Grinding / polishing system and method with proximity sensor

JP7912007B2Active Publication Date: 2026-08-27ILLINOIS TOOL WORKS INC
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Patent Information

Application Number
JP2023525607
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-10-18
Filing Date
2021-10-19
Publication Date
2026-08-27
Estimated Expiration
2041-10-19

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Abstract

An exemplary grinder / polisher system includes a sample holder configured to secure a sample, a platen, an actuator configured to move at least one of the sample holder and the platen, a sensor configured to detect an object within a field of view of the sensor, and a controller configured to control movement of the actuator and stop the actuator in response to detection of the object by the sensor while the actuator is moving.
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Description

Technical Field

[0001] Related Applications This application claims the benefit of U.S. Provisional Patent Application No. 63 / 105,725, filed Oct. 26, 2020, entitled “GRINDING / POLISHING SYSTEMS AND METHODS HAVING PROXIMITY SENSORS”. The entire disclosure of U.S. Provisional Patent Application No. 63 / 105,725 is hereby incorporated by reference in its entirety.

[0002] Background The present disclosure relates generally to grinding / polishing systems, and more particularly to grinding / polishing systems and methods having proximity sensors.

Background Art

[0003] For a number of purposes and across a wide variety of fields and industries, grinding and polishing operations are performed on samples or specimens. In some applications, surface conditioning of the sample by grinding / polishing operations is a prerequisite for sample testing such as microscopy, and serves as a basis, for example, when testing materials and components in the manufacturing field. A grinding / polishing apparatus can perform both grinding and polishing operations and process a sample to achieve the required finish for a particular application.

Summary of the Invention

[0004] Summary A grinding / polishing system and method having proximity sensors are disclosed as being substantially illustrated by at least one of the drawings and described with respect to that drawing, and more fully set forth in the claims.

Brief Description of the Drawings

[0005] [Figure 1]This figure shows an exemplary grinding / polishing apparatus according to an aspect of the present disclosure, having one or more detection devices configured to detect the entry of foreign matter into a volume adjacent to the grinding / polishing apparatus.

[0006] [Figure 2] This is a block diagram representing the grinding / polishing apparatus shown in Figure 1.

[0007] [Figure 3A-3B] Figure 1 is a plan view of an exemplary grinding / polishing apparatus, including an exemplary detection device for detecting foreign objects and a corresponding field of view.

[0008] [Figure 4] This flowchart illustrates an example of a machine-readable command that can be executed by the controller in Figure 2 to turn off one or more actuators of a grinding / polishing device in response to the detection of foreign matter entering a volumetric space. [Modes for carrying out the invention]

[0009] The drawings are not necessarily to scale. Where appropriate, the same or identical reference numerals are used to indicate similar or identical elements.

[0010] Detailed explanation A grinding / polishing system involves grinding and / or polishing a sample using one or more motors or other actuators. The polished sample can then be used to test the manufacturing or other process that produced the sample, such as by performing visual inspection, hardness testing, and / or any other desired tests. However, physical interference with the grinding / polishing operation, such as contact between foreign matter and the grinding / polishing equipment and / or the sample, is undesirable.

[0011] The illustrated grinding / polishing systems and methods disclosed monitor the volumetric space around the grinding / polishing operation and / or the equipment and automatically stop or disable the equipment (e.g., motor, actuator, etc.) in response to the detection of foreign matter in proximity to the grinding / polishing operation. Illustrative techniques that can be used to monitor the volumetric space include ultrasonic detection, retroreflective proximity detection, optical and / or image detection, and / or the use of a light curtain. The illustrated grinding / polishing system prevents further use or operation of the grinding / polishing system until the removal of foreign matter is detected.

[0012] To facilitate understanding of the principles of the claimed technology and to present the best currently understood modes of operation, the embodiments shown in the drawings will be referred to and described using specific terminology. However, this is not intended to limit the scope of the claimed technology, and it should be understood that such changes and further modifications in the shown devices, and such further applications of the principles of the claimed technology shown, are considered to be conventionally conceivable by those skilled in the art related to the claimed technology.

[0013] As used herein, the term “exemplary” means “serving as an example, illustration, or demonstrable example.” The embodiments described herein are illustrative and not limiting. It should be understood that the embodiments described herein are not necessarily construed as preferable or beneficial to other embodiments. Furthermore, the term “embodiment” does not require that all disclosed embodiments include the features, advantages, or modes of operation discussed.

[0014] As used herein, the terms “circuit” and “circuit section” mean physical electronic components (i.e., hardware) and any software and / or firmware ("code") that can constitute the hardware, can be executed by the hardware, and / or can be otherwise associated with the hardware. As used herein, for example, a particular processor and memory may include a first “circuit” when executing a first set of one or more lines of code, and a second “circuit” when executing a second set of one or more lines of code. As used herein, “and / or” means any one or more items in the list linked by “and / or”. For example, “x and / or y” means any element of the set of three elements {(x), (y), (x,y)}. In other words, “x and / or y” means “one or both of x and y”. As another example, “x, y and / or z” means any element of the seven-element set {(x), (y), (z), (x,y), (x,z), (y,z), (x,y,z)}. In other words, “x, y and / or z” means “one or more of x, y and z.” As used herein, the term “exemplary” means to serve as an unrestricted example, case, or illustration. As used herein, the term “for example” begins a list of one or more unrestricted examples, cases, or illustrations. As used herein, whenever a circuit section includes the hardware and code (if any) necessary to perform a certain function, the circuit section is “operable” to perform that function, regardless of whether the performance of that function is made impossible or impossible (e.g., by user-configurable settings, factory trim, etc.).

[0015] The illustrated grinder / polisher system disclosed comprises a sample holder configured to hold a sample in place, a platen, an actuator configured to move at least one of the sample holder and the platen, a sensor configured to detect objects within the sensor's field of view, and a controller configured to control the movement of the actuator and to stop the actuator in response to the sensor detecting an object while the actuator is moving.

[0016] In some exemplary grinder / polisher systems, the controller is configured to detect an object based on identifying a background signal from a sensor and comparing a monitoring signal from the sensor with the background signal, in response to the initiation of an action involving movement by an actuator. In some examples, the controller is configured to detect an object if the difference between the monitoring signal and the background signal meets a threshold.

[0017] In some exemplary grinder / polisher systems, the actuators include a motor and a driver actuator, and the controller is configured to (i) control the motor to rotate at least one of the sample holder and platen according to selected grinding / polishing parameters, and (ii) control the drive actuator to press the sample or platen into the other of the sample and platen according to a selected applied load. Some exemplary grinder / polisher systems further include a user interface, and the controller is configured to output notifications via the user interface in response to object detection.

[0018] In some examples, the sensor includes at least one of an ultrasonic sensor, a retroreflective proximity sensor, a light sensor, or a light curtain sensor. Some exemplary grinder / polisher systems further include multiple sensors, which are configured to monitor multiple corresponding sub-volume spaces adjacent to the platen. In some examples, the controller is configured to disable the actuator until the removal of an object is detected via the sensors.

[0019] A method for controlling an exemplary grinder / polisher system disclosed involves, via a controller, controlling an actuator to move at least one of a sample holder and the grinder / polisher system or the platen of the grinder / polisher system, and via a sensor, controlling the actuator to stop in response to detecting an object within the sensor's field of view while the actuator is moving.

[0020] Some exemplary methods further involve detecting an object based on identifying a background signal from a sensor and comparing a monitoring signal from the sensor with the background signal, in response to the initiation of an action involving movement by an actuator. In some exemplary methods, object detection is performed when the difference between the monitoring signal and the background signal satisfies a threshold.

[0021] In some exemplary methods, controlling the actuator involves (i) controlling the actuator's motor to rotate at least one of the sample holder and platen according to selected grinding / polishing parameters, and (ii) controlling the actuator's drive actuator to press the sample or platen into the other of the sample and platen according to a selected applied load. Some exemplary methods further involve outputting a notification via a user interface in response to object detection.

[0022] In some exemplary methods, detecting an object via a sensor involves detecting the object via at least one of an ultrasonic sensor, a retroreflective proximity sensor, an optical sensor, or a light curtain sensor. In some exemplary methods, detecting an object via a sensor includes detecting the object via at least one of a plurality of sensors configured to monitor corresponding sub-volume spaces proximate to the platen. Some exemplary methods further involve disabling an actuator until removal of the object is detected via the sensor.

[0023] FIG. 1 shows an exemplary grinding / polishing system 100 having one or more proximity devices and configured to detect entry of foreign objects into a volume space proximate to the grinding / polishing system 100. The grinding / polishing system 100 includes a power head assembly 102 having a sample holder 112 that holds a sample 116 (one shown), a cabinet or base 104 having a bowl 106, and an input device or unit control panel 122.

[0024] The bowl 106 forms an opening within the base 104. The bowl 106 includes a removable bowl liner (not shown), such as a transparent plastic bowl liner, to prevent accumulation of debris, contaminants, and residue within the bowl. A splash guard 109 is further positioned around the bowl 106 to contain fluid within the bowl, minimize spraying splashes, and prevent an article from inadvertently entering the bowl or contacting movable components of the grinding / polishing apparatus, such as the platen 108 or the sample holder 112.

[0025] The platen 108 is installed within the bowl 106. A pad 110 is fixed to the top of the platen 108 and is configured to contact the sample 116 during the grinding / polishing cycle. Many types of pads 110 can be used in the grinding / polishing operation. For example, the pad 110 can be a grinding disk, such as a silicon carbide grinding disk or a diamond grinding disk. In other embodiments, the pad 110 may be a polishing pad. The platen 108 is operably connected to an actuator that will be described in more detail with reference to FIG. 2. As an example, the underside of the platen 108 can have an opening for receiving drive pins on top of the drive plate of the actuator to fix the platen 108 to the actuator, although many other mechanisms can be used to fix the platen to the actuator.

[0026] The platen 108 (e.g., via an actuator controlled by a controller) is controlled to rotate, vibrate, or otherwise move to process the sample 116 during the grinding / polishing operation.

[0027] The power head assembly 102 is fixed to the base 104 and positions the sample holder 112 relative to the platen 108. In the illustrated embodiment, the sample holder 112 has a plurality of sample receiving slots 114 that hold a sample 116 (one shown) to be subjected to the grinding / polishing operation by the system 100. The sample holder 112 is operably connected to an actuator of the power head assembly 102. In the illustrated embodiment, the sample holder 112 is removably fixed to the actuator 118 via a chuck 115.

[0028] The fluid dispenser 120 is located on the base 104 and positioned to supply water, and in the illustrated embodiment, other types of fluid may be supplied to the platen 108. The fluid supplied to the platen 108 is collected in the bowl 106 and can be drained as needed. The dispenser includes a valve that can be operated to control the supply flow rate.

[0029] Examples of fluids that can be supplied include water, suspensions including diamond suspensions and other suspensions, polishing suspensions, lubricants, and other fluids. In certain embodiments, one or more fluids may be supplied by one or more dispensers. In embodiments that supply multiple fluids, such as water and other types of fluids, the water and other fluids (which may be more) are supplied by their respective supply lines (not shown), for example, a water service line and a fluid supply line. In embodiments, the water and other fluids are supplied from a reservoir or canister tank located on or remotely from the device. The controller may also provide automatic control of the fluids, which can be selected by the user on a control panel. In embodiments, the controller 190 operates the dispensers to adjust the flow rate by turning them on and off.

[0030] In the illustrated example, the dispenser 120 can supply water from one nozzle and another type of fluid from a second nozzle shown in the illustration, but in other examples, the second nozzle may be a standalone unit and part of a second dispenser separate from the base 104. In such embodiments, the fluid flow can be controlled by the standalone unit, for example, manually by a knob, or by a controller of the standalone dispenser unit. The second nozzle can be positioned next to the system 100 and, in embodiments, can be fixed to the base 104.

[0031] The unit control panel 122 displays grinding / polishing equipment data and information and receives user input, among other things. In embodiments, the unit control panel may include various buttons, knobs, switches, sliders, displays, touchscreens, touchpads, lights, indicators, etc., for displaying information and receiving user input. The unit control panel 122 may further include other components, such as peripherals, audio circuits and speakers, microphones, communication devices (wired or wireless), and other recognized components. In the example of Figure 1, the unit control panel 122 has a touch-sensitive display 124. As shown in Figure 1, a manual control knob 121 is also located on the base 104 and is operable to control the volume space of the flow rate delivered by the dispenser 120.

[0032] To reduce or prevent interference with the grinding / polishing operation during the movement of the platen 108, the exemplary grinding / polishing system 100 includes one or more sensors 152, which are positioned and configured to detect objects (e.g., hands, tools, etc.) within the detection field of the corresponding sensor(s) 152. In the example of Figure 1, the sensor 152 is configured to detect objects entering a volumetric space 154 adjacent to the grinding / polishing system 100, more specifically, adjacent to the moving components of the system 100 (e.g., platen 108, pad 110, etc.). Although the exemplary volumetric space 154 is depicted as a cylinder, the volumetric space 154 can be any shape or size based on a desired volumetric space to be monitored for foreign objects.

[0033] Examples of sensors that can be used to implement the foreign object detection sensor 152 include ultrasonic sensors, retroreflective proximity sensors, light sensors (e.g., cameras), light curtain sensors, and / or any other sensors. As will be described in more detail later, if one or more of the sensors 152 detect the presence of a foreign object during grinding or polishing, the platen 108 and / or other moving objects are stopped, and the unit control panel 122 can output a visual and / or audible notification of the detection.

[0034] Figure 2 is a block diagram representing the grinding / polishing system 100 illustrated in Figure 1. As shown in Figure 2, the grinding / polishing system 100 includes a controller 190, which is connected to a machine-readable storage device 191, actuators 117 and 118, a control panel 122, and a sensor 152.

[0035] The control circuit unit or controller 190 includes circuit units (e.g., a microcontroller and memory such as a non-temporary machine-readable storage device 191) that are operable to process data from the actuators 117, 118, the dispenser 120, and the unit control panel 122. For example, the controller 190 may include one or more processors and / or other logic circuit units that control the operation of the grinding / polishing apparatus. Examples of processors include one or more microprocessors, e.g., one or more "general-purpose" microprocessors, one or more dedicated microprocessors and / or ASICs, one or more microcontrollers, and / or any other type of processing and / or logic device. For example, the controller 190 may include one or more digital signal processors (DSPs). The controller 190 is operable to receive and respond to user input signals from the unit control panel 122 to control components of the grinding / polishing apparatus, such as the actuators, dispensers, their components, and other elements of the apparatus.

[0036] The actuator 117 rotates, vibrates, or otherwise moves the platen 108 to process the sample 116 during the grinding / polishing operation. In some examples, the actuator 117 is a bidirectional motor configured to rotate the platen 108 in either direction at a selected speed. In other examples, the actuator 117 includes a motor that can be operated to vibrate or otherwise move the platen 108 to process the sample 116.

[0037] In some examples, the actuator 118 may be configured to move the platen 108 toward and / or away from the sample 116 in order to adjust the load or force applied between the platen and the sample (e.g., a linear actuator controlled to move or drive toward and away from the sample). Many types of actuators may be used to facilitate grinding / polishing operations.

[0038] The actuator 118 is controlled to rotate, vibrate, or otherwise move the sample holder 112 (and sample 116) relative to the platen 108 (and pad 110) in order to process the sample 116 during the grinding / polishing operation. In the illustrated example, the actuator 118 includes a bidirectional motor configured to rotate the sample holder 112 in either direction at a selected speed, and further includes a linear type actuator configured to press the sample holder 112 (with the sample 116) toward or away from the platen 108 in order to adjust the load or force applied between the sample and the platen. In some examples, the actuator is configured to vibrate or move the sample holder 112 relative to the platen during operation. Any desired actuator may be used.

[0039] The controller 190 operates the dispenser 120 to turn it on and off and to adjust the flow rate. The controller 190 further controls the actuators 117, 118 to configure and / or perform grinding and / or polishing operations.

[0040] As described above, detection of a foreign object by sensor 152 causes the grinding or polishing operation to stop. For this purpose, the exemplary controller 190 monitors the signal from sensor 152 to determine whether sensor 152 has detected a foreign object (e.g., within volume space 154). In response to sensor 152 detecting an object while one or both of actuators 117, 118 are moving, controller 190 stops actuators 117, 118 to mitigate the effects of any potential contact between the foreign object and the grinding / polishing system 100. In some examples, controller 190 programmed to prevent further movement by actuators 117, 118 while a foreign object is detected (e.g., until the foreign object is removed).

[0041] In some examples, to detect foreign objects, a sensor 152 (e.g., an ultrasonic sensor, a retroreflective proximity sensor) is used to measure a baseline or background measurement at the start of a grinding / polishing procedure, where it is expected that no foreign objects are present at the start of the grinding / polishing procedure (e.g., the operator's hands must be outside the volumetric space 154 to start the operation, for example, by pressing several buttons to initiate the operation). For example, an ultrasonic sensor can measure a baseline distance measurement from the sensor to the platen 108, and the monitored volumetric space 154 is positioned between the ultrasonic sensor and the platen 108. As a result, when a foreign object enters the volumetric space 154, the distance measurement becomes smaller than the baseline measurement, and the controller 190 can detect the foreign object(s) by comparing the measurement taken during the grinding or polishing operation with the baseline or background measurement. For example, if the change in the distance measurement is greater than a threshold (e.g., a noise filtering threshold), the controller 190 detects the presence of a foreign object.

[0042] In some other examples, one or more of the sensors 152 are cameras or other optical sensors that provide images to the controller 190. The controller 190 can use image recognition techniques to detect the entry of foreign objects into the field of view of the cameras or optical sensors. In some examples, the controller 190 can be trained to ignore the spin motion of the platen 108, pad 110, sample holder 112, and / or any other objects that may interfere with foreign object detection. In addition or alternatively, the controller 190 may apply filters to filter or otherwise ignore components of the grinding / polishing system 100. If the controller 190 determines that the difference between the baseline or default image and the monitored image meets a difference threshold, the controller 190 can detect the presence of a foreign object.

[0043] Figure 3A is a plan view of the exemplary grinding / polishing system 100 of Figure 1, including an example arrangement of sensors 302a, 302b, 302c, 302d for detecting foreign objects and corresponding fields of view 304a, 304b, 304c, 304d. In the example of Figure 3A, sensors 302a, 302b, 302c, 302d are positioned on the power head assembly 102 across the platen 108, and fields of view 304a-304d are oriented downward toward the platen 108 and outward toward the power head assembly 102.

[0044] Figure 3B is a plan view of the exemplary grinding / polishing system 100 of Figure 1, including another exemplary arrangement of foreign object detection sensors 312a, 312b, 312c, 312d and corresponding fields of view 314a, 314b, 314c, 314d. In the example of Figure 3B, sensors 312a, 312b, 312c, 312d are located on the base 104, and fields of view 304a-304d are oriented upward from the base 104 toward the power head assembly 102.

[0045] Fields 304a-304d and 314a-314d can be implemented as sub-volume spaces of the monitored volume space 154, and each sensor 302a-302d and 312a-312d detects foreign objects within their respective sub-volume spaces, thereby detecting foreign objects within the monitored volume space 154 as a whole.

[0046] While illustrative arrangements are disclosed with reference to Figures 3A and 3B, other numbers of one or more sensors, sensor arrangements, and / or other configurations may be used based on the structure of the volume space 154 and / or grinding / polishing system 100 to be monitored. In some examples, the fields of view of the sensors overlap to provide redundancy between the sensors, and multiple sensors are required to detect foreign objects and take action.

[0047] Figure 4 is a flowchart representing an exemplary machine-readable command 400 that can be executed by the controller in Figure 2 to control one or more actuators of the grinding / polishing apparatus based on the detection of the entry of foreign matter into a volumetric space. The exemplary command 400 is described below with reference to the exemplary grinding / polishing system 100 in Figures 1 and 2.

[0048] In block 402, the operator and / or controller 190 configure the grinding / polishing operation. For example, the operator can provide a sample and / or configure the parameters of the grinding / polishing operation via the unit control panel 122.

[0049] In block 404, controller 190 determines whether the grinding / polishing operation has started. For example, controller 190 can determine whether the operator has started the grinding / polishing operation via an input. An example input involves both hands of the operator, such as multiple buttons spaced apart on the base 104 to avoid the operator's hands being in volume space 154 when the operation starts. If the grinding / polishing operation has not started (block 404), control returns to block 402 and continues configuring the operation.

[0050] In response to the commencement of a grinding / polishing operation (block 404), in block 406, the controller 190 obtains baseline measurements (which may be more) from one or more sensors 152 that monitor the volumetric space 154 (and / or a portion of the volumetric space 154). Examples of exemplary sensors (which may be more) 152 include ultrasonic sensors, retroreflective proximity sensors, optical sensors (e.g., cameras), light curtain sensors, and / or any other sensors capable of detecting objects within the sensor's field of view, such as in an example involving a camera or other image-based sensor and image processing for identifying foreign objects.

[0051] In block 408, the controller 190 controls actuators 117, 118 to perform grinding / polishing operations. The controller 190 can control actuators 117, 118 according to configured parameters.

[0052] In block 410, the controller 190 acquires monitored measurements(s)(s)(s)(s)152. For example, the controller 190 can acquire one or more measurements from each of the same(s)(s)152 as the baseline measurements in block 406. In an example involving a camera or other image sensor, the exemplary controller 190 can acquire images(s)(s)(s) from each of the(s) image sensors(s).

[0053] In block 412, the controller 190 determines whether the monitored measurement(s) indicate the presence of a foreign object within the monitored volumetric space (e.g., volumetric space 154, field of view 304a-304d, 314a-314d). For example, the controller 190 can compare each monitored measurement(s) with their respective baseline measurements obtained from the same sensor(s) 152. In one example involving an ultrasonic sensor, distance measurements from the ultrasonic sensor during grinding / polishing operations can be compared with baseline distance measurements. If the difference meets a threshold (e.g., the change in distance is greater than the threshold change), the controller 190 can determine that a foreign object is present. In several other examples where an image sensor is used, the controller 190 can perform one or more image processing techniques on the image(s) acquired during the grinding / polishing operation.

[0054] If the monitored measurements (which may include multiple measurements) do not indicate the presence of foreign matter (block 412), in block 414, the controller 190 determines whether the grinding / polishing operation is complete. If the grinding / polishing operation is not complete (block 414), control returns to block 408 and continues to control actuators (which may include multiple measurements) 117, 118. If the grinding / polishing operation is complete (block 414), control returns to block 402 and configures the next grinding / polishing operation.

[0055] If the monitored measurement(s) indicate the presence of foreign matter (block 412), in block 416, the controller 190 turns off actuators 117, 118 (e.g., to stop the movement of the platen 108, sample holder 112, and / or other components). In some examples, the controller 190 may engage the brakes to more quickly decelerate the movement of the platen 108, sample holder 112, and / or other components. In addition or alternatively, the controller 190 may control actuators 117, 118 to apply forces in the opposite direction to quickly reduce the movement speed of the platen 108, sample holder 112, and / or other components. In block 418, the controller 190 acquires additional monitored measurement(s) from sensor(s) 152. Block 418 can be performed in the same or identical manner as block 410.

[0056] In block 420, the controller 190 determines whether the operator is attempting to restart the grinding / polishing operation. Restarting the grinding / polishing operation may be similar to or identical to starting the grinding / polishing operation in block 404, but instead of restarting the grinding / polishing operation from the beginning, the grinding / polishing operation can be restarted. If the grinding / polishing operation is restarted (block 420), in block 422, the controller 190 determines whether the monitored measurement indicates the removal of foreign matter from the monitored volume space. For example, block 422 can be performed by determining whether foreign matter is present based on monitored measurement(s), which may be multiple, in a manner similar to block 412.

[0057] If the foreign object has not been removed (block 422), control returns to 416 and keeps actuators 117 and 118 in the off state (e.g., disabled). If the foreign object has been removed (block 422), control returns to block 408 and restarts the grinding / polishing operation, controlling actuators 117 and 118 to perform the grinding / polishing operation.

[0058] If the grinding / polishing operation is not resumed (block 420), in block 424, the controller 190 determines whether the grinding / polishing operation has finished. If the grinding / polishing operation has finished (block 424), control returns to block 402 to configure the next grinding / polishing operation. If the grinding / polishing operation has not finished (block 424), control returns to 416 to keep actuators 117 and 118 in the off state (e.g., disabled).

[0059] The methods and systems described herein can be implemented in hardware, software, or a combination of hardware and software. The methods and / or systems can be implemented centrally in at least one computing system, or distributed across several interconnected computing systems with different elements distributed among them. Any type of computing system or other device adapted to perform the methods described herein is suitable. A typical combination of hardware and software may include a general-purpose computing system, along with a program or other code that, once loaded and executed, controls the computing system to perform the methods described herein. Another typical embodiment may include an application-specific integrated circuit or chip. Some embodiments may include a non-temporary machine-readable (e.g., computer-readable) medium (e.g., flash drive, optical disk, magnetic storage disk, etc.) that stores one or more lines of machine-executable code, thereby causing a machine to perform a process such as those described herein.

[0060] The above description and accompanying drawings illustrate the principle, preferred embodiments, and modes of operation. However, this disclosure should not be construed as being limited to the specific embodiments described above. Additional variations of the embodiments described above will be understood by those skilled in the art.

[0061] While the Method and / or System has been described with reference to certain specific embodiments, those skilled in the art will understand that various modifications can be made and equivalents can be substituted without departing from the scope of the Method and / or System. In addition, many modifications can be made to adapt the teachings of this disclosure to specific circumstances or materials without departing from the scope of this disclosure. For example, blocks and / or components of the disclosed examples can be combined, divided, rearranged, and / or otherwise modified. Thus, the Method and / or System is not limited to the specific embodiments disclosed. Instead, the Method and / or System includes all embodiments that fall within the scope of the appended claims, either literally or under the doctrine of equivalents. While the Controller and Method have been described as being used in conjunction with a grinding / polishing apparatus, the teachings can similarly be applied to other apparatuses where it is desirable to determine and control the grinding and / or polishing operation.

[0062] All documents referenced herein, including published academic papers or abstracts, published or corresponding U.S. patent applications or foreign patent applications, issued patents or foreign patents, or any other documents, each in its entirety, including all data, tables, figures, and text presented within the referenced documents, constitute part of this specification by reference. [Configuration 1] A grinder / polisher system, A sample holder configured to fix the sample, Platen and, An actuator configured to move at least one of the sample holder and the platen, A sensor configured to detect an object within the field of view of the sensor, A controller configured to control the movement of the actuator and to stop the actuator in response to the detection of an object by the sensor while the actuator is moving, A grinder / polisher system equipped with [features / equipment]. [Configuration 2] The aforementioned controller, In response to the initiation of an operation involving movement by the actuator, the background signal from the sensor is identified. Based on comparing the monitoring signal from the sensor with the background signal, an object is detected, A grinder / polisher system as described in Configuration 1, configured to perform the following: [Configuration 3] The grinder / polisher system according to configuration 2, wherein the controller is configured to detect the object when the difference between the monitoring signal and the background signal meets a threshold. [Structure 4] The grinder / polisher system according to Configuration 1, wherein the actuator includes a motor and a driver actuator, and the controller is further configured to (i) control the motor to rotate at least one of the sample holder and the platen according to selected grinding / polishing parameters, and (ii) control the driver actuator to press the sample or the platen into the other of the sample and the platen according to a selected applied load. [Composition 5] The grinder / polisher system according to configuration 4, further comprising a user interface, wherein the controller is configured to output a notification via the user interface in response to the detection of the object. [Composition 6] The grinder / polisher system according to configuration 1, wherein the sensor includes at least one of an ultrasonic sensor, a retroreflective proximity sensor, a light sensor, or a light curtain sensor. [Composition 7] The grinder / polisher system according to configuration 1, further comprising a plurality of sensors including the aforementioned sensor, wherein the plurality of sensors are configured to monitor a plurality of corresponding sub-volume spaces adjacent to the platen. [Structure 8] The grinder / polisher system according to configuration 1, wherein the controller is configured to disable the actuator until the removal of the object is detected via the sensor. [Composition 9] A method for controlling a grinder / polisher system, Controlling an actuator via a controller to move at least one of the sample holder of the grinder / polisher system or the platen of the grinder / polisher system, Controlling the actuator to stop in response to detecting an object within the sensor's field of view while the actuator is moving, via the sensor. Methods that include... [Configuration 10] Furthermore, In response to the initiation of an operation involving movement by the actuator, the background signal from the sensor is identified. Based on comparing the monitoring signal from the sensor with the background signal, an object is detected, A method including configuration 9. [Composition 11] The method according to configuration 10, wherein the object is detected when the difference between the monitoring signal and the background signal satisfies a threshold. [Composition 12] The method according to configuration 9, wherein controlling the actuator includes (i) controlling the motor of the actuator to rotate at least one of the sample holder and the platen according to selected grinding / polishing parameters, and (ii) controlling the drive actuator of the actuator to press the sample or the platen into the other of the sample and the platen according to a selected applied load. [Composition 13] The method according to configuration 12, further comprising outputting a notification via a user interface in response to the detection of the object. [Composition 14] The method according to configuration 9, wherein detecting the object via the sensor includes detecting the object via at least one of an ultrasonic sensor, a retroreflective proximity sensor, a light sensor, or a light curtain sensor. [Composition 15] The method according to configuration 9, wherein detecting the object via the sensor includes detecting the object via at least one of a plurality of sensors configured to monitor a plurality of corresponding sub-volume spaces adjacent to the platen. [Composition 16] The method according to configuration 9, further comprising disabling the actuator until the removal of the object is detected via the sensor.

Claims

1. A grinder / polisher system, A sample holder configured to fix the sample, A platen is provided on the base, An actuator configured to move at least one of the sample holder and the platen, A sensor provided on the base surrounding the platen, configured to detect an object within the sensor's field of view, A controller configured to control the movement of the actuator and to stop the actuator in response to the detection of an object by the sensor while the actuator is moving, Equipped with, The grinder / polisher system further comprises a power head assembly for positioning the sample holder relative to the platen, The aforementioned sensor is an ultrasonic sensor or an optical sensor. The field of view of the sensor is directed upward from the base toward the power head assembly. Grinder / polisher system.

2. The aforementioned controller, In response to the initiation of an operation involving movement by the actuator, the background signal from the sensor is identified. Based on comparing the monitoring signal from the sensor with the background signal, an object is detected, A grinder / polisher system according to claim 1, configured to perform the following:

3. The grinder / polisher system according to claim 2, wherein the controller is configured to detect the object when the difference between the monitoring signal and the background signal satisfies a threshold.

4. The grinder / polisher system according to claim 1, wherein the actuator includes a motor and a driver actuator, and the controller is further configured to (i) control the motor to rotate at least one of the sample holder and the platen according to selected grinding / polishing parameters, and (ii) control the driver actuator to press the sample or the platen against the other of the sample and the platen according to a selected applied load.

5. The grinder / polisher system according to claim 4, further comprising a user interface, wherein the controller is configured to output a notification via the user interface in response to the detection of the object.

6. The grinder / polisher system according to claim 1, further comprising a plurality of sensors including the aforementioned sensor, wherein the plurality of sensors are configured to monitor a plurality of corresponding sub-volume spaces adjacent to the platen.

7. The grinder / polisher system according to claim 1, wherein the controller is configured to disable the actuator until the removal of the object is detected via the sensor.

8. A method for controlling a grinder / polisher system comprising a sample holder configured to fix a sample and a platen provided on a base, Controlling the actuator via the controller to move at least one of the sample holder or the platen, Controlling the actuator to stop in response to detecting an object within the field of view of the sensor while the actuator is moving, via the sensor provided on the base around the platen, Includes, The grinder / polisher system further includes a power head assembly that positions the sample holder relative to the platen. The aforementioned sensor is an ultrasonic sensor or an optical sensor. The field of view of the sensor is directed upward from the base toward the power head assembly. method.

9. Furthermore, In response to the initiation of an operation involving movement by the actuator, the background signal from the sensor is identified. Based on comparing the monitoring signal from the sensor with the background signal, an object is detected, The method according to claim 8, including the method described in claim 8.

10. The method according to claim 9, wherein the object is detected when the difference between the monitoring signal and the background signal satisfies a threshold.

11. The method according to claim 8, wherein controlling the actuator includes (i) controlling the motor of the actuator to rotate at least one of the sample holder and the platen according to selected grinding / polishing parameters, and (ii) controlling the drive actuator of the actuator to press the sample or the platen against the other of the sample and the platen according to a selected applied load.

12. The method according to claim 11, further comprising outputting a notification via a user interface in response to the detection of the object.

13. The method according to claim 8, wherein detecting the object via the sensor includes detecting the object via at least one of a plurality of sensors configured to monitor a plurality of corresponding sub-volume spaces adjacent to the platen.

14. The method according to claim 8, further comprising disabling the actuator until the removal of the object is detected via the sensor.

Citation Information

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