Electronic component and electronic component mounting structure

Abstract

This electronic component comprises: an element body; a first internal electrode; and a first external electrode (61). The first internal electrode is located inside the element body. The first outer electrode (61) covers a section of the outer surface of the element body. The first outer electrode (61) includes: a first electrode (61A) that covers a section of the outer surface of the element body and connects to the first internal electrode: and a second electrode (61B) that covers the outer surface of the first electrode (61A). The second electrode (61B) includes spherical copper particles (63) and silicon.

Description

Electronic components and electronic component mounting structures

[0001] The present disclosure relates to an electronic component and a mounting structure for the electronic component.

[0002] The electronic component described in Patent Document 1 includes an element body, internal electrodes, dummy internal electrodes, and external electrodes. The internal electrodes and dummy internal electrodes are located inside the element body. The external electrodes cover part of the outer surface of the element body. The external electrodes are connected to the internal electrodes.

[0003] JP 2015-115518 A

[0004] The electronic component described in Patent Document 1 is subject to external mechanical shocks and thermal stress due to temperature changes. This can lead to cracks and other problems occurring in the element body of the electronic component. The electronic component described in Patent Document 1 uses an internal structure of the element body, such as a dummy internal electrode, to prevent cracks from occurring in the element body. However, the relationship between the external electrodes and cracks and chips in the element body is not considered at all.

[0005] In order to solve the above problem, one aspect of the present disclosure is an electronic component comprising an element body, an internal electrode located inside the element body, and an external electrode covering a portion of the outer surface of the element body, wherein the external electrode has a first electrode covering a portion of the outer surface of the element body and connected to the internal electrode, and a second electrode covering the outer surface of the first electrode, and the second electrode is an electronic component having spherical copper particles and silicon.

[0006] Furthermore, in order to solve the above-described problems, one aspect of the present disclosure provides a mounting structure for an electronic component, comprising a substrate and an electronic component mounted on the substrate, the electronic component comprising an element body, an internal electrode located inside the element body, and an external electrode covering a portion of the outer surface of the element body, the external electrode having a first electrode covering a portion of the outer surface of the element body and connected to the internal electrode, and a second electrode covering the outer surface of the first electrode, the second electrode comprising spherical copper particles and silicon, and when a surface of the outer surface of the element body facing the substrate is defined as a mounting surface, the first electrode covers at least a portion of the mounting surface, and the second electrode covers at least a portion of the outer surface of the first electrode that covers the mounting surface.

[0007] According to the above configuration, the second electrode has a structure in which spherical copper particles are dispersed in silicon. This results in a relatively small flexural strength of the second electrode. Therefore, when an external force such as an impact or thermal stress acts on the electronic component, the second electrode is more likely to deform and crack than the element body. In other words, the second electrode plays a role in mitigating the effects of the external force by breaking itself. Therefore, when an external force acts on the electronic component, cracks are less likely to occur in the element body. Even if the second electrode breaks, the internal electrode remains connected to the first electrode. Therefore, electrical conductivity between the external electrode and the internal electrode is ensured.

[0008] The external electrodes can suppress cracks in the element body.

[0009] FIG. 1 is a perspective view of an electronic component. FIG. 2 is a side view of the electronic component. FIG. 3 is a cross-sectional view taken along line 3-3 in FIG. 2. FIG. 4 is a schematic enlarged cross-sectional view of a first external electrode of the electronic component. FIG. 5 is a schematic enlarged cross-sectional view of a first external electrode of the electronic component. FIG. 6 is a flowchart illustrating a method for manufacturing an electronic component. FIG. 7 is a diagram illustrating a mounting structure including a modified electronic component and a substrate. FIG. 8 is a diagram illustrating a mounting structure including a modified electronic component and a substrate. FIG. 9 is a cross-sectional view of a modified electronic component and a substrate. FIG. 10 is a cross-sectional view of a modified electronic component and a substrate.

[0010] Hereinafter, an embodiment of an electronic component and a mounting structure for the electronic component will be described with reference to the drawings. Note that the drawings may show components enlarged to facilitate understanding. The dimensional ratios of the components may differ from those in the actual drawings or from those in other drawings.

[0011] <Overall Configuration of Electronic Component> As shown in FIG. 1 , the electronic component 10 is a multilayer ceramic capacitor. The electronic component 10 includes an element body 20. The element body 20 is generally rectangular prism-shaped and has a central axis CA. In the following description, an axis extending along the central axis CA is referred to as a first axis X. One of the axes perpendicular to the first axis X is referred to as a second axis Y. An axis perpendicular to the first axis X and the second axis Y is referred to as a third axis Z. In addition, one of the directions along the first axis X is referred to as a first positive direction X1, and the direction along the first axis X that is opposite to the first positive direction X1 is referred to as a first negative direction X2. One of the directions along the second axis Y is referred to as a second positive direction Y1, and the direction along the second axis Y that is opposite to the second positive direction Y1 is referred to as a second negative direction Y2. Furthermore, one of the directions along the third axis Z is defined as a third positive direction Z1, and the direction along the third axis Z opposite to the third positive direction Z1 is defined as a third negative direction Z2.

[0012] The outer surface 21 of the element body 20 has six flat surfaces 22. The term "surface" of the element body 20 as used herein refers to a surface that can be observed when the entire element body 20 is observed. In other words, even if there are minute irregularities or steps that are not visible unless a portion of the element body 20 is magnified and observed using a microscope or the like, the surface is still referred to as a flat or curved surface. The six flat surfaces 22 face in different directions. The six flat surfaces 22 are broadly divided into a first end surface 22A facing the first positive direction X1, a second end surface 22B facing the first negative direction X2, and four side surfaces 22C. The four side surfaces 22C are, respectively, a surface facing the third positive direction Z1, a surface facing the third negative direction Z2, a surface facing the second positive direction Y1, and a surface facing the second negative direction Y2.

[0013] Furthermore, on the outer surface 21 of the element body 20, the boundary portions between two adjacent flat surfaces 22 and the boundary portions between three adjacent flat surfaces 22 are curved. In other words, the corners of the element body 20 are so-called R-chamfered.

[0014] As shown in Fig. 2, the element body 20 has a dimension along the first axis X that is larger than the dimension along the third axis Z. The material of the element body 20 is a dielectric ceramic. Specifically, the material of the element body 20 is BaTiO ３ The main component of the element 20 is CaTiO ３ , SrTiO ３ , CaZrO ３ The material of the element body 20 may contain, as a secondary component, a Mn compound, a Co compound, a Si compound, a rare earth compound, or the like.

[0015] 3 , the electronic component 10 includes, as wiring, four first internal electrodes 41 and four second internal electrodes 42. The first internal electrodes 41 and the second internal electrodes 42 are embedded inside the element body 20.

[0016] The material of the first internal electrode 41 is a conductive material. For example, the material of the first internal electrode 41 is Ni. The material of the first internal electrode 41 may further include a metal such as Ni, Cu, Ag, Au, Pt, Sn, or Pd, or an alloy containing these metals. The material of the second internal electrode 42 is the same as the material of the first internal electrode 41.

[0017] The first internal electrode 41 has a rectangular plate shape. The main surface of the first internal electrode 41 is perpendicular to the second axis Y. The second internal electrode 42 has the same rectangular plate shape as the first internal electrode 41. The main surface of the second internal electrode 42 is perpendicular to the second axis Y, similar to the first internal electrode 41.

[0018] The dimension of the first internal electrode 41 in the direction along the first axis X is smaller than the dimension of the element body 20 in the direction along the first axis X. Also, as shown in Fig. 1 , the dimension of the first internal electrode 41 in the direction along the third axis Z is approximately two-thirds of the dimension of the element body 20 in the direction along the third axis Z. The dimensions of the second internal electrode 42 in each direction are the same as those of the first internal electrode 41.

[0019] 3, the first internal electrodes 41 and the second internal electrodes 42 are positioned alternately in the direction along the second axis Y. That is, a total of eight internal electrodes are arranged alternately in the order of the first internal electrodes 41 and the second internal electrodes 42 from the side surface 22C facing the second positive direction Y1 toward the second negative direction Y2. In this embodiment, the distances between the respective internal electrodes in the direction along the second axis Y are equal.

[0020] As shown in Fig. 1, the four first internal electrodes 41 and the four second internal electrodes 42 are all located at the center of the element body 20 in the direction along the third axis Z. On the other hand, as shown in Fig. 3, the first internal electrodes 41 are located closer to the first positive direction X1, and the second internal electrodes 42 are located closer to the first negative direction X2.

[0021] Specifically, the end of the first internal electrode 41 on the first positive direction X1 side substantially coincides with the end of the element body 20 on the first positive direction X1 side. Therefore, the end of the first internal electrode 41 on the first positive direction X1 side is exposed from the first end surface 22A of the element body 20. The end of the first internal electrode 41 on the first negative direction X2 side is located inside the element body 20 and does not reach the end of the element body 20 on the first negative direction X2 side. On the other hand, the end of the second internal electrode 42 on the first negative direction X2 side substantially coincides with the end of the element body 20 on the first negative direction X2 side. Therefore, the end of the second internal electrode 42 on the first negative direction X2 side is exposed from the second end surface 22B of the element body 20. The end of the second internal electrode 42 on the first positive direction X1 side is located inside the element body 20 and does not reach the end of the element body 20 on the first positive direction X1 side.

[0022] 3, the electronic component 10 includes a first external electrode 61 and a second external electrode 62. The first external electrode 61 includes a first electrode 61A, a second electrode 61B, and a third electrode 61C.

[0023] The first electrode 61A covers a portion of the outer surface 21 of the element body 20. Specifically, the first electrode 61A covers the first end face 22A of the element body 20 and portions of the four side faces 22C facing the first positive direction X1. The first electrode 61A is also connected to the first internal electrode 41 exposed from the first end face 22A. The first electrode 61A is made mostly of copper and contains a small amount of glass.

[0024] The second electrode 61B covers the outer surface of the first electrode 61A. That is, the second electrode 61B is laminated on the first electrode 61A. Details of the second electrode 61B will be described later. The third electrode 61C covers the outer surface of the second electrode 61B. That is, the third electrode 61C is laminated on the second electrode 61B. A portion of the third electrode 61C protrudes from the second electrode 61B. Although not shown in the drawings, the third electrode 61C has a two-layer structure consisting of, in order from the second electrode 61B side, a nickel layer and a tin layer.

[0025] The second external electrode 62 has a first electrode 62A, a second electrode 62B, and a third electrode 62C. The first electrode 62A covers a portion of the outer surface 21 of the element body 20. Specifically, the first electrode 62A covers the second end face 22B of the element body 20 and portions of the four side faces 22C facing the first negative direction X2. The first electrode 62A is connected to the second internal electrode 42 exposed from the second end face 22B. The material of the first electrode 62A is the same as the material of the first electrode 62A in the first external electrode 61.

[0026] As shown in Fig. 3, the second electrode 62B covers the outer surface of the first electrode 62A. Therefore, the second electrode 62B is laminated on the first electrode 62A. Details of the second electrode 62B will be described later. Also, as shown in Figs. 3 and 4, the third electrode 62C covers the outer surface 610 of the second electrode 62B. Therefore, the third electrode 62C is laminated on the second electrode 62B. Also, as shown in Fig. 3, a portion of the third electrode 62C protrudes from the second electrode 62B. Although not shown, the third electrode 62C has a two-layer structure consisting of, in order from the second electrode 62B side, a nickel layer and a tin layer.

[0027] The second external electrode 62 does not reach the first external electrode 61 on the side surface 22C, and is spaced apart from the first external electrode 61 in the direction along the first axis X. The first external electrode 61 and the second external electrode 62 are not stacked in the central portion of the side surface 22C of the element body 20 in the direction along the first axis X. In FIGS. 1 to 3, the first external electrode 61 and the second external electrode 62 are shown by two-dot chain lines.

[0028] <Configuration of Second Electrode> The following describes in detail the configuration of the second electrode 61B of the first external electrode 61. The configuration of the second electrode 62B of the second external electrode 62 is also similar to that of the first external electrode 61.

[0029] The second electrode 61B contains copper and silicon. The second electrode 61B is a sintered body. The weight ratio of copper to silicon in the second electrode 61B is 0.5 or more and 2 or less. As shown in FIG. 4 , at least a portion of the copper in the second electrode 61B is spherical copper particles 63. The silicon in the second electrode 61B exists as a silicone resin 64. The silicone resin 64 is a polymer formed of a siloxane bond and a Si—C bond.

[0030] 4, the second electrode 61B is bisected into a first portion 631 located on the inner surface 620 side of the second electrode 61B and a second portion 632 located on the outer surface 610 side of the second electrode 61B. The inner surface 620 of the second electrode 61B is the boundary surface of the second electrode 61B that is closer to the first electrode 61A. The outer surface 610 of the second electrode 61B is the surface of the second electrode 61B that is opposite to the first electrode 61A. The position at which the second electrode 61B is bisected is the point at which the average thickness of the second electrode 61B, which will be described later, is divided into two equal parts.

[0031] 4 , the average particle size of copper particles 63 differs between first portion 631 and second portion 632. Specifically, the average particle size of copper particles 63 in first portion 631 is smaller than the average particle size of copper particles 63 in second portion 632. That is, the particle size of copper particles 63 located in first portion 631 is generally smaller than the particle size of copper particles 63 located in second portion 632. Overall, the particle size of copper particles 63 becomes smaller toward inner surface 620 within second electrode 61B.

[0032] The particle size of the copper particles 63 is calculated as follows. First, the outline of the copper particles 63 is obtained by image processing using an electron microscope. The obtained image is analyzed, and the line segment connecting the edges of one copper particle 63 is taken as the major diameter. Furthermore, the line segment connecting the edges of the copper particle 63, which is perpendicular to the major diameter, is taken as the minor diameter. The particle size of the copper particles 63 is calculated as the average of the major diameter and the minor diameter.

[0033] 5, the silicone resin 64 as silicon is distributed in a mesh-like pattern. Specifically, when the second electrode 61B is viewed in cross section, the silicone resin 64 is distributed in a mesh-like pattern so as to fill the spaces between the copper particles 63. Furthermore, a portion of the silicone resin 64 is in the form of clumps. The clumped silicone resin 64 is formed by condensation of a portion of the mesh-like silicone resin 64. In particular, the first portion 631 has a higher proportion of clumped silicone resin 64 than the second portion 632.

[0034] The proportion of silicone resin 64 in the first portion 631 of the second electrode 61B is higher than the proportion of silicone resin 64 in the second portion 632 of the second electrode 61B. That is, the proportion of silicon in the first portion 631 is higher than the proportion of silicon in the second portion 632. The proportion of silicone resin 64 is calculated as follows. First, a cross section of the second electrode 61B is photographed using an electron microscope. Next, the area occupied by silicone resin 64 within a certain square range in the photographed image is calculated. Then, the area of ​​silicone resin 64 relative to the area of ​​the square is defined as the proportion of silicone resin 64. At this time, a square range is defined so as not to extend beyond the first portion 631, and the proportion of silicone resin 64 is calculated. Then, the proportion of silicone resin 64 is calculated at three or more points within the range of the first portion 631, and the average of these values ​​is defined as the proportion of silicone resin 64 in the first portion 631. The same applies to the second portion 632.

[0035] The thickness of the first electrode 61A is the shortest distance from the surface of the first electrode 61A facing the element body 20 to the outer surface. The thickness of the second electrode 61B is the shortest distance from the inner surface 620 to the outer surface 610. The average thickness of the second electrode 61B is smaller than the average thickness of the first electrode 61A.

[0036] The average thickness of each electrode is calculated as follows. First, a cross section including the outer surface 610 and inner surface 620 of the second electrode 61B is photographed using an electron microscope. Next, a range in the photographed image in the direction along the outer surface 610 of the second electrode 61B is identified. Within this range, the cross-sectional area of ​​the second electrode 61B is calculated by image processing for a measurement range of at least 5 μm. Then, the thickness of the second electrode 61B is calculated by dividing the cross-sectional area of ​​the second electrode 61B in the calculated measurement range by the length of the measurement range. In other words, the thickness of the second electrode 61B is the thickness within the measurement range. In this manner, the thickness of the second electrode 61B is measured at five cross sections, and the average thickness is calculated.

[0037] Similarly, the thickness of the first electrode 61A is calculated. That is, a cross section of the first electrode 61A including the surface facing the element body 20 and the outer surface is photographed using an electron microscope. Next, a range in the photographed image is identified in a direction along the outer surface of the first electrode 61A. Within this range, the cross-sectional area of ​​the first electrode 61A is calculated by image processing for a measurement range of at least 5 μm. Then, the thickness of the first electrode 61A is calculated by dividing the cross-sectional area of ​​the first electrode 61A in the calculated measurement range by the length of the measurement range. In other words, the thickness of the first electrode 61A is the thickness in the measurement range. In this manner, the thickness of the first electrode 61A is measured at five cross sections, and the average value of the thicknesses is calculated.

[0038] <Method for Manufacturing Electronic Component> Next, a description will be given of a method for manufacturing electronic component 10. As shown in Fig. 6, the method for manufacturing electronic component 10 includes a laminate preparation step S11, an R-chamfering processing step S12, a conductor application step S13, a curing step S14, and a plating step S15.

[0039] First, in forming the element body 20, a laminate is prepared in the laminate preparation step S11. The laminate at this stage is in a state before R-chamfering and has a rectangular parallelepiped shape with six flat surfaces 22. For example, first, a plurality of ceramic sheets that will become the element body 20 are prepared. The sheets are thin plates. A conductive paste that will become the first internal electrode 41 is laminated on the sheets. A ceramic sheet that will become the element body 20 is laminated on the paste. A conductive paste that will become the second internal electrode 42 is laminated on the sheets. In this manner, the ceramic sheets and the conductive paste are laminated. The laminated sheets are then pressed in the stacking direction using a mold press or other means. The pressed sheet is then cut to a predetermined size to form an unfired laminate. The unfired laminate is then fired at a high temperature to prepare the laminate.

[0040] Next, an R-chamfering process step S12 is performed. In the R-chamfering process step S12, the laminate prepared in the laminate preparation process S11 is R-chamfered. This process provides an element body 20 with R-chamfered corners.

[0041] Next, a conductor application step S13 is performed. In the conductor application step S13, a first conductor paste is applied to a portion of the first end face 22A of the element body 20 and a portion of the second end face 22B of the element body 20 by a dip method. Specifically, the first conductor paste is applied so as to cover the entire first end face 22A and portions of the four side faces 22C. The first conductor paste is also applied so as to cover the entire second end face 22B and portions of the four side faces 22C. The first conductor paste contains a copper component and a silicon component.

[0042] Furthermore, in the conductor application step S13, a second conductor paste is applied onto the first conductor paste in two locations. The second conductor paste is a complex ink. The second conductor paste is prepared as follows: First, an amine compound such as 2-ethylhexylamine is mixed with an alcohol amine such as 2-amino-2-methylpropanol. Then, a silicon component such as silicone resin is added in an amount of 10-300 wt % relative to the weight of Cu alone. Then, a metal salt is further added and dissolved to prepare the second conductor paste. In other words, the second conductor paste contains a copper component and a silicon component. The sintering start temperature of the copper component is 170°C, and the hardening start temperature of the silicon component is 250°C.

[0043] Next, a curing step S14 is performed. Specifically, in the curing step S14, the element body 20 coated with the first and second conductive pastes is heated. In this embodiment, the element body 20 coated with the first and second conductive pastes is heated in a nitrogen atmosphere. The temperature is then maintained at a range of 300 to 600 degrees Celsius. This causes the first and second conductive pastes to be fired. During the firing of the second conductive paste, sintering of the copper component contained in the second electrodes 61B and 62B begins first. When sintering of the copper component begins, the silicon component is not hardened and remains fluid. Therefore, the silicon component fills the gaps between the copper components. After sintering of the copper component begins, when the temperature further rises to the hardening initiation temperature of the silicon component, hardening of the silicon component contained in the second electrodes 61B and 62B begins. In other words, the hardening initiation temperature of the silicon component is higher than the sintering initiation temperature of the copper component. The copper component is sintered to produce copper particles 63. The silicon component is hardened to produce silicone resin 64. As described above, the hardening start temperature of the silicon component is higher than the sintering start temperature of the copper component, and therefore the silicone resin 64 becomes a mesh-like structure that fills the gaps between the copper particles 63. As a result, the second electrode 61B and the second electrode 62B are formed as described above.

[0044] Next, a plating step S15 is performed. Electroplating is performed on the locations where the second electrodes 61B and 62B are located. As a result, a third electrode 61C is formed on the surface of the second electrode 61B. Also, a third electrode 62C is formed on the surface of the second electrode 62B. Although not shown, the third electrodes 61C and 62C are electroplated with two types of metal, nickel and tin, to form a two-layer structure. In this manner, the electronic component 10 is formed.

[0045] <Operation of this embodiment> The second electrode 61B contains silicone resin 64, and copper particles 63 are dispersed in this silicone resin 64. As a result, the flexural strength of the second electrode 61B is relatively small. Therefore, if an external force such as an impact or thermal stress acts on the electronic component 10, deformation and cracks are likely to occur in the second electrode 61B before they occur in the element body 20. In other words, the second electrode 61B plays a role in mitigating the effects of the external force by breaking itself.

[0046] <Effects of this embodiment> The effects of this embodiment will be described below. Note that, although the effects relating to the first external electrode 61 will be described as a representative example, the second external electrode 62 also provides similar effects.

[0047] (1) According to the above embodiment, the presence of the second electrode 61B makes it difficult for cracks to occur in the element body 20 when an external force acts on the electronic component 10. Even if a crack or the like occurs in the second electrode 61B, the first internal electrode 41 is connected to the first electrode 61A. Therefore, conductivity between the first external electrode 61 and the first internal electrode 41 is ensured.

[0048] (2) The silicone resin 64 has a stronger adhesive force with other components than the copper particles 63. In the above embodiment, the proportion of the silicone resin 64 in the first portion 631 of the second electrode 61B is higher than the proportion of the silicone resin 64 in the second portion 632 of the second electrode 61B. In other words, the silicone resin 64 is likely to be exposed on the inner surface 620 of the second electrode 61B. Therefore, the silicone resin 64 is likely to adhere to the first electrode 61A, and the second electrode 61B is unlikely to peel off from the first electrode 61A. Furthermore, because the second electrode 61B is in close contact with the first electrode 61A in this manner, even if a crack or the like occurs in the second electrode 61B, the crack can be prevented from propagating to the interface between the second electrode 61B and the first electrode 61A, preventing the entire second electrode 61B from peeling off from the first electrode 61A.

[0049] (3) According to the above embodiment, the second electrode 61B contains the silicone resin 64. In the case of an electrode containing the silicone resin 64 in this manner, the strength of the second electrode 61B can be designed to a preferred value by designing the content of the silicone resin 64 to an arbitrary value.

[0050] (4) According to the above embodiment, the average thickness of the second electrodes 61B is smaller than the average thickness of the first electrodes 61A. This configuration allows the overall thickness of the first external electrode 61 to be thinner than when the average thickness of the second electrodes 61B is the same as the average thickness of the first electrodes 61A. In other words, this configuration is particularly useful for small electronic components.

[0051] (5) In the above embodiment, the third electrode 61C covers the second electrode 61B. With this configuration, even if a crack or the like occurs in the second electrode 61B, the crack can be prevented from progressing to the outer surface of the first external electrode 61, i.e., the outer surface of the third electrode 61C.

[0052] (6) In the above embodiment, the first electrode 61A and the second electrode 61B are formed by a dipping method. Even when the first external electrode 61 is formed of multiple layers, by employing this method, it is possible to suppress a decrease in mass productivity.

[0053] <Modifications> The above embodiment and the following modifications can be implemented in combination with each other to the extent that no technical contradiction occurs. In the case of a modification that can be commonly applied to the first external electrode 61 and the second external electrode 62, the modification related to the first external electrode 61 will be described as a representative example.

[0054] In the above embodiment, the electronic component 10 is not limited to a multilayer ceramic capacitor. For example, the electronic component 10 may be a piezoelectric component, a thermistor, an inductor, or the like, which includes the element body 20, the first external electrode 61, and the second external electrode 62.

[0055] In the above embodiment, the material of the element 20 may be a dielectric, a piezoelectric, a magnetic material such as ferrite, or a composite of synthetic resin and metal. In the above embodiment, the second conductive paste may be nanoink. If it is nanoink, it is prepared as follows: Nanometal powder is dispersed in a solvent containing cellosolves, carbitols, hydrocarbons, aromatics, or the like. Then, various silicone-modified resins, silicone resins, sol-gel materials, or the like are added in an amount of 10-300 wt % relative to the weight of Cu alone. The nanoink second conductive paste may be prepared in this manner, or a different method may be used.

[0056] In the above embodiment, the material used when the second conductive paste is a complex ink is not limited to the example of the above embodiment. For example, the amine compound may be a primary amine, secondary amine, or tertiary amine, and the number of N atoms is not limited. For example, it may be a primary amine such as octylamine or hexylamine, a secondary amine such as di-n-butylamine, or a tertiary amine such as N,N-dimethylhexylamine. The amine compound may also be an alcohol amine or a diamine, and the positional relationship between the N atom and the OH group is not limited to the α, β, or γ position. Furthermore, the number of N and O atoms in one molecule is not particularly limited. For example, it may be an α-hydroxyamine such as 2-dimethylaminoethanol or 2-ethylaminoethanol, or a β-hydroxyamine such as 3-amino-1-propanol or 4-amino-2-butanol. Furthermore, it may be a diamine such as ethylenediamine, or a cyclic diamine such as piperazine. The silicon component may be, for example, various silicone-modified resins such as epoxy resins, polyester resins, and phenolic resins, or a sol-gel material. Furthermore, metal salts made of formic acid, acetic acid, oxalic acid, other organic acids, etc., may also be used as the metal salts. An example of this type of metal salt is anhydrous copper formate.

[0057] In the above embodiment, the number of first internal electrodes 41 and second internal electrodes 42 is not limited to the example in the above embodiment. The number of first internal electrodes 41 may be more or less than four. The same applies to the second internal electrodes 42.

[0058] In the above embodiment, the electronic component 10 may include a glass film. In this case, for example, the glass film may be formed so as to cover a partial region of the outer surface 21 of the element body 20. In other words, even if a glass film covering the element body 20 is present, it is sufficient that the electrical connection between the first internal electrode 41 and the first external electrode 61, and the electrical connection between the second internal electrode 42 and the second external electrode 62 are ensured.

[0059] In the above embodiment, the material of the first electrode 61A is not limited to the example in the above embodiment. For example, the material of the first electrode 61A may be a metal such as Ni, Ag, or Cu, or may contain any of these metals.

[0060] In the above embodiment, the second electrode 61B may cover at least a portion of the first electrode 61A. However, it is preferable that the second electrode 61B covers at least the outer surface of the first electrode 61A that faces the substrate 100 when the electronic component 10 is mounted on the substrate 100.

[0061] 7 includes a substrate 100 and an electronic component 10 mounted on the substrate 100. Furthermore, of the outer surface 21 of the element body 20, a side surface 22C facing the second positive direction Y1 serves as a mounting surface 22S for the substrate 100. The first electrode 61A covers the outer surface 21 of the element body 20 facing the first positive direction X1 and portions of the four side surfaces 22C. In other words, the first electrode 61A covers portions of the mounting surface 22S. The second electrode 61B covers a total of four outer surfaces of the first electrode 61A, including the surface facing the second positive direction Y1, the surface facing the second negative direction Y2, the surface facing the third positive direction Z1, and the surface facing the third negative direction Z2. In the example shown in Fig. 8, the second electrode 61B covers three outer surfaces of the first electrode 61A: a surface facing the second positive direction Y1, a surface facing the third positive direction Z1, and a surface facing the third negative direction Z2. In the example shown in Fig. 9, the second electrode 61B covers only two outer surfaces of the first electrode 61A: a surface facing the second positive direction Y1 and a surface facing the first positive direction X1. Furthermore, in the example shown in Fig. 10, the second electrode 61B covers only the outer surface of the first electrode 61A facing the second positive direction Y1. That is, in all of the examples shown in Figs. 7 to 10, the second electrode 61B covers the outer surface of the portion of the first electrode 61A that covers the mounting surface 22S. Furthermore, according to the electronic component 10 of the examples of Figures 7 to 10, if the second electrode 61B collides with the substrate 100 during mounting, the effect of (1) of the above embodiment can be exerted, thereby suppressing the influence of external forces on the base body 20.

[0062] In the above embodiment, the proportion of the silicone resin 64 in the first portion 631 of the second electrode 61B may be lower than or the same as the proportion of the silicone resin 64 in the second portion 632 of the second electrode 61B.

[0063] In the above embodiment, the average thickness of the second electrode 61B may be equal to or smaller than the average thickness of the first electrode 61A. On the other hand, it is preferable to set the thickness so that the flexural strength of the second electrode 61B is smaller than the flexural strength of the first electrode 61A.

[0064] In the above embodiment, the configuration related to the third electrode 61C may be omitted from the first external electrode 61. In the above embodiment, the average particle size of the copper particles 63 in the first portion 631 of the second electrode 61B may be the same as, smaller than, or larger than the average particle size of the copper particles 63 in the second portion 632 of the second electrode 61B.

[0065] In the above embodiment, silicon is not limited to silicone resin 64. For example, silicon may be silica (silicon dioxide) or the like. The manufacturing process of electronic component 10 in the above embodiment is not limited to the example in the above embodiment. For example, the element body 20 may be subjected to a process such as physical polishing.

[0066] In the above embodiment, the method for applying the first conductive paste and the second conductive paste is not limited to the example in the above embodiment. For example, these pastes may be applied by printing, or by an inkjet method, etc. Furthermore, the first conductive paste and the second conductive paste may be applied by different methods.

[0067] In the above embodiment, the curing step S14 may be performed in multiple steps. That is, the firing may be performed in multiple steps. In the above embodiment, the sintering start temperature of the copper component of the second conductive paste and the curing start temperature of the silicon component are not limited to the examples in the above embodiment.

[0068] <Supplementary Notes> The technical ideas that can be derived from the above-described embodiments and modified examples are described below: [1] An electronic component comprising an element body, an internal electrode located inside the element body, and an external electrode covering a portion of the outer surface of the element body, the external electrode having a first electrode covering a portion of the outer surface of the element body and connected to the internal electrode, and a second electrode covering the outer surface of the first electrode, the second electrode including spherical copper particles and silicon.

[0069] [2] The electronic component described in [1], wherein when the second electrode is divided into two equal parts, a first part located on the first electrode side and a second part located on the opposite side of the first electrode, the proportion of silicon in the first part is higher than the proportion of silicon in the second part.

[0070] [3] The electronic component according to [1] or [2], wherein the average thickness of the second electrode is smaller than the average thickness of the first electrode. [4] The electronic component according to any one of [1] to [3], wherein the external electrode has a third electrode covering the outer surface of the second electrode.

[0071] [5] The electronic component according to any one of [1] to [4], wherein the first electrode contains copper and glass. [6] A mounting structure for an electronic component having a substrate and an electronic component mounted on the substrate, the electronic component comprising: an element body, an internal electrode located inside the element body, and an external electrode covering a portion of the outer surface of the element body, the external electrode having a first electrode covering a portion of the outer surface of the element body and connected to the internal electrode, and a second electrode covering the outer surface of the first electrode, the second electrode comprising spherical copper particles and silicon, and when a surface of the outer surface of the element body facing the substrate is defined as a mounting surface, the first electrode covers at least a portion of the mounting surface, and the second electrode covers at least a portion of the outer surface of the first electrode that covers the mounting surface.

[0072] REFERENCE SIGNS LIST 10... Electronic component 20... Element body 41... First internal electrode 61... First external electrode 61A... First electrode 61B... Second electrode 61C... Third electrode 63... Copper particles 64... Silicone resin 631... First portion 632... Second portion

Claims

1. The base body and an internal electrode located inside the element body; an external electrode covering a part of the outer surface of the element body; Equipped with the external electrode includes a first electrode that covers a portion of an outer surface of the element body and is connected to the internal electrode, and a second electrode that covers an outer surface of the first electrode, the second electrode includes spherical copper particles and silicon; Within the second electrode, the particle size of the copper particles becomes smaller toward the first electrode side. Electronic components.

2. The base body and an internal electrode located inside the element body; an external electrode covering a part of the outer surface of the element body; Equipped with the external electrode includes a first electrode that covers a portion of an outer surface of the element body and is connected to the internal electrode, and a second electrode that covers an outer surface of the first electrode, the second electrode includes spherical copper particles and silicon; When the second electrode is divided into two equal parts, a first part located on the first electrode side and a second part located on the opposite side from the first electrode, the proportion of silicon in the first part is higher than the proportion of silicon in the second part. Electronic components.

3. The average thickness of the second electrodes is smaller than the average thickness of the first electrodes. The electronic component according to claim 1 .

4. The external electrode includes a third electrode covering the outer surface of the second electrode. The electronic component according to claim 1 .

5. The first electrode includes copper and glass. The electronic component according to claim 1 .

6. A substrate and an electronic component mounted on the substrate, The electronic component is The base body and an internal electrode located inside the element body; an external electrode covering a part of the outer surface of the element body; Equipped with the external electrode includes a first electrode that covers a portion of an outer surface of the element body and is connected to the internal electrode, and a second electrode that covers an outer surface of the first electrode, the second electrode includes spherical copper particles and silicon; In the second electrode, the particle size of the copper particles becomes smaller toward the first electrode, When the surface of the outer surface of the element body facing the substrate is the mounting surface, the first electrode covers at least a portion of the mounting surface, The second electrode covers at least a portion of the outer surface of the first electrode that covers the mounting surface. Mounting structure for electronic components.