Damping device, exposure device, and exposure method
Patent Information
- Application Number
- JP2025509635
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Filing Date
- 2025-10-09
- Publication Date
- 2025-12-24
AI Technical Summary
Highly accurate exposure in photolithography processes for liquid crystal display panel manufacturing is compromised by vibrations in the exposure apparatus, particularly in the optical surface plate, which affect the precision of pattern transfer onto the substrate.
A vibration damping device is integrated near the optical surface plate, comprising a frame with a weight driven by a voice coil motor and leaf spring mechanisms to suppress vibrations in specific modes, ensuring stable operation and improved exposure accuracy.
The vibration damping device effectively reduces unwanted vibrations, enhancing the exposure accuracy by aligning with and damping the primary vibration modes, thereby improving the precision of pattern transfer during photolithography.
Abstract
Description
Vibration damping device, exposure device, and exposure method
[0001] The present invention relates to a vibration damping device, an exposure device, and an exposure method.
[0002] In recent years, liquid crystal display panels have come into widespread use as display elements for personal computers, televisions, and the like. Liquid crystal display panels are manufactured by forming a circuit pattern of thin-film transistors on a plate (glass substrate) using a photolithography technique. An exposure apparatus is used for this photolithography process, which projects and exposes an original pattern formed on a mask onto a photoresist layer on the plate via a projection optical system (see, for example, Patent Document 1).
[0003] These exposure apparatuses are required to perform exposure with high accuracy.
[0004] JP 2015-081993 A
[0005] According to a first aspect of the disclosure, a vibration control device includes a frame having a first member and a second member that are maintained spaced apart in a first direction, a weight disposed between the first member and the second member, an actuator between the first member and the second member that drives the weight in the first direction, a plurality of first constraint mechanisms that connect the first member and the weight and each have one or more leaf springs that allow movement of the weight in the first direction, a plurality of second constraint mechanisms that connect the second member and the weight and each have one or more leaf springs that allow movement of the weight in the first direction, and a plurality of third constraint mechanisms that connect the plurality of first constraint mechanisms and the plurality of second constraint mechanisms and restrict movement of the weight in a direction inclined with respect to a plane perpendicular to the first direction.
[0006] According to a second aspect of the disclosure, an exposure apparatus is an exposure apparatus that exposes a pattern image of a first object onto a second object, and includes an illumination optical system that illuminates the first object with exposure light, a projection optical system that projects the exposure light from the first object onto the second object, a housing that supports the projection optical system, and the vibration damping device, wherein the vibration damping device is positioned near a position corresponding to an antinode of at least one of a plurality of vibration modes that occur in the housing.
[0007] According to a third aspect of the disclosure, an exposure method is an exposure method using the above-mentioned exposure apparatus, and includes illuminating the first object with the exposure light using the illumination optical system, and projecting a pattern image of the first object onto the second object using the projection optical system.
[0008] The configurations of the embodiments described below may be modified as appropriate, and at least a portion of the configuration may be replaced with other components. Furthermore, components that are not particularly limited in terms of their placement may be placed in any position that can achieve their function, not limited to the placement disclosed in the embodiments.
[0009] FIG. 1 is a schematic diagram showing the configuration of an exposure apparatus according to one embodiment. FIG. 2 is a perspective view of a vibration damping device according to one embodiment. FIG. 3(A) is a side view of the vibration damping device as seen from the -Y1 side, and FIG. 3(B) is a side view of the vibration damping device as seen from the +X1 side. FIG. 4(A) is a top view of the vibration damping device, and FIG. 4(B) is a cross-sectional view taken along line A-A in FIG. 4(A). FIG. 5 is a diagram showing a first restraint mechanism according to a modified example.
[0010] An exposure apparatus 10 according to one embodiment will be described with reference to FIGS. 1 to 4B.
[0011] (Configuration of Exposure Apparatus) FIG. 1 is a diagram that shows a schematic configuration of an exposure apparatus 10 according to this embodiment.
[0012] The exposure apparatus 10 is a scanning stepper (scanner) that drives a mask MSK and a glass substrate (hereinafter referred to as "substrate") P in the same direction and at the same speed relative to a projection optical system PL, thereby transferring a pattern formed on the mask MSK onto the substrate P. The substrate P is a rectangular glass substrate used in, for example, a liquid crystal display device (flat panel display), with at least one side or diagonal length of 500 mm or more.
[0013] In the following, the direction in which the mask MSK and substrate P are driven during scanning exposure (scanning direction) is referred to as the X-axis direction, the direction in the horizontal plane perpendicular to this is referred to as the Y-axis direction, the direction perpendicular to the X-axis and Y-axis is referred to as the Z-axis direction, and the rotation (tilt) directions around the X-axis, Y-axis, and Z-axis are referred to as the θx, θy, and θz directions, respectively.
[0014] The exposure apparatus 10 includes an illumination optical system IOP, a mask stage MST that holds a mask MSK, a projection optical system PL, a body 70 that supports these, a substrate stage PST that holds a substrate P, and a control system for these. The control system provides overall control of each component of the exposure apparatus 10.
[0015] The body 70 includes a base (vibration isolation table) 71, columns 72A and 72B, an optical surface plate (housing) 73, a support 74, and a slide guide 75. The base (vibration isolation table) 71 is placed on a floor F and supports the columns 72A, 72B, etc., while isolating vibrations from the floor F. The columns 72A and 72B each have a frame shape, with the column 72A being placed inside the column 72B. The optical surface plate 73 has, for example, a flat plate shape and is fixed to the ceiling of the column 72A. The support 74 is supported by the ceiling of the column 72B via a slide guide 75. The slide guide 75 includes an air ball lifter and a positioning mechanism, and positions the support 74 (i.e., the mask stage MST, described later) at an appropriate position in the X-axis direction relative to the optical surface plate 73.
[0016] The illumination optical system IOP is disposed above the body 70. The illumination optical system IOP irradiates the mask MSK with illumination light IL.
[0017] The mask stage MST is supported by a support 74. A mask MSK having a pattern surface (the lower surface in FIG. 1 ) on which a circuit pattern is formed is fixed to the mask stage MST by, for example, vacuum suction (or electrostatic suction). The mask stage MST is driven by a drive system including, for example, a linear motor at a predetermined stroke in the scanning direction (X-axis direction), and is also driven slightly in the non-scanning directions (Y-axis direction and θz direction).
[0018] Position information of the mask stage MST in the XY plane (including rotation information in the θz direction) is measured by an interferometer system. The interferometer system measures the position of the mask stage MST by irradiating a measurement beam onto a movable mirror (or a mirror-finished reflective surface (not shown)) provided at the end of the mask stage MST and receiving the light reflected from the movable mirror. The measurement results are supplied to a control device (not shown), which drives the mask stage MST via a drive system in accordance with the measurement results of the interferometer system.
[0019] The projection optical system PL is supported on an optical surface plate 73 below (on the -Z side of) the mask stage MST. The projection optical system PL is configured similarly to the projection optical system disclosed in, for example, U.S. Pat. No. 5,729,331. The projection optical system PL includes multiple (e.g., seven) projection optical units 100 (multi-lens projection optical units) arranged, for example, in a staggered pattern, to project the pattern image of the mask MSK. This forms a rectangular image field with the Y-axis direction as its longitudinal direction. Here, four projection optical units 100 are arranged at predetermined intervals in the Y-axis direction, and the remaining three projection optical units 100 are arranged at predetermined intervals in the Y-axis direction, spaced apart from the four projection optical units 100 on the +X side. Each of the multiple projection optical units 100 is, for example, a bilaterally telecentric, 1x1 system that forms an erect, normal image. The multiple projection areas of the staggered projection optical units 100 are collectively referred to as the exposure area.
[0020] When the illumination area on the mask MSK is illuminated by illumination light IL from the illumination optical system IOP, the illumination light IL that has passed through the mask MSK forms a projected image (partial erect image) of the circuit pattern of the mask MSK within that illumination area, via the projection optical system PL, in an irradiation area (exposure area (conjugate to the illumination area)) on the substrate P, which is arranged on the image plane side of the projection optical system PL. Here, a resist (sensitizer) is applied to the surface of the substrate P. By synchronously driving the mask stage MST and the substrate stage PST, i.e., by driving the mask MSK in the scanning direction (X-axis direction) relative to the illumination area (illumination light IL) and driving the substrate P in the same scanning direction relative to the exposure area (illumination light IL), the substrate P is exposed and the pattern of the mask MSK is transferred onto the substrate P.
[0021] The substrate stage PST is disposed on a base (vibration isolation table) 71 below (on the -Z side of) the projection optical system PL. The substrate P is held on the substrate stage PST via a substrate holder (not shown).
[0022] Position information of the substrate stage PST in the XY plane (including rotation information (yawing amount (rotation amount θz in the θz direction), pitching amount (rotation amount θx in the θx direction), and rolling amount (rotation amount θy in the θy direction))) is measured by an interferometer system. The interferometer system measures the position of the substrate stage PST by irradiating a measurement beam from the optical surface plate 73 onto a movable mirror (or a mirror-finished reflective surface (not shown)) provided at the end of the substrate stage PST, and receiving the reflected light from the movable mirror. The measurement results are supplied to a control device (not shown), and the control device drives the substrate stage PST in accordance with the measurement results of the interferometer system.
[0023] In exposure apparatus 10, alignment measurement (for example, EGA, etc.) is performed prior to exposure, and the results are used to expose substrate P in the following procedure. First, in accordance with instructions from the control device, mask stage MST and substrate stage PST are synchronously driven in the X-axis direction. This performs scanning exposure on the first shot area on substrate P. When scanning exposure on the first shot area is completed, the control device moves (steps) substrate stage PST to a position corresponding to the second shot area. Then, scanning exposure is performed on the second shot area. Similarly, the control device repeats stepping between shot areas on substrate P and scanning exposure on the shot areas to transfer the pattern of mask MSK to all shot areas on substrate P.
[0024] In the above-described exposure apparatus 10, if the optical surface plate 73 vibrates during scanning exposure, it affects the exposure accuracy (the accuracy of the pattern formed on the photosensitive material of the substrate P). The inventors discovered through simulation that multiple vibration modes occur in the optical surface plate 73 during scanning exposure. Possible causes of vibration of the optical surface plate 73 include, for example, vibration due to the operation of the exposure apparatus 10 itself, vibration due to the environment surrounding the exposure apparatus 10, etc.
[0025] Therefore, in this embodiment, one or more vibration damping devices 80 are installed on the optical surface plate 73 that holds the projection optical system PL in order to suppress vibration of the optical surface plate 73. The structure of the vibration damping device 80 according to this embodiment will be described in detail with reference to Figures 2 to 4B. In Figures 2 to 4B, the direction in which a weight 82 (described later) moves is defined as the Z1 direction, and the directions in which the sides of a rectangular lower base portion 81b (described later) extend in a plane perpendicular to the Z1 direction are defined as the X1 direction and the Y1 direction. The X1 direction, Y1 direction, and Z1 direction are orthogonal to one another.
[0026] Fig. 2 is a perspective view of the vibration damping device 80 according to this embodiment. Fig. 3(A) is a side view of the vibration damping device 80 as seen from the -Y1 side, and Fig. 3(B) is a side view of the vibration damping device 80 as seen from the +X1 side. Fig. 4(A) is a top view of the vibration damping device 80, and Fig. 4(B) is a cross-sectional view taken along line A-A in Fig. 4(A). In Fig. 4(A), some of the components of the vibration damping device 80 are indicated by dashed lines.
[0027] As shown in Figure 2, the vibration control device 80 comprises a frame body 81, a weight 82 arranged within the frame body 81, a plurality of first restraint mechanisms 84 that connect the frame body 81 and the weight 82 and allow movement of the weight 82 in the Z1 direction, a plurality of second restraint mechanisms 85 that connect the frame body 81 and the weight 82 and allow movement of the weight 82 in the Z1 direction, and a plurality of leaf springs (third restraint mechanisms) 86 that connect the plurality of first restraint mechanisms 84 and the plurality of second restraint mechanisms 85 and restrain movement of the weight 82 in a direction inclined relative to a plane perpendicular to the Z1 direction.
[0028] 3A and 3B, the frame 81 includes an upper base portion (first member) 81a, a lower base portion (second member) 81b, and a plurality of support members 81c that connect the upper base portion 81a and the lower base portion 81b. The plurality of support members 81c maintain the upper base portion 81a and the lower base portion 81b spaced apart in the Z1 direction.
[0029] 4B, a weight 82 is disposed between the upper base portion 81a and the lower base portion 81b. The weight 82 has, for example, a cylindrical shape. A recess 82a is formed on the −Z1 side surface of the weight 82, and a part of a stator 83a of a voice coil motor (VCM) 83 is housed in the recess 82a.
[0030] A stator 83a of the VCM 83 is fixed to the lower base portion 81b, and a mover 83b is fixed to the weight 82. As a result, the VCM 83 drives the weight 82 in the Z1 direction between the upper base portion 81a and the lower base portion 81b.
[0031] In this embodiment, four first constraint mechanisms 84 and four second constraint mechanisms 85 are provided. The four first constraint mechanisms 84 connect the upper base portion 81a and the weight 82 and allow movement of the weight 82 in the Z1 direction. The multiple first constraint mechanisms 84 also restrict movement of the weight 82 in a plane perpendicular to the Z1 direction and around the Z1 axis (an axis parallel to the Z1 direction). As shown in FIG. 4A , in this embodiment, the four first constraint mechanisms 84 are arranged at 90-degree intervals in the circumferential direction of a circle centered on the central axis AX of the weight 82. As a result, even if the vibration damping device 80 is installed with the X1 direction or the Y1 direction parallel to the direction of gravity (with the Z1 direction parallel to the horizontal direction), for example, movement of the weight 82 in a plane perpendicular to the Z1 direction and movement of the weight 82 around the Z1 axis can be restricted while allowing movement of the weight 82 in the Z1 direction.
[0032] Each first restraint mechanism 84 includes a first leaf spring (first leaf spring portion) 84a, a second leaf spring (second leaf spring portion) 84b, and a first connecting portion 84c. One end of the first leaf spring 84a is connected to a fixed portion 81a1 of the upper base portion 81a, and the other end of the first leaf spring 84a is connected to a first fixed portion 84c1 of the first connecting portion 84c. One end of the second leaf spring 84b is connected to an upper fixed portion 82b fixed to the end face on the +Z1 side of the weight 82, and the other end of the second leaf spring 84b is connected to the first fixed portion 84c1 of the first connecting portion 84c. In this way, the upper base portion 81a and the weight 82 are connected using two leaf springs whose other ends are connected to each other and extend in parallel. In other words, by connecting the two leaf springs in a U-shape, the distance (stroke) that the weight 82 can move in the Z1 direction can be made longer than when the upper base portion 81a and the weight 82 are connected using a single leaf spring of the same length.
[0033] The four second constraint mechanisms 85 connect the lower base portion 81b and the weight 82 and allow movement of the weight 82 in the Z1 direction. The four second constraint mechanisms 85 also constrain movement of the weight 82 in a plane perpendicular to the Z1 direction and movement of the weight 82 around the Z1 axis. The four second constraint mechanisms 85 are arranged to face the four first constraint mechanisms 84 in the Z1 direction.
[0034] Each second restraint mechanism 85 includes a third leaf spring (third leaf spring portion) 85a, a fourth leaf spring (fourth leaf spring portion) 85b, and a second connecting portion 85c. One end of the third leaf spring 85a is connected to a fixed portion 81b1 of the lower base portion 81b, and the other end of the third leaf spring 85a is connected to a first fixed portion 85c1 of the second connecting portion 85c. One end of the fourth leaf spring 85b is connected to a lower fixed portion 82c fixed to the end face on the -Z1 side of the weight 82, and the other end of the fourth leaf spring 85b is connected to the first fixed portion 85c1 of the second connecting portion 85c. By connecting the lower base portion 81b and the weight 82 using two leaf springs whose other ends are connected to each other and extend in parallel in this manner, the distance (stroke) that the weight 82 can move in the Z1 direction can be made longer than when connecting the lower base portion 81b and the weight 82 using a single leaf spring of the same length.
[0035] The thickness of each of the first leaf spring 84a, the second leaf spring 84b, the third leaf spring 85a, and the fourth leaf spring 85b is determined based on the weight of the weight 82 and the frequency at which vibration is to be damped.
[0036] The leaf spring (third constraint mechanism) 86 connects the first constraint mechanism 84 and the second constraint mechanism 85, and restricts movement of the weight 82 in a direction inclined with respect to a plane perpendicular to the Z1 direction. In this embodiment, one end of the leaf spring 86 is connected to the second fixed portion 84c2 of the first connecting portion 84c of the first constraint mechanism 84, and the other end of the leaf spring 86 is connected to the second fixed portion 85c2 of the second connecting portion 85c of the second constraint mechanism 85.
[0037] A vibration absorbing member 87 is installed between the lower base portion 81b and the second fixed portion 85c2 of the second connecting portion 85c. In this embodiment, the -Z1 side end of the vibration absorbing member 87 is fixed to the lower base portion 81b. The +Z1 side end of the vibration absorbing member 87 is not fixed to any member. Because the second fixed portion 85c2 of the second connecting portion 85c is part of the second restraint mechanism 85, it can also be said that the vibration absorbing member 87 is installed between the lower base portion 81b and the second restraint mechanism 85. Furthermore, because the second fixed portion 85c2 fixes the leaf spring 86, it can also be said that the vibration absorbing member 87 is installed between the lower base portion 81b and the leaf spring 86. Note that, for example, the vibration absorbing member 87 may also be installed between the lower base portion 81b and the first fixed portion 85c1 of the second connecting portion 85c.
[0038] The vibration absorbing member 87 absorbs vibrations (resonance) of the leaf spring 86 caused by unwanted vibration modes occurring in the vibration damping device 80. Materials for the vibration absorbing member 87 include those that convert kinetic energy caused by vibration into energy such as heat or sound to attenuate vibration. For example, viscoelastic materials (polymers, viscous fluids, and particle-filled structures) may be used. Here, an example of a polymer is Sorbothen (registered trademark). An example of a material using a viscous fluid is a damper that uses oil or water.
[0039] Furthermore, the vibration damping device 80 includes a weight compensation mechanism 91 that compensates for the weight of the weight 82. The weight compensation mechanism 91 includes a support portion 91a and a compression coil spring 91b. The support portion 91a has a generally T-shaped cross section and includes a spring engaging portion 91a1 that intersects with the Z1 direction and an extension portion 91a2 that extends from the spring engaging portion 91a1 in the −Z1 direction. The extension portion 91a2 is connected to the weight 82.
[0040] One end of the compression coil spring 91b contacts the bottom surface of a recess 81a2 formed in the upper base portion 81a, and the other end contacts a spring engaging portion 91a1 of the support portion 91a. The spring force generated by the compression coil spring 91b is set so that, when the weight 82 is stationary, the first leaf spring 84a, the second leaf spring 84b, the third leaf spring 85a, and the fourth leaf spring 85b are parallel to a plane perpendicular to the Z1 direction. In other words, when the weight 82 is stationary, the position of the weight 82 is maintained at the center of the stroke. Furthermore, it is desirable that the spring constant of the compression coil spring 91b be as small as possible to reduce loss of thrust from the VCM 83.
[0041] This reduces the loss of thrust of the VCM 83 due to expansion and contraction of the compression coil spring 91b, while compensating for the weight of the weight 82 when no load is applied to the VCM 83. It also ensures a sufficient stroke when driving the weight 82. It also reduces the load on the VCM 83 when driving the weight 82.
[0042] The lengths Lx1 and Ly1 of the vibration damping device 80 in the X1 and Y1 directions are, for example, 120 mm to 130 mm, and the height H of the vibration damping device 80 is, for example, 123 mm to 129 mm. Note that the size of the vibration damping device 80 is not limited to this.
[0043] In this embodiment, the vibration damping device 80 is installed on the optical surface plate 73 so that the movement direction (Z1 direction) of the weight 82 coincides with the direction of gravity (Z direction in FIG. 1). In other words, the vibration damping device 80 is installed on the optical surface plate 73 so that the lower base portion 81b contacts the upper surface of the optical surface plate 73.
[0044] It is preferable to provide the vibration damping device 80 at a position other than the node of at least one of the vibration modes to be damped among the multiple vibration modes occurring in the optical surface table 73. This is because if the vibration damping device 80 is provided at the node of the vibration mode, driving the vibration damping device 80 will not contribute to damping of the vibration mode. It is more preferable to provide the vibration damping device 80 in an area where it can contribute to damping of the vibration mode, and even more preferable to provide it near the antinode of the vibration mode where vibration displacement is particularly large. By using the VCM 83 to move the weight 82 in the Z1 direction at a frequency corresponding to the frequency of the vibration mode to be damped, it is possible to suppress vibration at the frequency of the vibration mode to be damped among the vibration modes occurring in the optical surface table 73.
[0045] Furthermore, for example, if two of the multiple vibration modes occurring in the optical surface table 73 are to be damped, it is preferable to install the vibration damping device 80 in a range where the non-node portions of one vibration mode overlap with the non-node portions of the other vibration mode. It is more preferable to install the vibration damping device 80 in an area that can contribute to damping of the two vibration modes. In particular, if the antinodes of the two vibration modes, where vibration displacement is large, are close to each other, it is even more preferable to install the vibration damping device 80 near those locations (e.g., midway between the positions where the antinodes of the two vibration modes occur). By using the VCM 83 to move the weight 82 in the Z1 direction at frequencies corresponding to the frequencies of the two vibration modes, it is possible to suppress vibration of the optical surface table 73 at the frequencies of the two vibration modes. This improves the exposure accuracy of the exposure apparatus 10. Furthermore, the weight of the weight 82 can be significantly reduced compared to when a passive mass damper is used.
[0046] The vibration damping device 80 may be installed at one location or at multiple locations.
[0047] As described in detail above, according to this embodiment, the vibration control device 80 comprises a frame body 81 having an upper base portion 81a and a lower base portion 81b that are maintained spaced apart in the Z1 direction, a weight 82 arranged between the upper base portion 81a and the lower base portion 81b, and a VCM 83 that drives the weight 82 in the Z1 direction between the upper base portion 81a and the lower base portion 81b. Furthermore, the vibration control device 80 includes a plurality of first restraint mechanisms 84, each having a first leaf spring 84a and a second leaf spring 84b, which connect the upper base portion 81a and the weight 82 and allow movement of the weight 82 in the Z1 direction; a plurality of second restraint mechanisms 85, each having a third leaf spring 85a and a fourth leaf spring 85b, which connect the lower base portion 81b and the weight 82 and allow movement of the weight 82 in the Z1 direction; and a plurality of leaf springs 86, which connect the plurality of first restraint mechanisms 84 and the plurality of second restraint mechanisms 85 and restrain movement of the weight 82 in a direction inclined relative to a plane perpendicular to the Z1 direction.
[0048] Furthermore, according to this embodiment, the multiple first restraint mechanisms 84 restrain the movement of the weight 82 in a plane perpendicular to the Z1 direction and the movement of the weight 82 around the Z1 axis, and the multiple second restraint mechanisms 85 restrain the movement of the weight 82 in a plane perpendicular to the Z1 direction and the movement of the weight 82 around the Z1 axis.
[0049] Examples of mechanisms for allowing movement of the weight 82 in the Z1 direction while restricting movement of the weight 82 in a plane perpendicular to the Z1 direction and around the Z1 axis include sliding guides such as LM guides and air guides. However, with sliding guides, repeated bending stress caused by vibration of the sliding guide causes wear on the guide surface, which leads to changes in characteristics (e.g., sliding friction resistance), making it difficult to ensure stable vibration control performance over a long period of time. Furthermore, maintenance such as lubrication is required. Non-contact guides such as air guides do not wear and therefore do not change their characteristics, but they require power (compressed air) during use and make it difficult to ensure load capacity (allowable load).
[0050] In contrast, in this embodiment, a leaf spring is used as a mechanism for restricting movement of the weight 82 in a plane perpendicular to the Z1 direction and around the Z1 axis while allowing movement of the weight 82 in the Z1 direction. This ensures stable vibration damping performance over a long period of time without wear. Furthermore, maintenance is easy. Furthermore, because leaf springs are less expensive than LM guides and air guides, the component costs of the vibration damping device 80 can be reduced.
[0051] In this embodiment, each of the first restraint mechanisms 84 includes a first leaf spring 84a connected to the upper base portion 81a, a second leaf spring 84b connected to the weight 82, and a first connecting portion 84c connecting the first leaf spring 84a and the second leaf spring 84b. Each of the second restraint mechanisms 85 includes a third leaf spring 85a connected to the lower base portion 81b, a fourth leaf spring 85b connected to the weight 82, and a second connecting portion 85c connecting the third leaf spring 85a and the fourth leaf spring 85b. As shown in FIG. 4B , connecting two leaf springs in a U-shape increases the travel distance (stroke) of the weight 82 compared to using a single leaf spring of the same length. The two leaf springs may also be connected in a V-shape instead of a U-shape.
[0052] In this embodiment, the vibration damping device 80 also includes a plurality of vibration absorbing members 87 that respectively absorb the vibrations of the plurality of leaf springs 86. This allows the vibration damping device 80 to attenuate and suppress resonance of unnecessary vibration modes that occur within the vibration damping device 80.
[0053] Furthermore, in this embodiment, the vibration damping device 80 includes a weight compensation mechanism 91 that compensates for the weight of the weight 82. This allows the position of the weight 82 to be maintained at the center of the stroke when the weight 82 is stationary, thereby ensuring the stroke when the weight 82 is driven. Furthermore, the load on the VCM 83 when the weight 82 is driven can be reduced.
[0054] In the above embodiment, the first restraint mechanism 84 includes the first leaf spring 84a, the second leaf spring 84b, and the first connecting portion 84c. However, the first restraint mechanism 84 may be realized by a single leaf spring. FIG. 5 illustrates a first restraint mechanism 84A according to a modified example. The first restraint mechanism 84A includes a first leaf spring portion 84Aa, a second leaf spring portion 84Ab, and a connecting portion 84Ac connecting the first leaf spring portion 84Aa and the second leaf spring portion 84Ab. The first leaf spring portion 84Aa, the second leaf spring portion 84Ab, and the connecting portion 84Ac are formed from a single leaf spring. That is, in this modified example, the first restraint mechanism 84A is realized by bending a single leaf spring into a U-shape. The upper base portion 81a and the weight 82 may be connected using this configuration. In this case, for example, the leaf spring 86 may be soldered to the connecting portion 84Ac of the first restraint mechanism 84A, or as shown in Fig. 5, a fixing member 88 may be provided to connect the first restraint mechanism 84A and the leaf spring 86. The same applies to the second restraint mechanism 85. Note that the first restraint mechanism 84A may also be realized by bending a single leaf spring into a V-shape instead of a U-shape.
[0055] In the above embodiment, the leaf spring 86 is used as the third restraint mechanism that connects the first restraint mechanism 84 and the second restraint mechanism 85, but this is not limitative. The mechanism that connects the first restraint mechanism 84 and the second restraint mechanism 85 may be a member other than a leaf spring as long as it does not expand or contract in the Z1 direction.
[0056] Furthermore, in the above embodiment, the vibration damping device 80 includes four first constraint mechanisms 84 and four second constraint mechanisms 85, but this is not limited to this. When the vibration damping device 80 is installed with the Z1 direction parallel to the direction of gravity, it is sufficient to have at least three first constraint mechanisms 84 and at least three second constraint mechanisms 85. Furthermore, the number of first constraint mechanisms 84 and the number of second constraint mechanisms 85 may each be five or more.
[0057] In the above embodiment, one end of the vibration absorbing member 87 is fixed to the lower base portion 81b, but this is not limited to this. One end of the vibration absorbing member 87 may be fixed to a separate member fixed to the lower base portion 81b. Also, one end of the vibration absorbing member 87 may be fixed to the support member 81c that connects the upper base portion 81a and the lower base portion 81b. Furthermore, one end of the vibration absorbing member 87 may not be a component of the vibration control device 80, but may be fixed to, for example, the optical table 73 or another member fixed to the optical table 73.
[0058] In the above embodiment, the vibration absorbing member 87 is provided between the lower base portion 81b and the leaf spring 86, but the vibration absorbing member 87 may be provided between the upper base portion 81a and the leaf spring 86, or between the upper base portion 81a and the first restraining mechanism 84. The other end of the vibration absorbing member 87 may be connected to an end of the leaf spring 86.
[0059] In the above embodiment, the weight 82 is driven in the Z1 direction by the VCM 83, but this is not limiting. Instead of the VCM 83, a piezoelectric element, a linear motor, or the like may be used.
[0060] In the above embodiment, an example has been described in which the vibration damping device 80 is installed on the optical base 73, but this is not limiting, and the vibration damping device 80 can be installed on any part within the exposure apparatus 10 for which it is desired to suppress vibrations. Furthermore, the vibration damping device 80 may also be installed in an apparatus other than the exposure apparatus 10.
[0061] In the above embodiment, the vibration damping device 80 is installed so that its Z1 direction is parallel to the direction of gravity, but depending on the direction of vibration occurring in the component, the vibration damping device 80 may be installed so that its Z1 direction is parallel to the horizontal direction (so that the X1 or Y1 direction is parallel to the direction of gravity). Also, the vibration damping device 80 may be installed with its Z1 direction tilted relative to the direction of gravity.
[0062] When the vibration damping device 80 is used with the X1 direction or Y1 direction parallel to the direction of gravity, a non-contact guide such as an air guide makes it difficult to increase the weight of the weight 82. In this embodiment, a leaf spring is used as a mechanism that allows movement of the weight 82 in the Z1 direction while restricting movement of the weight 82 in a plane perpendicular to the Z1 direction and movement of the weight 82 around the Z1 axis, making it possible to increase the weight of the weight 82.
[0063] When the vibration damping device 80 is installed so that the Z1 direction is parallel to the horizontal direction (so that the X1 or Y1 direction is parallel to the direction of gravity), the gravity compensation mechanism 91 may be omitted.
[0064] Furthermore, in the above embodiment, the exposure apparatus 10 is described as being a scanning stepper, but this is not limited to this, and the exposure apparatus 10 may be a stationary exposure apparatus such as a stepper, or may be a step-and-stitch type reduction projection exposure apparatus that combines shot areas.
[0065] Furthermore, although the case where the pattern image of the mask MSK of the exposure apparatus 10 is scanned and exposed onto the substrate P has been described, a spatial light modulator having a plurality of spatial light modulation elements may be used instead of the mask MSK. In this case, the pattern image generated by the spatial light modulator is scanned and exposed onto the substrate P.
[0066] The above-described embodiment is a preferred example of the present invention, but the present invention is not limited to this and can be modified in various ways without departing from the spirit of the present invention.
[0067] 10 Exposure apparatus 80 Vibration suppression device 81 Frame body 81a Upper base portion 81b Lower base portion 81c Support member 82 Weight 83 VCM 84, 84A First constraint mechanism 84a First leaf spring 84Aa First leaf spring portion 84b Second leaf spring 84Ab Second leaf spring portion 84c First connecting portion 84Ac Connecting portion 85 Second constraint mechanism 85a Third leaf spring 85b Fourth leaf spring 86 Leaf spring 87 Vibration absorbing member 91 Weight compensation mechanism 73 Optical surface plate IOP Illumination system MSK Mask P Substrate PL Projection optical system
Claims
1. a frame body having a first member and a second member that are maintained spaced apart in a first direction; a weight disposed between the first member and the second member; an actuator disposed between the first member and the second member and configured to drive the weight in the first direction; a plurality of first restraining mechanisms each including one or a plurality of leaf springs that connect the first member and the weight and allow the weight to move in the first direction; a plurality of second restraining mechanisms each including one or a plurality of leaf springs that connect the second member and the weight and allow the weight to move in the first direction; a plurality of third constraint mechanisms that connect the plurality of first constraint mechanisms and the plurality of second constraint mechanisms and that constrain movement of the weight in a direction inclined with respect to a plane perpendicular to the first direction; A vibration damping device comprising:
2. the plurality of first constraint mechanisms constrain movement of the weight in a plane perpendicular to the first direction and around a first axis parallel to the first direction; the plurality of second constraint mechanisms constrain movement of the weight in a plane perpendicular to the first direction and movement of the weight around the first axis. The vibration damping device according to claim 1 .
3. Each of the plurality of first restraint mechanisms comprises: a first leaf spring portion connected to the first member; a second leaf spring portion connected to the weight; a first connecting portion that connects the first leaf spring portion and the second leaf spring portion; Including, Each of the plurality of second restraint mechanisms comprises: a third leaf spring portion connected to the second member; a fourth leaf spring portion connected to the weight; a second connecting portion connecting the third leaf spring portion and the fourth leaf spring portion; Including, The vibration damping device according to claim 1 or 2.
4. the first leaf spring portion, the second leaf spring portion, and the first connecting portion are formed by a single leaf spring, the third leaf spring portion, the fourth leaf spring portion, and the second connecting portion are formed of a single leaf spring; The vibration damping device according to claim 3 .
5. the plurality of first restraint mechanisms are arranged at at least three locations in a circumferential direction of a circle centered on a first axis parallel to the first direction, the plurality of second restraint mechanisms are arranged to face the plurality of first restraint mechanisms in the first direction. The vibration damping device according to claim 1 or 2.
6. each of the plurality of third restraint mechanisms is a leaf spring; The vibration damping device according to claim 1 or 2.
7. Each of the plurality of third restraint mechanisms is a member that does not expand or contract in the direction of movement of the weight. The vibration damping device according to claim 1 or 2.
8. a plurality of vibration absorbing members that respectively absorb vibrations of the plurality of third restraint mechanisms; The vibration damping device according to claim 1 or 2.
9. the plurality of vibration absorbing members are respectively provided between the first member and the plurality of first restraint mechanisms, between the second member and the plurality of second restraint mechanisms, between the first member and the plurality of third restraint mechanisms, or between the second member and the plurality of third restraint mechanisms; The vibration damping device according to claim 8.
10. a weight compensation mechanism for compensating for the weight of the weight; The vibration damping device according to claim 1 or 2.
11. The actuator is a voice coil motor. The vibration damping device according to claim 1 or 2.
12. a thickness of the one or more leaf springs included in each of the plurality of first restraint mechanisms and a thickness of the one or more leaf springs included in each of the plurality of second restraint mechanisms are determined based on a weight of the weight and a frequency to be damped; The vibration damping device according to claim 1 or 2.
13. a support member that connects the first member and the second member; The vibration damping device according to claim 1 or 2.
14. An exposure apparatus that exposes a pattern image of a first object onto a second object, an illumination optical system that illuminates the first object with exposure light; a projection optical system that projects the exposure light from the first object onto a second object; a housing that supports the projection optical system; The vibration damping device according to claim 1 or 2; Equipped with the vibration damping device is disposed near a position corresponding to an antinode of at least one of a plurality of vibration modes occurring in the housing; Exposure equipment.
15. The second object is a photosensitive substrate having at least one side length or diagonal length of 500 mm or more. The exposure apparatus according to claim 14.
16. the actuator moves the weight in the first direction at a frequency corresponding to a frequency of the at least one vibration mode. The exposure apparatus according to claim 14.
17. An exposure method using the exposure apparatus according to claim 14, illuminating the first object with the exposure light using the illumination optical system; projecting a pattern image of the first object onto the second object using the projection optical system; An exposure method comprising: