Jumper chip component

Abstract

This jumper chip component includes a substrate, an upper surface electrode, a protective film, and a plating layer. The substrate has electrical insulation properties. The upper surface electrode contains Au. The upper surface electrode is formed on the upper surface of the substrate. The protective film is formed on the upper surface of the upper surface electrode to expose an end portion of the upper surface electrode in a predetermined direction. The plating layer is formed to cover an end portion of the upper surface electrode and an end portion of the protective film in a predetermined direction.

Description

Jumper Chip Components

[0001] The present disclosure relates generally to jumper chip assemblies, and more particularly to jumper chip assemblies with top surface electrodes.

[0002] Patent Document 1 discloses a jumper resistor, which includes a substrate, a primary upper surface electrode layer, a secondary upper surface electrode layer, a protective layer, a Ni plating layer, and a solder plating layer.

[0003] The primary upper surface electrode layer is made of an Ag-based metal and is provided on the upper surface of the substrate. The secondary upper surface electrode layer is made of an Au-based metal and is provided so as to cover the primary upper surface electrode layer. The protective layer is made of a phenolic epoxy resin or the like and is provided on the upper surface of the secondary upper surface electrode layer. The Ni plating layer is provided so as to cover the exposed portion of the secondary upper surface electrode layer that is not covered by the protective layer. The solder plating layer is provided so as to cover the Ni plating layer.

[0004] Japanese Patent Application Laid-Open No. 2000-156304

[0005] In the jumper resistor (jumper chip component) disclosed in Patent Document 1, a secondary upper surface electrode (first upper surface electrode) is formed by firing on top of a primary upper surface electrode, which may result in the generation of an alloy layer due to interdiffusion between the primary upper surface electrode and the secondary upper surface electrode, resulting in an increase in electrical resistance value.

[0006] In the jumper resistor disclosed in Patent Document 1, contact between the secondary upper surface electrode (second upper surface electrode) and the solder plating layer may cause solder erosion.

[0007] A jumper chip component according to one aspect of the present disclosure comprises a substrate, an upper surface electrode, a protective film, and a plating layer. The substrate is electrically insulating. The upper surface electrode contains Au. The upper surface electrode is formed on the upper surface of the substrate. The protective film is formed on the upper surface of the upper surface electrode so as to expose an end of the upper surface electrode in a predetermined direction. The plating layer is formed so as to cover the end of the upper surface electrode and the end of the protective film in the predetermined direction.

[0008] According to the jumper chip component according to the above aspect of the present disclosure, it is possible to prevent the electrical resistance value from increasing.

[0009] A jumper chip component according to another aspect of the present disclosure comprises a substrate, a first upper surface electrode, a second upper surface electrode, a protective film, a third upper surface electrode, and a plating layer. The substrate is electrically insulating. The first upper surface electrode contains Ag. The first upper surface electrode is formed on the upper surface of the substrate. The second upper surface electrode contains Au. The second upper surface electrode is formed on the upper surface of the first upper surface electrode. The protective film is formed on the upper surface of the second upper surface electrode so as to expose an end portion of the second upper surface electrode in a predetermined direction. The third upper surface electrode is formed of a resin Ag paste. The third upper surface electrode is formed on the upper surface of the second upper surface electrode so as to cover the end portion of the second upper surface electrode. The plating layer is formed so as to cover the third upper surface electrode and the end portion of the protective film in the predetermined direction.

[0010] According to the jumper chip component according to the above aspect of the present disclosure, the occurrence of solder erosion can be suppressed.

[0011] Fig. 1 is a cross-sectional view of a jumper chip component according to embodiment 1. Fig. 2 is a cross-sectional view of a jumper chip component according to embodiment 2. Fig. 3 is a cross-sectional view of a jumper chip component according to embodiment 3.

[0012] Preferred embodiments of the present disclosure will be described in detail below with reference to the drawings. Elements common to the embodiments described below are designated by the same reference numerals, and redundant descriptions of the common elements may be omitted. The following embodiment is merely one of various embodiments of the present disclosure. Various modifications of the embodiment may be made depending on the design, etc., as long as the object of the present disclosure can be achieved. Furthermore, the embodiments (including modified examples) may be realized in appropriate combinations.

[0013] The drawings described in this disclosure are schematic drawings, and the ratios of the sizes and thicknesses of the components in the drawings do not necessarily reflect the actual dimensional ratios.

[0014] In addition, the term "orthogonal (perpendicular)" as used herein not only refers to a state in which the angle between two things is exactly 90 degrees, but also refers to a state in which two things intersect within a certain range of difference. In other words, the angle between two orthogonal things falls within a certain range of difference from 90 degrees (for example, 10 degrees or less). In other words, the term "orthogonal" as used herein includes cases in which the angle between two things is between 80 degrees and 100 degrees. Similarly, the term "parallel" as used herein also includes not only a state in which two things do not strictly intersect, but also a state in which two things are lined up within a certain range of difference. For example, the term "parallel" as used herein includes cases in which one thing is inclined at an angle of 10 degrees or less relative to the other. In other words, the term "parallel" as used herein includes cases in which the angle between one thing and the other is between -10 degrees and 10 degrees.

[0015] (First Embodiment) (1.1) Overview First, an overview of a jumper chip component 1 according to a first embodiment will be described with reference to FIG.

[0016] The jumper chip component 1 of the first embodiment includes a substrate 2 , an upper surface electrode (first upper surface electrode 4 ), a protective film (second protective film 82 ), and a pair of plating layers 9 .

[0017] The substrate 2 has electrical insulation properties.

[0018] The first upper surface electrode 4 contains Au (gold) and is formed on the upper surface 21 of the substrate 2 .

[0019] The second protective film 82 is formed on the upper surface 41 of the first upper surface electrode 4. The second protective film 82 is formed so as to expose the end portion 41a of the first upper surface electrode 4 in a predetermined direction.

[0020] The plating layer 9 is formed so as to cover the end 41 a of the first upper surface electrode 4 and the end 82 a of the second protective film 82 in a predetermined direction.

[0021] In addition, the term "cover" as used in this disclosure includes not only directly covering a certain member, but also indirectly covering the certain member via another member.

[0022] According to the jumper chip component 1 of the first embodiment, the Au-based first upper surface electrode 4 is formed directly on the upper surface 21 of the substrate 2, and no Ag (silver)-based upper surface electrode is formed between the first upper surface electrode 4 and the substrate 2. Therefore, according to the jumper chip component 1 of the first embodiment, an alloy layer due to interdiffusion between the Au-based first upper surface electrode 4 and the Ag-based upper surface electrode is not generated, and therefore an increase in the electrical resistance value of the jumper chip component 1 can be suppressed. Furthermore, because the first upper surface electrode 4 is Au-based, the sulfuration resistance of the jumper chip component 1 can be ensured.

[0023] (1.2) Details The detailed configuration of the jumper chip component 1 according to the first embodiment will be described below with reference to FIG.

[0024] The jumper chip component 1 is mounted on, for example, a printed circuit board. More specifically, the jumper chip component 1 is configured so as to be connectable to a conductor pattern formed on the printed circuit board. The electrical resistance value of the jumper chip component 1 is, for example, several mΩ to several tens of mΩ. The overall shape of the jumper chip component 1 of the first embodiment is a rectangular parallelepiped.

[0025] In the following description, as an example, three mutually orthogonal axes, the X-axis, the Y-axis, and the Z-axis, are set as shown in FIG. 1 . Here, the axis along the longitudinal direction of the long jumper chip component 1 is referred to as the "X-axis," and the axis along the thickness direction is referred to as the "Z-axis." The axis along the short-side direction of the jumper chip component 1 is referred to as the "Y-axis." In the following description, the direction along the X-axis may be referred to as the "predetermined direction." The direction along the Z-axis may be simply referred to as the "vertical direction," with the positive side of the Z-axis referred to as "upward" and the negative side of the Z-axis referred to as "downward." The predetermined direction may also be the direction along the short-side direction (Y-axis) of the jumper chip component 1. For example, the predetermined direction is the direction along the direction of current flowing through the jumper chip component 1 when the jumper chip component 1 is mounted on a printed circuit board.

[0026] The X-axis, Y-axis, and Z-axis are all imaginary axes, and the arrows indicating "X," "Y," and "Z" in the drawings are merely shown for the purpose of explanation and do not have any physical substance. Furthermore, these directions are not shown with the intention of limiting the direction in which the jumper chip component 1 is used.

[0027] (1.2.1) Overall Structure As shown in FIG. 1, the jumper chip component 1 comprises a substrate 2, an upper surface electrode (first upper surface electrode 4), a pair of end surface electrodes 6, a pair of lower surface electrodes 7, a first protective film 81, a second protective film 82, and a pair of plating layers 9.

[0028] (1.2.2) Substrate The substrate 2 has electrical insulation properties. The substrate 2 is, for example, a ceramic substrate. The shape of the substrate 2 is a rectangular parallelepiped that is flat in the Z-axis direction and long in the X-axis direction.

[0029] The substrate 2 has an upper surface 21, a pair of side surfaces 22, and a lower surface 23. The lower surface 23 is the surface that faces the printed circuit board when the jumper chip component 1 is mounted on the printed circuit board. One of the pair of side surfaces 22 is the side surface on the first end 20a side in a predetermined direction of the substrate 2, and the other of the pair of side surfaces 22 is the side surface on the second end 20b side in the predetermined direction of the substrate 2. The normal to the upper surface 21 and the normal to the lower surface 23 are along the Z axis (parallel to the Z axis). The normal to the pair of side surfaces 22 is along the X axis.

[0030] (1.2.3) First Upper Surface Electrode The first upper surface electrode 4 is a rectangular sheet and is provided directly on the upper surface 21 of the substrate 2. The first upper surface electrode 4 can be formed thinly by printing and firing a conductive paste whose main component is, for example, Au. The first upper surface electrode 4 is formed on the upper surface 21 of the substrate 2, extending from the first end 20a to the second end 20b of the substrate 2. As an example, the first upper surface electrode 4 has approximately the same shape and area as the upper surface 21 of the substrate 2 when viewed along the Z axis. In short, the first upper surface electrode 4 is formed so as to cover substantially the entire upper surface 21 of the substrate 2.

[0031] By covering the upper surface 21 of the substrate 2 with the first upper surface electrode 4 containing Au, the sulfuration resistance of the jumper chip component 1 can be improved.

[0032] (1.2.4) First Protective Film The first protective film 81 covers a portion of the upper surface 41 of the first upper surface electrode 4. More specifically, the first protective film 81 is formed on the upper surface 41 of the first upper surface electrode 4 so as to expose a pair of ends 41a in a predetermined direction of the first upper surface electrode 4 and a peripheral region 41c of the ends 41a. The peripheral region 41c is a region of the upper surface 41 of the first upper surface electrode 4 that is connected to the ends 41a and surrounds the ends 41a. The first protective film 81 can be formed, for example, by printing and firing a glass paste.

[0033] (1.2.5) Second Protective Film The second protective film 82 covers a portion of the upper surface 41 of the first upper surface electrode 4 and the first protective film 81. More specifically, the second protective film 82 covers the peripheral region 41c of the end 41a of the first upper surface electrode 4 and the first protective film 81. In other words, the second protective film 82 is formed on the upper surface 41 of the first upper surface electrode 4 so as to expose the end 41a of the first upper surface electrode 4. The second protective film 82 can be formed, for example, by printing and baking an epoxy resin paste.

[0034] Furthermore, the provision of the second protective film 82 (protective film) makes it easier to determine the front and back sides of the jumper chip component 1, for example, during the mounting process of the jumper chip component 1. This contributes to improving productivity. The determination of the front and back sides here includes not only a determination of the front and back sides made by a person's visual inspection, but also an automatic determination of the front and back sides made by identifying an appearance image obtained by capturing an image of the jumper chip component 1 using a production management system.

[0035] (1.2.6) Lower Electrodes A pair of lower electrodes 7 are formed on the lower surface 23 of the substrate 2. The lower electrodes 7 are rectangular sheets and are provided directly on the lower surface 23 of the substrate 2. The lower electrodes 7 can be formed thinly by printing and firing a conductive paste primarily composed of Ag or the like. The lower electrodes 7 may also be formed by applying and curing a resin Ag paste. The resin Ag paste is a paste made by kneading resin and Ag powder. One of the pair of lower electrodes 7 is formed on the first end 20a side of the substrate 2, and the other of the pair of lower electrodes 7 is formed on the second end 20b side of the substrate 2. When viewed along the Z axis, a portion of the lower electrodes 7 overlaps the end 41a of the first upper electrode 4, and a portion of the lower electrodes 7 overlaps the second protective film 82.

[0036] (1.2.7) End Electrodes A pair of end electrodes 6 are formed to correspond one-to-one with a pair of side surfaces 22 of the substrate 2. The end electrodes 6 are provided directly on the side surfaces 22 of the substrate 2 so as to electrically connect the end portions 41a of the first upper surface electrodes 4 and the lower surface electrodes 7. The end electrode 6 has a substantially U-shaped cross section taken along the XZ plane.

[0037] The end surface electrodes 6 can be formed thinly by printing and baking a conductive paste containing Ag as a main component, for example. The end surface electrodes 6 may also be formed by applying and curing a resin Ag paste.

[0038] The provision of the pair of end electrodes 6 in the jumper chip component 1 improves the stress resistance of the jumper chip component 1 after the jumper chip component 1 is mounted on a printed circuit board, and also improves the adhesive strength of the first plating layer 91 to the first upper electrode 4 and the lower electrode 7.

[0039] (1.2.8) Plating Layers The pair of plating layers 9 are formed to correspond one-to-one to the pair of side surfaces 22 of the substrate 2. Each of the pair of plating layers 9 has a first plating layer 91 and a second plating layer 92.

[0040] By providing the jumper chip component 1 with the plating layer 9, the number of current paths increases, and it is possible to prevent the electrical resistance value of the jumper chip component 1 from increasing.

[0041] (1.2.9) First Plating Layer The first plating layer 91 contains Ni (nickel) and is conductive. The first plating layer 91 is a thin film layer. The first plating layer 91 corresponds to a nickel plating layer. The first plating layer 91 is formed to cover the end surface electrode 6, the lower surface electrode 7, the end 41 a of the first upper surface electrode 4, and the end 82 a of the second protective film 82. The first plating layer 91 of the first embodiment is formed to cover substantially the entire outer surfaces of the end surface electrode 6, the lower surface electrode 7, and the end 41 a of the first upper surface electrode 4.

[0042] (1.2.10) Second Plating Layer The second plating layer 92 contains Sn (tin) and is conductive. The second plating layer 92 is a thin film layer. The second plating layer 92 corresponds to a tin plating layer. The second plating layer 92 is formed to cover the first plating layer 91. The second plating layer 92 of the first embodiment is formed to cover substantially the entire outer surface of the first plating layer 91.

[0043] (1.3) Modifications Modifications of the first embodiment are listed below.

[0044] In the first embodiment, the jumper chip component 1 has a shape that is elongated in one direction (X axis). However, the shape of the jumper chip component 1 is not particularly limited, and may be, for example, a square shape when viewed along the thickness direction (Z axis).

[0045] In the first embodiment, the jumper chip component 1 is exemplified as having the first plating layer 91 and the second plating layer 92 as the plating layer 9. However, the jumper chip component 1 may, for example, have only the second plating layer 92 as the plating layer 9. When the jumper chip component 1 has only the second plating layer 92 as the plating layer 9, for example, the second plating layer 92 is formed so as to cover substantially the entire outer surfaces of the end surface electrodes 6, the lower surface electrodes 7, the end portions 41 a of the first upper surface electrodes 4, and the end portions 82 a of the second protective film 82.

[0046] Second Embodiment Next, a jumper chip component 1 according to a second embodiment will be described with reference to FIG.

[0047] As shown in FIG. 2, the jumper chip component 1 according to the second embodiment further includes a pair of second upper surface electrodes 5 .

[0048] The pair of second top-surface electrodes 5 are formed to correspond one-to-one with the pair of end portions 41 a of the first top-surface electrode 4. The second top-surface electrodes 5 are formed on the top surface 41 of the first top-surface electrode 4 so as to cover the end portions 41 a of the first top-surface electrode 4. That is, the second top-surface electrodes 5 are formed between the end portions 41 a of the first top-surface electrode 4 and the first plating layer 91 in the Z-axis direction, which is the thickness direction of the substrate 2. For example, the second top-surface electrodes 5 are formed by applying and curing a resin Ag paste. By forming the second top-surface electrodes 5 without firing, the generation of an alloy layer due to interdiffusion between the second top-surface electrode 5 and the first top-surface electrode 4 is suppressed. By suppressing the generation of an alloy layer due to interdiffusion between the second top-surface electrode 5 and the first top-surface electrode 4, an increase in the electrical resistance of the jumper chip component 1 can be suppressed.

[0049] According to the jumper chip component 1 of embodiment 2, the end 41 a of the Au-based first upper surface electrode 4 is covered by the second upper surface electrode 5 formed from a resin Ag paste, thereby suppressing the occurrence of solder erosion due to contact between the end 41 a of the first upper surface electrode 4 and the plating layer 9.

[0050] The pair of second upper surface electrodes 5 are formed on the upper surface of the second protective film 82 so as to cover a pair of ends 82 a in a predetermined direction of the second protective film 82. In other words, a part of the second upper surface electrode 5 is formed so as to cover the ends 82 a of the second protective film 82.

[0051] When viewed along the Z axis, the second upper surface electrode 5 has approximately the same shape and area as the end 41 a of the first upper surface electrode 4. However, because the second upper surface electrode 5 covers the end 82 a of the second protective film 82, the area of ​​the second upper surface electrode 5 is slightly larger than that of the end 41 a of the first upper surface electrode 4 when viewed along the Z axis.

[0052] The first plating layer 91 of the second embodiment is formed so as to cover the end surface electrode 6, the lower surface electrode 7, the second upper surface electrode 5, and the end portion 82 a of the second protective film 82. The first plating layer 91 of the second embodiment is formed so as to cover almost the entire outer surfaces of the end surface electrode 6, the lower surface electrode 7, and the second upper surface electrode 5.

[0053] The second plating layer 92 of the second embodiment is formed so as to cover the first plating layer 91. The second plating layer 92 of the second embodiment is formed so as to cover almost the entire outer surface of the first plating layer 91.

[0054] Here, a portion of the second upper surface electrode 5 in the second embodiment is bonded to the end 82a of the second protective film 82. Because the second upper surface electrode 5 and the end 82a of the second protective film 82 are bonded to each other, it is possible to prevent the second plating layer 92 covering the second upper surface electrode 5 from contacting the end 41a of the first upper surface electrode 4 through the boundary between the first plating layer 91 and the second protective film 82 and the boundary between the second upper surface electrode 5 and the second protective film 82. In other words, because the second upper surface electrode 5 and the end 82a of the second protective film 82 are bonded to each other, it is possible to further prevent solder erosion caused by contact between the end 41a of the first upper surface electrode 4 and the second plating layer 92 (plating layer 9).

[0055] The second protective film 82 in the second embodiment is formed by, for example, printing and baking an epoxy resin paste. Since the second protective film 82 is formed of the epoxy resin, it is possible to ensure the adhesion strength (separation strength) of the joint between the second protective film 82 and the second upper surface electrode 5 formed of the resin Ag paste.

[0056] (Summary) As described above, the jumper chip component (1) according to the first aspect includes a substrate (2), an upper surface electrode (first upper surface electrode 4), a protective film (second protective film 82), and a plating layer (9). The substrate (2) is electrically insulating. The upper surface electrode contains Au. The upper surface electrode is formed on the upper surface of the substrate (2). The protective film is formed on the upper surface (41) of the upper surface electrode so as to expose an end (41a) of the upper surface electrode in a predetermined direction. The plating layer (9) is formed so as to cover the end (41a) of the upper surface electrode and the end (82a) of the protective film in a predetermined direction.

[0057] According to this embodiment, the Au-based top electrode (first top electrode 4) is formed directly on the top surface (41) of the substrate (2), and no Ag (silver)-based top electrode (second top electrode 5) is formed between the top electrode and the substrate (2). Therefore, an alloy layer due to interdiffusion between the Au-based top electrode and the Ag-based top electrode is not formed, which prevents the electrical resistance of the jumper chip component (1) from increasing. Furthermore, because the top electrode is Au-based, the sulfuration resistance of the jumper chip component (1) can be ensured.

[0058] The jumper chip component (1) according to the second aspect is the same as that of the first aspect, and further includes a second upper surface electrode (5). The second upper surface electrode (5) is formed of a resin Ag paste. The second upper surface electrode (5) is formed on the upper surface (41) of the first upper surface electrode (4) so ​​as to cover the end portion (41a) of the first upper surface electrode (4), which is the upper surface electrode. The second upper surface electrode (5) is formed between the first upper surface electrode (4) and the plating layer (9).

[0059] According to this aspect, the end (41 a) of the Au-based first upper surface electrode (4) is covered with the second upper surface electrode (5) formed of resin Ag paste, so that it is possible to suppress the occurrence of solder erosion due to contact between the end (41 a) of the first upper surface electrode (4) and the plating layer (9).

[0060] In the jumper chip component (1) according to the third aspect, in the second aspect, a part of the second upper surface electrode (5) is joined to the end (82a) of the protective film (second protective film 82).

[0061] According to this aspect, it is possible to further suppress the occurrence of solder erosion due to contact between the end (41a) of the first upper surface electrode (4) and the plating layer (9).

[0062] In the jumper chip part (1) according to the fourth aspect, in the second or third aspect, the protective film (second protective film 82) is formed of an epoxy resin.

[0063] According to this aspect, since the protective film (second protective film 82) is formed from an epoxy resin, it is possible to ensure the adhesion strength (separation strength) of the joint between the protective film and the second upper surface electrode (5) formed from a resin Ag paste.

[0064] The jumper chip component (1) according to the fifth aspect is the jumper chip component (1) of any one of the first to fourth aspects, further comprising a bottom electrode (7) and an edge electrode (6). The bottom electrode (7) is formed on the bottom surface (23) of the substrate (2). The edge electrode (6) electrically connects the top electrode (first top electrode 4) and the bottom electrode (7).

[0065] According to this embodiment, the jumper chip component (1) is provided with the end surface electrodes (6), which improves the stress resistance of the jumper chip component (1) after it is mounted on a printed circuit board. Also, the adhesive strength of the plating layer to the upper surface electrode (first upper surface electrode 4) and the lower surface electrode (7) is improved.

[0066] In a jumper chip component (1) according to a sixth aspect, in any one of the first to fifth aspects, the plating layer (9) has a first plating layer (91) and a second plating layer (92). The first plating layer (91) contains Ni. The first plating layer (91) is formed so as to cover the end (41a) of the top electrode (first top electrode 4) and the end (82a) of the protective film (second protective film 82). The second plating layer (92) contains Sn. The second plating layer (92) is formed so as to cover the first plating layer (91).

[0067] According to this aspect, by providing the jumper chip component (1) with the first plating layer (91) and the second plating layer (92), the number of current paths increases, and the electrical resistance value of the jumper chip component (1) can be prevented from increasing.

[0068] The configurations other than the first aspect are not essential for the jumper chip component (1) and can be omitted as appropriate.

[0069] (Embodiment 3) (3.1) Overview First, an overview of the jumper chip part 101 according to this embodiment will be described with reference to FIG.

[0070] The jumper chip component 101 of this embodiment comprises a substrate 102, a first upper surface electrode 103, a second upper surface electrode 104, a pair of third upper surface electrodes 105, a protective film (second protective film 182), and a pair of plating layers 109.

[0071] The substrate 102 has electrical insulating properties.

[0072] The first upper surface electrode 103 contains Ag (silver) and is formed on the upper surface 121 of the substrate 102 .

[0073] The second upper surface electrode 104 contains Au (gold) and is formed on the upper surface 131 of the first upper surface electrode 103 .

[0074] The second protective film 182 is formed on the upper surface 141 of the second upper surface electrode 104. The second protective film 182 is formed so as to expose an end 141a of the second upper surface electrode 104 in a predetermined direction.

[0075] The third upper surface electrode 105 is formed of a resin Ag paste. The third upper surface electrode 105 is formed on the upper surface 141 of the second upper surface electrode 104. The third upper surface electrode 105 is formed so as to cover the end portion 141 a of the second upper surface electrode 104.

[0076] The plating layer 109 is formed to cover the third upper surface electrode 105 and an end portion 182 a of the second protective film 182 in a predetermined direction.

[0077] In addition, the term "cover" as used in this disclosure includes not only directly covering a certain member, but also indirectly covering the certain member via another member.

[0078] According to the jumper chip component 101 of this embodiment, the end 141a of the Au-based second upper surface electrode 104 is covered by the third upper surface electrode 105 formed from a resin Ag paste, thereby suppressing the occurrence of solder erosion due to contact between the end 141a of the second upper surface electrode 104 and the plating layer 109.

[0079] (3.2) Details The detailed configuration of the jumper chip part 101 according to this embodiment will be described below with reference to FIG.

[0080] The jumper chip component 101 is mounted on, for example, a printed circuit board. More specifically, the jumper chip component 101 is configured so that it can be bonded to a conductor pattern formed on the printed circuit board. The electrical resistance value of the jumper chip component 101 is, for example, several mΩ to several tens of mΩ. The overall shape of the jumper chip component 101 of this embodiment is a rectangular parallelepiped.

[0081] In the following description, as an example, three mutually orthogonal axes, the X-axis, the Y-axis, and the Z-axis, are set as shown in FIG. 3 . Here, the axis along the longitudinal direction of the long jumper chip component 101 is referred to as the "X-axis," and the axis along the thickness direction is referred to as the "Z-axis." The axis along the short-side direction of the jumper chip component 101 is referred to as the "Y-axis." In the following description, the direction along the X-axis may be referred to as the "predetermined direction." The direction along the Z-axis may be simply referred to as the "vertical direction," with the positive side of the Z-axis referred to as "upward" and the negative side of the Z-axis referred to as "downward." The predetermined direction may also be the direction along the short-side direction (Y-axis) of the jumper chip component 101. For example, the predetermined direction is the direction along the direction of current flowing through the jumper chip component 101 when the jumper chip component 101 is mounted on a printed circuit board.

[0082] The X-axis, Y-axis, and Z-axis are all imaginary axes, and the arrows indicating "X," "Y," and "Z" in the drawings are merely shown for the purpose of explanation and do not have any physical substance. Furthermore, these directions are not shown with the intention of limiting the direction in which the jumper chip component 101 is used.

[0083] (3.2.1) Overall structure As shown in FIG. 3, the jumper chip component 101 comprises a substrate 102, a first upper surface electrode 103, a second upper surface electrode 104, a pair of third upper surface electrodes 105, a pair of end surface electrodes 106, a pair of lower surface electrodes 107, a first protective film 181, a second protective film 182, and a pair of plating layers 109.

[0084] (3.2.2) Substrate The substrate 102 has electrical insulation properties. The substrate 102 is, for example, a ceramic substrate. The shape of the substrate 102 is a rectangular parallelepiped that is flat in the Z-axis direction and long in the X-axis direction.

[0085] The substrate 102 has an upper surface 121, a pair of side surfaces 122, and a lower surface 123. The lower surface 123 is the surface that faces the printed circuit board when the jumper chip component 101 is mounted on the printed circuit board. One of the pair of side surfaces 122 is the side surface on the first end 120a side in a predetermined direction of the substrate 102, and the other of the pair of side surfaces 122 is the side surface on the second end 120b side in the predetermined direction of the substrate 102. The normal to the upper surface 121 and the normal to the lower surface 123 are along the Z axis (parallel to the Z axis). The normal to the pair of side surfaces 122 is along the X axis.

[0086] (3.2.3) First Top Electrode The first top electrode 103 is a rectangular sheet and is provided directly on the top surface 121 of the substrate 102. The first top electrode 103 can be formed thinly by, for example, printing and baking a conductive paste primarily composed of Ag or the like. The first top electrode 103 may also be formed by applying and curing a resin Ag paste. The first top electrode 103 is formed on the top surface 121 of the substrate 102, extending from the first end 120a to the second end 120b of the substrate 102. As an example, the first top electrode 103 has approximately the same shape and area as the top surface 121 of the substrate 102 when viewed along the Z axis. In other words, the first top electrode 103 is formed to substantially cover the entire top surface 121 of the substrate 102.

[0087] By providing the jumper chip component 101 with the first upper surface electrode 103 containing Ag, the thickness of the second upper surface electrode 104 containing Au can be made thinner than when the jumper chip component 101 does not have the first upper surface electrode 103. For example, by making the second upper surface electrode 104 containing Au thinner, the manufacturing cost of the jumper chip component 101 can be reduced.

[0088] (3.2.4) Second Top Electrode The second top electrode 104 is a rectangular sheet and is provided directly on the top surface 131 of the first top electrode 103. The second top electrode 104 can be formed thinly by printing and firing a conductive paste whose main component is, for example, Au. The second top electrode 104 is formed on the top surface 131 of the first top electrode 103, extending from the first end to the second end in a predetermined direction. When viewed along the Z axis, the second top electrode 104 has approximately the same shape and area as the top surface 131 of the first top electrode 103. In other words, the second top electrode 104 is formed so as to cover substantially the entire top surface 131 of the first top electrode 103.

[0089] By covering the upper surface 131 of the first upper surface electrode 103 with the second upper surface electrode 104 containing Au, the sulfuration resistance of the jumper chip component 101 can be improved.

[0090] (3.2.5) First Protective Film The first protective film 181 covers a portion of the upper surface 141 of the second upper surface electrode 104. More specifically, the first protective film 181 is formed on the upper surface 141 of the second upper surface electrode 104 so as to expose a pair of ends 141a in a predetermined direction of the second upper surface electrode 104 and a peripheral region 141c of the ends 141a. The peripheral region 141c is a region of the upper surface 141 of the first upper surface electrode 104 that is connected to the ends 141a and surrounds the ends 141a. The first protective film 181 can be formed, for example, by printing and firing a glass paste.

[0091] (3.2.6) Second Protective Film The second protective film 182 covers a portion of the upper surface 141 of the second upper surface electrode 104 and the first protective film 181. More specifically, the second protective film 182 covers the peripheral region 141c of the end portion 141a of the second upper surface electrode 104 and the first protective film 181. In other words, the second protective film 182 is formed on the upper surface 141 of the second upper surface electrode 104 so as to expose the end portion 141a of the second upper surface electrode 104. The second protective film 182 can be formed, for example, by printing and baking an epoxy resin paste.

[0092] Since the second protective film 182 is formed from an epoxy resin, it is possible to ensure adhesion (separation strength) at the joint between the second protective film 182 and the third upper surface electrode 105 formed from a resin Ag paste.

[0093] Furthermore, the provision of the second protective film 182 (protective film) makes it easier to determine the front and back sides of the jumper chip component 101, for example, during the mounting process of the jumper chip component 101. This contributes to improving productivity. The determination of the front and back sides here includes not only a determination of the front and back sides made by a person's visual inspection, but also an automatic determination of the front and back sides made by identifying an appearance image obtained by capturing an image of the jumper chip component 101 using a production management system.

[0094] (3.2.7) Third Top Electrode The pair of third top electrodes 105 are formed to correspond one-to-one with the pair of end portions 141a of the second top electrode 104. The third top electrode 105 is formed on the top surface 141 of the second top electrode 104 so as to cover the end portions 141a of the second top electrode 104. For example, the third top electrode 105 is formed by applying and curing a resin Ag paste. By forming the third top electrode 105 without firing, the generation of an alloy layer due to interdiffusion between the third top electrode 105 and the second top electrode 104 is suppressed. By suppressing the generation of an alloy layer due to interdiffusion between the third top electrode 105 and the second top electrode 104, an increase in the electrical resistance of the jumper chip component 101 can be suppressed.

[0095] Furthermore, the pair of third upper surface electrodes 105 are formed on the upper surface of the second protective film 182 so as to cover a pair of ends 182a of the second protective film 182 in a predetermined direction. That is, a portion of the third upper surface electrode 105 is formed so as to cover the ends 182a of the second protective film 182. A portion of the third upper surface electrode 105 is joined to the ends 182a of the second protective film 182. Because the third upper surface electrode 105 is joined to the ends 182a of the second protective film 182, it is possible to prevent the second plating layer 192 (described later) covering the third upper surface electrode 105 from coming into contact with the ends 141a of the second upper surface electrode 104 through the boundary between the first plating layer 191 and the second protective film 182 (described later) and the boundary between the third upper surface electrode 105 and the second protective film 182. In other words, by joining the third upper surface electrode 105 and the end 182a of the second protective film 182, the occurrence of solder erosion due to contact between the end 141a of the second upper surface electrode 104 and the second plating layer 192 (plating layer 109) can be further suppressed.

[0096] When viewed along the Z axis, the third upper surface electrode 105 has approximately the same shape and area as the end 141a of the second upper surface electrode 104. However, because the third upper surface electrode 105 covers the end 182a of the second protective film 182, the area of ​​the third upper surface electrode 105 is slightly larger than that of the end 141a of the second upper surface electrode 104 when viewed along the Z axis.

[0097] (3.2.8) Lower Electrodes A pair of lower electrodes 107 are formed on the lower surface 123 of the substrate 102. The lower electrodes 107 are rectangular sheets and are provided directly on the lower surface 123 of the substrate 102. The lower electrodes 107 can be formed thinly by printing and baking a conductive paste primarily composed of Ag or the like. The lower electrodes 107 may also be formed by applying and curing a resin Ag paste. One of the pair of lower electrodes 107 is formed on the first end 120a side of the substrate 102, and the other of the pair of lower electrodes 107 is formed on the second end 120b side of the substrate 102. When viewed along the Z axis, a portion of the lower electrodes 107 overlaps with the third upper surface electrode 105, and a portion of the lower electrodes 107 overlaps with the second protective film 182.

[0098] (3.2.9) End Electrodes The pair of end electrodes 106 are formed to correspond one-to-one with the pair of side surfaces 122 of the substrate 102. The end electrodes 106 are provided directly on the side surfaces 122 of the substrate 102 so as to electrically connect the third upper surface electrode 105 and the lower surface electrode 107. The end electrode 106 has a substantially U-shaped cross section taken along the XZ plane.

[0099] The end surface electrodes 106 can be formed thinly by printing and baking a conductive paste containing Ag as a main component, for example. The end surface electrodes 106 may also be formed by applying and curing a resin Ag paste.

[0100] The provision of the pair of end surface electrodes 106 in the jumper chip component 101 improves the stress resistance of the jumper chip component 101 after the jumper chip component 101 is mounted on a printed circuit board. Also, the adhesive strength of the first plating layer 191 to the third upper surface electrode 105 and the lower surface electrode 107 is improved.

[0101] (3.2.10) Plating Layer The pair of plating layers 109 are formed to correspond one-to-one to the pair of side surfaces 122 of the substrate 102. Each of the pair of plating layers 109 has a first plating layer 191 and a second plating layer 192.

[0102] By providing the jumper chip component 101 with the plating layer 109, the number of current paths increases, and it is possible to prevent the electrical resistance value of the jumper chip component 101 from increasing.

[0103] (3.2.11) First Plating Layer The first plating layer 191 contains Ni (nickel) and is conductive. The first plating layer 191 is a thin film layer. The first plating layer 191 corresponds to a nickel plating layer. The first plating layer 191 is formed so as to cover the end electrode 106, the lower electrode 107, the third upper electrode 105, and the end 182a of the second protective film 182. In this embodiment, the first plating layer 191 is formed so as to cover substantially the entire outer surfaces of the end electrode 106, the lower electrode 107, and the third upper electrode 105.

[0104] (3.2.12) Second Plating Layer The second plating layer 192 contains Sn (tin) and is conductive. The second plating layer 192 is a thin film layer. The second plating layer 192 corresponds to a tin plating layer. The second plating layer 192 is formed to cover the first plating layer 191. In this embodiment, the second plating layer 192 is formed to cover substantially the entire outer surface of the first plating layer 191.

[0105] (3.3) Modifications Modifications of the above embodiment are listed below.

[0106] In the above embodiment, the jumper chip component 101 has a shape that is elongated in one direction (X axis). However, the shape of the jumper chip component 101 is not particularly limited, and may be, for example, a square shape when viewed along the thickness direction (Z axis).

[0107] In the above embodiment, the jumper chip component 101 includes the first plating layer 191 and the second plating layer 192 as the plating layer 109. However, the jumper chip component 101 may include, for example, only the second plating layer 192 as the plating layer 109. When the jumper chip component 101 includes only the second plating layer 192 as the plating layer 109, for example, the second plating layer 192 is formed so as to cover substantially the entire outer surfaces of the end surface electrode 106, the lower surface electrode 107, the third upper surface electrode 105, and the end portion 182a of the second protective film 182.

[0108] (Summary) As described above, the jumper chip component (101) according to the seventh aspect comprises a substrate (102), a first upper surface electrode (103), a second upper surface electrode (104), a protective film (second protective film 182), a third upper surface electrode (105), and a plating layer (109). The substrate (102) is electrically insulating. The first upper surface electrode (103) contains Ag. The first upper surface electrode (103) is formed on the upper surface (121) of the substrate (102). The second upper surface electrode (104) contains Au. The second upper surface electrode (104) is formed on the upper surface (131) of the first upper surface electrode (103). The protective film is formed on the upper surface (141) of the second upper surface electrode (104) so ​​as to expose an end (141a) of the second upper surface electrode (104) in a predetermined direction. The third upper surface electrode (105) is formed of a resin Ag paste. The third upper surface electrode (105) is formed on the upper surface (141) of the second upper surface electrode (104) so ​​as to cover the end (141a) of the second upper surface electrode (104). The plating layer (109) is formed so as to cover the third upper surface electrode (105) and an end (182a) of the protective film in a predetermined direction.

[0109] According to this aspect, the end (141 a) of the Au-based second upper surface electrode (104) is covered with the third upper surface electrode (105) formed of resin Ag paste, thereby making it possible to suppress the occurrence of solder erosion due to contact between the end (141 a) of the second upper surface electrode (104) and the plating layer (109).

[0110] In the jumper chip component (101) according to the eighth aspect, in the first aspect, a part of the third upper surface electrode (105) is joined to the end (182a) of the protective film (second protective film 182).

[0111] According to this aspect, it is possible to further suppress the occurrence of solder erosion due to contact between the end (141a) of the second upper surface electrode (104) and the plating layer (109).

[0112] In the jumper chip part (101) according to the ninth aspect, in the seventh or eighth aspect, the protective film (second protective film 182) is formed of an epoxy resin.

[0113] According to this aspect, it is possible to ensure the adhesion (separation strength) of the joint between the protective film (second protective film 182) and the third upper surface electrode (105) formed of resin Ag paste.

[0114] A jumper chip component (101) according to a tenth aspect is any one of the seventh to ninth aspects, further comprising a bottom electrode (107) and an edge electrode (106). The bottom electrode (107) is formed on the bottom surface (123) of the substrate (102). The edge electrode (106) electrically connects the third top electrode (105) and the bottom electrode (107).

[0115] According to this aspect, the stress resistance of the jumper chip component (101) after it is mounted on the printed circuit board is improved.

[0116] In a jumper chip component (101) according to an eleventh aspect, in any one of the seventh to tenth aspects, the plating layer (109) has a first plating layer (191) and a second plating layer (192). The first plating layer (191) contains Ni. The first plating layer (191) is formed so as to cover the third upper surface electrode (105) and the end portion (182a) of the protective film (second protective film 182). The second plating layer (192) contains Sn. The second plating layer (192) is formed so as to cover the first plating layer (191).

[0117] According to this embodiment, the number of current paths increases, and the electrical resistance value of the jumper chip component (101) can be prevented from increasing.

[0118] The configurations other than that of the seventh aspect are not essential for the jumper chip component (101) and can be omitted as appropriate.

[0119] 1 Jumper chip component 2 Substrate 21 Upper surface 23 Lower surface 4 First upper surface electrode (upper surface electrode) 41 Upper surface 41a End portion 5 Second upper surface electrode 6 End surface electrode 7 Lower surface electrode 82 Second protective film (protective film) 82a End portion 9 Plating layer 91 First plating layer 92 Second plating layer 101 Jumper chip component 102 Substrate 121 Upper surface 123 Lower surface 103 First upper surface electrode 131 Upper surface 104 Second upper surface electrode 141 Upper surface 141a End portion 105 Third upper surface electrode 106 End surface electrode 107 Lower surface electrode 182 Second protective film (protective film) 182a End portion 109 Plating layer 191 First plating layer 192 Second plating layer

Claims

1. an electrically insulating substrate; a first upper electrode including Au and formed on the upper surface of the substrate; a protective film formed on an upper surface of the first upper surface electrode so as to expose an end portion of the first upper surface electrode in a predetermined direction; a plating layer formed so as to cover the end of the first upper surface electrode and the end of the protective film in the predetermined direction; Equipped with Jumper chip parts.

2. a second upper surface electrode formed on an upper surface of the first upper surface electrode so as to cover the end portion of the first upper surface electrode, the second upper surface electrode being made of a resin Ag paste; the second upper surface electrode is formed between the first upper surface electrode and the plating layer; The jumper chip component according to claim 1 .

3. a portion of the second upper surface electrode being joined to the end portion of the protective film; The jumper chip part according to claim 2 .

4. The protective film is formed of an epoxy resin.

4. The jumper chip part according to claim 2 or 3.

5. a lower electrode formed on the lower surface of the substrate; an end surface electrode electrically connecting the first upper surface electrode and the lower surface electrode; Further comprising:

3. The jumper chip part according to claim 1 or 2.

6. the plating layer includes a first plating layer and a second plating layer, the first plating layer includes Ni and is formed to cover the end of the first upper surface electrode and the end of the protective film; The second plating layer contains Sn and is formed to cover the first plating layer.

3. The jumper chip part according to claim 1 or 2.

7. an electrically insulating substrate; a first upper electrode including Ag and formed on the upper surface of the substrate; a second upper surface electrode containing Au and formed on an upper surface of the first upper surface electrode; a protective film formed on the upper surface of the second upper surface electrode so as to expose an end portion of the second upper surface electrode in a predetermined direction; a third upper surface electrode formed on the upper surface of the second upper surface electrode so as to cover the end portion of the second upper surface electrode; a plating layer formed so as to cover the third upper surface electrode and an end portion of the protective film in the predetermined direction; Equipped with Jumper chip parts.

8. a portion of the third upper surface electrode being joined to the end portion of the protective film; 8. The jumper chip part according to claim 7.

9. The protective film is formed of an epoxy resin.

9. The jumper chip part according to claim 7 or 8.

10. a lower electrode formed on the lower surface of the substrate; an edge electrode electrically connecting the third upper surface electrode and the lower surface electrode; Further comprising:

9. The jumper chip part according to claim 7 or 8.

11. the plating layer includes a first plating layer and a second plating layer, the first plating layer contains Ni and is formed to cover the third upper surface electrode and the end portion of the protective film; The second plating layer contains Sn and is formed to cover the first plating layer.

9. The jumper chip part according to claim 7 or 8.