Film resistance value adjusting method and system, PCB circuit board and printing equipment

Abstract

The application discloses a film resistance value adjusting method and system, a PCB circuit board and a printing device. The film resistance value adjusting method comprises the following steps: obtaining a target resistance value, an actual resistance value, a width value and a process square resistance value of a formed film resistance; in the case that the actual resistance value is greater than the target resistance value, performing difference calculation and processing on the target resistance value and the actual resistance value to obtain a resistance value deviation value; performing calculation and processing on the resistance value deviation value, the width value and the process square resistance value to obtain a length design value; and printing a surface resistance on the formed film resistance according to the length design value. According to the scheme of the embodiment of the application, the surface resistance with the length design value is connected in parallel on the formed film resistance, the local resistance value of the formed film resistance is failed, the resistance value of the formed film resistance is reduced, the formed film resistance value is adjusted to the qualified range, and the qualified rate of products is improved.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, and in particular to a method and system for adjusting the resistance value of a thin film resistor, a PCB circuit board, and printing equipment. Background Technology

[0002] Thin-film resistors are high-end products in printed circuit boards (PCBs). During PCB manufacturing, a series of complex processes, including photolithography and chemical etching, allow for the simultaneous fabrication of resistive film areas—thin-film resistors—within the circuitry. Thin-film resistors possess the same functions as resistive components, but their use on PCBs eliminates the need for surface mount technology, and they occupy less space on the PCB. In traditional thin-film resistor manufacturing, resistance values ​​are controlled solely by the length and width of the resistor. Therefore, the accuracy of the finished thin-film resistor is limited by the stability of the thin-film resistor material, the precision of the photolithography equipment, and the etching equipment, making it difficult to improve resistance accuracy and meet the increasingly stringent precision requirements of the current electronics industry.

[0003] In related technologies, two main laser-based resistor trimming processes are used to adjust the resistance value of molded thin-film resistors. The first method involves laser ablation of an L-shaped path starting from the edge of the molded thin-film resistor, making it equivalent to two trapezoidal resistors and a rectangular resistor connected in series. This reduces the effective width of the resistor, thereby increasing its resistance value. The second method involves ablation of an array of laser spots from the middle of the molded thin-film resistor, making it equivalent to several rectangular resistors connected in parallel and then in series with two rectangular resistors. This also reduces the effective width of the resistor, thus increasing its resistance value. Both methods increase the resistance value by locally reducing the effective width of the thin-film resistor, thus adjusting an undersized resistance to a acceptable range. However, neither method can actually reduce the actual resistance value of the thin-film resistor. Summary of the Invention

[0004] This invention provides a method and system for adjusting the resistance value of a thin film resistor, a PCB circuit board, and a printing equipment. It can reduce the resistance value of the molded thin film resistor, adjust the excessively large resistance value of the molded thin film resistor to the qualified range, and improve the product qualification rate.

[0005] In a first aspect, embodiments of the present invention provide a method for adjusting the resistance value of a thin film resistor, comprising: obtaining a target resistance value, an actual resistance value, a width value, and a process resistance value of a molded thin film resistor; when the actual resistance value is greater than the target resistance value, performing a difference calculation on the target resistance value and the actual resistance value to obtain a resistance value deviation value; performing a length design value calculation based on the resistance value deviation value, the width value, and the process resistance value; and printing a surface resistor on the molded thin film resistor according to the length design value.

[0006] The thin-film resistor value adjustment method provided in the first aspect of the present invention has at least the following beneficial effects: obtaining the target resistance value, actual resistance value, width value, and process resistance value of the molded thin-film resistor; when the actual resistance value is greater than the pre-designed target resistance value, calculating the difference between the target resistance value and the actual resistance value to obtain a resistance value deviation value; calculating the length design value based on the resistance value deviation value, width value, and process resistance value; printing a surface resistor on the molded thin-film resistor according to the length design value, and connecting the surface resistor in parallel to the molded thin-film resistor to reduce the resistance value of the molded thin-film resistor. In the solution of the embodiment of the present invention, when the actual resistance value is greater than the pre-designed target resistance value, by connecting a surface resistor with a length design value in parallel to the molded thin-film resistor, the local resistance value of the molded thin-film resistor is rendered ineffective, thereby reducing the resistance value of the molded thin-film resistor, adjusting the excessively large resistance value of the molded thin-film resistor to the qualified range, and improving the product qualification rate; it can also control the amount of resistance reduction by adjusting the design length value of the surface resistor, realizing quantitative control of the resistance value adjustment of the molded thin-film resistor.

[0007] According to some embodiments of the present invention, the step of calculating and processing the length design value based on the resistance deviation value, the width value, and the process resistance value includes: multiplying the ratio of the width value and the process resistance value by the resistance deviation value to obtain the length design value.

[0008] According to some embodiments of the present invention, the step of calculating the difference between the target resistance value and the actual resistance value to obtain the resistance deviation value includes: subtracting the target resistance value from the actual resistance value to obtain the resistance deviation value.

[0009] According to some embodiments of the present invention, the width value of the printed surface resistivity is less than or equal to the width value of the molded thin film resistivity.

[0010] Secondly, embodiments of the present invention provide a PCB circuit board, including: a molded thin film resistor; and a surface resistance printed on the molded thin film resistor according to a length design value, wherein the length design value is calculated based on the resistance deviation between the target resistance value and the actual resistance value, the width value of the molded thin film resistor, and the process resistance value of the molded thin film resistor when the actual resistance value of the molded thin film resistor is greater than the target resistance value.

[0011] According to some embodiments of the present invention, the process resistance of the conductive material used for the surface resistor is less than the process resistance of the molded thin film resistor.

[0012] According to some embodiments of the present invention, the conductive material used for the surface resistance is a metal paste.

[0013] Thirdly, embodiments of the present invention provide a thin-film resistor value adjustment system, comprising: a data acquisition module, used to acquire a target resistance value, an actual resistance value, a width value, and a process resistance value of the molded thin-film resistor; a calculation and processing module, used to calculate a resistance deviation value by performing a difference calculation on the target resistance value and the actual resistance value when the actual resistance value is greater than the target resistance value; and to calculate a length design value based on the resistance deviation value, the width value, and the process resistance value; and a printing control module, used to print a surface resistor on the molded thin-film resistor according to the length design value.

[0014] Fourthly, embodiments of the present invention provide a printing apparatus, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the thin-film resistor value adjustment method as described in the first aspect.

[0015] Fifthly, embodiments of the present invention provide a storage medium storing computer-executable instructions for performing the thin-film resistor value adjustment method as described in the first aspect.

[0016] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the description and the drawings. Attached Figure Description

[0017] The accompanying drawings are provided to further understand the technical solutions of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the technical solutions of the present invention, and do not constitute a limitation on the technical solutions of the present invention.

[0018] Figure 1 This is a schematic diagram of the structure of a thin-film resistor value adjustment system provided in one embodiment of the present invention;

[0019] Figure 2 This is a schematic flowchart of a thin-film resistor value adjustment method provided in an embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of the structure of a molded thin-film resistor provided in one embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the structure of a printing device provided in one embodiment of the present invention. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0023] It should be noted that although the flowchart shows a logical order, in some cases, the steps shown or described may be performed in a different order than that shown in the flowchart. The terms "first," "second," etc., used in the specification and the above figures are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0024] This invention provides a method and system for adjusting the resistance value of a thin-film resistor based on big data, as well as a printing equipment and a computer-readable storage medium. In embodiments of this invention, the pre-designed target resistance value, actual resistance value, width value, and process resistance value of the molded thin-film resistor are obtained. If the actual resistance value is greater than the target resistance value, a resistance deviation value is obtained by calculating the difference between the target resistance value and the actual resistance value. A length design value is obtained by calculating the resistance deviation value, width value, and process resistance value. A surface resistor is printed on the molded thin-film resistor according to the length design value, and the surface resistor is connected in parallel to the molded thin-film resistor to reduce its resistance value. In other words, the solution of this invention, when the actual resistance value is greater than the target resistance value, causes the local resistance value of the molded film resistor to fail by connecting a surface resistor with a length design value in parallel with the molded film resistor, thereby reducing the resistance value of the molded film resistor and adjusting the excessively large resistance value of the molded film resistor to the qualified range, thus improving the product qualification rate; it can also control the amount of resistance reduction by adjusting the design length value of the surface resistor, thereby achieving quantitative control of the resistance value adjustment of the molded film resistor.

[0025] The embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0026] Reference Figure 1 , Figure 1 This is a schematic diagram of the structure of a thin-film resistor value adjustment system provided in one embodiment of the present invention. Figure 1 In the example, the thin-film resistor value adjustment system includes: a data acquisition module 110, a calculation and processing module 120, and a printing control module, wherein the calculation and processing module 120 is communicatively connected to the data acquisition module 110 and the printing control module 130, respectively.

[0027] The data acquisition module 110 is used to acquire the target resistance value, actual resistance value, width value, and process resistance value of the molded thin-film resistor. The data acquisition module sends the target resistance value, actual resistance value, width value, and process resistance value of the molded thin-film resistor to the calculation and processing module 120.

[0028] The calculation and processing module 120 is used to calculate the difference between the target resistance value and the actual resistance value to obtain a resistance deviation value when the actual resistance value is greater than the target resistance value; and to calculate the length design value based on the resistance deviation value, width value, and process resistance value. After receiving the target resistance value, actual resistance value, width value, and process resistance value of the molded thin film resistor sent by the data acquisition module 110, the calculation and processing module 120 performs calculations based on the acquired data to obtain the length design value, and sends the length design value to the printing control module 130.

[0029] The printing control module 130 is used to print surface resistors on the molding film resistor according to the length design value. Upon receiving the calculated length design value from the calculation processing module 120, the printing control module prints the surface resistor on the molding film resistor according to the length design value. That is, the length of the surface resistor is the calculated length design value. The surface resistor is connected in parallel to the molding film resistor to reduce its resistance value. When the actual resistance value is greater than the target resistance value, the film resistor value adjustment system, by connecting the surface resistor with the length design value in parallel to the molding film resistor, causes a local resistance failure in the molding film resistor, thereby reducing the resistance value and adjusting the excessively high resistance value to the acceptable range, improving the product yield. It can also control the amount of resistance reduction by adjusting the design length value of the surface resistor, achieving quantitative control of the resistance value adjustment of the molding film resistor.

[0030] The system structure and application scenarios described in the embodiments of this invention are for the purpose of more clearly illustrating the technical solutions of the embodiments of this invention, and do not constitute a limitation on the technical solutions provided by the embodiments of this invention. As those skilled in the art will know, with the evolution of system structure and the emergence of new application scenarios, the technical solutions provided by the embodiments of this invention are also applicable to similar technical problems.

[0031] Reference Figure 2 , Figure 2 This is a schematic flowchart of a thin-film resistor value adjustment method according to an embodiment of the present invention. This thin-film resistor value adjustment method is applied to, for example... Figure 1 The thin-film resistor value adjustment system shown includes, but is not limited to, steps S210, S220, S230, and S240.

[0032] Step S210: Obtain the target resistance value, actual resistance value, width value, and process resistance value of the molded thin film resistor.

[0033] In this step, the thin film resistor adjustment system obtains the target resistance value, actual resistance value, width value, and process resistance value of the formed thin film resistor. This is to facilitate the calculation of the resistance deviation between the actual resistance value and the target resistance value of the formed thin film resistor, which is beneficial for adjusting the formed thin film resistor based on the resistance deviation.

[0034] Understandably, after fabricating a thin-film resistor, its actual resistance, width, length, and thickness can be measured. The pre-designed target resistance and the resistivity of the material used to manufacture the thin-film resistor can be obtained through the design scheme of the thin-film resistor. The process resistance of the fabricated thin-film resistor is the ratio of the resistivity of the material used to manufacture the thin-film resistor to the thickness of the fabricated thin-film resistor. When the resistivity of the material used to manufacture the thin-film resistor and the thickness of the fabricated thin-film resistor are determined, the process resistance can also be obtained directly and clearly.

[0035] Specifically, the formula for calculating the resistance of a molded thin film is R = R 方 ×L / W, where R 方 =ρ 薄膜 / h 薄膜 R 方 It is the process resistance value of the molded thin-film resistor, ρ 薄膜 h is the resistivity of the material used to manufacture thin-film resistors. 薄膜 L is the thickness of the molded thin film resistor, W is the length of the molded thin film resistor, and W is the width of the molded thin film resistor.

[0036] Step S220: When the actual resistance value is greater than the target resistance value, calculate the difference between the target resistance value and the actual resistance value to obtain the resistance deviation value.

[0037] In this step, after obtaining the actual and target resistance values ​​of the molded thin-film resistor, the thin-film resistor adjustment system compares the actual and target resistance values. If the actual resistance value is greater than the pre-designed target resistance value, the system calculates the difference between the target and actual resistance values ​​to obtain a resistance deviation value. In one embodiment of the invention, the resistance deviation value is obtained by subtracting the target resistance value from the actual resistance value. This facilitates adjusting the molded thin-film resistor using the resistance deviation value, bringing an excessively high resistance value within the acceptable range, and achieving quantitative control over the resistance adjustment of the molded thin-film resistor.

[0038] Specifically, the resistance deviation ΔR = R 实际 -R 设计 , where R 实际 R is the actual resistance value of the molded thin-film resistor. 设计 It is the target resistance value of the molded thin-film resistor.

[0039] Step S230: Calculate and process the resistance deviation, width, and process resistance to obtain the length design value.

[0040] In this step, after obtaining the resistance deviation value, width value, and process resistance value, the thin-film resistor adjustment system calculates and processes these values ​​to obtain the length design value. In one embodiment of the invention, the ratio of the width value to the process resistance value is multiplied by the resistance deviation value to obtain the length design value. This allows for quantitative control of the resistance adjustment of the molded thin-film resistor by controlling the amount of resistance reduction using the length design value.

[0041] Specifically, ΔR = R 方 ×ΔL / W, then the design length ΔL=ΔR×(W / R) 方 ), where ΔR is the resistance deviation between the actual resistance value and the target resistance value of the molded thin film resistor, R 方 is the process resistance value of the molded thin-film resistor, and W is the width value of the molded thin-film resistor.

[0042] Step S240: Print the surface resistance on the molded thin film resistor according to the length design value.

[0043] In this step, after calculating the design length value of the surface resistor used to reduce the resistance value of the molded thin-film resistor, the thin-film resistor value adjustment system prints the surface resistor on the molded thin-film resistor according to the design length value. After drying, a molded thin-film resistor with the surface resistor connected in parallel is obtained. By connecting the surface resistor in parallel with the molded thin-film resistor, the local resistance value of the molded thin-film resistor is rendered ineffective, thus reducing the resistance value of the molded thin-film resistor. This adjusts the excessively high resistance value of the molded thin-film resistor to the acceptable range, improving the product yield.

[0044] It is understandable that the width value of the printed surface resistivity is less than or equal to the width value of the molded thin film resistivity.

[0045] It is understood that surface resistors with a length equal to the designed length can be printed on the molded thin-film resistor by means of inkjet printing, screen printing, etc. Therefore, this invention does not impose specific restrictions on the printing method used, as long as it is possible to print surface resistors on the molded thin-film resistor.

[0046] It should be noted that surface resistance can cause local resistance of the molded thin film resistor to fail. The amount of reduction in resistance of the molded thin film resistor is related to the length of the surface resistor and is not related to the position of the surface resistor on the molded thin film resistor. Therefore, this invention does not limit the specific printing position of the surface resistor on the molded thin film resistor, as long as the surface resistor is printed within the surface area of ​​the molded thin film resistor.

[0047] Furthermore, the sheet resistance of the material used in the printed surface resistor is less than the sheet resistance of the thin film resistor. The material used in the printed surface resistor can be metal paste or other materials. This invention does not impose specific restrictions on the material used in the printed surface resistor. The material of the printed surface resistor can be selected based on factors such as product cost and material performance.

[0048] Through steps S210 to S240, when the actual resistance value is greater than the target resistance value, a surface resistor with a length design value is connected in parallel with the molding film resistor to cause the local resistance value of the molding film resistor to fail, thereby reducing the resistance value of the molding film resistor and adjusting the excessively large resistance value of the molding film resistor to the qualified range, thus improving the product qualification rate; it is also possible to determine the amount of resistance reduction by controlling the length design value of the surface resistor, thereby realizing quantitative control of the resistance value adjustment of the molding film resistor.

[0049] Reference Figure 3 , Figure 3 This is a schematic diagram of the structure of a molded thin-film resistor provided in one embodiment of the present invention. Figure 3 As shown, a molded thin-film resistor with a length of W and a width of L is fabricated. When the actual resistance of the molded thin-film resistor is greater than the target resistance, the actual resistance value R is used as the reference. 实际and the target resistance value R 设计 The resistance deviation ΔR between the two resistors is used to calculate the design length L2. A surface resistor with a length of L2 and a width of W2 is then printed on the molded thin-film resistor. This is equivalent to connecting a surface resistor in parallel with the molded thin-film resistor. The surface resistor thickens a portion of the molded thin-film resistor, thereby increasing the conductivity of the thickened portion. In other words, the resistance of the thickened portion decreases, resulting in a decrease in the overall resistance of the molded thin-film resistor.

[0050] Specifically, it can be understood that before the surface resistor is printed on the molded thin-film resistor, the molded thin-film resistor is equivalent to a resistor formed by parallel connection of thin-film resistors R2, R3, and R4, followed by series connection of R1 and R5. The lengths of thin-film resistors R2, R3, and R4 are all L2, and the widths of thin-film resistors R2, R3, and R4 are W1, W2, and W3, respectively. Therefore, before the surface resistor is printed, the resistance R of the parallel portion of the molded thin-film resistor is... 并联 =R2×R3×R4 / (R2×R3+R2×R4+R3×R4), where:

[0051] R3=(ρ 薄膜 / h 薄膜 )×(L2 / W2);

[0052] ρ 薄膜 h is the resistivity of the material used to manufacture thin-film resistors. 薄膜 It is the thickness of the molded thin-film resistor.

[0053] Print a surface resistance R with a length L2 and a width W2 on a molded thin-film resistor. 表面 Subsequently, when the material used for printing the surface resistor is metal paste, the molded thin-film resistor with the printed surface resistor is equivalent to a resistor formed by R2, R3′, and R4 connected in parallel and then connected in series with R1 and R5. The lengths of resistors R2, R3′, and R4 are all L2, and the widths of resistors R2, R3′, and R4 are W1, W2, and W3, respectively. Therefore, the resistance of the parallel portion of the molded thin-film resistor after printing the surface resistor is:

[0054] R′ 并联 =R2×R3′×R4 / (R2×R3′+R2×R4+R3′×R4); where R3′ is equivalent to the thin film resistance R3 and the surface resistance R 表面 The resistors connected in parallel, specifically:

[0055] R3′=R3×R 表面 / (R3+R 表面 )=ρ 薄膜 ρ 表面 / (ρ 表面 h 薄膜 +ρ 薄膜 h 表面)×L2 / W2=R′ 方 ×L2 / W;

[0056] Among them, R 表面 =(ρ 表面 / h 表面 )×(L2 / W2), R′ 方 =ρ 薄膜 ρ 表面 / (ρ 表面 h 薄膜 +ρ 薄膜 h 表面 ).

[0057] In summary, after printing surface resistors on the molded thin-film resistor, the change in resistance of the equivalent parallel portion on the molded thin-film resistor is:

[0058] ΔR 并联 =R 并联 -R′ 并联 ;

[0059] That is: ΔR 并联 =R2×R3×R4 / (R2×R3+R2×R4+R3×R4)-R2×R3′×R4 / (R2×R3′+R2×R4+R3′×R4).

[0060] Based on the characteristics of parallel resistors, when multiple resistors are connected in parallel, the total resistance is close to the smallest resistance among the resistors connected in parallel. It is understandable that the resistivity of the material used to print surface resistors (such as metal paste) is extremely low, and the surface resistance R... 表面 The resistance is extremely small, close to 0. Therefore, in practical applications, the thin-film resistor R3 is in parallel with the surface resistance R. 表面 Then, the thin film resistor R3 and the surface resistance R 表面 The resistance R3′ after parallel connection is close to 0 and can be ignored. Therefore, R′ 并联 Approaching 0, the change in resistance of the equivalent parallel portion of the molded thin-film resistor is: ΔR 并联 =R 并联 ;Specifically:

[0061] ΔR 并联 =R2×R3×R4 / (R2×R3+R2×R4+R3×R4)=R 方 ×L2 / W.

[0062] From the above derivation, we can see that: a surface resistor R with a length of L2 and a width of W2 is printed on the thin film resistor R3 of the molded thin film resistor. 表面 After that, the resistance decreases by ΔR 并联 The equivalent resistance value of thin-film resistors R2, R3, and R4 connected in parallel, the reduction in resistance ΔR 并联It only depends on the length L2 of the covered thin-film resistor R3. Therefore, according to ΔR 并联 =R 方 ×L2 / W, the resistance value R in the thin film resistor manufacturing process. 方 Given the width W of the thin-film resistor, let the resistance difference ΔR between the actual resistance and the target resistance of the formed thin-film resistor be equal to ΔR. 并联 The design length L2 of the thin-film resistor to be covered can then be obtained; and then a surface resistor R of length L2 is printed on the molded thin-film resistor. 表面 Even if the surface resistance R 表面 It is connected in parallel with the molded thin film resistor, so that the surface resistance R is... 表面 When the covered thin-film resistor fails, the parallel resistance decreases by ΔR; the parallel resistance R of the thin-film resistors R2, R3, and R4 connected in parallel is... 并联 After reducing ΔR, we obtain a parallel resistance R′ consisting of thin-film resistors R2, R3′, and R4 connected in parallel. 并联 Parallel resistor R′ 并联 The total resistance is obtained by connecting it in series with R1 and R5. Compared with the total resistance before the surface resistance is printed, the total resistance is reduced, which reduces the oversized actual resistance value by ΔR. This makes the resistance value of the molded film reduced to the target resistance value, improves the product qualification rate, and enables quantitative control of the resistance value of the molded film.

[0063] It is understandable that the strength of the effect of the surface resistivity on the resistance of the molded thin-film resistor depends on the length covered by the surface resistivity, and is independent of the position of the surface resistivity on the molded thin-film resistor. This is more beneficial for production operations. Therefore, this invention does not impose specific restrictions on the printing position of the surface resistivity on the molded thin-film resistor.

[0064] In one embodiment of the present invention, a PCB circuit board is also provided, including: a molded thin film resistor; and a surface resistance printed on the molded thin film resistor according to a length design value, wherein the length design value is calculated based on the resistance deviation between the target resistance value and the actual resistance value, the width value of the molded thin film resistor, and the process resistance value of the molded thin film resistor when the actual resistance value of the molded thin film resistor is greater than the target resistance value. Specifically, firstly, when the actual resistance value is greater than the target resistance value, the difference between the target resistance value and the actual resistance value is calculated to obtain the resistance deviation value, which is obtained by subtracting the target resistance value from the actual resistance value. Then, based on the resistance deviation value, the width value of the molded thin film resistor, and the process resistance value, the length design value is calculated, which is obtained by multiplying the ratio of the width value to the process resistance value by the resistance deviation value. Finally, a surface resistor with the length design value is printed on the molded thin film resistor, which is equivalent to connecting a surface resistor with a very small resistance value in parallel with the molded thin film resistor. This causes the resistance value of the local area of ​​the molded thin film resistor covered by the surface resistor to become ineffective, thereby reducing the resistance value of the molded thin film resistor and adjusting the oversized resistance value of the molded thin film resistor to the target resistance value.

[0065] According to some embodiments of the present invention, the process resistance of the conductive material used in the surface resistivity is less than the process resistance of the molded thin film resistor. Specifically, the conductive material used in the surface resistivity is a metal paste.

[0066] When other circuit modules on the PCB have already been fabricated, if the actual resistance value of the molded thin-film resistor is found to be greater than the designed target resistance value, this can be addressed by connecting a surface resistor with a designed length in parallel with the molded thin-film resistor. This causes a localized failure in the resistance of the molded thin-film resistor, thereby reducing its resistance value and bringing it within the acceptable range, thus improving the product yield. Furthermore, the amount of resistance reduction can be controlled by adjusting the designed length value of the surface resistor, achieving quantitative control over the resistance adjustment of the molded thin-film resistor. Adjusting the oversized molded thin-film resistor value to the acceptable range without re-fabricating the PCB improves the PCB yield, increases production efficiency, and saves production costs.

[0067] Additionally, refer to Figure 4 , Figure 4 This is a schematic diagram of the structure of a printing device provided in an embodiment of the present invention. The printing device 400 includes: a memory 420, a processor 410, and a computer program stored in the memory and executable on the processor.

[0068] The processor 410 and the memory 420 can be connected via a bus or other means.

[0069] Memory 420, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory 420 may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0070] It should be noted that the printing equipment in this embodiment is an electronic device used for printing PCB circuit boards, and can be applied to, for example... Figure 1 The thin-film resistor value adjustment system in the illustrated embodiment, and the printing equipment in this embodiment, can be configured as follows: Figure 1 The system architecture shown in the embodiments is part of the same inventive concept. Therefore, these embodiments have the same implementation principle and technical effect, which will not be described in detail here.

[0071] The non-transient software program and instructions required to implement the thin-film resistor value adjustment method of the above embodiments are stored in memory 420. When executed by the processor, the thin-film resistor value adjustment method of the above embodiments is executed, for example, the method described above is executed. Figure 2 The methods and steps in the text.

[0072] In addition, one embodiment of the present invention provides a thin-film resistor value adjustment system, which includes a printing device and an external storage unit. The thin-film resistor value adjustment system in this embodiment can be configured as follows: Figure 1 The system architecture shown in the embodiments belongs to the same inventive concept, and therefore has the same implementation principle and technical effect, which will not be described in detail here.

[0073] The device or system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0074] Furthermore, one embodiment of the present invention provides a computer-readable storage medium storing computer-executable instructions that are executed by a processor or controller, for example, by a processor in the above-described device embodiment, causing the processor to perform the thin-film resistor value adjustment method in the above-described embodiment, for example, performing the above-described... Figure 2 The methods and steps in the text.

[0075] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0076] The above is a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the present invention.

Claims

1. A method for adjusting the resistance value of a thin-film resistor, characterized in that, include: Obtain the target resistance value, actual resistance value, width value, and process resistance value of the molded thin film resistor; When the actual resistance value is greater than the target resistance value, the difference between the target resistance value and the actual resistance value is calculated to obtain the resistance value deviation value. The length design value is obtained by calculating the resistance deviation value, the width value, and the process resistance value. Surface resistance is printed on the molded thin-film resistor according to the length design value; The step of calculating the length design value based on the resistance deviation value, the width value, and the process resistance value includes: multiplying the ratio of the width value to the process resistance value by the resistance deviation value to obtain the length design value.

2. The method for adjusting the resistance value of a thin-film resistor according to claim 1, characterized in that, The process of calculating the difference between the target resistance value and the actual resistance value to obtain the resistance deviation value includes: The resistance deviation value is obtained by subtracting the target resistance value from the actual resistance value.

3. The method for adjusting the resistance value of a thin-film resistor according to claim 1, characterized in that, The width value of the printed surface resistor is less than or equal to the width value of the molded thin film resistor.

4. A PCB circuit board, characterized in that, include: Molded thin-film resistors; The surface resistance printed on the molded thin-film resistor according to the length design value, wherein the length design value is calculated based on the resistance deviation between the target resistance value and the actual resistance value, the width value of the molded thin-film resistor, and the process resistance value of the molded thin-film resistor, when the actual resistance value of the molded thin-film resistor is greater than the target resistance value; wherein, the calculation of the length design value based on the resistance deviation value, the width value, and the process resistance value includes: multiplying the ratio of the width value to the process resistance value by the resistance deviation value to obtain the length design value.

5. The PCB circuit board according to claim 4, characterized in that, The surface resistivity is less than the process resistance of the conductive material used in the molding thin film resistor.

6. The PCB circuit board according to claim 5, characterized in that, The conductive material used for the surface resistance is metal paste.

7. A thin-film resistor value adjustment system, characterized in that, include: The data acquisition module is used to acquire the target resistance value, actual resistance value, width value, and process resistance value of the molded thin film resistor. The calculation and processing module is used to calculate the difference between the target resistance value and the actual resistance value to obtain a resistance value deviation value when the actual resistance value is greater than the target resistance value. The length design value is obtained by calculating the resistance deviation value, the width value, and the process resistance value; wherein, the calculation of the length design value by calculating the resistance deviation value, the width value, and the process resistance value includes: multiplying the ratio of the width value and the process resistance value by the resistance deviation value to obtain the length design value; A printing control module is used to print surface resistors on the molded thin-film resistor according to the length design value.

8. A printing apparatus, comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, when the processor executes the computer program, it implements the thin-film resistor value adjustment method as described in any one of claims 1 to 3.

9. A storage medium, characterized in that, The device stores computer-executable instructions for performing the thin-film resistor value adjustment method as described in any one of claims 1 to 3.

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