Electronic component module and wireless communication device comprising same

Abstract

This electronic component module comprises: a base sheet; an IC chip which is mounted on one surface of the base sheet; a combination electrode which is provided on the other side surface of the base sheet and is electrically connected to the ID chip; a protection layer which is provided on the one surface of the base sheet and in which the IC chip is embedded; an adhesive layer which is provided on the other surface of the base sheet so as to cover the combination electrode; and an insulation sheet which is provided on the protection layer so as to cover the protection layer. The insulation sheet is composed of a material having less tackiness than that of the protection layer.

Description

Electronic component module and wireless communication device including same

[0001] The present disclosure relates to an electronic component module and a wireless communication device including the same.

[0002] For example, Patent Document 1 discloses an RFIC (Radio-Frequency Integrated Circuit) module (electronic component module) in which an IC chip is protected by a protective film. The protective film is made of, for example, a thermosetting resin. The RFIC module is attached to an antenna pattern on an insulating film to produce a wireless communication device, a so-called RFID (Radio-Frequency Identification) tag.

[0003] International Publication No. 2021 / 019812

[0004] However, in the case of electronic component modules in which portions made of thermosetting resin are exposed to the outside, such as the RFIC module described in Patent Document 1, the tackiness of the thermosetting resin may cause multiple electronic component modules to stick to each other. For example, when electronic component modules are handled in a parts feeder, multiple electronic component modules may stick to each other and become unable to separate within the parts feeder. As a result, the handleability of the electronic component modules may be reduced.

[0005] Therefore, an object of the present disclosure is to prevent a situation in which multiple electronic component modules of a wireless communication device stick to each other, resulting in a decrease in handleability.

[0006] In order to solve the above technical problems, according to one aspect of the present disclosure, there is provided an electronic component module comprising: a base sheet; an IC chip mounted on one surface of the base sheet; a coupling electrode provided on the other surface of the base sheet and electrically connected to the IC chip; a protective layer provided on one surface of the base sheet and having the IC chip embedded therein; an adhesive layer provided on the other surface of the base sheet so as to cover the coupling electrode; and an insulating sheet provided on the protective layer so as to cover the protective layer, wherein the insulating sheet is made of a material having lower tackiness than the tackiness of the material of the protective layer.

[0007] According to another aspect of the present disclosure, there is provided a wireless communication device comprising: an electronic component module; and an antenna member to which the electronic component module is attached, the antenna member having an antenna pattern that is capacitively coupled to the electronic component module, wherein the electronic component module comprises: a base sheet; an IC chip mounted on one surface of the base sheet; a coupling electrode provided on the other surface of the base sheet, electrically connected to the IC chip, and capacitively coupled to the antenna pattern; a protective layer provided on one surface of the base sheet and in which the IC chip is embedded; an adhesive layer provided on the other surface of the base sheet so as to cover the coupling electrode; and an insulating sheet provided on the protective layer so as to cover the protective layer, wherein the insulating sheet is made of a material having lower tackiness than the tackiness of the material of the protective layer.

[0008] According to the present disclosure, it is possible to prevent a plurality of electronic component modules of a wireless communication device from sticking together and reducing the ease of handling.

[0009] 1. A perspective view of a wireless communication device according to one embodiment of the present disclosure. 2. A top view of a wireless communication device. 3. An exploded perspective view of an RFIC module. 4. An exploded perspective view of electronic components in the RFIC module. 5. An equivalent circuit diagram of a wireless communication device. 6. A cross-sectional view of a portion of a wireless communication device including an RFIC module immediately before attachment. 7. A cross-sectional view of the wireless communication device attached to an article. 8. An exploded perspective view of an RFIC module according to another embodiment of the present disclosure. 9. A top view of a wireless communication device according to a different embodiment of the present disclosure. 10. An exploded perspective view of an RFIC module in a wireless communication device according to a different embodiment. 11. An exploded perspective view of electronic components in an RFIC module in a wireless communication device according to a different embodiment.

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0011] Fig. 1 is a perspective view of a wireless communication device according to an embodiment of the present disclosure, and Fig. 2 is a top view of the wireless communication device. The X-Y-Z coordinate system in the figures is provided to facilitate understanding of the present disclosure and is not intended to limit the present disclosure. The X-axis direction indicates the longitudinal direction of the wireless communication device, the Y-axis direction indicates the width direction, and the Z-axis direction indicates the thickness direction.

[0012] As shown in FIGS. 1 and 2, the wireless communication device 10 is strip-shaped and is used as a so-called RFID (Radio-Frequency Identification) tag.

[0013] Specifically, as shown in FIGS. 1 and 2, the wireless communication device 10 has an antenna member 12 and an RFIC (Radio-Frequency Integrated Circuit) module 14 provided on the antenna member 12 .

[0014] The antenna member 12 of the wireless communication device 10 is strip-shaped (elongated rectangular) and comprises an antenna substrate 16 and antenna patterns 18A and 18B provided on one surface 16a of the antenna substrate 16 (first main surface 12a of the antenna member 12).

[0015] The antenna substrate 16 is a flexible sheet-like member made of an insulating material such as PET (polyethylene terephthalate). As shown in Figures 1 and 2, the antenna substrate 16 also has surfaces 16a and 16b that function as the first and second main surfaces 12a and 12b of the antenna member 12. Since the antenna substrate 16, which is a main component of the antenna member 12, is flexible, the antenna member 12 can also be flexible.

[0016] The antenna patterns 18A and 18B are used as antennas for wireless communication between the wireless communication device 10 and an external communication device (for example, a reader / writer device when the wireless communication device 10 is used as an RFID tag). In this embodiment, the antenna patterns 18A and 18B are conductor patterns made of metal foil such as silver, copper, or aluminum.

[0017] The antenna patterns 18A and 18B include radiating portions 18Aa and 18Ba for transmitting and receiving radio waves, and coupling portions 18Ab and 18Bb for electrically connecting to the RFIC module 14 .

[0018] In this embodiment, the radiating portions 18Aa and 18Ba of the antenna patterns 18A and 18B are dipole antennas having a meandering shape, and extend from coupling portions 18Ab and 18Bb, respectively, provided at the center of the antenna substrate 16 in the longitudinal direction (X-axis direction) toward both ends of the antenna substrate 16.

[0019] The coupling portions 18Ab and 18Bb of the antenna patterns 18A and 18B, which will be described in detail later, are electrically connected to coupling electrodes of the RFIC module 14. Each of the coupling portions 18Ab and 18Bb is a rectangular land.

[0020] Fig. 3 is an exploded perspective view of the RFIC module, Fig. 4 is an exploded perspective view of electronic components in the RFIC module, and Fig. 5 is an equivalent circuit diagram of the wireless communication device.

[0021] As shown in FIGS. 3 and 4, the RFIC module 14 is a device that performs wireless communication via antenna patterns 18A and 18B at a communication frequency in the 900 MHz band, that is, the UHF band.

[0022] 3 , in this embodiment, the RFIC module 14 is an electronic component module with a multilayer structure including electronic components 20. Specifically, the RFIC module 14 includes the electronic components 20 and a hot melt adhesive layer 22 for attaching the electronic components 20 to the antenna member 12. Furthermore, in this embodiment, the RFIC module 14 includes a bottom sheet 24 (second substrate) interposed between the electronic components 20 and the hot melt adhesive layer 22, a top sheet 26, and a protective layer 28 for protecting the electronic components 20.

[0023] As shown in FIG. 4, the electronic component 20 in the RFIC module 14 includes a base sheet 30 (first substrate), an RFIC chip 32 mounted on one surface 30a of the base sheet 30, a conductor pattern 34 formed on one surface 30a of the base sheet 30, and a conductor pattern 36 formed on the other surface 30b (first surface) of the base sheet 30 opposite the one surface 30a.

[0024] The base sheet 30 in the electronic component 20 of the RFIC module 14 is a thin insulating sheet made of an insulating material such as polyimide or liquid crystal polymer.

[0025] The RFIC chip 32 is an IC chip that operates at a UHF frequency (communication frequency) and has a structure in which various elements are embedded in a semiconductor substrate made of a semiconductor such as silicon. The RFIC chip 32 also has a first input / output terminal 32a and a second input / output terminal 32b. Furthermore, as shown in Figure 5, the RFIC chip 32 has an internal capacitance (capacitance: self-capacitance of the RFIC chip itself) C1.

[0026] The conductive pattern 34 is a pattern made of a conductive material such as silver, copper, aluminum, etc. The conductive pattern 34 includes two spiral coil portions 38 and 40.

[0027] A land portion 38a is provided at the outer peripheral end of the coil portion 38 of the conductor pattern 34, and is electrically connected to the first input / output terminal 32a of the RFIC chip 32 via, for example, solder (not shown). A land portion 38b is provided at the center end of the coil portion 38, and is electrically connected to the conductor pattern 36. A land portion 38d is also provided at the tip of a branch portion 38c that branches off from a portion of the coil portion 38 between the outer peripheral end (land portion 38a) and the center end (land portion 38b), and is electrically connected to the conductor pattern 36.

[0028] As shown in FIG. 5, the coil portion 38 functions as an inductance element having an inductance L1.

[0029] A land portion 40a is provided at the outer peripheral end of the coil portion 40 of the conductor pattern 34, which is electrically connected to the second input / output terminal 32b of the RFIC chip 32 via, for example, solder (not shown). A land portion 40b is provided at the center end of the coil portion 40, which is electrically connected to the conductor pattern 36. A land portion 40d is also provided at the tip of a branch portion 40c branching off from a portion of the coil portion 40 between the outer peripheral end (land portion 40a) and the center end (land portion 40b), which is electrically connected to the conductor pattern 36.

[0030] As shown in FIG. 5, the coil portion 40 functions as an inductance element having an inductance L2.

[0031] The conductor pattern 36 is a pattern made of a conductive material such as silver, copper, aluminum, etc. The conductor pattern 36 includes two spiral coil portions 42, 44 and two coupling electrodes 46, 48.

[0032] A land portion 42a is provided at the center side end of the coil portion 42 of the conductor pattern 36. The land portion 42a is electrically connected to the land portion 38b of the coil portion 38 of the conductor pattern 34 via an interlayer connection conductor 50 such as a through-hole conductor that penetrates the base sheet 30.

[0033] As shown in FIG. 5, the coil portion 42 functions as an inductance element having an inductance L3.

[0034] A land portion 44a is provided at the center side end of the coil portion 44 of the conductor pattern 36. The land portion 44a is connected to the land portion 40b of the coil portion 40 of the conductor pattern 34 via an interlayer connection conductor 52 such as a through-hole conductor that penetrates the base sheet 30.

[0035] As shown in FIG. 5, the coil portion 44 functions as an inductance element having an inductance L4.

[0036] The outer circumferential ends of the two coil portions 42, 44 are electrically connected via a connecting portion 54. The connecting portion 54 functions as an inductance element having an inductance L5.

[0037] The coupling electrodes 46, 48 of the conductor pattern 36 are electrically connected to the RFIC chip 32 and are electrodes for capacitive coupling with the coupling portions 18Ab, 18Bb of the antenna patterns 18A, 18B of the antenna member 12. In this embodiment, the coupling electrodes 46, 48 are rectangular and arranged with a gap between them. The coil portions 42, 44 and the connecting portion 54 are arranged between the coupling electrodes 46, 48.

[0038] The coupling electrode 46 is electrically connected to the land portion 38d of the coil portion 38 in the conductor pattern 34 via an interlayer connection conductor 56 such as a through-hole conductor that penetrates the base sheet 30. The coupling electrode 48 is electrically connected to the land portion 40d of the coil portion 40 via an interlayer connection conductor 58.

[0039] 5, a matching circuit 60 is formed by the coil portions 38, 40 of the conductor pattern 34, the coil portions 42, 44 and the connection portion 54 of the conductor pattern 36, and the self-capacitance C1 of the RFIC chip 32. This matching circuit 60 matches the impedance between the RFIC chip 32 and the coupling electrodes 46, 48 at a predetermined frequency (communication frequency).

[0040] 3 , a hot melt adhesive layer 22 is provided on the other surface 30b (i.e., the surface on the antenna member 12 side) of the base sheet 30 of the electronic component 20 of the RFIC module 14. Specifically, in the present embodiment, the hot melt adhesive layer 22 is provided on the other surface 30b of the base sheet 30 with a bottom sheet 24 (second substrate) interposed between the other surface 30b of the base sheet 30 and the hot melt adhesive layer 22. The hot melt adhesive layer 22 is also provided on the base sheet 30 so as to cover the coupling electrodes 46, 48.

[0041] The hot melt adhesive constituting the hot melt adhesive layer 22 softens (partially melts) when heated from a hardened state, and hardens again when cooled in the softened state. In this embodiment, the hot melt adhesive is, for example, an EVA-based thermoplastic resin that maintains its hardened state and does not deform at the temperature of the environment in which the wireless communication device 10 is used. In this embodiment, the hot melt adhesive layer 22 in its hardened state is insulating. Furthermore, in this embodiment, the hot melt adhesive layer 22 has a lower melting temperature, for example, 70 to 200 degrees Celsius, than other components of the RFIC module 14, such as the base sheet 30. When bonding, the hot melt adhesive layer 22 is softened by heating, for example, to approximately 95 degrees Celsius.

[0042] FIG. 6 is a cross-sectional view of a portion of a wireless communication device including an RFIC module immediately before attachment.

[0043] As shown in FIG. 6 , the hot melt adhesive layer 22 is interposed between the RFIC module 14 and the antenna member 12, bonding them together. Specifically, the RFIC module 14 is bonded to the antenna member 12 with the coupling electrode 46 facing the coupling portion 18Ab of the antenna pattern 18A and the coupling electrode 48 facing the coupling portion 18Bb of the antenna pattern 18B. Therefore, the coupling electrode 46 and the coupling portion 18Ab are capacitively coupled with the hot melt adhesive layer 22 and the bottom sheet 24 interposed therebetween (forming capacitance C2 as shown in FIG. 5 ). The coupling electrode 48 and the coupling portion 18Bb are capacitively coupled with the hot melt adhesive layer 22 and the bottom sheet 24 interposed therebetween (forming capacitance C3).

[0044] The bottom sheet 24 (second substrate) interposed between the base sheet 30 and the hot melt adhesive layer 22 is made of, for example, a thermosetting resin such as an epoxy resin. The bottom sheet 24 is provided on the other surface 30b of the base sheet 30 so as to cover the coupling electrodes 46, 48. The hot melt adhesive layer 22 is provided on the surface of the bottom sheet 24 opposite the surface facing the base sheet 30. The bottom sheet 24 is bonded to the base sheet 30 by, for example, thermocompression bonding.

[0045] The bottom sheet 24 protects the conductor pattern 36, including the coupling electrodes 46, 48, on the other surface 30b of the base sheet 30. At the same time, the bottom sheet 24 suppresses variations in the distance between the coupling electrode 46 and the coupling portion 18Ab of the antenna pattern 18A and the distance between the coupling electrode 48 and the coupling portion 18Bb of the antenna pattern 18B, i.e., variations in the capacitance therebetween.

[0046] For example, if only the hot melt adhesive layer 22 is present between the coupling electrode 46 and the coupling portion 18Ab, it is difficult to control the distance therebetween. That is, when the RFIC module 14 is attached to the antenna member 12, it is necessary to control the thickness of the hot melt adhesive layer 22 so as not to short-circuit the coupling electrode 46 and the coupling portion 18Ab. In contrast, if the bottom sheet 24 is present between the coupling electrode 46 and the coupling portion 18Ab, the thickness of the bottom sheet 24 is constant, so that the coupling electrode 46 and the coupling portion 18Ab are not short-circuited. This makes it possible to suppress variations in the distance between the coupling electrode 46 and the coupling portion 18Ab that could cause a short circuit.

[0047] The top sheet 26, for reasons that will be described later, is an insulating sheet made of a tack-free material, for example, an insulating resin material such as PET (polyethylene terephthalate), and is provided on one surface 30a of the base sheet 30. Specifically, a protective layer 28 in which at least the RFIC chip 32 is embedded is provided on one surface 30a of the base sheet 30. The protective layer 28 is made of a thermosetting resin such as epoxy resin so that the RFIC module 14 is flexible. The top sheet 26 is provided on the protective layer 28 so as to cover the protective layer 28. In this way, the top sheet 26 and the protective layer 28 protect the IC chip 32 and the conductor pattern 34 provided on one surface 30a of the base sheet 30. Note that another sheet may be provided on the top sheet 26. Here, the protective layer 28 is not limited to a thermosetting resin material. In addition to a thermosetting resin material, an adhesive such as a hot melt agent may also be used. This improves the adhesive strength between the top sheet 26 and the base sheet 30, and also improves the flexibility of the RFIC module if the hot melt agent is softer than the thermosetting resin.

[0048] In such wireless communication device 10, when antenna patterns 18A and 18B receive radio waves (signals) at a predetermined frequency (communication frequency) in the UHF band, a current corresponding to the signal flows from antenna patterns 18A and 18B to RFIC chip 32. The RFIC chip 32 is driven by the current and outputs a current (signal) corresponding to information stored in its internal memory unit (not shown) to antenna patterns 18A and 18B. Radio waves (signals) corresponding to the current are then radiated from antenna patterns 18A and 18B.

[0049] So far, the configuration of the wireless communication device 10 according to this embodiment has been described. From here on, a method for adhering the RFIC module 14 to the antenna member 12 via the hot melt adhesive layer 22 will be described.

[0050] 6, when adhering the RFIC module 14 to the antenna member 12, the RFIC module 14 is first placed on the antenna member 12. For example, the RFIC module 14 is placed on the antenna member 12 by a mounting device (not shown). When the RFIC module 14 is placed on the antenna member 12, the hot melt adhesive layer 22 is in a cured state and does not have any adhesive properties.

[0051] When the mounting device places the RFIC modules 14 on the antenna member 12, the parts feeder transports the multiple RFIC modules 14 one by one to a position (pickup position) where the mounting device picks up the RFIC modules 14. Until they are transported to the pickup position, the multiple RFIC modules 14 are in contact with each other inside the parts feeder. At this time, the top sheet 26 prevents the multiple RFIC modules 14 from sticking to each other.

[0052] If the top sheet 26 is not present, the protective layer 28 made of a thermosetting resin such as an epoxy resin would be exposed to the outside. The protective layer 28 made of a thermosetting resin such as an epoxy resin has tackiness. Due to this tackiness, multiple RFIC modules 14 would stick to one another via the protective layer 28, reducing the handleability of the RFIC modules 14. To address this issue, a tack-free top sheet 26 is provided on the protective layer 28 so as to cover the protective layer 28 and prevent the protective layer 28 from being exposed to the outside. In other words, the top sheet 26 is made of a material with lower tackiness than the tackiness of the material of the protective layer 28, and the top sheet 26 is provided on the protective layer 28.

[0053] The term "tackiness" as used herein refers to stickiness, and is measured, for example, using a probe tack tester. Simply put, a probe tack tester is a device that briefly contacts a specified cylindrical probe with the adhesive surface of an object to be measured for "tackiness" and then measures the force required to peel it off. The greater the load required to peel the probe off, the higher the "tackiness" of the object to be measured.

[0054] In the present embodiment, PET is used as the material for the top sheet 26, which has lower tackiness compared to the tackiness of the thermosetting resin, such as epoxy resin, that is the material for the protective layer 28. The top sheet 26 may be made of PI (polyimide) instead of PET.

[0055] With such a top sheet 26, it is possible to wind the carrier tape with the RFIC module 14 attached via the outer surface of the hot melt adhesive layer 22. Without the top sheet 26, the carrier tape and the protective layer 28 would stick together, making it impossible to wind the carrier tape.

[0056] Furthermore, depending on the type, the hot melt adhesive layer 22 may also have tackiness when cured. In such cases, there is a possibility that the hot melt adhesive layer 22 and the top sheet 26 may stick to each other. To address this issue, the outer surface of the hot melt adhesive layer 22 may be subjected to a roughening treatment, such as by providing a finely textured surface, to reduce the tackiness of the hot melt adhesive layer 22. In addition to or instead of this, the outer surface of the top sheet 26 may be subjected to a similar roughening treatment. Alternatively, a layer of a release agent (e.g., a silicone-based release agent) may be provided on the outer surface of the top sheet 26. When the hot melt adhesive layer 22 has tackiness, these surface treatments suppress the hot melt adhesive layer 22 from sticking to the top sheet 26.

[0057] When the RFIC module 14 is placed on the antenna member 12, the hot melt adhesive layer 22 is heated and softened. In the present embodiment, a heating device (not shown) that emits laser light LL (white arrow) is used to heat the hot melt adhesive layer 22. The RFIC module 14 is configured so that the hot melt adhesive layer 22 can be heated using the laser light LL.

[0058] Specifically, as shown in FIG. 6 , the laser light LL has a wavelength of, for example, approximately 900 nm and is irradiated not on the hot melt adhesive layer 22 but on the coupling electrodes 46, 48 covered by the hot melt adhesive layer 22. The coupling electrodes 46, 48 are heated by the laser light LL and reach a high temperature throughout. Heat H (indicated by the black arrows) is transferred from the coupling electrodes 46, 48, which are in a high temperature state throughout, to the hot melt adhesive layer 22, resulting in the hot melt adhesive layer 22 being heated and softened throughout. In other words, the coupling electrodes 46, 48 function as a heat spreader. In contrast, if the laser light LL were directly irradiated on the hot melt adhesive layer 22, there is a possibility that the portion irradiated with the laser light LL would excessively melt, e.g., liquefy, before the hot melt adhesive layer 22 softens throughout.

[0059] When the coupling electrodes 46, 48 functioning as heat spreaders are heated using laser light LL in this manner, it is preferable that the coupling electrodes 46, 48 be made of a material with high light absorption. For this reason, the coupling electrodes 46, 48 are preferably made of copper. If the coupling electrodes 46, 48 are made of copper, an oxide film (copper oxide layer) with high light absorption is formed on the surface of the coupling electrodes 46, 48. As a result, the laser light LL is absorbed by the coupling electrodes 46, 48 without being reflected.

[0060] In order to efficiently heat the hot melt adhesive layer 22 via the coupling electrodes 46, 48, the thermal resistance between the coupling electrodes 46, 48 and the hot melt adhesive layer 22 is set smaller than the thermal resistance between the coupling electrodes 46, 48 and the base sheet 30. Note that the term "thermal resistance" as used herein refers to a numerical value that indicates how difficult it is to conduct heat, and the larger the value, the more difficult it is to conduct heat.

[0061] In this embodiment, the bottom sheet 24 is interposed between the coupling electrodes 46, 48 and the hot melt adhesive layer 22. Therefore, the thermal resistance between the coupling electrodes 46, 48 and the bottom sheet 24 is smaller than the thermal resistance between the coupling electrodes 46, 48 and the base sheet 30.

[0062] Due to this difference in thermal resistance, most of the heat generated in the coupling electrodes 46, 48 heated by the laser light LL is transferred to the hot melt adhesive layer 22 via the bottom sheet 24. This allows the hot melt adhesive layer 22 to be softened efficiently in a short time.

[0063] In order to make the thermal resistance between the coupling electrodes 46, 48 and the bottom sheet 24 smaller than the thermal resistance between the coupling electrodes 46, 48 and the base sheet 30, in this embodiment, conductive particles such as carbon particles and aluminum particles are dispersed in the bottom sheet 24.

[0064] In this embodiment, the base sheet 30 is made of polyimide, and the bottom sheet 24 is made of epoxy resin. The thermal conductivity of the former is 0.28 to 0.34 [W / m·K], and the latter is 0.3 [W / m·K]. Therefore, the thermal conductivity of the materials themselves of the base sheet 30 and the bottom sheet 24 is approximately the same. In other words, the thermal resistance between the coupling electrodes 46, 48 and the base sheet 30 is substantially the same as the thermal resistance between the coupling electrodes 46, 48 and the bottom sheet 24. Therefore, in this embodiment, conductive particles are dispersed in the bottom sheet 24.

[0065] When conductive particles with high thermal conductivity are dispersed in the bottom sheet 24, heat is more easily transferred from the coupling electrodes 46, 48 into the bottom sheet 24. On the other hand, conductive particles are not dispersed in the base sheet 30. This allows the thermal resistance between the coupling electrodes 46, 48 and the bottom sheet 24 to be smaller than the thermal resistance between the coupling electrodes 46, 48 and the base sheet 30, even if the thermal conductivity of the materials of the bottom sheet 24 and the base sheet 30 is substantially the same. Therefore, most of the heat H generated in the coupling electrodes 46, 48 can be transferred to the bottom sheet 24, rather than to the base sheet 30.

[0066] In addition to or instead of dispersing conductive particles within the bottom sheet 24, the bottom sheet 24 may be made from a material with a thermal conductivity that is higher than that of the material of the base sheet 30. This also allows the thermal resistance between the coupling electrodes 46, 48 and the bottom sheet 24 to be lower than the thermal resistance between the coupling electrodes 46, 48 and the base sheet 30.

[0067] 6 , the laser light LL passes through the top sheet 26, the protective layer 28, and the base sheet 30 to reach the coupling electrodes 46, 48. To this end, the top sheet 26, the protective layer 28, and the base sheet 30 are made of materials that are transparent to light. In particular, the base sheet 30 is preferably made of a material that has a lower light absorptance than that of the coupling electrodes 46, 48. This allows a higher amount of laser light LL to reach the coupling electrodes 46, 48.

[0068] Furthermore, in this embodiment, as shown in FIGS. 2 and 3 , the RFIC chip 32 is provided on one surface 30 a of the base sheet 30. The RFIC chip 32 is provided on the one surface 30 a so as not to overlap the coupling electrodes 46, 48 in a plan view of the base sheet 30 (as viewed in the Z-axis direction). Specifically, in this embodiment, the coupling electrodes 46, 48 are arranged at intervals in the longitudinal direction (the X-axis direction). The RFIC chip 32 is positioned between the coupling electrodes 46, 48. This prevents the laser light LL from hitting the RFIC chip 32 and allows the laser light LL to reach the coupling electrodes 46, 48 without being obstructed by the RFIC chip 32.

[0069] The wireless communication device 10 thus produced is attached to an article for use.

[0070] FIG. 7 is a cross-sectional view of the wireless communication device attached to an article.

[0071] 7 , a double-sided tape 70 is used to attach the wireless communication device 10 to the surface Wa of the article W. Specifically, the wireless communication device 10 is attached to the surface Wa of the article W via the double-sided tape 70 with the RFIC module 14 facing the surface Wa of the article W.

[0072] The double-sided tape 70 may be a component of the wireless communication device 10. In that case, until the wireless communication device 10 is attached to the article W, the wireless communication device 10 is handled in a state in which a removable backing is attached to the adhesive surface 70a of the double-sided tape 70 that adheres to the article W, i.e., the wireless communication device 10 is handled as a sticker label.

[0073] Considering the case where the wireless communication device 10 is attached to an article W made of a material that does not substantially expand thermally, such as paper, the adhesive strength between the double-sided tape 70 and the top sheet 26 is made lower than the adhesive strength between the hot melt adhesive layer 22 and the antenna member 12.

[0074] Specifically, the antenna member 12 (its antenna substrate 16), the bottom sheet 24, the base sheet 30, the protective layer 28, the top sheet 26, and the double-sided tape 70 are made of a material that is substantially thermally expandable. If the article W is made of a material that is substantially non-thermally expandable, the double-sided tape 70 that is attached to and restrained on the surface Wa of the article W will be less likely to expand thermally. As a result, the top sheet 26 that is adhered to the double-sided tape 70 will also be less likely to expand thermally.

[0075] On the other hand, the antenna member 12 (antenna substrate 16 thereof) is susceptible to thermal expansion since the second main surface 12b thereof is not constrained and can be displaced freely.

[0076] Therefore, when heat is applied to the wireless communication device 10, shear forces may be generated at the interface between the hot melt adhesive layer 22 and the antenna member 12 in the portion of the wireless communication device 10 between the thermally resistant top sheet 26 and the thermally resistant antenna member 12. These shear forces may ultimately cause the RFIC module 14 to peel from the antenna member 12.

[0077] To address this issue, the adhesive strength between the double-sided tape 70 and the top sheet 26 is made lower than the adhesive strength between the hot melt adhesive layer 22 and the antenna member 12. For example, a release agent layer is provided on the outer surface of the top sheet 26 (the surface that comes into contact with the double-sided tape 70). This reduces the adhesive strength between the double-sided tape 70 and the top sheet 26, making the top sheet 26 more susceptible to thermal expansion. Alternatively, for example, the outer surface of the top sheet 26 may be roughened to reduce the contact area with the double-sided tape 70 and make the top sheet 26 more susceptible to thermal expansion.

[0078] As described above, according to the present embodiment, it is possible to prevent the RFIC modules 14 of the wireless communication device 10 from sticking together and reducing the ease of handling.

[0079] Although the present disclosure has been described above with reference to the above-described embodiment, the present disclosure is not limited to this embodiment.

[0080] For example, in the above-described embodiment, as shown in Fig. 3, in the RFIC module 14, an insulating bottom sheet 24 is interposed between the electronic component 20 and the hot melt adhesive layer 22. However, the embodiment of the present disclosure is not limited to this.

[0081] FIG. 8 is an exploded perspective view of an RFIC module according to another embodiment of the present disclosure.

[0082] 8 , in an RFIC module 114 according to another embodiment, a hot melt adhesive layer 122 is provided directly on the electronic component 20, similar to the bottom sheet 24 of the above-described embodiment, and covers the coupling electrodes 46, 48. In this case, the thermal resistance between the coupling electrodes 46, 48 and the hot melt adhesive layer 122 is made smaller than the thermal resistance between the coupling electrodes 46, 48 and the base sheet 30.

[0083] 3 , the hot melt adhesive layer 22 that bonds the RFIC module 14 and the antenna member 12 is provided on the RFIC module 14. However, the embodiment of the present disclosure is not limited to this. The hot melt adhesive layer 22 may be provided on the antenna member 12.

[0084] 6, the coupling electrodes 46, 48 are heated by irradiation with the laser light LL. This is because the coupling electrodes 46, 48 are not exposed to the outside. However, the embodiment of the present disclosure is not limited to this. For example, a portion of the coupling electrodes 46, 48 may be exposed, a heat transfer member may be brought into contact with the exposed portion, and the heat transfer member may be heated.

[0085] Furthermore, in the above-described embodiment, in the wireless communication device 10, the coupling electrodes 46, 48 of the electronic component 20 in the RFIC module 14 are capacitively coupled to the coupling portions 18Ab, 18Bb of the antenna patterns 18A, 18B of the antenna member 12. Therefore, as shown in FIGS. 2 and 6 , the coupling electrodes 46, 48 face the coupling portions 18Ab, 18Bb at a distance in the thickness direction (Z-axis direction) of the wireless communication device 10. That is, they are electric field coupled. However, the embodiments of the present disclosure are not limited to electric field coupling.

[0086] Fig. 9 is a top view of a wireless communication device according to another embodiment of the present disclosure, Fig. 10 is an exploded perspective view of an RFIC module in the wireless communication device according to another embodiment, and Fig. 11 is an exploded perspective view of electronic components in an RFIC module in the wireless communication device according to another embodiment.

[0087] 9 , in a wireless communication device 210 according to a different embodiment, an antenna member 212 includes an antenna pattern 218 that magnetically couples with an RFIC module 214. When viewed in the thickness direction (Z-axis direction) of the wireless communication device 210, the antenna pattern 218 includes a substantially C-shaped coupling portion 218a that is provided so as to surround the RFIC module 214, and linear radiation portions 218b and 218c that extend in opposite directions from both ends of the coupling portion 218a.

[0088] 10, the RFIC module 214 includes an electronic component 220, a bottom sheet 24 interposed between the electronic component 220 and the hot melt adhesive layer 22, a top sheet 26, and a protective layer 28 for adhering the top sheet 26 to the electronic component 220. Note that the bottom sheet 24 may be omitted.

[0089] 11 , the electronic component 220 includes a base sheet 230, an RFIC chip 232 provided on the base sheet 230, and a coil conductor 246 (coupling electrode) provided on the base sheet 230 and electrically connected to the RFIC chip 232. The coil conductor 246 includes a spiral conductor pattern 248 provided on one surface 230 a of the base sheet 230, a spiral conductor pattern 250 provided on the other surface 230 b, and interlayer connection conductors 252 and 254 such as through-hole conductors that penetrate the base sheet 230 and electrically connect the conductor patterns 248 and 250. The coil conductor 246 is provided on the base sheet 230 so as to surround the RFIC chip 232 when viewed in the thickness direction (Z-axis direction) of the wireless communication device 210.

[0090] In this wireless communication device 210, when the antenna pattern 218 receives radio waves, a current flows through the coupling portion 218a of the antenna pattern 218, causing the coupling portion 218a to generate a magnetic field. This magnetic field causes a current to flow through the coil conductor 246 of the electronic component 220 of the RFIC module 214. The RFIC chip 232 is driven by this current and outputs a current corresponding to information stored in its internal memory (not shown) to the coil conductor 246. The coil conductor 246 generates a magnetic field corresponding to the output current, and this magnetic field causes a current to flow through the coupling portion 218a of the antenna pattern 218. As a result, the antenna pattern 218 radiates radio waves corresponding to the current.

[0091] Furthermore, in the RFIC module 214, the coil conductor 246 is heated by irradiation with laser light. The hot melt adhesive layer 22 is heated and softened by the coil conductor 246, and as a result, the RFIC module 214 is bonded to the antenna member 212 via the hot melt adhesive layer 22.

[0092] There are various types of antenna patterns that can be magnetically coupled with the RFIC module 214.

[0093] 12 and 13 are top views of wireless communication devices according to different modified embodiments.

[0094] For example, as shown in FIG. 12, in one modified example of a wireless communication device 310, an antenna pattern 318 includes a substantially "C"-shaped coupling portion 318a arranged to surround the RFIC module 214, and meandering radiating portions 318b and 318c extending in opposite directions from both ends of the coupling portion 318a.

[0095] 13 , in a wireless communication device 410 according to another modification, an antenna pattern 418 includes linear radiating portions 418 a and 418 b extending parallel to each other with a gap therebetween, and a connecting portion 418 c connecting one end of the radiating portions 418 a and 418 b to each other. The RFIC module 214 is surrounded by the two radiating portions 418 a and 418 b and the connecting portion 418 c. This allows the RFIC module 214 to be magnetically coupled to the antenna pattern 418.

[0096] Furthermore, in the above-described embodiment, the electronic component module and member bonded via the hot melt adhesive layer 22 are the RFIC module 14 and antenna member 12 in the wireless communication device, but the embodiments of the present disclosure are not limited to this.

[0097] That is, various aspects of the present disclosure are as follows.

[0098] A first aspect is an electronic component module having a base sheet, an IC chip mounted on one surface of the base sheet, a coupling electrode provided on the other surface of the base sheet and electrically connected to the IC chip, a protective layer provided on one surface of the base sheet and in which the IC chip is embedded, an adhesive layer provided on the other surface of the base sheet so as to cover the coupling electrode, and an insulating sheet provided on the protective layer so as to cover the protective layer, wherein the insulating sheet is made of a material having lower tackiness than the tackiness of the material of the protective layer.

[0099] A second aspect is the electronic component module of the first aspect, wherein the protective layer is made of epoxy resin, and the insulating sheet is made of polyethylene terephthalate.

[0100] A third aspect is the electronic component module of the first or second aspect, wherein the adhesive layer is a hot melt adhesive layer, and the outer surface of the hot melt adhesive layer is roughened.

[0101] A fourth aspect is the electronic component module according to any one of the first to third aspects, wherein the outer surface of the insulating sheet is subjected to a surface roughening treatment.

[0102] A fifth aspect is the electronic component module according to any one of the first to fourth aspects, further comprising a release agent layer provided on the outer surface of the insulating sheet.

[0103] A sixth aspect is a wireless communication device comprising: an electronic component module; and an antenna member to which the electronic component module is attached, the antenna member having an antenna pattern that is capacitively coupled to the electronic component module; the electronic component module comprising: a base sheet; an IC chip mounted on one surface of the base sheet; a coupling electrode provided on the other surface of the base sheet, electrically connected to the IC chip, and electromagnetically coupled to the antenna pattern; a protective layer provided on one surface of the base sheet and in which the IC chip is embedded; an adhesive layer provided on the other surface of the base sheet so as to cover the coupling electrode; and an insulating sheet provided on the protective layer so as to cover the protective layer, wherein the insulating sheet is made of a material that has lower tackiness than the tackiness of the material of the protective layer.

[0104] A seventh aspect is the wireless communication device of the sixth aspect, further comprising a double-sided tape provided on the outer surface of the insulating sheet of the electronic component module, and the adhesive strength between the double-sided tape and the insulating sheet is lower than the adhesive strength between the adhesive layer and the antenna member.

[0105] An eighth aspect is the wireless communication device according to the seventh aspect, wherein a release agent layer is provided on the outer surface of the insulating sheet.

[0106] The present disclosure is applicable when attaching an electronic component module having a coupling electrode to a member having a conductor pattern that is capacitively or magnetically coupled to the coupling electrode.

Claims

1. A base sheet; An IC chip mounted on one surface of the base sheet; a coupling electrode provided on the other surface of the base sheet and electrically connected to the IC chip; a protective layer provided on one surface of the base sheet and in which the IC chip is embedded; an adhesive layer provided on the other surface of the base sheet so as to cover the coupling electrode; an insulating sheet provided on the protective layer so as to cover the protective layer, An electronic component module, wherein the insulating sheet is made of a material having a low tackiness compared to the tackiness of a material of the protective layer.

2. the protective layer is made of an epoxy resin; The electronic component module of claim 1 , wherein the insulating sheet is made of polyethylene terephthalate.

3. The adhesive layer is a hot melt adhesive layer, The electronic component module of claim 1 , wherein an outer surface of the hot melt adhesive layer is roughened.

4. The electronic component module according to claim 1 , wherein an outer surface of the insulating sheet is roughened.

5. The electronic component module according to claim 1 , further comprising a release agent layer provided on an outer surface of the insulating sheet.

6. An electronic component module; an antenna member to which the electronic component module is attached, the antenna member having an antenna pattern that is capacitively coupled with the electronic component module; The electronic component module comprises: A base sheet; An IC chip mounted on one surface of the base sheet; a coupling electrode provided on the other surface of the base sheet, electrically connected to the IC chip, and electromagnetically coupled to the antenna pattern; a protective layer provided on one surface of the base sheet and in which the IC chip is embedded; an adhesive layer provided on the other surface of the base sheet so as to cover the coupling electrode; an insulating sheet provided on the protective layer so as to cover the protective layer, A wireless communication device, wherein the insulating sheet is made from a material that has low tackiness compared to the tackiness of a material of the protective layer.

7. The electronic component module further includes a double-sided tape provided on an outer surface of the insulating sheet, The wireless communication device according to claim 6 , wherein an adhesive strength between the double-sided tape and the insulating sheet is lower than an adhesive strength between the adhesive layer and the antenna member.

8. The wireless communication device of claim 7 , wherein an outer surface of the insulating sheet is provided with a release agent layer.