Semiconductor inspection equipment

Abstract

A collet (5) adheres to the upper surface of the semiconductor element (1). An inspection jig (11) has an inspection terminal (12) connected to an electrode on the lower surface of the semiconductor element (1) and a GND block (13) in contact with the lower surface of the semiconductor element (1). A first heat dissipation mechanism (14) dissipates heat from the inspection jig (11). A second heat dissipation mechanism (16) dissipates heat from the collet (5).

Description

[Technical Field]

[0001] The present disclosure relates to a semiconductor inspection apparatus used to inspect the characteristics of semiconductor elements. [Background technology]

[0002] In conventional semiconductor inspection devices, the GND pattern on the underside of the semiconductor element is brought into contact with a GND block to dissipate heat generated during inspection (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2019-86425 Summary of the Invention [Problem to be solved by the invention]

[0004] Conventional semiconductor inspection equipment is capable of dissipating heat from semiconductor elements with a backside cooling structure, in which a heat sink such as a GND pattern is provided on the underside of the element, but it is not possible to ensure heat dissipation from semiconductor elements with a topside cooling structure, in which a heat sink is provided on the top side of the element.

[0005] The present disclosure has been made to solve the above-mentioned problems, and its purpose is to obtain a semiconductor inspection device that can ensure heat dissipation during characteristic inspection regardless of whether the heat dissipation surface of the semiconductor element is the top or bottom surface. [Means for solving the problem]

[0006] The semiconductor inspection device according to the present disclosure includes an inspection jig having a collet that adsorbs the upper surface of a semiconductor element, inspection terminals that are connected to electrodes on the lower surface of the semiconductor element, and a GND block that contacts the lower surface of the semiconductor element, a first heat dissipation mechanism that dissipates heat from the inspection jig, and a second heat dissipation mechanism that dissipates heat from the collet. a pressing jig that presses down the collet; Equipped with The second heat dissipation mechanism has an inclined portion provided on the inspection jig and a positioning plate provided on the underside of the pressing jig so as to be movable laterally and positioning the semiconductor element, and when the pressing jig is lowered and the positioning plate is pressed against the inclined portion, the positioning plate moves laterally and comes into contact with the semiconductor element and the side surface of the collet.It is characterized by: [Effects of the Invention]

[0007] In this disclosure, not only is a first heat dissipation mechanism provided on the inspection jig that comes into contact with the underside of the semiconductor element, but a second heat dissipation mechanism is also provided on the collet that adsorbs the top surface of the semiconductor element. This ensures heat dissipation during characteristic inspections regardless of whether the heat dissipation surface of the semiconductor element is the top or bottom. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a cross-sectional view showing a semiconductor element having a back surface heat dissipation structure. [Figure 2] FIG. 1 is a cross-sectional view showing a semiconductor element having a top-side cooling structure. [Figure 3] 1 is a cross-sectional view showing a semiconductor inspection device according to a first embodiment. [Figure 4] FIG. 10 is a bottom view showing the suction portion of the collet. [Figure 5] 1 is a cross-sectional view showing a semiconductor inspection device according to a first embodiment. [Figure 6] 1 is a cross-sectional view showing a semiconductor inspection device according to a first embodiment. [Figure 7] 1 is a cross-sectional view showing a semiconductor inspection device according to a first embodiment. [Figure 8] FIG. 10 is a cross-sectional view showing a modified example of the semiconductor inspection device according to the first embodiment. [Figure 9] FIG. 10 is a bottom view showing a modified example of the suction portion of the collet. [Figure 10] FIG. 10 is a cross-sectional view showing a modified example of the semiconductor inspection device according to the first embodiment. [Figure 11] FIG. 10 is a cross-sectional view showing a semiconductor inspection device according to a second embodiment. [Figure 12] FIG. 10 is a cross-sectional view showing a semiconductor inspection device according to a third embodiment. [Figure 13] FIG. 10 is a cross-sectional view showing a semiconductor inspection device according to a third embodiment. [Figure 14] FIG. 10 is a cross-sectional view showing a semiconductor inspection device according to a third embodiment. [Figure 15] FIG. 10 is a cross-sectional view showing a semiconductor inspection device according to a fourth embodiment. [Figure 16] FIG. 10 is a cross-sectional view showing a semiconductor inspection device according to a fourth embodiment. [Figure 17] FIG. 10 is a cross-sectional view showing a semiconductor inspection device according to a fifth embodiment. [Figure 18] FIG. 10 is a cross-sectional view showing a semiconductor inspection device according to a fifth embodiment. [Figure 19] FIG. 13 is a cross-sectional view showing a semiconductor inspection device according to a sixth embodiment. [Figure 20] FIG. 13 is a cross-sectional view showing a semiconductor inspection device according to a sixth embodiment. [Figure 21] FIG. 13 is a cross-sectional view showing a semiconductor inspection device according to a seventh embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] A semiconductor inspection device according to an embodiment will be described with reference to the drawings. The same or corresponding components are designated by the same reference numerals, and repeated description may be omitted.

[0010] Embodiment 1 FIG. 1 is a cross-sectional view showing a semiconductor element with a backside heat dissipation structure. The semiconductor element 1 is, for example, a GaN high-frequency device. An electrode 2 and a GND pattern 3 are provided on the bottom surface of the semiconductor element 1. The electrode 2 is an input terminal, output terminal, power supply terminal, etc. of the semiconductor element 1. The GND pattern 3 is not only connected to the GND potential, but also functions as a heat sink that dissipates heat from the semiconductor element 1.

[0011] Figure 2 is a cross-sectional view showing a semiconductor element with a top-side cooling structure. In a semiconductor element with a top-side cooling structure, a heat sink 4 is provided on the top surface of the semiconductor element 1. Because the product number and other information are printed on the heat sink 4 on the top surface of the semiconductor element 1, the top surface of the element is sometimes called the front surface and the bottom surface of the element is sometimes called the back surface. An electrode 2 is provided on the bottom surface of the semiconductor element 1, but a GND pattern 3 is not provided.

[0012] 3, 5 to 7 are cross-sectional views showing the semiconductor inspection device according to the first embodiment. FIG. 3 shows the state in which a semiconductor element 1 with a back surface heat dissipation structure has been picked up. FIG. 4 is a bottom view showing the suction portion of the collet. Collet 5 has suction portion 6 that suctions semiconductor element 1. A suction hole 7 is provided in the center of the underside of suction portion 6 of collet 5. An external vacuum pump applies suction through suction hole 7 via vacuum pipe 8. This causes collet 5 to suction the top surface of semiconductor element 1. The upper end of collet 5 is attached to pressing jig 10 via spring 9. Pressing jig 10 presses collet 5 down. Conventional collets are made of resin and have low thermal conductivity, but collet 5 of this embodiment is a metal collet made of Cu or the like, which has high thermal conductivity.

[0013] Inspection jig 11 has inspection terminals 12 and a GND block 13. A heat sink 15 is thermally connected to GND block 13 as a first heat dissipation mechanism 14. First heat dissipation mechanism 14 dissipates heat from inspection jig 11. A plurality of heat dissipation fins 17 are provided on the top surface of flat suction part 6 as a second heat dissipation mechanism 16. Second heat dissipation mechanism 16 dissipates heat from collet 5.

[0014] 5 shows a semiconductor element 1 with a backside heat dissipation structure being pressed against an inspection jig 11. The characteristics of the semiconductor element 1 are inspected by electrically connecting inspection terminals 12 of the inspection jig 11 to electrodes 2 of the semiconductor element 1. A GND block 13 comes into contact with the GND pattern 3 on the underside of the semiconductor element 1. The heat absorbed by the GND block 13 from the underside of the semiconductor element 1 is dissipated by a heat sink 15.

[0015] Figure 6 shows the state in which a semiconductor element 1 with a top-side cooling structure has been picked up. Figure 7 shows the state in which a semiconductor element 1 with a top-side cooling structure is pressed against an inspection jig 11. The collet 5 comes into contact with the heat sink 4 on the top surface of the semiconductor element 1. The heat absorbed by the collet 5 from the top surface of the semiconductor element 1 is dissipated by the heat dissipation fins 17.

[0016] As explained above, in this embodiment, not only is the inspection jig 11 that contacts the underside of the semiconductor element 1 provided with the first heat dissipation mechanism 14, but the collet 5 that suctions the top surface of the semiconductor element 1 is also provided with the second heat dissipation mechanism 16. This ensures heat dissipation during characteristic inspection whether the heat dissipation surface of the semiconductor element 1 is the top or bottom surface. Therefore, whether the semiconductor element 1 has a backside heat dissipation structure or a topside cooling structure, it can be inspected at a constant temperature using a single semiconductor inspection device.

[0017] 8 and 10 are cross-sectional views showing modified examples of the semiconductor inspection device according to embodiment 1. Fig. 8 shows a state in which the semiconductor element 1 has been picked up, and Fig. 10 shows a state in which the semiconductor element 1 is being pressed against an inspection jig 11.

[0018] The collet 5 has a suction portion 6 that suctions the semiconductor element 1, and an overhanging portion 18 that overhangs the side of the suction portion 6. The width of the suction portion 6 that protrudes downward in a convex shape is approximately the same as the width of the semiconductor element 1. Heat dissipation fins 17 are provided on the overhanging portion 18 as a second heat dissipation mechanism 16. By providing the overhanging portion 18, the heat capacity of the collet 5 is increased and an area for providing the heat dissipation fins 17 can be secured. Heat absorbed by the collet 5 from the top surface of the semiconductor element 1 is dissipated by the heat dissipation fins 17 via the overhanging portion 18.

[0019] 9 is a bottom view showing a modified example of the suction portion of the collet. Heat-conductive rubber 19 is provided on the underside of the suction portion 6 of the collet 5 that comes into contact with the upper surface of the semiconductor element 1. Heat-conductive rubber 19 can absorb the tilt of the semiconductor element 1 relative to the inspection jig. Note that heat-conductive rubber 19 may also be provided on collets 5 of other embodiments.

[0020] Embodiment 2 11 is a cross-sectional view showing a semiconductor inspection device according to embodiment 2. A circulation mechanism 20 that circulates dry air or cooling water inside the collet 5 is provided as the second heat dissipation mechanism 16. The circulation mechanism 20 is a flexible hose, and moves in accordance with the up and down movement of the collet 5.

[0021] The heat absorbed by the GND block 13 from the underside of the semiconductor element 1 is dissipated by the heat sink 15. The heat absorbed by the collet 5 from the top surface of the semiconductor element 1 is dissipated by the circulation mechanism 20. This ensures heat dissipation during characteristic testing regardless of whether the heat dissipation surface of the semiconductor element 1 is the top or bottom surface. Other configurations and effects are the same as those of the first embodiment.

[0022] Embodiment 3 12 to 14 are cross-sectional views showing a semiconductor inspection device according to embodiment 3. Figs. 12 and 13 show the case where the semiconductor element 1 has a back surface heat dissipation structure, and Fig. 14 shows the case where the semiconductor element 1 has a top side cooling structure. Fig. 12 shows the state where the semiconductor element 1 has been picked up. Figs. 13 and 14 show the state where the semiconductor element 1 is pressed against the inspection jig 11.

[0023] The first heat dissipation mechanism 14 has a heat sink 15 and a vapor chamber 21 that thermally connects the GND block 13 and the heat sink 15. The second heat dissipation mechanism 16 has a heat sink 22 and a vapor chamber 23 that thermally connects the collet 5 and the heat sink 22.

[0024] Heat absorbed by the GND block 13 from the underside of the semiconductor element 1 is dissipated from the heat sink 15 via the vapor chamber 21. Heat absorbed by the collet 5 from the upper surface of the semiconductor element 1 is dissipated from the heat sink 22 via the vapor chamber 23. This ensures heat dissipation during characteristic testing regardless of whether the heat dissipation surface of the semiconductor element 1 is the upper or lower surface. Furthermore, the use of the vapor chambers 21 and 23 increases the design freedom for the placement of the heat sinks 15 and 22. Other configurations and effects are the same as those of the first embodiment.

[0025] Embodiment 4 15 and 16 are cross-sectional views showing a semiconductor inspection device according to embodiment 4. Fig. 15 shows the case where the semiconductor element 1 has a back surface heat dissipation structure, and Fig. 16 shows the case where the semiconductor element 1 has a top side cooling structure. Both figures show the state where the semiconductor element 1 is pressed against the inspection jig 11.

[0026] The first heat dissipation mechanism 14 further includes a Peltier cooler 24 provided between the GND block 13 and the heat sink 15. The Peltier cooler 24 promotes heat transfer from the GND block 13 to the heat sink 15, further improving the heat dissipation capability of the first heat dissipation mechanism 14.

[0027] A Peltier cooler 25 is provided between the collet 5 and the spring 9 as a second heat dissipation mechanism 16. The underside of the Peltier cooler 25 contacts the collet 5, and heat dissipation fins 17 are provided on the upper surface of the Peltier cooler 25. The Peltier cooler 25 promotes heat transfer from the collet 5 to the upper surface side of the Peltier cooler 25, and the heat dissipation fins 17 dissipate the heat. This ensures heat dissipation during characteristic testing regardless of whether the heat dissipation surface of the semiconductor element 1 is the upper or lower surface. Other configurations and effects are the same as those of the first embodiment.

[0028] Fifth embodiment 17 and 18 are cross-sectional views showing a semiconductor inspection device according to embodiment 5. Fig. 17 shows a state in which a semiconductor element 1 has been picked up, and Fig. 18 shows a state in which the semiconductor element 1 is being pressed against an inspection jig 11.

[0029] The second heat dissipation mechanism 16 has an inclined portion 26 provided on the inspection jig 11 and a positioning plate 28 provided on the underside of the pressing jig 10 via rails 27. The positioning plate 28 is movable laterally along the rails 27. When the pressing jig 10 is lowered and the inclined surface of the positioning plate 28 is pressed against the inclined surface of the inclined portion 26, the positioning plate 28 moves laterally and comes into contact with the sides of the semiconductor element 1 and the collet 5. This allows the positioning plate 28 to position the semiconductor element 1. Heat absorbed by the collet 5 from the top surface of the semiconductor element 1 is dissipated from the heat sink 15 via the thermally connected positioning plate 28, inclined portion 26, and inspection jig 11. This ensures heat dissipation during characteristic testing regardless of whether the heat dissipation surface of the semiconductor element 1 is the top or bottom surface. Other configurations and effects are the same as those of the first embodiment.

[0030] Sixth embodiment 19 and 20 are cross-sectional views showing a semiconductor inspection device according to embodiment 6. Fig. 19 shows a state in which a semiconductor element 1 has been picked up, and Fig. 20 shows a state in which the semiconductor element 1 is being pressed against an inspection jig 11.

[0031] A recess 29 is provided on the underside of the collet 5. Suction holes 7 are provided on the underside of the collet 5 outside the recess 29. A heat dissipation block 30 is provided in the recess 29 of the collet 5 as a second heat dissipation mechanism 16. The heat dissipation block 30 comes into contact with both the collet 5 and the semiconductor element 1 when the collet 5 adsorbs the semiconductor element 1. Heat is dissipated from the top surface of the semiconductor element 1 via the heat dissipation block 30 and the collet 5 that are in contact with each other.

[0032] Because the heat dissipation block 30 is independent of the suction function of the collet 5, a material with high thermal conductivity can be selected for the heat dissipation block 30. The heat dissipation block 30 is easy to process because it does not interfere with the vacuum piping of the collet 5. The other configurations and effects are the same as those of the first embodiment.

[0033] Embodiment 7 21 is a cross-sectional view showing a semiconductor inspection device according to the seventh embodiment. The heat dissipation block 30 is water-cooled. A water pipe 31 circulates cold water inside the heat dissipation block 30. The water pipe 31 is a flexible hose, and moves in accordance with the vertical movement of the heat dissipation block 30 relative to the collet 5. This further improves the heat dissipation capacity of the heat dissipation block 30. The other configurations and effects are the same as those of the sixth embodiment. [Explanation of symbols]

[0034] REFERENCE SIGNS LIST 1 semiconductor element, 4 heat sink, 5 collet, 6 suction portion, 10 pressing jig, 11 inspection jig, 12 inspection terminal, 13 GND block, 14 first heat dissipation mechanism, 15 heat sink, 16 second heat dissipation mechanism, 17 heat dissipation fin, 18 protrusion, 20 circulation mechanism, 23 vapor chamber, 25 Peltier cooler, 26 inclined portion, 28 positioning plate, 29 recess, 30 heat dissipation block

Claims

1. A collet that attracts the upper surface of the semiconductor element, An inspection jig having an inspection terminal connected to an electrode on the lower surface of the semiconductor element and a GND block in contact with the lower surface of the semiconductor element, A first heat dissipation mechanism for dissipating heat from the inspection jig, A semiconductor inspection apparatus characterized by comprising a second heat dissipation mechanism for dissipating heat from the collet.

2. If a heat sink is provided on the lower surface of the semiconductor element, the GND block will be in contact with the heat sink. The semiconductor inspection apparatus according to claim 1, characterized in that the collet contacts the heat sink when the heat sink is provided on the upper surface of the semiconductor element.

3. The collet has an adsorption portion for adsorbing the semiconductor element, The semiconductor inspection apparatus according to claim 1 or 2, characterized in that the second heat dissipation mechanism has heat dissipation fins provided on the upper surface of the adsorption portion.

4. The collet has an adsorption portion for adsorbing the semiconductor element and an overhang portion that extends from the side of the adsorption portion. The semiconductor inspection apparatus according to claim 1 or 2, characterized in that the second heat dissipation mechanism has heat dissipation fins provided on the protruding portion.

5. The semiconductor inspection apparatus according to claim 1 or 2, characterized in that the second heat dissipation mechanism has a circulation mechanism for circulating dry air or cooling water inside the collet.

6. The semiconductor inspection apparatus according to claim 1 or 2, characterized in that the second heat dissipation mechanism comprises a heat sink and a vapor chamber that thermally connects the collet and the heat sink.

7. The semiconductor inspection apparatus according to claim 1 or 2, characterized in that the second heat dissipation mechanism has a Peltier cooler.

8. The system further comprises a pressing jig for pressing down the collet, The second heat dissipation mechanism includes an inclined portion provided on the inspection jig and a positioning plate provided on the lower surface of the pressing jig so as to be movable in the lateral direction for positioning the semiconductor element. The semiconductor inspection apparatus according to claim 1 or 2, characterized in that when the pressing jig is lowered and the positioning plate is pressed against the inclined portion, the positioning plate moves laterally and comes into contact with the semiconductor element and the side surface of the collet.

9. A recess is provided on the lower surface of the collet, The semiconductor inspection apparatus according to claim 1 or 2, wherein the second heat dissipation mechanism has a heat dissipation block disposed in the recess of the collet, which contacts both the collet and the semiconductor element when the collet adsorbs the semiconductor element.

10. The semiconductor inspection apparatus according to claim 9, characterized in that the heat dissipation block is water-cooled.

11. The semiconductor inspection apparatus according to claim 1 or 2, characterized in that the collet is a metal collet.

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