Bonded structure, method for producing same, conductive member for solder bonding, and structure for solder bonding

Abstract

A bonded structure which comprises a first conductive member, a second conductive member, and a solder bonding part for bonding the first conductive member and the second conductive member to each other, wherein at least one of the first conductive member and the second conductive member contains a metal and particles of a layered material that comprises one or more layers.

Description

Bonded structure and manufacturing method thereof, conductive member for soldering, and structure for soldering The present disclosure relates to a joint structure and a manufacturing method thereof, a conductive member for solder bonding, and a structure for solder bonding. Generally, an electronic component includes a component body and an external electrode provided on its surface. When mounting the electronic component on a substrate, the external electrode can be soldered to an electrode portion (e.g., a land) formed on the substrate (in this specification, the joint formed by this is also referred to as a "solder joint"). In solder joints, the metal constituting the external electrode may diffuse excessively when it comes into contact with the solder material, resulting in so-called "solder erosion." One measure to prevent this "solder erosion" is, for example, to provide a process for forming a barrier layer such as nickel plating on the surface of the wiring or electrode. However, pretreatment with a chemical solution such as an acid or alkali reduces the adhesive strength of the conductor to the substrate, and also causes problems such as high costs due to the addition of a plating process. For example, when the metal constituting the external electrodes is silver, a silver / palladium conductor or a silver / platinum conductor with added heat-resistant palladium or platinum can be used. In addition, a conductive paste with added manganese oxide, chromium oxide, and glass frit to silver / palladium can be used as a technique for forming surface wiring by post-fire using the thick-film method. However, post-fire using the thick-film method increases the number of steps, resulting in high costs. In addition, the glass frit softens during firing and accumulates between the conductor particles. Therefore, when solder erosion occurs on the conductor surface, the layer formed by the remaining glass is exposed, which causes a problem of repelling the solder material. Furthermore, the silver / palladium conductor has a high conductor resistance, which causes a problem of large conductor loss of electrical signals in the surface wiring. As another measure, Patent Document 1 discloses a conductive paste containing 0.2 to 1 part by weight of manganese dioxide, 0.2 to 1 part by weight of copper oxide, 0.3 to 1 part by weight of silicon dioxide, and 3 to 5.6 parts by weight of metal powders of molybdenum and tungsten, per 100 parts by weight of silver / platinum. JP 2001-143527 A For example, electrodes or wiring constituting electronic components are required to exhibit high electrical conductivity while preventing solder erosion. However, the structure shown in Patent Document 1 also has a problem of increased man-hours and high costs. The present disclosure has been made in consideration of the above circumstances, and its purpose is to provide a joint structure that prevents solder erosion and has excellent electrical conductivity, a method for manufacturing the joint structure at reduced cost, a conductive member for solder bonding, and a structure for solder bonding. According to one aspect of the present invention, A joint structure having a first conductive member, a second conductive member, and a solder joint portion that joins the first conductive member and the second conductive member, A bonded structure is provided, wherein at least one of the first conductive member and the second conductive member comprises a metal and particles of a layered material comprising one or more layers. As a preferred embodiment of the bonded structure of the present invention, A joint structure having a first conductive member, a second conductive member, and a solder joint portion that joins the first conductive member and the second conductive member, At least one of the first conductive member and the second conductive member is Metal and (i) A particle of layered material comprising one or more layers, The layer has the following formula: M ｍ X ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body; and (ii) a compound of the formula: M ｍAX ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; A is at least one Group 12, 13, 14, 15, or 16 element; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and one or more conductive particles among the second conductive particles represented by A joint structure is provided, comprising: According to the present disclosure, there is provided a joint structure having a first conductive member, a second conductive member, and a solder joint joining the first conductive member and the second conductive member, wherein at least one of the first conductive member and the second conductive member comprises a metal and particles of a layered material including one or more layers, preferably one or more conductive particles selected from a predetermined first conductive particle and a predetermined second conductive particle, and the joint structure is prevented from solder erosion and exhibits high electrical conductivity. FIG. 1 is a schematic cross-sectional view showing a part of a conventional joint structure; FIG. 2 is a schematic cross-sectional view showing a part of a joint structure according to the present embodiment; FIG. 3 is a schematic cross-sectional view showing MXene, which is a layered material that can be used for the joint structure according to the present embodiment; FIG. 4 is a schematic cross-sectional view of a mounting structure in which an electronic component is mounted on a substrate, shown as an example of the joint structure according to the present embodiment; FIG. 5 is a graph showing the relationship between the immersion time in a solder bath and the mass of a conductive material sample, which is the result of a solder erosion test in an example; and FIG. 6 is a micrograph showing the appearance of a sample before and after a solder erosion test in an example. (Embodiment 1: Joined structure) Hereinafter, a joint structure according to one embodiment of the present invention will be described in detail, but the present disclosure is not limited to such an embodiment. In this embodiment, one joint structure is A joint structure having a first conductive member, a second conductive member, and a solder joint portion that joins the first conductive member and the second conductive member, At least one of the first conductive member and the second conductive member is a bonded structure that includes a metal and particles of a layered material that includes one or more layers. Examples of the particles of the layered material including one or more layers in the bonded structure include, for example, MXene particles, MAX particles, graphene, graphene oxide, silicene, black phosphorus, borophene, titanium oxide nanosheets, transition metal dichalcogenides, boron nitride, etc., and one or more particles of these may be included. By including particles of the layered material including one or more layers in at least one of the first conductive member and the second conductive member, even if the metal is silver, copper, etc. that is likely to diffuse into the solder metal (e.g., tin, etc.) during solder bonding, solder erosion can be prevented. The particles of the layered material including one or more layers in the bonded structure preferably include one or more particles of MXene particles and MAX particles, and / or one or more particles of graphene and graphene oxide. The particles of the layered material including one or more layers in the bonded structure may be one or more particles of MXene particles and MAX particles. The particles of the layered material including one or more layers in the bonded structure may be one or more particles of graphene and graphene oxide. The particles of layered material comprising one or more layers in the bonded structure are more preferably particles of layered material comprising one or more layers, said layers being represented by the formula M ｍ X ｎ and MXene represented by the following formula: M ｍ A.X. ｎ and MAX, which is indicated by: A preferred joint structure in this embodiment is A joint structure having a first conductive member, a second conductive member, and a solder joint portion that joins the first conductive member and the second conductive member, At least one of the first conductive member and the second conductive member is Metal and (i) A particle of layered material comprising one or more layers, The layer has the following formula: M ｍ X ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body; and (ii) a compound of the formula: M ｍ A.X. ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; A is at least one Group 12, 13, 14, 15, or 16 element; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and one or more conductive particles among the second conductive particles represented by This preferred joining structure is described in detail below. [Conductive member] [One or more conductive particles of the first conductive particles (MXene particles) and the second conductive particles (MAX particles) contained in the conductive member] In the bonded structure according to the present embodiment, at least one of the first conductive member and the second conductive member may contain one or more of the first conductive particles and the second conductive particles together with a metal. In this specification, the first conductive particles may be referred to as "MXene particles" or "MXene powder", and the layered material constituting the first conductive particles may be referred to as "MXene". The second conductive particles may be referred to as "MAX particles", and the layered material constituting the second conductive particles may be referred to as "MAX". The joint structure according to the present embodiment can prevent solder erosion even if the metal is silver, copper, or the like that is easily diffused into the solder metal (e.g., tin, etc.) during soldering due to the above-mentioned configuration. Although this embodiment is not bound by any theory, the reason why the joint structure according to this embodiment can prevent solder erosion is presumed as follows, using the schematic cross-sectional views of Figures 1 and 2. Note that Figures 1 and 2 are merely image views used for convenience of explanation, and the thickness of the solder joint, the size and arrangement of one or more conductive particles of MXene particles and MAX particles in Figures 1 and 2 may differ from the actual ones, and the joint structure according to this embodiment is not limited to the form shown in Figure 2. FIG. 1 is a schematic cross-sectional view showing a portion of a conventional joint structure, and FIG. 2 is a schematic cross-sectional view showing a portion of the joint structure according to this embodiment. When a metal such as silver or copper constituting a conductive member is heated in contact with a solder metal such as tin contained in a solder material for soldering, an alloy layer (intermetallic compound) of these metals is formed as a solder joint by the diffusion of the metal constituting the conductive member and the diffusion of the solder metal. The formation of this alloy layer (intermetallic compound) ensures the strength of the joint structure and also ensures electrical conductivity. However, when the metal constituting the conductive member is easily diffused into the solder metal like silver, for example, as shown in FIG. 1, the diffusion (diffusion into the solder metal (tin, etc.)) 39 of the metal 36 such as silver constituting the conductive member 35A becomes excessive. As a result, most of the metal 36 such as silver constituting the conductive member 35A is used to form the alloy layer (intermetallic compound) 33, and the conductive member 35A disappears, resulting in so-called "solder erosion." However, as shown in FIG. 2, the conductive member 35B contains one or more conductive particles 37 of the first conductive particles (MXene particles) and the second conductive particles (MAX particles) together with the metal 36, which is thought to inhibit the diffusion 39 of the metal 36 such as silver constituting the conductive member 35B. As a result, it is thought that excessive diffusion into the solder metal is suppressed, and solder erosion can be prevented. As shown in the examples described later, among the particles of the layered material including one or more layers, the conductive particles (MXene particles) and one or more conductive particles of the second conductive particles (MAX particles) can prevent solder erosion and exhibit high conductivity. The first conductive particles and the second conductive particles will be described below. The layered material constituting the first conductive particles can be understood as a layered compound, and is also referred to as "M ｍ X ｎ T ｓ ", where s is any number, and conventionally, x or z may be used instead of s. Typically, n can be 1, 2, 3, or 4, but is not limited thereto. In the above formula for MXene, M is preferably at least one selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo and Mn, and more preferably at least one selected from the group consisting of Ti, V, Cr and Mo. MXene is represented by the above formula: ｍ X ｎ However, it is known that it can be expressed as follows: S.C. ２ C, Ti ２ C, Ti ２ N, Zr ２ C, Zr ２ N, Hf ２ C, Hf ２ N.V. ２ C.V. ２ N, Nb ２ C, Ta ２ C, Cr ２ C, Cr ２ N, M ２ C, Mo １．３ C, Cr １．３ C, (Ti, V)２ C, (Ti, Nb) ２ C, W ２ C, W １．３ C, Mo ２ N, Nb １．３ C, Mo １．３ Y ０．６ C (In the above formula, "1.3" and "0.6" respectively mean approximately 1.3 (= 4 / 3) and approximately 0.6 (= 2 / 3).) Ti ３ C ２ , Ti ３ N ２ , Ti ３ (CN), Zr ３ C ２ , (Ti, V) ３ C ２ , (Ti ２ Nb)C ２ , (Ti ２ Ta)C ２ , (Ti ２ Mn)C ２ Hf ３ C ２ , (Hf ２ V)C ２ , (Hf ２ Mn)C ２ , (V ２ Ti)C ２ , (Cr ２ Ti)C ２ , (Cr ２ V)C ２ , (Cr ２ Nb)C ２ , (Cr ２ Ta)C ２ , (Mo ２ Sc)C ２ , (Mo ２ Ti)C ２ , (Mo ２ Zr)C ２ , (Mo ２ Hf)C ２ , (Mo ２ V)C ２ , (Mo ２ Nb)C ２ , (Mo ２ Ta)C ２ , (W ２ Ti)C ２ , (W ２ Zr)C２ 、(W ２ Hf)C ２ 、 Ti ４ N ３ 、V ４ C ３ 、Nb ４ C ３ 、Ta ４ C ３ 、(Ti,Nb) ４ C ３ 、(Nb,Zr) ４ C ３ 、(Ti ２ Nb ２ )C ３ 、(Ti ２ Ta ２ )C ３ 、(V ２ Ti ２ )C ３ 、(V ２ Nb ２ )C ３ 、(V ２ Ta ２ )C ３ 、(Nb ２ Ta ２ )C ３ 、(Cr ２ Ti ２ )C ３ 、(Cr ２ V ２ )C ３ 、(Cr ２ Nb ２ )C ３ 、(Cr ２ Ta ２ )C ３ 、(Mo ２ Ti ２ )C ３ 、(Mo ２ Zr ２ )C ３ 、(Mo ２ Hf ２ )C ３ 、(Mo ２ V ２ )C ３ 、(Mo ２ Nb ２ )C ３ 、(Mo ２ Ta ２ )C ３ 、(W２ Ti ２ ) C ３ , (W ２ Zr ２ ) C ３ , (W ２ Hf ２ ) C ３ , (Mo ２．７ V １．３ ) C ３ (In the above formula, "2.7" and "1.3" mean approximately 2.7 (= 8 / 3) and approximately 1.3 (= 4 / 3), respectively.) Typically, in the above formula, M can be titanium or vanadium, and X can be a carbon atom or a nitrogen atom. For example, the MAX phase is Ti ３ AIC ２ and MXene is Ti ３ C ２ T ｓ (in other words, M is Ti, X is C, n is 2, and m is 3). In the present disclosure, MXene may contain a relatively small amount of residual A atoms, for example, 10% by mass or less of the original A atoms. The amount of residual A atoms may be preferably 8% by mass or less, more preferably 6% by mass or less. However, even if the amount of residual A atoms exceeds 10% by mass, there may be cases where there is no problem depending on the application and use conditions of the conductive member. The MXene particles are aggregates containing one layer of MXene 10a (single layer MXene) as shown in FIG. ｍ X ｎ The layer body (M ｍ X ｎ The MXene layer 7a has a layer body 1a and a modification or termination T3a, 5a present on the surface of the layer body 1a (more specifically, on at least one of the two surfaces facing each other in each layer). ｍ X ｎ T ｓ ", where s is any number. The MXene particles may contain multiple layers of MXene as well as one layer of MXene. Examples of multiple layers of MXene (multilayer MXene) include, but are not limited to, two layers of MXene 10b as shown in FIG. 3(b). 1b, 3b, 5b, and 7b in FIG. 3(b) are the same as 1a, 3a, 5a, and 7a in FIG. 3(a). The two adjacent MXene layers (e.g., 7a and 7b) of the multilayer MXene do not necessarily have to be completely separated, and may be partially in contact. The MXene 10a is present as one layer in which the multilayer MXene 10b is individually separated, and the unseparated multilayer MXene 10b remains, and may be a mixture of the single layer MXene 10a and the multilayer MXene 10b. Without being limiting of this embodiment, the thickness of each layer of MXene (corresponding to the above-mentioned MXene layers 7a and 7b) is, for example, 0.8 nm to 5 nm, particularly 0.8 nm to 3 nm (which may vary mainly depending on the number of M atomic layers contained in each layer). For each stack of multi-layered MXene that may be included, the interlayer distance (or gap dimension, shown as Δd in FIG. 3(b)) may be, for example, 0.8 nm to 10 nm, particularly 0.8 nm to 5 nm, more particularly about 1 nm, and the total number of layers may be 2 to 20,000. The MXene particles may be MXene with a small number of layers obtained by subjecting the multi-layer MXene to a delamination process (sometimes called a delamination process). The "small number of layers" refers to, for example, 6 or less stacked layers of MXene. The thickness in the stacking direction of the multi-layer MXene with a small number of layers may be 10 nm or less. Hereinafter, this "multi-layer MXene with a small number of layers" may be referred to as "few-layer MXene". Furthermore, single-layer MXene and few-layer MXene may be collectively referred to as "single-layer / few-layer MXene". The MXene particles may contain single-layer MXene and few-layer MXene, i.e., single-layer and few-layer MXene. The proportion of single-layer and few-layer MXene having a thickness of 10 nm or less in the entire MXene particles may be 10% by volume or more when the MXene particles are used in a conductive member that does not contain resin, and may be 1% by volume or more when the MXene particles are used in a conductive member that contains resin. In either case of use in a conductive member, the proportion of the single-layer and few-layer MXene may be higher. The ratio of one or more conductive particles, MXene particles and MAX particles (hereinafter referred to as "MXene particles / MAX particles" or simply "conductive particles") contained in at least one of the first conductive member and the second conductive member can be, for example, in the following range. That is, when the ratio of the conductive particles is expressed as (mass of conductive particles) / (mass of conductive particles + mass of metal constituting the conductive member), it can be, for example, 0.1 mass% or more and 20 mass% or less. However, it is not limited to this, and the ratio of the conductive particles may be more than 20 mass%. On the other hand, from the viewpoint of forming an intermetallic compound between the metal contained in the conductive member and the solder and achieving good solder bonding, it is preferable that the ratio of the conductive particles is 20 mass% or less. [Metals contained in conductive materials] The metal contained in at least one of the first conductive member and the second conductive member may be one or more selected from the group consisting of silver, copper, gold, nickel, zinc, tin, platinum, and palladium. These metals are easily diffused into the solder metal, such as tin, constituting the solder material, and when these metals are soldered as the joined object, solder erosion is likely to occur. The metals may be each pure metal, or may be an alloy containing each of them in a mass ratio of 50% or more. The metal may be one or more of silver and copper, and may be silver in particular. At least one of the first conductive member and the second conductive member may contain, for example, 80% or more of the above metal by mass. [Solder joint] A solder joint refers to a joint formed between the first conductive member and the second conductive member so as to be in contact with them by soldering the first conductive member and the second conductive member via a solder material including a solder metal. [Solder metal contained in solder joints] "Solder metal" means a metal for brazing. Examples of solder metals include lead-free solder metals. Solder metals may contain at least tin. Examples of solder metals containing tin (Sn) include simple Sn or Sn-based alloys. Examples of Sn-based alloys include Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-In, Sn-Ag-In, Sn-Cu-In, Sn-Ag-Cu-In, Sn-Ag-Cu-In, Sn-Bi, Sn-Bi-In, Sn-Ag-Bi, Sn-Cu-Bi, Sn-Ag-Cu-Bi, Sn-Ag-Cu-Bi-In, Sn-Ag-Cu-Bi, Sn-Ag-Cu-Bi-In, Sn-Au, Sn-Sb, and Sn-Zn. [Resin contained in solder joints] The solder joint may contain a resin depending on the raw material of the solder joint and the conditions of the joint. The resin contained in the solder joint is not limited, and may be a thermosetting resin or a thermoplastic resin. Examples of the resin include acrylic resin, fluororesin such as polytetrafluoroethylene, vinyl resin such as polyvinyl chloride, epoxy resin, polyurethane, melamine resin, phenolic resin, polyester such as polyethylene terephthalate, polyamide, polyimide, polyether, etc. The ratio of the resin contained in the solder joint may be appropriately determined depending on the application. [Embodiments of the Joined Structure] The joint structure according to this embodiment is obtained by soldering the first conductive member and the second conductive member. At least one of the first conductive member and the second conductive member may be, for example, an electrode or a wiring. The "electrode" may be an internal electrode, an external electrode, a pad electrode, a wiring-like electrode, a ground (reference potential) electrode, a shield pattern, etc. in an electronic component or a circuit board, which may cause the above-mentioned solder erosion. The "wiring" may be a signal line, a coil pattern, an interlayer connection conductor (via conductor), etc. that forms a circuit pattern. As an example of a joint structure, a schematic cross-sectional view of a mounting structure obtained by mounting an electronic component on a substrate using a solder material is shown in FIG. 4. In FIG. 4, a mounting structure 20 has an electronic component and solder joints 29a, 29b. In the mounting structure 20, the electronic component may include a component body 21 and external electrodes 27a, 27b provided on the surface of the component body. In FIG. 4, two external electrodes are shown as the external electrodes, but the number of external electrodes is not particularly limited. The solder joints 29a, 29b are used to join the substrate 23 and the electronic component, and specifically, they may be directly joined to an electrode portion 25 provided on the surface of the substrate 23. (Embodiment 2: Manufacturing method of bonded structure) Hereinafter, a method for manufacturing a joint structure in an embodiment of the present invention will be described in detail, but the present disclosure is not limited to such an embodiment. The method for manufacturing the joint structure of this embodiment includes the steps of: (a) providing a first conductive member and a second conductive member; At least one of the first conductive member and the second conductive member is Metal and (i) A particle of layered material comprising one or more layers, The layer has the following formula: M ｍ X ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body; and (ii) a compound of the formula: M ｍ AX ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; A is at least one Group 12, 13, 14, 15, or 16 element; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and one or more conductive particles among the second conductive particles represented by Including, (b) soldering the first conductive member and the second conductive member together; Includes. Each step will be described below. ・Process (a) A first conductive member and a second conductive member, At least one of the first conductive member and the second conductive member is Metal and (i) one or more of the first conductive particles and (ii) the second conductive particles; Prepare the following: In the above (a), the method for preparing at least one of the first conductive member and the second conductive member, which contains the metal and the conductive particles, may be the following method. In the step (a), at least one of the first conductive member and the second conductive member is (a11)(i) Particles of layered material comprising one or more layers, The layer has the following formula: M ｍ X ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body; and (ii) a compound of the formula: M ｍ AX ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; A is at least one Group 12, 13, 14, 15, or 16 element; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. providing one or more second conductive particles represented by: (a12) mixing a conductive member-forming composition containing a metal constituting at least one of the first conductive member and the second conductive member and the conductive particles to obtain a conductive member-forming mixture; and (a13) molding the conductive member-forming mixture and firing it at a sinterable temperature. (sometimes referred to as "first step (a)"). Another method for preparing the conductive member is as follows. In the step (a), at least one of the first conductive member and the second conductive member is (a21)(i) Particles of layered material comprising one or more layers, The layer has the following formula: M ｍ X ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body; and (ii) a compound of the formula: M ｍ AX ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; A is at least one Group 12, 13, 14, 15, or 16 element; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. providing one or more second conductive particles represented by: (a22) mixing a conductive member-forming composition containing a metal constituting at least one of the first conductive member and the second conductive member, the conductive particles, and a resin to obtain a conductive member-forming mixture; and (a23) Molding and drying the conductive member-forming mixture. (sometimes referred to as the "second step (a)"). The first step (a) will now be described. ・Process (a11) The first conductive particles and the second conductive particles can be prepared as follows. First, MAX constituting the second conductive particle is The following formula: M ｍ AX ｎ (wherein M, X, n and m are as defined above, and A is at least one Group 12, 13, 14, 15, 16 element, usually a Group A element, typically Group IIIA and Group IVA, and more particularly may include at least one element selected from the group consisting of Al, Ga, In, Tl, Si, Ge, Sn, Pb, P, As, S and Cd, and is preferably Al). and M ｍ X ｎ (each X may have a crystal lattice in which it is located in an octahedral array of M) between which a layer composed of A atoms is located. The MAX phase has a crystal structure in which, typically, when m=n+1, one layer of X atoms is arranged between each of the n+1 layers of M atoms (collectively referred to as "M ｍ X ｎ The n+1th layer of M atoms is followed by a layer of A atoms (also referred to as an "A atom layer"), but the invention is not limited thereto. The MAX phase can be produced by a known method. For example, TiC powder, Ti powder, and Al powder are mixed in a ball mill, and the resulting mixed powder is sintered in an Ar atmosphere to obtain a sintered body (a block-shaped MAX phase). The sintered body is then pulverized with an end mill to obtain MAX particles. The first conductive particles (MXene particles) can be synthesized by selectively etching (removing and optionally layer-separating) A atoms (and optionally some of the M atoms) from the MAX. The A atoms (and optionally some of the M atoms) are selectively etched (removed and optionally layer separated) from MAX, thereby removing the A atom layer (and optionally some of the M atoms) to expose M ｍ X ｎ The surface of the layer is modified with hydroxyl groups, fluorine atoms, chlorine atoms, oxygen atoms, hydrogen atoms, etc. present in the etching solution (usually, an aqueous solution of a fluorine-containing acid is used, but is not limited to this) to terminate the surface. The etching is performed using F － For example, a method using a mixed solution of lithium fluoride and hydrochloric acid, a method using hydrofluoric acid, etc. The etching solution may contain a metal compound containing a monovalent metal ion, and an intercalation treatment of the monovalent metal ion may be performed simultaneously with the etching. After the etching, layer separation of MXene (delamination, separation of multi-layer MXene into single-layer MXene) may be promoted by any suitable post-treatment (e.g., ultrasonic treatment, hand shaking, automatic shaker, etc.). For example, a monovalent metal ion intercalation treatment may be performed, which includes a step of mixing the etched product obtained by the etching treatment with a metal compound containing a monovalent metal ion. Note that ultrasonic treatment may destroy MXene due to excessive shear force, so when it is desired to obtain MXene with a two-dimensional shape having a larger aspect ratio (preferably single-layer MXene), it is preferable to apply an appropriate shear force by hand shaking or an automatic shaker, etc. ・Process (a12) A conductive member forming composition containing the metal constituting at least one of the first conductive member and the second conductive member and the conductive particles is mixed to obtain a conductive member forming mixture. The metal is as described in [Metal contained in the conductive member] above. The metal may be, for example, a metal powder. A metal paste containing the metal powder may be used. The metal paste may be a metal paste obtained by mixing, for example, Ag powder with a varnish prepared by mixing conductive particles, a solvent, and a resin (organic component). When a metal paste containing a resin is used in this way, the conductive member forming composition may contain a resin. The method of mixing is not particularly limited, and examples include stirring with a centrifugal stirrer, kneading and dispersion processing using a three-roll mill. In the kneading, if the fluidity is reduced, an organic solvent that can be removed in a subsequent drying process, such as diethylene glycol monobutyl ether acetate used in the examples, may be added. ・Process (a13) The conductive member-forming mixture is molded and fired at a sinterable temperature to obtain a conductive member containing conductive particles. The molding method is not particularly limited, and may be performed by applying the mixture to a coating object such as a substrate. The coating method is not limited, and may be, for example, a spray coating method using a nozzle such as a one-fluid nozzle, a two-fluid nozzle, or an airbrush, a slit coating using a table coater, a comma coater, or a bar coater, screen printing, metal mask printing, spin coating, dip coating, or dripping. The coating object may be appropriately selected from a printed circuit board, a metal substrate, a resin substrate, a laminated electronic component, a metal pin, a metal wire, or the like, depending on the application. The mixture may be molded, and may be dried, for example, to obtain a molded product, and then fired. When drying is performed after molding, the drying conditions may vary depending on the shape and size of the molded product, and may be, for example, 60° C. or higher and 200° C. or lower, and 10 minutes or longer and 120 minutes or shorter. As shown in the examples described later, molding and firing may be performed simultaneously. The molded product is sintered at a temperature at which the product can be sintered. The sinterable temperature may be determined according to the type of metal, for example, within a range of approximately 150°C or higher and 1450°C or lower. The sintering time may be determined according to the shape and size of the molded product. The atmosphere during the sintering is not particularly limited. For the purpose of removing the binder, the atmosphere during the sintering can be appropriately adjusted to an inert atmosphere, an oxidizing atmosphere, or a reducing atmosphere. Next, the second step (a) will be described. The same parts as those in the first step (a) will be omitted. ・Process (a21) The first conductive particles and the second conductive particles can be prepared in the same manner as in the above step (a11). ・Process (a22) A conductive member forming composition containing a metal constituting at least one of the first conductive member and the second conductive member, the conductive particles, and a resin is mixed to obtain a conductive member forming mixture. The metal is as described above in [Metal contained in the conductive member] and in step (a12). The resin is not limited, and the resin described in [Resin contained in the solder joint] can be used. That is, it may be a thermosetting resin or a thermoplastic resin. For example, acrylic resin, fluororesin such as polytetrafluoroethylene, vinyl resin such as polyvinyl chloride, epoxy resin, polyurethane, melamine resin, phenolic resin, polyester such as polyethylene terephthalate, polyamide, polyimide, polyether, etc. are listed. The ratio of the resin is preferably more than 0 mass%, preferably 2 mass% or more, in order to exert the function as a binder, while it is preferably 25 mass% or less, more preferably 12 mass% or less, from the viewpoint of ensuring electrical conductivity. The metal and the resin may be a metal paste in which they are mixed in advance. The ratio of the conductive particles contained in the conductive member forming composition may be adjusted so that the ratio of the conductive particles in the conductive member obtained is within the range of 0.1 mass % or more and 20 mass % or less, as shown in the above [One or more conductive particles of the first conductive particles (MXene particles) and the second conductive particles (MAX particles) contained in the conductive member]. ・Process (a23) The conductive member-forming mixture is molded and dried to obtain a conductive member. The mixture can be molded into a molded product in the shape of an electrode or wiring before drying, but the molding method is not particularly limited. For example, the mixture may be applied to a coating object such as a substrate. The coating method is not limited, and examples include a method of spray coating using a nozzle such as a one-fluid nozzle, a two-fluid nozzle, or an airbrush, a coating method using a table coater, a comma coater, or a bar coater, screen printing, metal mask printing, spin coating, dip coating, dripping, etc. The coating object may be appropriately selected from printed circuit boards, metal substrates, resin substrates, laminated electronic components, metal pins, metal wires, etc. depending on the application. The drying conditions vary depending on the shape and size of the molded mixture, but may be, for example, at a temperature of 60° C. to 200° C. for 10 minutes to 120 minutes. The above coating and drying steps may be repeated multiple times as necessary until a film of the desired thickness is obtained. ・Process (b) The first conductive member and the second conductive member are soldered together. [Solder material] The solder metal contained in the solder material is as described above. The solder metal may be, for example, in powder form. The solder material may contain flux in addition to the solder metal. Examples of the flux include rosin, a solvent, an activator, and a thickener. The rosin includes naturally occurring rosin and modified rosin. Modified rosin includes, for example, rosin obtained by reducing naturally occurring rosin (reduced rosin), polymerized rosin (polymerized rosin), disproportionated rosin (disproportionated rosin), and rosin derivatives obtained by introducing a substituent into naturally occurring rosin. The rosin may contain one of the above rosins and rosin derivatives alone, or may contain two or more of them in combination. The activators include amine halogen salts (eg, where the amine is cyclohexylamine and the halogen is bromine), amino acids such as glutamic acid, organic acids such as adipic acid, and the like. Examples of the thickener include those soluble in organic solvents, such as high molecular weight polyethylene glycol, polypropylene glycol, and ethyl cellulose; oils and fats, such as hydrogenated castor oil and coconut oil; waxes of higher alcohols and higher fatty acids, saturated higher fatty acids or alcohols, esters of polyhydric alcohols and higher fatty acids, amides or bisamides of higher fatty acids; natural or semi-synthetic gums, such as carnauba wax, acacia gum, tragacanth gum, guar gum, locust bean gum, arabinogalactone, karaya gum, iris moss, gelatin, sodium alginate, and propylene glycol alginate; and synthetic resins, such as low molecular weight phenol formaldehyde resin and low molecular weight polyethylene wax. When a solder paste is used as the solder material, the solder material may contain a solvent, such as glycols such as ethylene glycol, propylene glycol, diethylene glycol, and dipropylene glycol, mono- or di-ethers or mono- or di-esters thereof with lower alcohols, cyclic ethers, particularly crown ethers, glycerin, pentaerythritol, trimethylolpropane, and esters thereof. [Soldering method] In the present embodiment, the specific soldering method is not particularly limited. Examples of the method include a method of soldering the first conductive member and the second conductive member by contacting an electronic circuit board and an electronic component with a solder material melted by using a soldering iron, and a method of arranging electronic components on a printed wiring board on which a solder paste or the like made by mixing a solder alloy powder and a flux is printed, and melting the solder paste or the like in a reflow furnace to solder the electronic components. (Embodiment 3: Conductive member for solder bonding) Hereinafter, a conductive member for solder bonding according to an embodiment of the present invention will be described in detail, but the present disclosure is not limited to such an embodiment. The conductive member for solder bonding of this embodiment is A conductive member that is brought into contact with a solder material in a solder joint, Metal and (i) A particle of layered material comprising one or more layers, The layer has the following formula: M ｍ X ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body; and (ii) a compound of the formula: M ｍ AX ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; A is at least one Group 12, 13, 14, 15, or 16 element; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and one or more conductive particles among the second conductive particles represented by Includes. The conductive member for solder joint may further contain a resin, the details of which are as described above in [Resin contained in solder joint portion]. Details of the metal contained in the conductive member for solder bonding are as described above in [Metal contained in conductive member]. The conductive member for soldering of the present embodiment may be used with a solder material containing tin for soldering. The conductive member for soldering of the present embodiment can prevent solder erosion even when it comes into contact with a solder material containing tin during soldering. The conductive member for soldering includes, for example, electrodes or wirings used for soldering. The "electrodes" include internal electrodes, external electrodes, pad electrodes, wire-like electrodes, ground (reference potential) electrodes, shield patterns, etc. in electronic components and circuit boards where solder erosion may occur. The "wirings" include signal lines, coil patterns, interlayer connection conductors (via conductors), etc. that form circuit patterns. (Embodiment 4: Solder Joint Structure) The solder joint structure of this embodiment includes the conductive member for solder joint and a solder material in contact with the conductive member for solder joint. The details of the conductive member for solder joint and the solder material are as described above. The conductive member for solder joint and the solder material have a form in which, for example, at least a part of the surface of the conductive member for solder joint is covered with the solder material. [Example 1] In Example 1, the conductive member sample was produced by firing. In Example 1-1 below, MXene powder was used to form the conductive member sample, and in Example 1-2 below, MAX particles were used to form the conductive member sample. [Example 1-1] (1) Preparation of MAX particles TiC powder, Ti powder, and Al powder (all manufactured by Kojundo Chemical Laboratory Co., Ltd.) were mixed in a molar ratio of 2:1:1 in a ball mill containing zirconia balls for 24 hours. The mixed powder was sintered at 1350°C for 2 hours in an Ar atmosphere. The sintered body (block-shaped MAX phase) thus obtained was pulverized with an end mill to a maximum dimension of 40 μm or less. As a result, TiC powder was obtained as MAX particles. ３ AIC ２ particles were obtained. (2) Preparation of MXene clay and MXene powder Ti prepared by the above method ３ AIC ２ 1 g of the particles (powder) was weighed out, and added to 10 mL of 9 mol / L hydrochloric acid together with 1 g of LiF, and stirred with a stirrer at 35° C. for 24 hours to obtain Ti. ３ AIC ２ A solid-liquid mixture (suspension) containing solid components derived from the powder was obtained. The mixture was washed with pure water and the supernatant was separated and removed by decantation using a centrifuge (the remaining sediment after removing the supernatant was washed again) about 10 times to obtain a clay-like substance (clay) as the sediment. As a result, Ti was obtained as MXene clay. ３ C ２ T ｘ - Water-dispersed clay was obtained. ３ C ２ T ｘThe water-dispersed clay was freeze-dried and ground using an IKA mill to obtain MXene powder. (3) Formation of the conductive member The MXene powder and Ag powder (size: 1 μm) were mixed to have a ratio of 14.8 mass% and 85.2 mass%, respectively. The mixed powder was placed in a plastic container, and then a ZrO ２ Several balls were added and the mixture was mixed on a pot rack. The mixing conditions were 60 rpm and 24 hours. ２ The balls were removed to obtain a mixed powder. The mixed powder was then placed in a graphite die of a Spark Plasma Sintering (SPS) device, and molded by pressurization and heating to obtain a disk-shaped conductive member sample having a diameter of 10.4 mm and a thickness of 2 mm to 3 mm as a molded product. The conditions for the pressurization and heating were a temperature rise rate of 100° C. / min, a TOP temperature of 750° C., a keeping time of 15 min, an Ar atmosphere, and a maximum pressure of 40 MPa. [Example 1-2] A conductive member sample was obtained in the same manner as in Example 1-1(3) above, except that the MAX particles obtained in the same manner as in Example 1(1) above were used instead of the MXene powder. [Comparative Example 1] A conductive member sample was obtained in the same manner as in Example 1-1(3) above, except that no MAX particles or MXene powder was added. [Solder erosion test] The conductive member samples obtained in the above-mentioned Examples 1-1, 1-2, and Comparative Example 1 at room temperature were put into a solder bath (SAC305 composition) heated to 350° C. and immersed for 120 seconds. During the immersion, the mass was measured for each elapsed time of immersion. In the measurement, for one conductive member sample, after a predetermined time of immersion, the sample was taken out and the mass was measured, and the sample was again taken out after a predetermined time of immersion and the mass was measured. The results are shown in FIG. 5 as a graph showing the relationship between the immersion time and the mass of the conductive member sample. Note that in FIG. 5, the weights of Ag-MXene and Ag-MAX do not appear to have changed, but after being pulled out of the solder bath, an intermetallic compound (alloy layer) with the solder was formed to a thickness of several μm, and the mass increased to a level that could not be detected by the above measurement. In addition, the appearance was observed before immersion (initial stage) and after immersion for 60 seconds. The resulting micrographs are shown in Figure 6. In Figure 6, "Ag" is the micrograph of Comparative Example 1, "Ag-MAX" is the micrograph of Example 1-2, and "Ag-MXene" is the micrograph of Example 1-1. 6, it can be seen that the comparative conductive member sample made of only silver became smaller after 60 seconds of immersion, indicating that solder erosion had occurred, whereas the silver-based conductive member samples containing MAX or MXene did not change in size and did not exhibit solder erosion. 5, the comparative conductive member sample made only of silver lost mass, and this graph also shows that solder leaching occurred, as shown in the results of the above appearance observation. On the other hand, the conductive member samples containing MAX or MXene showed almost no change in mass, and did not suffer from solder leaching, as shown in the results of the above appearance observation. As shown in the graph of FIG. 5 and the photograph of FIG. 6, the conductive member samples containing MAX or MXene did not suffer from solder erosion. This is presumably because the presence of MAX or MXene together with the silver constituting the conductive member inhibits the silver from diffusing excessively to the tin side. In addition, since MAX and MXene have high electrical conductivity, there is no problem of the conductor resistance of the conductive member increasing. Furthermore, in the manufacture of the conductive member, MAX or MXene is added to the conventional metal powder for forming the conductive member, or the mixture is further made into a paste, and no chemical solution such as acid or alkali is used, so there is no problem of a decrease in the adhesive strength of the conductor to the substrate, and no problem of increased costs due to the addition of a plating process. In this embodiment, the conductive member sample was obtained by a method of manufacture by sintering, but this is not limited to this. For example, it is also possible to obtain a conductive member sample by kneading Ag paste, resin, and MXene powder or MAX particles obtained in the same manner as in Example 1-1 (1) and (2), printing the mixture on a substrate, and drying the mixture. In this way, among the particles of the layered material containing one or more layers, one or more of the conductive particles (MXene particles) and the second conductive particles (MAX particles) are useful for manufacturing conductive members and joint structures, and a joint structure in which the conductive particles are contained in a conductive member can exhibit high conductivity without solder erosion. The joint structure of the present disclosure may be used for any suitable application, and may be particularly preferably used for, for example, electrodes in electronic components. The disclosure of this specification may include the following aspects. <1> A joint structure having a first conductive member, a second conductive member, and a solder joint portion that joins the first conductive member and the second conductive member, At least one of the first conductive member and the second conductive member is Metal and (i) A particle of layered material comprising one or more layers, The layer has the following formula: M ｍ X ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body; and (ii) a compound of the formula: M ｍ AX ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; A is at least one Group 12, 13, 14, 15, or 16 element; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and one or more conductive particles among the second conductive particles represented by A joint structure comprising: <2> The bonded structure according to <1>, wherein the metal contained in at least one of the first conductive member and the second conductive member is one or more selected from the group consisting of silver, copper, gold, nickel, zinc, tin, platinum, and palladium. <3> The joint structure according to <1> or <2>, wherein the solder joint contains tin. <4> The joint structure according to any one of <1> to <3>, wherein the solder joint portion contains a resin. <5> (a) preparing a first conductive member and a second conductive member, At least one of the first conductive member and the second conductive member is Metal and (i) A particle of layered material comprising one or more layers, The layer has the following formula: M ｍX ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body; and (ii) a compound of the formula: M ｍ AX ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; A is at least one Group 12, 13, 14, 15, or 16 element; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and one or more conductive particles among the second conductive particles represented by Including, (b) soldering the first conductive member and the second conductive member together; A method for manufacturing a bonded structure comprising the steps of: <6> In the step (a), at least one of the first conductive member and the second conductive member is (a11)(i) Particles of layered material comprising one or more layers, The layer has the following formula: M ｍ X ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body; and (ii) a compound of the formula: M ｍ AX ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; A is at least one Group 12, 13, 14, 15, or 16 element; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. providing one or more second conductive particles represented by: (a12) mixing a conductive member-forming composition containing a metal constituting at least one of the first conductive member and the second conductive member and the conductive particles to obtain a conductive member-forming mixture; and (a13) molding the conductive member-forming mixture and firing it at a sinterable temperature. The method for producing a bonded structure according to <5>, comprising the steps of: <7> The method for producing a bonded structure according to <6>, wherein the composition for forming a conductive member further contains a resin. <8> In the step (a), at least one of the first conductive member and the second conductive member is (a21)(i) Particles of layered material comprising one or more layers, The layer has the following formula: M ｍ X ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body; and (ii) a compound of the formula: M ｍ AX ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; A is at least one Group 12, 13, 14, 15, or 16 element; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. providing one or more second conductive particles represented by: (a22) mixing a conductive member-forming composition containing a metal constituting at least one of the first conductive member and the second conductive member, the conductive particles, and a resin to obtain a conductive member-forming mixture; and (a23) Molding and drying the conductive member-forming mixture. The method for producing a bonded structure according to <5>, comprising the steps of: <9> A conductive member that is brought into contact with a solder material in a solder joint, Metal and (i) A particle of layered material comprising one or more layers, The layer has the following formula: M ｍ X ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body; and (ii) a compound of the formula: M ｍ AX ｎ wherein M is at least one Group 3, 4, 5, 6, or 7 metal; X is a carbon atom, a nitrogen atom, or a combination thereof; A is at least one Group 12, 13, 14, 15, or 16 element; n is 1 or more and 4 or less, m is greater than n and is equal to or less than 5. and one or more conductive particles among the second conductive particles represented by A conductive member for solder bonding comprising: <10> The conductive member for solder bonding according to <9>, further comprising a resin. <11> The conductive member for soldering according to <9> or <10>, wherein the metal is at least one selected from the group consisting of silver, copper, gold, nickel, zinc, tin, platinum, and palladium. <12> The conductive member for soldering according to any one of <9> to <11>, wherein a solder material containing tin is used for the soldering. <13> A structure for soldering, comprising the conductive member for soldering according to any one of <9> to <12> and a solder material to be brought into contact with the conductive member for soldering. This application claims priority from Japanese Patent Application No. 2022-156859, which is incorporated herein by reference. 1a, 1b layer body (MmXn layer) 3a, 5a, 3b, 5b Modification or terminal T 7a, 7b MXene layer 10a, 10b MXene particles (particles of layered material) 20 Mounting structure 21 Part body 23 Substrate 25 Electrode part 27a, 27b external electrodes 29a, 29b Solder joint 31 Solder materials 33 Solder joint (metal constituting conductive member and solder alloy alloy layer, intermetallic compound) 35A conductive material (MXene particles / no MAX particles) 35B Conductive material (with MXene particles / MAX particles) 36 Metal constituting conductive member 37 One or more of MXene particles and MAX particles 38. Diffusion of Solder Metal 39 Diffusion of metals constituting conductive members

Claims

1. A bonding structure having a first conductive member, a second conductive member, and a solder joint that bonds the first conductive member and the second conductive member, wherein at least one of the first conductive member and the second conductive member includes a metal and particles of a layered material including one or more layers, the bonding structure.

2. At least one of the first conductive member and the second conductive member is, a metal, and (i) particles of a layered material including one or more layers, wherein the layer has the following formula: M ｍ X ｎ (wherein M is at least one metal of Groups 3, 4, 5, 6, 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 or more and 4 or less, m is greater than n and 5 or less) including a layer body represented by and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body, a first conductive particle, and (ii) one or more conductive particles of a second conductive particle represented by the following formula: M ｍ AX ｎ (wherein M is at least one metal of Groups 3, 4, 5, 6, 7, X is a carbon atom, a nitrogen atom, or a combination thereof, A is at least one element of Groups 12, 13, 14, 15, 16, n is 1 or more and 4 or less, m is greater than n and 5 or less) including, the bonding structure according to claim 1.

3. The metal included in at least one of the first conductive member and the second conductive member is one or more selected from the group consisting of silver, copper, gold, nickel, zinc, tin, platinum, and palladium, the bonding structure according to claim 1 or 2.

4. The solder joint includes tin, the bonding structure according to claim 1 or 2.

5. The solder joint includes a resin, the bonding structure according to claim 1 or 2.

6. At least one of the first conductive member and the second conductive member is, a metal, and as particles of a layered material including one or more layers, includes one or more particles of graphene and graphene oxide, the bonding structure according to claim 1 or 2.

7. The first conductive member and the second conductive member do not include a resin, the bonding structure according to claim 1 or 2. ​

8. The bonding structure according to claim 1 or 2, wherein at least one of the first conductive member and the second conductive member is a sintered member of the metal and particles of a layered material including the one or more layers.

9. (a) preparing a first conductive member and a second conductive member, wherein at least one of the first conductive member and the second conductive member is a metal and (i) particles of a layered material including one or more layers, wherein the layer has the following formula: M ｍ X ｎ (wherein M is at least one metal of Groups 3, 4, 5, 6, and 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 or more and 4 or less, m is greater than n and 5 or less) and includes a layer body represented by the formula and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body, a first conductive particle, and (ii) one or more conductive particles of a second conductive particle represented by the following formula: M ｍ AX ｎ (wherein M is at least one metal of Groups 3, 4, 5, 6, and 7, X is a carbon atom, a nitrogen atom, or a combination thereof, A is at least one element of Groups 12, 13, 14, 15, and 16, n is 1 or more and 4 or less, m is greater than n and 5 or less) and includes, (b) soldering the first conductive member and the second conductive member. A method for manufacturing a bonding structure.

10. In (a) above, at least one of the first conductive member and the second conductive member is (a11) (i) particles of a layered material including one or more layers, wherein the layer has the following formula: M ｍ X ｎ (wherein M is at least one metal of Groups 3, 4, 5, 6, and 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 or more and 4 or less, m is greater than n and 5 or less) and includes a layer body represented by the formula and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body, a first conductive particle, and (ii) the following formula: M ｍ AX ｎ (wherein M is at least one metal of Groups 3, 4, 5, 6, and 7, X is a carbon atom, a nitrogen atom, or a combination thereof, A is at least one element of Groups 12, 13, 14, 15, and 16, n is 1 or more and 4 or less, m is greater than n and is 5 or less) preparing one or more conductive particles among the second conductive particles represented by) (a12) mixing a composition for forming a conductive member containing at least one metal constituting the first conductive member and the second conductive member and the conductive particles to obtain a mixture for forming a conductive member, and (a13) molding the mixture for forming a conductive member and firing it at a sinterable temperature The method for manufacturing a joined structure according to claim 9, which is prepared by a process including

11. The method for manufacturing a joined structure according to claim 10, wherein the composition for forming a conductive member further contains a resin.

12. In (a) above, at least one of the first conductive member and the second conductive member is (a21) (i) particles of a layered material including one or more layers, wherein the layer has the following formula: M ｍ X ｎ (In the formula, M is at least one metal of Groups 3, 4, 5, 6, and 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 or more and 4 or less, m is greater than n and is 5 or less) a first conductive particle including a layer main body represented by and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer main body, and (ii) the following formula: M ｍ AX ｎ (In the formula, M is at least one metal of Groups 3, 4, 5, 6, and 7, X is a carbon atom, a nitrogen atom, or a combination thereof, A is at least one element of Groups 12, 13, 14, 15, and 16, n is 1 or more and 4 or less, m is greater than n and is 5 or less) preparing one or more conductive particles among the second conductive particles represented by) (a22) mixing a composition for forming a conductive member containing at least one metal constituting the first conductive member and the second conductive member, the conductive particles, and a resin to obtain a mixture for forming a conductive member, and (a23) molding the mixture for forming a conductive member and drying it The method for manufacturing a joined structure according to claim 9, which is prepared by a process including

13. a conductive member that comes into contact with a solder material in a soldering joint, a metal, and (i) particles of a layered material including one or more layers, wherein the layer has the following formula: M ｍ X ｎ (In the formula, M is at least one metal of Groups 3, 4, 5, 6, and 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 or more and 4 or less, m is greater than n and 5 or less) a layer body represented by formula (I), and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body, and (ii) the following formula: M ｍ AX ｎ (wherein M is at least one metal of Groups 3, 4, 5, 6, and 7, X is a carbon atom, a nitrogen atom, or a combination thereof, A is at least one element of Groups 12, 13, 14, 15, and 16, n is 1 or more and 4 or less, m is greater than n and 5 or less) one or more conductive particles of the second conductive particles represented by formula (II), and a conductive member for soldering, comprising:

14. The conductive member for soldering according to claim 13, further comprising a resin.

15. The conductive member for soldering according to claim 13, wherein the metal is at least one selected from the group consisting of silver, copper, gold, nickel, zinc, tin, platinum, and palladium.

16. The conductive member for soldering according to claim 13, wherein a solder material containing tin is used for the soldering.

17. A soldering structure having the conductive member for soldering according to any one of claims 13 to 16 and a solder material brought into contact with the conductive member for soldering.