Vaporizer, processing device and processing method, and method for manufacturing semiconductor device

Abstract

The present invention has: a main body that houses a starting material which is in a liquid state at normal temperature; a plurality of temperature sensors that are provided on the side wall of the main body; and a collection unit that is formed so as to collect the starting material on the side wall side on which a temperature sensor disposed at the lower end among the plurality of temperature sensors is provided.

Description

Vaporizer, processing device, processing method, and manufacturing method of semiconductor device

[0001] The present disclosure relates to vaporizers, processing equipment and methods, and methods for manufacturing semiconductor devices.

[0002] A semiconductor manufacturing apparatus for manufacturing semiconductor devices is known as an example of a processing apparatus for processing a workpiece. With the recent trend toward miniaturization of devices, various processing gases, such as gases obtained by vaporizing liquids or gases obtained by sublimating solids, are sometimes used as processing gases for processing substrates. A stable supply of these processing gases at a predetermined flow rate is required. For example, Patent Document 1 discloses a method for steadily supplying processing gases by switching between multiple containers, and Patent Document 2 discloses a method for measuring the remaining amount of raw material using a liquid level sensor.

[0003] International Publication No. 2019 / 181603 International Publication No. 2018 / 056346

[0004] The present disclosure provides a technique for estimating the remaining amount of an ingredient based on the temperature detected by a temperature sensor.

[0005] According to one aspect of the present disclosure, there is provided a technology having a main body that stores a liquid raw material at room temperature, a plurality of temperature sensors provided on a side wall of the main body, and a collection section formed to collect the raw material on the side wall where the temperature sensor located at the bottom of the plurality of temperature sensors is provided.

[0006] According to the present disclosure, the remaining amount of raw material can be estimated based on the temperature detected by the temperature sensor.

[0007] FIG. 1 is a schematic configuration diagram of a processing device preferably used in one embodiment of the present disclosure. It is a cross-sectional view taken along line A-A in FIG. 1 . FIG. 3 is an explanatory diagram illustrating the configuration of a vaporization system preferably used in one embodiment of the present disclosure. FIG. 4 is a longitudinal cross-sectional view of a storage tank preferably used in one embodiment of the present disclosure. FIG. 5 is a schematic configuration diagram of a controller 41 of a processing device preferably used in one embodiment of the present disclosure, and is a block diagram illustrating the control system of the controller 41. FIG. 6 is a diagram illustrating a display unit that displays the transition of temperatures measured by multiple temperature sensors in one embodiment of the present disclosure. FIG. 7 is a transverse cross-sectional view of a storage tank in one embodiment of the present disclosure. FIG. 8 is a longitudinal cross-sectional view of a storage tank in a first modification of the present disclosure. FIG. 9 is a longitudinal cross-sectional view of a storage tank in a second modification of the present disclosure. FIG. 10(a) is a longitudinal cross-sectional view of a storage tank in a third modification of the present disclosure. FIG. 10(b) is a transverse cross-sectional view of a storage tank in a third modification of the present disclosure. FIG. 11 is a longitudinal cross-sectional view of a storage tank in a fourth modification of the present disclosure. Fig. 12(a) is a vertical cross-sectional view of a storage tank according to Modification 5 of the present disclosure. Fig. 12(b) is a horizontal cross-sectional view of a storage tank according to Modification 5 of the present disclosure.

[0008] <One Aspect of the Present Disclosure> One aspect of the present disclosure will be described below with reference to Figures 1 to 7. Note that all drawings used in the following description are schematic, and the dimensional relationships between elements, the ratios of elements, and the like shown in the drawings do not necessarily match those in reality. Furthermore, the dimensional relationships between elements, the ratios of elements, and the like do not necessarily match between multiple drawings.

[0009] (1) Configuration of the Processing Apparatus A reaction tube 1 is provided inside a heater 42, which is a heating device. A manifold 44 made of, for example, stainless steel is connected to the lower end of the reaction tube 1 via an O-ring 46, which is an airtight member. The lower end opening (furnace opening) of the manifold 44 is airtightly closed by a seal cap 35, which is a lid body, via an O-ring 18, which is an airtight member. At least the reaction tube 1, the manifold 44, and the seal cap 35 define a processing chamber 2, which is a processing space.

[0010] The boat 32 serving as a holder is erected on the seal cap 35 via a boat support base 45 , and the boat support base 45 serves as a holder for holding the boat 32 .

[0011] Two gas supply pipes (gas supply pipe 47 and gas supply pipe 48) are provided as supply paths to supply a plurality of types of processing gases (here, two types) to the processing chamber 2.

[0012] The gas supply pipe 47 is provided with, in order from upstream, a liquid source unit 71 serving as a liquid supply section, a reservoir 51, a mass flow controller (hereinafter also referred to as MFC) 49 serving as a liquid flow rate control device (flow rate control means), and an on-off valve 52. A purge gas supply pipe 53 that supplies an inert gas as a purge gas joins the gas supply pipe 47 downstream of the valve 52. The purge gas supply pipe 53 is provided with, in order from upstream, a purge gas source 72, an MFC 54 serving as a flow rate control device (flow rate control means), and an on-off valve 55.

[0013] A nozzle 56 is provided at the tip of the gas supply pipe 47, extending from the bottom to the top along the inner wall of the reaction tube 1, and gas supply holes 57 for supplying gas are provided on the side of the nozzle 56. The gas supply holes 57 are provided at equal intervals from the bottom to the top, and each has the same opening area.

[0014] Here, vaporizer 60 of this embodiment has MFC 49, storage section 51 including storage tank (storage container) 200 for storing the liquid source as described below, and heater 215 for heating the liquid source. In the description of this embodiment, of gas supply pipe 47, a pipe that is upstream of storage tank 200 and is provided between liquid source supply unit 71 and supply pipe 47a. In addition, a part of gas supply pipe 47 downstream of storage tank 200 is referred to as supply pipe 47b.

[0015] The gas supply pipe 47, MFC 49, reservoir 51, valve 52, and nozzle 56 are collectively referred to as a first gas supply unit (first gas supply line). The purge gas supply pipe 53, MFC 54, and valve 55 may also be included in the first gas supply unit. Furthermore, the liquid source unit 71 and purge gas source 72 may also be included in the first gas supply unit. This first gas supply line will be described later.

[0016] The gas supply pipe 48 is provided with, in order from the upstream direction, a reaction gas source 73, an MFC 58 which is a flow rate control device (flow rate control means), and a valve 59 which is an on-off valve, and a purge gas supply pipe 61 which supplies purge gas is joined downstream of the valve 59. The purge gas supply pipe 61 is provided with, in order from upstream, a purge gas source 74, an MFC 62 which is a flow rate control device (flow rate control means), and a valve 63 which is an on-off valve. A nozzle 64 is provided at the tip of the gas supply pipe 48 in parallel with the nozzle 56, and gas supply holes 65 which are supply holes for supplying gas are provided on the side of the nozzle 64. The gas supply holes 65 are provided at equal intervals from the bottom to the top, and each has the same opening area.

[0017] Here, the gas supply pipe 48, the MFC 58, the valve 59, and the nozzle 64 are collectively referred to as a second gas supply line as a second gas supply unit. The purge gas supply pipe 61, the MFC 62, and the valve 63 may also be included in the second gas supply unit. Furthermore, the reaction gas source 73 and the purge gas source 74 may also be included in the second gas supply unit.

[0018] The liquid source supplied from the liquid source unit 71 passes through the MFC 49, the reservoir 51, and the valve 52, merges with the purge gas supply pipe 53, and is further supplied to the processing chamber 2 via the nozzle 56. Note that when the liquid source is supplied to the processing chamber 2, the source vaporized in the vaporizer 60 is supplied. The reaction gas supplied from the reaction gas source 73 passes through the MFC 58 and the valve 59, merges with the purge gas supply pipe 61, and is further supplied to the processing chamber 2 via the nozzle 64.

[0019] The processing chamber 2 is connected to a vacuum pump 68, which is an exhaust device (exhaust means), via a gas exhaust pipe 66 that exhausts gas, and is configured to be evacuated. A valve 67, which serves as an adjustment valve, can open and close to evacuate and stop the evacuation of the processing chamber 2, and the valve 67 is configured to be able to adjust the pressure in the processing chamber 2 by further adjusting the opening degree of the valve.

[0020] The seal cap 35 is provided with a boat rotation mechanism 69, which rotates the boat 32 to improve the uniformity of the processing.

[0021] Next, a first gas supply line having a vaporizer 60 as a vaporization system will be described with reference to Figures 3 and 4. Note that the wafer 31 in the processing chamber 2 is omitted in Figure 3. Also, the same parts as in Figure 1 are denoted by the same numbers, and their description may be omitted.

[0022] The vaporizer 60 includes a storage tank 200 serving as a storage container for storing a liquid source (liquid source), an air valve 207, a pressure sensor P for detecting the pressure inside the storage tank 200, a heater 215 provided on the outside of the sidewall 201, a collection section 218 formed to collect the liquid source 216 on the sidewall 201 where the temperature sensor TC4 (a collective term for temperature sensors TC1, TC2, TC3, and TC4) located at the lower end in the vertical direction is provided even when the remaining amount of the liquid source 216 in the storage tank 200 becomes low, a storage section 51 provided in the bottom wall 202 and including an opening 219 as a supply port for replenishing the liquid source, a heater 217 provided on the outside of the bottom wall 202 as a preheating section, and an MFC 49. The vaporizer 60 further includes a display section 300 (see FIG. 6 ). The display section 300 will be described in detail later. In this specification, the liquid source stored in the storage tank 200 is referred to as the liquid source 216 .

[0023] The liquid source 216 is heated and vaporized by the heater 215. The vaporized source passes through the air valve 207, the MFC 49, the vaporizer 60, and the valve 52, merges with the purge gas supply pipe 53, and is supplied to the processing chamber 2 through the valve V1 and the nozzle 56. The storage tank 200 is configured to be able to estimate the remaining amount of the liquid source 216 based on the temperature detected by a plurality of temperature sensors TC1 to TC4 provided on the side wall 201. When the remaining amount of the liquid source 216 becomes low, the liquid source is replenished into the storage tank 200 from the liquid source unit 71 through the supply pipe 47a and the opening 219.

[0024] The amount of vaporized gas generated by vaporizing the liquid source 216 in the storage tank 200 varies depending on the remaining amount of the liquid source 216. For example, when the remaining amount of the liquid source 216 decreases, the heat transfer area from the heater 215 decreases, and the amount of vaporized gas generated also decreases. In this case, the MFC 49 cannot adjust the flow rate to a value exceeding the amount of vaporized gas generated, making it difficult to supply a predetermined amount of vaporized gas into the processing chamber 2. On the other hand, in the vaporizer 60 of this embodiment, the remaining amount of the liquid source 216 can be estimated by utilizing the temperature changes detected by the temperature sensors TC1 to TC4, making it possible to replenish the liquid source when the liquid source 216 becomes low to a certain extent. Estimation of the remaining amount of the liquid source 216 will be described later.

[0025] The collection section 218 is configured so that, when the remaining amount of the liquid source 216 becomes low, the liquid source 216 flows toward an opening 219 provided between the bottom wall 202 of the storage tank 200 and the supply pipe 47a. This configuration can reduce the influence of heating by the heater 215 when the liquid source is introduced (replenished) into the storage tank 200 from the opening 219. This can prevent the liquid source from vaporizing before being introduced into the storage tank 200. Therefore, it becomes possible to introduce (replenish) the liquid source from the liquid source unit 71 into the storage tank 200 at a predetermined flow rate.

[0026] The heater 215 is provided to surround or cover the side wall 201 and is configured to be able to heat the liquid source 216. If the vaporized source material is re-liquefied, this can cause problems such as the generation of particles, so to prevent this, the heating temperature of the heater 215 is set to a temperature slightly higher than the vaporization temperature of the liquid source material 216. This can enhance the effect of preventing the liquid source material 216 introduced into the storage tank 200 from being re-liquefied.

[0027] On the other hand, heater 217 is provided to cover the outer periphery of supply pipe 47a and is configured to heat the liquid source introduced into storage tank 200. In order to replenish the liquid source in a liquid state into storage tank 200, the heating temperature of heater 217 is set to a temperature slightly lower than the vaporization temperature of the liquid source. This allows the liquid source to be replenished in a liquid state into storage tank 200 while being brought to a state closer to the vaporization temperature, thereby improving the vaporization efficiency of liquid source 216.

[0028] The pressure sensor P is used to check the evacuation when removing the remaining liquid source from the supply pipe 47 etc., which will be described later, or to check the vaporization behavior during troubleshooting.

[0029] When the air valve 207 is closed, vaporized raw material remains between the air valve 207 and the valve 52. The flow of the remaining raw material stops, causing it to re-liquefy. To prevent this re-liquefaction, the air valve AV1 is opened, and an inert gas for purging the piping between the air valve 207 and the MFC 49 and the inside of the MFC 49 is purged to remove the remaining raw material (raw material gas). For example, the effect of preventing the raw material gas from re-liquefying can be enhanced by heating this purge gas to a temperature above its vaporization temperature using a heater (not shown). Whether purging is being performed can be confirmed by checking the detection value of the pressure sensor P.

[0030] By opening and closing air valve AV2, raw material is supplied from liquid raw material unit 71 via supply pipe 47a through reservoir 51. By opening and closing air valve 207, vaporized raw material is supplied via supply pipe 47b through which processing chamber 2 and reservoir 51 are connected. The vaporized raw material in supply pipe 47b is supplied to processing chamber 2 by opening air valve V1 and closing air valves V2 and V3, and is supplied to gas exhaust pipe 66 by closing air valve V1 and opening air valves V2 and V3.

[0031] In addition, the vaporized raw material remains in the supply pipe 47b as residue, and if it adheres to and accumulates on the inner wall of the supply pipe 47b, it will become particles. In this embodiment, the vaporized raw material is exhausted from the supply pipe 47b by the vacuum pump 68 so that the vaporized raw material does not remain as residue.

[0032] For example, after the film formation step of the process recipe is completed or after the process recipe is completed, valves 52, 55, and air valve V1 are closed, and air valves V2 and V3 are opened, and the vaporized source material in supply pipe 47b is evacuated by vacuum pump 68. Alternatively, while valve 55 is opened to supply a purge gas (e.g., an inert gas) from purge gas source 72, air valve V1 may be closed and air valves V2 and V3 may be opened, and the vaporized source material in supply pipe 47b may be evacuated by vacuum pump 68.

[0033] Hand valves H1 and H2 are provided to facilitate replacement of liquid source unit 71. First, hand valve H1 and air valve V2 are closed, and hand valve H2 and air valve V3 are opened to remove the source material from the piping using vacuum pump 68. Once the source material has been removed from the piping, hand valve H2 is closed, the piping is separated from the first gas supply line shown in FIG. 3, and the liquid source unit 71 is replaced.

[0034] 3, like Fig. 1, shows a controller 41 as a control section. The controller 41 is configured to be able to determine the remaining amount of the liquid source 216 in response to a change in temperature measured by a temperature sensor TC.

[0035] For example, the controller 41 is configured to be able to determine the remaining amount of the liquid source 216 in accordance with changes in temperature measured by the temperature sensor TC. If the controller 41 determines that the remaining amount of the liquid source 216 is large as a result of the remaining amount determination, it continues to have the temperature sensor TC measure the temperature. Furthermore, if the controller 41 determines that the remaining amount of the liquid source 216 is low, it can manage the liquid source by notifying the user of the low remaining amount by issuing an alarm or by having the liquid source unit 71 replenish the storage tank 200 with the liquid source. Details of how the temperature sensor TC determines the remaining amount of the liquid source 216 will be described later.

[0036] (Storage Tank) Next, the storage tank 200, which is a main part of the storage unit 51, which is part of the vaporizer 60, will be described using FIG. 4 . FIG. 4 is a longitudinal cross-sectional view of the storage tank 200. The heater 215 and the pressure sensor P are omitted here. In this specification, a longitudinal cross-sectional view of the storage tank 200 refers to a cross-sectional view of the storage tank 200 taken along the vertical direction, and a transverse cross-sectional view of the storage tank 200 refers to a cross-sectional view of the storage tank 200 taken along the horizontal direction. In this specification, the term "upper side" refers to the vertically upper side, and the term "lower side" refers to the vertically lower side. In this specification, the term "high position" refers to a vertically upper position, and the term "low position" refers to a vertically lower position.

[0037] The storage tank 200 is used as a container for storing a liquid source. The storage tank 200 includes a main body (container) 221 that constitutes a storage chamber 210 for storing the liquid source, a plurality of temperature sensors TC provided on a side wall 201, a collection section 218 formed on the side wall 201 side where the temperature sensor TC4, which is the lowest (lowest) of the plurality of temperature sensors TC, is provided to collect the liquid source 216, an opening 219 provided on a bottom wall 202 for replenishing the liquid source, and a lid 203 provided with a flow path (supply pipe 47b) for discharging the source vaporized in the storage chamber 210. The side wall 201, the bottom wall 202, and the lid 203 each constitute the main body 221 that includes the inner wall of the storage chamber 210.

[0038] According to this configuration, the remaining amount of the liquid source 216 can be estimated from the temperature detected (measured) by the temperature sensor TC4. In particular, even if the liquid source 216 is low, the temperature of the liquid source 216 can be detected by the temperature sensor TC4, and the remaining amount of the liquid source 216 can be estimated.

[0039] 4, multiple temperature sensors TC are arranged in a row in the height direction (vertical direction) of the side wall 201 inside the side wall 201. Specifically, temperature sensor TC1 is arranged at the topmost side (upper end) of the side wall 201 in the vertical direction, temperature sensors TC2 and TC3 are arranged below it in this order, and temperature sensor TC4 is arranged at the bottommost side (lower end). The multiple temperature sensors TC are arranged so as to be evenly spaced apart in the height direction of the side wall 201.

[0040] As shown in FIG. 6 , the display unit 300 displays a graph showing the temperature change (temperature transition) measured by the temperature sensor TC. The vertical axis of the graph represents temperature, and the horizontal axis represents elapsed time. The dotted lines (circles) on the graph represent the temperature change measured by the temperature sensor TC1, and are shown in red (solid line) on the display unit 300, for example. The dotted lines (angles) on the graph represent the temperature change measured by the temperature sensor TC2, and are shown in blue (solid line) on the display unit 300, for example. The solid lines on the graph represent the temperature change measured by the temperature sensor TC3, and are shown in black (solid line) on the display unit 300, for example. The long dashed two-dot line on the graph represents the temperature change measured by the temperature sensor TC4, and are shown in yellow (solid line) on the display unit 300, for example. In this way, the display unit 300 can display the temperature changes (temperature transitions) measured by multiple temperature sensors TC located at different positions, each in a different color.

[0041] When the liquid source 216 changes state from liquid to vaporized gas, the temperatures measured by the temperature sensors TC1 to TC4 change (rise). Based on this temperature change, the remaining amount of the liquid source 216 can be estimated. Specifically, at time (t) = 0, among the temperatures measured by the temperature sensors TC1 to TC4, the temperature measured by the temperature sensor TC1 is higher than the temperatures measured by the other temperature sensors TC2 to TC4. This allows us to estimate that the surface (liquid level) of the liquid source 216 is higher than the position of the temperature sensor TC2 and lower than or near the position of the temperature sensor TC1. Furthermore, at t = T, among the temperatures measured by the temperature sensors TC1 to TC4, only the temperature measured by the temperature sensor TC4 does not change (rise). This allows us to estimate that the surface (liquid level) of the liquid source 216 is higher than the temperature sensor TC4 and lower than or near the temperature sensor TC3.

[0042] 4, collection unit 218 has an inclined surface (surface) having a predetermined inclination angle with respect to the horizontal plane so that, when the remaining amount of liquid source 216 becomes low, the remaining liquid source 216 flows toward opening 219 provided at a position close to temperature sensor TC4. In this embodiment, collection unit 218 is configured so that the uppermost side (top end) of the surface is located above the position where temperature sensor TC4 is disposed.

[0043] In this embodiment, as shown in FIG. 4, in the longitudinal cross section of the storage tank 200, the surface of the collection section 218 (the surface in contact with the liquid raw material 216) is configured to be represented by a single straight line, and the collection section 218 is represented by a triangle.

[0044] 7 is a cross-sectional view of the storage tank 200. The position of the straight line indicated by the dotted line is the lowest (bottom end) position of the surface (inclined surface) of the collection section 218. The circle indicated by the dotted line is the opening 219. The cross-sectional shape of the opening 219 may be other than a circle, and may be, for example, an ellipse, a polygon, a star, a diamond, or a trapezoid. Furthermore, the cross-sectional shape of the storage tank 200 may be other than a rectangle, and may be, for example, a circle, an ellipse, a triangle, a polygon with pentagons or more, a star, a diamond, or a trapezoid.

[0045] 7, the temperature sensor TC is disposed near the opening 219. This allows for effective use of the liquid source, since even if the remaining amount of the liquid source 216 is low, the liquid source can be replenished based on the remaining amount management by the temperature detection of the liquid source 216 by the temperature sensor TC. Note that it is sufficient that the temperature sensor TC4, which is disposed at the lowest side (lowest end) of the plurality of temperature sensors TC, is disposed near the opening 219, and it is not necessary that all of the plurality of temperature sensors TC be disposed in the same place in cross section, as shown in FIG.

[0046] The vaporization system in this embodiment has at least a storage tank 200 equipped with a main body 221 for storing liquid raw material at room temperature, a plurality of temperature sensors TC provided on a side wall 201 of the main body 221, and a collection section 218 formed to collect liquid raw material 216 on the side of the side wall 201 where the temperature sensor TC4 is provided, and a controller 41 configured to be able to estimate the remaining amount of liquid raw material 216 in accordance with changes in temperature measured by the plurality of temperature sensors TC.

[0047] The controller 41 is configured to be able to replenish the liquid source from the liquid source unit 71 through the opening 219 based on an estimation of the remaining amount of the liquid source 216 according to changes in temperature measured by a plurality of temperature sensors TC.

[0048] The controller 41 is configured to be able to check the remaining amount of the liquid source 216 in response to changes in the temperature measured by the temperature sensor TC4 and determine whether the liquid source 216 is insufficient or needs to be replenished. When the liquid source 216 becomes so low that replenishment is necessary, the controller 41 is configured to replenish the liquid source from the liquid source unit 71 via the supply pipe 47a and the opening 219.

[0049] Furthermore, the controller 41 is configured to stop the supply of the liquid source from the liquid source unit 71 when the temperature measured by the temperature sensor TC1, which is located at the top (top end) of the multiple temperature sensors TC, reaches a saturated state. Here, the term "the temperature measured by the temperature sensor TC1 reaches a saturated state" means that the temperature measured by the temperature sensor TC1 reaches the temperature state when the liquid source was measured. In other words, the controller 41 is configured to stop the supply of the liquid source from the liquid source unit 71 when the surface (liquid level) position of the liquid source 216 approaches the position of the temperature sensor TC1.

[0050] The controller 41 is configured to be able to replenish the liquid raw material from the opening 219 based on the temperature detected by a temperature sensor TC4 located near the opening 219 provided in the bottom wall 202 of the storage tank 200.

[0051] In this embodiment, the remaining amount of the liquid source 216 is estimated based on the change in temperature detected by the temperature sensor TC4 located at the bottom among the plurality of temperature sensors TC, but this is not a limitation. For example, when the temperature detected by the temperature sensor TC3 among the plurality of temperature sensors TC changes, that is, when the remaining amount of the liquid source 216 has decreased to the height at which the temperature sensor TC4 is located, the liquid source 216 can be replenished.

[0052] (Control Unit) An outline of the controller 41 is shown in FIG. 5. The controller 41, which is the control unit (control means), is configured as a computer including a CPU (Central Processing Unit) 41a, a RAM (Random Access Memory) 41b, a storage device 41c, and an I / O port 41d. The RAM 41b, the storage device 41c, and the I / O port 41d are configured to be able to exchange data with the CPU 41a via an internal bus 41e. The controller 41 is configured to be able to connect to an input / output device 411 configured as, for example, a touch panel, and an external storage device 412. Furthermore, a receiving unit 413 is provided which is connected to a higher-level device 75 via a network. The receiving unit 413 is capable of receiving information from other devices from the higher-level device 75.

[0053] The storage device 41c is composed of, for example, a flash memory, an HDD (Hard Disk Drive), etc. Control programs for controlling the operation of the processing device, process recipes describing procedures and conditions for substrate processing (described later), etc., are readably recorded and stored in the storage device 41c. The process recipe is a combination of procedures in the substrate processing step (described later) that are executed by the controller 41 to obtain a predetermined result, and functions as a program. In this specification, the term "program" may refer to only a process recipe, only a control program, or both. The RAM 41b is configured as a memory area (work area) for temporarily storing programs, data, etc., read by the CPU 41a.

[0054] The I / O port 41d is connected to the boat elevator, heaters 42, 215, 217, MFCs 49, 54, 58, 62, valves 52, 55, 59, 63, 67, and the like.

[0055] The controller 41 adjusts the flow rate of the MFCs 49, 54, 58, and 62, opens and closes the valves 52, 55, 59, 63, and 67, adjusts the temperature of the heaters 42, 215, and 217, starts and stops the vacuum pump 68, adjusts the rotation speed of the boat rotation mechanism 69, and controls the raising and lowering operation of the boat elevator.

[0056] The controller 41 is not limited to being configured as a dedicated computer, but may also be configured as a general-purpose computer. For example, the controller 41 according to this embodiment can be configured by preparing an external storage device 412 (e.g., a semiconductor memory such as a USB memory or a memory card) storing the above-described program and installing the program on a general-purpose computer using the external storage device 412. The means for supplying the program to the computer is not limited to supplying the program via the external storage device 412. For example, the program may be supplied via a communication means such as the Internet or a dedicated line, without going through the external storage device 412. The storage device 41c and the external storage device 412 are configured as computer-readable recording media. Hereinafter, these will be collectively referred to simply as recording media. In this specification, the term "recording medium" may refer to only the storage device 41c alone, only the external storage device 412 alone, or both.

[0057] (2) Processing Method Next, an example of processing a wafer 31 as a substrate (object to be processed) will be described. Here, as an example of a semiconductor device manufacturing process, a cycle process in which a film processing is performed by alternately supplying a source (raw material) and a reactant (reaction gas) to the processing chamber 2 will be described.

[0058] In the film formation process of this embodiment, a film is formed on the wafer 31 by performing a cycle of non-simultaneously performing the following steps a predetermined number of times (one or more): a step of supplying a raw material gas to the wafer 31 in the processing chamber 2 (step 1); a step of removing the raw material gas (residual gas) from the processing chamber 2 (step 2); a step of supplying a reactive gas to the wafer 31 in the processing chamber 2 (step 3); and a step of removing the reactive gas (residual gas) from the processing chamber 2 (step 4).

[0059] (Step 1) In step 1, the raw material is flowed while the heater 42 and the heater 215 are operating. First, the valves 52 and 67 are opened. The raw material is supplied to the reservoir 51 via the supply pipe 47a. The raw material is stored in the reservoir 210 and is heated and vaporized by the heater 215. The vaporized gaseous raw material (raw material gas) has its flow rate adjusted by the MFC 49 and is supplied to the supply pipe 47b. This raw material gas is supplied to the processing chamber 2 through the gas supply holes 57 of the nozzle 56 and is exhausted through the gas exhaust pipe 66. At this time, the raw material gas is supplied to the wafer 31 from the side of the wafer 31. As a result, a first layer is formed on the wafer 31.

[0060] (Step 2) In step 2, the valve 52 of the gas supply pipe 47 is closed to stop the supply of the source gas. The valve 67 of the gas exhaust pipe 66 is left open, and the remaining source gas is evacuated from the processing chamber 2 by the vacuum pump 68. At this time, an inert gas, for example, N 2 is used as a purge gas. ２ Supplying the gas to the processing furnace 29 further enhances the effect of removing the residual source gas.

[0061] (Step 3) In step 3, the reactive gas valve 59 is opened to allow reactive gas to flow into the gas supply pipe 48. The flow rate of the reactive gas is adjusted by the MFC 58, and the reactive gas is supplied to the processing chamber 2 through the gas supply holes 65 of the nozzle 64 and exhausted through the gas exhaust pipe 66. At this time, the reactive gas is supplied to the wafer 31 from the side of the wafer 31. As a result, the first layer on the wafer 31 reacts with the reactive gas and is modified, and a second layer, which is the modified first layer, is formed on the wafer 31.

[0062] (Step 4) In step 4, after the second layer is formed, the valves 59 and 63 are closed, and the processing chamber 2 is evacuated by the vacuum pump 68 to remove the remaining reaction gas. At this time, an inert gas, for example, N 2 is used as a purge gas. ２ Supplying gas into the processing chamber 2 further enhances the effect of removing residual reaction gas from the processing chamber 2 .

[0063] The above steps 1 to 4 constitute one cycle, and by repeating this cycle multiple times, a film of a predetermined thickness can be formed on the wafer 31 .

[0064] (3) Effects of this Aspect According to this aspect, one or more of the following effects can be obtained.

[0065] (a) The remaining amount of the liquid source 216 can be estimated based on the transition of the temperature (change in temperature) measured by the plurality of temperature sensors TC provided on the side wall 201 of the main body 221 .

[0066] Since the collection section 218 is configured to collect the liquid source 216 on the side of the sidewall 201 where the temperature sensor TC4, which is arranged at the lowest side (lowest end) among the plurality of temperature sensors TC, is provided, it is possible to detect the temperature of the liquid source 216 by, for example, the temperature sensor TC4 even if the liquid source 216 is low. This makes it possible to estimate the remaining amount of the liquid source 216 even if it is low, and therefore makes it possible to manage the remaining amount of the liquid source 216.

[0067] (b) The collection section 218 is configured so that when the remaining amount of liquid source 216 becomes low, the remaining liquid source 216 flows toward an opening 219 provided at a position close to the temperature sensor TC4, which is arranged at the lowest (lowest end) of the multiple temperature sensors TC. This makes it possible to detect the temperature of the liquid source 216 using, for example, the temperature sensor TC4, even when the liquid source 216 becomes low, and therefore it is possible to replenish the liquid source based on the remaining amount management of the liquid source 216. This allows for effective use of the liquid source.

[0068] Furthermore, since the opening 219 is provided in the bottom wall 202, the liquid raw material can be replenished into the storage tank 200 at a preset flow rate without being affected by the heater 215 provided on the outside of the side wall 201.

[0069] (c) The uppermost end of the collection section 218 is configured to be located higher than the position of the temperature sensor TC4, which is located at the bottom of the multiple temperature sensors TC. More specifically, the uppermost end (uppermost side) of the inclined surface (surface) of the collection section 218 is configured to be located higher than the position of the temperature sensor TC4. This allows the surface of the collection section 218 (the surface that comes into contact with the liquid source 216) to have a steeper slope. Therefore, even if the liquid source 216 becomes low, the liquid source 216 can be easily collected on the temperature sensor TC4 side, making it easy for the temperature sensor TC4 to detect the temperature of the liquid source 216 and to easily estimate the remaining amount of the liquid source 216. This makes it easy to manage the remaining amount of the liquid source 216.

[0070] (d) Since the multiple temperature sensors TC are arranged so as to divide the side wall 201 evenly in the height direction, the temperature changes detected by the multiple temperature sensors TC occur over a certain period of time, making it easy to estimate the remaining amount of liquid raw material 216.

[0071] (e) In the longitudinal cross section of the storage tank 200, the surface of the collection section 218 (the surface that comes into contact with the liquid source 216) is configured as a single straight line. By providing an inclination to the collection section 218 in this way, even if the liquid source 216 is low, the liquid source 216 can be guided toward the temperature sensor TC, making it possible for the temperature sensor TC to detect the temperature of the liquid source 216 and estimate the remaining amount of the liquid source 216. This makes it possible to manage the remaining amount of the liquid source 216.

[0072] (f) The controller 41 is configured to determine that there is an insufficient remaining amount of the liquid source 216 when there is a change in the temperature measured by the temperature sensor TC4. This allows the controller 41 to manage the remaining amount of the liquid source 216 in accordance with a change in the temperature detected by the temperature sensor TC4, which is located at the lowest (bottom end) of the plurality of temperature sensors TC, for example, a temperature rise when the liquid source 216 is vaporized.

[0073] (g) The controller 41 is configured to replenish the liquid source unit 71 with the liquid source through the opening 219. Specifically, the controller 41 is configured to be able to replenish the liquid source from the liquid source unit 71 through the opening 219 based on an estimate of the remaining amount of the liquid source 216 according to changes in temperature measured by the plurality of temperature sensors TC. This allows reliable management of the remaining amount of the liquid source 216.

[0074] (h) The controller 41 is configured to stop the supply of liquid source to the liquid source unit 71 when the temperature measured by the temperature sensor TC1 reaches saturation. Specifically, the controller 41 is configured to stop the supply of liquid source from the liquid source unit 71 when the surface (liquid level) of the liquid source 216 approaches the position of the temperature sensor TC1, which is the uppermost (top) of the multiple temperature sensors TC. This keeps the liquid source 216 in the main body 221 within a predetermined amount, ensuring sufficient space for the liquid source 216 to transform into a vaporized gas. Furthermore, when refilling the storage tank 200 with liquid source, an appropriate amount (a preset amount) of liquid source can be refilled.

[0075] (i) The controller 41 is configured to be able to replenish the liquid source through the opening 219 based on the temperature detected by the temperature sensor TC4 disposed near the opening 219 provided in the bottom wall 202 of the storage tank 200. This allows the remaining amount of the liquid source 216 to be managed in accordance with changes in the temperature detected by the temperature sensor TC4, for example, a temperature rise when the liquid source 216 is vaporized. Furthermore, the liquid source can be replenished in accordance with the remaining amount of the liquid source 216.

[0076] (j) The display unit 300 displays the temperature changes measured by each of the multiple temperature sensors TC in different colors depending on the positions where they are located, making it easy to grasp the remaining amount of liquid raw material 216.

[0077] (k) By providing the heater 217 for heating the liquid raw material introduced into the main body 221 from the opening 219, the liquid raw material can be supplied at a temperature closer to the vaporization temperature, thereby improving the vaporization efficiency of the liquid raw material 216.

[0078] (4) Modifications The storage tank 200 in this embodiment can be modified as shown below. These modifications can be combined in any way. In the configuration of the storage tank described below, only elements that are different from the storage tank 200 shown in FIG. 4 will be described, and substantially the same elements will be given the same reference numerals and their description will be omitted. Note that the heater 217 is omitted in the modification described below. It goes without saying that the modification can be used in appropriate combination with the above embodiment. The processing procedures and processing conditions in this case can be, for example, the same as the processing procedures and processing conditions of the above embodiment and modification.

[0079] 8, the uppermost (topmost) surface of the collection section 218 may be located lower than the lowest (bottom) temperature sensor TC4 among the plurality of temperature sensors TC. This modification also provides the same effects as the above-described embodiment. Furthermore, this modification allows the liquid source to be replenished into the storage tank 200 when the temperature detected by the temperature sensor TC4 changes, i.e., when the temperature detected by the temperature sensor TC4 reaches the vaporization temperature of the liquid source 216.

[0080] (Variation 2) As shown in Fig. 9, the side wall 201 may be configured to have an uneven shape, and multiple temperature sensors TC may be installed in the protrusions that protrude into the main body 221. This variation also provides the same effects as the above-described embodiment. Furthermore, with the configuration of this variation, even if the remaining amount of liquid source 216 becomes low, it is possible to easily detect the temperature of the liquid source 216, for example, using the temperature sensor TC4. This makes it easy to estimate the remaining amount of liquid source 216, and therefore makes it easy to manage the remaining amount of liquid source 216.

[0081] (Variation 3) As shown in Fig. 10(a), the surface of the collection section 218 (surface in contact with the liquid raw material 216) may be configured as shown by a plurality of straight lines (for example, two straight lines) in a longitudinal cross section of the storage tank 200. Also, as shown in Fig. 10(b), the collection section 218 may be configured as a polygon having five or more sides in a transverse cross section of the storage tank 200. Note that the position of the straight line shown by the dotted line in Fig. 10(b) is the lowest (bottom end) position of the surface (inclined surface) of the collection section 218. In this variation, the same effects as those of the above-mentioned embodiment can be obtained.

[0082] 11 , the collection section 218 may be configured to have at least one rod-shaped heater 250 provided therein. This modification also provides the same effects as the above-described embodiment. Furthermore, this modification allows the heater 250, such as a cartridge heater, to be provided closer to the liquid source 216 for heating, thereby further improving the vaporization efficiency of the liquid source 216.

[0083] (Variation 5) As shown in FIG. 12( a), the collection section 218 may be configured so as not to be visible in the longitudinal cross section of the storage tank 200. Specifically, for example, as shown in FIG. 12( b), the collection section 218 may be formed in a cone shape so as to slope toward the opening 219. This variation also provides the same effect as the above-described variation. Note that, even when the collection section 218 is provided in the center of the main body 221 in the transverse cross section shown in FIG. 12( b), the same effect as the above-described variation can be obtained by disposing the temperature sensor TC4 near the opening 219.

[0084] Other Aspects of the Present Disclosure The above describes specific aspects of the present disclosure. However, the present disclosure is not limited to the above aspects and can be modified in various ways without departing from the spirit and scope of the present disclosure.

[0085] For example, in the above-described embodiment, the uppermost end of the collection unit 218 is disposed at a position higher than the position of the temperature sensor TC4 (see FIG. 4 ) and at a position lower than the lowermost end of the temperature sensor TC4 (see FIG. 8 ). However, the present disclosure is not limited to such an embodiment. For example, the collection unit 218 may be configured to be disposed at a height facing the temperature sensor TC4. Here, "the collection unit 218 is disposed at a height facing the temperature sensor TC4" means, for example, that the temperature sensor TC4 is disposed between the uppermost and lowermost ends of the collection unit 218. This embodiment also provides the same effects as the above-described embodiment.

[0086] For example, in the above-described embodiment, examples have been given in which the surface (inclined surface) of the collection section 218 is configured as a single straight line in the longitudinal cross section of the storage tank 200 (see FIG. 4 ) and as a plurality of straight lines (see FIG. 10 ). However, the present disclosure is not limited to these embodiments. For example, in the longitudinal cross section of the storage tank 200, the surface of the collection section 218 may be configured as a combination of straight lines and curved lines, or may be configured as a curved line. This embodiment also provides the same effects as the above-described embodiment.

[0087] For example, in the above-described embodiment, four temperature sensors TC1 to TC4 are used as the plurality of temperature sensors. However, the present disclosure is not limited to this embodiment. For example, two temperature sensors, three temperature sensors, or five or more temperature sensors may be used as the plurality of temperature sensors. This embodiment also provides the same effects as the above-described embodiment.

[0088] For example, in the above-described embodiment, multiple temperature sensors are provided on the side wall 201 of the storage tank 200. However, the present disclosure is not limited to this embodiment. For example, although a new configuration for protecting the temperature sensor TC, such as a protective tube, must be added, at least one of the four temperature sensors TC1 to TC4 can be disposed in the storage chamber 210. Even in this case, the temperature sensor TC can be brought into contact with the liquid source 216, making it possible to estimate the remaining amount of the liquid source 216. This embodiment also provides the same effects as the above-described embodiment.

[0089] It is preferable that the recipes used for each process are individually prepared according to the process content and recorded and stored in the storage device 41c via an electric communication line or an external storage device 412. When starting each process, it is preferable that the CPU 41a appropriately selects an appropriate recipe according to the process content from among the multiple recipes recorded and stored in the storage device 41c. This makes it possible to reproducibly form films with various film types, composition ratios, film qualities, and film thicknesses using a single processing device. It also reduces the burden on the operator, avoids operational errors, and enables each process to be started quickly.

[0090] The above-mentioned recipes do not necessarily have to be newly created, but may be prepared by modifying an existing recipe already installed in the processing device. When modifying a recipe, the modified recipe may be installed in the processing device via an electric communication line or a recording medium on which the recipe is recorded. Furthermore, an existing recipe already installed in the processing device may be directly modified by operating the input / output device 122 provided in the existing processing device.

[0091] Although the present embodiment has been described with reference to a semiconductor manufacturing process, the present disclosure is not limited thereto and can also be applied to substrate processing such as a manufacturing process for liquid crystal devices, a manufacturing process for solar cells, a manufacturing process for light-emitting devices, a processing process for glass substrates, a processing process for ceramic substrates, and a processing process for conductive substrates.

[0092] In the above-described embodiment, an example of forming a film using a batch-type processing apparatus that processes multiple substrates at a time has been described. The present disclosure is not limited to the above-described embodiment and can be suitably applied, for example, to a case where a film is formed using a single-wafer processing apparatus that processes one or several substrates at a time. Furthermore, in the above-described embodiment, an example of forming a film using a processing apparatus having a hot-wall processing furnace has been described. The present disclosure is not limited to the above-described embodiment and can be suitably applied to a case where a film is formed using a processing apparatus having a cold-wall processing furnace.

[0093] When using these processing devices, each process can be performed using the same processing procedures and conditions as in the above-described embodiments and modifications, and the same effects as in the above-described embodiments and modifications can be obtained.

[0094] The above-described embodiments and modifications may be used in combination as appropriate. The processing procedures and processing conditions in such a case may be the same as those of the above-described embodiments and modifications, for example.

[0095] 221 Main body 201 Side wall TC1 to TC4 Temperature sensors 218 Collection unit

Claims

1. A vaporizer having: a body for storing a raw material that is liquid at room temperature; a plurality of temperature sensors provided on a side wall of the body; and a collection section formed to collect the raw material on the side wall on which the lowest of the plurality of temperature sensors is provided.

2. The vaporizer according to claim 1, further comprising a supply port for replenishing the raw material provided on a bottom wall of the main body, and the collection section having a structure that allows the raw material to flow toward the supply port.

3. The vaporizer according to claim 2, wherein the supply port is provided at a position close to a temperature sensor that is located at the bottom among the plurality of temperature sensors.

4. The vaporizer according to claim 1, wherein the uppermost end of the collecting section is configured to be lower than a temperature sensor arranged at a lower end among the plurality of temperature sensors.

5. The vaporizer of claim 1, wherein the uppermost end of the collection section is configured to be positioned higher than a temperature sensor positioned at the lower end.

6. The vaporizer according to claim 5, wherein the collecting section is configured to be disposed at a height opposite a temperature sensor that is disposed at a lower end of the plurality of temperature sensors.

7. The vaporizer according to claim 1, wherein the side wall of the main body is configured to have an uneven shape, and the plurality of temperature sensors are installed within the protrusions.

8. The vaporizer according to claim 1, wherein the plurality of temperature sensors are arranged so as to equally divide the side wall of the main body in a height direction in a vertical cross section.

9. The vaporizer of claim 1, wherein the surface of the collection portion is configured such that, in a longitudinal cross-sectional view, it is defined by at least one straight line.

10. The vaporizer according to claim 9, wherein the surface of the collecting portion is configured to be shown in a longitudinal cross section as a combination of a plurality of the straight lines or a combination of the straight lines and curved lines.

11. The vaporizer of claim 1, wherein the surface of the collection portion is configured to be curved in longitudinal cross section.

12. The vaporizer according to claim 2, further comprising a control unit configured to be able to determine the remaining amount of said raw material within said main body in response to changes in temperature measured by said plurality of temperature sensors.

13. The vaporizer described in claim 12, wherein the control unit is configured to determine that the remaining amount of the raw material is insufficient when the temperature of a temperature sensor located at the bottom end of the plurality of temperature sensors changes.

14. The vaporizer according to claim 12, further comprising a liquid supply unit, wherein the control unit is configured to cause the liquid supply unit to replenish the raw material through the supply port.

15. The vaporizer according to claim 14, wherein the control unit is configured to stop the supply of the raw material to the liquid supply unit when the temperature of the temperature sensor located at the upper end among the plurality of temperature sensors reaches a saturated state.

16. The vaporizer described in claim 12, wherein the control unit is provided near the supply port and configured to replenish the raw material from the supply port based on the temperature detected by a temperature sensor located at the lower end of the plurality of temperature sensors.

17. The vaporizer of claim 1, further comprising a display unit that displays on a screen the progress of temperatures measured by the plurality of temperature sensors, the display unit being configured to display the temperatures in different colors according to the positions of the temperature sensors.

18. The vaporizer of claim 1, wherein the body is configured to provide at least one rod-shaped heater within the collection section.

19. The vaporizer according to claim 2, further comprising a preheating section configured to heat the raw material introduced into the body through the supply port.

20. The vaporizer of claim 1, wherein the collection portion is configured in a polygonal shape in cross section.

21. The vaporizer according to claim 1, wherein the collecting section is formed in a mortar shape.

22. A processing device equipped with a vaporizer having: a main body for storing a liquid raw material at room temperature; a plurality of temperature sensors provided on a side wall of the main body; and a collection section formed to collect the raw material on the side wall on which the lowest temperature sensor of the plurality of temperature sensors is provided.

23. A processing method comprising the steps of: placing an object to be processed in a processing space; and introducing the raw material into the processing space through a vaporizer having a main body for storing a raw material that is liquid at room temperature, a plurality of temperature sensors provided on a side wall of the main body, and a collection section formed to collect the raw material on the side wall on which the lowest temperature sensor of the plurality of temperature sensors is provided.

24. A method for manufacturing a semiconductor device, comprising the step of supplying the raw material to a substrate containing a semiconductor and carrying out a predetermined process using the processing method according to claim 23.