Wiring board, electronic component mounting package using wiring board, and electronic module

Abstract

This wiring board comprises: a first insulating layer; a second insulating layer; a first ground conductor; and a first signal conductor. The first insulating layer has a first upper surface and a first lower surface. The second insulating layer is located on the first insulating layer, and has a second upper surface and a second lower surface. The first ground conductor is located on the first lower surface, and has a first opening and a second opening. The first signal conductor has a first line located on the first upper surface, and a second line located on the second lower surface. The first line has a first end portion and a first line portion. The second line has a second end portion electrically connected to the first end portion, and a second line portion. In planar view, the first end portion and the second end portion are located in the first opening, and the second line portion is located so that at least a part thereof overlaps with the second opening. In planar view, the area of the first opening is larger than the area of the second opening.

Description

Wiring board, package for mounting electronic components using wiring board, and electronic module

[0001] The present disclosure relates to a wiring board, an electronic component mounting package using the wiring board, and an electronic module.

[0002] In recent years, electronic modules used in wireless communication devices and optical communication devices have been required to transmit higher signal frequencies in order to transmit larger volumes of information at higher speeds. Therefore, wiring boards that transmit signals are required to transmit high-frequency signals with low loss. Known signal transmission structures include signal wiring that transmits the signals, a shielding layer made of a conductive material, and an insulating coating layer sandwiched between the signal wiring and the shielding layer. A technique for adjusting the impedance of a circuit board with such a structure by providing an opening in the shielding layer is known (see Patent Document 1).

[0003] International Publication No. 2010 / 103722

[0004] In one embodiment of the present disclosure, (1) a wiring substrate includes a first insulating layer, a second insulating layer, a first ground conductor, and a first signal conductor. The first insulating layer has a first upper surface and a first lower surface opposite the first upper surface. The second insulating layer is located on the first insulating layer and has a second upper surface and a second lower surface opposite the second upper surface. The first ground conductor has a first opening and a second opening and is located on the first lower surface. The first signal conductor has a first line located on the first upper surface and a second line located on the second lower surface. The first line has a first end and a first line portion extending from the first end. The second line has a second end electrically connected to the first end and a second line portion extending from the second end. In a plan view, the first end and the second end are located within the first opening. In a plan view, at least a portion of the second line portion is located overlapping with the second opening. In addition, in a plan view, the area of ​​the first opening is larger than the area of ​​the second opening.

[0005] (2) In the wiring board of (1) above, when the direction in which the first line portion extends is defined as a first direction and the direction intersecting the first direction is defined as a second direction, the dimension of the first end portion in the second direction is smaller than the dimension of the second end portion in the second direction.

[0006] (3) In the wiring board of (1) or (2), the first ground conductor has a plurality of second openings, which are spaced apart from one another and positioned along the second line portion in a plan view.

[0007] (4) In the wiring boards of (1) to (3) above, in a plan view, the dimension of the second opening in a direction perpendicular to the direction along the second line portion is larger than the dimension of the second line portion in a direction perpendicular to the direction along the second line portion.

[0008] (5) In the wiring boards of (1) to (4) above, the distance between the multiple second openings in a direction along the second line portion in a plan view is not constant in a direction perpendicular to the direction along the second line portion.

[0009] (6) The wiring board according to any one of (1) to (5) above further includes a pair of second ground conductors located between the first insulating layer and the second insulating layer and electrically connected to the first ground conductor. In plan view, the first signal conductor is located between the pair of second ground conductors.

[0010] (7) In the wiring boards of (1) to (6) above, the first insulating layer has a first side surface connecting to the first upper surface and the first lower surface. The second insulating layer has a second side surface connecting to the second upper surface and the second lower surface and located inward from the first side surface in a plan view. The first upper surface has a first region located between the first side surface and the second side surface in a plan view. The first line is located so as to extend to the first region in a plan view and has a first connection portion to which an external connection member is connected.

[0011] (8) In the wiring board of (7) above, the first ground conductor has one or more third openings positioned to overlap the first connection portion in a plan view.

[0012] (9) In the wiring board of (8), the first insulating layer further includes a recess having an opening in the first region, the recess being positioned so as to overlap at least a portion of the third opening in plan view.

[0013] (10) The wiring board according to any one of (1) to (9) above further includes a third ground conductor electrically connected to the first ground conductor and located on the second upper surface. The third ground conductor has one or more fourth openings. In a plan view, at least a portion of the second line portion is positioned overlapping with the fourth opening. In a plan view, the fourth opening has a portion positioned overlapping with at least a portion of the second opening.

[0014] (11) An electronic component mounting package according to an embodiment of the present disclosure includes the wiring board of any one of (1) to (10) above, a substrate, and a frame. The frame is bonded to the top surface of the substrate. The wiring board is fixed to the frame.

[0015] (12) An electronic module according to an embodiment of the present disclosure includes the electronic component mounting package of (11), an electronic component, and a lid. The electronic component is located on the top surface of the substrate and is electrically connected to the wiring board. The lid is located on the frame and covers the interior of the electronic component mounting package.

[0016] 5 is a perspective view of a wiring board, an electronic component mounting package, and an electronic module according to an embodiment of the present disclosure; FIG. 1 is an enlarged view of a main part A shown in FIG. 1 from a different angle; FIG. 2 is an exploded perspective view of a wiring board according to an embodiment of the present disclosure; FIG. 3 is a plan view of a wiring board according to an embodiment of the present disclosure, with a third ground conductor omitted; FIG. 4 is an enlarged view of a main part B shown in FIG. 5; FIG. 6 is a view showing a third ground conductor superimposed on the enlarged view of FIG. 5; FIG. 7 is a plan view of a first ground conductor; FIG. 8 is a plan view of a first top surface; FIG. 9 is a plan view of a second top surface; and FIG. 10 is a plan view of a third ground conductor.

[0017] <Configuration of Wiring Board> An exemplary embodiment of the present disclosure will be described below with reference to the drawings. Note that, although either direction of the wiring board may be considered to be up or down, for convenience, a Cartesian coordinate system xyz is defined, with the positive side of the z direction being considered to be up. In the following, the first direction refers to, for example, the y direction in the drawings. The second direction intersecting the first direction refers to, for example, the x direction in the drawings. Furthermore, the inward direction refers to, for example, the positive direction of the y axis in the drawings. Furthermore, in the present disclosure, the concept of planar view includes planar perspective view.

[0018] A wiring board 101 according to an embodiment of the present disclosure will be described with reference to Figures 2 to 10. Figure 2 is an enlarged view of a main portion A of the wiring board 101, electronic component mounting package 100, and electronic module 10 shown in Figure 1, viewed from the positive direction of the z-axis. The wiring board 101 includes a first insulating layer 1, a second insulating layer 2, a first ground conductor G1, and a first signal conductor S1.

[0019] 3 and 8, the first insulating layer 1 has a first upper surface 1a and a first lower surface 1b opposite to the first upper surface 1a. Examples of materials that can be used for the first insulating layer 1 include ceramic materials such as aluminum oxide sintered body, mullite sintered body, silicon carbide sintered body, aluminum nitride sintered body, and silicon nitride sintered body, and dielectric materials such as glass ceramic materials.

[0020] The first insulating layer 1 may be a single layer or may be a laminate of multiple insulating layers. The first insulating layer 1 has, for example, a rectangular shape in plan view, with dimensions of 4 mm × 4 mm to 50 mm × 50 mm and a thickness of 0.5 mm to 10 mm.

[0021] As shown in Figure 3, the second insulating layer 2 is located on the first insulating layer 1 and has a second upper surface 2a and a second lower surface 2b opposite the second upper surface 2a. The material of the second insulating layer 2 may be the same as or different from the material of the first insulating layer 1, and for example, the same material as the first insulating layer 1 described above may be used. The second insulating layer 2 may be a single layer or may be configured with multiple insulating layers stacked together. The second insulating layer 2 has a rectangular shape in a plan view, for example, with dimensions of 4 mm x 4 mm to 50 mm x 50 mm and a thickness of 0.1 mm to 10 mm.

[0022] As shown in FIG. 3 , the wiring substrate 101 may further include a third insulating layer 3 located below the first insulating layer 1 (on the side of the first lower surface 1b). The material of the third insulating layer 3 may be the same as or different from the material of the first insulating layer 1. For example, the same material as the first insulating layer 1 described above may be used. The third insulating layer 3 may be a single layer or may be configured with multiple insulating layers stacked together. The third insulating layer 3 may be rectangular in plan view, with dimensions of 4 mm × 4 mm to 50 mm × 50 mm and a thickness of 0.1 mm to 10 mm. Wiring such as signal conductors and ground conductors may be formed on the third insulating layer 3.

[0023] 3, 4, and 7, the first ground conductor G1 has a first opening O1 and a second opening O2 and is located on the first lower surface 1b. Examples of materials for the first ground conductor G1 include metal materials such as gold, silver, copper, nickel, tungsten, molybdenum, and manganese. The first ground conductor G1 may be formed by sintering a metal paste on the first lower surface 1b, or by using a thin-film formation technique such as vapor deposition or sputtering.

[0024] The shape of the first opening O1 may be circular or rectangular in a plan view. The circular shape referred to here is not limited to a perfect circle, but may be an ellipse or a partially missing circle. The shape of the second opening O2 may also be circular or rectangular in a plan view. The shape of the first opening O1 and the shape of the second opening O2 may be the same or different. Furthermore, the first ground conductor G1 may have a fifth opening O5 and a sixth opening O6.

[0025] As shown in FIG. 3 , the first signal conductor S1 has a first line S11 located on the first upper surface 1a and a second line S12 located on the second lower surface 2b. The material of the first signal conductor S1 may be the same as or different from the material of the first ground conductor G1, for example, the same material as the material of the first ground conductor G1 described above. Note that the first line S11 and the second line S12 do not necessarily need to be made of the same material; they may be different. The first signal conductor S1 may also be formed using the same method as the first ground conductor G1 described above. The first signal conductor S1 has a width of 0.05 mm to 2 mm and a length of 1.5 mm to 25 mm, for example. The thickness of the first signal conductor S1 is, for example, 0.01 to 0.1 mm. Note that the width, length, and thickness of the first signal conductor S1 here may refer to the dimensions of the first signal conductor S1 in the x-direction, y-direction, and z-direction, respectively.

[0026] The surface of the first signal conductor S1 may be formed with metal plating such as nickel plating or gold plating. An insulating film made of ceramic (e.g., alumina coating) or resin may be located on a portion of the first signal conductor S1. The insulating film may be provided on the first signal conductor S1 by screen printing. Alternatively, the insulating film may be located only on a portion of the first signal conductor S1. This configuration can reduce the possibility of the first signal conductor S1 shorting out with other wiring.

[0027] As shown in FIG. 4 , the wiring substrate 101 may further include a second signal conductor S2 positioned alongside the first signal conductor S1. With this configuration, the first signal conductor S1 and the second signal conductor S2 can form a pair of signal conductors that transmit differential signals. The material of the second signal conductor S2 may be the same as or different from the material of the first ground conductor G1, and may be, for example, the same material as the material of the first ground conductor G1 described above. Furthermore, the second signal conductor S2 may include a third line S23 positioned on the first upper surface 1 a and a fourth line S24 positioned on the second lower surface 2 b.

[0028] As shown in FIG. 8 , the first line S11 has a first end S11e and a first line portion S11a extending from the first end S11e. As shown in FIG. 9 , the second line S12 has a second end S12e electrically connected to the first end S11e and a second line portion S12a extending from the second end S12e. The first end S11e and the second end S12e may overlap in a planar view. In one embodiment, the first end S11e is in direct contact with the second end S12e and overlaps in a planar view. This eliminates the need to connect the first end S11e and the second end S12e with via conductors, thereby enabling the wiring substrate 101 to be reduced in height and size. The first end S11e and the second end S12e may be connected by via conductors or by castellations. In this case, another insulating layer is located between the first insulating layer 1 and the second insulating layer 2, and the first end S11e and the second end S12e can be electrically connected by providing a via or castellation in that insulating layer.

[0029] 4, 8, and 9, when the wiring board 101 further includes a third line S23 and a fourth line S24, the third line S23 may have a third end S23e and a third line portion S23a extending from the third end S23e. The fourth line S24 may have a fourth end S24e and a fourth line portion S24a extending from the fourth end S24e. In this case, the third end S23e, the third line portion S23a, the fourth end S24e, and the fourth line portion S24a may have the same configurations as the first end S11e, the first line portion S11a, the second end S12e, and the second line portion S12a, respectively.

[0030] 4 and 5, in a plan view, the first end S11e and the second end S12e are located within the first opening O1. In a plan view, at least a portion of the second line portion S12a is located overlapping the second opening O2. In addition, in a plan view, the area of ​​the first opening O1 is larger than the area of ​​the second opening O2. With this configuration, the wiring substrate 101 can adjust the impedance to an appropriate value at the second line portion S12a and at the locations where the first end S11e and the second end S12e are electrically connected. This will be described below.

[0031] Generally, forming a ground conductor below a signal conductor in a microstrip line shifts the resonant frequency to the higher frequency side, improving the transmission characteristics of high-frequency signals. However, impedance tends to decrease as the signal conductor and ground conductor are closer, so impedance matching is required. In one embodiment, the first ground conductor G1 has a second opening O2 at a position overlapping at least a portion of the second line portion S12a in a plan view. This reduces the impedance drop and adjusts the impedance to a desired value while maintaining a desired resonant frequency in the second line portion S12a.

[0032] Furthermore, as in one embodiment, since the characteristic impedance may decrease at the location where the first end S11e and the second end S12e are electrically connected, it is necessary to reduce the impedance mismatch more than at the second line portion S12a. Therefore, by positioning the first end S11e and the second end S12e within the first opening O1 and making the area of ​​the first opening O1 larger than the area of ​​the second opening O2 in a plan view, it is possible to adjust the impedance to a desired value both at the connection location between the first end S11e and the second end S12e and at the second line portion S12a.

[0033] As shown in Figures 4 to 7, when the first ground conductor G1 has a fifth opening O5 and a sixth opening O6, the fifth opening O5 and the sixth opening O6 can be configured similarly to the first opening O1 and the second opening O2, respectively.

[0034] The wiring substrate 101 may include a plurality of signal lines corresponding to the first signal conductor S1 and / or the second signal conductor S2. In this case, the first ground conductor G1 may have a plurality of first openings O1, second openings O2, fifth openings O5, and sixth openings O6 corresponding to the plurality of first signal conductors S1 and / or second signal conductors S2.

[0035] As shown in FIG. 5 , if the direction in which the first line portion S11a extends is defined as a first direction (y direction) and the direction intersecting the y direction is defined as a second direction (x direction), the dimension L1e of the first end portion S11e in the second direction (x direction) may be smaller than the dimension L2e of the second end portion S12e in the second direction (x direction). That is, the width of the first end portion S11e is smaller than the width of the second end portion S12e. This configuration facilitates electrical connection between the first line S11 formed on the first insulating layer 1 and the second line S12 formed on the second insulating layer 2, even if misalignment occurs during lamination. In other words, it is easy to position the first end portion S11e and the second end portion S12e overlapping each other in a plan view.

[0036] As shown in Fig. 5, in one embodiment, the second end S12e has a circular shape. This reduces the possibility of disconnection at the connection point between the first line S11 and the second line S12 due to lamination misalignment. The circular shape referred to here is not limited to a perfect circle, but may also be an ellipse or a circle with a missing portion. The shape of the second end S12e may be rectangular or polygonal.

[0037] In one embodiment, the dimension L1e of the first end S11e in the x direction is equal to the dimension L1 of the first line portion S11a in the x direction, but they may be different. Also, in one embodiment, the dimension L2e of the second end S12e in the x direction is greater than the dimension L2 of the second line portion S12a in the x direction, but the dimension L2e of the second end S12e in the x direction may be equal to the dimension L2 of the second line portion S12a in the x direction.

[0038] As shown in FIGS. 4 and 5 , the first ground conductor G1 may include multiple second openings O2 (O21, O22, O23). In this case, the multiple second openings O2 may be spaced apart and positioned along the second line portion S12a in a plan view. This configuration reduces impedance reduction and facilitates adjusting the impedance to a desired value while maintaining the resonant frequency of the second line portion S12a. In one embodiment, the number of second openings O2 is three (O21, O22, O23). However, the number of second openings O2 may be two, four, or more. The number of second openings O2 can be determined depending on the length of the second line portion S12a and the desired impedance value. As shown in FIG. 5 , the minimum distance LO12 in the y direction between the first opening O1 and the second opening O2 may be greater than distances LO2a and LO2b, which will be described later.

[0039] As shown in Figures 4 and 5, in a plan view, the dimension LO2 of the second opening O2 in a direction perpendicular to the direction along the second line portion S12a may be larger than the dimension L2 of the second line portion S12a in a direction perpendicular to the direction along the second line portion S12a. This configuration reduces impedance reduction and facilitates adjusting the impedance to a desired value while maintaining the resonant frequency of the second line portion S12a. Furthermore, with this configuration, even if misalignment occurs when the second insulating layer 2 on which the second line portion S12a is formed is laminated on the first insulating layer 1, the second opening O2 can be positioned to overlap the second line portion S12a in a plan view. Here, in the portion where the second line portion S12a is positioned so as to extend linearly in the y direction, the direction parallel to the second line portion S12a refers to the y direction. Furthermore, when the second line portion S12a has a curved portion S12c that is curved as shown in Figure 4, the direction along the second line portion S12a refers to the tangent direction of the second line portion S12a at the curved portion S12c.

[0040] As shown in FIG. 5 , the distance between the multiple second openings O2 in the direction along the second line portion S12a in a plan view may not be constant in a direction perpendicular to the direction along the second line portion S12a. For example, a description will be given using one second opening O21 and another second opening O22. As shown in FIG. 5 , the distance between the second opening O21 and the second opening O22 at an arbitrary point along the second line portion S12a is defined as distance LO2a, and the distance between the second opening O21 and the second opening O22 at another arbitrary point along the second line portion S12a is defined as distance LO2b. In this case, distance LO2a and distance LO2b are different. This configuration reduces the possibility of interference between the multiple second openings O2 and increases the area of ​​the second openings O2. This reduces the possibility of mutual interference between the multiple second openings O2, while maintaining a desired resonant frequency at the second line portion S12a, thereby making it easier to adjust the impedance to a desired value.

[0041] As shown in FIG. 5 , in one embodiment, the second line portion S12a has a curved portion S12c that curves in the positive direction of the x-axis. The distance LO2a can be defined as the distance between the second openings O2 on the inside of the curved portion S12c (on the positive side of the x-axis relative to the second line portion S12a), and the distance LO2b can be defined as the distance between the second openings O2 on the outside of the curved portion S12c (on the negative side of the x-axis relative to the second line portion S12a). In this case, satisfying LO2a > LO2b can further effectively achieve the above-described effect. That is, in a plan view, the second openings O2 are positioned at an angle to match the second line portion S12a and the curved portion S12c, thereby favorably achieving the above-described effect.

[0042] As shown in FIGS. 2 to 4 , the antenna may further include a pair of second ground conductors G2 located between the first insulating layer 1 and the second insulating layer 2 and electrically connected to the first ground conductor G1. In this case, the first signal conductor S1 is located between the pair of second ground conductors G2 in a plan view. With this configuration, the first signal conductor S1 is located alongside the second ground conductor G2, allowing the first signal conductor S1 as a signal wiring to have a coplanar structure. The coplanar structure allows for smooth transmission of high-frequency signals. More specifically, as shown in FIG. 4 , the pair of second ground conductors G2 may include a second left ground conductor G2L and a second right ground conductor G2R. Furthermore, the second left ground conductor G2L may include a second left outer ground conductor G21L located alongside the first line S11 and a second left inner-layer ground conductor G22L located alongside the second line S12. The second right ground conductor G2R may also have a second right outer ground conductor G21R positioned alongside the first line S11, and a second right inner ground conductor G22R positioned alongside the second line S12.

[0043] As shown in FIGS. 1 to 4 , the first insulating layer 1 may further have a first side surface 1c connecting to the first upper surface 1a and the first lower surface 1b. The second insulating layer 2 may also have a second side surface 2c connecting to the second upper surface 2a and the second lower surface 2b and positioned inwardly from the first side surface 1c in a planar view. In this case, the first upper surface 1a has a first region 11 positioned between the first side surface 1c and the second side surface 2c in a planar view. The first line S11 may also extend to the first region 11 in a planar view and have a first connection portion S11b to which an external connection member 8 is connected. This configuration allows electrical signals to be exchanged directly with the external connection member 8 or via the external connection member 8. In the present disclosure, the external connection member 8 is a concept that includes connection members such as flexible printed circuits (FPCs), wires, and lead terminals, as well as printed circuit boards (PCBs) on which electronic circuits are formed.

[0044] 1, in one embodiment, the external connection member 8 is a flexible substrate. When the external connection member 8 connected to the wiring board 101 is a connection member such as a wire or a lead terminal, a circuit board such as a printed circuit board may be connected to the tip of the connection member.

[0045] Furthermore, a printed circuit board may be connected to the wiring board 101 by solder balls or the like. That is, the wiring board 101 may be mounted on the printed circuit board by a ball grid array (BGA).

[0046] If the wiring board 101 further includes a pair of second grounding conductors G2 (second left grounding conductor G2L and second right grounding conductor G2R), the grounding conductors of the external connection member 8 may be connected to the second left external grounding conductor G21L and the second right external grounding conductor G21R.

[0047] If the wiring board 101 further includes a third line S23 (third line portion S23a, third end portion S23e), the third line S23 may be positioned to extend to the first region 11 in a planar view and may have a second connection portion S23b to which the external connection member 8 is connected.

[0048] 4 and 7, the first ground conductor G1 may have one or more third openings O3 that overlap the first connection portion S11b in plan view. This configuration can reduce the possibility of a decrease in the impedance value at the first connection portion S11b.

[0049] Furthermore, if the wiring substrate 101 further includes a second connection portion S23b, the first ground conductor G1 may have one or more seventh openings O7 that are positioned overlapping the second connection portion S23b in a planar view.

[0050] 2 to 4, the first insulating layer 1 may further include a recess K1 having an opening in the first region 11. In this case, the recess K1 may be positioned to overlap a portion of the third opening O3 in plan view. By forming the recess K1, the relative dielectric constant of the portion where the recess K1 is formed can be reduced, thereby reducing the decrease in the impedance value of the first line S11.

[0051] As shown in Figures 6, 7, and 10, the wiring substrate 101 may further include a third ground conductor G3 electrically connected to the first ground conductor G1 and located on the second upper surface 2a. The third ground conductor G3 may have one or more fourth openings O4. In this case, at least a portion of the second line portion S12a is positioned overlapping the fourth opening O4 in a planar view. In a planar view, the fourth opening O4 has a portion overlapping with a portion of the second opening O2. In other words, in a planar view, the fourth opening O4 may be positioned offset from the third opening O3. This configuration allows the second line S12 to have a stripline structure and reduces or adjusts the decrease in impedance value while maintaining the resonant frequency of the second line portion S12a.

[0052] Furthermore, when the wiring substrate 101 further includes the fourth line S24 (fourth line portion S24a, fourth end portion S24e), the third ground conductor G3 may have one or more eighth openings O8. In this case, at least a portion of the fourth line portion S24a may be positioned so as to overlap the eighth opening O8 in a planar view. Furthermore, as shown in FIG. 6 , the eighth opening O8 may have a portion positioned so as to overlap a portion of the sixth opening O6 in a planar view.

[0053] 1 , an electronic component mounting package 100 according to an embodiment of the present disclosure includes a wiring substrate 101, a substrate 102, and a frame 103. The frame 103 is bonded to the upper surface of the substrate 102, and the wiring substrate 101 is fixed to the frame 103. Alternatively, the wiring substrate 101 may be bonded to the upper surface of the substrate 102.

[0054] The substrate 102 has an upper surface. For example, the substrate 102 is rectangular in plan view, measuring 10 mm x 10 mm to 50 mm x 50 mm and having a thickness of 0.5 mm to 20 mm. Examples of materials for the substrate 102 include metal materials such as copper, iron, tungsten, molybdenum, nickel, and cobalt, as well as alloys containing these metal materials. In this case, the substrate 102 may be a single metal plate or a laminate of multiple metal plates. Furthermore, when the substrate 102 is made of any of the above metal materials, a plating layer of nickel, gold, or the like may be formed on the surface of the substrate 102 using electroplating or electroless plating to reduce oxidation corrosion. Furthermore, the substrate 102 may be made of an insulating material, such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a ceramic material such as glass ceramics.

[0055] Alternatively, the substrate 102 may be a PCB on which an electric circuit is printed. In this case, the wiring board 101 may be joined to the substrate 102 by a BGA.

[0056] The frame 103 is located on the upper surface of the substrate 102 and protects the electronic components 104 located inside in a plan view. That is, in a plan view, the frame 103 is located so as to surround the electronic components 104. As shown in FIG. 1 , in one embodiment, the frame 103 and the wiring substrate 101 surround the outer edge of the upper surface of the substrate 102. In this way, the frame 103 does not have to surround the entire outer edge of the upper surface of the substrate 102. Also, in one embodiment, the frame 103 is located along the outer edge of the upper surface of the substrate 102, but the frame 103 may be located inside the outer edge of the upper surface of the substrate 102.

[0057] The frame 103 may be rectangular in plan view. In this case, the wiring substrate 101 may be bonded to the lower surface of the frame 103. Furthermore, when the wiring substrate 101 is bonded to the upper surface of the substrate 102, the wiring substrate 101 may be sandwiched between the frame 103 and the substrate 102.

[0058] The material of the frame 103 may be, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials. The material of the frame 103 may also be an insulating material, such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a ceramic material such as glass ceramics.

[0059] The frame 103 can be joined to the substrate 102 via a brazing material or the like. The brazing material may be, for example, silver, copper, gold, aluminum, or magnesium, and may contain additives such as nickel, cadmium, or phosphorus.

[0060] 1, the electronic module 10 includes an electronic component mounting package 100, an electronic component 104, and a lid 106. The electronic module 10 may also include a seal ring 105.

[0061] The electronic component 104 may be a component that performs signal processing, such as converting an optical signal to an electrical signal or an electrical signal to an optical signal. The electronic component 104 is located on the upper surface of the substrate 102 and is housed in the electronic component mounting package 100.

[0062] Examples of the electronic component 104 include optical semiconductor elements such as semiconductor lasers (LDs) or photodiodes (PDs), semiconductor integrated circuit elements, and sensor elements such as optical sensors. The electronic component 104 can be formed from a semiconductor material such as gallium arsenide or gallium nitride. When the electronic component 104 is an optical semiconductor element, the electronic module 10 can be used as an optical communication module.

[0063] The lid 106 is positioned on the frame 103, covering the interior of the electronic component mounting package 100, and protects the electronic component 104 together with the frame 103. The lid 106 is, for example, rectangular in plan view, measuring 10 mm x 10 mm to 50 mm x 50 mm and having a thickness of 0.5 mm to 2 mm. Examples of materials for the lid 106 include metal materials such as iron, copper, nickel, chromium, cobalt, molybdenum, and tungsten, as well as alloys combining a plurality of these metal materials. The metal member that constitutes the lid 106 can be produced by subjecting an ingot of such a metal material to a metal processing method such as rolling or punching.

[0064] The seal ring 105 functions to join the lid body 106 and the frame body 103. The seal ring 105 is located on the frame body 103 and surrounds the electronic component 104 in a plan view. Examples of materials for the seal ring 105 include metal materials such as iron, copper, silver, nickel, chromium, cobalt, molybdenum, and tungsten, and alloys combining a plurality of these metal materials. Note that if the seal ring 105 is not provided on the frame body 103, the lid body 106 may be joined via a joining material such as solder, brazing material, glass, or resin adhesive.

[0065] It should be noted that various combinations of the features in one embodiment are not limited to the examples of the above-described embodiment, and combinations of the respective embodiments are also possible.

[0066] The wiring board according to one embodiment, having the above-described configuration, can adjust impedance more appropriately, thereby improving the signal transmission characteristics of the signal wiring, thereby providing an electronic component mounting package and an electronic module that can reduce loss in signal transmission, particularly high-frequency signals.

[0067] The present disclosure can be used as a wiring board, an electronic component mounting package using the wiring board, and an electronic module.

[0068] 1 First insulating layer 1a First upper surface 1b First lower surface 1c First side surface 11 First region 2 Second insulating layer 2a Second upper surface 2b Second lower surface 2c Second side surface G1 First ground conductor G2 Second ground conductor G2L Second left ground conductor G21L Second left outer ground conductor G22L Second left inner-layer ground conductor G2R Second right ground conductor G21R Second right outer ground conductor G22R Second right inner-layer ground conductor G3 Third ground conductor O1 First opening O2 (O21 to O23) Second opening O3 Third opening O4 Fourth opening O5 Fifth opening O6 Sixth opening O7 Seventh opening K1 Recess S1 First signal conductor S11 First line S11a First line portion S11b First connection portion S11e First end portion S12 Second line S12a Second line portion S12e Second end portion S2 Second signal conductor S23 Third line S23a Third line portion S23e Third end portion S23b Second connection portion S24 Fourth line S24a Fourth line portion S24e Fourth end portion L1 Dimension of first line portion L1e Dimension of first end portion L2 Dimension of second line portion L2e Dimension of second end portion LO1 Dimension of first opening LO2 Dimension of second opening 8 External connection member 10 Electronic module 100 Package for mounting electronic component 101 Wiring board 102 Board 103 Frame 104 Electronic component 105 Seal ring 106 Lid

Claims

1. a first insulating layer having a first upper surface and a first lower surface opposite the first upper surface; a second insulating layer located on the first insulating layer and having a second upper surface and a second lower surface opposite the second upper surface; a first ground conductor having a first opening and a second opening and located on the first lower surface; a first signal conductor having a first line located on the first upper surface and a second line located on the second lower surface; the first line has a first end and a first line portion extending from the first end, the second line has a second end electrically connected to the first end and a second line portion extending from the second end, In plan view, the first end and the second end are located within the first opening; At least a portion of the second line portion is positioned to overlap the second opening, The area of ​​the first opening is larger than the area of ​​the second opening. Wiring board.

2. When a direction in which the first line portion extends is a first direction and a direction intersecting the first direction is a second direction, The wiring board according to claim 1 , wherein a dimension of the first end in the second direction is smaller than a dimension of the second end in the second direction.

3. the first ground conductor includes a plurality of the second openings; The wiring board according to claim 1 , wherein the second openings are spaced apart from one another and positioned along the second line portion in a plan view.

4. The wiring board according to claim 1 or 2, wherein, in a planar view, a dimension of the second opening in a direction perpendicular to a direction along the second line portion is larger than a dimension of the second line portion in a direction perpendicular to the direction along the second line portion.

5. In plan view, The wiring board according to claim 1 , wherein a distance between the second openings in a direction along the second line portion is not constant in a direction perpendicular to the direction along the second line portion.

6. a pair of second ground conductors located between the first insulating layer and the second insulating layer and electrically connected to the first ground conductor; The wiring board according to claim 1 , wherein the first signal conductor is located between the pair of second ground conductors in a plan view.

7. the first insulating layer has a first side surface connected to the first upper surface and the first lower surface; the second insulating layer has a second side surface connected to the second upper surface and the second lower surface and located inwardly of the first side surface in a plan view; the first upper surface has a first region located between the first side surface and the second side surface in a plan view, 3 . The wiring board according to claim 1 , wherein the first line is positioned to extend into the first region in a plan view and has a first connection portion to which an external connection member is connected.

8. The wiring board according to claim 7 , wherein the first ground conductor has one or more third openings positioned to overlap the first connection portion in a plan view.

9. the first insulating layer further includes a recess having an opening in the first region; The wiring board according to claim 8 , wherein the recess is positioned so as to overlap at least a portion of the third opening in a plan view.

10. a third ground conductor electrically connected to the first ground conductor and located on the second top surface; the third ground conductor has one or more fourth openings; In a plan view, at least a portion of the second line portion is positioned to overlap with the fourth opening, The wiring board according to claim 1 , wherein the fourth opening has a portion that overlaps at least a portion of the second opening in a plan view.

11. A substrate; A frame body joined to an upper surface of the substrate; A package for mounting electronic components, comprising: the wiring board according to claim 1 or 2 fixed to the frame.

12. The electronic component mounting package according to claim 11 ; an electronic component located on the top surface of the substrate and electrically connected to the wiring board; a lid body positioned on the frame body and covering the inside of the electronic component mounting package.