Q. The teaching substrate 100 is used for teaching, which determines the position of the center J1 and, consequently, the position of the rotation axis Q.

[0104] For example, an operator introduces a target wafer 200 into the chamber 31 after maintenance has been completed, and holds it in the chuck 304 of the chamber 31. The operator can work inside the chamber 31 from anywhere other than the transport section 6. Unlike the placement of the teaching substrate 100 onto the transport robot 8, the operator does not need to enter the transport section 6.

[0105] Alternatively, for example, the target wafer 200 is stored in the shelf 40, similar to the teaching substrate 100, and prior to the placement of the teaching substrate 100, the transport robot 8 holds it in the chuck 304 of the chamber 31 after maintenance is complete. Once teaching is complete, the transport robot 8 places the teaching substrate 100 into the shelf 40 and then places the target wafer 200 into the shelf 40.

[0106] <6-2. Objects on the Stage> Teaching using the teaching substrate 100 does not necessarily require a target wafer 200. The target can be placed on the stage 301.

[0107] Figure 14 is a cross-sectional view showing the stage 301 and the chuck 304. Figure 14 is a cross-sectional view taken perpendicular to a section parallel to the Z direction and containing the axis of rotation Q. The chuck 304 shown in Figure 14 has a different angle when viewed along the Z direction compared to the chuck 304 shown in Figure 13. The recess 304m of the chuck 304 shown on the left side of Figure 14 opens towards the back of the paper from the cross-section and is therefore shown as a hidden dashed line.

[0108] A columnar body 302 is fixed to the Z-direction side of the stage 301. The columnar body 302 has a recess 303 that opens on the opposite side from the stage 301. For example, the recess 303 penetrates the columnar body 302 along the Z-direction. The recess 303 surrounds the axis of rotation Q. In a plan view along the -Z direction, the axis of rotation Q is located within the recess 303.

[0109] The -Z-direction end 304a of the recess 304m and the Z-direction end 302a of the columnar body 302 are separated by a distance d (>0). With this positional relationship, the columnar body 302 and the substrate W do not come into contact when the recess 304m holds the substrate W.

[0110] <6-3. Teaching of the substrate mounting section> It is also conceivable that teaching may be performed on the substrate mounting section 41. In this case, the substrate mounting section 41 is provided with a place to place the substrate W, as well as a place to place the target object.

[0111] Figure 15 is a perspective view showing the substrate mounting section 41 and the mounting target 400. Figure 15 illustrates a case where the substrate mounting section 41 can mount multiple substrates, for example, two substrates W and the mounting target 400. The mounting target 400 is mounted on the substrate mounting section 41 on the Z-direction side of each substrate W.

[0112] The substrate mounting section 41 opens in both the X direction and the -X direction, allowing the substrate W to be received and removed from either the X direction side or the -X direction side.

[0113] The mounting target 400 comprises a plate 401 and a columnar body 402. The plate 401 extends along the Y direction. The Y-direction end and the -Y-direction end of the plate 401 are held by the substrate mounting section 41. The columnar body 402 is fixed to the Z-direction side of the plate 401. The columnar body 402 has a recess 403 that opens on the opposite side from the plate 401. For example, the recess 403 penetrates the columnar body 402 along the Z direction. The recess 403 surrounds an axis J2 parallel to the Z direction. In a plan view along the -Z direction, the axis J2 is located within the recess 403.

[0114] The position of axis J2 in the X and Y directions serves as a reference for the position of the substrate W placed on the substrate mounting section 41 in the X and Y directions. For example, the substrate W is mounted such that its center coincides with axis J2 when viewed along the -Z direction.

[0115] <7. The sequence of maintenance, teaching, and board transport> When performing maintenance on the chambers 31, not all chambers 31 are necessarily subject to maintenance. In a single-wafer substrate processing apparatus 700, substrates W that have been processed in one chamber 31 are transported to the shelf 40 by the transport robot 8 without being processed in any other chambers 31.

[0116] It is assumed that a collection of substrates W stored in one carrier C is treated as a single lot, and that maintenance is performed in one chamber 31. The processing in the chamber 31 that is subject to maintenance is interrupted or stopped.

[0117] The same substrate W will not be processed sequentially by multiple chambers 31. Processing in chambers 31 that are not subject to maintenance does not need to be interrupted or delayed.

[0118] After maintenance is completed, teaching is performed, and the transport robot 8 is used for this teaching. While teaching is being performed, the transport robot 8 holds the teaching substrate 100, so the transport robot 8 cannot transport the substrate W (hereinafter also referred to as "transportation processing"). When teaching is being performed, the processing of the entire lot is interrupted.

[0119] Figure 16 is a flowchart illustrating the sequence in which maintenance, teaching, and substrate transport are performed. Since this sequence involves interruption (or stopping) and resumption of processing in chamber 31, and interruption and resumption of transport processing, this flowchart is labeled "Interruption / Resumption Processing".

[0120] Step S11 is a step to check whether there is a chamber 31 that is subject to maintenance. Step S11 is performed by the control unit 79. Whether or not maintenance is required is determined by predetermined conditions, for example, whether or not the cumulative usage time of the chamber 31 since the last maintenance has exceeded a predetermined time.

[0121] Step S11 is the process of determining whether or not to perform maintenance on chamber 31(k), that is, whether or not chamber 31(k) is subject to maintenance. Chamber 31(k) is a name that includes the code "(k)" to distinguish multiple chambers 31 from each other. For example, if the substrate processing apparatus 700 has 12 chambers 31, the value k will be an integer from 1 to 12. The value k is updated cyclically each time step S11 is executed.

[0122] For example, it is conceivable that in step S11, a decision is made as to whether or not to perform maintenance on chamber 31(11). If the result of the decision in step S11 is negative, then a decision is made as to whether or not to perform maintenance on chamber 31(12). If the result of the decision in step S11 is negative, then a decision is made as to whether or not to perform maintenance on chamber 31(1).

[0123] If the judgment result in step S11 is positive, the value k at that time is adopted as the value i and step S12 is executed. Step S12 is the process of stopping the processing of the chamber 31(i) that is the subject of maintenance. Alternatively, step S12 may be the process of interrupting the processing of the chamber 31(i). Step S12 is executed by the chamber 31(i) under the control of the control unit 79 (see Figure 3; however, the symbol "(k)" is not attached in Figure 3).

[0124] For example, in step S11, it is determined whether or not to perform maintenance on chamber 31(6). If the result of this determination is positive, the processing of chamber 31(6) is stopped or interrupted in step S12.

[0125] After step S12 is performed, step S13 determines whether or not maintenance of chamber 31(i) is complete. As long as this determination is negative, step S13 continues to be executed. During this time, the operator performs maintenance on chamber 31(i).

[0126] As described above, since operators can work inside the chamber 31 from outside the transport section 6, the transport process continues even when maintenance is being performed. Furthermore, the operation of chamber 31(m) (where m is a possible value for k, and not i) that is not undergoing maintenance will not be interrupted or stopped due to the maintenance in question.

[0127] Once maintenance is complete, the operator provides information to the control unit 79 indicating that maintenance is complete, for example, using the graphic user interface 20. The control unit 79 then performs the decision in step S13 based on whether or not this information is present.

[0128] Once maintenance is complete and the result of step S13 is positive, step S14 is executed. Step S14 is a process in which the transport process of the substrate W is interrupted and the teaching substrate 100 is transported. The transport robot 8 transports the teaching substrate 100 instead of transporting the substrate W. Step S14 is executed by the transport robot 8 under the control of the control unit 79 (see Figure 3).

[0129] For example, in step S14, if the transport robot 8 has a substrate W it is holding, it places it on the substrate placement unit 41 (or a buffer station not shown), takes out the teaching substrate 100 from the shelf 40 and holds it, and then transports the teaching substrate 100 in the transport section 6.

[0130] After step S14 is performed, teaching of chamber 31(i) is performed in step S15.

[0131] After step S15 is performed, step S16 is performed. Step S16 is the process of storing the teaching board 100 in the shelf 40 and resuming the transport process of the board W. Step S16 is performed by the transport robot 8 under the control of the control unit 79 (see Figure 3).

[0132] For example, in step S16, the transport robot 8 stores the teaching board 100 it was holding into the shelf 40, takes out the board W from the shelf 40 and holds it, and the transport of the board W in the transport section 6 resumes.

[0133] After step S16 is performed, processing in chamber 31(i) is resumed in step S17. Step S16 is performed by chamber 31(i) under the control of the control unit 79 (see Figure 3; however, the notation "(i)" is not used in Figure 3).

[0134] During the interruption / restart process, chamber 31(m), which is neither subject to maintenance nor teaching, and whose processing was not interrupted, continues to process the substrate W in parallel while steps S12 to S17 are being executed, for example, while step S15 is being executed. Therefore, when step S17 is executed, the processing of the entire lot is also restarted.

[0135] By employing the aforementioned interruption / restart process, maintenance and teaching can be performed, as well as processing can be resumed after maintenance, without the operator entering the transport section 6. The generation of particulate matter and metal contamination in the transport section 6, which is a concern when operators enter the section, is also reduced.

[0136] By employing the above-described interruption / restart process, control based on the control unit 79 is maintained, and there is no need to stop the operation of the substrate processing device 700. There is no need to take communication with the host computer 500 offline, and so-called tool-down does not occur. Processing in chamber 31(m), which is not subject to teaching, is performed in parallel with teaching in chamber 31(i), which contributes to speeding up the overall processing of the substrate processing device 700.

[0137] As a result of executing steps S12 to S17, normal processing in chamber 31(k) is delayed, while normal processing in chamber 31(m) is maintained. Therefore, for example, the timing of processing for the entire lot is changed. This timing is reset, for example, by a scheduler executed by the control unit 79.

[0138] Step S14 is executed under the control of the control unit 79. For example, if the control unit 79 makes a positive decision in step S13, steps S14 and S15 are executed as an interrupt process for the scheduler. When step S15 is completed, that is, when teaching of chamber 31(i) is finished, the timing of processing for the entire lot is calculated and the scheduler is updated. Steps S16 and S17 are executed according to the updated scheduler.

[0139] The flowchart terminates when the process in step S17 is resumed, or step S11 is executed again.

[0140] In step S17, the chamber 31(i) where processing is resumed uses, for example, a quality control substrate as the target of processing at the time of resumption. After processing using the quality control substrate, the presence or absence of fine particles or metal contamination on the substrate is checked. In this case, the chamber 31(i) processes the substrate W after processing the quality control substrate.

[0141] <8. Specific Examples of Teaching> The following describes a specific example of step S15. Figure 17 is a flowchart of a specific example of step S15. Step S15 includes step S151, in which Z-axis teaching is performed, and step S152, in which R / Θ-axis teaching is performed.

[0142] The following explanation uses columnar body 202, but the explanation remains valid even if columnar body 202 is replaced with columnar bodies 302 and 402.

[0143] <8-1. Z-axis teaching> The Z-axis teaching performed in step S151 is teaching for teaching in the Z direction. Z-axis teaching teaches the position of the substrate W in the Z direction based on the output of the sensor 101.

[0144] Figure 18 is a flowchart showing a specific example of step S151. In Z-axis teaching, first in step S101, the teaching substrate 100 is moved to a position in the Z direction (hereinafter also referred to as the "Z-axis position") Z0.

[0145] Figures 19 and 20 are cross-sectional views illustrating the positional relationship between the teaching substrate 100 and the columnar body 202 immediately after step S101 is performed. Figure 19 shows a cross-section viewed along the -R direction including the rotation axis Q. Figure 20 shows a cross-section viewed along the Θ direction including the rotation axis Q. For illustrative purposes, the Z-axis position of surface 105b is exemplified as the position of the teaching substrate 100. In Figures 18 and 19, the Z-axis position Z0 of the teaching substrate 100 is exemplified.

[0146] When Z=Z0, the teaching substrate 100 is far away from the columnar body 202 in the Z direction, and the light L1 emitted from the light emitter 101a is received by the light receiver 101b. Therefore, at this time, the sensor 101 is in the ON state.

[0147] After step S101 is performed, step S102 is performed. In step S102, the teaching board 100 is moved to a position in the R direction (hereinafter also referred to as the "R-axis position") R0 while the Z-axis position of the teaching board 100 is maintained at Z=Z0. This movement is performed by the transport robot 8, more specifically by the linear motion mechanism 843, under the control of the control unit 79.

[0148] Figures 21 and 22 are cross-sectional views illustrating the positional relationship between the teaching substrate 100 and the columnar body 202 immediately after step S102 is performed. Figure 21 shows a cross-section along the -R direction including the rotation axis Q. Figure 22 shows a cross-section along the Θ direction including the rotation axis Q. For convenience of illustration, the R-axis position and the Θ-axis position (hereinafter also referred to as the "Θ-axis position") of the center of the plate 105 are exemplified as the position of the teaching substrate 100. In Figure 21, the Θ-axis position Θ0 of the teaching substrate 100 is exemplified. In Figure 22, the R-axis position R0 of the teaching substrate 100 is exemplified.

[0149] The R-axis position R0 and the Θ-axis position Θ0 are the default teaching positions where light L1 intersects the columnar body 202 in a plan view along the -Z direction. Furthermore, how the R-axis position R0 and the Θ-axis position Θ0 are set will be explained later in <8-2-1. Rough Teaching>.

[0150] After step S102 is performed, step S103 is performed. In step S103, the teaching board 100 is moved in the -Z direction. At this time, the R-axis position R0 and the Θ-axis position Θ0 are maintained. The movement in the -Z direction is performed by an amount that can be quickly stopped by the decision made in step S104.

[0151] After step S103 is executed, step S104 is executed. In step S104, it is determined whether the sensor 101 is in the ON state or the OFF state.

[0152] If it is determined that sensor 101 is in the ON state, step S103 is executed again. Step S103 is repeatedly executed until the teaching board 100 moves in the -Z direction and it is determined that sensor 101 is in the OFF state. If it is determined that sensor 101 is in the OFF state, step S105 is executed.

[0153] In step S105, the teaching board 100 is moved in the -Z direction. At this time, the R-axis position R0 and the Θ-axis position Θ0 are maintained. The teaching board 100 moves in the -Z direction with a movement amount ΔZ1 (>0) and stops. The movement amount ΔZ1 is set such that, as a result of executing step S105, the columnar body 202 does not come into contact with either the plate 105 or the sensor 102.

[0154] This setting is made considering, for example, the Z-axis position of the optical path of light L1, for example, the mounting position of sensor 101, and the mounting position of sensor 102. For example, the amount of movement ΔZ1 is 0.5 mm.

[0155] Figure 23 is a cross-sectional view illustrating the positional relationship between the teaching substrate 100 and the columnar body 202 immediately after step S105 is performed. Figure 23 shows a cross-section along the Θ direction including the rotation axis Q.

[0156] Since the columnar body 202 extends along the Z direction on the -Z direction side with respect to the teaching substrate 100, the sensor 101, which was determined to be in the OFF state in step S104, remains in the OFF state even after step S105 is executed.

[0157] Light L1 is blocked by the columnar body 202 and is not received by the photodetector 101b. In Figure 23, the light L1 that would have been received by the photodetector 101b if it had not been blocked by the columnar body 202 is hypothetically shown by the dashed line.

[0158] In step S105, the Z-axis position ZP1 of the teaching board 100 after stopping is stored.

[0159] After step S105 is performed, step S106 is performed. In step S106, the teaching board 100 is moved in the Z direction. At this time, the R-axis position R0 and the Θ-axis position Θ0 are maintained. The movement in the Z direction is performed by an amount that can be quickly stopped by the decision made in step S107.

[0160] After step S106 is performed, step S107 is performed. In step S107, it is determined whether the sensor 101 is in the ON state or the OFF state.

[0161] If it is determined that the sensor 101 is in the OFF state, step S106 is executed again. Step S106 is repeatedly executed until the teaching board 100 moves in the Z direction and it is determined that the sensor 101 is in the ON state. If it is determined that the sensor 101 is in the ON state, step S108 is executed.

[0162] In step S108, the movement of the teaching board 100 in the Z direction is stopped, and the Z-axis position ZP2 of the stopped teaching board 100 is stored.

[0163] Figure 24 is a cross-sectional view illustrating the positional relationship between the teaching substrate 100 and the columnar body 202 immediately after step S108 is performed. Figure 24 shows a cross-section along the Θ direction including the rotation axis Q. Light L1 from the light emitter 101a is received by the light receiver 101b.

[0164] After step S108 is performed, step S109 is performed. In step S109, a provisional value ZP for the position for teaching in the Z direction is stored. The value ZP is obtained as the average of Z-axis positions ZP1 and ZP2. The value ZP is an approximation of the Z-axis position of the Z-axis side end 202a of the columnar body 202. The value ZP is calculated, for example, by the data processing unit 791 and stored in the storage medium 792b.

[0165] After step S109 is performed, step S110 is performed. In step S110, a position value ZP-γ for teaching in the Z direction is stored. The value γ corresponds to the displacement in the Z direction between the target object and the substrate W, and is, for example, the length of the columnar body 202 along the Z direction.

[0166] The value (ZP-γ) is calculated, for example, by the data processing unit 791 and stored in the storage medium 792b. The value (ZP-γ) is used to teach about the substrate W in the Z direction.

[0167] The Z-axis teaching (step S151) is completed when step S110 is executed.

[0168] The movement in steps S101, S103, S105, and S106 is performed by the transport robot 8 under the control of, for example, the control unit 79. The decisions in steps S104 and S107 are made by the control unit 79 after the output from the sensor 101 is transmitted to the control unit 79 via the connector 104 and conductive terminal 83. The storage in steps S105 and S108 is, for example, storage in the storage medium 792b.

[0169] <8-2. R / Θ axis teaching> The R / Θ axis teaching performed in step S152 is teaching for teaching in the R and Θ directions. The R / Θ axis teaching teaches the position of the substrate W in the R and Θ directions based on the output of the sensor 102.

[0170] Figure 25 is a flowchart showing a specific example of step S152. Step S152 includes steps S152A, S152B, and S152C, which are executed in this order.

[0171] Step S152A is a process for rough teaching in the R and Θ directions. Step S152B is a process for fine teaching in the R direction. Step S152C is a process for fine teaching in the Θ direction.

[0172] <8-2-1. Rough Teaching> Figure 26 is a flowchart showing a specific example of step S152A. In rough teaching, the position of the sensor 102 is first adjusted in steps S201 and S202. Specifically, the teaching board 100 moves in the Z direction to the Z-axis position ZP+ΔZ2 in step S201, and then moves in the -Z direction to the Z-axis position ZP+ΔZ3 in step S202 (ΔZ2, ΔZ3 > 0). Steps S201 and S202 are executed while the R-axis position R0 and the Θ-axis position Θ0 are maintained. Steps S201 and S202 are implemented by the transport robot 8, more specifically by the linear motion mechanism 843, under the control of the control unit 79.

[0173] Figure 27 is a cross-sectional view illustrating the positional relationship between the teaching substrate 100 and the columnar body 202 immediately after step S201 is executed. Figure 27 shows a cross-section along the Θ direction including the rotation axis Q. The light L2 emitted by the sensor 102 is reflected by the columnar body 202. The reflected light L2 is not received by the sensor 102, and the sensor 102 is in the OFF state. The value ΔZ2 is set to a magnitude such that the sensor 102 is in the OFF state when the teaching substrate 100 is located at the Z-axis position Z = ZP + ΔZ2. This setting is determined considering the mounting position of the sensor 102 on the plate 105 and the specifications of the sensor 102.

[0174] Figure 28 is a cross-sectional view illustrating the positional relationship between the teaching substrate 100 and the columnar body 202 immediately after step S202 is performed. Figure 28 shows a cross-section along the Θ direction including the rotation axis Q. The light L2 emitted by the sensor 102 is reflected at the end 202a. The reflected light L2 is received by the sensor 102, and the sensor 102 is in the ON state. However, when the light L2 is reflected by the recess 203, the sensor 102 does not receive the light L2. The value ΔZ3 is set considering the mounting position of the sensor 102 on the plate 105 and the specifications of the sensor 102.

[0175] In step S202, the sensor 102 is turned ON, so the R-axis position R0 and the Θ-axis position Θ0 are set so that, in a plan view along the -Z direction, the detection area of ​​the sensor 102 is surrounded by the outer casing of the columnar body 202. As described above, due to the Z-axis teaching being performed, the R-axis position R0 and the Θ-axis position Θ0 are set so that, in the plan view, light L1 intersects with the columnar body 202. Therefore, it is desirable that, in the plan view, the detection area of ​​the sensor 102 and light L1 intersect. For example, the light emitter 101a, sensor 102, and light receiver 101b are arranged in this order or the reverse order along the Θ direction (see Figure 7).

[0176] After step S202 is executed, in step S203 it is determined whether the sensor 102 is in the ON state or the OFF state. Since the R-axis position R0 and the Θ-axis position Θ0 are set as described above, if the sensor 102 is in the ON state, it corresponds to the light L2 being reflected at the end 202a. If the sensor 102 is in the OFF state, it corresponds to the light L2 being reflected at the recess 203.

[0177] Specifically, the decision in step S203 is made by the control unit 79 after the output from the sensor 102 is transmitted to the control unit 79 via the connector 104 and conductive terminal 83.

[0178] The recess 203 surrounds the circular center J1 of the main surface 201. When the target wafer 200 is held by the holding mechanism 300, the center J1 rests on the rotation axis Q. Normally, when the substrate W is held by the holding mechanism 300, its center rests on the rotation axis Q. The reflection of light L2 by the recess 203 indicates that the position of the teaching substrate 100 roughly corresponds to the position used for teaching the RΘ plane of the substrate W. If it is determined in step S203 that the sensor 102 is in the OFF state, step S205 is executed, and the current position of the teaching substrate 100 is stored as the R-axis position R1 and the Θ-axis position Θ1. Specifically, for example, the R-axis position R1 and the Θ-axis position Θ1 are stored in the storage medium 792b.

[0179] If it is determined in step S203 that the sensor 102 is in the ON state, step S204 is executed. In step S204, the position of the teaching board 100 (R-axis position and Θ-axis position) moves within a circle centered on the R-axis position R0 and the Θ-axis position Θ0. Specifically, this movement is achieved, for example, by the transport robot 8 under the control of the control unit 79.

[0180] Figure 29 is a plan view illustrating the positional relationship between the teaching substrate 100 and the columnar body 202 and the recess 203. Figure 29 is a plan view along the -Z direction. The position of the teaching substrate 100 is described using the R-axis position and the Θ-axis position. Circle 121 is a circle centered at position 120, which is at R-axis position R0 and Θ-axis position Θ0. The radius of this circle is set considering the detection range of the sensor 102 in a plan view, the R-axis position R0 and Θ-axis position Θ0, the columnar body 202 and the recess 203. For example, the recess 203 is a circle with a radius of 2 mm in a plan view, and the radius of circle 121 is 7 mm. In a plan view, it is assumed that at least a part of the recess 203 is surrounded by circle 121.

[0181] Figure 29 illustrates the case where the R-axis position and Θ-axis position of the teaching substrate 100 move in this order along paths 122a and 122b inside the circle 121. Path 122a is on the -R side of the R-axis position R0. Path 122b is on the R side of the R-axis position R0.

[0182] Path 122a starts at position 120, moves in the Θ and -Θ directions while heading towards the -R direction, and returns to the starting point after traveling a predetermined distance in the -R direction. Path 122b starts at position 120, moves in the Θ and -Θ directions while heading towards the R direction, and ends at the point reached after traveling a predetermined distance in the R direction.

[0183] Step S204 is repeatedly executed as long as step S203 determines that the sensor 102 is in the ON state. If step S203 continues to determine that the sensor 102 is in the ON state even when the R-axis position R and Θ-axis position Θ reach the end point of path 122b, the flowchart terminates due to an error handling process not shown.

[0184] <8-2-2. R-axis teaching> Figure 30 is a flowchart showing a specific example of step S152B. Figure 31 is a plan view illustrating the movement of the teaching substrate 100 during R-axis teaching and Θ-axis teaching. The R-axis position R1 and Θ-axis position Θ1 obtained as a result of rough teaching are exemplified as position 123 in Figure 31. During R-axis teaching, the Z-axis position ZP + ΔZ3 is maintained.

[0185] In R-axis teaching, first, in step S301, the teaching substrate 100 is moved in the -R direction by a displacement of ΔR while the Θ-axis position Θ1 is maintained. The resulting R-axis position R1-ΔR and Θ-axis position Θ1 are exemplified as position 124a in Figure 31.

[0186] The amount of movement ΔR is set so that the sensor 102 is expected to be turned ON by the movement in step S301. For example, when the recess 203 is a circle with a radius of 2 mm in plan view, and the radius of circle 121 is 7 mm, the amount of movement ΔR is set to 3 mm. With this setting, it is assumed that no matter where position 123 is in the recess 203 in plan view, position 124a is outside the recess 203 and inside the end 202a.

[0187] After step S301 is performed, step S302 is performed. In step S302, the teaching board 100 is moved in the R direction while the Θ-axis position Θ1 is maintained. The movement in the R direction in step S302 is performed by an amount that can be quickly stopped by the judgment in step S303. After step S302 is performed, step S303 is performed. In step S303, it is determined whether the sensor 102 is in the ON state or the OFF state. Specifically, the output from the sensor 102 is transmitted to the control unit 79 via the connector 104 and conductive terminal 83, and the control unit 79 makes the determination.

[0188] If it is determined that the sensor 102 is in the ON state, step S302 is executed again. Step S302 is repeatedly executed until the teaching board 100 moves in the R direction and it is determined that the sensor 102 is in the OFF state.

[0189] If it is determined that the sensor 102 is in the OFF state, step S304 is executed. Figure 31 illustrates the position 124b of the teaching board 100 immediately before step S304 is executed. Ideally, position 124b lies on the circumference of the recess 203 in a plan view. In step S304, the R-axis position of the current position (abbreviated as "current position R" in Figure 30) is stored as the R-axis position RF.

[0190] After step S304 is performed, step S305 is performed. In step S305, the teaching substrate 100 is moved in the R direction by a displacement of ΔR. The resulting R-axis position RF+ΔR and Θ-axis position Θ1 are exemplified as position 124c in Figure 31.

[0191] With the movement amount ΔR set as described above, it is assumed that the sensor 102 will be turned OFF by the movement in step S305. In plan view, it is assumed that no matter where position 124b is on the circle of the recess 203, position 124c is outside the recess 203 and inside the end 202a.

[0192] After step S305 is executed, step S306 is executed. In step S306, the teaching board 100 is moved in the -R direction while the Θ-axis position Θ1 is maintained. The movement in the -R direction in step S306 is performed by an amount that can be quickly stopped by the judgment in step S307. After step S306 is executed, step S307 is executed. In step S307, it is determined whether the sensor 102 is in the ON state or the OFF state. Specifically, the output from the sensor 102 is transmitted to the control unit 79 via the connector 104 and conductive terminal 83, and the control unit 79 makes the determination.

[0193] If it is determined that the sensor 102 is in the ON state, step S306 is executed again. Step S306 is repeatedly executed until the teaching board 100 moves in the -R direction and it is determined that the sensor 102 is in the OFF state.

[0194] If it is determined that the sensor 102 is in the OFF state, step S308 is executed. Figure 31 illustrates the position 124d of the teaching board 100 immediately before step S308 is executed. Ideally, position 124d lies on the circumference of the recess 203 in a plan view. In step S308, the R-axis position of the current position (abbreviated as "current position R" in Figure 30) is stored as the R-axis position RR.

[0195] After step S308 is executed, step S309 is executed. In step S309, the R-axis position RP is calculated as the average of the R-axis positions RF and RR and stored. The R-axis position RP is calculated, for example, by the data processing unit 791 and stored in the storage medium 792b.

[0196] Positions 124b and 124d lie on line segment 124 at the Θ-axis position Θ1. The R-axis position RP is assumed to be the R-axis position of the center of the circle that the recess 203 presents in plan view, and is used as the position for teaching in the R direction.

[0197] After step S309 is performed, step S310 is performed. In step S310, the teaching board 100 moves to the R-axis position RP while maintaining the Θ-axis position Θ1. Figure 31 illustrates the position 124e of the teaching board 100 immediately after step S310 is performed. The R-axis teaching is completed by the execution of step S310.

[0198] The movement in steps S301, S302, S305, S306, and S310 is performed by the transport robot 8 under the control of the control unit 79.

[0199] The storage in steps S304 and S308 is, for example, storage to the storage medium 792b.

[0200] <8-2-3. Theta-axis teaching> Figure 32 is a flowchart showing a specific example of step S152C. The R-axis position RP and Z-axis position ZP+ΔZ3 obtained as a result of R-axis teaching are maintained during Θ-axis teaching.

[0201] In Θ-axis teaching, in step S401, the teaching substrate 100 is moved by a displacement ΔΘ in the -Θ direction while the R-axis position RP is maintained. The resulting Θ-axis position Θ1-ΔΘ and R-axis position RP are exemplified as position 125a in Figure 31.

[0202] The amount of movement ΔΘ is set so that the sensor 102 is expected to be turned ON by the movement in step S401. For example, when the recess 203 is a circle with a radius of 2 mm in plan view, and the radius of circle 121 is 7 mm, the amount of movement ΔΘ is set to 3 mm. With this setting, it is assumed that no matter where position 124e is in the recess 203 in plan view, position 125a is outside the recess 203 and inside the end 202a.

[0203] After step S401 is executed, step S402 is executed. In step S402, the teaching board 100 is moved in the Θ direction while the R-axis position RP is maintained. The movement in the Θ direction in step S402 is performed by an amount that can be quickly stopped by the judgment in step S403. After step S402 is executed, step S403 is executed. In step S303, it is determined whether the sensor 102 is in the ON state or the OFF state. Specifically, the output from the sensor 102 is transmitted to the control unit 79 via the connector 104 and conductive terminal 83, and the control unit 79 makes the determination.

[0204] If it is determined that the sensor 102 is in the ON state, step S402 is executed again. Step S402 is repeatedly executed until the teaching board 100 moves in the Θ direction and it is determined that the sensor 102 is in the OFF state.

[0205] If it is determined that the sensor 102 is in the OFF state, step S404 is executed. Figure 31 illustrates the position 125b of the teaching board 100 immediately before step S404 is executed. Ideally, position 125b lies on the circumference of the recess 203 in a plan view. In step S404, the Θ-axis position of the current position (abbreviated as "current position Θ" in Figure 32) is stored as the Θ-axis position ΘF.

[0206] After step S404 is performed, step S405 is performed. In step S405, the teaching substrate 100 is moved in the Θ direction by an amount ΔΘ. The resulting Θ-axis position ΘF+ΔΘ and R-axis position RP are exemplified as position 125c in Figure 31.

[0207] With the movement amount ΔΘ set as described above, it is assumed that the sensor 102 will turn OFF due to the movement in step S405. In plan view, it is assumed that no matter where position 125b is on the circle of the recess 203, position 125c is outside the recess 203 and inside the end 202a.

[0208] After step S405 is executed, step S406 is executed. In step S406, the teaching board 100 is moved in the -Θ direction while the R-axis position RP is maintained. The movement in the -Θ direction in step S406 is performed by an amount that can be quickly stopped by the judgment in step S407. After step S406 is executed, step S407 is executed. In step S407, it is determined whether the sensor 102 is in the ON state or the OFF state. Specifically, the output from the sensor 102 is transmitted to the control unit 79 via the connector 104 and conductive terminal 83, and the control unit 79 makes the determination.

[0209] If it is determined that the sensor 102 is in the ON state, step S406 is executed again. Step S406 is repeatedly executed until the teaching board 100 moves in the -Θ direction and it is determined that the sensor 102 is in the OFF state.

[0210] If it is determined that the sensor 102 is in the OFF state, step S408 is executed. In Figure 31, the position 125d of the teaching board 100 immediately before step S408 is executed is shown as an example. Ideally, position 125d lies on the circumference of the recess 203 in a plan view. In step S408, the Θ-axis position of the current position (abbreviated as "current position Θ" in Figure 32) is stored as Θ-axis ΘR.

[0211] After step S408 is performed, step S409 is performed. In step S409, the Θ-axis position ΘP is calculated as the average of the Θ-axis positions ΘF and ΘR and stored. The Θ-axis position ΘP is calculated, for example, by the data processing unit 791 and stored in the storage medium 792b.

[0212] Positions 125b and 125d lie on line segment 125 at R-axis position RP. The Θ-axis position ΘP is assumed to be the Θ-axis position of the center of the circle that the recess 203 presents in plan view, and is used as the position for teaching in the Θ direction. The Θ-axis teaching is completed by performing step S409.

[0213] The movement in steps S401, S402, S405, and S406 is performed by the transport robot 8 under the control of the control unit 79.

[0214] The storage in steps S404 and S408 is, for example, storage to the storage medium 792b.

[0215] As described above, the Z-axis position ZP-γ, R-axis position RP, and Θ-axis position ΘP are obtained and stored as teaching positions, and step S15 ends. Using these teaching positions, the transport robot 8 accurately places the substrate W onto the chamber 31(i) in step S17.

[0216] <Transformation> In the above embodiment, the target of teaching may be, for example, the inversion unit 42 or the buffer station.

[0217] If the processing of the entire lot is prioritized over teaching, teaching does not need to be performed immediately after maintenance. For example, after steps S12 and S13 of the interruption / restart process (see Figure 16) are executed, step S17 may be executed without steps S14, S15, and S16 being executed. In this case, the transport process of the substrate W does not need to be interrupted. The processing of the entire lot is not interrupted because chamber 31(m) takes over the processing of chamber 31(i). Whether to prioritize the processing of the entire lot over teaching, or to prioritize teaching over the processing of the entire lot, as in the case of the interruption / restart process, can be provided to the control unit 79 as information for each lot in advance using the graphic user interface 20 or the host computer 500. Based on this information, the control unit 79 selectively executes the processing after step S13 is executed.

[0218] If the processing of the entire lot takes precedence over maintenance, maintenance, or maintenance and teaching, may be performed after the processing of the entire lot is completed. For example, after step S11 of the interruption / restart process is executed, and before step S12 is executed, a step is added to determine whether the processing of the entire lot has been completed. If the result of the determination in this step is positive, steps S12 and later are executed; if negative, the process continues to be executed. Such priorities can also be provided to the control unit 79 as information for each lot in advance by the user using the graphic user interface 20 or the host computer 500.

[0219] In the R / Θ axis teaching performed in step S152 (see Figure 17) (see Figure 25), steps S152B and S152C may be performed in reverse order.

[0220] Furthermore, it is possible to combine all or part of the above embodiments and various modifications as appropriate, within a non-contradictory scope. [Explanation of Symbols]

[0221] 8. Transport robots 31 Chamber (processing room) 40 shelves (storage space) 83b Bump (conductor) 100 Teaching boards 700 Substrate Processing Equipment 101 Sensor (1st sensor) 102 Sensor (Second Sensor) 103 Amplifier 104b pin R,Z,Θ direction W board

Claims

1. Processing room and A transport robot for transporting substrates to be processed in the aforementioned processing chamber, A teaching board for teaching the position of the substrate to the transport robot, Storage location for storing the teaching board and Equipped with, The teaching board is, A first sensor detects the position of the teaching substrate in a first direction parallel to the normal direction of the substrate placed in the processing chamber, and outputs the result of the detection. A second sensor detects the position of the teaching substrate in a plane perpendicular to the first direction and outputs the result of the detection. It has, The aforementioned teaching board is The device further includes conductive pins through which outputs from the first sensor and the second sensor are transmitted. The aforementioned transport robot A hand that supports the aforementioned substrate, The wall provided on the hand, A pusher that moves toward the substrate to press the substrate against the wall and hold the substrate, and moves away from the substrate to release the hold on the substrate, A conductor is provided on the pusher and contacts and makes electrical contact with the pin when the teaching substrate is held by the transport robot. A substrate processing apparatus having

2. A substrate processing apparatus according to claim 1, The aforementioned teaching board is An amplifier that amplifies the outputs from the first sensor and the second sensor and transmits them to the pin. A substrate processing apparatus further having the following.

3. A transport teaching method using a substrate processing apparatus as described in claim 1, The first step is for the transport robot to take out the teaching board from the storage location and hold it, A second step of teaching the position of the substrate in a first direction based on the output of the first sensor, and teaching the position of the substrate on the surface based on the output of the second sensor. A transport teaching method comprising:

4. A transport teaching method according to claim 3, Multiple processing rooms are provided. A transport teaching method wherein the second step for one of the processing chambers is performed in parallel with the processing of the substrate in the processing chamber that is not subject to the second step.

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