Chip resistor and method for manufacturing the same

Abstract

The resistive element of this chip resistor includes a resistance value adjustment portion. A meandering formation portion is formed in the resistance value adjustment portion. In the meandering formation portion, a first trimming groove and a second trimming groove are arranged side by side in a first direction (longitudinal direction). The first trimming groove has a first linear portion extending along a second direction (transverse direction) from a second edge of the resistance value adjustment portion. The second trimming groove has a second linear portion extending along the second direction from the second edge of the resistance value adjustment portion, and a bent portion extending from the leading end of the second linear portion toward the first trimming groove.

Description

Chip Resistors

[0001] The present disclosure generally relates to a chip resistor and a method for manufacturing the same, and more particularly to a chip resistor including a pair of electrodes and a resistive element, and a method for manufacturing the same.

[0002] Patent Document 1 discloses a chip resistor in which a resistor formed on an insulating substrate has linear trimming grooves formed in a rectangular portion of the resistor.

[0003] Patent Document 2 discloses a chip resistor in which a resistor element formed on an insulating substrate has linear trimming grooves formed in a rectangular portion of the resistor element.

[0004] JP 2010-135358 A JP 2005-244060 A

[0005] In the chip resistor described in Patent Document 1, the trimming groove forms a serpentine pattern in the rectangular portion of the resistor. The trimming groove is formed, for example, using a laser. In addition, the chip resistor described in Patent Document 1 has two parallel trimming grooves formed to allow for fine adjustment of the resistance value.

[0006] When a laser is used to form the trimming groove, there are technical limitations to widening the trimming groove width, making it difficult to increase the withstand voltage of the trimming groove, which can become the voltage limit of the chip resistor.

[0007] In the chip resistor described in Patent Document 2, the resistor element has a pair of rectangular portions and a meandering portion between them. The trimming groove forms a meandering pattern in the rectangular portion of the resistor element. The trimming groove is formed using, for example, a laser.

[0008] When a laser is used to form the trimming groove, there are technical limitations to widening the trimming groove width, making it relatively difficult to increase the withstand voltage of the trimming groove, which can become the voltage limit of the chip resistor.

[0009] A chip resistor according to one aspect of the present disclosure includes a substrate, a pair of electrodes, and a resistor. The pair of electrodes are provided at both ends of one surface of the substrate. The resistor is provided between the pair of electrodes on the one surface of the substrate. The resistor has a pair of connection portions connected to the pair of electrodes, respectively, and a resistance adjustment portion provided between the pair of connection portions. The resistance adjustment portion has a serpentine forming portion formed therein for forming the resistance adjustment portion into a serpentine shape. The serpentine forming portion has a first trimming groove and a second trimming groove. The first trimming groove and the second trimming groove are aligned along a first direction in which the pair of connection portions are aligned. The first trimming groove has a first linear portion extending from a groove starting edge of the resistance adjustment portion along a second direction perpendicular to the first direction. The second trimming groove has a second straight portion extending along the second direction from the groove starting edge of the resistance value adjustment portion, and a bent portion extending from the tip of the second straight portion in a direction approaching the first trimming groove.

[0010] According to the present disclosure, a chip resistor with high withstand voltage can be obtained.

[0011] A chip resistor according to one aspect of the present disclosure includes a substrate, a first electrode, a second electrode, and a resistor. The first electrode and the second electrode are provided on both ends in a first direction on one surface of the substrate. The resistor is provided between the first electrode and the second electrode on the one surface of the substrate. The resistor has a serpentine portion and a rectangular portion connected to the serpentine portion and the first electrode. The chip resistor further includes a first trimming groove and a second trimming groove. The first trimming groove and the second trimming groove are formed in the rectangular portion and extend from edges of the rectangular portion extending in the first direction along a second direction perpendicular to the first direction, thereby giving the rectangular portion a serpentine shape.

[0012] A method for manufacturing a chip resistor according to one embodiment of the present invention includes the steps of forming a first electrode and a second electrode at both ends in a first direction of one surface of a substrate; forming a resistor having a serpentine portion and a rectangular portion connected to the serpentine portion and the first electrode in the middle of the first direction of the one surface of the substrate; and forming a first trimming groove and a second trimming groove in the rectangular portion, the first trimming groove extending from an edge of the rectangular portion extending in the first direction along a second direction perpendicular to the first direction, thereby giving the rectangular portion a serpentine shape.

[0013] According to the present disclosure, a chip resistor with high withstand voltage and a method for manufacturing the chip resistor can be obtained.

[0014] FIG. 1 is a schematic cross-sectional view of a chip resistor according to a first embodiment of the present disclosure. FIG. 2 is a schematic top view of the same chip resistor. FIG. 3 is a graph showing the change in resistance value versus the total trimming distance. FIG. 4 is a graph showing the change in the potential difference across each groove versus the change in the ratio of the length of the second trimming groove to the length of the first trimming groove. FIG. 5 is a schematic top view of a chip resistor according to a second embodiment of the present disclosure. FIG. 6 is a schematic top view of a chip resistor according to a third embodiment of the present disclosure. FIG. 7 is a schematic top view of a chip resistor according to a fourth embodiment of the present disclosure. FIG. 8 is a schematic top view of a chip resistor according to a fifth embodiment of the present disclosure. FIG. 9 is a schematic perspective view of a chip resistor according to a sixth embodiment of the present disclosure. FIG. 10 is a graph showing the change in the potential difference across each groove versus the length of the second trimming groove of a chip resistor according to a sixth embodiment of the present disclosure. FIG. 11 is a schematic perspective view of a chip resistor according to a seventh embodiment of the present disclosure. Fig. 12 is a graph showing the change in resistance variation rate with respect to crack length of a chip resistor according to a seventh embodiment of the present disclosure. Fig. 13 is a schematic perspective view of a chip resistor according to an eighth embodiment of the present disclosure. Fig. 14 is a schematic perspective view of a chip resistor according to a ninth embodiment of the present disclosure.

[0015] Hereinafter, chip resistors according to embodiments will be described with reference to the drawings. The figures described in the following embodiments are schematic diagrams, and the ratios of the sizes and thicknesses of the components do not necessarily reflect the actual dimensional ratios. Furthermore, the configurations described in the following embodiments are merely examples of the present disclosure. The present disclosure is not limited to the following embodiments, and various modifications are possible depending on the design, etc., as long as the effects of the present disclosure can be achieved.

[0016] In the drawings, the X-axis, Y-axis, and Z-axis are perpendicular to one another, but this is merely an example and is not intended to define the directions in which the chip resistor should be used.

[0017] (First Embodiment) (1-1) Basic Configuration of Chip Resistor Hereinafter, a first embodiment will be described with reference to Figures 1 and 2. The first embodiment discloses a chip resistor 1 in which a meandering groove is formed in a resistor element.

[0018] The chip resistor 1 is a chip resistor for surface mounting (SMT: Surface Mount Technology) that is mounted on the surface (mounting surface) of a printed circuit board using, for example, a surface mounter. In this embodiment, as an example, the chip resistor 1 is a thick-film chip resistor.

[0019] 1 and 2, the chip resistor 1 has an insulating substrate 2, a first upper surface electrode 3, a second upper surface electrode 4, and a resistor 5. As shown in Fig. 1, the chip resistor 1 further has a first lower surface electrode 33, a second lower surface electrode 34, a first end surface electrode 35, a second end surface electrode 36, a pair of first plating layers 37, and a pair of second plating layers 38. As shown in Fig. 1, the chip resistor 1 further has a glass protective film 41 and a resin protective film 42.

[0020] (1-2) Insulating Substrate The insulating substrate 2 is made of, for example, Al ２ O ３The aluminum alloy sheet is made of alumina containing 96% aluminum and has a rectangular shape (rectangular when viewed from above). Hereinafter, the left-right direction in Figures 1 and 2 will be referred to as a longitudinal direction D1 (an example of a first direction), and the up-down direction in Figure 2 will be referred to as a lateral direction D2 (an example of a second direction). Furthermore, the right side in Figures 1 and 2 will be referred to as a longitudinal first side, the left side in Figures 1 and 2 will be referred to as a longitudinal second side, the upper side in Figure 2 will be referred to as a lateral first side, and the lower side in Figure 2 will be referred to as a lateral second side.

[0021] The longitudinal direction D1 and the lateral direction D2 are perpendicular to each other. Note that the concept of "perpendicular" here includes "approximately perpendicular," and includes the range of 90°±10°.

[0022] (1-3) Top electrode, bottom electrode and side electrode The first top electrode 3 and the second top electrode 4 are provided at both longitudinal ends of the surface 21 of the insulating substrate 2, respectively, and are formed by printing and firing a thick film material containing a metal such as silver.

[0023] The first lower surface electrode 33 and the second lower surface electrode 34 are provided at both longitudinal ends of the rear surface 22 of the insulating substrate 2, and are formed by printing and baking a thick film material containing a metal such as silver. The first lower surface electrode 33 and the second lower surface electrode 34 correspond to the first upper surface electrode 3 and the second upper surface electrode 4, respectively.

[0024] The first end surface electrode 35 and the second end surface electrode 36 are respectively provided on a pair of end surfaces 23 on both longitudinal sides of the insulating substrate 2. The first end surface electrode 35 and the second end surface electrode 36 are, for example, sputtered films made of NiCr. That is, the first end surface electrode 35 and the second end surface electrode 36 are formed (deposited) on the left-right end surfaces 23 of the insulating substrate 2 by sputtering. The first end surface electrode 35 electrically connects the first upper surface electrode 3 and the first lower surface electrode 33. The second end surface electrode 36 electrically connects the second upper surface electrode 4 and the second lower surface electrode 34.

[0025] (1-4) Resistor The resistor 5 is formed on the surface 21 of the insulating substrate 2 between the first upper surface electrode 3 and the second upper surface electrode 4, and is connected to the first upper surface electrode 3 and the second upper surface electrode 4. The resistor 5 is formed by printing a thick film material made of copper nickel, silver palladium, or ruthenium oxide on the surface 21 of the insulating substrate 2, and then firing the printed material.

[0026] The resistor 5 has a resistance value adjusting portion 12 , a first connecting portion 31 , and a second connecting portion 32 .

[0027] The resistance value adjusting portion 12 is disposed at a longitudinal center of the surface 21 of the insulating substrate 2, that is, spaced apart between the first upper surface electrode 3 and the second upper surface electrode 4. More specifically, the resistance value adjusting portion 12 is provided between the first connecting portion 31 and the second connecting portion 32. The resistance value adjusting portion 12 is a portion where the resistance value of the resistor 5 is adjusted by laser trimming, as will be described later. The edge of the resistance value adjusting portion 12 on the first side in the short side direction is referred to as a first edge 13, and the edge on the second side in the short side direction is referred to as a second edge 14 (an example of a groove starting edge).

[0028] The first connecting portion 31 and the second connecting portion 32 are aligned in the longitudinal direction D1. The first connecting portion 31 includes a first rectangular portion 6, a second rectangular portion 7, and a third rectangular portion 8 (an example of a connecting portion). The first rectangular portion 6 is connected to a first short-side portion of the first upper surface electrode 3 and extends in the first longitudinal direction. The second rectangular portion 7 extends from the tip of the first rectangular portion 6 in the second short-side direction. The third rectangular portion 8 extends from the tip of the second rectangular portion 7 in the first longitudinal direction and is connected to the end of the resistance value adjustment portion 12 in the second short-side direction (the end on the second edge 14 side). The third rectangular portion 8 has an edge 49 (an example of an edge) on the first short-side side. The edge 49 is the edge opposite the second edge 14 in the short-side direction D2.

[0029] The second connection portion 32 includes a fourth rectangular portion 9, a fifth rectangular portion 10, and a sixth rectangular portion 11 (an example of a connection portion). The fourth rectangular portion 9 is connected to a first short-side portion of the second upper surface electrode 4 and extends to a second long-side portion. The fifth rectangular portion 10 extends from a tip of the fourth rectangular portion 9 to the second short-side portion. The sixth rectangular portion 11 extends from a tip of the fifth rectangular portion 10 to the second long-side portion and is connected to an end portion of the resistance adjustment portion 12 on the second short-side side (an end portion on the second edge 14 side). In the above-described configuration, the sixth rectangular portion 11 is provided near the second edge 14 of the resistance adjustment portion 12. The sixth rectangular portion 11 has an edge 50 (an example of an edge) on the first short-side side. The edge 50 is an edge opposite the second edge 14 in the short-side direction D2. The short-side position of the edge 49 of the third rectangular portion 8 and the edge 50 of the sixth rectangular portion 11 is defined as a voltage reference position 51 .

[0030] The resistance value adjusting section 12 has a meander forming section 15 for forming the resistance value adjusting section 12 into a meander shape. The resistor 5 has a meandering shape that is folded three times in a direction parallel to the short-side direction D2 of the insulating substrate 2. Specifically, the first rectangular section 6, the second rectangular section 7, the third rectangular section 8, and the resistance value adjusting section 12 form a first turn that is folded back toward the first side in the short-side direction. Furthermore, the fourth rectangular section 9, the fifth rectangular section 10, the sixth rectangular section 11, and the resistance value adjusting section 12 form a second turn that is folded back toward the first side in the short-side direction. Furthermore, the resistance value adjusting section 12 forms a third turn that is folded back toward the second side in the short-side direction, as will be described later.

[0031] Two trimming grooves are formed in the meander forming portion 15. Specifically, a first trimming groove 16 and a second trimming groove 17 are formed in the meander forming portion 15. The first trimming groove 16 and the second trimming groove 17 are aligned along the longitudinal direction D1.

[0032] The first trimming groove 16 has a first linear portion 16P1 extending from the second edge 14 of the resistance value-adjusting portion 12 along the short-side direction D2 (an example of the second direction).

[0033] The second trimming groove 17 has a second straight portion 17P1 extending from the second edge 14 of the resistance value adjustment portion 12 along the short direction D2, and a bent portion 17P2 (an example of a folded portion) extending from the tip of the second straight portion 17P1 in a direction approaching the first trimming groove 16.

[0034] The second linear portion 17P1 of the second trimming groove 17 is longer in the short-side direction D2 than the first linear portion 16P1 of the first trimming groove 16.

[0035] The bent portion 17P2 of the second trimming groove 17 is located on the opposite side of the second edge 14 from the tip of the first straight portion 16P1 of the first trimming groove 16.

[0036] The above-described configuration can reduce the potential difference between both sides of each trimming groove in the meander forming portion 15. Therefore, a meander pattern that can withstand a high potential difference can be formed.

[0037] The bent portion 17P2 of the second trimming groove 17 has a first portion 18 that bends at a right angle from the tip of the second straight portion 17P1 and extends toward the second side in the lateral direction. The tip of the first portion 18 is located toward the second side in the longitudinal direction relative to the tip of the first straight portion 16P1 of the first trimming groove 16.

[0038] The bent portion 17P2 of the second trimming groove 17 further includes a second portion 19 that extends from the tip of the first portion 18 so as to fold back toward the second straight portion 17P1. The second portion 19 extends from the tip of the first portion 18 toward the second side in the short direction. Specifically, the second portion 19 is a straight line that extends parallel to the second straight portion 17P1. More specifically, the tip of the second portion 19 is located closer to the second side in the short direction than the tip of the first straight portion 16P1. In other words, the tip portion of the first straight portion 16P1 is surrounded by the second trimming groove 17 on both longitudinal sides and on the first side in the short direction.

[0039] As shown in FIG. 2 , if the short-side length from voltage reference position 51 to the tip of second trimming groove 17 is a1 and the short-side length from voltage reference position 51 to the tip of first trimming groove 16 is b1, then 0.53≦a1 / b1≦1.30 holds.

[0040] In this case, the potential difference between both sides of each trimming groove can be reduced compared to the conventional example of two trimming grooves, so that voltage breakdown in the groove portion is less likely to occur, and therefore abnormal characteristics can be suppressed.

[0041] (1-5) Glass Protective Film The glass protective film 41 is a film for protecting the resistor 5. As shown in FIG. 1, the glass protective film 41 covers the entire area (whole) of the resistor 5. The glass protective film 41 is made of, for example, lead oxide glass. The glass protective film 41 is formed (deposited) by, for example, screen printing. Note that the glass protective film 41 is not limited to lead oxide glass, and may be made of, for example, silicate glass.

[0042] (1-6) Resin Protective Film The resin protective film 42 is made of, for example, epoxy resin, and covers the entire area (whole) of the glass protective film 41. The resin protective film 42 is formed (deposited) by, for example, applying epoxy resin by screen printing and then thermally curing the epoxy resin.

[0043] (1-7) First Plating Layer The pair of first plating layers 37 is made of, for example, nickel (Ni) plating. The pair of first plating layers 37 covers the first end surface electrode 35 and the second end surface electrode 36, respectively, at both longitudinal ends of the insulating substrate 2.

[0044] (1-8) Second Plating Layer The pair of second plating layers 38 is made of, for example, tin (Sn) plating. The pair of second plating layers 38 covers the pair of first plating layers 37 at both ends of the insulating substrate 2 in the longitudinal direction D1.

[0045] (1-9) Method for Manufacturing Chip Resistor Hereinafter, a method for manufacturing the chip resistor 1 will be described. However, for the sake of simplicity, only the formation of the first upper surface electrode 3, the second upper surface electrode 4, and the resistor 5 will be described.

[0046] First, an electrode paste is screen-printed on both longitudinal ends of an insulating substrate 2 made of alumina, and then fired at 850° C. to form a first upper surface electrode 3 and a second upper surface electrode 4 .

[0047] Next, a resistive paste is screen-printed between the first upper surface electrode 3 and the second upper surface electrode 4, and then fired at 850° C. to form the resistor 5.

[0048] Next, in order to form the resistance-adjusting portion 12 in a meandering shape, the meander-forming portion 15 is formed by laser trimming, whereby the resistor 5 has a meandering shape with three turns.

[0049] The formation of the second trimming groove 17 will be described using Figure 3. In this embodiment, laser trimming is performed in the order of the second straight portion 17P1, the first portion 18 of the bent portion 17P2, and the second portion 19 of the bent portion 17P2. In Figure 3, a change in resistance value indicated by reference numeral 91 is observed when the second straight portion 17P1 is formed, a change in resistance value indicated by reference numeral 92 is observed when the first portion 18 is formed, and a change in resistance value indicated by reference numeral 93 is observed when the second portion 19 is formed. This shows that the resistance value of the resistor 5 can be finely adjusted by forming the first portion 18 and the second portion 19.

[0050] (1-10) Characteristics Using Figure 4, we will explain the change in the potential difference across each groove with respect to the change in the ratio (%) of the length of the second trimming groove 17 to the length of the first trimming groove 16. This result was obtained by simulation when 800 V was applied to the resistor 5. Here, the potential difference across the groove means the potential difference between the conductor portions on both sides of each trimming groove. In the case of two conventional trimming grooves, the minimum value of the potential difference across the groove was 176 V.

[0051] In FIG. 4 , the line connecting multiple dots (△) indicates the potential difference across the first trimming groove 16, and the line connecting multiple dots (◯) indicates the potential difference across each of the second trimming grooves 17. Furthermore, a straight line 61 indicates 176 V, which is the minimum value of the conventional potential difference across the groove. As is clear from FIG. 4 , when the ratio is small (e.g., near 0%), the potential difference across the first trimming groove 16 is 176 V or more. However, as the ratio increases, the potential difference across the first trimming groove 16 decreases. When the ratio is 53% or more, the potential difference across the groove becomes less than 176 V. Furthermore, when the ratio is small (e.g., near 0%), the potential difference across the second trimming groove 17 is small. However, as the ratio increases, the potential difference across the second trimming groove 17 increases. However, even if the above ratio approaches and exceeds 100%, if the ratio is 130% or less, the potential difference across the second trimming groove 17 is less than 176V.

[0052] From the above, it was found that if the above ratio is 53% or more and 130% or less, a potential difference even smaller than the conventional minimum potential difference across the groove can be obtained. Furthermore, the above ratio is preferably in the range of 70 to 120%, and even more preferably in the range of 80 to 110%. In this case, the potential difference across the groove for all trimming grooves can be made lower than 150 V.

[0053] Second Embodiment A chip resistor 1A according to a second embodiment will be described with reference to Fig. 5. The basic configuration of the chip resistor 1A is the same as that of the chip resistor 1 according to the first embodiment, and therefore differences will be mainly described.

[0054] Two trimming grooves are formed in the meandering portion 15A. Specifically, a first trimming groove 16A and a second trimming groove 17A are formed in the meandering portion 15A. The first trimming groove 16A and the second trimming groove 17A are aligned along the longitudinal direction D1 (an example of the first direction).

[0055] The first trimming groove 16A has a first linear portion 16A1 extending from the second edge 14A of the resistance value-adjusting portion 12A along the short-side direction D2.

[0056] The second trimming groove 17A has a second straight portion 17A1 extending from the second edge 14A of the resistance value adjustment portion 12A along the short direction D2 (an example of the second direction), and a bent portion 17A2 extending from the tip of the second straight portion 17A1 in a direction approaching the first trimming groove 16A.

[0057] The second linear portion 17A1 of the second trimming groove 17A is longer in the short direction D2 than the first trimming groove 16A of the first trimming groove 16A.

[0058] The bent portion 17A2 of the second trimming groove 17A bends at a right angle from the tip of the second linear portion 17A1 and extends to the second longitudinal side. The tip of the bent portion 17A2 is located on the second longitudinal side of the tip of the first linear portion 16A1 of the first trimming groove 16A.

[0059] The above-described configuration can reduce the potential difference between both sides of each trimming groove in the meander forming portion 15A, thereby forming a meander pattern that can withstand a high potential difference.

[0060] Third Embodiment A chip resistor 1B according to a third embodiment will be described with reference to Fig. 6. The basic configuration of the chip resistor 1B is the same as that of the chip resistor 1 according to the first embodiment, and therefore differences will be mainly described.

[0061] A meandering portion 15B is formed in the resistance value adjustment portion 12B of the resistor 5B. A trimming groove is formed in the meandering portion 15B to form the resistance value adjustment portion 12B into a meandering shape. Specifically, a first trimming groove 16B and a second trimming groove 17B are formed in the meandering portion 15B. The first trimming groove 16B and the second trimming groove 17B are aligned along the longitudinal direction D1 (an example of a first direction). The first trimming groove 16B and the second trimming groove 17B extend parallel to each other in the transverse direction D2 (a transverse direction) from a second edge 14B (an example of a groove starting edge) of the resistance value adjustment portion 12B. The second trimming groove 17B is located on the first longitudinal side of the first trimming groove 16B.

[0062] The first trimming groove 16B has a first linear portion 16B1 extending from the second edge 14B of the resistance value-adjusting portion 12B toward the first side in the short-side direction.

[0063] The second trimming groove 17B has a second straight portion 17B1 extending from the second edge 14B of the resistance value adjustment portion 12B to the first side in the short direction, and a bent portion 17B2 (an example of a folded portion) extending from the tip of the second straight portion 17B1 toward the first straight portion 16B1.

[0064] The second linear portion 17B1 of the second trimming groove 17B is longer in the short direction D2 than the first linear portion 16B1 of the first trimming groove 16B.

[0065] The bent portion 17B2 of the second trimming groove 17B has a first portion 18B that is semicircular in shape when viewed in a plane from the thickness direction of the insulating substrate 2B, and a second portion 19B that is bent back relative to the second straight portion 17B1 and extends parallel to the second straight portion 17B1.

[0066] The bent portion 17B2 of the second trimming groove 17B is located on the opposite side of the second edge 14B from the tip of the first linear portion 16B1 of the first trimming groove 16B. Specifically, the first portion 18B curves from the tip of the second linear portion 17B1 so as to convex outward in the lateral direction and extend toward the second longitudinal side. More specifically, the tip of the bent portion 17B2 (specifically, the second portion 19B) is located closer to the second lateral side than the tip of the first linear portion 16B1. In other words, the tip portion of the first linear portion 16B1 is surrounded on both longitudinal sides and on the first lateral side by the second trimming groove 17B.

[0067] The above configuration can reduce the potential difference between both sides of each trimming groove in the meander forming portion 15. Therefore, it is possible to form a meander pattern that can withstand a high potential difference.

[0068] In the above configuration, second trimming groove 17B has bent portion 17B2, which makes it difficult for microcracks to occur at the tip end of second trimming groove 17B. In particular, because bent portion 17B2 has at least a partial arc, current concentration at the corner at the tip of the bent portion can be alleviated, improving load characteristics.

[0069] More specifically, because the microcracks at the ends of second trimming grooves 17B are oriented in the same direction as the current path, the resistance value hardly changes even when the microcracks grow, i.e., the resistance value precision and reliability are improved. Furthermore, the resistance value fluctuations caused by the growth of microcracks at the ends of first trimming grooves 16B can be reduced, thereby improving the resistance value precision and reliability.

[0070] Furthermore, because bent portion 17B2 of second trimming groove 17B is bent toward first trimming groove 16B in longitudinal direction D1, the location where microcracks occur at the tip of second trimming groove 17B can be positioned in a location where almost no current flows, further improving the resistance value accuracy and reliability.

[0071] Fourth Embodiment A chip resistor 1C according to a fourth embodiment will be described with reference to Fig. 7. The basic configuration of the chip resistor 1C is the same as that of the chip resistor 1 according to the first embodiment, and therefore differences will be mainly described.

[0072] The resistor 5C has a resistance value adjusting portion 12C, a first connecting portion 6C, and a second connecting portion 9C.

[0073] The resistance-adjusting portion 12C is disposed at a longitudinal center of the surface 21C of the insulating substrate 2C, i.e., between the first upper-surface electrode 3C and the second upper-surface electrode 4C. The resistance-adjusting portion 12C is a portion where the resistance of the resistor 5C is adjusted by laser trimming. The edge on the first longitudinal side of the resistance-adjusting portion 12C is referred to as a first edge 13C, and the edge on the second longitudinal side is referred to as a second edge 14C (an example of a groove starting edge).

[0074] The first connection portion 6C and the second connection portion 9C are aligned in the short-side direction D2 (an example of a first direction). The first connection portion 6C is connected to a first short-side portion of the first upper surface electrode 3C, extends to the first longitudinal side, and is connected to the resistance-adjusting portion 12C. The second connection portion 9C is connected to a second short-side portion of the second upper surface electrode 4, and extends to the second longitudinal side. The end of the second longitudinal side of the second connection portion 9C is connected to the resistance-adjusting portion 12C via a connection portion 11C.

[0075] The resistor 5C has a serpentine shape folded back in a direction parallel to the longitudinal direction D1 of the insulating substrate 2C. Specifically, a first turn folded back toward the second longitudinal side is formed by the first connecting portion 6C and the resistance value adjusting portion 12C. Furthermore, a second turn folded back toward the first longitudinal side is formed by the resistance value adjusting portion 12C, the connecting portion 11C, and the second connecting portion 9C.

[0076] A meandering portion 15C is formed in the resistance value adjustment portion 12C. A trimming groove is formed in the meandering portion 15C to form the resistance value adjustment portion 12C into a meandering shape. Specifically, a first trimming groove 16C and a second trimming groove 17C are formed in the meandering portion 15C. The first trimming groove 16C and the second trimming groove 17C extend parallel to the longitudinal direction D1 (an example of the second direction) from the second edge 14C of the resistance value adjustment portion 12C. The second trimming groove 17C is located on the second side in the short direction of the first trimming groove 16C.

[0077] The first trimming groove 16C has a first linear portion 16C1 that extends from the second edge 14C of the resistance value-adjusting portion 12C toward the first side in the longitudinal direction.

[0078] The second trimming groove 17C has a second straight portion 17C1 extending from the second edge 14C of the resistance value adjustment portion 12C along the short direction D2, and a bent portion 17C2 extending from the tip of the second straight portion 17C1 in a direction approaching the first trimming groove 16A.

[0079] The second linear portion 17C1 of the second trimming groove 17C is longer in the longitudinal direction D1 (an example of the second direction) than the first linear portion 16C1 of the first trimming groove 16 of the first trimming groove 16C.

[0080] The bent portion 17C2 of the second trimming groove 17C is located on the opposite side of the second edge 14C from the tip of the first straight portion 16C1 of the first trimming groove 16C. Specifically, the bent portion 17C2 bends at a right angle from the tip of the second straight portion 17C1 and extends toward the second longitudinal side. The tip of the bent portion 17C2 is located toward the first lateral side of the tip of the first straight portion 16C1 of the first trimming groove 16C.

[0081] The above-described configuration can reduce the potential difference between both sides of each trimming groove of the meander forming portion 15C, thereby forming a meander pattern that can withstand a high potential difference.

[0082] Fifth Embodiment A chip resistor 1D according to a fifth embodiment will be described with reference to Fig. 8. The basic configuration of the chip resistor 1D is the same as that of the chip resistor 1C according to the fourth embodiment, and therefore differences will be mainly described.

[0083] A meandering portion 15D is formed in the resistance value adjustment portion 12D of the resistor 5D. A trimming groove is formed in the meandering portion 15D to form the resistance value adjustment portion 12D into a meandering shape. Specifically, a first trimming groove 16D and a second trimming groove 17D are formed in the meandering portion 15D. The first trimming groove 16D and the second trimming groove 17D are aligned along the short-side direction D2. The first trimming groove 16D and the second trimming groove 17D extend parallel to the short-side direction D2 (an example of a first direction). The second trimming groove 17D is located on the second short-side direction side of the first trimming groove 16D.

[0084] The first trimming groove 16D has a first linear portion 16D1 that extends from the second edge 14D of the resistance value-adjusting portion 12D toward the first side in the longitudinal direction.

[0085] The second trimming groove 17D has a second linear portion 17D1 extending from the second edge 14D of the resistance value-adjusting portion 12D toward the first longitudinal side, and a bent portion 17D2 (an example of a folded portion) extending from the tip of the second linear portion 17D1 toward the first linear portion 16D1. The bent portion 17D2 has a first portion 18D that is semicircular in plan view from the thickness direction of the insulating substrate 2D, and a second portion 19D that is folded back relative to the second linear portion 17D1 and extends parallel to the second linear portion 17D1.

[0086] The second linear portion 17D1 of the second trimming groove 17D is longer in the longitudinal direction D1 than the first linear portion 16D1 of the first trimming groove 16D.

[0087] The bent portion 17D2 of the second trimming groove 17D is located on the opposite side of the second edge 14D from the tip of the first linear portion 16D1 of the first trimming groove 16D. Specifically, the first portion 18D curves from the tip of the second linear portion 17D1 to extend toward the second longitudinal side, convexly outward in the longitudinal direction. More specifically, the tip of the bent portion 17D2 (specifically, the second portion 19D) is located on the second longitudinal side of the tip of the first linear portion 16D1. In other words, the tip portion of the first linear portion 16D1 is surrounded on both short sides and on the first longitudinal side by the second trimming groove 17D.

[0088] The above configuration can reduce the potential difference between both sides of each trimming groove of the meander forming portion 15D, thereby forming a meander pattern that can withstand a high potential difference.

[0089] (Modifications) The above-described embodiments are merely examples of various embodiments of the present disclosure. The above-described embodiments can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. Modifications of the above-described embodiments are listed below. The modifications described below can be applied in appropriate combinations.

[0090] The chip resistor 1 may be a thin film chip resistor.

[0091] In the first to fifth embodiments, the second linear portion of the second trimming groove is longer than the first linear portion of the first trimming groove. However, the second linear portion of the second trimming groove may be shorter than the first linear portion of the first trimming groove.

[0092] The shape and length of the folded portion of the trimming groove are not particularly limited, but it is preferable that the folded portion is smooth, i.e., without corners.

[0093] In the first to fifth embodiments, the bent portions of the second trimming grooves overlap with and extend beyond the first linear portions of the first trimming grooves in the groove alignment direction. However, the bent portions of the second trimming grooves do not necessarily overlap with the first linear portions of the first trimming grooves in the groove alignment direction, or may overlap only a portion of the first linear portions of the first trimming grooves in the groove alignment direction.

[0094] (Aspects) The present specification discloses the following aspects.

[0095] A chip resistor (1, 1A, 1B, 1C, 1D) according to a first aspect includes a substrate (2, 2B, 2C, 2D), a pair of electrodes (3, 3C, 4, 4C), and a resistor (5, 5B, 5C, 5D). The pair of electrodes (3, 4) are provided at both ends of one surface (21, 21C) of the substrate (2, 2B, 2C, 2D). The resistor (5, 5B, 5C, 5D) is provided between the pair of electrodes (3, 3C, 4, 4C) on the one surface (21, 21C) of the substrate (2, 2B, 2C, 2D). The resistor includes a pair of connection portions (31, 32) respectively connected to the pair of electrodes (3, 4), and a resistance value adjustment portion (12, 12A, 12B, 12C, 12D) provided between the pair of connection portions (31, 32). The resistance value adjusting portions (12, 12A, 12B, 12C, 12D) are formed with serpentine forming portions (15, 15A, 15B, 15C, 15D) for forming the resistance value adjusting portions (12, 12A, 12B, 12C, 12D) into a serpentine shape. The serpentine forming portions (15, 15A, 15B, 15C, 15D) are formed with first trimming grooves (16, 16A, 16B, 16C, 16D) and second trimming grooves (17, 17A, 17B, 17C, 17D). The first trimming grooves (16, 16A, 16B, 16C, 16D) and the second trimming grooves (17, 17A, 17B, 17C, 17D) are aligned along a first direction, which is the direction in which the pair of connecting portions (31, 32) are aligned. The first trimming groove (16, 16A, 16B, 16C, 16D) has a first linear portion (161, 16A1, 16B1, 16C1, 16D1) extending from the groove starting edge (14, 14A, 14B, 14C, 14D) of the resistance value adjustment portion (12, 12A, 12B, 12C, 12D) along a second direction perpendicular to the first direction. The second trimming grooves (17, 17A, 17B, 17C, 17D) have second straight portions (17P1, 17A1, 17B1, 17C1, 17D1) extending along the second direction from the groove starting edges (14, 14A, 14B, 14C, 14D) of the resistance value adjustment portions (12, 12A, 12B, 12C, 12D), and bent portions (17P2, 17A2, 17B2, 17C2, 17D2) extending from the tips of the second straight portions (17P1, 17A1, 17B1, 17C1, 17D1) in a direction approaching the first trimming grooves (16, 16A, 16B, 16C, 16D).

[0096] According to this aspect, the potential difference between both sides of each trimming groove in the meander forming portion can be reduced, and therefore a meander pattern that can withstand a high potential difference can be formed.

[0097] In the chip resistor (1, 1A, 1B, 1C, 1D) according to the second aspect, in the first aspect, the second straight portions (17P1, 17A1, 17B1, 17C1, 17D1) are longer in the second direction than the first straight portions (16P1, 16A1, 16B1, 16C1, 16D1).

[0098] According to this aspect, the potential difference between both sides of each trimming groove in the meander forming portion can be reduced, and therefore a meander pattern that can withstand a high potential difference can be formed.

[0099] In the chip resistor (1, 1A, 1B, 1C, 1D) according to the third aspect, in the first or second aspect, the bent portion (17P2, 17A2, 17B2, 17C2, 17D2) of the second trimming groove (17, 17A, 17B, 17C, 17D) is positioned on the opposite side of the groove starting edge (14, 14A, 14B, 14C, 14D) from the tip of the first straight portion (16P1, 16A1, 16B1, 16C1, 16D1) of the first trimming groove (16, 16A, 16B, 16C, 16D).

[0100] According to this aspect, the potential difference between both sides of each trimming groove in the meander forming portion can be reduced, and therefore a meander pattern that can withstand a high potential difference can be formed.

[0101] In the chip resistor (1, 1B, 1D) according to the fourth aspect, in any of the first to third aspects, the bent portion (17P2, 17B2, 17D2) has a folded portion (17P2, 17B2, 17D2) that extends so as to fold back on the second straight portion (17P1, 17A1, 17B1, 17C1, 17D1).

[0102] According to this aspect, the potential difference between both sides of each trimming groove in the meander forming portion can be reduced, and therefore a meander pattern that can withstand a high potential difference can be formed.

[0103] In a chip resistor (1B, 1D) according to a fifth aspect, in the fourth aspect, the folded portion (17B2, 17D2) of the second trimming groove (17B, 17D) has at least a part of an arcuate portion.

[0104] According to this aspect, since the folded portion has a circular arc portion in part, microcracks are less likely to occur in the tip end portion of the trimming groove in the extension direction.

[0105] In the chip resistor (1) according to the sixth aspect, in the first to fifth aspects, each of the pair of connection portions (31, 32) has a connection portion (8, 11) provided near the groove starting edge and connected to the resistance value adjustment portion. If the length from the edge (49, 50) of the connection portion (8, 11) opposite the groove starting edge (14) to the tip of the second trimming groove (17) is defined as a1, and the length from the edge (14) of the connection portion (8, 11) to the tip of the first trimming groove (16) is defined as b1, then a1 / b1≧0.53 and a1 / b1≦1.30 hold.

[0106] According to this embodiment, the potential difference between both sides of each trimming groove can be reduced compared to the conventional example of two trimming grooves, so that voltage breakdown in the groove portion is less likely to occur, and therefore characteristic abnormalities can be suppressed.

[0107] Sixth Embodiment (6-1) Basic Configuration of Chip Resistor Hereinafter, a sixth embodiment will be described with reference to FIG.

[0108] The chip resistor 101 is a chip resistor for surface mounting (SMT: Surface Mount Technology) that is mounted on the surface (mounting surface) of a printed circuit board using, for example, a surface mounter. In this embodiment, as an example, the chip resistor 101 is a thick-film chip resistor.

[0109] 9, the chip resistor 101 has an insulating substrate 102, a first upper surface electrode 103, a second upper surface electrode 104, and a resistor 105. Although not shown, the chip resistor 101 further has a first lower surface electrode, a second lower surface electrode, a first end surface electrode, a second end surface electrode, a pair of first plating layers, and a pair of second plating layers. Although not shown, the chip resistor 101 further has a glass protective film and a resin protective film.

[0110] (6-2) Insulating Substrate The insulating substrate 102 is made of, for example, Al ２ O ３ 9 is made of alumina containing 96% alumina and has a rectangular shape (rectangular in top view). The insulating substrate 102 has a longitudinal direction along the Y-axis direction (first direction), a lateral direction along the X-axis direction (second direction), and a thickness direction along the Z-axis direction. Furthermore, the diagonally upper right side of FIG. 9 is the longitudinal first side (Y-axis first side), the diagonally lower left side of FIG. 9 is the longitudinal second side (Y-axis second side), the diagonally upper left side of FIG. 9 is the lateral first side (X-axis first side), and the diagonally lower right side of FIG. 9 is the lateral second side (X-axis second side).

[0111] The X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to one another, but the concept of "perpendicular" here includes "approximately perpendicular," and includes the range of 90°±10°.

[0112] (6-3) Upper Surface Electrodes The first upper surface electrode 103 and the second upper surface electrode 104 are provided at both longitudinal ends of the surface 121 of the insulating substrate 102, and are formed by printing and firing a thick film material containing a metal such as silver.

[0113] (6-4) Resistor (6-4-1) Overview of Resistor The resistor 105 is formed on the surface 211 (one surface) of the insulating substrate 102 between the first upper surface electrode 103 and the second upper surface electrode 104, and is connected to the first upper surface electrode 103 and the second upper surface electrode 104. The resistor 105 is formed by printing a thick film material made of, for example, about 10 wt % lead ruthenate, about 53 wt % glass, and about 37 wt % solvent on the surface 121 of the insulating substrate 102, followed by baking. The resistor 105 has a first edge 151 and a second edge 152 extending in the Y-axis direction. The first edge 151 is provided on the second side in the Y-axis direction, and the second edge 152 is provided on the first side in the Y-axis direction.

[0114] The resistor 105 has a meandering portion 106 , a first rectangular portion 107 , and a second rectangular portion 108 .

[0115] The serpentine portion 106 is disposed at the longitudinal center of the surface 121 of the insulating substrate 102, i.e., between the first upper surface electrode 103 and the second upper surface electrode 104. The serpentine portion 106 has a first recess 109 and a second recess 110. In the Y-axis direction, the first recess 109 is disposed on the first upper surface electrode 103 side, and the second recess 110 is disposed on the second upper surface electrode 104 side. The first recess 109 extends in the X-axis direction from a second edge 152 on a first side in the X-axis direction of the resistor 105, and the second recess 110 extends in the X-axis direction from a first edge 151 on a second side in the X-axis direction of the resistor 105. As a result, the serpentine portion 106 has a twice-folded serpentine shape (approximately S-shaped).

[0116] The first rectangular portion 107 continues from the serpentine portion 106 and is connected to the first upper surface electrode 103 .

[0117] The second rectangular portion 108 continues from the serpentine portion 106 and is connected to the second upper surface electrode 104 .

[0118] (6-4-2) Rectangular Portion (6-4-2-1) First Rectangular Portion A first trimming groove 111 and a second trimming groove 112 are formed in the first rectangular portion 107. The first trimming groove 111 and the second trimming groove 112 extend parallel to each other along the X-axis direction from a first edge 151 of the first rectangular portion 107 and are linear. The first trimming groove 111 and the second trimming groove 112 give the first rectangular portion 107 a serpentine shape. The first trimming groove 111 and the second trimming groove 112 are formed in the first rectangular portion 107 near the first upper surface electrode 103 (in a region closer to the first upper surface electrode 103 than the center of the first rectangular portion 107 in the Y-axis direction).

[0119] The first trimming groove 111 is provided closer to the first upper surface electrode 103 than the second trimming groove 112 in the Y-axis direction.

[0120] First trimming groove 111 is longer than second trimming groove 112. In other words, the tip of first trimming groove 111 is located closer to second edge 152 than the tip of second trimming groove 112.

[0121] (6-4-2-2) Second Rectangular Portion A third trimming groove 113 and a fourth trimming groove 114 are formed in the second rectangular portion 108. The third trimming groove 113 and the fourth trimming groove 114 extend parallel to each other along the X-axis direction from the second edge 152 of the second rectangular portion 108 and are linear. The third trimming groove 113 and the fourth trimming groove 114 give the second rectangular portion 108 a serpentine shape. The third trimming groove 113 and the fourth trimming groove 114 are formed in the second rectangular portion 108 near the second top surface electrode 104 (in a region closer to the second top surface electrode 104 than the center of the second rectangular portion 108 in the Y-axis direction).

[0122] The third trimming groove 113 is provided closer to the second upper surface electrode 104 than the fourth trimming groove 114 in the Y-axis direction.

[0123] Third trimming groove 113 is longer than fourth trimming groove 114. That is, the tip of third trimming groove 113 is located closer to first edge 151 than the tip of fourth trimming groove 114.

[0124] (6-5) Effects The effects of the chip resistor 101 will be described with reference to FIG.

[0125] 10 shows the simulation results of the potential difference between both ends of first trimming groove 111 and second trimming groove 112, when, for example, the length of first trimming groove 111 is fixed at 0.85 mm and the length of second trimming groove 112, which serves as the second trimming groove, is varied within a range of 0 to 0.85 mm. In FIG. 10, A1 indicates the potential difference (250 V) when simulating the case where there is only one conventional trimming groove, V1 indicates the potential difference of first trimming groove 111, and V2 indicates the potential difference of second trimming groove 112.

[0126] 10, when the length of the second trimming groove 112 exceeds 0 mm, the potential difference is smaller than in the conventional case where there is only one trimming groove. Furthermore, when the length of the second trimming groove 112 is less than 0.85 mm, the potential difference across both sides of multiple trimming grooves is smaller than when the trimming grooves are the same length. Therefore, even when the chip resistor 101 is used at high voltage, dielectric breakdown is less likely to occur in the trimming groove, and as a result, characteristic anomalies are less likely to occur.

[0127] 10, when the length of second trimming groove 112 is 0.65 mm, the potential difference between first trimming groove 111 and second trimming groove 112 is 134 V. In other words, the larger of the potential differences between the two trimming grooves is the smallest. The potential difference across each rectangular trimming groove can be significantly reduced compared to the case of a single trimming groove. Therefore, a meandering pattern that can withstand a high potential difference can be formed.

[0128] The optimum value for the length of second trimming groove 112 varies depending on the shape of the resistor, the positions or lengths of first trimming groove 111 and second trimming groove 112, and the like.

[0129] Generally, the surface of a resistor is covered with a resin-based or glass-based protective film, which has a dielectric strength of approximately 1 kV / mm. The trimming groove generally has a width of approximately 0.015 to 0.040 mm, so the dielectric strength of the protective film in the trimming groove is 150 to 400 V. Therefore, even a potential difference of 250 V, as shown in the simulation for a single trimming groove, could potentially cause dielectric breakdown. However, by forming two trimming grooves of appropriate lengths, as in this embodiment, the potential difference can be reduced to 134 V, which is less than the dielectric strength of the protective film.

[0130] In this embodiment, trimming grooves are formed in both the first rectangular portion 107 and the second rectangular portion 108. This allows the resistance value to be adjusted near the first upper surface electrode 103 and the second upper surface electrode 104 on both sides, thereby expanding the adjustable range of the resistance value. Furthermore, the accuracy of the resistance value adjustment is improved.

[0131] (6-6) Method for Manufacturing Chip Resistor Hereinafter, a method for manufacturing the chip resistor 101 will be described. However, for the sake of simplicity, only the formation of the first upper surface electrode 103, the second upper surface electrode 104, and the resistor 105 will be described.

[0132] First, an electrode paste is screen-printed on both longitudinal ends of insulating substrate 102 made of alumina, and then fired at 850° C. to form first upper surface electrode 103 and second upper surface electrode 104 .

[0133] Next, a resistive paste is screen-printed between the first upper surface electrode 103 and the second upper surface electrode 104, and then fired at 850°C to form the resistor 105. The resistor 105 has a serpentine portion 106, a first rectangular portion 107, and a second rectangular portion 108. Finally, a first trimming groove 111 and a second trimming groove 112 are formed in the first rectangular portion 107 by laser processing, and a third trimming groove 113 and a fourth trimming groove 114 are formed in the second rectangular portion 108. Note that the order of forming the first upper surface electrode 103 and the second upper surface electrode 104 and the resistor 105 may be reversed.

[0134] Seventh Embodiment In the sixth embodiment described above, the trimming groove is linear, but the shape of the trimming groove is not particularly limited.

[0135] 11 and 12, a chip resistor 101A having a trimming groove with a different shape from that of the sixth embodiment will be described as a seventh embodiment. Note that the basic configuration of the chip resistor 101A is the same as that of the chip resistor 101 according to the sixth embodiment, and therefore differences will be mainly described.

[0136] (7-1) Overview of Chip Resistor As shown in FIG. 11, the chip resistor 101A has an insulating substrate 102A, a first upper surface electrode 103A, a second upper surface electrode 104A, and a resistive element 105A.

[0137] (7-2) Insulating Substrate The insulating substrate 102A is made of, for example, Al ２ O ３ The insulating substrate 102A is made of alumina containing 96% of arsenic and has a rectangular shape (rectangular when viewed from above). The longitudinal direction of the insulating substrate 102A is along the Y axis, the lateral direction is along the X axis, and the thickness direction is along the Z axis.

[0138] (7-3) Upper Surface Electrodes The first upper surface electrode 103A and the second upper surface electrode 104A are provided at both longitudinal ends of the surface 121A of the insulating substrate 102A, and are formed by printing and firing a thick film material containing a metal such as silver.

[0139] (7-4) Resistor (7-4-1) Overview of Resistor The resistor 105A is formed on the surface 121A of the insulating substrate 102A between the first upper surface electrode 103A and the second upper surface electrode 104A, and is connected to the first upper surface electrode 103A and the second upper surface electrode 104A. The resistor 105A has a first edge 151A and a second edge 152A extending in the Y-axis direction. The first edge 151A is provided on the second side in the X-axis direction, and the second edge 152A is provided on the first side in the X-axis direction.

[0140] The resistor 105A has a meandering portion 106A, a first rectangular portion 107A, and a second rectangular portion 108A.

[0141] The serpentine portion 106A is located at the longitudinal center of the surface 121A of the insulating substrate 102A, i.e., between the first upper surface electrode 103A and the second upper surface electrode 104A. The serpentine portion 106A has a first recess 109A and a second recess 110A. In the Y-axis direction, the first recess 109A is located on the first upper surface electrode 103A side, and the second recess 110A is located on the second upper surface electrode 104A side. The first recess 109A extends in the X-axis direction from a second edge 152A on a first side in the X-axis direction of the resistor 105A, and the second recess 110A extends in the X-axis direction from a first edge 151A on a second side in the X-axis direction of the resistor 105A. This results in the serpentine portion 106A having a twice-folded serpentine shape (approximately S-shaped).

[0142] The first rectangular portion 107A continues from the serpentine portion 106A and is connected to the first upper surface electrode 103A.

[0143] The second rectangular portion 108A continues from the serpentine portion 106A and is connected to the second upper surface electrode 104A.

[0144] (7-4-2) Rectangular Portion (7-4-2-1) First Rectangular Portion A first trimming groove 111A and a second trimming groove 112A are formed in the first rectangular portion 107A. The first trimming groove 111A and the second trimming groove 112A extend generally parallel to each other along the X-axis direction from a first edge 151A of the first rectangular portion 107A. The first trimming groove 111A and the second trimming groove 112A give the first rectangular portion 107A a serpentine shape. The first trimming groove 111A and the second trimming groove 112A are formed in the first rectangular portion 107A near the first upper surface electrode 103A (in a region closer to the first upper surface electrode 103A than the center of the first rectangular portion 107A in the Y-axis direction).

[0145] The first trimming groove 111A is provided closer to the first upper surface electrode 103A than the second trimming groove 112A in the Y-axis direction.

[0146] First trimming groove 111A is longer than second trimming groove 112A. That is, the tip of first trimming groove 111A is located closer to second edge 152A than the tip of second trimming groove 112A.

[0147] The first trimming groove 111A has a straight portion 211A and a tip portion 212A extending from the tip of the straight portion 211A toward the first upper surface electrode 103. Specifically, the tip portion 212A is linear and inclined from the straight portion 211A toward the first upper surface electrode 103A. The inclination angle of the tip portion 212A with respect to the straight portion 211A is in the range of 30 to 60 degrees.

[0148] The second trimming groove 112A is linear.

[0149] (7-4-2-2) Second Rectangular Portion A third trimming groove 113A and a fourth trimming groove 114A are formed in the second rectangular portion 108A. The third trimming groove 113A and the fourth trimming groove 114A extend generally parallel to each other along the X-axis direction from the second edge 152A of the second rectangular portion 108A. The third trimming groove 113A and the fourth trimming groove 114A give the second rectangular portion 108A a serpentine shape. The third trimming groove 113A and the fourth trimming groove 114A are formed in the second rectangular portion 108A near the second top surface electrode 104A (in a region closer to the second top surface electrode 104A than the center of the second rectangular portion 108A in the Y-axis direction).

[0150] The third trimming groove 113A is provided closer to the second upper surface electrode 104A in the Y-axis direction than the fourth trimming groove 114A.

[0151] Third trimming groove 113A is longer than fourth trimming groove 114A. That is, the tip of third trimming groove 113A is closer to first edge 151A than the tip of fourth trimming groove 114A.

[0152] The third trimming groove 113A has a straight portion 231A and a tip portion 232A that extends from the tip of the straight portion 231A toward the second upper surface electrode 104. Specifically, the tip portion 232A is linear and inclined from the straight portion 231A toward the second upper surface electrode 104A. The inclination angle of the tip portion 232A with respect to the straight portion 231A is in the range of 30 to 60 degrees.

[0153] The fourth trimming groove 114A is linear.

[0154] (7-5) Effects (7-5-1) In the seventh embodiment, as in the sixth embodiment, the potential difference between both sides of each trimming groove in the rectangular portion can be significantly reduced compared to the case of a single trimming groove. Therefore, a meandering pattern that can withstand a high potential difference can be formed.

[0155] (7-5-2) In particular, in the seventh embodiment, by forming the tip portion 212A and the tip portion 232A on the linear portion 211A and the linear portion 231A, respectively, it is possible to reduce current concentration at the tip of the trimming groove, thereby suppressing characteristic abnormalities due to overload.

[0156] (7-5-3) Generally, laser trimming tends to cause microcracks in the direction of laser trimming, which results in variations in resistance. However, in the seventh embodiment, the formation of the tip portions 212A and 232A can suppress the rate of variation in resistance due to microcracks, thereby reducing variations in the resistance of the product.

[0157] Figure 12 shows the change in resistance variation rate with crack length. In Figure 12, A2 shows an example where the trimming groove does not have a tilted tip, and A3 shows an example of this embodiment where the trimming groove has a tilted tip. As is clear from Figure 12, providing a tilted tip can reduce the resistance variation rate with microcrack length.

[0158] Eighth Embodiment In the sixth and seventh embodiments described above, two trimming grooves are formed in one rectangular portion, but the number of trimming grooves may be two or more.

[0159] 13, a chip resistor 101B having three trimming grooves will be described as an eighth embodiment. Note that the basic configuration of the chip resistor 101B is the same as that of the chip resistor 101 according to the sixth embodiment, and therefore differences will be mainly described.

[0160] (8-1) Overview of Chip Resistor As shown in FIG. 13, the chip resistor 101B has an insulating substrate 102B, a first upper surface electrode 103B, a second upper surface electrode 104B, and a resistor 105B.

[0161] (8-2) Insulating Substrate The insulating substrate 102B is made of, for example, Al ２ O ３ The insulating substrate 102B is made of alumina containing 96% of arsenic and has a rectangular shape (rectangular when viewed from above). The insulating substrate 102B has a longitudinal direction along the Y axis, a lateral direction along the X axis, and a thickness direction along the Z axis.

[0162] (8-3) Upper Surface Electrodes The first upper surface electrode 103B and the second upper surface electrode 104B are provided at both longitudinal ends of the surface 121B of the insulating substrate 102B, and are formed by printing and firing a thick film material containing a metal such as silver.

[0163] (8-4) Resistor (8-4-1) Overview of Resistor The resistor 105B is formed on the surface 121B of the insulating substrate 102B between the first upper surface electrode 103B and the second upper surface electrode 104B, and is connected to the first upper surface electrode 103B and the second upper surface electrode 104B. The resistor 105B has a first edge 151B and a second edge 152B extending in the Y-axis direction. The first edge 151B is provided on the second side in the X-axis direction, and the second edge 152B is provided on the first side in the X-axis direction.

[0164] The resistor 105B has a meandering portion 106B, a first rectangular portion 107B, and a second rectangular portion 108B.

[0165] The serpentine portion 106B is located at the longitudinal center of the surface 121B of the insulating substrate 102B, i.e., between the first upper surface electrode 103B and the second upper surface electrode 104B. The serpentine portion 106B has a first recess 109B and a second recess 110B. In the Y-axis direction, the first recess 109B is located on the first upper surface electrode 103B side, and the second recess 110B is located on the second upper surface electrode 104B side. The first recess 109B extends in the X-axis direction from a second edge 152B on a first side in the X-axis direction of the resistor 105B, and the second recess 110B extends in the X-axis direction from a first edge 151B on a second side in the X-axis direction of the resistor 105B. This results in the serpentine portion 106B having a twice-folded serpentine shape (approximately S-shaped).

[0166] The first rectangular portion 107B continues from the serpentine portion 106B and is connected to the first upper surface electrode 103B.

[0167] The second rectangular portion 108B continues from the serpentine portion 106B and is connected to the second upper surface electrode 104B.

[0168] (8-4-2) Rectangular Portion (8-4-2-1) First Rectangular Portion The first rectangular portion 107B is formed with a first trimming groove 111B, a second trimming groove 112B, and a fifth trimming groove 115B. The first trimming groove 111B, the second trimming groove 112B, and the fifth trimming groove 115B extend parallel to each other along the X-axis direction from a first edge 151B of the first rectangular portion 107B and are linear. The first trimming groove 111B, the second trimming groove 112B, and the fifth trimming groove 115B give the first rectangular portion 107B a serpentine shape. The first trimming groove 111B, the second trimming groove 112B, and the fifth trimming groove 115B are aligned in this order from the second side toward the first side in the Y-axis direction. The first trimming groove 111B, the second trimming groove 112B, and the fifth trimming groove 115B are formed in the first rectangular portion 107B near the first upper surface electrode 103B (in the region closer to the first upper surface electrode 103B than the center of the first rectangular portion 107 in the Y-axis direction).

[0169] The first trimming groove 111B is provided closer to the first upper surface electrode 103B than the second trimming groove 112B in the Y-axis direction.

[0170] First trimming groove 111B is longer than second trimming groove 112B. That is, the tip of first trimming groove 111B is located closer to second edge 152B than the tip of second trimming groove 112B.

[0171] Fifth trimming groove 115B is formed on the opposite side of second trimming groove 112B from first trimming groove 111B. Fifth trimming groove 115B is shorter than second trimming groove 112B. As a result, three trimming grooves are formed in first rectangular portion 107B, with the longer ones closer to first upper surface electrode 103B.

[0172] (8-4-2-2) Second Rectangular Portion The second rectangular portion 108B is formed with a third trimming groove 113B, a fourth trimming groove 114B, and a sixth trimming groove 116B. The third trimming groove 113B, the fourth trimming groove 114B, and the sixth trimming groove 116B are aligned in this order from the first side toward the second side in the Y-axis direction. The third trimming groove 113B, the fourth trimming groove 114B, and the sixth trimming groove 116B extend parallel to each other along the X-axis direction from the second edge 152B of the second rectangular portion 108B in a linear manner. The third trimming groove 113B, the fourth trimming groove 114B, and the sixth trimming groove 116B give the second rectangular portion 108B a serpentine shape. The third trimming groove 113B, the fourth trimming groove 114B, and the sixth trimming groove 116B are formed in the vicinity of the second upper surface electrode 104B within the second rectangular portion 108B (in the region closer to the second upper surface electrode 104B than the center of the second rectangular portion 108B in the Y-axis direction).

[0173] The third trimming groove 113B is provided closer to the second upper surface electrode 104B in the Y-axis direction than the fourth trimming groove 114B.

[0174] The third trimming groove 113B is longer than the fourth trimming groove 114B.

[0175] The sixth trimming groove 116B is formed on the opposite side of the fourth trimming groove 114B from the second trimming groove 112B. The sixth trimming groove 116B is shorter than the fourth trimming groove 114B. As a result, three trimming grooves are formed in the second rectangular portion 108B, with the longer ones closer to the second top surface electrode 104B.

[0176] (8-5) Effects (8-5-1) In the eighth embodiment, as in the sixth embodiment, the potential difference between both sides of each trimming groove in the rectangular portion can be significantly reduced compared to the case of a single trimming groove. Therefore, a meandering pattern that can withstand a high potential difference can be formed.

[0177] (8-5-2) In particular, in the eighth embodiment, three trimming grooves are formed, with the longer ones closer to the electrode as described above, so that the potential difference between both sides of the trimming groove can be further dispersed and reduced.

[0178] (8-6) Modification of Eighth Embodiment Tip portions as in the seventh embodiment may be formed at the tips of first trimming groove 111B and third trimming groove 113B.

[0179] Ninth Embodiment In the sixth to eighth embodiments, the trimming grooves are formed in both rectangular portions, but they may be formed in only one of the rectangular portions.

[0180] 14, a chip resistor 101C in which a trimming groove is formed only on one rectangular portion will be described as a ninth embodiment. Note that the basic configuration of the chip resistor 101C is the same as that of the chip resistor 101 according to the sixth embodiment, and therefore differences will be mainly described.

[0181] (9-1) Overview of Chip Resistor As shown in FIG. 14, the chip resistor 101C has an insulating substrate 102C, a first upper surface electrode 103C, a second upper surface electrode 104C, and a resistor element 105C.

[0182] (9-2) Insulating Substrate The insulating substrate 102C is made of, for example, Al ２ O ３ The insulating substrate 102C is made of alumina containing 96% of arsenic and has a rectangular shape (rectangular when viewed from above). The longitudinal direction of the insulating substrate 102C is along the Y axis, the lateral direction is along the X axis, and the thickness direction is along the Z axis.

[0183] (9-3) Upper Surface Electrodes The first upper surface electrode 103C and the second upper surface electrode 104C are provided at both longitudinal ends of the surface 121C of the insulating substrate 102C, and are formed by printing and firing a thick film material containing a metal such as silver.

[0184] (9-4) Resistor (9-4-1) Overview of Resistor The resistor 105C is formed on the surface 121C of the insulating substrate 102C between the first upper surface electrode 103C and the second upper surface electrode 104C, and is connected to the first upper surface electrode 103C and the second upper surface electrode 104C. The resistor 105C has a first edge 151C and a second edge 152C extending in the Y-axis direction. The first edge 151C is provided on the second side in the X-axis direction, and the second edge 152C is provided on the first side in the X-axis direction.

[0185] The resistor 105C has a meandering portion 106C and a rectangular portion 107C.

[0186] The serpentine portion 106C is located at the longitudinal center of the surface 121C of the insulating substrate 102C, i.e., between the first upper surface electrode 103C and the second upper surface electrode 104C. The serpentine portion 106C has a first recess 109C, a second recess 110C, and a third recess 117C. The first recess 109C, the second recess 110C, and the third recess 117C are aligned in this order from the second side toward the first side in the Y-axis direction. In the Y-axis direction, the first recess 109C is located on the first upper surface electrode 103B side, the third recess 117C is located on the second upper surface electrode 104C side, and the second recess 110C is located between the first recess 109C and the third recess 117C. The first recess 109C extends in the X-axis direction from a second edge 152C on the first side in the X-axis direction of the resistor 105C. The second recess 110C extends in the X-axis direction from a first edge 151C on the second side in the X-axis direction of the resistor 105C. The third recess 117C extends in the X-axis direction from a second edge 152C on the first side in the X-axis direction of the resistor 105C. This results in the serpentine portion 106C having a three-fold serpentine shape.

[0187] The rectangular portion 107C continues from the serpentine portion 106C and is connected to the first upper surface electrode 103C.

[0188] (9-4-2) Rectangular portion A first trimming groove 111C and a second trimming groove 112C are formed in the rectangular portion 107C. The first trimming groove 111C and the second trimming groove 112C extend parallel to each other along the X-axis direction from a first edge 151C of the rectangular portion 107C and are linear. The first trimming groove 111C and the second trimming groove 112C give the rectangular portion 107C a serpentine shape. The first trimming groove 111C and the second trimming groove 112C are formed in the rectangular portion 107C near the first top surface electrode 103C (in a region closer to the first top surface electrode 103C than the center of the first rectangular portion 107C in the Y-axis direction).

[0189] The first trimming groove 111C is provided closer to the first upper surface electrode 103C than the second trimming groove 112C in the Y-axis direction.

[0190] First trimming groove 111C is longer than second trimming groove 112C. That is, the tip of first trimming groove 111C is located closer to second edge 152C than the tip of second trimming groove 112C.

[0191] (9-5) Effects In the ninth embodiment, as in the sixth embodiment, the potential difference between both sides of each trimming groove in the rectangular portion can be significantly reduced compared to the case of a single trimming groove. Therefore, a meandering pattern that can withstand a high potential difference can be formed.

[0192] (9-6) Modification of the Ninth Embodiment Tip portions as in the seventh embodiment may be formed at the tips of the first trimming groove 111B and the third trimming groove 113B.

[0193] The number of trimming grooves formed in the rectangular portion may be three as in the eighth embodiment.

[0194] (Modifications) The above-described embodiments are merely examples of various embodiments of the present disclosure. The above-described embodiments can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. Modifications of the above-described embodiments are listed below. The modifications described below can be applied in appropriate combinations.

[0195] The chip resistor 101 may be a thin film chip resistor.

[0196] The number of trimming grooves is not particularly limited.

[0197] The trimming grooves may include curves or other shapes other than straight lines.

[0198] (Aspects) The present specification discloses the following aspects.

[0199] A chip resistor (101, 101A, 101B, 101C) according to a seventh aspect includes a substrate (102, 102A, 102B, 102C), a first electrode (103, 103A, 103B, 103C), a second electrode (104, 104A, 104B, 104C), and a resistor (105, 105A, 105B, 105C). The first electrode (103, 103A, 103B, 103C) and the second electrode (104, 104A, 104B, 104C) are provided at both ends in a first direction (Y) of one surface (121, 121A, 121B, 121C) of the substrate (102, 102A, 102B, 102C). The resistors (105, 105A, 105B, 105C) are provided on one surface (121, 121A, 121B, 121C) of the substrate (102, 102A, 102B, 102C) between the first electrodes (103, 103A, 103B, 103C) and the second electrodes (104, 104A, 104B, 104C). The resistors (105, 105A, 105B, 105C) have serpentine portions (106, 106A, 106B, 106C) and rectangular portions (107, 107A, 107B, 107C) connected to the serpentine portions (106, 106A, 106B, 106C) and the first electrodes (103, 103A, 103B, 103C). The first trimming grooves (111, 111A, 111B, 111C) and the second trimming grooves (112, 112A, 112B, 112C) are formed in the rectangular portions (107, 107A, 107B, 107C) and extend from edges (151, 151A, 151B, 151C) extending in a first direction (Y) of the rectangular portions (107, 107A, 107B, 107C) along a second direction (X) perpendicular to the first direction (Y), thereby giving the rectangular portions (107, 107A, 107B, 107C) a serpentine shape.

[0200] According to this embodiment, the potential difference between both sides of the trimming groove can be reduced, so that even when the chip resistor is used at high voltage, dielectric breakdown in the trimming groove is unlikely to occur, resulting in a chip resistor that is less likely to have characteristic abnormalities and has excellent electrical resistance value accuracy.

[0201] In a chip resistor (101, 101A, 101B, 101C) according to an eighth aspect, in the seventh aspect, the first trimming grooves (111, 111A, 111B, 111C) are formed closer to the first electrodes (103, 103A, 103B, 103C) in the first direction (Y) than the second trimming grooves (112, 112A, 112B, 112C). The first trimming grooves (111, 111A, 111B, 111C) are longer than the second trimming grooves (112, 112A, 112B, 112C).

[0202] According to this aspect, the potential difference across the banks of the plurality of trimming grooves can be reduced compared to when the grooves have the same length, making it less likely that dielectric breakdown will occur.

[0203] In the chip resistor (101A) of the ninth aspect, in the eighth aspect, the first trimming groove (111A) has a straight portion (211A) and a tip portion (212A) extending from the tip of the straight portion (211A) toward the first electrode (103A).

[0204] This embodiment reduces current concentration at the tip of the trimming groove, thereby suppressing abnormal characteristics due to overload. Furthermore, laser trimming generally tends to cause microcracks in the direction of the trimming, resulting in variations in resistance. However, this embodiment, by providing an inclined tip, can suppress changes in resistance due to microcracks, thereby reducing variations in resistance in chip resistors.

[0205] In a chip resistor (101, 101A, 101B) according to a tenth aspect, in any of the seventh to ninth aspects, the rectangular portion (107, 107A, 107B) is a first rectangular portion (107, 107A, 107B). The edges (151, 151A, 151B, 151C) are first edges (151, 151A, 151B, 151C). The chip resistor (101, 101A, 101B) further includes a second rectangular portion (108, 108A, 108B) connected to the second electrode (104, 104A, 104B), and third trimming grooves (113, 113A, 113B) and fourth trimming grooves (114, 114A, 114B) formed in the second rectangular portion (108, 108A, 108B) and extending along the second direction (X) from second edges (152, 152A, 152B) extending in the first direction (Y) of the second rectangular portion (108, 108A, 108B).

[0206] According to this aspect, by adjusting the resistance value in the vicinity of the electrodes on both sides, the adjustable range of the resistance value can be widened, and the accuracy of the resistance value adjustment can be improved.

[0207] In a chip resistor (101, 101A, 101B) according to an eleventh aspect, in the tenth aspect, the third trimming groove (113, 113A, 113B) is provided closer to the remaining electrode than the fourth trimming groove (114, 114A, 114B) in the first direction (Y). The third trimming groove (113, 113A, 113B) is longer than the fourth trimming groove (114, 114A, 114B).

[0208] According to this aspect, the potential difference across the banks of the plurality of trimming grooves can be reduced compared to when the grooves have the same length, making it less likely that dielectric breakdown will occur.

[0209] In the chip resistor (101A) of the 12th aspect, in the 11th aspect, the third trimming groove (113A) has a straight portion (231A) and a tip portion (232A) extending from the tip of the straight portion (231A) toward the second electrode (104A).

[0210] This embodiment reduces current concentration at the tip of the trimming groove, thereby suppressing abnormal characteristics due to overload. Furthermore, laser trimming generally tends to cause microcracks in the direction of the trimming, resulting in variations in resistance. However, this embodiment, by providing an inclined tip, can suppress changes in resistance due to microcracks, thereby reducing variations in resistance in chip resistors.

[0211] A method for manufacturing a chip resistor (101, 101A, 101B, 101C) according to a thirteenth aspect includes a step of forming first electrodes (103, 103A, 103B, 103C) and second electrodes (104, 104A, 104B, 104C) at both ends in a first direction (Y) on one surface of a substrate (102, 102A, 102B, 102C); and a step of forming a serpentine portion (106, 106A, 106B, 106C) at the middle of the first direction on one surface (121, 121A, 121B, 121C) of the substrate (102, 102A, 102B, 102C) and a rectangular portion connected to the serpentine portion (106, 106A, 106B, 106C) and the first electrode (103, 103A, 103B, 103C). and forming first trimming grooves (111, 111A, 111B, 111C) and second trimming grooves (112, 112A, 112B, 112C) in the rectangular portions (107, 107A, 107B, 107C), the first trimming grooves (111, 111A, 111B, 111C) and second trimming grooves (112, 112A, 112B, 112C) extending from edges (151, 151A, 151B, 151C) extending in a first direction (Y) of the rectangular portions (107, 107A, 107B, 107C) along a second direction (X) perpendicular to the first direction (Y), thereby making the rectangular portions (107, 107A, 107B, 107C) serpentine.

[0212] According to this embodiment, the potential difference between both sides of the trimming groove can be reduced, so that even when the chip resistor is used at high voltage, dielectric breakdown in the trimming groove is unlikely to occur, resulting in a chip resistor that is less likely to have characteristic abnormalities and has excellent electrical resistance value accuracy.

[0213] A manufacturing method for a chip resistor (101, 101A, 101B, 101C) according to a fourteenth aspect is the thirteenth aspect, in which the first trimming grooves (111, 111A, 111B, 111C) are formed closer to one electrode than the second trimming grooves (112, 112A, 112B, 112C) in the first direction (Y). The first trimming grooves (111, 111A, 111B, 111C) are longer than the second trimming grooves (112, 112A, 112B, 112C).

[0214] According to this aspect, the potential difference across the banks of the plurality of trimming grooves can be reduced compared to when the grooves have the same length, making it less likely that dielectric breakdown will occur.

[0215] In the manufacturing method of the chip resistor (101A) according to the 15th aspect, in the 14th aspect, the first trimming groove (111A) has a straight portion (211A) and a tip portion (212A) extending from the tip of the straight portion (211A) toward the first electrode (103A).

[0216] This embodiment reduces current concentration at the tip of the trimming groove, thereby suppressing abnormal characteristics due to overload. Furthermore, laser trimming generally tends to cause microcracks in the direction of the trimming, resulting in variations in resistance. However, this embodiment, by providing the trimming groove with an inclined tip, can suppress changes in resistance due to microcracks, thereby reducing variations in resistance in chip resistors.

[0217] DESCRIPTION OF SYMBOLS 1, 1A, 1B, 1C, 1D Chip resistor 2, 2B, 2C, 2D Insulating substrate (substrate) 3, 3C First upper surface electrode (electrode) 4, 4C Second upper surface electrode (electrode) 5, 5B, 5C, 5D Resistor 11 Sixth rectangular portion (connection portion) 11C Connection portion 12, 12A, 12B, 12C, 12D Resistance value adjustment portion 14, 14A, 14B, 14C, 14D Second edge (groove starting edge) 15, 15A, 15B, 15C, 15D Serpentine forming portion 16, 16A, 16B, 16C, 16D First trimming groove 17, 17A, 17B, 17C, 17D Second trimming groove 16P1, 16A1, 16B1, 16C1, 16D1 First straight portion 17P1, 17A1, 17B1, 17C1, 17D1 Second straight portion 17P2, 17A2, 17B2, 17C2, 17D2 Bent portion 21, 21C Surface 31 First connection portion 32 Second connection portion 49 Edge 50 Edge 101, 101A, 101B, 101C Chip resistor 102, 102A, 102B, 102C Insulating substrate 103, 103A, 103B, 103C First upper surface electrode 104, 104A, 104B, 104C Second upper surface electrode 105, 105A, 105B, 105C Resistor 106, 106A, 106B, 106C Serpentine portion 107, 107A, 107B First rectangular portion 107C Rectangular portion 108, 108A, 108B Second rectangular portion 111, 111A, 111B, 111C First trimming groove 112, 112A, 112B, 112C Second trimming groove 113, 113A, 113B Third trimming groove 114, 114A, 114B Fourth trimming groove 115B Fifth trimming groove 116B Sixth trimming groove

Claims

1. A substrate; a pair of electrodes provided on both ends of one surface of the substrate; a resistor provided between the pair of electrodes on the one surface of the substrate, The resistor is a pair of connection portions respectively connected to the pair of electrodes and arranged along a first direction; a resistance value adjusting portion provided between the pair of connecting portions, a meander forming portion for forming the resistance value adjusting portion into a meander shape is formed in the resistance value adjusting portion, a first trimming groove and a second trimming groove are formed in the meander forming portion, the first trimming groove and the second trimming groove are aligned along the first direction, the first trimming groove has a first linear portion extending from a groove starting edge of the resistance value-adjusting portion along a second direction perpendicular to the first direction, the second trimming groove has a second linear portion extending along the second direction from the groove starting edge of the resistance value adjusting portion, and a bent portion extending from a tip of the second linear portion in a direction approaching the first trimming groove. Chip resistors.

2. the second linear portion is longer in the second direction than the first linear portion; The chip resistor according to claim 1 .

3. the bent portion of the second trimming groove is disposed on the opposite side of the groove starting edge with respect to the tip of the first linear portion of the first trimming groove; The chip resistor according to claim 1 or 2.

4. The chip resistor according to claim 1 , wherein the bent portion has a folded portion that extends so as to fold back relative to the second linear portion.

5. The folded portion of the second trimming groove has at least a partial arc portion. The chip resistor according to claim 4 .

6. each of the pair of connection parts is provided near the groove starting edge and has a connection part connected to the resistance value adjustment part; where a1 is the length from the edge of the connecting portion opposite the groove starting edge to the tip of the second trimming groove, and b1 is the length from the edge of the connecting portion to the tip of the first trimming groove, a1 / b1≧0.53 and a1 / b1≦1.30 are satisfied. The chip resistor according to claim 1 or 2.

7. A substrate; a first electrode and a second electrode provided at both ends in a first direction on one surface of the substrate; a resistor provided between the first electrode and the second electrode on the one surface of the substrate, The resistor is A meandering section, a first rectangular portion connected to the meandering portion and the first electrode, The first rectangular portion is formed with a first trimming groove and a second trimming groove extending from a first edge of the first rectangular portion extending in the first direction along a second direction perpendicular to the first direction, thereby forming the first rectangular portion in a serpentine shape. Chip resistors.

8. the first trimming groove is formed closer to the first electrode than the second trimming groove in the first direction, The first trimming groove is longer than the second trimming groove. The chip resistor according to claim 7 .

9. The first trimming groove is A straight section; a tip portion extending from a tip of the linear portion toward the first electrode; having The chip resistor according to claim 8 .

10. The resistor is a second rectangular portion connected to the serpentine portion and the second electrode; The second rectangular portion has a third trimming groove and a fourth trimming groove formed therein, the third trimming groove and the fourth trimming groove extending along the second direction from a second edge of the second rectangular portion extending in the first direction. The chip resistor according to any one of claims 7 to 9.

11. the third trimming groove is provided closer to the second electrode than the fourth trimming groove in the first direction, The third trimming groove is longer than the fourth trimming groove. The chip resistor according to claim 10.

12. The third trimming groove is A straight section; a tip portion extending from a tip of the linear portion toward the second electrode; having The chip resistor according to claim 11.

13. forming a first electrode and a second electrode on both ends in a first direction of one surface of a substrate; forming a resistor having a meandering portion and a rectangular portion connected to the first electrode at a middle point in the first direction on the one surface of the substrate; forming a first trimming groove and a second trimming groove in the rectangular portion, the first trimming groove and the second trimming groove extending from an edge of the rectangular portion extending in the first direction along a second direction perpendicular to the first direction to form the rectangular portion in a serpentine shape; Manufacturing method of chip resistors.

14. the first trimming groove is formed closer to the one electrode than the second trimming groove in the first direction, The first trimming groove is longer than the second trimming groove. The method for manufacturing the chip resistor according to claim 13 .

15. The first trimming groove is A straight section; a tip portion extending from a tip of the linear portion toward the first electrode; having The method for manufacturing the chip resistor according to claim 14 .