Electronic control device and method for manufacturing electronic control device

Abstract

This electronic control device comprises: a circuit board on which an electronic component is mounted and on which a ground pattern is formed; an electroconductive housing that accommodates the circuit board; and an electromagnetic wave shield member that is disposed between the ground pattern of the circuit board and the housing, the electromagnetic wave shield member electrically connecting the ground pattern and the housing. The circuit board or the housing has a conductor base surface against which the electromagnetic wave shield member is pressed, and conductor protrusions that protrude further toward the electromagnetic-wave-shield-member side than the conductor base surface. The electromagnetic wave shield member is disposed in contact with the conductor base surface and the conductor protrusions.

Description

Electronic control device and manufacturing method of electronic control device

[0001] The present invention relates to an electronic control device and a method for manufacturing the electronic control device.

[0002] In recent years, there has been an increasing demand for advanced driver assistance systems (hereinafter referred to as "ADAS") and autonomous driving (hereinafter referred to as "AD") systems. Semiconductor components such as central processing units (CPUs) mounted in electronic control devices for ADAS or AD have high operating frequencies, posing a problem of electromagnetic noise generation. Patent Document 1, for example, discloses an example of a shielding structure for reducing electromagnetic noise emitted into the external environment, in which a dielectric is inserted between a circuit board on which electronic components are mounted and a metal housing that protects the circuit board.

[0003] Japanese Patent Application Laid-Open No. 2022-173233

[0004] As a shielding structure for reducing electromagnetic noise radiated to the external environment, a structure has been considered in which a ground pattern of a circuit board on which electronic components are mounted is electrically connected to a metal housing that houses the circuit board using an electromagnetic shielding material. When the circuit board is assembled to the housing, the electromagnetic shielding material is sandwiched between the ground pattern of the circuit board and the housing. In this case, for example, even if the electromagnetic shielding material is formed on a predetermined surface of the housing and the electromagnetic shielding material is brought into contact with the ground pattern of the circuit board by the pressing force during assembly, there is a risk that the contact area of ​​the electromagnetic shielding material with the ground pattern may not be sufficient. Therefore, for example, when the intensity of electromagnetic noise increases with an increase in the processing speed of a CPU, the electromagnetic noise shielding performance of the electromagnetic shielding material may be insufficient.

[0005] The object of the present invention is to provide an electronic control device that can improve the electromagnetic noise shielding performance of an electromagnetic wave shielding material when the ground pattern of a circuit board and a conductive housing are electrically connected by an electromagnetic wave shielding material to shield electromagnetic noise.

[0006] To solve the above problems, for example, the configurations described in the claims are adopted. The present application includes multiple means for solving the above problems, one of which is an electronic control device including a circuit board on which electronic components are mounted and on which a ground pattern is formed, a conductive housing that houses the circuit board, and an electromagnetic wave shielding material that is disposed between the ground pattern of the circuit board and the housing and electrically connects the ground pattern to the housing. The circuit board or the housing has a conductor reference surface against which the electromagnetic wave shielding material is pressed, and a conductor protrusion that protrudes toward the electromagnetic wave shielding material beyond the conductor reference surface. The electromagnetic wave shielding material is disposed in contact with the conductor reference surface and the conductor protrusion.

[0007] According to the present invention, when a ground pattern of a circuit board and a conductive housing are electrically connected by an electromagnetic shielding material to shield against electromagnetic noise, the electromagnetic noise shielding performance of the electromagnetic shielding material can be improved. Problems, configurations, and effects other than those described above will become clear from the description of the following embodiments.

[0008] 1 is a perspective view of an electronic control device according to a first embodiment; a plan view of the electronic control device according to the first embodiment; an exploded perspective view of the electronic control device according to the first embodiment; a schematic plan view of a circuit board in the first embodiment; a VV cross-sectional view of the electronic control device shown in FIG. 2; an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material included in the electronic control device according to the first embodiment; a diagram for explaining a manufacturing method of the electronic control device according to the first embodiment; a perspective view showing the arrangement of an electromagnetic wave shielding material and a ground pattern in the electronic control device according to the first embodiment; an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material included in an electronic control device according to a comparative embodiment; a perspective view showing a part of a circuit board included in an electronic control device according to a second embodiment; a front view showing a part of a circuit board included in an electronic control device according to the second embodiment; a perspective view showing a part of a circuit board included in an electronic control device according to a third embodiment; a front view showing a part of a circuit board included in an electronic control device according to the third embodiment; an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material included in an electronic control device according to a fourth embodiment; an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material included in an electronic control device according to a fifth embodiment. FIG. 10 is an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material provided in an electronic control device according to a sixth embodiment. FIG. 11 is an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material provided in an electronic control device according to a seventh embodiment. FIG. 12 is an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material provided in an electronic control device according to an eighth embodiment. FIG. 13 is an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material provided in an electronic control device according to a ninth embodiment. FIG. 14 is an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material provided in an electronic control device according to a tenth embodiment. FIG. 15 is an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material provided in an electronic control device according to an eleventh embodiment. FIG. 16 is an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material provided in an electronic control device according to a twelfth embodiment.Fig. 13 is an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material provided in an electronic control device according to a 13th embodiment; Fig. 14 is an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material provided in an electronic control device according to a 14th embodiment; Fig. 15 is an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material provided in an electronic control device according to a 15th embodiment; Fig. 16 is an enlarged cross-sectional view showing the arrangement of a circuit board, a housing base, and an electromagnetic wave shielding material provided in an electronic control device according to a 16th embodiment.

[0009] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In this specification and the drawings, elements having substantially the same function or configuration are designated by the same reference numerals, and redundant description will be omitted. Furthermore, the following description and drawings are examples for explaining the present invention, and may be omitted or simplified for the sake of convenience. Furthermore, the position, size, shape, range, etc. of each component shown in the drawings may not accurately represent the actual position, size, shape, range, etc., in order to facilitate understanding of the invention.

[0010] <First embodiment> Fig. 1 is a perspective view of an electronic control device according to a first embodiment. Fig. 2 is a plan view of the electronic control device according to the first embodiment. Fig. 3 is an exploded perspective view of the electronic control device according to the first embodiment. A connector, which will be described later, is omitted from Figs. 1 and 3 .

[0011] 1 to 3, the electronic control device 10 includes a circuit board 11 (FIG. 3) on which electronic components described below are mounted, and a conductive housing 12 that houses the circuit board 11. The electronic control device 10 is a so-called in-vehicle electronic control device that is mounted in a vehicle such as an automobile for, for example, ADAS or AD use.

[0012] The housing 12 has a small height (thickness) and is formed in a flat, generally rectangular parallelepiped shape. The housing 12 has an opening 13 for connecting a connector. The housing 12 is composed of a metal housing base 15 and a metal housing cover 16. The housing base 15 and the housing cover 16 are fixed to each other with a plurality of screws 31.

[0013] More specifically, as shown in FIG. 3 , a plurality of cover pedestals 30 are formed on the housing base 15. The cover pedestals 30 are formed integrally with the housing base 15. Each cover pedestal 30 has a screw hole 34 formed therein. Meanwhile, a plurality of cover fixing holes 35 are formed in the housing cover 16. Each cover fixing hole 35 is a through-hole for fixing the housing cover 16 to the housing base 15. A plurality of screws 31 are inserted through the corresponding cover fixing holes 35 and engage with the screw holes 34 of the cover pedestal 30. The housing cover 16 is fixed to the housing base 15 by fastening the screws 31. By fixing the housing cover 16 to the housing base 15 in this manner with the screws 31, the housing base 15 and the housing cover 16 are electrically and mechanically connected to each other.

[0014] The housing base 15 and the housing cover 16 may be made of the same metal material or different metal materials. When the housing base 15 and the housing cover 16 are made of different metal materials, the housing base 15 is made of, for example, aluminum, and the housing cover 16 is made of, for example, iron that has been subjected to a rust prevention treatment.

[0015] In this specification, for convenience of explanation, the side on which the housing base 15 is arranged may be referred to as the lower side, and the side on which the housing cover 16 is arranged may be referred to as the upper side. When the electronic control unit 10 is mounted in a vehicle, the orientation of the electronic control unit 10 does not matter. In general, it is preferable to mount the electronic control unit 10 in a vehicle so that the housing base 15 faces upward and the housing cover 16 faces downward.

[0016] The circuit board 11 is surrounded from above and below by a housing base 15 and a housing cover 16. The circuit board 11 is formed of a printed wiring board whose base material is, for example, glass epoxy. The circuit board 11 is formed in a substantially rectangular shape.

[0017] Fig. 4 is a schematic plan view of the circuit board in the first embodiment. As shown in Fig. 4, three electronic components 17, 18, and 19 and two connectors 21 and 22 are mounted on the circuit board 11. The circuit board 11 has a circuit area 25 and a ground pattern 26. Each of the electronic components 17, 18, and 19 is mounted on the circuit area 25 of the circuit board 11. Each of the connectors 21 and 22 is mounted on an end of the circuit board 11.

[0018] Each of the electronic components 17, 18, and 19 is an LSI element that functions as, for example, a CPU. LSI is an abbreviation for Large Scale Integration. Each of the electronic components 17, 18, and 19 is a heat source and a noise source. The circuit area 25 of the circuit board 11 is an area where electronic components other than the LSI elements are also mounted. That is, the circuit area 25 is a component mounting area where various electronic components are mounted. In FIG. 4, electronic components other than the LSI elements and wiring patterns of circuit wiring for signal transmission, power supply, etc. are omitted. Each of the connectors 21 and 22 can be connected to a cable-side connector (not shown) through the opening 13 ( FIG. 1 ) of the housing 12.

[0019] The ground pattern 26 is formed around the circuit area 25 so as to surround the circuit area 25. The ground pattern 26 is preferably a pattern made of copper. The ground pattern 26 is formed in a ring shape so as to surround the circuit area 25 on all four sides.

[0020] 3, the circuit board 11 is fixed to the housing base 15 by a plurality of screws 32. The screws 32 are provided as an example of a fastener. The mounting structure of the circuit board 11 using the screws 32 will be described in detail below.

[0021] A plurality of board pedestals 36 are formed on the housing base 15. The board pedestals 36 are formed integrally with the housing base 15. A screw hole 37 is provided on the upper surface of each board pedestal 36. Meanwhile, a plurality of board fixing holes 33 are provided on the circuit board 11. Each of the board fixing holes 33 is a through-hole for fixing the circuit board 11 to the housing base 15. Each of the board fixing holes 33 is formed on the ground pattern 26. In the portion where the board fixing hole 33 is formed, a part of the ground pattern 26 is formed in a circle that is slightly larger than the inner diameter of the board fixing hole 33, and the board fixing hole 33 is formed within this circular area.

[0022] The above-mentioned plurality of screws 32 are engaged with screw holes 37 of the board base 36 through corresponding board fixing holes 33. The circuit board 11 is fixed to the housing base 15 by fastening each screw 32. In addition, the housing base 15 is formed with protrusions 38 for board positioning. A plurality of protrusions 38 are formed at appropriate positions on the housing base 15. The circuit board 11 is positioned by the plurality of protrusions 38 and then screwed to the housing base 15.

[0023] Boss portions 27, 28, and 29 for heat dissipation are integrally formed on the housing base 15. The boss portion 27 is connected to the electronic component 17 via thermal grease (not shown). The boss portion 28 is connected to the electronic component 18 via thermal grease (not shown), and the boss portion 29 is connected to the electronic component 19 via thermal grease (not shown). As a result, the heat generated by each of the electronic components 17, 18, and 19 is conducted to the housing base 15 via the thermal grease and dissipated from the outer surface of the housing base 15.

[0024] In addition, a shield pedestal 39 is formed on the housing base 15. The shield pedestal 39 is located one step lower than the board pedestal 36. The shield pedestal 39 is a pedestal for interposing an electromagnetic wave shielding material 40 between the ground pattern 26 of the circuit board 11 and the housing base 15. The electromagnetic wave shielding material 40 is located between the ground pattern 26 of the circuit board 11 (see FIG. 4 ) and the housing base 15, and electrically connects the ground pattern 26 and the housing base 15. In addition, the electromagnetic wave shielding material 40 is located in a compressed and deformed state between the ground pattern 26 of the circuit board 11 and the shield pedestal 39 of the housing base 15.

[0025] The electromagnetic wave shielding material 40 is composed of a resin containing a large amount of conductive filler, i.e., a conductive adhesive. The conductive filler is, for example, a metal filler, more preferably a metal filler that has been plated. The base material of the electromagnetic wave shielding material 40 is an elastic adhesive that has the property of becoming a rubber-like elastic body after curing. The elastic adhesive is, for example, silicone, urethane, or the like. Specifically, the electromagnetic wave shielding material 40 is, for example, a liquid or paste-like adhesive that hardens as a cured in-place gasket (CIPG). The electromagnetic wave shielding material 40 that hardens as a CIPG retains appropriate rubber-like elasticity (resilience) even after hardening. Therefore, the electromagnetic wave shielding material 40 has the property of compressing and deforming (elastically deforming) when subjected to an external force, thereby reducing the distance between the conductive fillers and reducing impedance.

[0026] The shielding base 39 is formed to follow the shape of the ground pattern 26 (see FIG. 4 ) of the circuit board 11. Therefore, by disposing the electromagnetic wave shielding material 40 between the ground pattern 26 of the circuit board 11 and the shielding base 39 of the housing base 15, the ground pattern 26 of the circuit board 11 and the housing base 15 can be electrically connected via the electromagnetic wave shielding material 40.

[0027] Fig. 5 is a VV cross-sectional view of the electronic control device shown in Fig. 2. Fig. 6 is an enlarged cross-sectional view showing the arrangement of the circuit board 11, the housing base 15, and the electromagnetic wave shielding material 40 provided in the electronic control device according to the first embodiment. In Fig. 6, the VI section of the electronic control device shown in Fig. 5 is shown with the vertical positional relationship inverted. Therefore, in the following description, the side on which the circuit board 11 is arranged will be referred to as the lower side (downward direction) and the side on which the housing base 15 is arranged will be referred to as the upper side (upward direction), as shown in Fig. 6. This also applies to the second and subsequent embodiments described below.

[0028] As shown in Figures 5 and 6, the electromagnetic wave shielding material 40 is disposed between the ground pattern 26 of the circuit board 11 and the shielding pedestal 39 of the housing base 15 as described above. As shown in Figure 6, the electromagnetic wave shielding material 40 is formed so as to protrude in a semicircular shape when viewed in the longitudinal direction of the ground pattern 26 (the Y direction in Figure 8). The shape of the electromagnetic wave shielding material 40 in Figure 6 shows the cross-sectional shape of the electromagnetic wave shielding material 40. Furthermore, the shape of the electromagnetic wave shielding material 40 in Figure 6 shows the shape of the electromagnetic wave shielding material 40 before it is compressively deformed.

[0029] The length direction Y of the ground pattern 26 (see FIG. 8 ) is a direction perpendicular to the width direction X of the ground pattern 26 (see FIG. 6 ). The length direction of the ground pattern 26 applies to both the state of the circuit board 11 alone and the state of the circuit board 11 attached to the housing 12. The shielding pedestal 39 of the housing base 15 of the housing 12 is formed along the ground pattern 26 of the circuit board 11. Therefore, the length direction of the ground pattern 26 can be rephrased as the length direction of the shielding pedestal 39 of the housing base 15. Similarly, the width direction of the ground pattern 26 can be rephrased as the width direction of the shielding pedestal 39 of the housing base 15.

[0030] The length direction Y of the ground pattern 26 and the width direction X of the ground pattern 26 are directions defined by an imaginary plane perpendicular to the thickness direction (height direction) of the circuit board 11. In Fig. 6, the length direction of the ground pattern 26 is parallel to the depth direction of Fig. 6, and the width direction X of the ground pattern 26 is parallel to the left-right direction of Fig. 6. Furthermore, when the circuit board 11 is viewed from the front as shown in Fig. 4 above, the length direction of the ground pattern 26 formed parallel to the longitudinal direction of the circuit board 11 is parallel to the longitudinal direction of the circuit board 11. Furthermore, the length direction of the ground pattern 26 formed parallel to the short-side direction of the circuit board 11 is parallel to the short-side direction of the circuit board 11.

[0031] Here, a method for manufacturing an electronic control device according to the first embodiment will be described with reference to Fig. 7. As shown in Fig. 7, the method for manufacturing an electronic control device includes a housing fabrication process S1, a circuit board fabrication process S2, a circuit board attachment process S3, and a housing cover attachment process S4.

[0032] The housing manufacturing process S1 is a process for manufacturing the housing 12. Although not shown, the housing manufacturing process S1 includes at least a housing base manufacturing process and a housing cover manufacturing process. The housing base manufacturing process is a process for manufacturing the housing base 15. In the housing base manufacturing process, the housing base 15 is manufactured by, for example, aluminum die casting. The housing cover manufacturing process is a process for manufacturing the housing cover 16. In the housing cover manufacturing process, the housing cover 16 is manufactured by, for example, sheet metal processing.

[0033] The circuit board fabrication process S2 is a process for fabricating the circuit board 11. Although not shown, the circuit board fabrication process S2 includes at least a pattern formation process and a component mounting process. The pattern formation process is a process for forming various patterns, including a signal pattern, a power supply pattern, and a ground pattern 26, on the circuit board 11. The component mounting process is a process for mounting various electronic components, including electronic components 17, 18, and 19 and connectors 21 and 22, on the circuit board 11.

[0034] The circuit board mounting process S3 is a process of mounting the circuit board 11 to the housing base 15. In the circuit board mounting process S3, the circuit board 11 is mounted to the board seat 36 of the housing base 15 using a plurality of screws 32. In this way, the circuit board 11 is assembled to the housing base 15.

[0035] The housing cover attaching step S4 is a step of attaching the housing cover 16 to the housing base 15. In the housing cover attaching step S4, the housing cover 16 is attached to the cover seat 30 of the housing base 15 using a plurality of screws 31. In this way, the housing cover 16 is assembled to the housing base 15. The circuit board 11 is housed inside the housing 12.

[0036] The electromagnetic wave shielding material 40 is formed on the housing base 15 in the housing fabrication process S1 described above. In this case, the housing fabrication process S1 corresponds to a process of forming the electromagnetic wave shielding material 40 on the housing (the housing base 15 in this embodiment). The electromagnetic wave shielding material 40 is provided in a state of being adhered to the surface of the shielding pedestal 39 of the housing base 15. The electromagnetic wave shielding material 40 is formed in a state of protruding toward the circuit board 11. Such an electromagnetic wave shielding material 40 is formed in the housing fabrication process S1 described above, for example, by the following method. First, the housing base 15 is fabricated in the housing base fabrication process. Next, a liquid or paste-like material (conductive adhesive) containing a conductive filler, which is the raw material for the electromagnetic wave shielding material 40, is applied to the surface of the shielding pedestal 39 of the housing base 15 using an application nozzle (not shown). Next, the material on the shielding pedestal 39 is hardened, for example, by moisture, heat, or ultraviolet light. The method for curing the material applied to the shielding pedestal 39 of the housing base 15 is determined by the properties (moisture curing, thermosetting, ultraviolet curing, etc.) of the material used as the raw material of the electromagnetic wave shielding material 40. As a result, the electromagnetic wave shielding material 40 is formed in a semicircular protruding state. As described above, the electromagnetic wave shielding material 40 has rubber-like elasticity.

[0037] The ground pattern 26 has a first ground pattern portion 26a, a second ground pattern portion 26b, and a third ground pattern portion 26c. The first ground pattern portion 26a, the second ground pattern portion 26b, and the third ground pattern portion 26c are arranged in positions facing the shielding pedestal 39 of the housing base 15. The second ground pattern portion 26b and the third ground pattern portion 26c are arranged in positions adjacent to the first ground pattern portion 26a, with the first ground pattern portion 26a sandwiched therebetween. In addition, in the width direction X of the ground pattern 26, a predetermined distance is provided between the first ground pattern portion 26a and the second ground pattern portion 26b, and a predetermined distance is also provided between the first ground pattern portion 26a and the third ground pattern portion 26c. In other words, the first ground pattern portion 26a, the second ground pattern portion 26b, and the third ground pattern portion 26c are each formed on the circuit board 11 as independent pattern portions.

[0038] The pattern surface 41 of the first ground pattern portion 26a is disposed in a state where it is exposed to the outside. The pattern surface 41 of the first ground pattern portion 26a is disposed so as to form substantially the same plane as the main surface 11a of the circuit board 11. The pattern surface 41 of the first ground pattern portion 26a corresponds to a conductor reference plane against which the electromagnetic wave shielding material 40 is pressed. The pressing force of the electromagnetic wave shielding material 40 against the pattern surface 41 is obtained when the circuit board 11 is attached to the housing base 15. Specifically, in the circuit board attachment step S3 described above, when the circuit board 11 is attached to the board seat 36 of the housing base 15 using a plurality of screws 32, the electromagnetic wave shielding material 40 is pressed against the pattern surface 41 by fastening the plurality of screws 32. In this case, the electromagnetic wave shielding material 40 is in a state where the vicinity of the top portion 40a of the electromagnetic wave shielding material 40 is pressed against the pattern surface 41 of the first ground pattern portion 26a. Furthermore, the electromagnetic wave shielding material 40 is compressed and deformed by the pressing force applied when the circuit board 11 is attached to the housing base 15 in the circuit board attachment step S3 described above. Fig. 6 shows the state of the electromagnetic wave shielding material 40 before it is compressed and deformed.

[0039] Meanwhile, a conductor protrusion 45 is formed on the second ground pattern portion 26b, and a conductor protrusion 46 is formed on the third ground pattern portion 26c. The conductor protrusion 45 is formed to protrude from the pattern surface of the second ground pattern portion 26b. The conductor protrusion 46 is formed to protrude from the pattern surface of the third ground pattern portion 26c. Each of the conductor protrusions 45, 46 is formed on the circuit board 11 in the circuit board fabrication process S2 (see FIG. 7 ) described above. Specifically, a mask (not shown) is set on the circuit board 11 after the pattern formation process. The mask has openings at positions where solder paste will be applied. When the mask is set on the circuit board 11, the first ground pattern portion 26a is covered by the mask, and the second ground pattern portion 26b and the third ground pattern portion 26c are exposed to the outside through the openings in the mask. A predetermined amount of solder paste is applied to the mask in this state, and the solder paste is then poured into the openings in the mask using a squeegee (not shown). At this time, solder is supplied (applied) to the second ground pattern portion 26b and the third ground pattern portion 26c, but no solder is supplied to the first ground pattern portion 26a. After that, the mask is removed from the circuit board 11, and various electronic components including electronic components 17, 18, and 19 are placed in predetermined positions on the circuit board 11 in a component mounting step of the circuit board fabrication step S2. Next, the circuit board 11 is placed in a reflow furnace. As a result, the various electronic components are mounted on the circuit board 11 by solder reflow. Furthermore, a conductor protrusion 45 is formed on the second ground pattern portion 26b by solder deposition, and a conductor protrusion 46 is also formed on the third ground pattern portion 26c by solder deposition. In this case, the circuit board fabrication step S2 corresponds to a step of forming a conductor reference plane and a conductor protrusion on the circuit board 11.

[0040] By forming each of the conductor projections 45, 46 by soldering in this manner, the solder projections can be formed simultaneously in the process of mounting various electronic components on the circuit board 11 by solder reflow. This eliminates the need for an additional process for forming the conductor projections 45, 46. This allows the circuit board 11 with the conductor projections 45, 46 formed thereon to be manufactured inexpensively.

[0041] Each of the conductor protrusions 45, 46 is formed to protrude in a semicircular shape when viewed in the longitudinal direction of the ground pattern 26. The shapes of the conductor protrusions 45, 46 in FIG. 6 represent the cross-sectional shapes of the conductor protrusions 45, 46. Each of the conductor protrusions 45, 46 is made of a material having a higher conductivity than the electromagnetic wave shielding material 40. Therefore, the conductivity of each of the conductor protrusions 45, 46 is higher than the conductivity of the electromagnetic wave shielding material 40. This reduces the impedance of the electromagnetic wave shielding portion when the ground pattern 26 and the housing base 15 are electrically connected via the electromagnetic wave shielding material 40. This strengthens the electrical connection between the ground pattern 26 and the housing base 15 and improves the electromagnetic wave shielding performance of the electromagnetic wave shielding material 40. Note that the conductivity of the conductor protrusions is higher than that of the electromagnetic wave shielding material even when the conductor protrusions are made of a material other than solder, specifically, a metal such as copper or aluminum.

[0042] FIG. 8 is a perspective view showing the arrangement of the electromagnetic wave shielding material and the ground pattern in the electronic control device according to the first embodiment. As shown in FIG. 8 , the conductor protrusion 46 is formed along the ground pattern 26. Similarly, the conductor protrusion 45 is formed along the ground pattern 26. Therefore, the length direction of each of the conductor protrusions 45, 46 is the same as the length direction Y of the ground pattern 26. Furthermore, the width direction of each of the conductor protrusions 45, 46 is the same as the width direction X of the ground pattern 26. The conductor protrusion 45 is disposed on one side of the ground pattern 26 in the width direction X, and the conductor protrusion 46 is disposed on the other side of the ground pattern 26 in the width direction X. In other words, the conductor protrusions 45 and 46 are disposed in pairs on both sides of the ground pattern 26 in the width direction X. Furthermore, each of the conductor protrusions 45, 46 is formed linearly and continuously with a length equivalent to that of the ground pattern 26. Similarly, the electromagnetic wave shielding material 40 is formed linearly and continuously with a length equivalent to that of the ground pattern 26.

[0043] Also, as shown in Figure 6, each conductor protrusion 45, 46 is formed in a state where it protrudes toward the electromagnetic wave shielding material 40 side (the housing base 15 side) more than the pattern surface 41 of the first ground pattern portion 26a in the thickness direction of the circuit board 11.

[0044] On the other hand, the electromagnetic wave shielding material 40 is arranged in contact with the pattern surface 41 of the ground pattern 26 and the conductor protrusions 45, 46. The conductor protrusion 45 is in contact with the side surface 40b of the electromagnetic wave shielding material 40, which is offset to one side (the left side in FIG. 6 ) from the top of the electromagnetic wave shielding material 40. The conductor protrusion 46 is in contact with the side surface 40c of the electromagnetic wave shielding material 40, which is offset to the other side (the right side in FIG. 6 ) from the top surface 40a of the electromagnetic wave shielding material 40.

[0045] As a result, the following effects can be obtained compared to a configuration in which the electromagnetic wave shielding material 40 formed on the housing base 15 is pressed against the ground pattern 26 of the circuit board 11 to electrically connect the ground pattern 26 and the housing base 15, as in the comparative example shown in Figure 9.

[0046] 9 , only the top portion 40a of the electromagnetic shielding material 40 comes into contact with the ground pattern 26. Furthermore, even if the electromagnetic shielding material 40 is compressed and deformed by the pressing force F that is generated when the circuit board 11 is attached to the housing base 15 in the circuit board attachment step S3 described above, only the vicinity of the top portion 40a of the electromagnetic shielding material 40 comes into contact with the ground pattern 26. For this reason, there is a risk that a sufficient contact area of ​​the electromagnetic shielding material 40 with the ground pattern 26 cannot be ensured.

[0047] In contrast to this, in the first embodiment, as shown in Fig. 6 , in addition to the top portion 40a of the electromagnetic wave shielding material 40 contacting the first ground pattern portion 26a, the side portion 40b of the electromagnetic wave shielding material 40 contacts the conductor protrusion 45, and the side portion 40c of the electromagnetic wave shielding material 40 contacts the conductor protrusion 46. Furthermore, in the circuit board attachment step S3 described above, the electromagnetic wave shielding material 40 is compressively deformed from the state shown in Fig. 6 by the pressing force F that is generated when the circuit board 11 is attached to the housing base 15. In this case, the circuit board attachment step S3 corresponds to a step of compressively deforming the electromagnetic wave shielding material 40 by the pressing force F, thereby bringing the electromagnetic wave shielding material 40 into contact with the conductor reference plane and the conductor protrusions 45, 46.

[0048] When the electromagnetic shielding material 40 undergoes compressive deformation as described above, the contact area of ​​the electromagnetic shielding material 40 with the first ground pattern portion 26 a increases. Furthermore, when the electromagnetic shielding material 40 undergoes compressive deformation, the contact area of ​​the electromagnetic shielding material 40 with the conductor protrusion 45 on the second ground pattern portion 26 b and the contact area of ​​the electromagnetic shielding material 40 with the conductor protrusion 46 on the third ground pattern portion 26 c both increase. As a result, when the conductor protrusion 45 is considered to be part of the second ground pattern portion 26 b and the conductor protrusion 46 is considered to be part of the third ground pattern portion 26 c, the contact area of ​​the electromagnetic shielding material 40 with the ground patterns 26 (26 a, 26 b, 26 c) can be substantially increased. Furthermore, the electromagnetic shielding material 40 is electrically connected to the first ground pattern portion 26 a, as well as to the second ground pattern portion 26 b via the conductor protrusion 45 and to the third ground pattern portion 26 c via the conductor protrusion 46. This strengthens the electrical connection between the housing base 15 and the ground pattern 26. As a result, the ground is strengthened around the circuit area 25 on the circuit board 11, and the electromagnetic noise shielding performance of the electromagnetic shielding material 40 can be improved.

[0049] 6 and 8 , in the first embodiment, the pair of conductor protrusions 45, 46 contact the electromagnetic wave shielding material 40 from both sides in the width direction X of the ground pattern 26. This makes it possible to suppress misalignment of the electromagnetic wave shielding material 40 in the width direction X of the ground pattern 26.

[0050] Second Embodiment An electronic control device according to a second embodiment differs from the first embodiment in the configuration of the circuit board 11. Fig. 10 is a perspective view showing a portion of the circuit board 11 provided in the electronic control device according to the second embodiment. Fig. 11 is a front view showing a portion of the circuit board 11 provided in the electronic control device according to the second embodiment. Both Fig. 10 and Fig. 11 show the structure of the portion of the circuit board 11 against which the electromagnetic wave shielding material 40 is pressed.

[0051] As shown in Figures 10 and 11 , the ground pattern 26 of the circuit board 11 has a first ground pattern portion 26a, a second ground pattern portion 26b, and a third ground pattern portion 26c. This is similar to the first embodiment described above. However, in the first embodiment described above, as shown in Figure 8 , each of the conductor protrusions 45, 46 is formed linearly and continuously with the same length as the ground pattern 26. In contrast, in the second embodiment, each of the conductor protrusions 45, 46 is formed in plurality at predetermined intervals in the longitudinal direction Y of the ground pattern 26. In other words, each of the conductor protrusions 45, 46 is formed by dividing it into multiple portions in the longitudinal direction Y of the ground pattern 26. Such a circuit board 11 can be obtained by changing the position, size, and number of openings in a mask used to apply solder paste to the second ground pattern portion 26b and the third ground pattern portion 26c in the circuit board manufacturing process S2 described above.

[0052] The plurality of conductor protrusions 45 are arranged on one side in the width direction X of the ground pattern 26 (upper side in FIG. 11 ). The plurality of conductor protrusions 46 are arranged on the other side in the width direction X of the ground pattern 26 (lower side in FIG. 11 ). The plurality of conductor protrusions 45 and the plurality of conductor protrusions 46 are arranged at the same positions as each other in the length direction Y of the ground pattern 26. Therefore, when viewed from the width direction X of the ground pattern 26, the plurality of conductor protrusions 45 and the plurality of conductor protrusions 46 are arranged to overlap each other.

[0053] By forming the conductor projections 45, 46 at predetermined intervals in the longitudinal direction Y of the ground pattern 26 in this manner, it is possible to reduce the amount of material used to form the conductor projections 45, 46 compared to the first embodiment described above, thereby ensuring high shielding performance at low cost.

[0054] Third Embodiment An electronic control device according to a third embodiment differs from the second embodiment in the arrangement of conductor protrusions 45, 46 on a circuit board 11. Fig. 12 is a perspective view showing a portion of the circuit board 11 provided in the electronic control device according to the third embodiment. Fig. 13 is a front view showing a portion of the circuit board 11 provided in the electronic control device according to the third embodiment. Both Fig. 12 and Fig. 13 show the structure of the portion of the circuit board 11 against which the electromagnetic wave shielding material 40 is pressed.

[0055] 12 and 13 , the conductor protrusions 45, 46 are formed in plurality at predetermined intervals in the longitudinal direction Y of the ground pattern 26. This is the same as in the second embodiment described above. However, in the third embodiment, the plurality of conductor protrusions 45 and the plurality of conductor protrusions 46 are arranged at different positions in the longitudinal direction Y of the ground pattern 26. Therefore, when viewed from the width direction X of the ground pattern 26, the plurality of conductor protrusions 45 and the plurality of conductor protrusions 46 are arranged so as not to overlap each other.

[0056] Even when a plurality of conductor projections 45 and a plurality of conductor projections 46 are arranged in this manner, the same effects as those of the second embodiment described above can be obtained.

[0057] Fourth Embodiment An electronic control device according to a fourth embodiment differs from the first, second, and third embodiments in the structure of a first ground pattern portion 26a in a ground pattern 26. Fig. 14 is an enlarged cross-sectional view showing the arrangement of a circuit board 11, a housing base 15, and an electromagnetic wave shielding material 40 provided in an electronic control device according to the fourth embodiment. Note that, like Fig. 6 above, the enlarged cross-sectional view of Fig. 14 shows section VI of the electronic control device shown in Fig. 5 in an enlarged state with the vertical positional relationship reversed. This also applies to Fig. 15 and subsequent drawings described later.

[0058] As shown in FIG. 14 , the first ground pattern portion 26 a of the ground pattern 26 has a recess 47. The recess 47 is recessed relative to the pattern surface 41 of the first ground pattern portion 26 a. The shape of the recess 47 in FIG. 14 shows the cross-sectional shape of the recess 47. The surface of the recess 47 corresponds to the conductor reference plane. The recess 47 is formed by machining a portion of the first ground pattern portion 26 a after the pattern formation step in the circuit board fabrication step S2 (see FIG. 7 ). The recess 47 is formed at a location where the electromagnetic wave shielding material 40 comes into contact. Specifically, the recess 47 is formed at a location where the top of the electromagnetic wave shielding material 40, which protrudes in a semicircular shape, comes into contact. The recess 47 is formed continuously along the longitudinal direction Y of the ground pattern 26 (see FIG. 8 ). However, the recess 47 may be formed intermittently (discontinuously) at predetermined intervals in the longitudinal direction Y of the ground pattern 26.

[0059] When the recess 47 is formed in the first ground pattern portion 26a in this manner, the pressing force F generated when the circuit board 11 is attached to the housing base 15 presses the top of the electromagnetic shielding material 40 into the recess 47. As a result, the top of the electromagnetic shielding material 40 deforms to fit the shape of the recess 47 due to compressive deformation of the electromagnetic shielding material 40. This increases the contact area of ​​the electromagnetic shielding material 40 with the first ground pattern portion 26a. This ensures higher shielding performance.

[0060] Fifth Embodiment An electronic control device according to a fifth embodiment differs from the above-described fourth embodiment in the structure of a first ground pattern portion 26a in the ground pattern 26. Fig. 15 is an enlarged cross-sectional view showing the arrangement of a circuit board 11, a housing base 15, and an electromagnetic wave shielding material 40 provided in an electronic control device according to the fifth embodiment.

[0061] As shown in Fig. 15 , the first ground pattern portion 26a of the ground pattern 26 has a recess 47. The shape of the first ground pattern portion 26a in Fig. 15 shows the cross-sectional shape of the first ground pattern portion 26a. The method of forming the recess 47 is basically the same as that of the fourth embodiment described above. When viewed from the longitudinal direction Y of the ground pattern 26 (see Fig. 8 ), the side surface 47a of the recess 47 is formed in a tapered inclined state. Therefore, the dimension of the recess 47 in the width direction X of the ground pattern 26 gradually increases from the bottom surface of the recess 47 toward the opening of the recess 47.

[0062] When the side surface 47a of the recess 47 is formed in a tapered shape in this way, the top of the electromagnetic shielding material 40 easily conforms to the shape of the recess 47 when the top of the electromagnetic shielding material 40 is pressed into the recess 47 by the above-mentioned pressing force F. This increases the contact area of ​​the electromagnetic shielding material 40 with the first ground pattern portion 26a, ensuring higher shielding performance.

[0063] Sixth Embodiment An electronic control device according to a sixth embodiment differs from the fourth and fifth embodiments in the structure of a first ground pattern portion 26a in a ground pattern 26. Fig. 16 is an enlarged cross-sectional view showing the arrangement of a circuit board 11, a housing base 15, and an electromagnetic wave shielding material 40 provided in an electronic control device according to the sixth embodiment.

[0064] As shown in Fig. 16 , the first ground pattern portion 26a of the ground pattern 26 has a recess 47. The shape of the first ground pattern portion 26a in Fig. 16 indicates the cross-sectional shape of the first ground pattern portion 26a. The method of forming the recess 47 is basically the same as that of the fourth embodiment described above. The recess 47 is formed in a semicircular recessed state when viewed from the longitudinal direction Y of the ground pattern 26 (see Fig. 8 ). In other words, the recess 47 is formed in a concave shape when viewed from the longitudinal direction Y of the ground pattern 26. In this case, the concave surface formed by the recess 47 corresponds to the conductor reference plane.

[0065] When the recess 47 is formed in a semicircular recessed state in this manner, the top of the electromagnetic wave shielding material 40 easily conforms to the shape of the recess 47 when the top of the electromagnetic wave shielding material 40 is pressed into the recess 47 by the above-mentioned pressing force F. This increases the contact area of ​​the electromagnetic wave shielding material 40 with the first ground pattern portion 26a, ensuring higher shielding performance.

[0066] Seventh Embodiment An electronic control device according to a seventh embodiment differs from the first, second, and third embodiments in the configuration of the conductor protrusion. Fig. 17 is an enlarged cross-sectional view showing the arrangement of a circuit board 11, a housing base 15, and an electromagnetic wave shielding material 40 provided in an electronic control device according to the seventh embodiment.

[0067] As shown in FIG. 17 , a conductor protrusion 51 is formed on the second ground pattern portion 26 b, and a conductor protrusion 52 is formed on the third ground pattern portion 26 c. Both of the conductor protrusions 51 and 52 are formed from copper blocks. The shapes of the conductor protrusions 51 and 52 in FIG. 17 indicate the cross-sectional shapes of the conductor protrusions 51 and 52. The conductor protrusions 51 and 52 are each formed continuously and elongated along the longitudinal direction Y of the ground pattern 26 (see FIG. 8 ). However, each of the conductor protrusions 51 and 52 may be formed intermittently (discontinuously) at predetermined intervals in the longitudinal direction Y of the ground pattern 26. In other words, each of the conductor protrusions 51 and 52 may be divided into multiple parts in the longitudinal direction Y of the ground pattern 26.

[0068] The conductor protrusions 51 and 52 are formed by fixing copper blocks to the second ground pattern portion 26 b and the third ground pattern portion 26 c by soldering after the pattern forming step in the circuit board fabrication step S2 (see FIG. 7 ). The copper blocks are fabricated by, for example, cutting before the soldering.

[0069] The conductor protrusion 51 is formed in a trapezoidal shape when viewed in the longitudinal direction Y of the ground pattern 26 (see FIG. 8 ). As a result, the side surface 51 a of the conductor protrusion 51 is formed in a tapered and inclined state. Therefore, the dimension of the conductor protrusion 51 in the width direction X of the ground pattern 26 gradually decreases from the bottom surface of the conductor protrusion 51 toward the top surface of the conductor protrusion 51. The conductor protrusion 52 has the same shape as the conductor protrusion 51. Therefore, the side surface 52 a of the conductor protrusion 52 is formed in a tapered and inclined state.

[0070] In this way, when the side surface 51 a of the conductor protrusion 51 and the side surface 52 a of the conductor protrusion 52 are each formed in a tapered shape, when the electromagnetic wave shielding material 40 is pressed against the ground pattern 26 by the above-mentioned pressing force, the side surface portions 40 b, 40 c of the electromagnetic wave shielding material 40 become more easily fitted to the corresponding side surfaces 51 a, 52 a of the conductor protrusions 51, 52. This increases the contact area of ​​the electromagnetic wave shielding material 40 with the first ground pattern portion 26 a, ensuring higher shielding performance.

[0071] Furthermore, when the conductor protrusions 51, 52 are formed from copper blocks, it is easier to ensure a large height (protrusion dimension) for the conductor protrusions 51, 52 compared to when the conductor protrusions 45, 46 are formed by soldering as described above. This is advantageous in increasing the contact area between the electromagnetic wave shielding material 40 and each of the conductor protrusions 51, 52.

[0072] Eighth Embodiment An electronic control device according to an eighth embodiment differs from the seventh embodiment in the shapes of the conductor protrusions 51, 52. Fig. 18 is an enlarged cross-sectional view showing the arrangement of a circuit board 11, a housing base 15, and an electromagnetic wave shielding material 40 included in the electronic control device according to the eighth embodiment.

[0073] As shown in Fig. 18, a conductor protrusion 51 is formed on the second ground pattern portion 26b, and a conductor protrusion 52 is formed on the third ground pattern portion 26c. Both the conductor protrusions 51 and 52 are formed from copper blocks. The shapes of the conductor protrusions 51 and 52 in Fig. 18 indicate the cross-sectional shapes of the conductor protrusions 51 and 52. The method of forming the conductor protrusions 51 and 52 is basically the same as that of the seventh embodiment described above.

[0074] The conductor protrusion 51 is formed in a triangular shape when viewed from the longitudinal direction Y of the ground pattern 26 (see FIG. 8 ). As a result, the side surface 51 a of the conductor protrusion 51 is formed in a tapered and inclined state. Therefore, the dimension of the conductor protrusion 51 in the width direction X of the ground pattern 26 gradually decreases from the bottom surface of the conductor protrusion 51 toward the top surface of the conductor protrusion 51. The conductor protrusion 52 has the same shape as the conductor protrusion 51. Therefore, the side surface 52 a of the conductor protrusion 52 is formed in a tapered and inclined state.

[0075] As described above, even when the conductor projections 51 and 52 are formed in a triangular shape when viewed in the longitudinal direction Y of the ground pattern 26 (see FIG. 8), the same effects as those of the seventh embodiment can be obtained.

[0076] Ninth Embodiment An electronic control device according to a ninth embodiment differs from the first embodiment in the configuration of the ground pattern 26. Fig. 19 is an enlarged cross-sectional view showing the arrangement of the circuit board 11, the housing base 15, and the electromagnetic wave shielding material 40 provided in the electronic control device according to the ninth embodiment. The shape of the ground pattern 26 in Fig. 19 indicates the cross-sectional shape of the ground pattern 26.

[0077] 19 , the width W1 of the ground pattern 26 is wider than the width W2 of the electromagnetic wave shielding material 40. The width W2 of the electromagnetic wave shielding material 40 is the dimension before the electromagnetic wave shielding material 40 is compressed and deformed by the pressing force F. The pressing force F is as described above. A pattern recess 55 is formed in the center of the ground pattern 26 in the width direction X. The pattern recess 55 is formed integrally with the ground pattern 26. The pattern recess 55 is formed by machining a portion of the ground pattern 26 after the pattern forming step in the circuit board manufacturing step S2 (see FIG. 7 ).

[0078] The pattern recess 55 is formed by recessing the center of the ground pattern 26 in the width direction X into a substantially U-shape (concave shape). Therefore, the thickness dimension of the ground pattern 26 is smaller in the center of the ground pattern 26 than in other portions. The pattern recess 55 is formed continuously and elongated along the length of the ground pattern 26. However, the pattern recess 55 may be formed intermittently (discontinuously) at predetermined intervals along the length of the ground pattern 26. The width W3 of the pattern recess 55 is narrower than the width W2 of the electromagnetic wave shielding material 40. The width W1 of the ground pattern 26, the width W2 of the electromagnetic wave shielding material 40, and the width W3 of the pattern recess 55 are all dimensions defined in the width direction X of the ground pattern 26.

[0079] The top surfaces (main surfaces) 26d of the ground pattern 26 are arranged in pairs on both sides of the pattern recess 55 when viewed in the longitudinal direction of the ground pattern 26. The top surfaces 26d of the ground pattern 26 are substantially flush with the main surface 11a of the circuit board 11. In other words, there is almost no step at the boundary between the top surfaces 26d of the ground pattern 26 and the main surface 11a of the circuit board 11. The top surfaces 26d of the ground pattern 26 are arranged to protrude toward the electromagnetic wave shielding material 40 beyond the bottom surfaces 55a of the pattern recesses 55. In this case, the bottom surfaces 55a of the pattern recesses 55 correspond to the conductor reference surface, and the top surfaces 26d of the ground pattern 26 correspond to the conductor protrusions. By forming the pattern recesses 55 in the ground pattern 26 in this way and recessing the center of the ground pattern 26 in the width direction X due to the presence of the pattern recesses 55, the bottom surface 55a as the conductor reference surface and the top surface 26d as the conductor protrusions are formed integrally (in an integral structure) with the ground pattern 26. This allows the circuit board 11 to be manufactured at lower cost than when the conductor projections 45, 46 are formed as separate bodies (separate structures) from the ground pattern 26 as shown in FIG. 6, for example.

[0080] The cross-sectional shape of the pattern recess 55 is not limited to a substantially U-shape, but may be, for example, a semicircular shape or a substantially V-shape. In addition, it is preferable that the width W1 of the ground pattern 26 is equal to or greater than the width W2 of the electromagnetic wave shielding material 40.

[0081] In the electronic control device according to the ninth embodiment, when the electromagnetic wave shielding material 40 is pressed against the ground pattern 26 with a pressing force F, the top of the electromagnetic wave shielding material 40 comes into contact with the bottom surface 55a of the pattern recess 55, and the side surface of the electromagnetic wave shielding material 40 comes into contact with the upper surface 26d of the ground pattern 26. Therefore, compared to the comparative example shown in Fig. 9 above, the contact area of ​​the electromagnetic wave shielding material 40 with the ground pattern 26 is increased, and the electrical connection between the housing base 15 and the ground pattern 26 can be strengthened. This improves the electromagnetic noise shielding performance of the electromagnetic wave shielding material 40.

[0082] Furthermore, in the ninth embodiment, when the electromagnetic wave shielding material 40 is pressed against the ground pattern 26 by the pressing force F, the electromagnetic wave shielding material 40 is pressed into the pattern recess 55, and is thereby compressed and deformed so as to conform to the shape of the pattern recess 55. This makes it possible to suppress misalignment of the electromagnetic wave shielding material 40 in the width direction X of the ground pattern 26.

[0083] Tenth Embodiment An electronic control device according to a tenth embodiment partially differs from the above-described ninth embodiment in the structure of the ground pattern 26. Fig. 20 is an enlarged cross-sectional view showing the arrangement of the circuit board 11, the housing base 15, and the electromagnetic wave shielding material 40 provided in the electronic control device according to the tenth embodiment. The shape of the ground pattern 26 in Fig. 20 indicates the cross-sectional shape of the ground pattern 26.

[0084] As shown in FIG. 20 , the ground pattern 26 has a pattern recess 55 in the center of the ground pattern 26 in the width direction X. This is similar to the ninth embodiment, including the method of forming the pattern recess 55. However, in the ninth embodiment, the upper surface 26 d of the ground pattern 26 is substantially flush with the main surface 11 a of the circuit board 11. In contrast, in the tenth embodiment, the upper surface 26 d of the ground pattern 26 is disposed so as to protrude toward the electromagnetic wave shielding material 40 (housing base 15) beyond the main surface 11 a of the circuit board 11. In other words, a step H is formed at the boundary between the upper surface 26 d of the ground pattern 26 and the main surface 11 a of the circuit board 11, and both sides of the ground pattern 26 protrude toward the electromagnetic wave shielding material 40 beyond the center of the ground pattern 26 by the amount of this step H. Furthermore, the recess dimension (depth dimension) of the pattern recess 55 relative to the upper surface 26 d of the ground pattern 26 is substantially the same as the step H.

[0085] The tenth embodiment provides the same effects as the ninth embodiment. Furthermore, the tenth embodiment ensures a larger thickness dimension of the ground pattern 26 than the ninth embodiment, thereby reducing the electrical resistance of the ground pattern 26.

[0086] Eleventh Embodiment An electronic control device according to an eleventh embodiment differs from the above-described ninth and tenth embodiments in the configuration of the ground pattern 26. Fig. 21 is an enlarged cross-sectional view showing the arrangement of the circuit board 11, the housing base 15, and the electromagnetic wave shielding material 40 provided in the electronic control device according to the eleventh embodiment. The shape of the ground pattern 26 in Fig. 21 indicates the cross-sectional shape of the ground pattern 26.

[0087] As shown in FIG. 21 , a pattern convex portion 56 is formed in the center of the ground pattern 26 in the width direction X. The pattern convex portion 56 is formed integrally with the ground pattern 26 by protruding the center of the ground pattern 26 in the width direction X. The center of the ground pattern 26 in the width direction X is the portion against which the top of the electromagnetic wave shielding material 40 is pressed. The pattern convex portion 56 is formed, for example, by cutting the ground pattern 26 so as to leave the pattern convex portion 56 after the pattern forming step in the circuit board manufacturing process S2 (see FIG. 7 ). The pattern convex portion 56 is formed continuously along the length of the ground pattern 26. However, the pattern convex portion 56 may be divided into multiple portions at predetermined intervals along the length of the ground pattern 26. The pattern convex portion 56 is formed in a convex shape protruding toward the electromagnetic wave shielding material 40 beyond the upper surface (main surface) 26 e of the ground pattern 26. The top surfaces 26e (main surfaces) of the ground pattern 26 are arranged in pairs on both sides of the pattern protrusions 56 when viewed in the longitudinal direction of the ground pattern 26. The top surfaces 26e of the ground pattern 26 form substantially the same plane as the main surface 11a of the circuit board 11. In this case, the top surface 26e of the ground pattern 26 corresponds to the conductor reference plane, and the pattern protrusions 56 of the ground pattern 26 correspond to the conductor protrusions. By forming the pattern protrusions 56 on the ground pattern 26 in this manner and causing the central portion of the ground pattern 26 in the width direction X to protrude due to the presence of these pattern protrusions 56, the top surface 26e as the conductor reference plane and the pattern protrusions 56 as the conductor protrusions are formed integrally with the ground pattern 26.

[0088] In the electronic control device according to the eleventh embodiment, when the electromagnetic wave shielding material 40 is pressed against the ground pattern 26 by a pressing force generated when the circuit board 11 is assembled to the housing base 15, the pattern protrusions 56 are embedded in the electromagnetic wave shielding material 40. This embedding of the pattern protrusions 56 into the electromagnetic wave shielding material 40 is achieved by the rubber-like elasticity of the electromagnetic wave shielding material 40 being pressed into the pattern protrusions 56 and elastically deforming. Furthermore, the electromagnetic wave shielding material 40 is compressed and deformed by the pressing force, so that it not only contacts the pattern protrusions 56 of the ground pattern 26 but also contacts the upper surface 26e of the ground pattern 26 on both sides of the pattern protrusions 56. This increases the contact area of ​​the electromagnetic wave shielding material 40 with the ground pattern 26 compared to the comparative example shown in FIG. 9 , thereby strengthening the electrical connection between the housing base 15 and the ground pattern 26. This improves the electromagnetic noise shielding performance of the electromagnetic wave shielding material 40.

[0089] Furthermore, in the eleventh embodiment, when the electromagnetic wave shielding material 40 is pressed against the ground pattern 26 by the pressing force F, the pattern convex portions 56 bite into the electromagnetic wave shielding material 40, thereby restricting movement of the electromagnetic wave shielding material 40 in the width direction X of the ground pattern 26. This makes it possible to suppress displacement of the electromagnetic wave shielding material 40 in the width direction X of the ground pattern 26.

[0090] Twelfth Embodiment An electronic control device according to a twelfth embodiment differs from the above-described eleventh embodiment in the number of pattern protrusions 56 provided on the ground pattern 26. Fig. 22 is an enlarged cross-sectional view showing the arrangement of the circuit board 11, the housing base 15, and the electromagnetic wave shielding material 40 provided in the electronic control device according to the twelfth embodiment. The shape of the ground pattern 26 in Fig. 22 indicates the cross-sectional shape of the ground pattern 26.

[0091] 22 , the ground pattern 26 has a plurality of pattern protrusions 56 (56a, 56b, 56c, 56d, and 56e). In the twelfth embodiment, as an example, five pattern protrusions 56a, 56b, 56c, 56d, and 56e are provided on the ground pattern 26. The five pattern protrusions 56a, 56b, 56c, 56d, and 56e are formed integrally with the ground pattern 26 by protruding from a plurality of locations in the width direction X of the ground pattern 26. The five pattern protrusions 56a, 56b, 56c, 56d, and 56e are formed at predetermined intervals in the width direction X of the ground pattern 26.

[0092] The five pattern convex portions 56a, 56b, 56c, 56d, and 56e are formed by, for example, cutting the ground pattern 26 after the pattern forming step in the circuit board fabrication step S2 (see FIG. 7 ) so as to leave the five pattern convex portions 56a, 56b, 56c, 56d, and 56e. The pattern convex portion 56c is formed in the center of the ground pattern 26 in the width direction X. The pattern convex portions 56a and 56e are formed at both ends of the ground pattern 26 in the width direction X. The pattern convex portion 56b is formed between the pattern convex portions 56a and 56c in the width direction X of the ground pattern 26. The pattern convex portion 56d is formed between the pattern convex portions 56c and 56e in the width direction X of the ground pattern 26.

[0093] Each of the pattern protrusions 56a, 56b, 56c, 56d, and 56e is formed to protrude toward the electromagnetic wave shielding material 40 beyond the upper surface (surface) 26e of the ground pattern 26. The upper surface (main surface) 26e of the ground pattern 26 is formed between two pattern protrusions adjacent to each other in the width direction X of the ground pattern 26. The upper surface 26e of the ground pattern 26 can also be described as a concave bottom surface formed between two pattern protrusions adjacent to each other in the width direction X of the ground pattern 26. By forming the multiple pattern protrusions 56 (56a, 56b, 56c, 56d, and 56e) in the ground pattern 26 in this manner, the upper surface 26e of the ground pattern 26 as a conductor reference plane and the multiple pattern protrusions 56 (56a, 56b, 56c, 56d, and 56e) as conductor protrusions are formed integrally with the ground pattern 26.

[0094] In the electronic control device according to the twelfth embodiment, when the electromagnetic wave shielding material 40 is pressed against the ground pattern 26 by the pressing force generated when the circuit board 11 is attached to the housing base 15, the pattern protrusion 56c is pressed into the top of the electromagnetic wave shielding material 40. The pattern protrusion 56b is pressed into one side surface of the electromagnetic wave shielding material 40 (the left side in FIG. 22 ), and the pattern protrusion 56d is pressed into the other side surface of the electromagnetic wave shielding material 40 (the right side in FIG. 22 ). The electromagnetic wave shielding material 40 is compressed and deformed by the pressing force, and thus comes into contact not only with the pattern protrusions 56b, 56c, and 56d of the ground pattern 26 but also with the top surface 26e of the ground pattern 26 on both sides of the pattern protrusion 56c. Furthermore, depending on the magnitude of the pressing force, the side surfaces of the electromagnetic wave shielding material 40 can be brought into contact with the pattern protrusions 56a and 56e. This increases the contact area of ​​the electromagnetic wave shielding material 40 with the ground pattern 26 compared to the eleventh embodiment described above, thereby strengthening the electrical connection between the housing base 15 and the ground pattern 26 .

[0095] Furthermore, in the twelfth embodiment, when the electromagnetic wave shielding material 40 is pressed against the ground pattern 26 by the pressing force F, at least three pattern protrusions 56b, 56c, and 56d bite into the electromagnetic wave shielding material 40, thereby restricting movement of the electromagnetic wave shielding material 40 in the width direction X of the ground pattern 26. This makes it possible to suppress displacement of the electromagnetic wave shielding material 40 in the width direction X of the ground pattern 26.

[0096] In FIG. 22, five pattern protrusions 56 (56a, 56b, 56c, 56d, 56e) are formed on the ground pattern 26, but the number of pattern protrusions 56 may be two or more.

[0097] 23 is an enlarged cross-sectional view showing the arrangement of a circuit board 11, a housing base 15, and an electromagnetic wave shielding material 60 included in an electronic control device according to a thirteenth embodiment. As shown in Fig. 23, the electromagnetic wave shielding material 60 is arranged between the ground pattern 26 of the circuit board 11 and the shielding pedestal 39 of the housing base 15. The ground pattern 26 is formed to be wider than the ground pattern 26 in the comparative example (Fig. 9).

[0098] The electromagnetic wave shielding material 60 is formed so as to protrude in a semicircular shape when viewed from the longitudinal direction of the ground pattern 26. The shape of the electromagnetic wave shielding material 60 in Fig. 23 shows the cross-sectional shape of the electromagnetic wave shielding material 60. The shape of the electromagnetic wave shielding material 60 in Fig. 23 also shows the shape of the electromagnetic wave shielding material 60 before it is compressively deformed. The electromagnetic wave shielding material 60 is formed on the ground pattern 26 of the circuit board 11. The electromagnetic wave shielding material 60 is provided in a state of being adhered to the upper surface (surface) 26f of the ground pattern 26. The electromagnetic wave shielding material 60 is formed so as to protrude toward the housing base 15 in the thickness direction of the circuit board 11.

[0099] The electromagnetic wave shielding material 60 is formed on the circuit board 11 in the circuit board fabrication step S2 (see FIG. 7 ), for example, by the following method. First, a circuit board 11 is prepared after the pattern formation step. Next, a liquid or paste-like material (conductive adhesive) containing a conductive filler, which is the raw material for the electromagnetic wave shielding material 60, is applied to the surface of the ground pattern 26 of the circuit board 11 using an application nozzle (not shown). Next, the material on the ground pattern 26 is cured, for example, by moisture, heat, ultraviolet light, or the like. The method for curing the material applied to the ground pattern 26 of the circuit board 11 depends on the properties (moisture curing, thermosetting, ultraviolet light curing, etc.) of the material used as the raw material for the electromagnetic wave shielding material 40. As a result, the electromagnetic wave shielding material 60 is formed in a semicircular protruding shape. The electromagnetic wave shielding material 60 is made of the same material as the electromagnetic wave shielding material 40 in the first embodiment, and therefore has rubber-like elasticity. In this case, the circuit board fabrication step S2 corresponds to the step of forming the electromagnetic wave shielding material 60 on the circuit board 11.

[0100] Meanwhile, two conductor protrusions 61, 62 are provided on the housing base 15. Each of the conductor protrusions 61, 62 is formed by partially protruding the housing base 15 in a convex shape. Therefore, each of the conductor protrusions 61, 62 can be referred to as a housing protrusion. The conductor protrusions 61, 62 are formed integrally with the housing base 15 by protruding a portion of a predetermined surface of the housing base 15 that faces the ground pattern 26. Specifically, the conductor protrusions 61, 62 are provided so as to protrude from the surface 39a of the shielding pedestal 39. In this case, the surface 39a of the shielding pedestal 39 corresponds to the conductor reference plane. By forming the conductor protrusions 61, 62 on the shielding pedestal 39 of the housing base 15 in this manner, the surface 39a of the shielding pedestal 39, which serves as the reference plane, and the conductor protrusions 61, 62 are formed integrally (in an integral structure) with the housing base 15. This allows the housing base 15 to be manufactured at lower cost than when the conductor protrusions are formed separately (as separate structures) on the housing base 15. The two conductor protrusions 61, 62 may be formed in the housing base manufacturing step S1 (see FIG. 7 ) described above, or may be formed by performing post-processing such as cutting on the housing base 15 obtained by the housing base manufacturing step. In this case, the housing manufacturing step S1 corresponds to a step of forming the conductor reference surface and the conductor protrusions on the housing (housing base 15 in this example).

[0101] The conductor protrusions 61, 62 are arranged in pairs in the width direction X of the ground pattern 26. Each conductor protrusion 61, 62 is formed at a position facing both ends of the ground pattern 26 in the width direction X. Each conductor protrusion 61, 62 is formed in a state in the thickness direction of the housing base 15 such that a portion of the surface 39a of the shielding base 39 protrudes toward the electromagnetic wave shielding material 60 (toward the circuit board 11). Therefore, the conductor protrusions 61, 62 protrude toward the electromagnetic wave shielding material 60 (toward the circuit board 11) beyond the surface 39a of the shielding base 39. In this case, the surface 39a of the shielding base 39 corresponds to a predetermined surface of the housing that is disposed opposite the ground pattern 26. Each conductor protrusion 61, 62 is formed continuously and long along the ground pattern 26 in the length direction of the ground pattern 26 (the depth direction in FIG. 23 ). However, each of the conductor protrusions 61, 62 may be divided into multiple parts at predetermined intervals in the longitudinal direction of the ground pattern 26. Furthermore, each of the conductor protrusions 61, 62 is formed in a convex shape. The shapes of the conductor protrusions 61, 62 in Fig. 23 show the cross-sectional shapes of the conductor protrusions 61, 62 when viewed from the longitudinal direction of the ground pattern 26.

[0102] In the electronic control device according to the thirteenth embodiment, the vicinity of the top 60a of the electromagnetic shielding material 60 contacts the surface 39a of the shielding base 39. In addition, the side portion 60b of the electromagnetic shielding material 60 protrudes into the conductor protruding portion 61, and the side portion 60c of the electromagnetic shielding material 60 contacts the conductor protruding portion 62. This increases the contact area (electrical connection area) of the electromagnetic shielding material 60 with the housing base 15. Furthermore, the pressing force generated when assembling the circuit board 11 to the housing base 15 compresses and deforms the electromagnetic shielding material 60, thereby further increasing the contact area (electrical connection area) of the electromagnetic shielding material 60 with the housing base 15. This strengthens the electrical connection between the housing base 15 and the ground pattern 26. As a result, the ground is strengthened around the circuit area 25 (see FIG. 4 ) of the circuit board 11, improving the electromagnetic noise shielding performance of the electromagnetic shielding material 60.

[0103] In the thirteenth embodiment, the pair of conductor protrusions 61, 62 contact the electromagnetic wave shielding material 60 from both sides in the width direction X of the ground pattern 26. This makes it possible to suppress misalignment of the electromagnetic wave shielding material 60 in the width direction X of the ground pattern 26.

[0104] Furthermore, when viewed in the longitudinal direction of the ground pattern 26, the shape of each of the conductor protrusions 61, 62 may be, for example, a trapezoid or a triangle in order to form tapered side surfaces of the conductor protrusions 61, 62. This allows the side surface portions 60b, 60c of the electromagnetic shielding material 60 to fit more easily with the side surfaces of the corresponding conductor protrusions 61, 62 when the electromagnetic shielding material 60 is pressed against the shielding base 39. This increases the contact area of ​​the electromagnetic shielding material 60 with the housing base 15, ensuring higher shielding performance.

[0105] <Fourteenth Embodiment> An electronic control device according to a fourteenth embodiment differs from the thirteenth embodiment in the structure of the housing base 15. Fig. 24 is an enlarged cross-sectional view showing the arrangement of the circuit board 11, housing base 15, and electromagnetic wave shielding material 60 provided in the electronic control device according to the fourteenth embodiment. Fig. 24 shows the state before the electromagnetic wave shielding material 60 is compressively deformed by the pressing force F.

[0106] As shown in FIG. 24 , a housing recess 65 is formed in the housing base 15. The housing recess 65 may be formed during the housing base fabrication step S1 (see FIG. 7 ) described above, or may be formed by performing post-processing such as cutting on the housing base 15 obtained by the housing base fabrication step. The housing recess 65 is formed by recessing a portion of the surface 39 b of the shield pedestal 39 into a generally U-shape. The housing recess 65 is formed integrally with the housing base 15. The housing recess 65 is formed to face the ground pattern 26. The surface 39 b of the shield pedestal 39 is positioned to protrude toward the electromagnetic wave shielding material 60 beyond the bottom surface 65 a of the housing recess 65. The surfaces 39 b of the shield pedestal 39 are positioned in pairs on both sides of the housing recess 65 when viewed in the longitudinal direction of the ground pattern 26. In this case, the bottom surface 65 a of the housing recess 65 corresponds to a conductor reference plane, and the surface 39 b of the shield pedestal 39 corresponds to a conductor protrusion.

[0107] In the electronic control device according to the fourteenth embodiment, the electromagnetic wave shielding material 60 undergoes compressive deformation (elastic deformation) due to the pressing force F that is generated when the circuit board 11 is attached to the housing base 15. As a result, when the circuit board 11 is attached to the housing base 15, the top of the electromagnetic wave shielding material 60 comes into contact with the bottom surface 65a of the housing recess 65, and the side surface of the electromagnetic wave shielding material 60 comes into contact with the surface 39b of the shield pedestal 39. Therefore, the same effects as those of the thirteenth embodiment can be obtained.

[0108] The cross-sectional shape of the housing recess 65 is not limited to a substantially U-shape. For example, the cross-sectional shape of the housing recess 65 may be semicircular or may have tapered side surfaces so that the electromagnetic wave shielding material 60 can easily fit into the housing recess 65 when the electromagnetic wave shielding material 60 is compressed and deformed by the pressing force F.

[0109] Fifteenth Embodiment An electronic control device according to a fifteenth embodiment differs from the above-described thirteenth embodiment in the structure of the housing base 15. Fig. 25 is an enlarged cross-sectional view showing the arrangement of the circuit board 11, housing base 15, and electromagnetic wave shielding material 60 provided in the electronic control device according to the fifteenth embodiment.

[0110] As shown in FIG. 25 , one conductor protrusion 66 is provided on the housing base 15. The conductor protrusion 66 may be formed during the housing base fabrication step S1 (see FIG. 7 ) described above, or may be formed by performing post-processing such as cutting on the housing base 15 obtained by the housing base fabrication step. The conductor protrusion 66 is formed on the surface 39 c of the shield pedestal 39 at a position facing the center of the ground pattern 26 in the width direction X. The conductor protrusion 66 is formed by partially protruding from the housing base 15. Therefore, the conductor protrusion 66 can be referred to as a housing protrusion. The conductor protrusion 66 is integrally formed with the housing base 15. The conductor protrusion 66 is formed so as to protrude toward the electromagnetic wave shielding material 60 (toward the circuit board 11) beyond the surface 39 c of the shield pedestal 39. In this case, the surface 39 c of the shield pedestal 39 corresponds to a predetermined surface of the housing that is disposed opposite the ground pattern 26. The surface 39 c of the shield pedestal 39 corresponds to a conductor reference plane. The conductor protrusion 66 is formed continuously along the ground pattern 26 in the longitudinal direction of the ground pattern 26 (the depth direction in FIG. 25 ). However, the conductor protrusion 66 may be divided into multiple parts at predetermined intervals in the longitudinal direction of the ground pattern 26. The conductor protrusion 66 is formed in a convex shape. The shape of the conductor protrusion 66 in FIG. 25 shows the cross-sectional shape of the conductor protrusion 66 when viewed from the longitudinal direction of the ground pattern 26.

[0111] In the electronic control device according to the fifteenth embodiment, when the electromagnetic wave shielding material 60 is pressed against the shielding base 39 of the housing base 15 by a pressing force generated when the circuit board 11 is assembled to the housing base 15, the conductor protrusion 66 is embedded in the electromagnetic wave shielding material 60. This embedding of the conductor protrusion 66 into the electromagnetic wave shielding material 60 is achieved by the electromagnetic wave shielding material 60, which has rubber-like elasticity, being pressed into the conductor protrusion 66 and elastically deforming. Furthermore, the electromagnetic wave shielding material 60 is compressed and deformed by the pressing force, so that it not only contacts the conductor protrusion 66 but also contacts the surface 39c of the shielding base 39 on both sides of the conductor protrusion 66. This increases the contact area of ​​the electromagnetic wave shielding material 60 with the housing base 15, thereby strengthening the electrical connection between the housing base 15 and the ground pattern 26. This improves the electromagnetic noise shielding performance of the electromagnetic wave shielding material 60.

[0112] Furthermore, in the fifteenth embodiment, when the electromagnetic wave shielding material 60 is pressed against the shielding pedestal 39 of the housing base 15 by the pressing force, the conductor protrusions 66 bite into the electromagnetic wave shielding material 60, thereby restricting movement of the electromagnetic wave shielding material 60 in the width direction X of the ground pattern 26. This makes it possible to suppress displacement of the electromagnetic wave shielding material 60 in the width direction X of the ground pattern 26.

[0113] <Sixteenth embodiment> An electronic control device according to a sixteenth embodiment differs from the above-described fifteenth embodiment in the number of conductor protrusions 66 provided on the housing base 15. Fig. 26 is an enlarged cross-sectional view showing the arrangement of the circuit board 11, housing base 15, and electromagnetic wave shielding material 60 provided in the electronic control device according to the sixteenth embodiment.

[0114] As shown in FIG. 26 , the housing base 15 has a plurality of conductor protrusions 66 (66 a, 66 b, 66 c, 66 d, and 66 e). In the sixteenth embodiment, as an example, five conductor protrusions 66 a, 66 b, 66 c, 66 d, and 66 e are provided on the housing base 15. The five conductor protrusions 66 a, 66 b, 66 c, 66 d, and 66 e are arranged at predetermined intervals in the width direction X of the ground pattern 26. The five conductor protrusions 66 a, 66 b, 66 c, 66 d, and 66 e may be formed in the housing base manufacturing step in the housing manufacturing process S1 (see FIG. 7 ), or may be formed by performing post-processing such as cutting on the housing base 15 obtained in the housing base manufacturing step. The conductor protrusion 66 c is formed in a position facing the center of the ground pattern 26 in the width direction X. The conductor protrusion 66b is formed between the conductor protrusions 66a and 66c in the width direction X of the ground pattern 26. The conductor protrusion 66d is formed between the conductor protrusions 66c and 66e in the width direction X of the ground pattern 26.

[0115] Each of the conductor protrusions 66a, 66b, 66c, 66d, and 66e is formed to protrude toward the electromagnetic wave shielding material 60 beyond the surface 39c of the shielding base 39. The surface 39c of the shielding base 39 is formed between two conductor protrusions that are adjacent to each other in the width direction X of the ground pattern 26. In other words, the surface 39c of the shielding base 39 can be said to be a concave bottom surface that is formed between two conductor protrusions that are adjacent to each other in the width direction X of the ground pattern 26.

[0116] In the electronic control device according to the sixteenth embodiment, when the electromagnetic wave shielding material 60 is pressed against the shielding base 39 of the housing base 15 by a pressing force generated when the circuit board 11 is assembled to the housing base 15, the conductor protrusion 66c is pressed into the top of the electromagnetic wave shielding material 60. The conductor protrusion 66b is pressed into one side surface of the electromagnetic wave shielding material 60 (the left side in FIG. 26 ), and the conductor protrusion 66d is pressed into the other side surface of the electromagnetic wave shielding material 60 (the right side in FIG. 26 ). The electromagnetic wave shielding material 60 is compressed and deformed by the pressing force, and thus comes into contact not only with the conductor protrusions 66b, 66c, and 66d of the housing base 15, but also with the surface 39c of the shielding base 39 on both sides of the conductor protrusion 66c. Furthermore, depending on the magnitude of the pressing force, the side surfaces of the electromagnetic wave shielding material 60 can be brought into contact with the conductor protrusions 66a and 66e. This increases the contact area of ​​the electromagnetic wave shielding material 40 with the ground pattern 26 compared to the fifteenth embodiment described above, thereby strengthening the electrical connection between the housing base 15 and the ground pattern 26 .

[0117] Furthermore, in the sixteenth embodiment, when the electromagnetic wave shielding material 60 is pressed against the shielding pedestal 39 of the housing base 15 by the pressing force, at least three conductor protrusions 66b, 66c, 66d bite into the electromagnetic wave shielding material 60, thereby restricting movement of the electromagnetic wave shielding material 60 in the width direction X of the ground pattern 26. This makes it possible to suppress displacement of the electromagnetic wave shielding material 60 in the width direction X of the ground pattern 26.

[0118] In FIG. 26, five conductor protrusions 66 (66a, 66b, 66c, 66d, 66e) are formed on the housing base 15, but the number of conductor protrusions 66 may be two or more.

[0119] The present invention is not limited to the above-described embodiments and includes various modifications. For example, the above-described embodiments have been described in detail to facilitate understanding of the present invention, but the present invention is not necessarily limited to those including all of the configurations described in the above-described embodiments. Furthermore, it is possible to replace part of the configuration of one embodiment with the configuration of another embodiment. It is also possible to add the configuration of another embodiment to the configuration of one embodiment. It is also possible to delete part of the configuration of each embodiment, add other configurations, or replace it with other configurations.

[0120] Furthermore, it is preferable that the ground pattern 26 is formed so as to surround the circuit area 25 on all four sides as shown in FIG. 4 above, but the present invention is not limited to this, and the ground pattern 26 may be formed so as to surround the circuit area 25 on three sides.

[0121] 17, the conductor protrusion 51 is formed into a trapezoid shape, so that both sides of the conductor protrusion 51 are tapered, but the present invention is not limited to this. For example, only one side of the conductor protrusion 51 that comes into contact with the side surface 40b of the electromagnetic wave shielding material 40 may be tapered. This also applies to the conductor protrusion 52 shown in FIG. 17 and the conductor protrusions 51, 52 shown in FIG. 18.

[0122] 10...Electronic control device, 11...Circuit board, 12...Housing, 15...Housing base (housing), 17, 18, 19...Electronic component, 26...Ground pattern, 26a...First ground pattern portion, 26b...Second ground pattern portion, 26c...Third ground pattern portion, 26d...Surface (conductor protrusion), 26e...Upper surface (conductor reference plane), 39...Shield base, 39a...Surface (reference plane), 39b...Surface (conductor protrusion), 39c...Conductor reference plane, 40, 60...Electromagnetic wave shielding material, 41...Pattern surface (conductor reference plane), 45, 46, 51, 61, 62, 66...Conductor protrusion, 47...Depression, 47a, 51a, 52a...Side, 55...Pattern recess, 55a...Bottom surface (conductor reference plane), 56...Pattern protrusion (conductor protrusion), 65...Housing recess, 65a...Bottom surface (conductor reference plane)

Claims

1. An electronic control device comprising: a circuit board on which electronic components are mounted and on which a ground pattern is formed; a conductive housing that houses the circuit board; and an electromagnetic wave shielding material that is disposed between the ground pattern of the circuit board and the housing and electrically connects the ground pattern to the housing, wherein the circuit board or the housing has a conductor reference surface against which the electromagnetic wave shielding material is pressed, and a conductor protrusion that protrudes toward the electromagnetic wave shielding material beyond the conductor reference surface, and the electromagnetic wave shielding material is disposed in a state of contact with the conductor reference surface and the conductor protrusion.

2. The electronic control device according to claim 1, wherein the electromagnetic wave shielding material has rubber-like elasticity and is disposed in a compressed and deformed state between the ground pattern and the housing.

3. The electronic control device according to claim 1, wherein the conductor protrusions are formed in a plurality at predetermined intervals in the longitudinal direction of the ground pattern.

4. An electronic control device as described in claim 1, wherein the ground pattern has a first ground pattern portion, and a second ground pattern portion and a third ground pattern portion arranged at positions adjacent to the first ground pattern portion with the first ground pattern portion in between, the conductor reference plane is formed by the first ground pattern portion, and the conductor protrusion portion is formed in each of the second ground pattern portion and the third ground pattern portion.

5. The electronic control device according to claim 4, wherein the first ground pattern portion has a recess at a location where the electromagnetic wave shielding material comes into contact.

6. The electronic control device according to claim 5, wherein the side surface of the recess is tapered when viewed in the longitudinal direction of the ground pattern.

7. The electronic control device according to claim 5, wherein the recess is formed in a semicircular recess when viewed in the longitudinal direction of the ground pattern.

8. The electronic control device according to claim 1, wherein the electromagnetic shielding material is formed in a semicircular protruding shape when viewed in the longitudinal direction of the ground pattern.

9. The electronic control device according to claim 1, wherein the side surface of the conductor protrusion is tapered when viewed in the longitudinal direction of the ground pattern.

10. The electronic control device according to claim 1, wherein the conductor reference surface and the conductor protrusion are formed integrally with the ground pattern.

11. The electronic control device according to claim 10, wherein the conductor reference surface and the conductor protrusion are formed integrally with the ground pattern by recessing the center of the ground pattern in the width direction.

12. An electronic control device according to claim 10, wherein the conductor reference surface and the conductor protrusion are formed integrally with the ground pattern by protruding a central portion or a plurality of portions in the width direction of the ground pattern.

13. The electronic control device according to claim 1, wherein the conductor reference surface and the conductor protrusion are formed integrally with the housing.

14. The electronic control device according to claim 13, wherein the conductor protrusion is formed integrally with the housing by protruding a portion of a predetermined surface of the housing that is positioned opposite the ground pattern.

15. An electronic control device as described in claim 13, wherein the conductor reference surface and the conductor protrusion are formed integrally with the housing by recessing a portion of a specific surface of the housing that is positioned opposite the ground pattern.

16. The electronic control device according to claim 14, wherein the conductor protrusion is formed at a position opposite to the center of the ground pattern in the width direction.

17. The electronic control device according to claim 1, wherein the conductor protrusions are formed in a plurality at predetermined intervals in the width direction of the ground pattern.

18. The electronic control device according to claim 1, wherein the electrical conductivity of the conductor protrusion is higher than the electrical conductivity of the electromagnetic wave shielding material.

19. The electronic control device according to claim 1, wherein the conductor protrusion is formed by a solder bump or a copper block.

20. A method for manufacturing an electronic control device comprising: a circuit board on which electronic components are mounted and on which a ground pattern is formed; a conductive housing that houses the circuit board; and an electromagnetic shielding material that is disposed between the ground pattern of the circuit board and the housing and electrically connects the ground pattern to the housing, the method comprising the steps of: applying a paste or liquid material that is a raw material of the electromagnetic shielding material to the circuit board or the housing, and then hardening the material to form the electromagnetic shielding material having rubber-like elasticity on the circuit board or the housing; forming, on the circuit board or the housing, a conductor reference surface against which the electromagnetic shielding material is pressed, and a conductor protrusion that protrudes toward the electromagnetic shielding material beyond the conductor reference surface; and assembling the circuit board to the housing, and compressing and deforming the electromagnetic shielding material by a pressing force generated by the assembling, so that the electromagnetic shielding material comes into contact with the conductor reference surface and the conductor protrusion.