Inductor, singulated inductor, and method for manufacturing same

JPWO2022168924A5Pending Publication Date: 2025-02-12
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Patent Information

Application Number
JP2022579607
Authority / Receiving Office
JP · JP
Patent Type
Applications
Priority Date
2022-02-03
Filing Date
2022-02-03
Publication Date
2025-02-12

AI Technical Summary

Technical Problem

Inductors face a decrease in inductance when the magnetic layer between adjacent wirings is cut, leading to excessive shortening of the distance between the end wiring and the cut side end face, and difficulty in miniaturizing the singulated inductor due to insufficient magnetic particles, while long distances between wires hinder size reduction.

Method used

Incorporating a magnetic layer with wiring arrangement portions and margin portions, where wiring is omitted in the margin portions to ensure a sufficient distance between the cut side end face and the adjacent wiring, allowing for regular parallel arrangement of wirings to maintain inductance and compact size.

Benefits of technology

This approach effectively suppresses the decrease in inductance and allows for miniaturization of the singulated inductor by ensuring adequate magnetic particles between the cut side end face and the wiring, while enabling compact wiring arrangement and size reduction.

✦ Generated by Eureka AI based on patent content.
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Abstract

An inductor (1) comprises a magnetic layer (2) and a plurality of wires (3) embedded in the magnetic layer (2) and extending in a longitudinal direction. The plurality of wires (3) are parallel with a predetermined interval therebetween in a direction perpendicular to the longitudinal direction. The magnetic layer (2) includes a plurality of wire arranged portions (7) in which the wires (3) are arranged regularly in parallel, and a margin portion (8) which is disposed between wire arranged portions (7) adjacent to each other in the parallel direction of the wires (3) and in which the wires (3) are omitted.
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Description

Inductor, individualized inductor, and method for manufacturing same

[0001] The present invention relates to an inductor, a singulated inductor, and a method for manufacturing the same.

[0002] An inductor is known that includes a magnetic layer and a plurality of wires embedded in the magnetic layer (see, for example, Patent Document 1 below). In the inductor described in Patent Document 1, the plurality of wires are arranged in parallel at equal intervals in the horizontal direction. The magnetic layer contains magnetic particles.

[0003] Japanese Patent Application Laid-Open No. 2020-150057

[0004] Depending on the application and purpose, the magnetic layer between adjacent wirings may be cut in the thickness direction to manufacture individual inductors that are smaller in size than the inductor.

[0005] In the inductor described in Patent Document 1, when the distance between two adjacent wirings is short, cutting the magnetic layer between the two adjacent wirings results in an excessively short distance between one end surface of the magnetic layer in the singulated inductor after cutting and the end wiring located at one lateral end. This results in an excessively small amount of magnetic particles in the magnetic layer between the one end surface and the end wiring. This poses a problem of reduced inductance of the singulated inductor.

[0006] On the other hand, if the distance between two adjacent wirings is long, there is a problem in that it is not possible to reduce the size of the individual inductors after cutting.

[0007] The present invention provides an individualized inductor that suppresses a decrease in inductance and is miniaturized, a method for manufacturing the same, and an inductor used therein.

[0008] The present invention (1) includes an inductor comprising a magnetic layer and a plurality of wirings embedded in the magnetic layer and extending in a longitudinal direction, the plurality of wirings being parallel to each other at predetermined intervals in a direction perpendicular to the longitudinal direction, the magnetic layer including a plurality of wiring arrangement portions in which the wirings are regularly arranged in parallel, and a margin portion in which the wirings are omitted and arranged between adjacent wiring arrangement portions in the parallel direction of the wirings.

[0009] In this inductor, the wiring is omitted from the marginal portion of the magnetic layer. Therefore, by cutting the marginal portion along the longitudinal direction, a sufficient distance can be secured between the cut end surface of the magnetic layer and the wiring adjacent to the cut end surface. This ensures that the amount of magnetic component present between the cut end surface and the wiring in the magnetic layer is sufficient. As a result, the decrease in inductance of the individual inductors after cutting can be suppressed.

[0010] On the other hand, in the wiring arrangement portion, the wiring is arranged regularly in parallel. Therefore, the wiring can be arranged compactly in the singulated inductor. As a result, the singulated inductor can be made smaller after cutting.

[0011] Therefore, with this inductor, it is possible to suppress a decrease in inductance of the singulated inductor after cutting, and also to reduce the size of the singulated inductor.

[0012] The present invention (2) includes the inductor according to (1), wherein the plurality of wires are arranged in parallel at equal intervals in the wiring arrangement portion.

[0013] In the wiring arrangement portion of this inductor, multiple wires are arranged in parallel at equal intervals. This allows the wires to be arranged more compactly in the wiring arrangement portion. In addition, the inductance of each wire can be made equal. As a result, the individualized inductors after cutting can be made even smaller, while the inductance of each wire can be made equal.

[0014] The present invention (3) also includes a method for manufacturing a singulated inductor, comprising a first step of preparing the inductor described in (1) or (2), and a second step of cutting the margin portion.

[0015] In the method for manufacturing the singulated inductor, since the margin portion is cut, a sufficient distance can be secured between the cut end surface of the magnetic layer and the wiring adjacent to the cut end surface. Therefore, the amount of magnetic component present between the cut end surface and the wiring in the magnetic layer is sufficient. As a result, a decrease in inductance of the singulated inductor after the second process can be suppressed.

[0016] On the other hand, in the wiring arrangement portion, the wiring is arranged regularly in parallel. Therefore, the wiring can be arranged compactly in the singulated inductor. As a result, the singulated inductor after the second process can be made smaller.

[0017] Therefore, this method for manufacturing a singulated inductor can suppress a decrease in inductance and manufacture a singulated inductor that is miniaturized.

[0018] The present invention (4) includes a singulated inductor comprising a magnetic layer and a plurality of wirings embedded in the magnetic layer and extending in a longitudinal direction, the plurality of wirings being parallel to each other at predetermined intervals in a direction perpendicular to the longitudinal direction, the magnetic layer including a wiring arrangement portion in which the wirings are regularly arranged in parallel, the wirings including end wirings arranged at one end of the wiring arrangement portion in the parallel direction of the wirings, and the distance from one side end face of the magnetic layer to the end wiring in the parallel direction is 0.2 mm or more and 7 mm or less.

[0019] In this singulated inductor, the distance from one end face of the magnetic layer to the end wiring is 0.2 mm or more, so that the amount of magnetic component present in the magnetic layer between the cut end face and the end wiring is sufficient, thereby suppressing a decrease in inductance of the singulated inductor.

[0020] Furthermore, in this singulated inductor, the distance from one end face of the magnetic layer to the end wiring is 7 mm or less, which allows the singulated inductor to be made smaller.

[0021] Therefore, this singulated inductor can be made smaller while suppressing a decrease in inductance.

[0022] The present invention (5) includes the singulated inductor according to (4), wherein an end face of the wiring in the longitudinal direction has an exposed portion exposed from the magnetic layer.

[0023] The present invention (6) includes the singulated inductor according to (4) or (5), wherein an end face of the wiring in the longitudinal direction has a covered portion that is covered with the magnetic layer.

[0024] The present invention (7) includes the singulated inductor according to any one of (4) to (6), which has a rectangular shape including curved corners in a plan view.

[0025] The present invention (8) provides the singulated inductor according to (7), wherein the curve is a curved line having a radius of curvature of 0.1 mm or more and 5 mm or less.

[0026] If the radius of curvature of the curve is equal to or greater than 0.1 mm, the impact resistance of the inductor can be improved.

[0027] If the radius of curvature of the curve is 5 mm or less as described above, the area near the corner can be made wider, and a mark can be placed in the free space.

[0028] The method for manufacturing a singulated inductor of the present invention using the inductor of the present invention can manufacture a singulated inductor that is miniaturized and suppresses a decrease in inductance.

[0029] The singulated inductor of the present invention is designed to suppress the decrease in inductance and to be miniaturized.

[0030] FIGS. 1A and 1B are plan views of an inductor and a singulated inductor of the present invention, respectively. FIG. 1A is an inductor. FIG. 1B is a plurality of singulated inductors. FIGS. 2A and 2B are cross-sectional views corresponding to FIGS. 1A and 1B, respectively. FIG. 2A is an inductor. FIG. 2B is a plurality of singulated inductors. FIGS. 3A and 3B are cross-sectional views of modified examples of an inductor and a singulated inductor, respectively. FIG. 3A is an inductor. FIG. 3B is a plurality of singulated inductors. FIGS. 4A and 4B are cross-sectional views of modified examples of an inductor and a singulated inductor, respectively. FIG. 4A is an inductor. FIG. 4B is a plurality of singulated inductors. FIGS. 5A and 5B are plan views of modified examples of an inductor and a singulated inductor, respectively. FIG. 5A is an inductor. FIG. 4B is a second singulated inductor. FIG. 6 is a front view of an end face of a modified singulated inductor in the longitudinal direction.

[0031] One embodiment of the inductor and singulated inductor of the present invention will be described with reference to FIGS. 1A-2B.

[0032] <Inductor 1> As shown in Figures 1A and 2A, the inductor 1 extends in a plane direction perpendicular to the thickness direction. The thickness direction is the depth direction of the paper in Figure 1A. The thickness direction is the up-down direction in Figure 2A. The plane direction includes a first direction and a second direction perpendicular to the first direction. The first direction is the up-down direction in Figure 1A. The first direction is the depth direction of the paper in Figure 2A. The second direction is the left-right direction in each of Figures 1A and 2A. The inductor 1 is a sheet that is approximately rectangular in plan view. The inductor 1 includes a magnetic layer 2 and a plurality of wirings 3.

[0033] <Magnetic Layer 2> The magnetic layer 2 has the same external shape as the inductor 1. The magnetic layer 2 has two main surfaces 4 opposing each other in the thickness direction, two first side end faces 20A and 20B (see FIG. 1A) opposing each other in a first direction, and two second side end faces 6 opposing each other in a second direction. The first side end faces 20A and 20B (see FIG. 1A) extend along the second direction. The second side end faces 6 extend along the first direction. The two second side end faces 6 include a second one-side end face 61 disposed on one side in the second direction and a second other-side end face 62 disposed on the other side in the second direction. Examples of materials for the magnetic layer 2 include magnetic compositions containing magnetic particles as a magnetic component. Examples of magnetic compositions are described in JP 2020-150057 A. The thickness of the magnetic layer 2 is, for example, 1 μm or more and, for example, 5,000 μm or less. The thickness of the magnetic layer 2 is the distance between the two main surfaces 4. The magnetic layer 2 includes a wiring arrangement portion 7, a margin portion 8, and a second margin portion 9, which will be described later.

[0034] <Wiring 3> The wiring 3 extends along a first direction. The first direction corresponds to the longitudinal direction of the wiring 3. A plurality of wirings 3 are arranged in parallel at predetermined intervals in a cross section along the thickness direction and the second direction. The cross section along the thickness direction and the second direction is the cross section depicted in FIG. 2A. Therefore, the second direction corresponds to the parallel direction in which the wirings 3 are arranged in parallel. The wiring 3 is embedded in the magnetic layer 2. The configuration and dimensions of each of the plurality of wirings 3 are described, for example, in JP 2020-150057 A. The radius R of the wiring 3 is, for example, 25 μm or more and, for example, 2000 μm or less. Next, the wiring arrangement portion 7 and the margin portion 8 will be described.

[0035] <Wiring arrangement portion 7> A plurality of wiring arrangement portions 7 (three in this embodiment) are included in the magnetic layer 2. The plurality of wiring arrangement portions 7 are spaced apart in the second direction. Each of the plurality of wiring arrangement portions 7 is arranged in the inductor 1 across the first direction. In the wiring arrangement portion 7, the wirings 3 are regularly arranged in parallel. Specifically, in the wiring arrangement portion 7, a plurality of wirings 3 (three in this embodiment) are arranged in parallel at equal intervals P0. The dimensions of the wirings 3 and the interval P0 between two adjacent wirings 3 are not limited. These are described, for example, in JP 2020-150057 A.

[0036] A plurality of wires 3 are arranged in the wiring arrangement portion 7. The plurality of wires 3 include a first end wire 31, a second end wire 32, and an intermediate wire 33. The first end wire 31 is arranged at one end in the second direction of the wiring arrangement portion 7. The second end wire 32 is arranged at the other end in the second direction of the wiring arrangement portion 7. The intermediate wire 33 is arranged between the first end wire 31 and the second end wire 32. Therefore, in the wiring arrangement portion 7, the first end wire 31, the intermediate wire 33, and the second end wire 32 are arranged in this order toward the other side in the second direction.

[0037] <Margin portion 8> The margin portion 8 is arranged between adjacent wiring placement portions 7. Specifically, the margin portion 8 connects two wiring placement portions 7 adjacent in the second direction. A plurality of margin portions 8 (two in this embodiment) are included in the magnetic layer 2. The number of wiring placement portions 7 is one more than the number of margin portions 8. Each of the plurality of margin portions 8 is arranged in the inductor 1 across the first direction.

[0038] The wiring 3 is omitted from the margin portion 8. More specifically, in the inductor 1 in which all of the wirings 3 are arranged in parallel at equal intervals P0 in the second direction, one wiring 3 is omitted (omitted) for every predetermined number of wirings 3 (four in this embodiment), and the area (and its vicinity) in the magnetic layer 2 from which the wiring 3 has been omitted (omitted) becomes the margin portion 8, and the area in the magnetic layer 2 other than the margin portion 8 becomes the wiring arrangement portion 7.

[0039] The wiring 3 is not disposed in the marginal portion 8, and only the magnetic layer 2 is disposed therein. The marginal portion 8 has a length in the second direction that ensures a distance L0, which will be described later.

[0040] <Second margin portion 9> The second margin portion 9 is arranged outside the wiring arrangement portion 7 located at the outermost side in the second direction. In other words, the second margin portion 9 is arranged at both ends of the inductor 1 in the second direction. Specifically, the second margin portion 9 is arranged on one side of the wiring arrangement portion 7 located at the outermost side in the second direction, and on the other side of the wiring arrangement portion 7 located at the outermost side in the second direction. In this embodiment, the number of second margin portions 9 is two. No wiring 3 is arranged in the second margin portion 9, and only the magnetic layer 2 is arranged therein.

[0041] <Method for Manufacturing Segmented Inductor 10> Next, a method for manufacturing the segmented inductor 10 using the inductor 1 will be described. This manufacturing method includes a first step and a second step.

[0042] <First Step> In the first step, the inductor 1 shown in Figures 1A and 2A is prepared. There are no limitations on the method for preparing the inductor 1. The method for preparing the inductor 1 is described in, for example, JP 2020-150057 A.

[0043] <Second Step> In the second step, the margin portion 8 is cut. Specifically, a substantially central portion 81 in the second direction of the margin portion 8 is cut along the first direction. More specifically, the magnetic layer 2 is cut at the central portion 81 in the second direction between the second end wiring 32 and the first end wiring 31 facing the second end wiring 32 in the second direction. More specifically, the magnetic layer 2 is cut so as to pass through a point located on the other side of the second direction from the second end wiring 32 by a length equal to the spacing P0 between the wirings 3 and the sum of the radius R of the wiring 3 (P0 + R). The magnetic layer 2 is also cut so as to pass through a point located on one side of the second direction from the first end wiring 31 by a length equal to the spacing P0 between the wirings 3 and the sum of the radius R of the wiring 3 (P0 + R).

[0044] The margin portion 8 can be cut by non-contact cutting such as using a laser, for example. The wiring 3 can be cut by contact cutting such as punching using a die or dicing using a rotary cutter, for example. From the viewpoint of shortening the time required for the second step, contact cutting is preferred, and from the viewpoint of improving product quality, punching is more preferred.

[0045] By cutting the margin portion 8 as described above, one margin portion 8 is divided into two. In this embodiment, by cutting each of the two margin portions 8, three singulated inductors 10 are manufactured.

[0046] <Singulated inductors 10> The three singulated inductors 10 include a first singulated inductor 21, a second singulated inductor 22, and a third singulated inductor 23. The first singulated inductor 21 includes a wiring arrangement portion 7 that is arranged on one side of the inductor 1 in the second direction. The third singulated inductor 23 includes a wiring arrangement portion 7 that is arranged on the other side of the inductor 1 in the second direction. The second singulated inductor 22, the first singulated inductor 21, and the third singulated inductor 23 will be described in order.

[0047] First, the second singulated inductor 22 will be described in detail, followed by a brief description of the first singulated inductor 21 and the third singulated inductor 23. In the description of the first singulated inductor 21 and the third singulated inductor 23, descriptions of components and the like common to the second singulated inductor 22 will be omitted. Furthermore, components other than those specifically mentioned are the same as the components in the inductor 1 described above.

[0048] <Second Singulated Inductor 22> The second singulated inductor 22 is a sheet that is generally rectangular in plan view. The second singulated inductor 22 has a length in the second direction that is shorter than that of the inductor 1. The second singulated inductor 22 includes a magnetic layer 2 and wiring 3. The wiring 3 is embedded in the magnetic layer 2.

[0049] <Magnetic Layer 2 in Second Singulated Inductor 22> The magnetic layer 2 in the second singulated inductor 22 has the same external shape as the second singulated inductor 22. The magnetic layer 2 has two main surfaces 4, two first side end faces 20A and 20B (see FIG. 1A), and two second side end faces 6. The main surface 4 and the first side end faces 20A and 20B (see FIG. 1A) are the same as those of the inductor 1. The two second side end faces 6 are both cut surfaces (cut-side end faces) formed by cutting the margin portion 8. The two second side end faces 6 include a second one-side end face 61 and a second other-side end face 62. The magnetic layer 2 includes a wiring arrangement portion 7.

[0050] <Wiring Arrangement Portion 7 in Second Singulated Inductor 22> One wiring arrangement portion 7 is provided for each second singulated inductor 22. In the wiring arrangement portion 7, a first end wiring 31, a second end wiring 32, and an intermediate wiring 33 are arranged.

[0051] <Distance L0 between the second one-side end surface 61 and the first end wiring 31> In the second direction, the distance L0 from the second one-side end surface 61 of the magnetic layer 2 to the first end wiring 31 is 0.2 mm or more and 7 mm or less. If the distance L0 is less than 0.2 mm, the amount of magnetic particles present in the magnetic layer 2 between the second one-side end surface 61 and the first end wiring 31 becomes excessively small, making it impossible to suppress a decrease in the inductance of the second singulated inductor 22. If the distance L0 exceeds 7 mm, it is impossible to miniaturize the second singulated inductor 22. The distance L0 is preferably 0.4 mm or more and preferably 5 mm or less.

[0052] <Distance L0 between the second other-side end surface 62 and the second end wiring 32> In the second direction, the distance L0 from the second other-side end surface 62 of the magnetic layer 2 to the second end wiring 32 is 0.2 mm or more and 7 mm or less. If the distance L0 is less than 0.2 mm, the amount of magnetic particles present in the magnetic layer 2 between the second other-side end surface 62 and the second end wiring 32 becomes excessively small, making it impossible to suppress a decrease in the inductance of the second singulated inductor 22. If the distance L0 exceeds 7 mm, it is impossible to miniaturize the second singulated inductor 22. The distance L0 is preferably 0.4 mm or more and preferably 5 mm or less.

[0053] Furthermore, the difference between the maximum and minimum values ​​of distances L1, L2, and L3 from the first point P1, the second point P2, and the third point P3, which are spaced apart in the first direction on the second other-side end surface 62 of the magnetic layer 2, to the fourth point P4, the fifth point P5, and the sixth point P6 (none of which are shown) which are adjacent in the second direction to the first point P1, the second point P2, and the third point P3, respectively, on the second end wiring 32, is, for example, 2 mm or less, preferably 1 mm or less. If the difference is equal to or less than the upper limit, the variation in inductance of the second singulated inductor 22 in the first direction can be reduced.

[0054] <First Singulated Inductor 21> The first singulated inductor 21 includes a magnetic layer 2 and a wiring 3. The magnetic layer 2 has two main surfaces 4, two first side end faces 20A and 20B (see FIG. 1A), and two second side end faces 6. The main surface 4, the first side end faces 20A and 20B (see FIG. 1A), and the second one-side end face 61 are the same as those of the inductor 1. The second other-side end face 62 is a cut surface (cut-side end face) formed by cutting the margin portion 8. The magnetic layer 2 includes a wiring placement portion 7. The distance L0 from the second other-side end face 62 to the second end wiring 32 is the same as described above. The distance L4 from the second one-side end face 61 to the first end wiring 31 is the same as the distance L0 described above. 1B and 2B is the same as the distance L4 in the inductor 1 shown in Figures 1A and 2A. The distance L4 is also the width of the second margin portion 9.

[0055] <Third Singulated Inductor 23> The third singulated inductor 23 includes a magnetic layer 2 and a wiring 3. The magnetic layer 2 has two main surfaces 4, two first end surfaces 20A and 20B (see FIG. 1A), and two second end surfaces 6. The main surface 4, the first end surfaces 20A and 20B (see FIG. 1A), and the second other end surface 62 are the same as those of the inductor 1. The second one end surface 61 is a cut surface (cut-side end surface) formed by cutting the margin portion 8. The magnetic layer 2 includes a wiring placement portion 7. The distance L0 from the second one end surface 61 to the first end wiring 31 is the same as described above. The distance L5 from the second other end surface 62 to the second end wiring 32 is the same as the distance L0 described above. 1B and 2B is the same as the distance L5 in the inductor 1 shown in Figures 1A and 2A. The distance L5 is also the width of the second margin portion 9.

[0056] <Effects of the Embodiment> In this inductor 1, the wiring 3 is omitted from the margin portion 8 of the magnetic layer 2. Therefore, by cutting the margin portion 8 along the first direction, a sufficient distance L0 can be ensured between the second one-side end surface 61 of the magnetic layer 2 and the first end wiring 31 in the second singulated inductor 22 and the third singulated inductor 23. Therefore, a sufficient amount of magnetic particles is present in the magnetic layer 2 between the second one-side end surface 61 and the first end wiring 31. Furthermore, a sufficient distance L0 can be ensured between the second other-side end surface 62 of the magnetic layer 2 and the second end wiring 32 in the second singulated inductor 22 and the first singulated inductor 21. Therefore, a sufficient amount of magnetic particles is present in the magnetic layer 2 between the second other-side end surface 62 and the second end wiring 32. As a result, a decrease in the inductance of the singulated inductors 10 (the first singulated inductor 21, the second singulated inductor 22, and the third singulated inductor 23) after cutting can be suppressed.

[0057] On the other hand, in the wiring arrangement portion 7, the wirings 3 are arranged regularly in parallel. Therefore, the wirings 3 can be arranged compactly in the wiring arrangement portion 7. As a result, the size of the individual inductors 10 after cutting can be reduced.

[0058] Therefore, in this inductor 1, it is possible to suppress a decrease in inductance of the singulated inductor 10 after cutting, and also to reduce the size of the singulated inductor 10.

[0059] Furthermore, in the manufacturing method of the singulated inductor 10, the margin portion 8 is cut. Therefore, it is possible to sufficiently ensure the distance L0 between the second one-side end surface 61 of the magnetic layer 2 and the first end wiring 31 in the second singulated inductor 22 and the third singulated inductor 23. It is also possible to sufficiently ensure the distance L0 between the second other-side end surface 62 of the magnetic layer 2 and the second end wiring 32 in the second singulated inductor 22 and the first singulated inductor 21. Therefore, it is possible to suppress a decrease in inductance of the singulated inductor 10 after the second process.

[0060] On the other hand, in the wiring arrangement portion 7, the wirings 3 are arranged regularly in parallel. Therefore, the wirings 3 can be arranged compactly in the singulated inductor 10. As a result, the singulated inductor 10 can be made smaller after the second process.

[0061] Therefore, this method for manufacturing the singulated inductor 10 can suppress a decrease in inductance and manufacture a singulated inductor 10 that is miniaturized.

[0062] Furthermore, in this second singulated inductor 22, the distance L0 from the second one-side end face 61 to the first end wiring 31 and the distance L0 from the second other-side end face 62 to the second end wiring 32 are 0.2 mm or more, so there are sufficient amounts of magnetic particles present between the second one-side end face 61 and the first end wiring 31 and between the second other-side end face 62 and the second end wiring 32. This makes it possible to suppress a decrease in the inductance of the second singulated inductor 22.

[0063] Furthermore, in the second singulated inductor 22, the distance L0 is 7 mm or less, which allows for miniaturization.

[0064] Therefore, the second singulated inductor 22 can be made smaller while suppressing a decrease in inductance.

[0065] The first singulated inductor 21 and the third singulated inductor 23 also have the same effects as the second singulated inductor 22 .

[0066] <Modifications> In the following modifications, the same components and steps as those in the above-described embodiment are denoted by the same reference numerals, and detailed descriptions thereof will be omitted. Furthermore, each modification can achieve the same effects as those in the above-described embodiment unless otherwise specified. Furthermore, the embodiment and its modifications can be combined as appropriate.

[0067] In one embodiment, there is a single intermediate wiring 33. In a modified example, there are a plurality of intermediate wirings 33. In one wiring arrangement portion 7, the plurality of intermediate wirings 33 are arranged in parallel at equal intervals P0 in the second direction.

[0068] 3A , in the wiring arrangement portion 7 of the inductor 1 of the modified example, the multiple wires 3 are spaced apart not at equal intervals P0, but by a first interval P1 and a second interval P2 that is longer than the first interval P1. In other words, one wiring arrangement portion 7 has multiple wires 3 that are spaced apart by different intervals P1 and P2. The first interval P1 and the second interval P2 are alternately arranged in the second direction. Meanwhile, the second interval P2 is, for example, shorter than the length of the margin portion 8 in the second direction.

[0069] The embodiment is preferable compared to the modified example. In the wiring arrangement portion 7 of the inductor 1 of the embodiment, the multiple wirings 3 are arranged in parallel at equal intervals P0. Therefore, the wirings 3 can be arranged more compactly in the wiring arrangement portion 7. Furthermore, the inductance of each wiring 3 can be made equal. As a result, the singulated inductor 10 can be made even more compact while the inductance of each wiring 3 can be made equal.

[0070] Although not shown, the number of margin portions 8 in the inductor 1 may be one.

[0071] Although not shown, one inductor 1 can also be cut to produce a plurality of second singulated inductors 22. In this case, the inductor 1 includes four or more wiring arrangement portions 7 and three or more margin portions 8. Two or more second singulated inductors 22 are produced by cutting the three or more margin portions 8.

[0072] 4B , the spacings P1, P2, and P3 between the wirings in the multiple singulated inductors 10 are different from one another. Specifically, the first spacing P1 between adjacent wirings 3 in the first singulated inductor 21, the second spacing P2 between adjacent wirings 3 in the second singulated inductor 22, and the third spacing P3 between adjacent wirings 3 in the third singulated inductor 23 are different from one another.

[0073] In the first singulated inductor 21, the multiple wirings 3 are arranged in parallel at equal intervals P1. In the first singulated inductor 21, the distance L1 between the second other-side end face 62 and the second end wiring 32 is 0.2 mm or more and 7 mm or less, and is the same as the first interval P1, for example. Furthermore, the distance L1 between the second other-side end face 62 and the second end wiring 32 is the same as the distance L4 from the second one-side end face 61 to the first end wiring 31.

[0074] In the second singulated inductor 22, the multiple wirings 3 are arranged in parallel at equal intervals P2. In the second singulated inductor 22, the distance L2 between the second other-side end face 62 and the second end wiring 32 is 0.2 mm or more and 7 mm or less, and is the same as the second interval P2 described above. Furthermore, the distance L2 between the second other-side end face 62 and the second end wiring 32 is the same as the distance L2 from the second one-side end face 61 to the first end wiring 31.

[0075] In the third singulated inductor 23, the multiple wirings 3 are arranged in parallel at equal intervals P3. In the third singulated inductor 23, the distance L3 from the second one-side end face 61 to the first end wiring 31 is 0.2 mm or more and 7 mm or less, and is the same as the third interval P3 described above. In addition, the distance L3 between the second other-side end face 62 and the second end wiring 32 is the same as the distance L5 between the second other-side end face 62 and the second end wiring 32.

[0076] As shown in Figure 4A, the inductor 1 prepared in the first step has a wiring arrangement portion 7 corresponding to the first singulated inductor 21, a wiring arrangement portion 7 corresponding to the second singulated inductor 22, and a wiring arrangement portion 7 corresponding to the third singulated inductor 23, separated by a margin portion 8.

[0077] In the second step, the magnetic layer 2 is cut midway between the second end wiring 32 and the first end wiring 31 facing the second end wiring 32 in the second direction. More specifically, the magnetic layer 2 is cut so as to pass through a point located a distance from the second end wiring 32 on the other side in the second direction that is the sum of a length equal to the first interval P1 or the second interval P2 and the radius R of the wiring 3. Alternatively, the magnetic layer 2 is cut so as to pass through a point located a distance from the first end wiring 31 on one side in the second direction that is the sum of a length equal to the second interval P2 or the third interval P3 and the radius R of the wiring 3.

[0078] In the second step, the margin portions 8 are cut and the magnetic layer 2 and the plurality of wirings 3 are cut along the second direction (parallel direction). For example, the inductor 1 is cut into rectangular shapes in a plan view. This results in individualized inductors 10 each having a rectangular shape in a plan view.

[0079] 6 , for example, the end face (first side end face and / or second side end face) of the wiring 3 in the longitudinal direction includes an exposed portion 35 and a covered portion 36. The exposed portion 35 is a portion of the end face of the wiring 3 that is exposed from the magnetic layer 2. The covered portion 36 is a portion of the end face of the wiring 3 that is covered by the magnetic layer 2 (adhered matter during cutting).

[0080] To obtain the individual inductor 10 of this modified example, the inductor 1 shown in FIG. 5A is cut along the first direction and the second direction, respectively. For cutting, preferably, punching and dicing are used. For punching, a die having four curved corners (curved lines) is used.

[0081] The magnetic layer 2 and the wiring 3 of the inductor 1 are cut so that one end and the other end in the first direction remain.

[0082] The magnetic layer 2 is cut in the second direction so that the central portion 81 of the margin portion 8 remains.

[0083] The second margin portion 9 is cut at the same time as the margin portion 8 is cut. The second margin portion 9 is cut along the first direction. This leaves an outer edge of the second margin portion 9 in the second direction.

[0084] The singulated inductor 10 obtained as described above has, for example, a generally rectangular shape in plan view, with each of the four corners 11 having a curved line (curved line). The radius of curvature of the corners 11 is, for example, 0.1 mm or more, preferably 0.2 mm or more. The radius of curvature of the corners 11 is, for example, 5 mm or less, preferably 4 mm or less.

[0085] If the radius of curvature of the corner 11 is equal to or greater than the lower limit, the impact resistance of the inductor 1 can be improved.

[0086] If the radius of curvature of the corner 11 is equal to or less than the upper limit, the area near the corner 11 can be widened, and marks (including the alignment mark 111) can be placed in the free space.

[0087] The above invention is provided as an exemplary embodiment of the present invention, but it is merely an example and should not be interpreted as being limiting. Modifications of the present invention that are obvious to those skilled in the art are included in the scope of the following claims.

[0088] Inductors are used as electronic components in electrical circuits.

[0089] REFERENCE SIGNS LIST 1 inductor 2 magnetic layer 3 wiring 7 wiring arrangement portion 8 margin portion 10 singulated inductor 11 corner portion 21 first singulated inductor 22 second singulated inductor 23 third singulated inductor 35 exposed portion 36 coated portion L0 distance L1 distance L2 distance L3 distance P0 equal interval

Claims

1. An inductor comprising: a magnetic layer; and a plurality of wirings embedded in the magnetic layer and extending in a longitudinal direction, the plurality of wirings being parallel to each other at predetermined intervals in a direction perpendicular to the longitudinal direction, wherein the magnetic layer includes a plurality of wiring arrangement portions in which the wirings are regularly arranged in parallel, and margin portions in which the wirings are omitted and are arranged between adjacent wiring arrangement portions in the parallel direction of the wirings.

2. The inductor according to claim 1, wherein the plurality of wires are arranged in parallel at equal intervals in the wiring arrangement portion.

3. A method for manufacturing an individualized inductor, comprising: a first step of preparing the inductor according to claim 1 or 2; and a second step of cutting off the margin portion.

4. A singulated inductor comprising: a magnetic layer; and a plurality of wirings embedded in the magnetic layer and extending in a longitudinal direction, the plurality of wirings being parallel to each other at predetermined intervals in a direction perpendicular to the longitudinal direction; the magnetic layer including a wiring arrangement portion in which the wirings are regularly arranged in parallel; the wirings including end wirings arranged at one end of the wiring arrangement portion in the parallel direction of the wirings; and the distance from one side end face of the magnetic layer to the end wiring in the parallel direction is 0.2 mm or more and 7 mm or less.

5. The singulated inductor according to claim 4, wherein an end face of the wiring in the longitudinal direction has an exposed portion exposed from the magnetic layer.

6. The singulated inductor according to claim 4 or 5, wherein an end face of the wiring in the longitudinal direction has a covered portion that is covered with the magnetic layer.

7. The singulated inductor according to any one of claims 4 to 6, which has a rectangular shape including curved corners in a plan view.

8. The singulated inductor according to claim 7, wherein the curve is a curved line having a radius of curvature of 0.1 mm or more and 5 mm or less.