Transfer film, method for producing laminate, method for producing circuit wiring substrate, circuit wiring substrate, and semiconductor package

Abstract

An embodiment of the present invention is: a transfer film having a temporary support, a surfactant-containing middle layer, and a photosensitive layer and having a surface free energy, for the surface on the side not containing the temporary support and exposed by detaching the temporary support, of not more than 66.0 mJ / m2; a method for producing a laminate; a method for producing a circuit wiring substrate; a circuit wiring substrate; and a semiconductor package.

Description

Transfer film, laminate manufacturing method, circuit wiring board manufacturing method, circuit wiring board and semiconductor package

[0001] The present disclosure relates to a transfer film, a method for manufacturing a laminate, a method for manufacturing a circuit wiring board, a circuit wiring board, and a semiconductor package.

[0002] Because it requires only a small number of steps to obtain a desired pattern, a widely used method involves placing a photosensitive layer on a substrate of your choice using a transfer film, exposing the photosensitive layer through a mask, and then developing it.

[0003] For example, Patent Document 1 discloses "a method for exposing a photosensitive layer-forming composition layer, characterized in that a photosensitive resin laminate having a support (A), a negative-type photosensitive layer-forming composition layer (B) having a thickness of 1 to 35 μm, and a protective layer (C) is laminated on the metal-coated surface of a metal-coated insulating board having a metal conductor layer on one or both sides such that the negative-type photosensitive layer-forming composition layer (B) is in close contact with the metal-coated surface of the metal-coated insulating board, and the support is peeled off before exposure, and an image of the photomask is projected through a lens."

[0004] Patent Document 1: Patent No. 4477077

[0005] The present inventors have found that the exposure method disclosed in Patent Document 1 has a high degree of adhesion between the photosensitive layer-forming composition layer and the support, which may result in peeling of the photosensitive layer-forming composition layer, cohesive failure of the support, etc. Furthermore, the above-mentioned transfer film is usually required to have excellent resolution capable of forming a fine pattern.

[0006] The problem to be solved by one embodiment of the present disclosure is to provide a transfer film, a method for manufacturing a laminate, a method for manufacturing a circuit wiring board, a circuit wiring board, and a semiconductor package, which have excellent releasability and resolution of a temporary support.

[0007] Specific means for solving the problems are as follows: <1> A photosensitive film having a temporary support, an intermediate layer containing a surfactant, and a photosensitive layer, wherein the temporary support is peeled off and the surface free energy of the exposed surface not containing the temporary support is 66.0 mJ / m ２A transfer film having the following structure. <2> The transfer film according to <1> above, wherein the surfactant includes a silicone-based surfactant. <3> The transfer film according to <1> or <2> above, wherein the photosensitive layer includes a surfactant including a silicone-based surfactant. <4> The transfer film according to any one of <1> to <3> above, wherein the photosensitive layer includes an alkali-soluble resin, the alkali-soluble resin including at least one of a styrene-derived structural unit and a styrene derivative-derived structural unit, and a (meth)acrylic acid ester-derived structural unit, and wherein, when the contents of the styrene-derived structural unit and the styrene derivative-derived structural unit are taken as 1, the content of the (meth)acrylic acid ester-derived structural unit is 0.3 to 2.5. <5> The transfer film according to any one of <1> to <4> above, wherein the intermediate layer includes polyvinyl alcohol. <6> The transfer film according to <5> above, wherein the content of polyvinyl alcohol relative to the total mass of the intermediate layer is 15% by mass to 90% by mass. <7> The transfer film according to any one of <1> to <6>, wherein the intermediate layer contains one or more compounds X selected from the group consisting of water-soluble cellulose compounds, polyether compounds, phenolic compounds, and polyhydric alcohol compounds. <8> The transfer film according to <7>, wherein the sum of the contents of compounds X relative to the total mass of the intermediate layer is 0.1% by mass to 36% by mass. <9> The transfer film according to any one of <1> to <8>, wherein the intermediate layer contains hydroxypropyl methylcellulose. <10> The transfer film according to any one of <1> to <9>, wherein the thickness of the intermediate layer is 5.0 μm or less. <11> The transfer film according to any one of <1> to <10>, wherein the thickness of the photosensitive layer is 2.0 μm to 20.0 μm. <12> The transfer film according to any one of <1> to <11>, wherein a thermoplastic resin layer containing a surfactant including a silicone-based surfactant is provided between the temporary support and the intermediate layer. <13> The transfer film according to <12>, wherein the thermoplastic resin layer has a thickness of 2.0 μm to 15.0 μm.<14> A method for producing a laminate, the method comprising the steps of: laminating the transfer film according to any one of <1> to <13> above to a substrate so that the surface of the photosensitive layer opposite the intermediate layer is in contact with the substrate; peeling off the temporary support; and performing an exposure treatment and, after the exposure, performing a development treatment to form a pattern. <15> A method for producing the laminate according to <14> above, in which the surfactant comprises a silicone-based surfactant. <16> A method for producing the laminate according to <14> or <15> above, in which the photosensitive layer comprises a surfactant comprising a silicone-based surfactant. <17> A method for producing the laminate according to any one of <14> to <16> above, in which the intermediate layer comprises polyvinyl alcohol. <18> A method for producing the laminate according to any one of <14> to <17> above, in which the transfer film has a thermoplastic resin layer between the temporary support and the intermediate layer, the thermoplastic resin layer comprising a surfactant comprising a silicone-based surfactant. <19> A method for producing a laminate according to any one of <14> to <18> above, wherein the substrate has a dielectric loss tangent of 0.05 or less at 25 GHz. <20> A method for producing a laminate according to any one of <14> to <19> above, wherein the substrate is a substrate incorporating an element for connecting semiconductor elements to each other. <21> A method for producing a circuit wiring board, comprising, in this order: producing a laminate by the method according to any one of <14> to <20> above; plating an area where the pattern is not formed to form a conductive pattern; and removing the pattern. <22> A circuit wiring board produced by the production method according to <21> above. <23> A semiconductor package comprising the circuit wiring board according to <22> above.

[0008] According to one embodiment of the present disclosure, it is possible to provide a transfer film having excellent releasability and resolution of a temporary support, a method for manufacturing a laminate, a method for manufacturing a circuit wiring board, a circuit wiring board, and a semiconductor package.

[0009] FIG. 1 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 2 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 3 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 4 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 5 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 6 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 7 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 8 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 9 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 10 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 11 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 12 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. 13 and 14 are schematic cross-sectional views illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package.

[0010] The present disclosure will be described in detail below. In this specification, a numerical range expressed using "to" means a range that includes the numerical values ​​written before and after "to" as the upper and lower limits. In this specification, in numerical ranges described in stages, the upper or lower limit value described in a certain numerical range may be replaced with the upper or lower limit value of another numerical range described in stages. Furthermore, in numerical ranges described in this specification, the upper or lower limit value described in a certain numerical range may be replaced with a value shown in an example.

[0011] In this specification, the term "process" includes not only an independent process but also a process that cannot be clearly distinguished from other processes, as long as the intended purpose of the process is achieved.

[0012] In this specification, "transparent" means that the average transmittance of visible light in the wavelength range of 400 nm to 700 nm is 80% or more, and preferably 90% or more. In this specification, the average transmittance of visible light is a value measured using a spectrophotometer, and can be measured using, for example, a spectrophotometer U-3310 manufactured by Hitachi, Ltd.

[0013] In this specification, unless otherwise specified, the weight average molecular weight (Mw) and number average molecular weight (Mn) are values ​​converted using a polystyrene standard substance measured by a gel permeation chromatography (GPC) analyzer using a TSKgel GMHxL, TSKgel G4000HxL, or TSKgel G2000HxL (all trade names manufactured by Tosoh Corporation) column, THF (tetrahydrofuran) as an eluent, a differential refractometer as a detector, and polystyrene as a standard substance. Furthermore, in this specification, unless otherwise specified, the molecular weight of a compound having a molecular weight distribution is the weight average molecular weight (Mw).

[0014] In this specification, "(meth)acrylic" is a concept that encompasses both acrylic and methacrylic, "(meth)acryloyloxy group" is a concept that encompasses both acryloyloxy group and methacryloyloxy group, "(meth)acrylamide group" is a concept that encompasses both acrylamide group and methacrylamide group, and "(meth)acrylate" is a concept that encompasses both acrylate and methacrylate.

[0015] In this specification, "alkali-soluble" means that the solubility in 100 g of a 1 mass % aqueous sodium carbonate solution at a liquid temperature of 22° C. is 0.1 g or more. Therefore, for example, an alkali-soluble resin refers to a resin that satisfies the above-mentioned solubility conditions.

[0016] As used herein, "water-soluble" means that the solubility in 100 g of water having a pH of 7.0 and a liquid temperature of 22° C. is 0.1 g or more. Therefore, for example, a water-soluble resin refers to a resin that satisfies the above-mentioned solubility conditions.

[0017] In this specification, the "solid content" of a composition means components that form a composition layer formed using the composition, and when the composition contains a solvent (organic solvent, water, etc.), it means all components excluding the solvent. Furthermore, liquid components that form a composition layer are also considered to be solid content.

[0018] In this specification, the thickness of the temporary support or the like is calculated as the average value of measurements taken at any five points by cross-sectional observation using an SEM (Scanning Electron Microscope).

[0019] In this specification, the surface free energy is the measured value of pure water H ２ O and methylene iodide CH ２ I ２ and the respective contact angles θ Ｈ２Ｏ and θ ＣＨ２Ｉ２ is used, and is calculated by the Owens equation (simultaneous equations (A) and (B)) shown below.

[0020] Contact angle of pure water (θ Ｈ２Ｏ ) is measured by the following method. 12 μL of pure water is dropped onto the surface of the object for which the surface free energy of the intermediate layer or the like is to be measured in an atmosphere of room temperature 25°C and relative humidity 50%, and after 20 seconds, the contact angle is measured using a contact angle meter. The above measurement is carried out five times in total. Then, the arithmetic mean of the three measurement values ​​excluding the maximum and minimum values ​​out of the five measurement values ​​is taken as the contact angle of pure water (θ Ｈ２Ｏ The contact angle meter used may be a contact angle meter CA-D type (manufactured by Kyowa Interface Science Co., Ltd.) or a device of the same level.

[0021] Next, the contact angle (θ ＣＨ２Ｉ２) is measured by the following method. 12 μL of diiodomethane (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) is dropped onto the surface of the object for which the surface free energy of an intermediate layer or the like is to be measured under an atmosphere of room temperature of 25°C and relative humidity of 50%, and after 20 seconds, the contact angle is measured using a contact angle meter. The above measurement is carried out five times in total. Then, the arithmetic mean of the three measurement values ​​excluding the maximum and minimum values ​​out of the five measurement values ​​is taken as the contact angle (θ) of methylene iodide. ＣＨ２Ｉ２ )

[0022] θ measured by the above method Ｈ２Ｏ and θ ＣＨ２Ｉ２ The values ​​of γ in Table 1 below are substituted into the simultaneous equations (A) and (B) below to obtain "γs ｄ +γs ｈ The value of "L" is the surface free energy. ２ When γ is O, for example, Ｌ ｄ is γ Ｈ２Ｏ ｄ In addition, L is represented by CH ２ I ２ For example, if γ Ｌ ｄ is γ ＣＨ２Ｉ２ ｄ It is expressed as:

[0023]

[0024] [Simultaneous equations] (A): 1 + cosθ H2O = 2√γ S d (√γ H2O d / γ H2O,V ) + 2√γ S h (√γ H2O h / γ H2O,V ) (B): 1 + cosθ CH2I2 = 2√γ S d (√γ CH2I2 d / γ CH2I2,V ) + 2√γ S h (√γ CH2I2 h / γ CH2I2,V )

[0025] In this specification, the dielectric loss tangent of the substrate at 24 GHz is measured by a resonator method. As an apparatus for measuring the dielectric loss tangent, a 24 GHz split cylinder resonator manufactured by Kanto Electronics Application Development Co., Ltd. or an apparatus of the same level can be used.

[0026] <Transfer Film> The transfer film of the present disclosure has a temporary support, an intermediate layer containing a surfactant, and a photosensitive layer, and is formed by peeling off the temporary support and then exposing the surface on the side not containing the temporary support, so that the surface free energy is 66.0 mJ / m ２ The following is the result.

[0027] The transfer film of the present disclosure has excellent releasability of the temporary support and excellent resolution. The mechanism by which the above effects are achieved is not clear, but is presumed to be as follows. The transfer film of the present disclosure has an intermediate layer containing a surfactant, and when the temporary support is peeled off, the surface free energy of the exposed surface on the side not containing the temporary support is 66.0 mJ / m ２ The following is the reason. It is presumed that this reduces the interaction with the temporary support, improving the releasability of the temporary support. Furthermore, as a result of improving the releasability of the temporary support, it is possible to suppress roughening of the surface of the transfer film from which the temporary support has been peeled off, and it is possible to suppress excessive improvement in adhesion to the mask, making it possible to form a fine pattern with reduced residue in the areas between the patterns.

[0028] The surface free energy of the surface exposed by peeling, which does not contain the temporary support, can be adjusted, for example, by the composition of the layer on the surface exposed by peeling, which does not contain the temporary support.

[0029] The transfer film may have a thermoplastic resin layer containing a surfactant between the temporary support and the intermediate layer, and may have a protective film on the surface of the photosensitive layer opposite to the intermediate layer side.

[0030] (Temporary Support) The temporary support is a member that supports the photosensitive layer and the like, and is ultimately removed by a peeling treatment.

[0031] The temporary support may have a single-layer structure or a multi-layer structure. The temporary support is preferably a film, more preferably a resin film. The temporary support is preferably a film that is flexible and does not undergo significant deformation, shrinkage, or elongation under pressure, or under pressure and heat. Examples of the film include polyethylene terephthalate film, polymethyl methacrylate film, cellulose triacetate film, polystyrene film, polyimide film, polycarbonate film, etc. The resin film may be a stretched film or a non-stretched film, but a stretched film is preferred, and a biaxially stretched film is more preferred. Among these, a polyethylene terephthalate film is preferred as the temporary support. Furthermore, it is preferable that the film used as the temporary support is free of deformation such as wrinkles, scratches, etc.

[0032] The thickness of the temporary support is not particularly limited, but is preferably 5.0 μm to 200.0 μm, and from the viewpoint of ease of handling and versatility, is more preferably 5.0 μm to 150.0 μm, even more preferably 5.0 μm to 50.0 μm, and most preferably 5.0 μm to 25.0 μm.

[0033] To improve handling properties, a layer containing fine particles (lubricant layer) may be provided on the surface of the temporary support. The lubricant layer may be provided on one side or both sides of the temporary support. The diameter of the particles contained in the lubricant layer is preferably 0.05 μm to 0.8 μm. The film thickness of the lubricant layer is preferably 0.05 μm to 1.0 μm.

[0034] From the viewpoint of releasability and resolution of the temporary support, the surface free energy of the surface of the temporary support on the intermediate layer side is 66.0 mJ / m ２ Preferably, 63.0 mJ / m or less ２ More preferably, it is 60.0 mJ / m or less. ２ From the viewpoint of adhesion of the coating film, the lower limit of the surface free energy is more preferably 35 mJ / m or less. ２ It is preferable that the concentration is 40 mJ / m or more. ２More preferably, 45 mJ / m or more ２ More preferably, it is equal to or greater than this.

[0035] In one embodiment, the temporary support may be one consisting of only a substrate; a laminate comprising a substrate and a particle-containing layer disposed on one surface of the substrate; or a laminate comprising a substrate and particle-containing layers disposed on both surfaces of the substrate.

[0036] Examples of the substrate constituting the temporary support include the above-mentioned resin film, glass, paper, etc. The substrate constituting the temporary support is preferably a resin film from the viewpoints of strength, flexibility, and light transmittance. The resin film is preferably a polyethylene terephthalate film, more preferably a biaxially stretched polyethylene terephthalate film.

[0037] When a particle-containing layer is disposed on one or both surfaces of the substrate, the particle-containing layer may be one layer or two or more layers.

[0038] The particle-containing layer can be formed, for example, by applying a composition for the particle-containing layer onto a substrate and drying the composition. Alternatively, the particle-containing layer can be disposed by co-extrusion when forming a resin film.

[0039] The particle-containing layer composition preferably contains a binder polymer and particles. The type of binder polymer is not particularly limited and can be appropriately selected depending on the purpose. Examples of binder polymers include acrylic resins, urethane resins, olefin resins, styrene-butadiene resins, ester resins, vinyl chloride resins, and vinylidene chloride resins. When the particle-containing layer is disposed by co-extrusion, polyethylene terephthalate is preferably used as the binder polymer.

[0040] The particle-containing layer may contain one kind of binder polymer and one kind of particles, or may contain two or more kinds of binder polymer and one kind of particles.

[0041] The particles contained in the particle-containing layer are not particularly limited and can be appropriately selected depending on the purpose. The content of particles in the particle-containing layer can be appropriately adjusted by the amount of particles added to the composition for the particle-containing layer. In this specification, the particles contained in the particle-containing layer are referred to as "added particles."

[0042] The additive particles are to be distinguished from impurities unexpectedly mixed in during the manufacturing process of the temporary support and particles formed during the manufacturing process of the temporary support. The additive particles are preferably particles that do not melt at 200°C.

[0043] Whether or not the temporary support contains additive particles can be determined, for example, by the following method: Additive particles usually have uniform shape and distribution, and therefore can be determined by observation with an optical microscope.

[0044] Examples of the additive particles include inorganic particles and organic particles.

[0045] Examples of inorganic particles include particles of inorganic oxides such as silicon oxide (silica), titanium oxide (titania), zirconium oxide (zirconia), magnesium oxide (magnesia), and aluminum oxide (alumina).

[0046] Examples of organic particles include particles of polymers such as acrylic resin, polyester, polyurethane, polycarbonate, polyolefin, and polystyrene.

[0047] When the temporary support has a particle-containing layer, the additive particles contained in the particle-containing layer are preferably inorganic oxide particles.

[0048] The average particle size of the additive particles is not particularly limited, but is, for example, 0.1 μm to 10 μm. The average particle size is measured by cutting a 100 nm thick slice with an ultramicrotome and using a TEM (transmission electron microscope).

[0049] In the transfer film according to the present disclosure, the thermal deformation rate of the temporary support is preferably 1.0% or less, more preferably 0.5% or less. The lower limit of the thermal deformation rate is not particularly limited, and is preferably 0%. By making the thermal deformation rate of the temporary support 1.0% or less, deformation of the substrate to be bonded to the transfer film is suppressed.

[0050] In the present disclosure, the thermal deformation rate is measured by the following method.

[0051] On the main surface of the temporary support, the direction parallel to one of two pairs of opposing sides is defined as direction A, and the direction perpendicular to direction A is defined as direction B. A test piece is cut to a length of 30 mm in direction A and 4 mm in direction B, and another test piece is cut to a length of 30 mm in direction B and 4 mm in direction A. The following measurements are performed using the two test pieces. A thermal expansion measurement device (e.g., product name "TMA450EM" manufactured by TA Instruments) is used as the measurement device. The measurement conditions are as follows: Measurement mode: Tensile mode; Grip distance: 16 mm; Set load: Vary from 0.05 N to 0.48 N at a rate of 6.00 N / min. Each test piece is heated from 25°C to 100°C at a heating rate of 20°C / min, and the elongation of each test piece is measured five times, and the average value is calculated. The larger average elongation value of the two test pieces is used as the thermal deformation rate.

[0052] Examples of methods for reducing the thermal deformation rate of the temporary support include increasing the thickness of the temporary support and incorporating particles into the temporary support to increase the amount of particles contained in the temporary support.

[0053] In the transfer film according to the present disclosure, the haze of the temporary support is preferably greater than 2.0%, from the viewpoint of suppressing deformation of the substrate to which the transfer film is attached.

[0054] From the above viewpoint, the haze of the temporary support is more preferably 2.5% or more. The upper limit of the haze is not particularly limited, and is, for example, 10%.

[0055] When forming a pattern using the transfer film according to the present disclosure, it is preferable to peel off the temporary support after laminating the transfer film to a substrate and before exposure. If the temporary support is peeled off before exposure, it is not necessary to consider the influence of high haze on the temporary support on exposure.

[0056] In the present disclosure, haze is measured using a haze meter in accordance with JIS K7136: 2000. For example, a haze meter manufactured by Nippon Denshoku Industries Co., Ltd. under the product name "NDH-2000" is used.

[0057] In addition, in the transfer film according to the present disclosure, from the viewpoint of suppressing deformation of the substrate to which the transfer film is attached, the total number of particles having a diameter of 5 μm or more and aggregates having a diameter of 5 μm or more contained in the temporary support is set to 30 particles / mm ２ More is preferable.

[0058] From the above viewpoint, the total number of particles and aggregates is 40 / mm ２ The upper limit of the total number is not particularly limited, and is, for example, 50 pieces / mm ２ is.

[0059] The particles and aggregates referred to here mean those having an area in which a difference in polarization from the surrounding area can be observed when the temporary support is observed under a polarizing microscope. Examples of particles and aggregates include carbonized resins formed during the production of the substrate and catalysts used in the production of the substrate. In addition, when a particle-containing layer such as that described above is provided, the added particles contained in the particle-containing layer also fall under the category of the above particles.

[0060] In the present disclosure, the total number of particles and aggregates contained in the temporary support is measured by the following method.

[0061] First, the temporary support is observed with a polarizing microscope (product name "BX60" with a "U-POT" filter and a "U-AN360" filter inserted to form a simple polarizing microscope, 10x objective lens, manufactured by Olympus Corporation), and areas where polarization is disturbed are identified as foreign matter (particles or aggregates). The identified foreign matter is observed with an incident-light laser microscope (product name "Confocal Laser Microscope VL2000D", manufactured by Lasertec Corporation). In addition, the diameter of the foreign matter is measured with an optical microscope (product name "BX60", 100x objective lens, manufactured by Olympus Corporation), and the diameter of the foreign matter is measured within an observation area of ​​1 mm. ２ The number of foreign particles with a diameter of 5 μm or more contained in the foreign particle is counted. If the foreign particle contains a void, the diameter is measured including the void. If the foreign particle is not circular, the longest diameter is measured.

[0062] When forming a pattern using the transfer film according to the present disclosure, it is preferable to peel off the temporary support after laminating the transfer film to the substrate and before exposure. If the temporary support is peeled off before exposure, it is not necessary to consider the influence on exposure of the large amount of particles and aggregates contained in the temporary support.

[0063] In addition, in the transfer film according to the present disclosure, from the viewpoint of suppressing deformation of the substrate to which the transfer film is bonded, the temporary support is 13.5 mm when measured by an incident-light laser microscope. ２ It is preferable that the total area ratio of the optically abnormal region when observed over an area of ​​100 ppm or more is greater than 300 ppm.

[0064] From the above viewpoint, the total area ratio of the optically abnormal region is more preferably 350 ppm or more. The upper limit of the total area ratio is not particularly limited, and is, for example, 500 ppm.

[0065] In the present disclosure, the area of ​​the optically abnormal region means the area of ​​the optically abnormal region observed in a region extending from the center position of the thickness of the temporary support to 2 μm in one direction or the other in the thickness direction.

[0066] In the present disclosure, an optically abnormal region is a region whose optical properties are different from those of the main region of the temporary support (the resin constituting the temporary support) (specifically, a region whose reflectance or refractive index is different from that of the main region, or a region in which optical phenomena such as scattering and diffraction occur more strongly than in the main region). When the temporary support contains, for example, particles, the optically abnormal region may include both a light-shielding portion caused by the particles and an optically abnormal region other than the particles (for example, an abnormal refractive index region having a refractive index different from that of the particles and the main region of the temporary support). Examples of the optically abnormal region include a region whose orientation and / or crystallinity is different from that of the main region of the temporary support, an air region, a region of gas other than air, a void region where gas is almost absent, etc.

[0067] In the present disclosure, the total area of ​​the optically abnormal region is measured in the following manner.

[0068] A polarizing filter (OLS4000-QWP) is inserted above the objective lens of an incident-light laser microscope (OLS-4100, manufactured by Olympus). Next, a temporary support cut to 30 mm x 30 mm is horizontally suction-fixed onto the stage of the laser microscope using a porous suction plate (65F-HG, manufactured by Universal Giken) and a vacuum pump. The suction-fixed temporary support is observed under conditions of a 50x objective lens and a laser light intensity of 60 (laser wavelength: 405 nm). At this time, the measurement area is defined as an area up to 2 μm from the center position of the thickness of the temporary support to one side or the other in the thickness direction, and measurements are performed at 200 measurement points in a measurement area of ​​259 μm x 260 μm. Therefore, the total measurement area is 0.259 mm x 0.26 mm x 200 = 13.5 mm ２ This becomes:

[0069] The difference in light intensity between the pixel with the maximum light intensity and the pixel with the minimum light intensity in the measured image is divided into 4096 gradations (the maximum light intensity value is 4095 and the minimum light intensity value is 0). A histogram (horizontal axis: light intensity gradation (minimum value 0, maximum value 4095), vertical axis: number of pixels) is created, graphing the light intensity distribution of the pixels in the image. The measured image is binarized using a gradation obtained by adding 400 gradations to the value of the larger of the two base values ​​of the created histogram as the threshold, and the areas of pixels with a light intensity greater than the threshold are summed up, and this total area is taken as the total area of ​​the optical anomalous regions. The ratio of the total area of ​​the optical anomalous regions to the measured area is calculated.

[0070] From the viewpoint of improving adhesion to the intermediate layer, the surface of the temporary support that comes into contact with the intermediate layer may be subjected to a surface treatment such as ultraviolet irradiation, corona discharge, plasma treatment, etc. When the surface treatment is performed by ultraviolet irradiation, the exposure dose is 10 mJ / cm ２ ~2000mJ / cm ２ and preferably 50 mJ / cm ２ ~1000mJ / cm ２ It is more preferable that:

[0071] Examples of light sources for ultraviolet irradiation include light sources that emit light in the wavelength band of 150 nm to 450 nm (e.g., low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, carbon arc lamps, metal halide lamps, xenon lamps, chemical lamps, electrodeless discharge lamps, and light-emitting diodes (LEDs)). There are no particular limitations on the output and illuminance.

[0072] The intermediate layer is preferably in contact with the surface of the temporary support. From the viewpoint of transferring the irregularities of the temporary support to the intermediate layer, the surface roughness Rmax of the temporary support on the intermediate layer side is preferably 0.5 μm or less, and more preferably 0.01 μm to 0.5 μm.

[0073] The surface roughness Rmax of the intermediate layer side surface of the temporary support is measured by the following method.

[0074] In the present disclosure, the surface roughness Rmax is measured using a three-dimensional optical profiler (for example, New View 7300, manufactured by Zygo).

[0075] First, the temporary support is peeled off from the transfer film. A surface profile of the intermediate layer side surface of the temporary support is obtained. MetroPro ver. 8.3.2 Microscope Application is used as the measurement and analysis software. Next, a Surface Map screen is displayed using the measurement and analysis software, and histogram data is obtained on the Surface Map screen. From the obtained histogram data, the surface roughness Rmax is obtained. The surface roughness Rmax corresponds to the maximum height of the roughness curve in the reference length.

[0076] The temporary support may be a recycled product. Examples of recycled products include those obtained by cleaning used films and then chipping them, and then forming the chips into a film. Specific examples of recycled products include the Ecouse series from Toray Industries, Inc.

[0077] (Intermediate layer) When the temporary support is peeled off and the exposed surface of the transfer film is the surface of the intermediate layer, the surface free energy is 66.0 mJ / m ２ or less, 63.0 mJ / m ２ More preferably, 60.0 mJ / m or less ２ From the viewpoint of adhesion to the temporary support, the lower limit of the surface free energy is more preferably 45 mJ / m ２ It is preferable that the concentration is 50 mJ / m or more. ２ More preferably, 55 mJ / m or more. ２ The surface free energy of the intermediate layer surface can be adjusted by adjusting the type and content of the surfactant contained in the intermediate layer, the type and content of the water-soluble resin contained in the intermediate layer, etc.

[0078] The intermediate layer preferably has oxygen blocking ability. When the intermediate layer has oxygen blocking ability, the sensitivity during exposure is improved, the time load on the exposure machine can be reduced, and productivity can be improved. In addition, when the photosensitive layer in the transfer film is a negative photosensitive layer containing a radical polymerizable compound, there is also the advantage that oxygen inhibition is less likely to occur in the polymerization reaction during exposure.

[0079] The intermediate layer may contain one or more water-soluble resins, such as polyvinyl alcohol, polyvinylpyrrolidone, water-soluble cellulose compounds, (meth)acrylamide, polyether compounds, gelatin, vinyl ether compounds, polyamides, phenolic compounds, and copolymers thereof.

[0080] From the viewpoints of the releasability of the temporary support, resolution, oxygen blocking ability, and defect suppression in the pattern (hereinafter also simply referred to as "defect suppression"), it is preferable that the intermediate layer contains at least one of polyvinyl alcohol and polyvinylpyrrolidone, it is more preferable that it contains polyvinyl alcohol, and it is even more preferable that it contains polyvinyl alcohol and polyvinylpyrrolidone.

[0081] When the intermediate layer contains polyvinyl alcohol, from the viewpoints of releasability, resolution, oxygen blocking ability, defect suppression, etc. of the temporary support, the content of polyvinyl alcohol relative to the total mass of the intermediate layer is preferably 5% by mass to 95% by mass, more preferably 15% by mass to 90% by mass, even more preferably 25% by mass to 80% by mass, particularly preferably 50% by mass to 75% by mass, and most preferably 55% by mass to 70% by mass. When the intermediate layer contains polyvinylpyrrolidone, from the viewpoints of releasability, resolution, oxygen blocking ability, defect suppression, etc. of the temporary support, the content of polyvinylpyrrolidone relative to the total mass of the intermediate layer is preferably 20% by mass to 98% by mass, more preferably 23% by mass to 90% by mass, even more preferably 25% by mass to 75% by mass, and particularly preferably 25% by mass to 50% by mass. When the intermediate layer contains polyvinyl alcohol and polyvinylpyrrolidone, from the viewpoints of releasability of the temporary support, resolution, oxygen blocking ability, defect suppression, etc., the sum of the contents of polyvinyl alcohol and polyvinylpyrrolidone relative to the total mass of the intermediate layer is preferably 50% by mass to 99% by mass, more preferably 70% by mass to 99% by mass, and even more preferably 75% by mass to 99% by mass.

[0082] From the viewpoints of releasability, resolution, oxygen blocking ability, defect suppression, etc. of the temporary support, the intermediate layer preferably contains one or more compounds X selected from the group consisting of water-soluble cellulose compounds, polyether compounds, phenol compounds, and polyhydric alcohol compounds. Examples of water-soluble cellulose compounds include hydroxyethyl cellulose, hydroxypropyl methylcellulose, hydroxypropyl cellulose, methyl cellulose, ethyl cellulose, etc. Examples of polyether compounds include polyethylene glycol and polypropylene glycol. Examples of phenol compounds include bisphenol A and bisphenol S, etc. Examples of polyhydric alcohol compounds include glycerin, diglycerin, diethylene glycol, etc. From the viewpoints of releasability, resolution, oxygen blocking ability, defect suppression, etc. of the temporary support, the intermediate layer preferably contains one or more compounds X selected from the group consisting of hydroxypropyl methylcellulose, polyethylene glycol, bisphenol A, and glycerin, more preferably one or more compounds X selected from the group consisting of hydroxypropyl methylcellulose and polyethylene glycol, and even more preferably hydroxypropyl methylcellulose.

[0083] From the viewpoints of releasability of the temporary support, resolution, oxygen blocking ability, defect suppression, and the like, when the intermediate layer contains compound X, the sum of the contents of compound X relative to the total mass of the intermediate layer is preferably 0.1% by mass to 36% by mass, more preferably 0.5% by mass to 20% by mass, and even more preferably 1% by mass to 15% by mass.

[0084] From the viewpoints of temporary support releasability, resolution, oxygen blocking ability, defect suppression, etc., the intermediate layer preferably contains at least one of polyvinyl alcohol and polyvinylpyrrolidone and compound X, more preferably polyvinyl alcohol and compound X, and even more preferably polyvinyl alcohol, polyvinylpyrrolidone, and compound X. When the intermediate layer has the above-mentioned composition, compound X is more likely to be unevenly distributed on the surface of the intermediate layer facing the temporary support, and the formation of a weak boundary layer (WBL) layer due to mixing of the intermediate layer and the photosensitive layer can be suppressed. As a result, the surface free energy of the intermediate layer facing the temporary support is adjusted to an appropriate value, thereby further improving temporary support releasability and resolution.

[0085] From the viewpoints of the releasability, resolution, oxygen blocking ability, defect suppression ability, etc. of the temporary support, the weight average molecular weight (Mw) of the water-soluble resin is preferably 5,000 to 200,000, more preferably 7,000 to 100,000, and even more preferably 7,000 to 50,000. From the viewpoints of the releasability, resolution, oxygen blocking ability, defect suppression ability, etc. of the temporary support, the dispersity (Mw / Mn) of the water-soluble resin is preferably 1 to 10, and more preferably 1 to 5.

[0086] From the viewpoints of releasability of the temporary support, resolution, oxygen blocking ability, defect suppression, etc., the content of the water-soluble resin relative to the total mass of the intermediate layer is preferably 60 mass% or more, preferably 80 mass% or more, preferably 95 mass% or more, and may be 100 mass%.

[0087] The intermediate layer contains a surfactant. The intermediate layer may contain two or more types of surfactants. The surfactant preferably contains one or more selected from the group consisting of nonionic surfactants, fluorine-based surfactants, and silicone-based surfactants. From the viewpoints of the releasability, resolution, oxygen blocking ability, defect suppression, etc. of the temporary support, the surfactant preferably contains a silicone-based surfactant. Silicon-based surfactants are also preferred from the viewpoint of improving the adhesion (hereinafter also referred to as "interlayer adhesion") between the intermediate layer and adjacent layers (photosensitive layer, thermoplastic resin, etc.). From the viewpoints of the releasability, resolution, oxygen blocking ability, defect suppression, interlayer adhesion, etc. of the temporary support, the content of the silicone-based surfactant relative to the total weight of the surfactant is preferably 60% by weight or more, preferably 80% by weight or more, preferably 95% by weight or more, and even 100% by weight. Examples of silicone-based surfactants include linear polymers composed of siloxane bonds and modified siloxane polymers in which an organic group has been introduced into at least one of the side chains and the f-terminal.

[0088] From the viewpoints of the releasability of the temporary support, resolution, oxygen blocking ability, defect suppression, interlayer adhesion, etc., the content of the surfactant relative to the total mass of the intermediate layer is preferably 0.1 mass % to 10 mass %, more preferably 0.5 mass % to 7 mass %, and even more preferably 1 mass % to 5 mass %.

[0089] The intermediate layer may contain a water-insoluble resin. Examples of the water-insoluble resin include polyester resin and (meth)acrylic resin. When the intermediate layer contains a water-insoluble resin, the content of the water-insoluble resin relative to the total mass of the intermediate layer is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 1% by mass or less.

[0090] The intermediate layer may contain additives such as colorants, flame retardants, antioxidants, anti-rust agents, dispersants, and the like.

[0091] From the viewpoints of releasability of the temporary support, resolution, oxygen blocking ability, defect suppression, interlayer adhesion, and the like, the thickness of the intermediate layer is preferably 5.0 μm or less, more preferably 0.01 μm to 4.0 μm, and even more preferably 0.1 μm to 3.0 μm.

[0092] (Photosensitive layer) The photosensitive layer may be a positive photosensitive layer or a negative photosensitive layer, but in the transfer film of the present disclosure, a negative photosensitive layer is preferable. A negative photosensitive layer is a photosensitive layer in which the solubility of the exposed portion in a developer decreases upon exposure. When the photosensitive layer is a negative photosensitive layer, the formed pattern corresponds to a cured layer.

[0093] The photosensitive layer may contain one or more polymers. The polymer is preferably an alkali-soluble resin. The polymer may contain a structural unit formed by a monomer having an acid group. Examples of the acid group include a carboxy group, a sulfo group, a phosphate group, and a phosphonic acid group. Examples of the monomer having an acid group include (meth)acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, 4-vinylbenzoic acid, and maleic anhydride. The polymer may contain a structural unit formed by a monomer not having an acid group. Examples of the monomer not having an acid group include (meth)acrylic acid esters, ester compounds of vinyl alcohol, (meth)acrylonitrile, and aromatic vinyl compounds. Examples of (meth)acrylic acid esters include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and benzyl (meth)acrylate. Examples of vinyl alcohol ester compounds include vinyl acetate. Examples of aromatic vinyl compounds include styrene and styrene derivatives. The non-acidic monomer is preferably one or more monomers selected from the group consisting of methyl (meth)acrylate, n-butyl (meth)acrylate, styrene, styrene derivatives, and benzyl (meth)acrylate.

[0094] From the viewpoint of resolution, the alkali-soluble resin preferably contains at least one of a structural unit derived from styrene and a structural unit derived from a styrene derivative. Specific examples of the styrene derivative include vinyltoluene, p-methylstyrene, and p-chlorostyrene.

[0095] The copolymerization ratio of the styrene-derived structural unit and the styrene derivative-derived structural unit in the alkali-soluble resin is preferably 5% by mass to 60% by mass, more preferably 10% by mass to 50% by mass, and even more preferably 15% by mass to 40% by mass, relative to the total mass of the alkali-soluble resin.

[0096] From the viewpoint of adhesion, the alkali-soluble resin preferably contains a structural unit derived from a (meth)acrylic acid ester. When the alkali-soluble resin contains at least one of a structural unit derived from styrene and a structural unit derived from a styrene derivative, and a structural unit derived from a (meth)acrylic acid ester, when the content of the structural unit derived from styrene and the structural unit derived from a styrene derivative is taken as 1, from the viewpoint of achieving both resolution and adhesion, the content of the structural unit derived from a (meth)acrylic acid ester is preferably 0.3 to 2.5, more preferably 0.5 to 2.0, and even more preferably 0.7 to 1.7.

[0097] From the viewpoints of resolution, developability, and the like, the weight average molecular weight (Mw) of the polymer is preferably 5,000 to 500,000, more preferably 10,000 to 100,000, and even more preferably 30,000 to 60,000. The dispersity (Mw / Mn) of the polymer is preferably 1.0 to 6.0, more preferably 1.0 to 5.0, even more preferably 1.0 to 4.0, and particularly preferably 1.0 to 3.0.

[0098] From the viewpoint of resolution, developability, and the like, the acid value of the polymer is preferably 60 mgKOH / g to 220 mgKOH / g, more preferably 120 mgKOH / g to 200 mgKOH / g, and even more preferably 150 mgKOH / g to 190 mgKOH / g.

[0099] The acid value (mg KOH / g) is the mass [mg] of potassium hydroxide required to neutralize 1 g of sample. The acid value can be determined, for example, according to the method described in JIS K0070:1992. The acid value of the polymer can be adjusted by changing the type of constituent unit and the content of the constituent unit containing an acid group.

[0100] From the viewpoints of resolution, developability, and the like, the content of the polymer relative to the total mass of the photosensitive layer is preferably 30% by mass to 70% by mass, more preferably 40% by mass to 60% by mass, and even more preferably 45% by mass to 57% by mass.

[0101] The photosensitive layer may contain one or more polymerizable compounds. The polymerizable compound is not limited, and known polymerizable compounds can be used. The polymerizable compound is preferably an ethylenically unsaturated compound. The ethylenically unsaturated compound is a compound having one or more ethylenically unsaturated groups. The ethylenically unsaturated group is preferably a (meth)acryloyl group. The ethylenically unsaturated compound is preferably a (meth)acrylate compound. As the ethylenically unsaturated compound, an ethylenically unsaturated compound having a bisphenol structure is also preferably used. As the ethylenically unsaturated compound having a bisphenol structure, alkylene oxide-modified bisphenol A di(meth)acrylate can be used. Examples of alkylene oxide-modified bisphenol A di(meth)acrylates include ethylene glycol dimethacrylates in which an average of 5 moles of ethylene oxide have been added to each end of bisphenol A, ethylene glycol dimethacrylates in which an average of 2 moles of ethylene oxide have been added to each end of bisphenol A, ethylene glycol dimethacrylates in which an average of 5 moles of ethylene oxide have been added to each end of bisphenol A, alkylene glycol dimethacrylates in which an average of 6 moles of ethylene oxide and an average of 2 moles of propylene oxide have been added to each end of bisphenol A, and alkylene glycol dimethacrylates in which an average of 15 moles of ethylene oxide and an average of 2 moles of propylene oxide have been added to each end of bisphenol A. Specific examples of alkylene oxide-modified bisphenol A di(meth)acrylates include 2,2-bis(4-(methacryloxydiethoxy)phenyl)propane and 2,2-bis(4-(methacryloxyethoxypropoxy)phenyl)propane.

[0102] The molecular weight of the polymerizable compound is preferably 200 to 3000, more preferably 280 to 2200, and even more preferably 300 to 2200. When the polymerizable compound is a compound having a molecular weight distribution (for example, a polymer), the weight average molecular weight of the polymerizable compound is preferably 200 to 3000, more preferably 280 to 2200, and even more preferably 300 to 2200.

[0103] The content of the polymerizable compound is preferably 10% by mass to 70% by mass, more preferably 20% by mass to 60% by mass, and even more preferably 20% by mass to 50% by mass, relative to the total mass of the photosensitive layer.

[0104] From the viewpoints of resolution, oxygen blocking ability, etc., the photosensitive layer preferably contains one or more of the above surfactants. Preferred aspects of the surfactant are as explained for the intermediate layer, and will not be explained here. From the viewpoints of resolution, oxygen blocking ability, etc., the content of the surfactant relative to the total mass of the photosensitive layer is preferably 0.05% by mass to 5% by mass, more preferably 0.1% by mass to 3% by mass, and even more preferably 0.2% by mass to 1% by mass.

[0105] The photosensitive layer may contain one or more polymerization initiators, such as conventionally known radical polymerization initiators and cationic polymerization initiators.

[0106] The content of the polymerization initiator relative to the total mass of the photosensitive layer is not particularly limited, and can be 1% by mass to 10% by mass.

[0107] The photosensitive layer may contain additives such as colorants, sensitizers, chain transfer agents (N-phenylcarbamoylmethyl-N-carboxymethylaniline, N,N-tetraethyl-4,4-diaminobenzophenone, etc.), polymerization inhibitors, plasticizers, flame retardants, antioxidants, rust inhibitors, dispersants, and thermally crosslinkable compounds (methylol compounds, blocked isocyanate compounds, etc.).

[0108] From the viewpoint of the strength, resolution, etc. of the photosensitive layer, the thickness of the photosensitive layer is preferably 0.6 μm to 30.0 μm, more preferably 1.5 μm to 20.0 μm, and even more preferably 2.0 μm to 15.0 μm.

[0109] (Thermoplastic resin layer) The transfer film may have a thermoplastic resin layer containing a surfactant between the temporary support and the intermediate layer. When the transfer film has a thermoplastic resin layer, the surface of the transfer film exposed by peeling off the temporary support is the surface of the thermoplastic resin layer. Its surface free energy is 66.0 mJ / m ２ or less, 63.0 mJ / m ２ More preferably, 60.0 mJ / m or less ２ More preferably, 55.0 mJ / m or less ２ From the viewpoint of adhesion, the lower limit of the surface free energy is particularly preferably 35 mJ / m ２ It is preferable that the concentration is 40 mJ / m or more. ２ More preferably, 45 mJ / m or more ２ The surface free energy of the surface of the thermoplastic resin layer can be adjusted by adjusting the type and content of the surfactant contained in the thermoplastic resin layer, the type and content of the thermoplastic resin contained in the thermoplastic resin layer, etc.

[0110] The thermoplastic resin contains one or more of the above surfactants. Preferred aspects of the surfactant are as explained in the intermediate layer, and will not be explained here. From the viewpoints of temporary support releasability, resolution, oxygen blocking ability, etc., the content of the surfactant relative to the total mass of the thermoplastic resin layer is preferably 0.01% by mass to 3% by mass, more preferably 0.02% by mass to 1% by mass, and even more preferably 0.03% by mass to 0.3% by mass.

[0111] The thermoplastic resin layer may contain one or more thermoplastic resins. The thermoplastic resin is not particularly limited as long as it is a resin that plasticizes when heated, but examples include acrylic resins, polystyrene resins, styrene-acrylic copolymers, polyurethane resins, polyvinyl alcohol, polyvinyl formal, polyamide resins, polyester resins, polyamide resins, epoxy resins, polyacetal resins, polyhydroxystyrene resins, polyimide resins, polybenzoxazole resins, polysiloxane resins, polyethyleneimine, polyallylamine, and polyalkylene glycols. Among these, from the viewpoint of developability and transferability, the thermoplastic resin is preferably an acrylic resin. Here, the acrylic resin refers to a resin having at least one structural unit selected from the group consisting of structural units formed from (meth)acrylic acid, structural units formed from (meth)acrylic acid esters, and structural units formed from (meth)acrylic acid amides, and the content of the structural unit is preferably 50% by mass or more relative to the total amount of the resin.

[0112] From the viewpoint of developability, the thermoplastic resin preferably has an acid group.

[0113] From the viewpoints of resolution, developability, and the like, the weight average molecular weight (Mw) of the thermoplastic resin is preferably 5,000 to 500,000, more preferably 10,000 to 100,000, and even more preferably 30,000 to 60,000. The dispersity (Mw / Mn) of the thermoplastic resin is preferably 1.0 to 6.0, more preferably 1.0 to 5.0, even more preferably 1.0 to 4.0, and particularly preferably 1.0 to 3.0.

[0114] From the viewpoint of resolution, developability, and the like, the acid value of the thermoplastic resin is preferably 60 mgKOH / g to 220 mgKOH / g, more preferably 120 mgKOH / g to 200 mgKOH / g, and even more preferably 150 mgKOH / g to 190 mgKOH / g.

[0115] From the viewpoint of film strength, the content of the thermoplastic resin relative to the total mass of the thermoplastic resin layer is preferably 10% by mass to 80% by mass, more preferably 30% by mass to 75% by mass, and even more preferably 50% by mass to 65% by mass.

[0116] The thermoplastic resin layer may contain one or more plasticizers. The plasticizer is not particularly limited as long as it is a compound that is compatible with the thermoplastic resin and exhibits plasticity. From the viewpoint of imparting plasticity, the plasticizer preferably has an alkyleneoxy group in the molecule, and is more preferably a polyalkylene glycol compound. The alkyleneoxy group contained in the plasticizer more preferably has a polyethyleneoxy structure or a polypropyleneoxy structure. The plasticizer is preferably a (meth)acrylate compound.

[0117] From the viewpoint of lamination properties, the content of the plasticizer relative to the total mass of the thermoplastic resin layer is preferably 15% by mass to 60% by mass, more preferably 25% by mass to 50% by mass, and even more preferably 35% by mass to 40% by mass.

[0118] The thermoplastic resin layer may contain additives such as colorants, dyes, acid generators, flame retardants, antioxidants, rust inhibitors, and dispersants.

[0119] From the viewpoints of releasability of the temporary support, resolution, oxygen blocking ability, etc., the thickness of the thermoplastic resin layer is preferably 1.0 μm to 20.0 μm, and more preferably 2.0 μm to 15.0 μm.

[0120] (Protective Film) The transfer film may have a protective film on the surface opposite to the intermediate layer side of the photosensitive layer. A resin film can be used as the protective film. Examples of the resin film include polyolefin films such as polypropylene film and polyethylene film, polyester films such as polyethylene terephthalate film, polycarbonate film, and polystyrene film. Among these, from the viewpoint of heat resistance, the protective film is preferably a polyolefin film, more preferably a polypropylene film or a polyethylene film, and even more preferably a polyethylene film.

[0121] The thickness of the protective film is not particularly limited, but from the viewpoint of mechanical strength etc., it is preferably 1.0 μm to 100.0 μm, more preferably 5.0 μm to 50.0 μm, and even more preferably 5.0 μm to 40.0 μm.

[0122] (Uses of Transfer Film) The transfer film of the present disclosure is preferably used to form circuit wiring arranged on a support substrate such as a sheet, a metal substrate, a ceramic substrate, or glass in a manufacturing process film for a semiconductor package, a printed circuit board, a flexible printed wiring board, or an interposer rewiring layer.

[0123] <Method for Manufacturing Transfer Film> In one embodiment, the method for manufacturing a transfer film of the present disclosure includes a step of applying an intermediate layer-forming composition to the surface of a temporary support and drying it to form an intermediate layer (hereinafter referred to as the intermediate layer-forming step), and a step of applying a photosensitive layer-forming composition to the surface of the intermediate layer and drying it to form a photosensitive layer (hereinafter referred to as the photosensitive layer-forming step). In another embodiment, the method for manufacturing a transfer film of the present disclosure includes a step of applying a thermoplastic resin-forming composition to the surface of a temporary support and drying it to form a thermoplastic resin layer (hereinafter referred to as the thermoplastic resin layer-forming step), a step of applying an intermediate layer-forming composition to the surface of the thermoplastic resin layer and drying it to form an intermediate layer, and a step of applying a photosensitive layer-forming composition to the surface of the intermediate layer and drying it to form a photosensitive layer. The two methods for manufacturing transfer films of the present disclosure described above may also include a step of providing a protective film on the surface of the photosensitive layer (hereinafter referred to as the protective film-arranging step). Note that, in this specification, "drying" means removing at least a portion of the solvent contained in the composition. Examples of drying methods include natural drying, heat drying, and reduced pressure drying. The above methods can be applied alone or in combination.

[0124] (Intermediate Layer Forming Step) The intermediate layer forming composition used in the intermediate layer forming step can be prepared by dissolving or dispersing the materials (surfactants, etc.) to be contained in the intermediate layer in a solvent. Examples of solvents include water, alcohols having 1 to 3 carbon atoms, acetone, ethylene glycol, and glycerin. Examples of methods for applying the intermediate layer forming composition include printing, spraying, roll coating, bar coating, curtain coating, spin coating, and die coating (i.e., slit coating). The drying temperature can be 80°C to 130°C. The drying temperature refers to the temperature of the environment in which the intermediate layer forming composition is dried. The drying time can be 20 seconds to 600 seconds.

[0125] (Photosensitive Layer Forming Step) The photosensitive layer forming composition used in the photosensitive layer forming step can be prepared by dissolving or dispersing the materials to be contained in the photosensitive layer in a solvent. Examples of the solvent include alkylene glycol ethers, alkylene glycol ether acetates, alcohols (methanol, ethanol, etc.), ketone solvents (acetone, methyl ethyl ketone, etc.), aromatic hydrocarbon solvents (toluene, etc.), aprotic polar solvents (N,N-dimethylformamide, etc.), cyclic ether solvents (tetrahydrofuran, etc.), ester solvents (n-propyl acetate, etc.), amide solvents, and lactone solvents. The coating method, drying temperature, and drying time of the photosensitive layer forming composition are the same as those in the intermediate layer forming step, and therefore will not be described here.

[0126] (Thermoplastic resin layer forming process) The thermoplastic resin layer forming composition used in the thermoplastic resin layer forming process can be prepared by dissolving or dispersing the materials to be contained in the thermoplastic resin layer in a solvent. Examples of the solvent include alkylene glycol ether, alkylene glycol ether acetate, alcohol (methanol, ethanol, etc.), ketone solvent (acetone, methyl ethyl ketone, etc.), aromatic hydrocarbon solvent (toluene, etc.), aprotic polar solvent (N,N-dimethylformamide, etc.), cyclic ether solvent (tetrahydrofuran, etc.), ester solvent (n-propyl acetate, etc.), amide solvent, lactone solvent, etc. The coating method, drying temperature, and drying time of the thermoplastic resin layer forming composition are the same as those in the intermediate layer forming process, and therefore will not be described here.

[0127] (Protective Film Arrangement Step) The protective film arrangement step can include laminating a protective film on the surface of the photosensitive layer. The protective film can be attached using a known laminator such as a vacuum laminator or an auto-cut laminator. The laminator is preferably equipped with any heatable roller such as a rubber roller and capable of applying pressure and heat.

[0128] <Method for manufacturing laminate> The method for manufacturing a laminate of the present disclosure includes the steps of: laminating a transfer film to a substrate so that the surface of the transfer film opposite the intermediate layer side of the photosensitive layer is in contact with the substrate (hereinafter also referred to as a "transfer film laminating step"); peeling off the temporary support (hereinafter also referred to as a "temporary support peeling step"); and, after peeling off the temporary support, performing an exposure treatment, and further performing a development treatment after the exposure to form a pattern (hereinafter also referred to as a "pattern forming step"). Preferred aspects of the transfer film used in the method for manufacturing a laminate of the present disclosure are as described above, and therefore will not be described here.

[0129] The method for producing a laminate according to the present disclosure is excellent in the releasability and resolution of the temporary support. The mechanism by which the above effects are achieved is not clear, but is presumed to be as follows. The transfer film used in the method for producing a laminate according to the present disclosure has an intermediate layer containing a surfactant, and when the temporary support is peeled off, the surface on the exposed side that does not contain the temporary support has a surface free energy of 66.0 mJ / m ２ The following is the result. It is presumed that this reduces the interaction with the temporary support, improving the releasability of the temporary support. Furthermore, as a result of improving the releasability of the temporary support, it is possible to suppress roughening of the surface of the transfer film from which the temporary support has been peeled off, and it is possible to suppress excessive improvement in adhesion to the mask, making it possible to form a fine pattern with reduced residue in the areas between the patterns. In the method for producing a laminate of the present disclosure, the temporary support is peeled off before the exposure treatment. It is presumed that this reduces the distance between the photosensitive layer and the exposure light source, making it possible to form a fine pattern with reduced residue in the areas between the patterns.

[0130] Hereinafter, the method for producing a laminate according to the present disclosure will be described in detail for each step. Note that the following description of the constituent elements may be based on a representative embodiment of the method for producing a laminate according to the present disclosure, but the present disclosure is not limited to such an embodiment.

[0131] (Transfer film laminating process) In the transfer film laminating process, a transfer film having a temporary support, an intermediate layer containing a surfactant, and a photosensitive layer is laminated to a substrate so that the surface of the transfer film opposite the intermediate layer side of the photosensitive layer is in contact with the substrate. The transfer film may have a thermoplastic resin layer containing a surfactant between the temporary support and the intermediate layer. The transfer film may have a protective film on the surface opposite the intermediate layer side of the photosensitive layer. In addition, when the transfer film has a protective film, the protective film is peeled off before the laminating process.

[0132] The method for laminating the transfer film and the substrate is not particularly limited, and known transfer methods and lamination methods can be used. Among these, it is preferable to laminate the transfer film and the substrate by placing the surface of the transfer film opposite the intermediate layer side of the photosensitive layer on the substrate and applying pressure and heat using a roll or the like. For lamination, known laminators such as a vacuum laminator or an auto-cut laminator can be used. It is preferable that the laminator is equipped with any heatable roller such as a rubber roller and is capable of applying pressure and heat. The lamination temperature is not particularly limited, and can be, for example, 70°C to 130°C.

[0133] The substrate is preferably a conductive substrate (wiring substrate) having a support substrate and a conductive layer disposed on the support substrate.

[0134] Examples of the support substrate include a resin substrate, a glass substrate, and a semiconductor substrate. A preferred embodiment of the support substrate is described, for example, in paragraph

[0140] of International Publication No. 2018 / 155193, the contents of which are incorporated herein by reference. Furthermore, when the support substrate is a resin substrate, the material of the resin substrate is preferably a substrate containing a cycloolefin polymer, polyethylene terephthalate, or polyimide. The thickness of the support substrate is not particularly limited, and can be 5.0 μm to 200.0 μm.

[0135] From the viewpoints of conductivity and fine line formability, the conductive layer is preferably at least one layer selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer. Furthermore, only one conductive layer may be disposed on the support substrate, or two or more conductive layers may be disposed. When two or more conductive layers are disposed, it is preferable to have conductive layers made of different materials. A preferred embodiment of the conductive layer is described, for example, in paragraph

[0141] of WO 2018 / 155193, the contents of which are incorporated herein by reference.

[0136] The conductive substrate is preferably a substrate having at least one of a transparent electrode and a routed wiring. A conductive substrate having such a configuration can be suitably used as a touch panel substrate. The transparent electrode can suitably function as a touch panel electrode. The transparent electrode is preferably composed of a metal oxide film such as ITO (indium tin oxide) and IZO (indium zinc oxide), a metal mesh, a metal nanowire, or other thin metal wire. Examples of the thin metal wire include thin wires of silver, copper, etc. Among these, silver conductive materials such as silver mesh and silver nanowire are preferred.

[0137] The material of the lead wiring is preferably a metal. Examples of the metal that can be used for the lead wiring include gold, silver, copper, molybdenum, aluminum, titanium, chromium, zinc, manganese, and alloys of two or more of these metal elements. The material of the lead wiring is preferably copper, molybdenum, aluminum, or titanium, and particularly preferably copper.

[0138] The substrate may be a substrate incorporating an element for interconnecting semiconductor elements, such as an element having a wiring pattern formed on a silicon substrate to interconnect semiconductor elements.

[0139] The substrate may have a seed layer on its surface. Examples of materials constituting the seed layer include copper, chromium, lead, nickel, gold, silver, tin, and zinc. The thickness of the seed layer is not particularly limited and can be 50 nm to 2 μm. The method for forming the seed layer is not particularly limited and includes a method of applying a dispersion liquid in which metal fine particles are dispersed and sintering the coating film, a sputtering method, a vapor deposition method, and the like.

[0140] From the viewpoint of reducing transmission loss, the dielectric loss tangent of the substrate at 24 GHz is preferably 0.05 or less, and more preferably 0.03 or less.

[0141] (Temporary Support Peeling Step) The method for peeling off the temporary support is not particularly limited and can be carried out based on a known method. For example, a mechanism similar to the cover film peeling mechanism described in paragraphs

[0161] to

[0162] of JP-A 2010-072589 can be used.

[0142] In one embodiment, the pattern is formed by bringing the exposed intermediate layer or thermoplastic resin into contact with a mask, performing an exposure treatment, and then performing a development treatment.

[0143] In the exposure treatment, the photosensitive layer of the laminate is exposed to light in a pattern. The pattern exposure means exposure that generates exposed and unexposed areas in the photosensitive layer.

[0144] Furthermore, when the photosensitive layer is a negative photosensitive layer, the exposure light source can be appropriately selected and used as long as it can irradiate light in at least a wavelength range capable of curing the photosensitive layer (for example, 365 nm or 405 nm). Of these, the dominant wavelength of the exposure light for pattern exposure is preferably 365 nm. The dominant wavelength refers to the wavelength with the highest intensity. Examples of the light source include semiconductor light sources such as various lasers and light-emitting diodes (LEDs); and discharge lamps such as ultra-high pressure mercury lamps, high pressure mercury lamps, and metal halide lamps. The exposure dose is not particularly limited, and is preferably 5 mJ / cm. ２ ~200 mJ / cm２ It can be said that:

[0145] After the exposure process and before the development process, it is preferable to remove the mask used in the exposure process.

[0146] The development process is a process of developing the pattern-shaped photosensitive layer obtained by the exposure process to form a pattern. The development of the photosensitive layer can be carried out using a developer. For example, when the photosensitive layer is a negative photosensitive layer, the unexposed areas of the photosensitive layer are removed by the development process using an alkaline developer, and the photosensitive layer remaining in the exposed areas forms a pattern.

[0147] In the development treatment, an alkaline aqueous solution is preferably used as the developer. Examples of alkaline compounds that can be contained in the alkaline aqueous solution include sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, and choline (2-hydroxyethyltrimethylammonium hydroxide).

[0148] Examples of the development method include puddle development, shower development, spin development, and dip development.

[0149] (Other Steps) When the transfer film has a protective film, the method for producing a laminate of the present disclosure may include a step of peeling off the protective film before bonding to the substrate. The method for peeling off the protective film is not particularly limited, and can be performed by a conventionally known method.

[0150] The method for producing a laminate according to the present disclosure may include at least one of a step of exposing the formed pattern to light (hereinafter also referred to as a "post-exposure step") and a step of heating the formed pattern (hereinafter also referred to as a "post-bake step"). When the method for producing a laminate according to the present disclosure includes both the post-exposure step and the post-bake step, it is preferable to carry out the post-bake step after the post-exposure step. The exposure dose of the post-exposure is 100 mJ / cm.２ ~5000mJ / cm ２ is preferred, and 200 mJ / cm ２ ~3000mJ / cm ２ The post-baking temperature is preferably 80° C. to 250° C., more preferably 90° C. to 160° C. The post-baking time is preferably 1 minute to 180 minutes, more preferably 10 minutes to 60 minutes.

[0151] <Method for manufacturing circuit wiring board> The method for manufacturing a circuit wiring board of the present disclosure includes, in this order: a step of manufacturing a laminate by the method for manufacturing a laminate of the present disclosure described above; a step of plating an area where no pattern is formed to form a conductive pattern (hereinafter also referred to as a "conductive pattern forming step"); and a step of removing the pattern (hereinafter also referred to as a "pattern removing step"). The method for manufacturing a circuit wiring board of the present disclosure may include a step of forming a protective layer on the surface of the plating layer after the conductive pattern forming step and before the pattern removing step (hereinafter also referred to as a "protective layer forming step"). If the substrate has a seed layer on its surface, the method for manufacturing a circuit wiring board of the present disclosure may include a step of removing the seed layer (hereinafter also referred to as a "seed layer removing step"). Note that the step of manufacturing a laminate by the method for manufacturing a laminate of the present disclosure described above has been described above, so a description thereof will be omitted here.

[0152] The circuit wiring board may be a semiconductor package. When the circuit wiring board is a semiconductor package, the manufacturing method for the circuit wiring board can include, after the seed layer removal step, a step of forming a solder resist layer having openings on the surface of the substrate using a solder resist (hereinafter also referred to as a "solder resist layer forming step"), a step of forming bump electrodes in the openings (hereinafter also referred to as a "bump electrode forming step"), and a step of mounting a semiconductor element to be connected to the bump electrodes (hereinafter also referred to as a "semiconductor element mounting step").

[0153] (Conductive Pattern Forming Step) The method for manufacturing a circuit wiring board includes a step of plating an area of ​​the laminate where no pattern has been formed by the method for manufacturing a laminate of the present disclosure, to form a conductive pattern. Examples of plating methods include electrolytic plating and electroless plating, and electrolytic plating is preferred from the viewpoint of productivity.

[0154] The metal used for plating is not particularly limited, and known metals can be used. Usable metals include copper, chromium, lead, nickel, gold, silver, tin, zinc, and alloys of these metals. From the viewpoint of electrical conductivity, copper or its alloys are preferred.

[0155] The thickness of the plating layer formed by plating is not particularly limited, and can be 0.1 μm to 20.0 μm.

[0156] (Pattern Removal Step) The method for removing the pattern is not particularly limited, but examples thereof include a method of removing the pattern by chemical treatment, and a method of removing the pattern using a remover is preferred. Examples of the remover include a remover obtained by dissolving an inorganic alkali component or an organic alkali component in water, dimethyl sulfoxide, N-methylpyrrolidone, a mixed solution thereof, or the like. Examples of the inorganic alkali component include sodium hydroxide and potassium hydroxide. Examples of the organic alkali component include a primary amine compound, a secondary amine compound, a tertiary amine compound, a quaternary ammonium salt compound, and the like.

[0157] The temperature of the remover is preferably 30° C. to 80° C., and more preferably 50° C. to 80° C. One preferred embodiment of the removal method is a method in which the laminate having the pattern to be removed is immersed for 1 minute to 30 minutes in a stirred remover having a temperature of 50° C. to 80° C. Alternatively, the pattern may be removed using the remover by a known method such as a spray method, a shower method, or a puddle method.

[0158] (Protective Layer Forming Step) The method for manufacturing a circuit wiring board according to the present disclosure may include a step of forming a protective layer on the surface of the plating layer after the conductive pattern forming step and before the pattern removing step. The material constituting the protective layer is preferably a material that is insoluble in the removing solution or etching solution used in the pattern removing step or seed layer removing step. Examples of materials constituting the protective layer include nickel, chromium, tin, zinc, magnesium, gold, silver, alloys thereof, and resins. Nickel or chromium is preferred as the material constituting the protective layer.

[0159] Examples of methods for forming the protective layer include electroless plating and electroplating, with electroplating being preferred.

[0160] The thickness of the protective layer is not particularly limited, and can be set to 0.3 μm to 3.0 μm.

[0161] (Seed Layer Removal Step) When the substrate has a seed layer on its surface, the method for manufacturing a circuit wiring board according to the present disclosure may include a step of removing the seed layer. The seed layer removal step is a step of removing the exposed seed layer to obtain conductive thin wires.

[0162] The method for removing the seed layer is not particularly limited, and may be a method using a known etching solution, such as a ferric chloride solution, a cupric chloride solution, an ammonia alkali solution, a sulfuric acid-hydrogen peroxide mixture, or a phosphoric acid-hydrogen peroxide mixture.

[0163] (Solder Resist Layer Forming Step) The method for manufacturing a circuit wiring board according to the present disclosure may include a step of using a solder resist to form a solder resist layer having openings on the surface of the substrate from which the seed layer has been removed. The openings preferably expose the conductive pattern formed on the surface of the substrate. As the solder resist, a conventionally known material may be used. Examples of the solder resist include azide-cyclized polyisoprene resins, azide-phenol resins, and chloromethyl polystyrene resins. The thickness of the solder resist layer is not particularly limited, and may be 5 μm to 50 μm. The method for forming the solder resist layer is not particularly limited, and may be a conventionally known method.

[0164] (Bump Electrode Forming Step) The method for manufacturing a circuit wiring board according to the present disclosure may include a step of forming bump electrodes in the openings of the solder resist layer. The bump electrodes are preferably connected to the conductor patterns exposed in the openings.

[0165] (Semiconductor Element Mounting Step) The manufacturing method of the circuit wiring board of the present disclosure can include a step of mounting a semiconductor element to be connected to the bump electrodes. The mounted semiconductor preferably has electrodes, which are preferably connected to the bump electrodes. After mounting the semiconductor, it is preferable to encapsulate the semiconductor using a conventional encapsulant.

[0166] An embodiment of a method for manufacturing a semiconductor package will be described below with reference to FIGS.

[0167] As shown in Fig. 1, a support substrate on which a conductive layer 11 is formed is prepared as a wiring substrate 10. Next, as shown in Fig. 2, a recess is formed in the wiring substrate 10 using a laser drill or the like. As shown in Fig. 3, an element 12 for connecting semiconductor elements to each other is prepared in the recess and placed in the recess as shown in Fig. 4. Next, a dielectric material 13 is prepared as shown in Fig. 4, and the dielectric material 13 is bonded to the substrate as shown in Fig. 5. The bonding method is not particularly limited, and can be the method described above. Next, as shown in Fig. 5, a via hole 14 is formed in the dielectric material 13 bonded to the wiring substrate 10. The via hole is formed by CO ２ The via holes 14 can be formed by using a laser, a UV (ultraviolet) laser, or the like. As shown in FIG. 6 , a seed layer 15 is formed on the surface of the dielectric material 13 in which the via holes 14 are formed. Then, as shown in FIG. 7 , the surface of the transfer film 20 opposite the intermediate layer of the photosensitive layer is bonded to the seed layer 15 formed on the surface of the wiring substrate 10. Next, the temporary support is peeled off from the transfer film 20, and an exposure process is performed. Further, after the exposure, a development process is performed to form a pattern 21 as shown in FIG. 8 . As shown in FIG. 9 , plating is performed on the areas of the seed layer 15 where the pattern is not formed, forming a conductive pattern 22. Thereafter, as shown in FIG. 10 , the pattern 21 is removed. Next, as shown in FIG. 11 , the seed layer is removed. After the seed layer is removed, a solder resist layer 30 having openings is formed on the entire surface of the wiring substrate 10 using solder resist as shown in FIG. 12 . Bump electrodes 31 are formed in the openings of the solder resist layer 30 as shown in FIG. 13 . As shown in FIG. 14, electrodes 40A and 41A of semiconductor elements 40 and 41 are connected to bump electrodes 31 and sealed, whereby a semiconductor package 100 can be obtained.

[0168] <Circuit Wiring Board> The circuit wiring board of the present disclosure is a circuit wiring board manufactured by the above-described method for manufacturing a circuit wiring board.

[0169] <Semiconductor Package> The semiconductor package of the present disclosure includes the circuit wiring board.

[0170] <Method for manufacturing a printed wiring board> The transfer film of the present disclosure can be used in the manufacture of a printed wiring board. The method for manufacturing a printed wiring board includes a step of subjecting a substrate having a pattern in the method for manufacturing a laminate described above to at least one treatment selected from the group consisting of an etching treatment and a plating treatment. Here, the etching or plating of the substrate can be performed by etching or plating the surface of the substrate using a known method using the developed pattern as a mask. Furthermore, before etching or plating, a residual film removal step may be performed using resin etching with a chemical solution containing a permanganate component, resin ashing with plasma, or the like.

[0171] Examples of the etching solution used for etching include a cupric chloride solution, a ferric chloride solution, and an alkaline etching solution. Examples of plating include copper plating, solder plating, nickel plating, and gold plating.

[0172] After etching or plating, the pattern can be stripped, for example, with an aqueous solution that is more strongly alkaline than the aqueous solution used for development. Examples of such strongly alkaline aqueous solutions include a 1% to 10% by mass aqueous solution of sodium hydroxide and a 1% to 10% by mass aqueous solution of potassium hydroxide. Examples of stripping methods include immersion and spraying. The printed wiring board on which the pattern is formed may be a multilayer printed wiring board and may have small-diameter through-holes.

[0173] When plating is performed on a substrate having a conductive layer, etc., it is necessary to remove the conductive layer other than the pattern. Examples of this removal method include a method in which the pattern is peeled off and then lightly etched, and a method in which solder plating or the like is performed following the plating, and then the pattern is peeled off to mask the wiring portion with solder, and then the substrate is treated with an etching solution that can etch only the conductive layer in the portion not masked with solder.

[0174] The present disclosure will be described in more detail below based on examples. The materials, amounts used, ratios, processing details, processing procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the present disclosure. Therefore, the scope of the present disclosure should not be interpreted as being limited by the examples shown below. Unless otherwise specified, "parts" and "%" are based on mass. In the following examples, the weight average molecular weight of the resin is the weight average molecular weight calculated in terms of polystyrene by gel permeation chromatography (GPC). The theoretical acid value was used as the acid value.

[0175] [Various Components of Transfer Film] First, various components used in producing the transfer film will be described below.

[0176] [Intermediate Layer] The compositions of intermediate layers 1 to 19 shown in Tables 7 to 12 are shown in Table 2.

[0177]

[0178] <<Various Components of Intermediate Layer>> The components of the photosensitive layer shown in Table 2 are as follows: PVA: (Polyvinyl alcohol: Product name "Kuraray Poval PVA-205" (manufactured by Kuraray Co., Ltd.)) PVP: (Polypyrrolidone: Product name "Polyvinylpyrrolidone K-30" (manufactured by Nippon Shokubai Co., Ltd.)) HPMC: (Hydroxypropyl methylcellulose: Product name "Metolose 60SH-03" (manufactured by Shin-Etsu Chemical Co., Ltd.)) PEG: (Polyethylene glycol: Product name "Polyethylene glycol 1,000" (molecular weight: 900-1000) (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)) Surfactant A: Silicone-based surfactant, BYK-345, manufactured by BYK Japan Surfactant B: Silicone-based surfactant, BYK-348, manufactured by BYK Japan Surfactant C: Silicone-based surfactant, EXP. S-506, manufactured by DIC Corporation Surfactant D: Fluorine-based surfactant, Megafac (registered trademark) F-444

[0179] <<Preparation of Composition for Forming Intermediate Layer>> A composition for forming an intermediate layer was prepared by mixing the components according to the description in Table 2 and then adding a solvent (a mixed solvent of ion-exchanged water and methanol (manufactured by Mitsubishi Gas Chemical Company, Inc.) in a mixing ratio (ion-exchanged water / methanol [mass ratio]) of 40 / 60). The values ​​in Table 2 represent the content of each component in parts by mass relative to the total mass of the intermediate layer.

[0180] [Photosensitive Layer] The compositions of the photosensitive layers 1 to 15 shown in Tables 7 to 12 are shown in Table 3. The values ​​relating to the polymers in the tables are the solid content.

[0181]

[0182] <<Various Components of Photosensitive Layer>> The components of the photosensitive layer shown in Table 3 are as follows. <Polymer> Polymers A-1 to A-5 were synthesized by known methods. The weight average molecular weights (Mw) of the synthesized polymers were measured by gel permeation chromatography (GPC) under the following conditions.

[0183] (GPC conditions) Apparatus: Tosoh high-speed GPC apparatus HLC-8420GPC (trade name), manufactured by Tosoh Corporation Guard column: HZ-L, manufactured by Tosoh Corporation Separation column: Three columns of TSK gel Super HZM-N (trade name), manufactured by Tosoh Corporation, connected in series Measurement temperature: 40°C Eluent: THF (tetrahydrofuran) Flow rate: Sample pump 0.35 mL / min, reference pump 0.175 mL / min Injection volume: 10 μL Detector: Differential refractometer Standard substance solution for GPC column calibration: Standard polystyrene, manufactured by Tosoh Corporation

[0184] (Synthesis of Polymer) The following abbreviations represent the following compounds: St: styrene (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) MAA: methacrylic acid (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) MMA: methyl methacrylate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) BA: butyl acrylate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) MAA-GMA: a structural unit in which glycidyl methacrylate is added to a structural unit derived from methacrylic acid.

[0185] Polymer A-1: ​​The solid content of the solution containing Polymer A-1 was adjusted to 30.0% by mass. The acid value of Polymer A-1 was 189 mgKOH / g.

[0186] Polymer A-2: The solid content of the solution containing Polymer A-2 was 30% by mass. The acid value of Polymer A-2 was 124 mgKOH / g.

[0187] Polymer A-3: The solid content of the solution containing Polymer A-3 was 30% by mass. The acid value of Polymer A-3 was 150 mgKOH / g.

[0188] Polymer A-4: The solid content of the solution containing Polymer A-4 was 30% by mass. The acid value of Polymer A-4 was 124 mgKOH / g.

[0189] Polymer A-5: The solid content of the solution containing Polymer A-5 was 30% by mass. The acid value of Polymer A-5 was 124 mgKOH / g.

[0190] The types and mass ratios of the monomers used to synthesize each polymer, as well as the weight average molecular weight of each polymer, are shown below. The unit of the amount of monomer in Table 4 is % by mass.

[0191]

[0192] <Other Components> Other components contained in the photosensitive layer shown in Table 3 are shown below. (Polymerizable Compounds) BPE-500: 2,2-bis(4-((meth)acryloxypentaethoxy)phenyl)propane, manufactured by Shin-Nakamura Chemical Co., Ltd. M-270: Polypropylene glycol diacrylate (n≒12), manufactured by Toagosei Co., Ltd. BPE-100: 2,2-bis(4-(methacryloylethoxy)phenyl)propane, manufactured by Shin-Nakamura Chemical Co., Ltd. A-TMPT: Trimethylolpropane triacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd. (Polymerization initiator) B-CIM: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, manufactured by Hampford Chemical Co., Ltd. (Sensitizer) SB-PI 701: 4,4'-bis(diethylamino)benzophenone, manufactured by Sanyo Trading Co., Ltd. (Chain transfer agent) Leuco Crystal Violet: manufactured by Tokyo Chemical Industry Co., Ltd. N,N-Tetraethyl-4,4-diaminobenzophenone: manufactured by Hodogaya Chemical Co., Ltd. N-Phenylcarbamoylmethyl-N-carboxymethylaniline: manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. (rust inhibitor) CBT-1: Carboxybenzotriazole, manufactured by Johoku Chemical Co., Ltd. (polymerization inhibitor) TDP-G: Phenothiazine, manufactured by Kawaguchi Chemical Co., Ltd. Irganox 245: Hindered phenol-based antioxidant, manufactured by BASF (antioxidant) 4-Hydroxymethyl-4-methyl-1-phenyl-3-pyrazolidone: manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. (surfactant) Surfactant E: Silicone-based surfactant, manufactured by DIC Corporation, EXP.S-315 Surfactant F: Silicone-based surfactant, manufactured by DIC Corporation, EXP. S-503-2 Surfactant G: Silicone-based surfactant, manufactured by Shin-Etsu Chemical Co., Ltd., KP-124 Surfactant H: Fluorine-based surfactant, Megafac (registered trademark) F-552

[0193] <<Preparation of composition for forming photosensitive layer>> A composition for forming a photosensitive layer was prepared by mixing the components according to the description in Table 3 and then adding methyl ethyl ketone to adjust the solids concentration to 25% by mass. The values ​​in Table 3 represent the content of each component in parts by mass relative to the total mass of the photosensitive layer.

[0194] [Thermosetting Resin Layer] The compositions of the thermosetting resin layers 1 to 5 shown in Tables 7 to 12 are shown in Table 5. The values ​​relating to the thermoplastic resin in the table are the solid content.

[0195]

[0196] <<Various Components of Thermoplastic Resin Layer>> The components of the thermoplastic resin layer shown in Table 5 are as follows. Note that components that have already been explained will not be described again. Note that the numerical values ​​in Table 5 represent the content of each component in parts by mass relative to the total mass of the thermoplastic resin layer.

[0197] Synthesis of Thermoplastic Resin A A solution containing thermoplastic resin A was obtained in the same manner as for polymer A-1, except that the types of monomers used were changed as shown in Table 6 below. The solid content concentration of the solution containing thermoplastic resin A was 30% by mass. The acid value of thermoplastic resin A was 155 mgKOH / g.

[0198] The types and mass ratios of the monomers used to synthesize thermoplastic resin A, as well as the weight average molecular weight of thermoplastic resin A, are shown below. The units of the amounts of the monomers in Table 6 are % by mass. The abbreviations in Table 6 represent the following compounds: BzMA: benzyl methacrylate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) MMA: methyl methacrylate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) AA: acrylic acid (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)

[0199]

[0200] <Other Components> Other components contained in the photosensitive layer shown in Table 5 are as follows: (Plasticizers) A-DCP: tricyclodecane dimethanol diacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd. 8UX-015: multifunctional urethane acrylate compound, manufactured by Taisei Fine Chemical Co., Ltd. TO-2349: multifunctional acrylate compound having a carboxy group, manufactured by Toagosei Co., Ltd.

[0201] (Dye) Dye B: Compound with the structure shown below (dye that develops color when exposed to acid)

[0202]

[0203] (Photoacid Generator) Photoacid Generator C: Compound having the structure shown below (photoacid generator, compound described in paragraph 0227 of JP2013-47765A, synthesized according to the method described in paragraph 0227).

[0204]

[0205] <<Preparation of Composition for Forming Thermoplastic Resin Layer>> Compositions for forming thermoplastic resin layer were prepared by mixing the components according to the description in Table 5 and then adding solvents (methyl ethyl ketone, propylene glycol monomethyl ether acetate). The values ​​in Table 5 represent the content of each component in parts by mass relative to the total mass of the thermoplastic resin layer.

[0206] Examples 1 to 36, Examples 49 to 64, Comparative Example 2 Production of Transfer Films Transfer films composed of a temporary support, an intermediate layer, and a photosensitive layer were each produced to have the configurations shown in Tables 7 to 9 or Tables 11 to 12. Specifically, the process is as follows. First, an intermediate layer-forming composition for forming an intermediate layer shown in Tables 7 to 9 or Tables 11 to 12 was applied onto a temporary support (thickness 16 μm, manufactured by Toray Industries, Inc., 16KS40) using a slit nozzle so that the coating width after drying was 1.0 m and the film thickness after drying was the value shown in Tables 7 to 9 or Tables 11 to 12. The film was then passed through a drying zone at 80° C. for 40 seconds to form an intermediate layer. Furthermore, a photosensitive layer-forming composition for forming a photosensitive layer shown in Tables 7 to 9 or 11 to 12 was applied onto the intermediate layer using a slit nozzle so that the coating width after drying would be 1.0 m and the film thickness after drying would be the numerical value shown in Tables 7 to 9 or 11 to 12, and the coating was passed through a drying zone at 80°C for 40 seconds to form a negative photosensitive layer. An 18 µm thick polypropylene film (Oji F-Tex Co., Ltd., Alphan E200C3) was pressure-bonded thereon as a protective film to prepare a transfer film, which was then wound up into a roll.

[0207] [Laminate Production] A copper layer with a thickness of 200 nm was formed on a 300 μm thick (glass epoxy resin) substrate by vapor deposition to prepare a copper-layered PET substrate. The dielectric loss tangent of the substrate at 24 GHz was measured using a 24 GHz split cylinder resonator manufactured by Kanto Electronics Application Development Co., Ltd., and was found to be 0.029. After peeling off the protective film from the prepared transfer film, the film was attached to the copper-layered PET substrate under lamination conditions of a roll temperature of 100°C, a linear pressure of 1.0 MPa, and a linear speed of 4.0 m / min, so that the copper layer and the photosensitive layer were in contact (transfer film lamination process). Next, the temporary support was peeled off at an angle of 180° (temporary support peeling process). Next, a photomask with a predetermined line width (μm) / space width (μm) pattern was used, and the intermediate layer was brought into contact with the mask after peeling, and exposure was performed. A high-pressure mercury lamp with an i-line (365 nm) dominant wavelength was used for exposure. The exposure dose was set arbitrarily so that the top shape of each pattern matched the mask opening. Shower development was performed with a 1% by mass aqueous solution of sodium carbonate at a liquid temperature of 25°C, followed by rinsing with water, forming a predetermined pattern on the copper to obtain a laminate (pattern formation process). The temporary support was peeled off, and the surface free energy of the exposed transfer film surface (intermediate layer surface) was calculated using the Owens formula described above. The results are summarized in Tables 7 to 9 or 11 to 12 as the surface free energy of the temporary support peeled surface.

[0208] Examples 37 to 48, Comparative Example 3 Transfer films each composed of a temporary support, a thermoplastic resin layer, an intermediate layer, and a photosensitive layer were prepared, each having the configuration shown in Table 10 or Table 12. Specifically, the process is as follows. First, a thermoplastic resin layer-forming composition for forming a thermoplastic resin layer shown in Table 10 or Table 12 was applied onto the temporary support using a slit nozzle so that the coating width after drying was 1.0 m and the film thickness after drying was the numerical value shown in Table 10 or Table 12. The film was then passed through an 80°C drying zone for 40 seconds to form a thermoplastic resin layer. Next, an intermediate layer-forming composition for forming an intermediate layer shown in Table 10 or Table 12 was applied onto the thermoplastic resin layer using a slit nozzle so that the coating width after drying was 1.0 m and the film thickness after drying was the numerical value shown in Table 10 or Table 12. The film was then passed through an 80°C drying zone for 40 seconds to form an intermediate layer. Furthermore, a photosensitive layer-forming composition for forming a photosensitive layer shown in Table 10 or Table 12 was applied onto the intermediate layer using a slit nozzle so that the coating width after drying was 1.0 m and the film thickness after drying was the numerical value listed in Table 10 or Table 12, and the coating was passed through an 80°C drying zone for 40 seconds to form a negative photosensitive layer. A 16 μm thick polyethylene terephthalate film (16KS40, manufactured by Toray Industries, Inc.) was pressed onto the intermediate layer as a protective film to prepare a transfer film, which was then wound up into a roll. The temporary support was peeled off, and the surface free energy of the exposed transfer film surface (thermoplastic resin layer surface) was calculated using the Owens formula described above, and the results are summarized in Table 10 or Table 12.

[0209] A laminate was produced in the same manner as in Example 1, except that the above transfer film was used.

[0210] [Comparative Example 1] A transfer film and a laminate were produced in the same manner as in Example 1, except that an intermediate layer was not formed and the photosensitive layer was changed to the configuration shown in Table 12. After peeling off the temporary support, the surface free energy of the exposed transfer film surface (photosensitive layer surface) was calculated using the Owens formula described above, and the results are summarized in Table 12.

[0211] [Various Evaluations] [Evaluation 1: Temporary Support Removal Property] The temporary support removability in the production of the laminates of the above Examples and Comparative Examples was evaluated based on the following evaluation criteria. The evaluation results are summarized in Tables 7 to 12. (Evaluation Criteria) "A": The temporary support can be peeled off smoothly. "B": The temporary support can be peeled off, but there is a noise when peeling. "C": A small amount of peeling traces are left on the surface of the transfer film after the temporary support has been peeled off (less than 5% of the peeled area). "D": A large amount of peeling traces are left on the surface of the transfer film after the temporary support has been peeled off (5% or more of the peeled area).

[0212] [Evaluation 2: Resolution] The resolution of the patterns formed on the laminates of the above Examples and Comparative Examples was evaluated based on the following evaluation criteria. The evaluation results are summarized in Tables 7 to 12. (Evaluation Criteria) "A": A pattern with an aspect ratio (pattern height / line width) of 2.0 or more could be formed without residue or pattern collapse. "B": Residue or a pattern was generated when forming a pattern with an aspect ratio of 2.0 or more, but a pattern with an aspect ratio of 1.8 or more but less than 2.0 could be formed without residue or pattern collapse. "C": Residue or a pattern was generated when forming a pattern with an aspect ratio of 1.8 or more but less than 2.0, but a pattern with an aspect ratio of 1.5 or more but less than 1.8 could be formed without residue or pattern collapse. "D": Residue or a pattern was generated when forming a pattern with an aspect ratio of 1.5.

[0213] [Evaluation 3: Interlayer Adhesion] In each of the Examples and Comparative Examples, three laminates were prepared as test specimens after the temporary support had been peeled off and before pattern formation. Cellophane tape was attached to the surface of the transfer film from which the temporary support had been peeled off, and the cellophane tape was peeled off while maintaining an angle of 180°. The transfer film with the peeled trace was visually observed and evaluated based on the following evaluation criteria. The evaluation results are summarized in Tables 7 to 12. Note that for Comparative Example 1, the transfer film did not have either an intermediate layer or a thermoplastic resin layer, so evaluation of interlayer adhesion was not performed. (Evaluation Criteria) "A": No interlayer delamination occurred. "B": Peeling occurred at the interface between the intermediate layer and the photosensitive layer, and a peeling trace was observed. "C": Peeling occurred at the interface between the intermediate layer and the photosensitive layer, and no peeling trace was observed. "D": Interlayer delamination occurred, and the peeled interface was not uniform.

[0214] [Evaluation 4: Defect Suppression] In the above Examples and Comparative Examples, the line width (μm) / space width (μm) ratio was changed to 1, a pattern was formed on the laminate, and the cross-sectional shape was observed with a scanning electron microscope (S-4800, manufactured by Hitachi, Ltd.) and evaluated based on the following evaluation criteria. The evaluation results are summarized in Tables 7 to 12. (Evaluation Criteria) "A": No defects were found in the pattern, and the shape of the upper part of the pattern was not a round-top shape (collar-shaped). "B": No defects were found in the pattern, but the shape of the upper part of the pattern was a round-top shape (collar-shaped). "C": Defects were found in one set of patterns. "D": Defects were found in two or more sets of patterns.

[0215]

[0216]

[0217]

[0218]

[0219]

[0220]

[0221] From the results in Tables 7 to 12, it can be seen that the surface free energy of the surface having the temporary support, the intermediate layer containing a surfactant, and the photosensitive layer, from which the temporary support was peeled off, was 66.0 mJ / m ２ It can be seen that the transfer film shown below is excellent in releasability of the temporary support, resolution, defect suppression, and interlayer adhesion.

[0222] Example 100: Manufacturing of a circuit wiring board (semiconductor package) As shown in Fig. 1, a support substrate on which a conductive layer 11 was formed was prepared as a wiring board 10. Next, as shown in Fig. 2, a recess was formed in the wiring board 10 using a laser drill. As shown in Fig. 3, an element 12 for connecting semiconductor elements to each other was prepared in the recess, and was placed in the recess as shown in Fig. 4. Next, a dielectric material 13 was prepared as shown in Fig. 4, and the dielectric material 13 was attached to the substrate as shown in Fig. 5. Next, CO ２Via holes 14 were formed using a laser and a UV laser, as shown in FIG. 5 . A 0.2 μm-thick seed layer 15 was formed on the surface of the dielectric material 13 with the via holes 14 formed thereon by Cu / Ti sputtering, as shown in FIG. 6 . The dielectric loss tangent at 24 GHz of the substrate with the seed layer formed thereon was measured using a 24 GHz split cylinder resonator manufactured by Kanto Application Development Co., Ltd., and was found to be 0.029. As shown in FIG. 7 , the surface of the photosensitive layer of the transfer film 20 opposite the intermediate layer was bonded to the seed layer 15 formed on the surface of the wiring substrate 10 (transfer film bonding process). After the temporary support was peeled from the transfer film 20 (temporary support peeling process), an exposure process was performed, and further, a development process was performed after the exposure to form a pattern 21 as shown in FIG. 8 (pattern formation process). Specifically, the photosensitive layer was exposed using an ultra-high pressure mercury lamp, and then developed for 30 seconds using a 1% by mass aqueous solution of sodium carbonate (30°C) as the developer. After development, the substrate was rinsed with a polishing cloth for 30 seconds, and then air was blown to remove moisture and form a pattern. Subsequently, as shown in FIG. 9 , plating was performed on the unpatterned areas of the seed layer 15 to form a conductive pattern 22 (conductive pattern formation process). Specifically, electrolytic plating was performed using a copper sulfate aqueous solution. Thereafter, as shown in FIG. 10 , the pattern 21 was removed using a removal solution (3.0 mass% sodium hydroxide aqueous solution, 50°C) (pattern removal process). Next, as shown in FIG. 11 , the seed layer was removed using an etching solution (aqueous solution containing 0.1 mass% sulfuric acid and 0.1 mass% hydrogen peroxide, 28°C) (seed layer removal process). After removing the seed layer, as shown in FIG. 12 , a solder resist was laminated on the entire surface of the wiring substrate 10, exposed to light using an ultra-high pressure mercury lamp, and then developed using a 1 mass% sodium carbonate aqueous solution (30°C). After development, the solder resist layer was thermally cured by heating at 180°C for 30 minutes to form a solder resist layer 30 having openings (solder resist layer forming step). The conductive pattern 22 was exposed in the openings. Then, bump electrodes 31 were formed in the openings of the solder resist layer 30 as shown in Fig. 13 (bump electrode forming step). The bump electrodes were connected to the exposed conductive pattern 22.14, electrodes 40A, 41A of semiconductor elements 40, 41 were connected to bump electrodes 31 and sealed (semiconductor element mounting step), thereby obtaining a semiconductor package 100. It was confirmed that the manufactured semiconductor package operated normally.

[0223] Example 101: Production of flexible printed wiring board A polyimide substrate with a copper layer was prepared by forming a 300 nm thick copper layer on both sides of a 25 μm thick polyimide substrate (Kapton 100H, manufactured by Toray Industries, Inc.) by vapor deposition.

[0224] <Exposure method 1> The transfer film of Example 49 was laminated on both sides of the polyimide substrate with the copper layer so that the copper layer and the photosensitive layer were in contact with each other under lamination conditions of a roll temperature of 100°C, a linear pressure of 1.0 MPa, and a linear speed of 1.0 m / min, to prepare a laminate for evaluation. Next, the temporary supports on both sides were peeled off in a 180° direction.

[0225] Next, a photomask having a pattern of predetermined line width (μm) / space width (μm) was used, and the intermediate layer was brought into contact with the mask and exposed simultaneously on both sides. A high-pressure mercury lamp with i-line (365 nm) as the dominant exposure wavelength was used for exposure. The exposure dose was set arbitrarily so that the top shape of each pattern matched the mask opening. Both sides were shower-developed with a 1% by mass aqueous solution of sodium carbonate at a liquid temperature of 30°C, and then washed with water, to obtain a laminate with a predetermined pattern formed on the copper on both sides. The laminate was then acid-degreased, washed with water, and dipped in sulfuric acid, and plated at 1 A / dm using a copper sulfate plating solution. ２ Copper plating was performed under the conditions of

[0043] until the plating thickness reached 15 μm. After rinsing with water and drying, the resist was stripped using a 3.0 mass % sodium hydroxide aqueous solution at 50°C, and the seed layer was then removed with an etching solution (aqueous solution containing 0.1 mass % sulfuric acid and 0.1 mass % hydrogen peroxide at 28°C), followed by rinsing with water to produce a flexible printed wiring board. The manufactured flexible printed wiring board was confirmed to function normally.

[0226] <Exposure Method 2> The transfer film of Example 51 was laminated on both sides of a polyimide substrate with a copper layer so that the copper layer and the photosensitive layer were in contact under lamination conditions of a roll temperature of 100 ° C., a linear pressure of 1.0 MPa, and a linear speed of 1.0 m / min, to produce a laminate for evaluation. Next, the temporary support on one side was peeled off at an angle of 180 °, and the peeled surface was exposed. Exposure was performed using a projection exposure machine with a high-pressure mercury lamp with i-line (365 nm) through a mask, using reduced projection exposure. The mask used had a pattern with a predetermined line width (μm) / space width (μm). The exposure amount was set arbitrarily so that the top shape of each pattern matched the mask opening.

[0227] Next, the temporary support of the transfer film on the side opposite to the exposed side was peeled off at a 180° angle, and the peeled side was exposed under the same conditions as the first exposed side. Both sides were shower-developed with a 1% by mass aqueous solution of sodium carbonate at a liquid temperature of 30°C, and then washed with water to obtain a laminate with a predetermined pattern formed on the copper on both sides. The laminate was then acid-degreased, washed with water, and dipped in sulfuric acid, and plated at 1 A / dm using a copper sulfate plating solution. ２ Copper plating was performed under the conditions of

[0043] until the plating thickness reached 15 μm. After rinsing with water and drying, the resist was stripped using a 3.0 mass % sodium hydroxide aqueous solution at 50°C, and the seed layer was then removed with an etching solution (aqueous solution containing 0.1 mass % sulfuric acid and 0.1 mass % hydrogen peroxide at 28°C), followed by rinsing with water to produce a flexible printed wiring board. The manufactured flexible printed wiring board was confirmed to function normally.

[0228] Examples 102 to 114 Using the transfer films of Examples 50 to 62, flexible printed wiring boards were produced in the same manner as in Example 101. It was confirmed that both the flexible printed wiring boards produced by exposure method 1 and exposure method 2 functioned normally.

[0229] The disclosures of Japanese Patent Application No. 2022-075452, filed April 28, 2022, and Japanese Patent Application No. 2023-000711, filed January 5, 2023, are incorporated herein by reference in their entirety. All publications, patent applications, and technical standards mentioned herein are incorporated herein by reference to the same extent as if each individual publication, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. A temporary support, an intermediate layer containing a surfactant, and a photosensitive layer, The temporary support was peeled off, and the surface free energy of the exposed surface not containing the temporary support was 66.0 mJ / m ２ Below is the transfer film.

2. The transfer film according to claim 1 , wherein the surfactant comprises a silicone-based surfactant.

3. The transfer film of claim 1 , wherein the photosensitive layer comprises a surfactant including a silicone-based surfactant.

4. the photosensitive layer contains an alkali-soluble resin, the alkali-soluble resin contains at least one of a structural unit derived from styrene and a structural unit derived from a styrene derivative, and a structural unit derived from a (meth)acrylic acid ester; The transfer film according to claim 3, wherein the content of the structural unit derived from the (meth)acrylic acid ester is 0.3 to 2.5 when the content of the structural unit derived from the styrene and the structural unit derived from the styrene derivative is 1.

5. The transfer film of claim 1 , wherein the intermediate layer comprises polyvinyl alcohol.

6. The transfer film according to claim 5, wherein the content of polyvinyl alcohol relative to the total mass of the intermediate layer is 15% by mass to 90% by mass.

7. The transfer film according to claim 1 , wherein the intermediate layer contains one or more compounds X selected from the group consisting of water-soluble cellulose compounds, polyether compounds, phenol compounds, and polyhydric alcohol compounds.

8. The transfer film according to claim 7, wherein the sum of the contents of the compounds X relative to the total mass of the intermediate layer is 0.1% by mass to 36% by mass.

9. The transfer film of claim 1 , wherein the intermediate layer comprises hydroxypropyl methylcellulose.

10. The transfer film according to claim 1 , wherein the intermediate layer has a thickness of 5.0 μm or less.

11. The transfer film according to claim 1, wherein the photosensitive layer has a thickness of 2.0 μm to 20.0 μm.

12. The transfer film according to claim 1 , further comprising a thermoplastic resin layer containing a surfactant including a silicone-based surfactant between the temporary support and the intermediate layer.

13. The transfer film according to claim 12, wherein the thermoplastic resin layer has a thickness of 2.0 μm to 15.0 μm.

14. The transfer film according to claim 1, wherein the surface not including the exposed temporary support is a surface of the intermediate layer, and the surface free energy thereof is 50 mJ / m 2 or more and 63.0 mJ / m 2 or less.

15. The transfer film according to claim 1, wherein the surface not including the exposed temporary support is a surface of the intermediate layer, and the surface free energy thereof is 55 mJ / m 2 or more and 60.0 mJ / m 2 or less.

16. A transfer film as described in claim 15, wherein the photosensitive layer contains a surfactant including a silicone-based surfactant.

17. a step of bonding the transfer film to the substrate so that a surface of the transfer film according to claim 1 opposite to the intermediate layer side of the photosensitive layer is in contact with the substrate; A step of peeling off the temporary support; A method for producing a laminate, comprising the steps of: carrying out an exposure treatment; and further carrying out a development treatment after the exposure to form a pattern, in that order.

18. The method for producing a laminate according to claim 17 , wherein the surfactant comprises a silicone-based surfactant.

19. The method for producing a laminate according to claim 17 , wherein the photosensitive layer comprises a surfactant including a silicone-based surfactant.

20. The method of claim 17, wherein the intermediate layer comprises polyvinyl alcohol.

21. The method for producing a laminate according to claim 17 , wherein the transfer film has a thermoplastic resin layer containing a surfactant including a silicone-based surfactant between the temporary support and the intermediate layer.

22. The method for producing a laminate according to claim 17 , wherein the substrate has a dielectric loss tangent of 0.05 or less at 24 GHz.

23. The method for producing a laminate according to claim 17 , wherein the substrate is a substrate incorporating an element for connecting semiconductor elements to each other.

24. A step of producing a laminate by the production method according to claim 17; performing a plating process on the area where the pattern is not formed to form a conductive pattern; removing the pattern; The method for manufacturing a circuit wiring board includes the steps of:

25. A circuit wiring board manufactured by the manufacturing method according to claim 24.

26. A semiconductor package comprising the circuit wiring board according to claim 25.