Film forming device

Abstract

The sputtering deposition apparatus (1) comprises a deposition chamber (11) for performing a deposition process to prevent deposition material from adhering to one side of a substrate while a film is being deposited on the other side of the substrate, a substrate holder (22) for mounting a substrate (S) having one side and another side, and a rotating drum (12) provided within the deposition chamber (11) and holding the substrate holder (22), the substrate holder (22) being provided reversibly or rotatably relative to the rotating drum (12) between a first position for depositing a film on one side of the substrate (S) and a second position for depositing a film on the other side of the substrate (S), and further comprises a masking member (24) for shielding the other side of the substrate (S) when the substrate holder (22) is at the first position for depositing a film on one side of the substrate (S).

Description

[Technical field]

[0001] The present invention relates to a film forming apparatus, and more particularly to an apparatus for forming films on both sides of a substrate. [Background technology]

[0002] A vacuum deposition apparatus capable of forming a film on both sides of a substrate is known (see, for example, Patent Document 1). In this vacuum deposition apparatus, a substrate is attached to a substrate holder so that both sides of the substrate are exposed, and the substrate holder is rotatably attached to a substrate jig. After forming a deposited film on one side of the substrate, the substrate holder is rotated relative to the substrate jig to invert the substrate. Then, a deposited film is formed on the other side of the inverted substrate, thereby forming films on both sides of the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 5-271935 Summary of the Invention [Problem to be solved by the invention]

[0004] In the conventional vacuum deposition apparatus, the substrate holder for holding the substrate is attached so as to be reversible, and therefore a gap is required between the substrate holder and the adjacent substrate holder to prevent interference between them. However, during film formation, the deposition material flows through the gap to the rear surface of the substrate holder, forming a film on a part of the rear surface of the substrate. Due to the influence of the flowing film, there is a problem that the film performance on the rear surface does not exhibit the film performance as designed.

[0005] An object of the present invention is to provide a film forming apparatus capable of preventing a film forming material from adhering to one surface of a substrate while a film is being formed on the other surface of the substrate. [Means for solving the problem]

[0006] The present invention relates to a film formation apparatus including a film formation chamber for performing a film formation process, a substrate holder for mounting a substrate having one surface and another surface, and a rotor provided within the film formation chamber and for holding the substrate holder, the substrate holder being provided reversibly or rotatably between a first position for forming a film on one surface of the substrate and a second position for forming a film on the other surface of the substrate with respect to the rotor, the apparatus comprising: The above problem is solved by a film formation apparatus further including a masking member that shields the other surface of the substrate when a film is formed on one surface of the substrate when the substrate holder is at the first position. Effect of the Invention

[0007] According to the present invention, while a film is being formed on one surface of the substrate, the other surface of the substrate is shielded with a masking member, thereby preventing deposition material from adhering to the other surface of the substrate while a film is being formed on one surface of the substrate. [Brief description of the drawings]

[0008] [Figure 1] 1 is a cross-sectional view showing an embodiment of a film forming apparatus according to the present invention. [Diagram 2] FIG. 2 is a vertical cross-sectional view taken along line II-II in FIG. [Diagram 3] 3 is an enlarged view of a portion III in FIG. 2, and is a front view showing a first embodiment of a masking member according to the present invention. FIG. [Figure 4] 4 is a view taken along line IV-IV in FIG. 3. [Diagram 5] FIG. 5 is an enlarged view of a portion V in FIG. [Figure 6] 6 is a view taken along line VI-VI in FIG. 5. [Figure 7] 4 is a view taken along line IV-IV in FIG. 3, showing the operation (part 1) of the first embodiment of the masking member according to the present invention. [Figure 8] 4 is a view taken along line IV-IV in FIG. 3, showing the operation (part 2) of the first embodiment of the masking member according to the present invention. FIG. [Figure 9]4 is a view taken along line IV-IV in FIG. 3, showing the operation (part 3) of the first embodiment of the masking member according to the present invention. FIG. [Figure 10] FIG. 4 is a perspective view showing a second embodiment of a masking member according to the present invention. [Figure 11] FIG. 11 is an enlarged perspective view of a portion XI in FIG. [Figure 12] FIG. 11 is an enlarged perspective view of a portion XII in FIG. [Figure 13] 11 is a plan view showing the operation (part 1) of the second embodiment of the masking member according to the present invention. FIG. [Figure 14] FIG. 11 is a plan view showing the operation (part 2) of the second embodiment of the masking member according to the present invention. [Figure 15] FIG. 11 is a plan view showing the operation (part 3) of the second embodiment of the masking member according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a cross-sectional view showing one embodiment of a film formation apparatus according to the present invention, and Fig. 2 is a vertical cross-sectional view taken along line II-II in Fig. 1. The film formation apparatus of this embodiment is a sputtering film formation apparatus 1, and includes a film formation chamber 11 capable of reducing pressure and introducing a discharge gas, in which a film is formed on a substrate S, a rotating drum 12 rotatably provided within the film formation chamber 11, and a first sputtering electrode 13 and a second sputtering electrode 14 facing the outer surface of the rotating drum 12.

[0010] The film formation chamber 11 is made of a hollow housing that forms a substantially sealed space, and is rectangular in plan and side views, for example, as shown in Figures 1 and 2. A suction port of a first exhaust device 15 such as a turbo molecular pump is connected to a wall surface of the film formation chamber 11, and the film formation chamber 11 is maintained at a predetermined reduced pressure atmosphere by exhausting gas from the internal space of the film formation chamber 11.

[0011] The film-forming chamber 11 is provided with a gas introduction device 16 for introducing a discharge gas (a gas that emits electrons that collide with the target in the sputtering process) and, if necessary, a reactive gas into the internal space of the film-forming chamber 11. The gas introduction device 16 of this embodiment stores a discharge gas, and also stores a reactive gas when performing a reactive sputtering process or the like. The discharge gas is not particularly limited, but an inert gas such as argon gas is used. The reactive gas is selected according to the type of film to be formed, and for example, oxygen gas is used for an oxide film, and nitrogen gas is used for a nitride film.

[0012] 1 and 2, the film-forming chamber 11 is provided with a first sputtering electrode 13 and a second sputtering electrode 14 on a part of the wall surface facing the outer wall of the rotating drum 12. Each of the first sputtering electrode 13 and the second sputtering electrode 14 in this embodiment is connected to a power source 17, and a target serving as a film-forming material is attached to the tip of the sputtering electrode. Each of the first sputtering electrode 13 and the second sputtering electrode 14 is provided in such a position that the surface of the target faces the substrate S supported by the rotating drum 12, and a voltage from the power source 17 is applied to the target during film formation.

[0013] In the sputtering film formation apparatus 1 of this embodiment, a load lock chamber 19 is provided on one of the side walls of the film formation chamber 11 via a gate valve 18 as shown in Fig. 1, and the rotating drum 12 supporting the substrate S is loaded and unloaded via the load lock chamber 19. A door 20 for loading and unloading the rotating drum 12 is provided on one of the walls of the load lock chamber 19. In addition, a suction port of a second exhaust device 21 such as a turbo molecular pump is connected to the wall of the load lock chamber 19, and the gas in the internal space of the load lock chamber 19 is exhausted with the door 20 closed, thereby maintaining the inside of the load lock chamber 19 at a reduced pressure atmosphere.

[0014] The rotating drum 12 in this embodiment is a carousel type drum system, and the substrate S is attached to the side wall surface of the drum via a substrate holder 22. The rotating drum 12 is rotated in a predetermined direction at a predetermined speed around a rotation shaft 121 rotatably provided in the film formation chamber 11 by a driving device 122 such as an electric motor.

[0015] Fig. 3 is an enlarged front view of part III in Fig. 2, showing a plurality of substrate holders 22 attached along the cylindrical outer wall surface of the rotating drum 12, and Fig. 4 is a view taken along line IV-IV in Fig. 3. The substrate holder 22 of this embodiment is interposed between an upper skeletal member 123 and a lower skeletal member 124 of the rotating drum 12, and a shaft 221 of the substrate holder 22 is rotatably supported by each of the upper skeletal member 123 and the lower skeletal member 124.

[0016] The substrate S as a film-formed object is detachably attached to the substrate holder 22 via a dedicated jig or the like. In particular, the substrate S in this embodiment has product specifications in which a film is formed on both the front and back surfaces, and therefore the substrate holder 22 is reversible or rotatable with respect to the rotating drum 12 between a first position where a film is formed on one surface (e.g., the front surface) of the substrate S and a second position where a film is formed on the other surface (e.g., the back surface) of the substrate S. In the present invention, when the substrate holder 22 is moved between the first position and the second position, the substrate holder 22 may be reversed each time or may be rotated by 180°.

[0017] Specifically, as described above, each of the multiple substrate holders 22 is rotatably supported by each of the upper skeletal member 123 and the lower skeletal member 124 of the rotating drum 12. In addition, a cam member 222 is fixed to the upper end of the shaft 221 of each substrate holder 22 as shown in Figures 3 and 4, while a pin member 23 is provided on the film formation chamber 11 side so as to be able to protrude and retract. The pin member 23 is actuated by an actuator or the like to a retracted position where the pin member 23 retracts and does not interfere with the cam member 222, and a protruding position where the pin member 23 protrudes and interferes with the cam member 222.

[0018] During film formation on one side (e.g., the front surface) of the substrate S, with the pin members 23 in the retracted position, each substrate holder 22 stops at a first position where one side (e.g., the front surface) of the supported substrate S faces the outside of the rotating drum 12, thereby causing the one side (e.g., the front surface) of the substrate S to face the first sputtering electrode 13 and the second sputtering electrode 14, and a sputtered film is formed on that one side (e.g., the front surface).

[0019] When a predetermined sputtered film is formed on one surface (for example, the front surface) of the substrate S, the pin members 23, which had been recessed, are operated to the protruding position, and the rotating drum 12 is rotated. This rotation of the rotating drum 12 causes the pin members 23 to come into contact with the cam members 222 of each substrate holder 22, causing the substrate holder 22 to rotate 180°. As a result, the substrate holder 22 is inverted, and the other surface (for example, the back surface) of the supported substrate S stops at a second position facing the outside of the rotating drum 12, whereby the other surface (for example, the back surface) of the substrate S faces the first sputtering electrode 13 and the second sputtering electrode 14. If the film formation process is resumed from this state, a sputtered film will also be formed on the other surface (for example, the back surface) of the substrate S.

[0020] Incidentally, when each of the multiple substrate holders 22 is rotatably attached to the rotating drum 12, it is necessary to provide a small gap between adjacent substrate holders 22 so that they do not interfere with each other during rotation. However, there is a problem that during film formation, the film formation material may get around to the back side of the substrate holder 22 through this gap and adhere to the back side surface of the substrate S. When films are formed on both sides of the substrate S for the purpose of film formation for decoration or the like, even if some film formation material adheres to the back side surface of the substrate S, there is little problem as a decorated product. However, for products such as optical lenses that strictly require the spectral characteristics of the film, even if even a small amount of film formation material adheres to the back side surface of the substrate S, there is a problem that the desired optical characteristics cannot be obtained.

[0021] For this reason, the sputtering film formation apparatus 1 of this embodiment is further provided with a masking member 24 that shields the other surface of the substrate S when a film is formed on one surface of the substrate S. In this case, the masking member 24 not only shields the other surface of the substrate S on which a film has not yet been formed when a film is formed on one surface of the substrate S, but also shields the one surface of the substrate S on which a film has already been formed when a film is formed on the other surface of the substrate S. The masking member 24 according to the present invention will be described below with reference to two embodiments.

[0022] First Embodiment A first embodiment of masking member 24 according to the present invention is shown in Figures 3 to 9. Masking member 24 of the first embodiment has a curtain-like member 241 made of metal, synthetic resin or ceramics having rigidity or flexibility, the upper end of curtain-like member 241 is supported by upper skeleton member 123 of rotating drum 12 via intermediate member 242, and the lower end of curtain-like member 241 is a free end.

[0023] Fig. 5 is an enlarged view of the V part in Fig. 4, and Fig. 6 is a view taken along the line VI-VI in Fig. 5. As shown in Fig. 5, the intermediate member 242 is made of a rigid plate material such as metal or synthetic resin, and is a member having an L-shaped cross section as shown in Fig. 5. A first hinge 243 made of a flat hinge or the like is fixed between the upper end of the intermediate member 242 and the upper frame member 123 of the rotating drum 12, so that the intermediate member 242 can rotate about the rotation axis of the first hinge 243 relative to the rotating drum 12. In addition, a second hinge 244 made of a flat hinge or the like is fixed between the lower end of the intermediate member 242 and the upper end of the curtain-shaped member 241, so that the curtain-shaped member 241 can rotate about the rotation axis of the second hinge 244 relative to the intermediate member 242. As shown in FIG. 6, one first hinge 243 is provided in the center of the intermediate member 242 in the width direction, and two second hinges 244 are provided at both ends of the intermediate member 242 in the width direction.

[0024] Next, the operation will be described. Figures 7 to 9 are views taken along the line IV-IV in Figure 3, showing the operation of the masking member 24 according to the first embodiment, with Figure 7 showing a state in which the rotating drum 12 is stopped and the substrate holder 22 is in the first or second position, Figure 8 showing a state in which the substrate holder 22 is in the first or second position and the rotating drum 12 is rotating, and Figure 9 showing a state in which the rotating drum 12 is stopped and the substrate holder 22 is inverting or rotating.

[0025] As shown in Fig. 7, when the rotating drum 12 is stopped and the substrate holder 22 is in the first or second position, the curtain-shaped member 241 of the masking member 24 hangs down at a position slightly away from the rear surface of the substrate holder 22. The upper end of the curtain-shaped member 241 is attached to the upper frame member 123 of the rotating drum 12 via an intermediate member 242, one first hinge 243, and two second hinges 244, and the lower end is a free end. Therefore, when the rotating drum 12 rotates from the state shown in Fig. 7 to start film formation, a centrifugal force acts on the curtain-shaped member 241 of the masking member 24. This centrifugal force acts as a force that moves the curtain-shaped member 241 toward the outside of the rotating drum 12, so that the curtain-shaped member 241 is pressed toward the rear surface of the substrate holder 22 as shown in Fig. 8.

[0026] Here, the curtain-shaped member 241 of the masking member 24 of this embodiment is attached to the rotating drum 12 via the intermediate member 242, the first hinge 243, and the second hinge 244, so that the curtain-shaped member 241 is in close contact with the back surface of the substrate holder 22 over the entire area from the top to the bottom. Depending on the fixing position of the first hinge 243 to the upper skeleton member 123 of the rotating drum 12, the intermediate member 242 does not need to have an L-shaped cross section, and the intermediate member 242 may be made of a flat plate. Furthermore, in the masking member 24 according to the present invention, it is only necessary that the curtain-shaped member 241 can shield the back surface of the substrate S, so any one of the intermediate member 242, the first hinge 243, or the second hinge 244 may be omitted.

[0027] When the substrate holder 22 is inverted or rotated 180° to form a film on the other surface (for example, the back surface) of the substrate S after completion of film formation on one surface (for example, the front surface), even if the substrate holder 22 is rotated 90° from the first position or the second position, which is the film formation position, as shown in Fig. 9, the curtain-like member 241 of the masking member 24 can be retreated to the inside of the rotating drum 12 by the intermediate member 242, the first hinge 243, and the second hinge 244. This makes it possible to prevent the masking member 24 from interfering with the inversion or 180° rotation of the substrate holder 22.

[0028] Second Embodiment A second embodiment of a masking member according to the present invention is shown in Figures 10 to 15. Masking member 24 of the second embodiment has flat plate-like member 245 made of metal, synthetic resin, or ceramics, which has rigidity or flexibility, and pressing members 246 are attached to the upper and lower ends of this flat plate-like member 245.

[0029] Fig. 10 is a perspective view showing a second embodiment of the masking member 24 according to the present invention, and is a view of a part of the rotating drum 12 seen from the inside, Fig. 11 is an enlarged perspective view of part XI in Fig. 10, and Fig. 12 is an enlarged perspective view of part XII in Fig. 10. As shown in detail in Fig. 11, the upper pressing member 246 shown in Fig. 10 includes a link member 2461 having one end rotatably provided on a support shaft 125 fixed to the rotating drum 12 and the other end rotatably provided on the flat plate-like member 245 of the masking member 24, and two spring members 2462 and 2463 that bias the link member 2461 in a rotational direction toward the substrate holder 22. Similarly, the lower pressing member 246 shown in Figure 10, as shown in detail in Figure 12, comprises a link member 2461 having one end rotatably mounted on a support shaft 125 fixed to the rotating drum 12 and the other end rotatably mounted on the flat member 245 of the masking member 24, and two spring members 2462, 2463 that urge the link member 2461 in a rotational direction toward the substrate holder 22.

[0030] Of the two spring members, the spring member 2463 provided between the link member 2461 and the support shaft 125 spring-biases the link member 2461 in a direction toward the substrate holder 22 around the support shaft 125, and also has the function of retracting the flat member 245 toward the inside of the rotating drum 12 when the substrate holder 22 is inverted or rotated 180° as described below. In contrast, the spring member 2462 provided between the link member 2461 and the flat member 245 spring-biases the flat member 245 in a direction toward the substrate holder 22 around the connecting shaft thereof, and has the function of bringing the flat member 245 into close contact with the rear surface of the substrate holder 22.

[0031] Next, the operation will be described. Figures 13 to 15 are plan views showing the operation of the masking member 24 according to the second embodiment, with Figure 13 showing a state in which the rotating drum 12 is stopped or rotating and the substrate holder 22 is in the first position or the second position, Figure 14 showing a state in which the rotating drum 12 is stopped and the substrate holder 22 has started to turn over or rotate 180° from the first position or the second position, and Figure 15 showing a state in which the rotating drum 12 is stopped and the substrate holder 22 has turned over or rotated 90°.

[0032] 13, in the masking member 24 of the second embodiment, when the substrate holder 22 is in the first position or the second position, regardless of whether the rotating drum 12 is stopped or rotating, the flat member 245 of the masking member 24 is in a position pressed against the back surface of the substrate holder 22. In this state, one spring member 2463 spring-biases the flat member 245 in a direction toward the substrate holder 22 via the link member 2461, while the other spring member 2462 spring-biases the flat member 245 in a direction toward the substrate holder 22, thereby bringing the flat member 245 into close contact with the back surface of the substrate holder 22 without any gaps.

[0033] When the substrate holder 22 is inverted or rotated 180° to form a film on the other surface (for example, the back surface) of the substrate S after completing the film formation on one surface (for example, the front surface) of the substrate S, when the substrate holder 22 starts to rotate from the first position or the second position, which is the film formation position, as shown in Fig. 14, the flat member 245 starts to retreat toward the inside of the rotating drum 12 mainly against the biasing force of the spring member 2463. Then, as shown in Fig. 15, even if the substrate holder 22 rotates 90°, the flat member 245 of the masking member 24 can retreat toward the inside of the rotating drum 12 while resisting the biasing force of the spring member 2463. This makes it possible to prevent the masking member 24 from hindering the inversion or 180° rotation of the substrate holder 22.

[0034] As described above, according to the sputtering film-forming apparatus 1 of this embodiment, while a film is being formed on one surface of the substrate S, the other surface of the substrate S is shielded by the masking member 24, thereby preventing the film-forming material from adhering to the other surface of the substrate S while a film is being formed on one surface of the substrate S.

[0035] The film forming apparatus of the present invention is not limited to a sputtering film forming apparatus, but can also be applied to a vapor deposition apparatus. In addition, the rotating body according to the present invention is embodied in the rotating drum 12 in the above-mentioned embodiment, but the rotating body according to the present invention is not limited to a rotating drum, but can also be applied to an umbrella-shaped rotating body provided at the top of a film forming chamber of a vapor deposition apparatus or the like.

[0036] In addition, in the first embodiment described above, the curtain-like member 241 of the masking member 24 is configured to be pressed against the rear surface of the substrate holder 22 by the centrifugal force accompanying the rotation of the rotating drum 12, but the curtain-like member 241 may also be configured to be pressed against the rear surface of the substrate holder 22 by the elastic force of a spring member or the like. [Explanation of symbols]

[0037] 1...Sputtering deposition equipment 11...Deposition chamber 12...Rotating drum 121...Rotation axis 122...Drive unit 123...Upper frame member 124...Lower frame member 125...Spindle 13...First sputtering electrode 14...Second sputtering electrode 15…First exhaust device 16...Gas introduction device 17...Power supply 18...Gate valve 19...Load lock chamber 20…Door 21…Second exhaust device 22...Substrate holder 221...Axis 222...Cam member 23...Pin member 24…Masking material 241...Curtain-shaped member 242...Intermediate parts 243…First hinge 244…Second hinge 245... Flat plate member 246...Pressing member 2461...Link member 2462...Spring parts 2463...Spring parts S...Substrate

Claims

1. A film forming chamber for performing a film forming process, a substrate holder for mounting a substrate having one surface and the other surface, a rotating body provided in the film forming chamber for holding the substrate holder, and comprising: In the film forming apparatus in which the substrate holder is provided so as to be reversible or rotatable with respect to the rotating body between a first position for forming a film on one surface of the substrate and a second position for forming a film on the other surface of the substrate, when the substrate holder forms a film on one surface of the substrate at the first position, further comprising a masking member for masking the other surface of the substrate, The masking member is composed of a curtain-like member having an upper end supported by the rotating body and a lower end being a free end, A film forming apparatus that is pressed toward the other surface of the substrate by a centrifugal force acting on the masking member due to the rotation of the rotating body.

2. An intermediate member provided between the upper end of the masking member and the rotating body, a first hinge fixed to each of the rotating body and the upper end of the intermediate member, a second hinge fixed to each of the lower end of the intermediate member and the upper end of the masking member, and further comprising: When the substrate holder reverses or rotates between the first position and the second position with respect to the rotating body, the masking member retreats inside the rotating body by the intermediate member, the first hinge, and the second hinge. The film forming apparatus according to claim 1.

3. A film forming chamber for performing a film forming process, a substrate holder for mounting a substrate having one surface and the other surface, a rotating body provided in the film forming chamber for holding the substrate holder, and comprising: In the film forming apparatus in which the substrate holder is provided so as to be reversible or rotatable with respect to the rotating body between a first position for forming a film on one surface of the substrate and a second position for forming a film on the other surface of the substrate, when the substrate holder forms a film on one surface of the substrate at the first position, further comprising a masking member for masking the other surface of the substrate, The masking member is composed of a flat plate-like member, A film forming apparatus further comprising a pressing member that presses the masking member toward the other surface of the substrate when the substrate holder is in the first position, and presses the masking member toward one surface of the substrate when the substrate holder is in the second position.

4. The pressing member is a link member having one end rotatably provided on the rotating body and the other end rotatably provided on the masking member, A spring member that biases the link member in a rotational direction toward the substrate holder. When the substrate holder is inverted or rotated between the first position and the second position with respect to the rotating body, the masking member retreats inward of the rotating body against the biasing force of the spring member of the pressing member. The film forming apparatus according to claim 3, wherein when the inversion or rotation of the substrate holder is completed, the masking member is pressed toward the substrate holder by the pressing member. **Claim 5** The film forming apparatus according to claim 3, wherein the pressing member is provided at an upper end portion and a lower end portion of the masking member. **Claim 6** When forming a film on one surface of the substrate and then inverting or rotating the substrate holder from the first position to the second position to form a film on the other surface of the substrate. The film forming apparatus according to any one of claims 1 to 5, wherein the masking member shields one surface of the substrate.

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