Binding protective tape

Abstract

Provided is a binding protective tape that has an excellent balance between flexibility and protective performance, and also has excellent tape storage stability. The present invention provides a binding protective tape having a substrate and an adhesive layer formed on one side of the substrate, wherein the substrate is composed of a resin composition containing a polyvinyl chloride resin, a plasticizer, a filler, and a slidability imparting agent, and the content of the slidability imparting agent in the resin composition is 1-10 parts by mass with respect to 100 parts by mass of the polyvinyl chloride resin.

Description

Bundling protection tape

[0001] The present invention relates to a bundling and protection tape that can be suitably used for bundling and protecting high-voltage cables in electric vehicles and hybrid vehicles, automotive wire harnesses, and the like.

[0002] For the purposes of bundling and protecting automotive wire harnesses, polyvinyl chloride bundling protection tapes, which have a substrate made of polyvinyl chloride resin and a pressure-sensitive adhesive applied to one side thereof, are used because they have moderate flexibility and extensibility, and are excellent in flame retardancy, mechanical strength, heat deformation resistance, electrical insulation, and moldability, and are also relatively inexpensive (Patent Documents 1 and 2). It is also known that the cut resistance and abrasion resistance of polyvinyl chloride bundling protection tapes can be improved by arranging hard wires harder than polyvinyl chloride resin in a predetermined cutting direction and embedding them in the substrate (Patent Document 3).

[0003] JP 8-259909 JP 2012-184369 JP 9-71031

[0004] An object of the present invention is to provide a bundling and protective tape that has an excellent balance between flexibility and protective performance and also has excellent storage stability.

[0005] As a result of investigations by the present inventors, it was discovered that a bundling protection tape having a substrate and a pressure-sensitive adhesive layer formed on one side of the substrate can be obtained by incorporating a polyvinyl chloride resin, a plasticizer, a filler, and a sliding property-imparting agent in the substrate, and setting the content of the sliding property-imparting agent to 1 to 10 parts by mass per 100 parts by mass of the polyvinyl chloride resin, thereby obtaining a bundling protection tape that has an excellent balance of flexibility and protective performance and also has excellent storage stability. That is, the present invention provides: [1] A bundling protection tape having a substrate and a pressure-sensitive adhesive layer formed on one side of the substrate, wherein the substrate is made of a resin composition containing a polyvinyl chloride resin, a plasticizer, a filler, and a sliding property-imparting agent, and the content of the sliding property-imparting agent in the resin composition is 1 to 10 parts by mass per 100 parts by mass of the polyvinyl chloride resin. [2] A bundling protection tape having a substrate and a pressure-sensitive adhesive layer formed on one side of the substrate, wherein the substrate is made of a resin composition containing a polyvinyl chloride resin, a plasticizer, a filler, and a sliding property-imparting agent, and the content of the sliding property-imparting agent in the resin composition is 1 to 10 parts by mass per 100 parts by mass of the polyvinyl chloride resin. The bond protection tape according to [1], wherein the substrate is fixed using a 5000NS double-sided tape, and the dynamic friction coefficient of the substrate surface is 0.06 to 0.26 when measured using an R contactor based on ASTM D1894 under conditions of a load of 200 g and a test speed of 2.5 mm / sec. [3] The bond protection tape according to [1], wherein the bond protection tape is fixed to a sample stage via the pressure-sensitive adhesive layer, and the dynamic friction coefficient of the substrate back surface of the bond protection tape is 0.13 to 0.60 when measured using an R contactor based on ASTM D1894 under conditions of a load of 200 g and a test speed of 2.5 mm / sec. [4] The bond protection tape according to any one of [1] to [3], wherein the slidability-imparting agent is any one selected from the group consisting of linear polyorganosiloxane, crosslinked polyorganosiloxane, silica, talc, glass fiber, and fluororesin. [5] The binder protection tape according to any one of [1] to [4], wherein the sliding property imparting agent is a linear polydimethylsiloxane. [6] The linear polydimethylsiloxane has a kinematic viscosity of 2,000,000 mm at 25°C. ２ / s or more. [7] The bond protection tape according to any one of [1] to [6], wherein the content of the plasticizer in the resin composition is 38 to 60 parts by mass per 100 parts by mass of the polyvinyl chloride resin. [8] The bond protection tape according to any one of [1] to [7], wherein the content of the filler in the resin composition is 10 to 60 parts by mass per 100 parts by mass of the polyvinyl chloride resin. [9] The bond protection tape according to any one of [1] to [8], wherein the thickness of the substrate is 180 to 330 μm.

[10] The bond protection tape according to any one of [1] to [9], wherein the tensile modulus of elasticity converted into thickness of the substrate is 5 to 9 N / mm.

[0006] According to the present invention, it is possible to provide a bundling and protective tape that has an excellent balance between flexibility and protective performance, and further has excellent storage stability of the tape.

[0007] <Explanation of Terms> In the present specification, for example, the description "A to B" means A or more and B or less.

[0008] The following describes in detail the embodiments of the present invention. The present invention is not limited to these, and various modifications are possible without departing from the spirit of the invention. The various features shown in the following embodiments can be combined with each other. Furthermore, each feature can be an invention independently.

[0009] <Configuration of the bundling protection tape> The bundling protection tape according to one embodiment of the present invention has a substrate and a pressure-sensitive adhesive layer formed on one side of the substrate. Each component will be described in detail below.

[0010] <Substrate> A substrate according to one embodiment of the present invention is composed of a resin composition containing a polyvinyl chloride resin, a plasticizer, a filler, and a sliding property imparting agent, in which the content of the sliding property imparting agent is 1 to 10 parts by mass per 100 parts by mass of the polyvinyl chloride resin.

[0011] <Polyvinyl chloride resin> In one embodiment of the present invention, the polyvinyl chloride resin preferably has an average degree of polymerization of 1000 to 1500, and two or more polyvinyl chloride resins with different average degrees of polymerization may be used. If the average degree of polymerization is less than 1000, the entanglement of polymer chains may be insufficient, making it difficult to obtain sufficient strength (abrasion resistance). If the average degree of polymerization is higher than 1500, gelation may be difficult, which may result in poor film formability.

[0012] <Plasticizer> The plasticizer used in one embodiment of the present invention is not particularly limited as long as it can impart flexibility to the substrate. Examples include trimellitic acid esters, adipate esters, phthalate esters, epoxy-based plasticizers, isophthalate esters, terephthalate esters, and phosphoric acid-based plasticizers. Phthalate esters are preferred from the viewpoints of their plasticizing effect on polyvinyl chloride resins and their reduced bleed-out. These plasticizers may be used alone or in combination of two or more.

[0013] <Phthalate Ester> Examples of phthalate ester plasticizers in one embodiment of the present invention include DINP (diisononyl phthalate), DHP (diheptyl phthalate), DOP (di-2-ethylhexyl phthalate), n-DOP (di-n-octyl phthalate), and diisodecyl phthalate (DIDP). From the viewpoints of plasticizing effect on polyvinyl chloride resin, less bleed-out, and less impact on the human body, diesters of phthalic acid and alcohols having 9 to 10 carbon atoms, such as DINP (diisononyl phthalate) and diisodecyl phthalate (DIDP), are preferred. These plasticizers may be used alone or in combination of two or more.

[0014] In one embodiment of the present invention, the content of the plasticizer is preferably 38 to 60 parts by mass, more preferably 40 to 50 parts by mass, per 100 parts by mass of polyvinyl chloride resin. Specifically, for example, 38, 40, 42, 43, 44, 45, 46, 48, 50, 55, or 60 parts by mass is preferred, and may be within a range between any two of the values ​​exemplified here. By using 38 parts by mass or more of the plasticizer, the flexibility of the substrate is improved, and for example, improved tracking when wrapped around an electric wire or the like can reduce lifting of the bundling protection tape. By using 60 parts by mass or less of the plasticizer, the abrasion resistance of the substrate is improved, resulting in good protective performance. Note that when a plasticizer is used in combination, the content of the plasticizer refers to the total amount of the plasticizer used in combination.

[0015] <Filler> The filler in one embodiment of the present invention is not particularly limited as long as it can increase the amount of the base material and improve hardness. For example, from the viewpoint of achieving both a reinforcing effect and flexibility, an inorganic filler is preferred.

[0016] <Inorganic Filler> Examples of inorganic fillers in one embodiment of the present invention include calcium carbonate, aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, calcium hydroxide, potassium hydroxide, barium hydroxide, triphenyl phosphite, ammonium polyphosphate, polyphosphate amide, zirconium oxide, magnesium oxide, zinc oxide, titanium oxide, molybdenum oxide, guanidine phosphate, hydrotalcite, smectite, zinc borate, anhydrous zinc borate, zinc metaborate, barium metaborate, antimony oxide, antimony pentoxide, red phosphorus, alumina, boehmite, bentonite, sodium silicate, calcium silicate, calcium sulfate, magnesium carbonate, and carbon black. From the viewpoint of achieving both reinforcing effect and flexibility, calcium carbonate and carbon black are preferred. These fillers may be used alone or in combination of two or more.

[0017] In one embodiment of the present invention, the filler content is preferably 10 to 60 parts by mass, more preferably 20 to 40 parts by mass, per 100 parts by mass of polyvinyl chloride resin. Specifically, for example, it may be 10, 15, 20, 25, 30, 35, 40, 45, 50, or 60 parts by mass, and may be within a range between any two of the values ​​exemplified here. By using 10 parts by mass or more of the filler, the abrasion resistance of the substrate is improved and good protective performance can be obtained. By using 60 parts by mass or less of the filler, the flexibility of the substrate is improved, and for example, the tracking ability when wrapped around an electric wire or the like is improved, thereby reducing the occurrence of lifting in the bundling protection tape. Note that when a filler is used in combination, the filler content refers to the total amount of the filler used in combination.

[0018] <Slidability-imparting agent> The sliding property-imparting agent in one embodiment of the present invention is not particularly limited as long as it can impart sliding property to the substrate. Examples include polyorganosiloxane, silica, talc, glass fiber, fluororesin, boron nitride, molybdenum disulfide, and ultra-high molecular weight polyethylene resin. From the viewpoint of achieving both sliding property and flexibility, polyorganosiloxane is preferred. Examples of polyorganosiloxane include linear polyorganosiloxane and crosslinked polyorganosiloxane. These sliding property-imparting agents may be used alone or in combination of two or more. Note that the sliding property-imparting agent is preferably uniformly dispersed in the resin composition from the viewpoint of sliding property and preventing plate-out (a phenomenon in which part of the resin composition separates and adheres to the molding machine).

[0019] <Polyorganosiloxane> <Polyorganosiloxane Structure> The polyorganosiloxane in one embodiment of the present invention is not particularly limited as long as it has a polyorganosiloxane structure. The polyorganosiloxane structure is a polymer having a repeating unit of -Si-O- in the main chain and an organic group in the side chain. Examples of the repeating unit include those represented by the following structural formula:

[0020]

[0021] In the formula, R １ and R ２are each independently an organic group selected from an alkyl group, a polyoxyalkylene group, a fluorine-containing group, and a chlorophenyl group. From the viewpoint of sliding properties, an alkyl group is preferred. Examples of the alkyl group from the viewpoint of sliding properties include a methyl group and an ethyl group. These polyorganosiloxane structures may be used alone or in combination of two or more types.

[0022] <Linear Polyorganosiloxane> The polyorganosiloxane in one embodiment of the present invention may be a linear polyorganosiloxane in which the siloxane bonds of the main chain are linearly bonded. Examples of linear polyorganosiloxanes include linear polydimethylsiloxane, linear polymethylphenylsiloxane, and linear polymethylhydrogensiloxane. From the viewpoint of sliding properties, linear polydimethylsiloxane is preferred. These other linear polyorganosiloxanes may be used alone or in combination of two or more.

[0023] <Kinematic Viscosity of Linear Polyorganosiloxane> In one embodiment of the present invention, the kinematic viscosity of the linear polyorganosiloxane at 25°C is 2,000,000 mm ２ / s or more, and 5 million mm ２ The upper limit of the kinematic viscosity is not particularly limited, but from the viewpoint of ease of handling and dispersibility, it is preferably 50,000,000 mm ２ Specifically, for example, 2 million, 5 million, 15 million, 20 million, 25 million, 30 million, 40 million, or 50 million mm ２ / s, and may be within a range between any two of the values ​​exemplified here. ２ By setting the tensile strength to 1 / s or more, the abrasion resistance of the substrate is improved, good protective performance is obtained, and the storage stability of the tape is also improved.

[0024] In one embodiment of the present invention, the kinematic viscosity of the linear polyorganosiloxane at 25 ° C. is a value measured, for example, by a kinematic viscometer. The kinematic viscosity of the linear polyorganosiloxane can be controlled by adjusting the molecular weight. When a linear polyorganosiloxane is used in combination, the kinematic viscosity of the linear polyorganosiloxane at 25 ° C. means the average kinematic viscosity when the linear polyorganosiloxane used in combination is combined.

[0025] <Crosslinked polyorganosiloxane> In one embodiment of the present invention, the polyorganosiloxane may have a structure in which linear polyorganosiloxane is crosslinked, or a structure in which siloxane bonds are crosslinked in a three-dimensional network structure, from the viewpoint of storage stability. From the viewpoint of sliding properties, polyorganosiloxanes in which linear polyorganosiloxanes are crosslinked are preferred. These crosslinked polyorganosiloxanes may be used alone or in combination of two or more.

[0026] The sliding property imparting agent in one embodiment of the present invention may be silica, talc, glass fiber, fluororesin, or the like.

[0027] <Content of Sliding Property-Imparting Agent> In one embodiment of the present invention, the content of the sliding property-imparting agent is 1 to 10 parts by mass, more preferably 3 to 7 parts by mass, per 100 parts by mass of polyvinyl chloride resin. Specifically, for example, it is 1, 2, 4, 6, 8, or 10 parts by mass, and may be within a range between any two of the values ​​exemplified here. By setting the content of the sliding property-imparting agent to 1 part by mass or more, the abrasion resistance of the substrate is improved and good protective performance is obtained. By setting the content of the sliding property-imparting agent to 10 parts by mass or less, the storage stability of the tape is improved. Note that when sliding property-imparting agents are used in combination, the content of the sliding property-imparting agent refers to the total amount of the sliding property-imparting agents used in combination.

[0028] <Other Additives> Furthermore, the resin composition of the present embodiment may contain other additives such as colorants, stabilizers, antioxidants, UV absorbers, and lubricants, as needed, within the scope of not impairing the effects of the present invention.

[0029] <Substrate Thickness> The substrate thickness of the bundling protection tape in this embodiment varies depending on the intended use and application, but is preferably 180 to 330 μm, more preferably 180 to 250 μm. Specifically, for example, it is 180, 185, 190, 195, 200, 205, 210, 220, 250, 280, 300, or 330 μm, and may be within a range between any two of the values ​​exemplified here. By making the substrate thickness 180 μm or more, the abrasion resistance of the substrate is improved and good protective performance is obtained. By making the substrate thickness 330 μm or less, the flexibility of the substrate is improved, and for example, the tracking ability when wrapped around an electric wire or the like is improved, thereby reducing the occurrence of lifting in the bundling protection tape.

[0030] <Structure of Substrate> The structure of the substrate of the binding protection tape in this embodiment is preferably a single-layer structure from the viewpoint of simplifying the manufacturing process and manufacturing equipment.

[0031] <Method for Manufacturing Substrate> The resin composition for manufacturing the substrate according to this embodiment can be obtained by melt-kneading polyvinyl chloride resin, plasticizer, filler, and sliding property-imparting agent, as well as, if necessary, heat stabilizers, light absorbers, pigments, and other additives. The melt-kneading method is not particularly limited, but various mixers and kneaders equipped with heating devices such as twin-screw extruders, continuous and batch kneaders, rolls, and Banbury mixers can be used. The resin composition is mixed to uniformly disperse, and the resulting mixture is molded into a substrate using conventional molding methods such as the calendar method, T-die method, and inflation method. A calendar molding machine is preferred from the perspectives of productivity, color change, and shape uniformity. Known roll arrangement methods, such as L-type, reverse L-type, and Z-type, can be used for calendar molding. The roll temperature is typically set to 150 to 200°C, preferably 155 to 190°C.

[0032] <Dynamic Friction Coefficient of Substrate Surface> In one embodiment of the present invention, when the substrate is fixed to a measurement stage with Nitto Denko Corporation's No. 5000NS double-sided tape, the kinetic friction coefficient of the substrate surface measured using an R contactor based on ASTM D1894 under conditions of a load of 200 g and a test speed of 2.5 mm / sec is preferably 0.06 to 0.26, more preferably 0.10 to 0.25. Specifically, for example, the kinetic friction coefficient is 0.06, 0.08, 0.10, 0.12, 0.14, 0.16, 0.18, 0.20, 0.22, 0.24, or 0.26, and may be within a range between any two of the values ​​exemplified here. By making the kinetic friction coefficient of the substrate surface 0.06 or more, the flexibility of the bundling protection tape is improved, and the improved followability when wrapped around, for example, an electric wire can be improved, thereby reducing the occurrence of lifting of the bundling protection tape. By making the dynamic friction coefficient of the substrate surface 0.26 or less, the abrasion resistance of the bundling protection tape is improved, and good protection performance can be obtained.

[0033] The dynamic friction coefficient of the substrate surface can be controlled by adjusting the type and content of the sliding property imparting agent contained in the resin composition used to produce the substrate.

[0034] <Measurement of Dynamic Friction Coefficient of Substrate Surface> The dynamic friction coefficient of the substrate surface of the substrate according to this embodiment can be measured, for example, using an automatic friction and wear analyzer TS-501 manufactured by Kyowa Interface Science Co., Ltd., according to the following procedure. A substrate sample is cut to a width of 50 mm and a length of 100 mm, and fixed to a sample stage using double-sided tape (No. 5000NS manufactured by Nitto Denko Corporation). An R contact based on ASTM D1894 is placed on the back of the bonded substrate sample, and the dynamic friction coefficient is measured under conditions of a load of 200 g and a test speed of 2.5 mm / sec (room temperature 23°C, humidity 50% RH).

[0035] <Tensile Modulus of Elasticity Equivalent to Substrate Thickness> For the substrate according to this embodiment, the tensile modulus of elasticity equivalent to the thickness of the substrate is preferably 5 to 9 N / mm, more preferably 6 to 9 N / mm. Specifically, it may be, for example, 5, 6, 7, 8, or 9 N / mm, and may be within a range between any two of the values ​​exemplified here. By setting the tensile modulus of elasticity equivalent to the thickness of the substrate to 5 N / mm or more, a balance with the protective performance of the substrate can be achieved. By setting the tensile modulus of elasticity equivalent to the thickness of the substrate to 9 N / mm or less, the flexibility of the substrate is improved, and, for example, the followability when wrapped around an electric wire or the like is improved, thereby reducing the occurrence of lifting of the bundling protection tape. The tensile modulus of elasticity equivalent to the thickness of the substrate can be controlled by adjusting the type and content of the sliding property-imparting agent contained in the resin composition used to produce the substrate.

[0036] <Measurement of the tensile modulus of elasticity converted into thickness of the substrate> The tensile modulus of elasticity converted into thickness of the substrate according to this embodiment can be obtained from the value of the tensile modulus of elasticity by the following procedure. A binding tape test piece having a width of 19 mm and a length of 200 mm is clamped and fixed in the chucks of a tensile tester so that the distance between the chucks is 100 mm. The test piece is pulled at a speed of 300 mm / min under an environment of room temperature of 23°C and relative humidity of 50% RH, and the tensile stress and strain are measured. The ratio of the tensile stress to the strain between 0.01% and 0.05% is calculated by linear regression and is taken as the tensile modulus of elasticity. The product of the tensile modulus thus obtained and the total thickness of the tape (unit: mm) is taken as the tensile modulus of elasticity converted into thickness.

[0037] <Adhesive Layer> The adhesive of the adhesive layer of the bundling protection tape according to this embodiment is preferably a rubber-based adhesive, and may be either a solvent-based or emulsion-based adhesive. The rubber-based adhesive preferably contains one or more rubbers selected from natural rubber or synthetic rubber and a tackifier resin, and more preferably a mixture of natural rubber, synthetic rubber, and a tackifier resin. The mixing ratio of the tackifier resin is preferably 50 to 150 parts by mass per 100 parts by mass of the rubber component of the mixture containing natural rubber and synthetic rubber.

[0038] Examples of the natural rubber and synthetic rubber include natural rubber-methyl methacrylate copolymer latex, styrene-butadiene copolymer, acrylonitrile-butadiene copolymer, methyl methacrylate-butadiene copolymer, etc. These may be used alone or in combination of two or more.

[0039] The tackifying resin can be selected in consideration of the softening point, compatibility with each component, etc. Examples include emulsions of terpene resin, rosin resin, hydrogenated rosin resin, coumarone-indene resin, styrene-based resin, aliphatic petroleum resin, alicyclic petroleum resin, terpene-phenol resin, xylene-based resin, and other aliphatic hydrocarbon resins or aromatic hydrocarbon resins. These may be used alone or in combination of two or more.

[0040] The rubber-based adhesive can be freely selected from solvent-based and emulsion-based adhesives, but emulsion-based adhesives that generate less VOC are preferred.

[0041] <Primer Layer>

[0042] Furthermore, the bundling protection tape according to this embodiment may, if necessary, have a primer layer between the substrate and the pressure-sensitive adhesive layer for the purpose of improving the adhesion between the substrate and the pressure-sensitive adhesive layer, as long as the effect of the present invention is not impaired. In this case, as described below, the thickness of the primer layer is usually 0.1 to 1 μm, more preferably 0.3 to 0.5 μm, and it is preferable that the thickness of the primer layer is smaller than the thickness of the substrate.

[0043] The primer for forming the primer layer is preferably one comprising 25 to 300 parts by mass of an acrylonitrile-butadiene copolymer with 100 parts by mass of a graft polymer obtained by graft polymerizing methyl methacrylate onto natural rubber.

[0044] The graft polymer used in the primer, in which methyl methacrylate is graft polymerized onto natural rubber, is preferably one in which 30 to 50% by mass of methyl methacrylate is graft polymerized onto 70 to 50% by mass of natural rubber. If the proportion of methyl methacrylate in the graft polymer is less than 30% by mass, the adhesion between the methyl methacrylate and the film substrate may be poor, resulting in delamination of the bundling protection tape. If the proportion of methyl methacrylate is more than 50% by mass, the primer itself may harden and be unable to follow the deformation of the film substrate, resulting in delamination of the bundling protection tape.

[0045] The acrylonitrile-butadiene copolymers used in the primer include medium nitrile types (25 to 30% by mass of acrylonitrile, 75 to 70% by mass of butadiene), medium-high nitrile types (31 to 35% by mass of acrylonitrile, 69 to 65% by mass of butadiene), high nitrile types (36 to 43% by mass of acrylonitrile, 64 to 57% by mass of butadiene), etc. These may be used alone or in combination of two or more types.

[0046] <Method for Manufacturing a Binder Protective Tape> The binder protective tape according to this embodiment can be produced by, for example, applying a primer to one side of a substrate, thoroughly removing the solvent in a drying oven, applying a pressure-sensitive adhesive, thoroughly removing the solvent in a drying oven in the same manner as for the primer, and then applying a pressure-sensitive adhesive to the substrate. The primer can be applied by a gravure method, a spray method, a kiss roll method, a bar method, a knife method, or the like. The pressure-sensitive adhesive can be applied by a comma method, a lip die method, a gravure method, a roll method, a slot die method, or the like. The thickness of the primer layer is typically 0.1 to 1 μm, more preferably 0.3 to 0.5 μm. The thickness of the pressure-sensitive adhesive layer varies depending on the intended use and application, but is typically 5 to 50 μm, more preferably 10 to 30 μm.

[0047] <Dynamic Friction Coefficient of Backside of Binder / Protein Tape Substrate> In another embodiment of the present invention, when the binder / protection tape is fixed to a measurement stage via the adhesive layer, the binder / protection tape substrate has a kinetic friction coefficient of 0.13 to 0.60, more preferably 0.23 to 0.58, as measured using an R contactor according to ASTM D1894 under conditions of a load of 200 g and a test speed of 2.5 mm / sec. Specifically, for example, 0.13, 0.15, 0.20, 0.25, 0.30, 0.35, 0.40, 0.45, 0.50, 0.55, or 0.60 is preferred, and may be within a range between any two of the values ​​exemplified here. By setting the binder / protection tape substrate backside kinetic friction coefficient to 0.13 or more, the flexibility of the binder / protection tape is improved, and the improved followability when wrapped around an electric wire or the like can reduce the occurrence of lifting of the binder / protection tape. By setting the dynamic friction coefficient of the back surface of the bundling protection tape substrate to 0.60 or less, the abrasion resistance of the bundling protection tape is improved and good protective performance can be obtained. Note that the back surface of the bundling protection tape substrate refers to the surface of the bundling protection tape substrate opposite the surface on which the pressure-sensitive adhesive layer is formed.

[0048] For example, when the thickness of the substrate is the same, the kinetic friction coefficient of the back surface of the substrate of the bundling protection tape tends to increase as the kinetic friction coefficient of the substrate surface increases. Therefore, the kinetic friction coefficient of the back surface of the substrate of the bundling protection tape can be controlled by adjusting the kinetic friction coefficient of the substrate surface within the above-mentioned range. When a bundling protection tape is formed by providing a pressure-sensitive adhesive layer on the substrate, the kinetic friction coefficient of the back surface of the substrate of the bundling protection tape tends to be higher than the kinetic friction coefficient of the substrate surface. However, due to the above-mentioned relationship, the kinetic friction coefficient of the back surface of the substrate of the bundling protection tape can be controlled within a desired range by adjusting the kinetic friction coefficient of the substrate surface within a predetermined range. Furthermore, as the thickness of the substrate increases, the effect of providing a pressure-sensitive adhesive layer on the change in the kinetic friction coefficient of the back surface of the substrate of the bundling protection tape tends to decrease. Therefore, even when the thickness of the substrate is large, the kinetic friction coefficient of the back surface of the substrate of the bundling protection tape can be controlled by adjusting the kinetic friction coefficient of the substrate surface within the above-mentioned range.

[0049] <Measurement of the Dynamic Friction Coefficient of the Backside of the Binder / Protection Tape Substrate> The dynamic friction coefficient of the backside of the binder / protection tape substrate in the binder / protection tape according to this embodiment can be measured, for example, using an automatic friction and wear analyzer TS-501 manufactured by Kyowa Interface Science Co., Ltd., according to the following procedure. A binder / protection tape sample is cut to a width of 50 mm and a length of 100 mm, and fixed to a sample stage via the adhesive layer of the binder / protection tape sample. An R contact based on ASTM D1894 is placed on the backside of the bonded binder / protection tape sample, and the dynamic friction coefficient is measured under conditions of a load of 200 g and a test speed of 2.5 mm / sec (room temperature 23°C, humidity 50% RH).

[0050] <Uses of the bundling protection tape> The bundling protection tape according to this embodiment is suitably used as a bundling protection tape for bundling high voltage cables and wire harnesses in electric vehicles and hybrid vehicles, for example.

[0051] The present invention will be described in more detail below with reference to examples, but these examples are merely illustrative and are not intended to limit the scope of the present invention.

[0052] <Preparation of substrate> <Materials used> (1) Polyvinyl chloride resin: homopolymer of vinyl chloride, average degree of polymerization 1000: product name "TH-1000", manufactured by Taiyo Vinyl Corporation (2) Sliding property imparting agent: linear polydimethylsiloxane (kinematic viscosity at 25°C: 25,000,000 mm ２ / s): Product name "GENIOPLAST GUM", Wacker Asahi Kasei Silicone Co., Ltd., linear polydimethylsiloxane (kinematic viscosity at 25 ° C. 2,000,000 mm ２ / s): Product name "DMF100-200M", Tomita Matex Co., Ltd., linear polydimethylsiloxane (kinematic viscosity at 25 ° C. 1,000,000 mm ２ / s): Product name “AK1000000”, manufactured by Asahi Kasei Wacker Silicone Co., Ltd. Cross-linked polydimethylsiloxane (polyorganosiloxane cross-linked with linear polyorganosiloxane): Product name “KMP-597”, manufactured by Shin-Etsu Chemical Co., Ltd. Silica: Product name “HDK H-18”, manufactured by Asahi Kasei Wacker Silicone Co., Ltd. Talc: Product name “High Micron HE5”, manufactured by Takehara Chemical Industry Co., Ltd. Glass fiber: Product name “Milled Fiber EPH80M-10A”, manufactured by Nippon Electric Glass Co., Ltd. Fluorine resin: Product name “Dyneon PTFE Micropowder TF9207Z”, manufactured by 3M (3) Plasticizer Phthalate ester plasticizer, diisononyl phthalate: Product name “DINP”, manufactured by J-Plus Co., Ltd. (4) Filler Calcium carbonate: product name "Calcises (registered trademark) P", manufactured by Konoshima Chemical Co., Ltd.

[0053] Polyvinyl chloride resin, a sliding property imparting agent, a plasticizer, and a filler were melt-kneaded in a Banbury mixer in the formulations shown in Tables 1 and 2 so as to be uniformly dispersed, and then substrates of a predetermined thickness were produced in a calendar molding machine at a roll temperature of 165°C.

[0054] <Preparation of bundling protection tape> <Materials used> (1) Substrate: Substrate prepared by the process described above (2) Primer layer: Mixture emulsion of graft polymer latex obtained by graft polymerizing methyl methacrylate onto natural rubber and acrylonitrile butadiene copolymer emulsion: Product name KT4612A, manufactured by E-Tech Co., Ltd. (3) Adhesive layer: Mixture of 60 parts by mass (solid content) of natural rubber latex (manufactured by Resitex Co., Ltd., product name: HA LATEX), 40 parts by mass (solid content) of graft polymer latex obtained by graft polymerizing methyl methacrylate onto natural rubber (manufactured by Resitex Co., Ltd., product name: MG-40S), and 135 parts by mass (solid content) of petroleum resin emulsion tackifier (manufactured by Arakawa Chemical Industries, Ltd., product name: AP-1100-NT).

[0055] A primer was applied to one side of the substrate by gravure coating, and the solvent was thoroughly removed in a drying oven. Then, a pressure-sensitive adhesive was applied by comma coating, and the solvent was thoroughly removed in a drying oven in the same manner as for the primer, to produce a bundling protection tape. The dried thickness of the primer layer was 0.3 μm, and the dried thickness of the pressure-sensitive adhesive layer was 20 μm.

[0056] <Physical Properties of Substrate and Bundling Protection Tape> Measurement and evaluation of the physical properties of the substrate and the bundling protection tape were carried out under the measurement conditions shown below. The results are shown in Tables 1 and 2. In the tables, PVC stands for polyvinyl chloride resin, DINP stands for diisononyl phthalate, PDMS stands for polydimethylsiloxane, and PTFE stands for polytetrafluoroethylene.

[0057] <Dynamic friction coefficient of substrate surface> Measurement was performed using the following procedure using an automatic friction and wear analyzer TS-501 manufactured by Kyowa Interface Science Co., Ltd. A substrate sample was cut to a width of 50 mm and a length of 100 mm and fixed to a sample stage using double-sided tape (No. 5000NS manufactured by Nitto Denko Corporation). An R contact based on ASTM D1894 was placed on the back of the bonded substrate sample, and the dynamic friction coefficient was measured under conditions of a load of 200 g and a test speed of 2.5 mm / sec (room temperature 23°C, humidity 50% RH).

[0058] <Dynamic Friction Coefficient of Binder / Protein Tape> Measurement was performed using the following procedure using an automatic friction and wear analyzer TS-501 manufactured by Kyowa Interface Science Co., Ltd. A binder / protection tape sample was cut to a width of 50 mm and a length of 100 mm, and attached and fixed to a sample stage via an adhesive layer. An R contact based on ASTM D1894 was placed on the back of the attached binder / protection tape sample, and the dynamic friction coefficient was measured under conditions of a load of 200 g and a test speed of 2.5 mm / sec (room temperature 23°C, humidity 50% RH).

[0059] <Tensile modulus / Tensile modulus converted into thickness> A binding tape test piece measuring 19 mm in width and 200 mm in length was clamped and fixed in the chucks of a tensile tester so that the distance between the chucks was 100 mm. The test piece was pulled at a speed of 300 mm / min under an environment of room temperature of 23°C and relative humidity of 50% RH, and the tensile stress and strain were measured. The ratio of tensile stress to strain between strains of 0.01 and 0.05% was calculated by linear regression and used as the tensile modulus. The product of the tensile modulus and the total tape thickness (unit: mm) was used as the tensile modulus converted into thickness.

[0060] <Hardness> The durometer A hardness of a substrate sample stacked to a thickness of 6 mm or more was measured using an Asker rubber hardness tester Type A (type A indenter based on ASTM D2240) manufactured by Kobunshi Keiki Co., Ltd. (room temperature 23°C, humidity 50% RH).

[0061] <Protection Performance> Abrasion resistance was evaluated according to the following procedure. The evaluation was carried out in accordance with ISO 6722-1 (2001). A substrate sample was wrapped around a 10 mm diameter cylinder twice and secured with tape or the like. The sample surface was then abraded at a speed of 1500 mm / min with sandpaper made of fused alumina as the hard material and 150 μm grain size. The abrasion distance (mm) until a hole was created in the sample was measured (room temperature 23°C, humidity 50% RH). The abrasion distance (mm) until a hole was created in the sample was evaluated according to the following criteria. A substrate with an excellent abrasion distance evaluation has high abrasion resistance, and it can be expected that a bundling protection tape manufactured using this substrate will achieve excellent protection performance. ◎: Abrasion distance is 1000 mm or more. ○: Abrasion distance is 800 mm or more but less than 1000 mm. ×: Abrasion distance is less than 800 mm.

[0062] <Flexibility> Evaluation was made according to the following procedure based on the presence or absence of lifting when bundling electric wires. A bundling protection tape sample was spirally wrapped around electric wire bundles of 15 mm and 10 mm diameters (half-wrapped) to bind them. When this bundled electric wire was wrapped around a mandrel of 50 mm diameter once, the presence or absence of lifting (gaps due to peeling) between the bundling protection tape sample and the electric wire bundle was confirmed. The lifting between the bundling protection tape sample and the electric wire bundle was evaluated according to the following criteria. ⊚: No lifting occurred for both 15 mm and 10 mm electric wire diameters. ○: No lifting occurred for 15 mm electric wire diameter, but lifting occurred for 10 mm electric wire diameter. ×: Lifting occurred for both 15 mm and 10 mm electric wire diameters.

[0063] <Tape storage stability> Evaluation was performed according to the following procedure and evaluation criteria. EDX analysis (energy dispersive X-ray analysis) was performed on the substrate sample before heating, and the amount of Si in the substrate sample was quantified. The substrate sample was heated in an oven at 100°C for 168 hours. After removing the silicone precipitated on the surface of the substrate sample after heating, EDX analysis was performed on the substrate sample, and the amount of Si in the substrate sample after heating was quantified. The Si reduction rate before and after heating was calculated and evaluated according to the following criteria. A substrate with an excellent evaluation of storage stability has high storage stability, and therefore it can be expected that a bundling protection tape manufactured using this substrate will achieve excellent storage stability. ◎: Si reduction rate is less than 5% by mass ○: Si reduction rate is 5% or more but less than 20% by mass ×: Si reduction rate is 20% or more by mass

[0064]

[0065]

[0066] From the results in Tables 1 and 2, it can be seen that the bundling protection tapes using the substrates according to the Examples and the bundling protection tapes according to the Examples have an excellent balance between flexibility and protective performance, and furthermore, since the storage stability of the substrates according to the Examples is excellent, it is expected that the bundling protection tapes using these substrates will have excellent storage stability. On the other hand, it can be seen that the bundling protection tapes using the substrates according to the Comparative Examples are inferior in one or more respects of the balance between flexibility and protective performance and the storage stability of the bundling protection tapes.

[0067] The bundling and protective tape of the present invention has an excellent balance between flexibility and protective performance, and further has excellent storage stability. The bundling and protective tape of the present invention can be suitably used for bundling and protecting high-voltage cables in electric vehicles and hybrid vehicles, automotive wire harnesses, etc., and has industrial applicability.

Claims

1. A bundling protection tape having a substrate and a pressure-sensitive adhesive layer formed on one side of the substrate, the substrate is made of a resin composition containing a polyvinyl chloride resin, a plasticizer, a filler, and a sliding property imparting agent; In the resin composition, the content of the sliding property imparting agent is 1 to 10 parts by mass relative to 100 parts by mass of the polyvinyl chloride resin, The sliding property imparting agent is a linear polydimethylsiloxane. Binding protection tape.

2. The substrate is fixed to a sample stage using a double-sided tape No. 5000NS manufactured by Nitto Denko Corporation, and the dynamic friction coefficient of the substrate surface is 0.06 to 0.26, as measured using an R contact based on ASTM D1894 under conditions of a load of 200 g and a test speed of 2.5 mm / sec. The bundling protection tape according to claim 1 .

3. The bundling protection tape is fixed to a sample stage via the pressure-sensitive adhesive layer, and the dynamic friction coefficient of the back surface of the substrate of the bundling protection tape is measured using an R contactor based on ASTM D1894 under conditions of a load of 200 g and a test speed of 2.5 mm / sec., and is 0.13 to 0.

60. The bundling protection tape according to claim 1 .

4. The linear polydimethylsiloxane has a kinetic viscosity of 2,000,000 mm at 25°C. ２ The bundling protection tape according to any one of claims 1 to 3, wherein the bundling protection tape has a viscosity of 1 / s or more.

5. The bundling protection tape according to any one of claims 1 to 3, wherein the content of the plasticizer in the resin composition is 38 to 60 parts by mass per 100 parts by mass of the polyvinyl chloride resin.

6. The bundling protection tape according to any one of claims 1 to 3, wherein the content of the filler in the resin composition is 10 to 60 parts by mass per 100 parts by mass of the polyvinyl chloride resin.

7. The bundling protection tape according to any one of claims 1 to 3, wherein the thickness of the substrate is 180 to 330 µm.

8. The bundling protection tape according to any one of claims 1 to 3, wherein the substrate has a tensile modulus of elasticity converted into a thickness of 5 to 9 N / mm.