Substrate processing device

Abstract

The substrate processing device (1) comprises a material block (5), a processing block (7), and a buffer section (33). The material block (5) comprises a batch transport mechanism (HTR) for receiving a substrate (W) in a carrier (C), and a first position conversion mechanism (15) for converting the substrate (W) to a vertical position. The processing block (7) comprises a batch processing area (R1), a single-wafer processing area (R3), a single-wafer substrate transport area (R2), and a batch substrate transport area (R4). In the batch processing area (R1), a batch processing tank (BT1 to BT6) and a second position conversion mechanism (31) for converting the substrate (W) to a horizontal position are formed. In the single-wafer processing area (R3), for example, a single-wafer processing chamber (SW1) is formed. A center robot (CR) is formed in the single-wafer substrate transport area (R2). A first transport mechanism (WTR1) is formed in the batch substrate transport area (R4). The batch transport mechanism (HTR) transports the substrate (W) to the first position change mechanism (15) and transports the substrate (W) from the buffer section (33).

Description

Technology Field

[0001] The present invention relates to a substrate processing apparatus for processing a substrate. Examples of substrates include semiconductor substrates, substrates for FPDs (Flat Panel Displays), glass substrates for photomasks, substrates for optical discs, substrates for magnetic discs, ceramic substrates, substrates for solar cells, etc. Examples of FPDs include liquid crystal display devices, organic EL (electroluminescence) display devices, etc. Background Technology

[0002] As a conventional substrate processing device, there is a hybrid substrate processing device equipped with a batch processing module (batch processing unit) that processes multiple substrates in batches and a single-wafer processing module (single-wafer processing unit) that processes the substrates processed by the batch processing module one by one (see, for example, Patent Documents 1 and 2).

[0003] The substrate processing device of Patent Document 1 comprises a load port used to receive a cassette, a first robot, two rotation mechanisms for rotating a wafer between a vertical position and a horizontal position, two sets arranged in a line between the two rotation mechanisms, a second robot capable of transporting a wafer in a vertical position between the two rotation mechanisms and the two sets, a plurality of single-wafer cleaning modules for performing cleaning and drying, and a third robot.

[0004] Multiple single-wafer cleaning modules are arranged in a line. A first robot extracts five wafers at a time from a cassette and returns these five wafers to a first rotary mechanism. A third robot extracts a wafer from a second rotary mechanism and returns the wafer to a single-wafer cleaning module. The first robot extracts one wafer from one of the multiple single-wafer cleaning modules and returns the wafer to the cassette.

[0005] The substrate processing device of Patent Document 2 comprises an input / output section having a cassette holder, a single-wafer processing section (region), an interface section, and a batch processing section (region). Additionally, the substrate processing device of Patent Document 3 comprises an orientation changing mechanism. Prior art literature

[0006] Japanese Published Patent Application No. 2016-502275, Japanese Published Patent Application No. 2021-064652, Japanese Published Patent Application No. 2018-056341 The problem to be solved

[0007] Conventional substrate processing devices have the following problems. For example, in the substrate processing device of Patent Document 1, the first robot moves along a plurality of single-wafer cleaning modules, extracts five wafers at a time from a cassette, and returns these five wafers to a first rotary mechanism. Additionally, the first robot moves along a plurality of single-wafer cleaning modules, extracts one wafer from one of the plurality of single-wafer cleaning modules, and returns the wafer to the cassette. As a result, the first robot is busy, and there is a possibility that it reduces the throughput of the substrate processing device.

[0008] In addition, in the substrate processing apparatus of Patent Document 2, the input / output section, the single-wafer processing section, the interface section, and the batch processing section are arranged in sequence. Therefore, in order to transfer a substrate from the input / output section to the batch processing section, it is necessary to pass it through the single-wafer processing section. Consequently, there is a possibility that the throughput of the substrate processing apparatus is reduced.

[0009] The present invention is made in consideration of such circumstances and aims to provide a substrate processing apparatus capable of improving throughput. means of solving the problem

[0010] To achieve this objective, the present invention takes the following configuration. That is, the substrate processing apparatus related to the present invention is a substrate processing apparatus that continuously performs batch processing, which processes a plurality of substrates collectively, and single-wafer processing, which processes substrates one by one, and comprises a stoker block, a transfer block adjacent to the stoker block, a processing block adjacent to the transfer block, and a substrate placement section for placing a plurality of substrates in a horizontal position at a predetermined distance in a vertical direction, wherein the stoker block accommodates at least one carrier for storing a plurality of substrates in a horizontal position at the predetermined distance in a vertical direction, and comprises at least one carrier placement shelf for substrate extraction and storage on which the carrier is placed for the extraction and storage of substrates from the carrier, wherein the transfer block comprises a substrate handling mechanism for extracting and storing a plurality of substrates collectively from a carrier placed on the carrier placement shelf, and a first position conversion mechanism for converting the position of a plurality of substrates collectively from a horizontal position to a vertical position, and wherein the processing block is a batch processing extending in a direction away from the transfer block. The apparatus comprises a region, a single-wafer processing region having one end located close to the aforementioned material block and the other end extending in a direction away from the aforementioned material block, a single-wafer substrate transport region interposed between the batch processing region and the single-wafer processing region, having one end adjacent to the aforementioned material block and the other end extending in a direction away from the aforementioned material block, and a batch substrate transport region formed along the batch processing region, having one end extending to the aforementioned material block and the other end extending in a direction away from the aforementioned material block, wherein the batch processing region comprises a plurality of batch processing tanks arranged in a direction in which the region extends to collectively immerse and process a plurality of substrates, and furthermore, a second orientation conversion mechanism formed to collectively convert the orientation of a plurality of substrates from a vertical orientation to a horizontal orientation, and wherein the single-wafer processing region comprisesA single-wafer processing chamber is formed to process substrates one by one in the direction in which the area extends, and in the single-wafer substrate transport area, a single-wafer substrate transport mechanism is formed to transport substrates between the second position changing mechanism, the single-wafer processing chamber, and the substrate placement section, and in the batch substrate transport area, a batch substrate transport mechanism is formed to transport multiple substrates collectively between a predetermined substrate receiving position within the transfer block, the plurality of batch processing tanks, and the second position changing mechanism, and furthermore, the substrate handling mechanism of the transfer block is characterized by transporting multiple substrates collectively to the first position changing mechanism and also transporting multiple substrates collectively from the substrate placement section.

[0011] According to the substrate processing apparatus related to the present invention, a batch processing area, a single-wafer processing area, and a single-wafer substrate transport area are formed to extend from the material block side. A plurality of batch processing tanks are arranged in the direction in which the batch processing area extends. Additionally, a plurality of single-wafer processing chambers are arranged in the direction in which the single-wafer processing area extends. Furthermore, a single-wafer substrate transport mechanism is formed in a single-wafer substrate transport area that is fitted between the plurality of batch processing tanks and the plurality of single-wafer processing chambers. The batch substrate transport mechanism is formed in the batch substrate transport area along the plurality of batch processing tanks. Accordingly, the substrate processing apparatus of the present invention can transport substrates smoothly.

[0012] This will be explained in detail. The substrate handling mechanism of the material block can collectively extract multiple substrates from a carrier and collectively transfer the multiple substrates to a first position change mechanism. Additionally, the batch substrate transfer mechanism transfers multiple substrates between the substrate receiving position, the batch processing tank, and the second position change mechanism. Additionally, the single-wafer substrate transfer mechanism transfers substrates between the second position change mechanism, the single-wafer processing chamber, and the substrate placement section. Furthermore, the substrate handling mechanism collectively receives multiple substrates from the substrate placement section and collectively stores the multiple substrates in a carrier.

[0013] Therefore, multiple substrates can be directly transferred from the transfer block to the batch processing area without being transferred to the single-wafer processing area before being transferred to the batch substrate processing area. In addition, the substrate handling mechanism transfers multiple substrates in bulk between the carrier, the first position change mechanism, and the substrate placement section without accessing each single-wafer processing chamber. As a result, multiple substrates can be quickly transferred from the carrier to the first position change mechanism, and multiple substrates can be quickly transferred from the substrate placement section to the carrier. Accordingly, the substrate processing device of the present invention can smoothly transfer substrates. Therefore, throughput can be improved.

[0014] In addition, in the substrate processing device described above, it is preferable that the second position change mechanism be formed on the opposite side of the material block via the plurality of batch processing tanks.

[0015] While performing batch processing by the batch processing unit, multiple substrates can be transferred from the transfer block to the second position change mechanism, and then, while performing single-wafer processing by the single-wafer processing chamber, multiple substrates can be transferred from the second position change mechanism to the transfer block. Therefore, multiple substrates can be transferred in a circular motion within the processing block, and thereby, the substrates can be transferred smoothly.

[0016] In addition, in the substrate processing device described above, it is preferable that the second position changing mechanism be formed between two of the plurality of batch processing tanks.

[0017] Since the second position change mechanism is formed between the two batch processing tanks, the distance from the second position change mechanism to each single-wafer processing chamber can be made relatively uniform. Therefore, the single-wafer substrate transport mechanism can transport the substrate starting from near the center of the single-wafer substrate transport area. As a result, the travel distance of the single-wafer substrate transport mechanism can be reduced, thereby improving the transport efficiency of the substrate.

[0018] In addition, in the substrate processing apparatus described above, it is preferable that the second position changing mechanism be formed between the material transfer block and the plurality of batch processing tanks. By doing so, the second position changing mechanism is positioned near the material transfer block. Therefore, the substrate can be transported starting from the material transfer block side.

[0019] In addition, in the substrate processing apparatus described above, it is preferable that the substrate placement portion be fixedly formed at the boundary between the transfer block and the single-wafer substrate transport area, the transfer block, and the single-wafer substrate transport area. Since the substrate placement portion is fixedly formed without moving, the configuration of the substrate placement portion and its surroundings can be simplified.

[0020] In addition, the substrate processing device described above is further provided with a placement unit moving mechanism, wherein the substrate placement unit is formed to be movable to the single-wafer substrate transport area, and the placement unit moving mechanism preferably moves the substrate placement unit in the direction in which the single-wafer substrate transport area extends. Since the placement unit is moved by the placement unit moving mechanism, the single-wafer substrate transport mechanism does not need to move to the vicinity of the substrate handling mechanism, thereby improving the substrate transport efficiency.

[0021] In addition, in the substrate processing apparatus described above, the placement unit moving mechanism follows the single-wafer substrate transport mechanism ( It is preferable to move the substrate placement portion in the direction in which the single-wafer substrate transport area is extended so as to ) follow the single-wafer substrate transport mechanism ( Since the substrate placement area is moved in this way, the single-wafer substrate transport mechanism can quickly transport the substrate to the substrate placement area.

[0022] In addition, in the substrate processing apparatus described above, the single-wafer substrate transport mechanism comprises a mechanism body and an upper rail formed above the single-wafer substrate transport area and also following the single-wafer substrate transport area, and the mechanism body is preferably configured to move along the upper rail while being suspended from the upper rail. This prevents droplets falling from a wet substrate from contaminating the mechanism body (e.g., a moving part and a lifting / rotating part). For example, there is a risk that the single-wafer substrate transport mechanism may malfunction if the mechanism body is contaminated by droplets, but this can be prevented.

[0023] In addition, in the substrate processing apparatus described above, the second orientation conversion mechanism preferably comprises a substrate holding unit that holds a plurality of substrates in a vertical orientation conveyed by the batch substrate conveying unit, a substrate extraction mechanism capable of extracting two or more substrates from the plurality of substrates held by the substrate holding unit, and an orientation conversion unit that collectively converts the orientation of the two or more substrates extracted by the substrate extraction mechanism from a vertical orientation to a horizontal orientation. Thus, for the two or more substrates extracted by the substrate extraction mechanism, the orientation conversion unit can perform an orientation conversion. Effects of the invention

[0024] According to the substrate processing device related to the present invention, throughput can be improved. Brief explanation of the drawing

[0025] FIG. 1 is a plan view showing the schematic configuration of a substrate processing apparatus related to Example 1. Figure 2 is a side view showing a batch return mechanism. Figures 3 (a) to (f) are side views for explaining the posture conversion part and the pusher mechanism in the material block. Figure 4 (a) is a plan view showing the second attitude change mechanism, and (b) is a front view showing the second attitude change mechanism. FIG. 5 is a side view illustrating the second return mechanism and the attitude changer. Figure 6 (a) is a plan view showing the auxiliary chuck opening / closing part of the posture changing part, and (b) is a side view showing the forward / backward part of the posture changing part. Figures 7 (a) and (b) are diagrams for explaining the operation of the forward and backward movement of the posture change unit. Figure 8 is a flowchart for explaining the operation of a substrate processing device. Figure 9 is a flowchart illustrating the overall operation of the second posture conversion mechanism. Figure 10 is a flowchart illustrating the operation of the latter part of the second posture conversion mechanism. Figures 11 (a) to (d) are plan views for explaining the operation of the second attitude change mechanism. Figures 12 (a) to (d) are front views illustrating the operation of the second posture change mechanism. Figures 13 (a) and (b) are plan views for explaining the operation of the second attitude change mechanism, and (c) and (d) are front views for explaining the operation of the second attitude change mechanism. Figure 14 (a) is a longitudinal section view showing a pusher mechanism of a second posture change mechanism related to Example 2, and (b) is a plan view showing a second posture change mechanism related to Example 2. FIG. 15 is a plan view showing the schematic configuration of a substrate processing device related to Example 3. Figures 16 (a) and (b) are side views for explaining the buffer section related to Example 3. FIG. 17 is a plan view showing the schematic configuration of a substrate processing device related to Example 4. FIG. 18 is a plan view showing the schematic configuration of a substrate processing apparatus related to Example 5. FIG. 19 is a plan view showing the schematic configuration of a substrate processing device related to a modified example. FIG. 20 is a side view showing a ceiling-suspended center robot related to a modified example. Specific details for implementing the invention

[0026] Example 1

[0027] Hereinafter, Example 1 of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the schematic configuration of a substrate processing apparatus (1) related to Example 1. FIG. 2 is a side view showing a batch transport mechanism (HTR). FIG. 3(a) to FIG. 3(f) are side views for explaining the orientation changer and the pusher mechanism in the material block.

[0028] <1. Overall Composition>

[0029] Refer to FIG. 1. A substrate processing device (1) comprises a stoker block (3), a material block (5), and a processing block (7). The stoker block (3), the material block (5), and the processing block (7) are arranged in a single row in the horizontal direction in sequence.

[0030] The substrate processing device (1) performs, for example, chemical treatment, cleaning treatment, drying treatment, etc. on the substrate (W). The substrate processing device (1) performs batch processing and single-wafer processing in succession on the substrate (W). That is, after performing batch processing, the substrate processing device (1) performs single-wafer processing on the substrate (W). Batch processing is a processing method that processes multiple substrates (W) in batches. Single-wafer processing is a processing method that processes substrates (W) one by one.

[0031] In this specification, for convenience, the direction in which the stoker block (3), material block (5), and processing block (7) are arranged is referred to as the "front-back direction (X)." The front-back direction (X) is horizontal. Among the front-back direction (X), the direction from the material block (5) toward the stoker block (3) is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-back direction (X) is referred to as the "width direction (Y)." One direction of the width direction (Y) is appropriately referred to as the "right direction." The direction opposite to the right direction is referred to as the "left direction." The direction perpendicular to the horizontal direction is referred to as the "vertical direction (Z)." For example, in FIG. 1, the front, back, right, left, up, and down directions are appropriately indicated for reference.

[0032] <2. Stalker Block>

[0033] The stoker block (3) accommodates at least one carrier (C). One or more (e.g., two) load ports (9) are formed in the stoker block (3). The stoker block (3) is equipped with a carrier conveying mechanism (robot) (11) and a shelf (13).

[0034] The carrier conveying mechanism (11) conveys the carrier (C) between the load port (9) and the shelf (13). The carrier conveying mechanism (11) is equipped with a gripping part that grips a protrusion on the upper surface of the carrier (C), or a hand that supports the carrier (C) while in contact with the bottom surface of the carrier (C). The shelf (13) is classified into a shelf (13A) for taking out and storing a substrate (W) and a shelf (13B) for storage.

[0035] A shelf (13A) is positioned adjacent to the material block (5). A mechanism for attaching and detaching the cover portion of the carrier (C) may be formed on the shelf (13A). At least one shelf (13A) is formed. The carrier (C) is placed on the shelf (13A). The carrier (C) stores multiple substrates (W) in a horizontal position at a predetermined interval (e.g., 25 substrates) in a vertical direction (Z). Additionally, the substrates (W) are aligned in the thickness direction of the substrates (W). For example, a FOUP (Front Opening Unify Pod) is used as the carrier (C). The FOUP is a sealed container. The carrier (C) may be an open container, and the type is irrelevant. Additionally, the shelf (13A) corresponds to the carrier placement shelf of the present invention.

[0036] <3. Lee Jae Block>

[0037] The material block (5) is positioned adjacent to the rear (X) of the stoker block (3). The material block (5) is equipped with a batch conveying mechanism (robot) (HTR) and a first position change mechanism (15). Additionally, the batch conveying mechanism (HTR) corresponds to the substrate handling mechanism of the present invention.

[0038] The batch return mechanism (HTR) is formed on the right (Y) side within the material block (5). The batch return mechanism (HTR) returns multiple substrates (W) in a horizontal position (e.g., 25 substrates) in a batch. The batch return mechanism (HTR) retrieves and stores multiple substrates (W) in a batch from a carrier (C) placed on a shelf (13A). Additionally, the batch return mechanism (HTR) is configured to be able to receive multiple substrates (W) in a batch between the first position change mechanism (15) and the buffer unit (33) described later. That is, the batch return mechanism (HTR) can return multiple substrates (W) between the carrier (C) placed on the shelf (13A), the first position change mechanism (15), and the buffer unit (33).

[0039] Refer to FIG. 2. The batch return mechanism (HTR) is equipped with a plurality (e.g., 25) of hands (17). In FIG. 2, for convenience of illustration, the batch return mechanism (HTR) is equipped with three hands (17). Each hand (17) holds one substrate (W).

[0040] Additionally, the collective conveying mechanism (HTR) is equipped with a hand support part (19), a forward / backward part (20), and a lifting / rotating part (21). The hand support part (19) supports a plurality of hands (17). Thus, the plurality of hands (17) move as a whole. The forward / backward part (20) advances and retracts the plurality of hands (17) through the hand support part (19). The lifting / rotating part (21) rotates the plurality of hands (17), etc., around the vertical axis (AX1) by rotating the forward / backward part (20) around the vertical axis (AX1). Additionally, the lifting / rotating part (21) raises and lowers the plurality of hands (17), etc., by raising and lowering the forward / backward part (20). The lifting / rotating part (21) is fixed to the floor surface. That is, the lifting / rotating part (21) does not move in the horizontal direction. Additionally, the forward / backward section (20) and the lifting / rotating section (21) are each equipped with an electric motor. Furthermore, the batch conveying mechanism (HTR) may be equipped with a hand (not shown) for conveying one substrate (W) separately from the hand (17) and the hand support section (19).

[0041] Refer to FIG. 1. The first orientation change mechanism (15) converts the orientation of a plurality of substrates (W) from a horizontal orientation to a vertical orientation in a batch. The first orientation change mechanism (15) is equipped with an orientation change unit (23) and a pusher mechanism (25). In FIG. 1, the batch transport mechanism (HTR), the orientation change unit (23), and the pusher mechanism (25) are arranged in order to the left (Y). FIG. 3(a) to FIG. 3(f) are drawings for explaining the first orientation change mechanism (15).

[0042] As shown in FIG. 1 and FIG. 3(a), the posture changing unit (23) comprises a support (23A), a pair of horizontal holding members (23B), a pair of vertical holding members (23C), and a rotary driving unit (23D). A pair of horizontal holding members (23B) and a pair of vertical holding members (23C) are formed on the support (23A). The horizontal holding members (23B) and the vertical holding members (23C) receive a plurality of substrates (W) that are conveyed by a batch conveying mechanism (HTR). When the substrate (W) is in a horizontal posture, a pair of horizontal holding members (23B) support the substrate (W) from below while in contact with the lower surface of each substrate (W). Also, when the substrate (W) is in a vertical posture, a pair of vertical holding members (23C) hold the substrate (W).

[0043] The rotary drive unit (23D) rotatably supports the support (23A) around the horizontal axis (AX2). Additionally, the rotary drive unit (23D) changes the position of the multiple substrates (W) held in the holding unit (23B, 23C) from horizontal to vertical by rotating the support (23A) around the horizontal axis (AX2).

[0044] As shown in FIGS. 1 and FIGS. 3(f), the pusher mechanism (25) comprises a pusher (25A), a lifting rotating part (25B), a horizontal moving part (25C), and a rail (25D). The pusher (25A) supports the lower portion of each of a plurality of substrates (W) in a vertical position (e.g., 50 substrates). Additionally, in FIGS. 3(a) to FIGS. 3(f), for convenience of illustration, the pusher (25A) is configured to support 6 substrates (W).

[0045] The lifting rotation part (25B) is connected to the lower surface of the pusher (25A). The lifting rotation part (25B) raises the pusher (25A) in the up and down direction by extending and retracting. Also, the lifting rotation part (25B) rotates the pusher (25A) around the vertical axis (AX3). The horizontal movement part (25C) supports the lifting rotation part (25B). The horizontal movement part (25C) moves the pusher (25A) and the lifting rotation part (25B) horizontally along the rail (25D). The rail (25D) is formed to extend in the width direction (Y). Additionally, the rotation drive part (23D), the lifting rotation part (25B), and the horizontal movement part (25C) are each equipped with an electric motor.

[0046] Here, the operation of the first orientation change mechanism (15) is explained. The batch processing group (BT1 to BT6) described later in the processing block (7) processes 50 substrates (W) in batches, for example, two sets of carriers (C). The first orientation change mechanism (15) changes the orientation of the 50 substrates (W) in batches of 25. In addition, the first orientation change mechanism (15) arranges multiple substrates (W) in a face-to-face manner at a predetermined interval (half pitch). The half pitch is, for example, a 5 mm interval. The pusher mechanism (25) conveys these 50 substrates (W) to the first conveying mechanism (WTR1).

[0047] Additionally, 25 substrates (W) in the first carrier (C) are described as substrates (W1) of the first substrate group. 25 substrates (W) in the second carrier (C) are described as substrates (W2) of the second substrate group. Also, in FIGS. 3(a) to 3(f), for the sake of illustration, the number of substrates (W1) of the first substrate group is 3, and the number of substrates (W2) of the second substrate group is 3. Also, when there is no particular distinction between substrate (W1) and substrate (W2), substrates (W1 and W2) are described as "substrates (W)."

[0048] Refer to FIG. 3(a). The orientation changer (23) receives 25 substrates (W1) of a first substrate group, which are conveyed by a batch conveying mechanism (HTR), from the holding unit (23B, 23C). At this time, the 25 substrates (W1) are in a horizontal orientation, and the device surface is facing upward. The 25 substrates (W1) are arranged at a predetermined interval (full pitch). The full pitch is, for example, 10 mm interval. The full pitch is also called the normal pitch.

[0049] Also, a half pitch is a spacing that is half the length of a full pitch. Also, the device surface of a substrate (W (W1, W2)) is the surface where an electronic circuit is formed and is called the "surface." Also, the back surface of a substrate (W) refers to the surface where no electronic circuit is formed. The back surface is the surface opposite to the device surface.

[0050] Refer to FIG. 3(b). The orientation changer (23) rotates the holding member (23B, 23C) by 90 degrees around the horizontal axis (AX2) to change the orientation of 25 substrates (W1) from horizontal to vertical. Refer to FIG. 3(c). The pusher mechanism (25) raises the pusher (25A) to a position higher than the holding member (23B, 23C) of the orientation changer (23). By doing so, the pusher (25A) receives 25 substrates (W) from the holding member (23B, 23C). The 25 substrates (W1) held by the pusher (25A) face to the left (Y). In addition, among FIGS. 3(a) to 3(f), the arrow (AR) given to the substrate (W) indicates the direction of the device surface of the substrate (W).

[0051] Refer to FIG. 3(d). The pusher mechanism (25) rotates 25 substrates (W) in a vertical position 180 degrees around the vertical axis (AX3). As a result, the 25 substrates (W1) are inverted and face to the right (Y). Additionally, the inverted 25 substrates (W1) move to the left (Y) by a half-pitch (e.g., 5 mm) from their position before rotation. Furthermore, the holding parts (23B, 23C) of the position change unit (23) are rotated -90 degrees around the horizontal axis (AX2) to a state where the next substrate (W2) can be received. After that, the position change unit (23) receives the 25 substrates (W2) of the second group of substrates, which were transported by the batch transport mechanism (HTR), from the holding parts (23B, 23C). At this time, the 25 substrates (W2) are in a horizontal position, and the device surface is upward. Also, the position conversion unit (23) and the pusher mechanism (25) are operated so as not to interfere with each other.

[0052] Refer to FIG. 3(e). The pusher mechanism (25) lowers the pusher (25A) holding the 25 substrates (W1) of the first substrate group to a retracted position. Then, the position changing unit (23) changes the position of the 25 substrates (W2) from horizontal to vertical. After the position change, the 25 substrates (W2) face left (Y). Refer to FIG. 3(f). Then, the pusher mechanism (25) raises the pusher (25A) holding the 25 substrates (W2) of the second substrate group. By doing so, the pusher mechanism (25) receives an additional 25 substrates (W2) from the position changing unit (23).

[0053] Thus, the pusher (25A) holds 50 substrates (W (W1, W2)) of the first substrate group and the second substrate group. The 50 substrates (W) are arranged such that 25 substrates (W1) and 25 substrates (W2) are arranged alternately. The 50 substrates (W) are arranged at a half pitch (e.g., 5 mm interval). Additionally, the 25 substrates (W1) are oriented in the opposite direction to the 25 substrates (W2). Therefore, the 50 substrates (W) are arranged in a face-to-face manner. That is, two adjacent substrates (W1, W2) have two device faces (or two back faces) facing each other.

[0054] After that, the pusher mechanism (25) moves the pusher (25A), which holds 50 substrates (W), along the rail (25D) to the substrate receiving position (PP) below the pair of chucks (49, 50) of the first conveying mechanism (WTR1).

[0055] <4. Processing Block (7)>

[0056] The processing block (7) is adjacent to the material block (5). The processing block (7) is positioned at the rear (X) of the material block (5). The processing block (7) includes a batch processing area (R1), a single-wafer substrate transport area (R2), a single-wafer processing area (R3), and a batch substrate transport area (R4). The substrate processing device (1) includes an electric field area (R5).

[0057] <4-1. Batch Processing Area (R1)>

[0058] The batch processing area (R1) is adjacent to the material block (5), the single-wafer substrate transport area (R2), and the batch substrate transport area (R4). Additionally, the batch processing area (R1) is positioned between the single-wafer substrate transport area (R2) and the batch substrate transport area (R4). One end of the batch processing area (R1) is adjacent to the material block (5), and the other end of the batch processing area (R1) extends in a direction away from the material block (5), i.e., in the rear (X).

[0059] In the batch processing area (R1), for example, six batch processing tanks (BT1 to BT6) and a second position changing mechanism (31) are formed. The six batch processing tanks (BT1 to BT6) are arranged in a line in the front-rear direction (X) where the batch processing area (R1) extends. Also, the second position changing mechanism (31) is positioned on the opposite side of the material block (5) with the six batch processing tanks (BT1 to BT6) interposed. That is, the six batch processing tanks (BT1 to BT6) are positioned between the material block (5) and the second position changing mechanism (31). Also, the second position changing mechanism (31) (pusher mechanism (61)) is positioned on the extension line of the row of the six batch processing tanks (BT1 to BT6). In addition, the number of batch processing tanks is not limited to 6, and multiple numbers are acceptable.

[0060] Each of the six batch treatment tanks (BT1 to BT6) immerses and treats multiple substrates (W) in a vertical position in batches. For example, the six batch treatment tanks (BT1 to BT6) consist of four chemical treatment tanks (BT1 to BT4) and two water washing treatment tanks (BT5, BT6). Specifically, two chemical treatment tanks (BT1, BT2) and a water washing treatment tank (BT5) form one set. Then, two chemical treatment tanks (BT3, BT4) and a water washing treatment tank (BT6) form another set.

[0061] Four chemical treatment tanks (BT1 to BT4) each perform etching treatment with a chemical solution. For example, phosphoric acid is used as the chemical solution. Chemical treatment tank (BT1) stores the chemical solution supplied from a chemical discharge pipe not shown. The chemical discharge pipe is formed on the inner wall of the chemical treatment tank (BT1). Three chemical treatment tanks (BT2 to BT4) are each configured in the same way as chemical treatment tank (BT1).

[0062] Each of the two rinsing tanks (BT5, BT6) performs a pure water cleaning treatment to wash away the chemical solution attached to the multiple substrates (W) with pure water. For example, deionized water (DIW) is used as the pure water. Each of the two rinsing tanks (BT5, BT6) stores pure water supplied from a cleaning solution discharge pipe not shown. The cleaning solution discharge pipe is formed on the inner wall of each rinsing tank (BT5, BT6).

[0063] Six lifters (LF1 to LF6) are formed in each of the six batch processing tanks (BT1 to BT6). For example, a lifter (LF1) holds multiple substrates (W) in a vertical position arranged at a predetermined interval (half pitch). Additionally, the lifter (LF1) raises and lowers the multiple substrates (W) between a processing position inside the batch processing tank (chemical processing tank) (BT1) and a receiving position above the batch processing tank (BT1). The other five lifters (LF2 to LF6) are configured in the same way as the lifter (LF1).

[0064] The second orientation conversion mechanism (31) converts the orientation of multiple substrates (W) from vertical to horizontal in batches. Details of the second orientation conversion mechanism (31) will be described later.

[0065] <4-2. Single-wafer substrate transport area (R2)>

[0066] The single-wafer substrate transport area (R2) is adjacent to the material block (5), batch processing area (R1), single-wafer processing area (R3), and full-length area (R5). Additionally, the single-wafer substrate transport area (R2) is interposed between the batch processing area (R1) and the single-wafer processing area (R3). One end of the single-wafer substrate transport area (R2) is adjacent to the material block (5). Additionally, the other end of the single-wafer substrate transport area (R2) extends in a direction away from the material block (5), i.e., backward (X).

[0067] In the single-wafer substrate transport area (R2), a center robot (CR) and a buffer section (33) are formed. The center robot (CR) transports the substrate between the second position change mechanism (31), the single-wafer processing chambers (SW1 to SW4) described later, and the buffer section (33). The center robot (CR) is equipped with two hands (35), a forward / backward section (37), a lifting / rotating section (39), and a horizontal movement section (41) (including a guide rail).

[0068] Each of the two hands (35) holds one substrate (W) in a horizontal position. The reciprocating unit (37) supports the hands (35) movably and moves the hands (35) back and forth individually. The lifting and rotating unit (39) rotates the hands (35) and the reciprocating unit (37) around a vertical axis (AX11). Additionally, the lifting and rotating unit (39) raises and lowers the hands (35) and the reciprocating unit (37). A guide rail is formed along the direction in which the single-wafer substrate transport area (R2) extends and is formed on the bottom surface of the single-wafer substrate transport area (R2). A horizontal moving unit (41) moves the hands (35) and the reciprocating unit (37), etc., along the guide rail in the forward and backward direction (X). In addition, the forward / backward section (37), the upward / downward rotation section (39), and the horizontal movement section (41) are each equipped with an electric motor.

[0069] For example, the advance / retreat unit (37) advances two hands (35) to extract two substrates (W) from the second position change mechanism (31). Afterward, the advance / retreat unit (37) may advance one hand (35) holding one substrate (W) to return one substrate (W) to one single-wafer processing chamber. Additionally, the center robot (CR) may be equipped with one or three or more hands (35). If three or more hands (35) are equipped, the center robot (CR) advances and retreats the three or more hands (35) individually.

[0070] The buffer section (33) is equipped with a plurality of stacking shelves. Each of the plurality of stacking shelves is in a horizontal position. Each of the plurality of stacking shelves can stack one substrate (W). The buffer section (33) stacks the plurality of substrates (W) in a horizontal position at a predetermined interval (full pitch) in the vertical direction (Z). That is, the plurality of stacking shelves are also arranged in the vertical direction (Z) at a predetermined interval (full pitch). The buffer section (33) is configured to stack at least 25 substrates (W) that can be transported by the batch transport mechanism (HTR). The buffer section (33) is configured to stack, for example, 50 substrates (W).

[0071] Additionally, as shown in FIG. 1, the buffer section (33) is arranged across the material block (5) and the single-wafer substrate transport area (R2), in detail. That is, the buffer section (33) is formed at the boundary between the material block (5) and the single-wafer substrate transport area (R2). Also, the buffer section (33) may be formed only in the material block (5) or the single-wafer substrate transport area (R2). Therefore, the buffer section (33) may be fixedly formed at the boundary between the material block (5) and the single-wafer substrate transport area (R2), the material block (5), and the single-wafer substrate transport area (R2). Since the buffer section (33) is formed fixedly without moving, the configuration of the buffer section (33) and its surroundings can be simplified.

[0072] The buffer section (33) corresponds to the substrate placement section of the present invention. The center robot (CR) corresponds to the single-wafer substrate transport mechanism of the present invention.

[0073] <4-3. Single-wafer processing area (R3)>

[0074] The single-wafer processing area (R3) is adjacent to the single-wafer substrate transport area (R2) and the full-length area (R5). One end of the single-wafer processing area (R3) is located near the material block (5) through the full-length area (R5). In the full-length area (R5), electrical circuits required for the substrate processing device (1) and a control unit (59) described later are formed. Also, the other end of the single-wafer processing area (R3) extends in a direction away from the material block (5), that is, in the rear (X). Also, the single-wafer processing area (R3) is formed along the batch processing area (R1) and the single-wafer substrate transport area (R2).

[0075] In the single-wafer processing area (R3), a plurality (e.g., 4) of single-wafer processing chambers (SW1 to SW4) are formed. The 4 single-wafer processing chambers (SW1 to SW4) are arranged in the front-rear direction (X) where the single-wafer processing area (R3) extends. Each single-wafer processing chamber (SW1 to SW4) processes one substrate (W) at a time. The first single-wafer processing chamber (SW1) is positioned furthest from the material block (5). The second single-wafer processing chamber (SW2) is positioned in front (X) of the first single-wafer processing chamber (SW1). The third single-wafer processing chamber (SW3) is positioned in front (X) of the second single-wafer processing chamber (SW2). The fourth single-wafer processing chamber (SW4) is positioned in front (X) of the third single-wafer processing chamber (SW3). The single-wafer processing chambers (SW1 to SW4) may be composed of multiple stages. For example, 12 single-wafer processing chambers may be arranged in four rows in the front-rear direction (X) (horizontal direction) and three rows in the vertical direction (Z).

[0076] For example, the single-wafer processing chambers (SW1, SW2) each have a rotation processing unit (45) and a nozzle (47). The rotation processing unit (45) has a spin chuck that holds a single substrate (W) in a horizontal position and an electric motor that rotates the spin chuck around a vertical axis passing through the center of the substrate (W). The spin chuck may hold the lower surface of the substrate (W) by vacuum suction. Additionally, the spin chuck may have three or more chuck pins that hold the outer edge of the substrate (W).

[0077] The nozzle (47) supplies a processing liquid to the substrate (W) held in the rotary processing unit (45). The nozzle (47) moves across a standby position away from the rotary processing unit (45) and a supply position above the rotary processing unit (45). For example, pure water (DIW) and IPA (isopropyl alcohol) are used as processing liquids. Each of the single-wafer processing chambers (SW1, SW2) may, for example, perform a cleaning treatment with pure water on the substrate (W) and then perform a preliminary drying treatment with IPA, or form a liquid film of IPA on the upper surface of the substrate (W).

[0078] Each single-wafer processing chamber (SW3, SW4) performs a drying process using, for example, a supercritical fluid. For example, carbon dioxide is used as the fluid. Each single-wafer processing chamber (SW3, SW4) is equipped with a chamber body (container) (48), a support tray, and a cover. The chamber body (48) is equipped with a processing space formed inside, an opening for placing a substrate (W) into the processing space, a supply port, and an exhaust port. The substrate (W) is supported by the support tray and accommodated in the processing space. The cover blocks the opening of the chamber body (48). For example, each single-wafer processing chamber (SW3, SW4) brings the fluid to a supercritical state and supplies the supercritical fluid from the supply port to the processing space within the chamber body (48). At this time, the processing space within the chamber body (48) is exhausted from the exhaust port. A drying process is performed on the substrate (W) by the supercritical fluid supplied to the processing space.

[0079] A supercritical state is obtained by applying a critical temperature and critical pressure inherent to the fluid. Specifically, when the fluid is carbon dioxide, the critical temperature is 31°C and the critical pressure is 7.38 MPa. In the supercritical state, the surface tension of the fluid becomes nearly zero. Therefore, no influence from the gas-liquid interface occurs on the pattern of the substrate (W). Consequently, pattern collapse on the substrate (W) is unlikely to occur.

[0080] <4-4. Batch Board Transport Area (R4)>

[0081] The batch substrate transport area (R4) is adjacent to the material block (5) and the batch processing area (R1). The batch substrate transport area (R4) is formed along the batch processing area (R1). The batch substrate transport area (R4) extends in the front-rear direction (X). The four areas (R1, R2, R3, R4) are formed to extend parallel to each other.

[0082] The batch substrate transport area (R4) has a first transport mechanism (robot) (WTR1). That is, a first transport mechanism (WTR1) is formed in the batch substrate transport area (R4). The first transport mechanism (WTR1) transports a plurality (e.g., 50 sheets) of substrates (W) in batches between a designated substrate receiving position (PP) within the material block (5), each of, for example, six batch processing tanks (BT1 to BT6), and a second position changing mechanism (31).

[0083] The first conveying mechanism (WTR1) comprises a pair of chucks (49, 50) and a guide rail (53). Each chuck (49, 50) has 50 retaining grooves to hold, for example, 50 substrates (W). Each of the two chucks (49, 50) extends parallel to each other in the Y direction (Fig. 1) when viewed from a plane. The first conveying mechanism (WTR1) opens or closes the two chucks (49, 50). The first conveying mechanism (WTR1) moves the pair of chucks (49, 50) along the guide rail (53). The first conveying mechanism (WTR1) is driven by an electric motor.

[0084] <5. Control Unit>

[0085] A substrate processing device (1) is equipped with a control unit (59) and a memory unit (not shown). The control unit (59) controls each component of the substrate processing device (1). The control unit (59) is equipped with one or more processors, such as a central processing unit (CPU). The memory unit is equipped with at least one of, for example, ROM (Read-Only Memory), RAM (Random-Access Memory), and a hard disk. The memory unit stores computer programs necessary to control each component of the substrate processing device (1).

[0086] <6. Second Position Change Mechanism>

[0087] FIG. 4(a) is a plan view showing a second orientation change mechanism (31). FIG. 4(b) is a front view showing a second orientation change mechanism (31). FIG. 5 is a side view for explaining a second conveying mechanism (WTR2) and an orientation change unit (63). The second orientation change mechanism (31) comprises a pusher mechanism (61), a second conveying mechanism (second batch substrate conveying mechanism) (WTR2), and an orientation change unit (63). Additionally, the second conveying mechanism (WTR2) corresponds to the substrate extraction mechanism of the present invention.

[0088] <6-1. Pusher Mechanism>

[0089] The pusher mechanism (61) receives a plurality of substrates (W) from the first conveying mechanism (WTR1). The pusher mechanism (61) can maintain the plurality of substrates (W) in a vertical position and rotate the plurality of substrates (W) around a vertical axis (AX4). The pusher mechanism (61) is equipped with a pusher (65) and a lifting rotation part (67).

[0090] The pusher (65) is conveyed to the first conveying mechanism (WTR1) and also holds a plurality of substrates (W) in a vertical position arranged at a predetermined interval (e.g., half pitch). The lifting rotation unit (67) raises the pusher (65) and rotates the pusher (65) around the vertical axis (AX4). The lifting rotation unit (67) is equipped with, for example, one or more electric motors. Additionally, the pusher (65) corresponds to the substrate holding unit of the present invention.

[0091] <6-2. Second Batch Return Mechanism (Second Return Mechanism)>

[0092] The second conveying mechanism (robot) (WTR2) retrieves and conveys multiple substrates (W) from the pusher (65). The second conveying mechanism (WTR2) is equipped with two chucks (horizontal chucks) (69, 70), an opening / closing part (71), a lifting part (73), and a horizontal moving part (75). As shown in FIG. 5, the chucks (69, 70) hold multiple substrates (W) by inserting two sides of each outer edge of multiple substrates (W) in a vertical position in the radial direction.

[0093] Each of the two chucks (69, 70) is provided with a plurality (e.g., 25) of V-shaped retaining grooves (78) and a plurality (e.g., 25) of through grooves (80). The V-shaped retaining grooves (78) and through grooves (80) are arranged alternately one by one. The inside of each V-shaped retaining groove (78) is formed in a cross-sectional V shape. Also, the V-shaped retaining groove (78A) of the chuck (69) faces the V-shaped retaining groove (78B) of the chuck (70). Thus, a pair of V-shaped retaining grooves (78A, 78B) hold one substrate (W). The 25 pairs of V-shaped retaining grooves (78) of the two chucks (69, 70) each hold 25 substrates (W) in a vertical position.

[0094] The pass groove (80) does not hold the substrate (W). The V-shaped holding groove (78) is arranged at a predetermined interval (e.g., full pitch). Also, the pass groove (80) is arranged at a predetermined interval (e.g., full pitch). Thus, the second conveying mechanism (WTR2) can extract the substrate (W) at intervals of one sheet from a plurality of substrates (W) arranged at half pitch.

[0095] The opening / closing part (71) shown in FIG. 4(a) oscillates (rotates) the chuck (69) around the horizontal axis (AX5) and also oscillates the chuck (70) around the horizontal axis (AX6). By doing so, the opening / closing part (71) can hold the substrate (W) or release the state in which the substrate (W) is held. When the substrate (W) is held by the pair of chucks (69, 70), the width of the two inner parts of the V-shaped holding grooves (78A, 78B) becomes smaller than the diameter of each substrate (W). Therefore, the substrate (W) is held. Additionally, the two horizontal axes (AX5, AX6) each extend in the front-rear direction (X) where the substrate (W) is aligned. Also, the horizontal axis (AX5) extends parallel to the horizontal axis (AX6).

[0096] The lifting unit (73) raises the chuck (69, 70) and the opening / closing unit (71). The horizontal moving unit (75) moves the chuck (69, 70) and the lifting unit (73) in the width direction (Y) (see FIG. 4(a)). The horizontal moving unit (75) moves the chuck (69, 70) between an upper position of the pusher (65) and a lower position relative to the position changing unit (63). The opening / closing unit (71), the lifting unit (73), and the horizontal moving unit (75) are each equipped with, for example, an electric motor.

[0097] Additionally, it is preferable that the upper end of each chuck (69, 70) is lower than the upper end of each substrate (W) being held. Also, it is preferable that the lower end of each chuck (69, 70) is higher than the lower end of each substrate (W) being held. By doing so, the chucks (69, 70) holding the substrate (W) can be easily passed between the upper chuck (81) and the lower chuck (83) described later. Therefore, the chucks (69, 70) can smoothly guide the substrate (W) to the upper and lower chucks (81, 83).

[0098] <6-3. Attitude Transformation Section>

[0099] FIG. 6(a) is a plan view showing the auxiliary chuck opening / closing part (87) of the posture changing part (63). FIG. 6(b) is a side view showing the forward / backward part (88) of the posture changing part (63). FIG. 7(a) and FIG. 7(b) are drawings for explaining the operation of the forward / backward part (88) of the posture changing part (63).

[0100] Refer to FIG. 4(a), FIG. 4(b), FIG. 6(a), etc. The orientation changer (63) changes the orientation of the substrate (W) conveyed by the second conveying mechanism (WTR2) from vertical to horizontal. The orientation changer (63) is equipped with an upper chuck (81), a lower chuck (83), an upper chuck moving part (84), two auxiliary chucks (85, 86), an auxiliary chuck opening / closing part (87), a forward / backward part (88), an upper / lower chuck rotation part (89), a support arm (90), and a base frame (91).

[0101] The upper chuck (81) and the lower chuck (83) (hereinafter appropriately referred to as “upper and lower chucks (81, 83)”) insert the upper and lower outer edges of each of the multiple substrates (W) in a vertical position held by the two chucks (69, 70) in the diametrical direction. By doing so, the upper chuck (81) and the lower chuck (83) can directly receive the substrates (W) from the two chucks (69, 70) of the second conveying mechanism (WTR2).

[0102] The upper chuck (81) is formed on the support arm (90) so as to be movable up and down. The upper chuck moving part (84) can move the upper chuck (81) closer to the lower chuck (83) or move the upper chuck (81) further away from the lower chuck (83). The upper chuck moving part (84) is formed on the support arm (90). The upper chuck moving part (84) is equipped with a linear actuator having, for example, an electric motor. The lower chuck (83) is not movable and is fixed to the support arm (90).

[0103] As shown in FIG. 5, the upper chuck (81) is provided with a plurality (e.g., 25) of first horizontal mounting guide grooves (93). Likewise, the lower chuck (83) is provided with a plurality (e.g., 25) of second horizontal mounting guide grooves (94). For example, the 25 first horizontal mounting guide grooves (93) are each configured to accommodate the outer edges of 25 substrates (W). Also, the 25 second horizontal mounting guide grooves (94) are each configured to accommodate the outer edges of 25 substrates (W). Additionally, each of the horizontal mounting guide grooves (93, 94) has a mounting surface (95) for mounting one substrate (W) (see FIG. 7(a)).

[0104] Additionally, each horizontal mounting guide groove (93, 94) has a width (WD) that is wider than the thickness (TC) of each substrate (W). That is, from the entrance of each horizontal mounting guide groove (93, 94) to the inside, the width (WD) of each groove (93, 94) is wider than the thickness (TC) of each substrate (W). Thus, when the hand (35) of the center robot (CR) extracts a single substrate (W) in a horizontal position from the horizontal mounting guide groove (93, 94), it can lift the single substrate (W) in a horizontal position within the horizontal mounting guide groove (93, 94). That is, the horizontal mounting guide groove (93, 94) has a space where the substrate (W) can move freely.

[0105] Also, when the upper chuck (81) and the lower chuck (83) insert the substrate (W), a gap (GP) (space) is formed to move the substrate (W) in the radial direction within the horizontal mounting guide grooves (93, 94).

[0106] The auxiliary chucks (85, 86) hold the lower side of each substrate (W). Two auxiliary chucks (85, 86) are formed on both sides of the lower chuck (83) along the circumferential direction of each substrate (W). Specifically described with reference to FIG. 5, when the two chucks (69, 70), the upper chuck (81), and the lower chuck (83) hold each substrate (W), a first auxiliary chuck (85) is positioned between the chuck (69) and the lower chuck (83). Additionally, a second auxiliary chuck (86) is positioned between the chuck (70) and the lower chuck (83).

[0107] Similar to the chuck (69, 70), the two auxiliary chucks (85, 86) each have a plurality (e.g., 25) of V-shaped retaining grooves (97). The inside of each retaining groove (97) is formed in a cross-sectional V shape.

[0108] When the upper chuck (81) and lower chuck (83) hold the substrate (W) in a "vertical position," the auxiliary chucks (85, 86) each hold the substrate (W) in a vertical position by receiving the outer edge of the substrate (W) into the V-shaped holding groove (97). Also, when the upper chuck (81) and lower chuck (83) hold the substrate (W) in a "horizontal position," the two auxiliary chucks (85, 86) each move the substrate (W) away from the V-shaped holding groove (97) and move away from the substrate (W) to a position that does not interfere with the extraction of the substrate (W) by the center robot (CR).

[0109] The auxiliary chuck opening / closing part (87) is formed in the support arm (90) through the reciprocating part (88). The auxiliary chuck opening / closing part (87) oscillates (rotates) the first auxiliary chuck (85) around the horizontal axis (AX7) and also oscillates the second auxiliary chuck (86) around the horizontal axis (AX8). This is explained with reference to FIG. 6(a). The auxiliary chuck opening / closing part (87) is equipped with, for example, an electric motor (87A), a first gear (87B), a second gear (87C), a third gear (87D), a fourth gear (87E), a first shaft (87F), and a second shaft (87G).

[0110] The first gear (87B) is fixed to the output shaft (87H) of the electric motor (87A). The second gear (87C) is fixed to the first shaft (87F). The first shaft (87F) is rotatably supported around the horizontal axis (AX7). Additionally, a first auxiliary chuck (85) is connected to the tip of the first shaft (87F). The third gear (87D) is rotatably supported around the horizontal axis. The fourth gear (87E) is fixed to the second shaft (87G). The second shaft (87G) is rotatably supported around the horizontal axis (AX8). Additionally, a second auxiliary chuck (86) is connected to the tip of the second shaft (87G).

[0111] Two gears (87B, 87C) mesh. Two gears (87B, 87D) mesh. Also, two gears (87D, 87E) mesh. When the electric motor (87A) rotates the output shaft (87H) in the forward direction, the substrate (W) is held in the auxiliary chuck (85, 86). Conversely, when the electric motor (87A) rotates the output shaft (87H) in the reverse direction, the auxiliary chuck (85, 86) moves away from the substrate (W), and the state of holding the substrate (W) is released.

[0112] Additionally, two horizontal axes (AX7, AX8) each extend in the front-rear direction (X) where the substrate (W) is aligned. Also, the horizontal axis (AX7) extends parallel to the horizontal axis (AX8). When the auxiliary chucks (85, 86) are not holding the substrate (W), the auxiliary chuck opening / closing part (87) moves a pair of auxiliary chucks (85, 86) outward from the dotted line (101), as indicated by the dashed line in FIG. 5.

[0113] The reciprocating member (88) is formed in the support arm (90) as shown in FIG. 6(b). The reciprocating member (88) moves (advances and retracts) the auxiliary chucks (85, 86) relative to the upper and lower chucks (81, 83) in the forward and backward direction (X) where the substrate (W) is aligned. The reciprocating member (88) is equipped with, for example, an electric motor (88A), a screw shaft (88B), a slider (88C), and a guide rail (88D).

[0114] The output shaft (88E) of the electric motor (88A) is connected to one end of the screw shaft (88B). The screw shaft (88B) passes through the slider (88C) while engaging with the nut portion (88F) of the slider (88C). The guide rail (88D) passes through the slider (88C). The slider (88C) can move freely relative to the guide rail (88D). The slider (88C) is connected to the auxiliary chuck opening / closing portion (87). The screw shaft (88B) and the guide rail (88D) extend in the forward / backward direction (X) where the substrate (W) is aligned. When the electric motor (88A) rotates the output shaft (88E) in the forward direction, the auxiliary chucks (85, 86) advance relative to the upper and lower chucks (81, 83). In contrast, when the electric motor (88A) reverses the output shaft (88E), the auxiliary chuck (85, 86) retracts relative to the upper and lower chucks (81, 83).

[0115] When the posture conversion unit (63) changes the posture of the substrate (W) from vertical to horizontal, the advance / retreat unit (88) moves two auxiliary chucks (85, 86) so that the vertically positioned substrate (W) received in the V-shaped retaining groove (97) comes into contact with the sling surface (95), respectively. This will be explained in detail with reference to FIGS. 7(a) and 7(b). In FIGS. 7(a) and 7(b), for convenience of illustration, the upper and lower chucks (81, 83) are positioned at the left end of the substrate (W), and the auxiliary chucks (85, 86) are positioned at the right end of the substrate (W).

[0116] FIG. 7(a) shows the state immediately after the position changer (63) receives the substrate (W) from the second conveying mechanism (WTR2) using the upper and lower chucks (81, 83) and auxiliary chucks (85, 86). That is, the outer edge of the substrate (W) is located inside the V-shaped retaining groove (97) and is also located at the center of the width (WD) of the horizontal mounting guide groove (93, 94).

[0117] The retraction unit (88) makes it possible to move the auxiliary chuck (85, 86) between the contact position and the standby position. When changing the position of the substrate (W), the retraction unit (88) retracts the auxiliary chuck (85, 86) from the standby position to the contact position (moves backward (X)). By doing so, as shown in FIG. 7(b), the back surface of the substrate (W) in a vertical position held in the V-shaped holding groove (97) is brought into contact with or close to the mounting surface (95) of the horizontal mounting guide groove (93, 94) of the upper and lower chucks (81, 83), respectively.

[0118] When the auxiliary chuck (85, 86) is not holding the substrate (W), the substrate (W) can move freely within the horizontal mounting guide groove (93, 94). However, when the position is changed, the substrate (W) moves and collides within the horizontal mounting guide groove (93, 94). This may cause particles to be generated. Therefore, by using the reciprocating part (88) to make contact with the substrate (W) on the mounting surface (95), the impact caused by the collision of the substrate (W) can be reduced. Consequently, the generation of particles can be suppressed.

[0119] The upper and lower chuck rotation part (89) shown in FIG. 4(b) rotates the upper and lower chucks (81, 83) around a horizontal axis (AX9) that is orthogonal to the alignment direction (front-back direction (X)) of the 25 substrates (W) in a vertical position maintained by the upper and lower chucks (81, 83). By doing so, the position of the 25 substrates (W) received from the two chucks (69, 70) is changed from vertical to horizontal. Additionally, the horizontal axis (AX9) extends in the width direction (Y).

[0120] The upper and lower chuck rotation part (89) is formed in the base frame (91). The base frame (91) is provided with, for example, a beam member (91A) extending horizontally in the front-rear direction (X) and two column members (91B) supporting both ends of the beam member. The upper and lower chuck rotation part (89) supports the upper and lower chucks (81, 83) rotatable around a horizontal axis (AX9) through an L-shaped support arm (90). The upper and lower chuck rotation part (89) is provided with, for example, an electric motor.

[0121] <7. Operation Description>

[0122] Next, the operation of the substrate processing device (1) will be described with reference to the flowcharts of FIGS. 8 to 10. Refer to FIG. 1. An external transport robot, not shown, transports two carriers (C) to the load port (9) in sequence.

[0123] [Step S01] Return of substrate from carrier

[0124] The carrier conveying mechanism (11) of the stocker block (3) conveys the first carrier (C) from the load port (9) to the shelf (13A). The batch conveying mechanism (HTR) of the material block (5) extracts 25 substrates (W1) in a horizontal position from the first carrier (C) placed on the shelf (13A) and conveys them to the position changing unit (23). After that, the carrier conveying mechanism (11) conveys the empty first carrier (C) to the shelf (13B). After that, the carrier conveying mechanism (11) conveys the second carrier (C) from the load port (9) to the shelf (13A). The batch return mechanism (HTR) takes 25 substrates (W2) in a horizontal position from the second carrier (C) placed on the shelf (13A) and returns them to the position changer (23).

[0125] [Step S02] Transition to Vertical Position

[0126] Fifty substrates (W (W1, W2)) of two carriers (C) are conveyed to the orientation changer (23). As shown in FIGS. 3(a) to FIGS. 3(f), the orientation changer (23) and the pusher mechanism (25) change the orientation of the 50 substrates (W) from a horizontal orientation to a vertical orientation while aligning the 50 substrates (W) in a face-to-face manner and at a half pitch (5 mm). The pusher mechanism (25) conveys the 50 substrates (W) in a vertical orientation to a predetermined substrate receiving position (PP) within the material block (5).

[0127] [Step S03] Chemical Treatment (Batch Treatment)

[0128] The first conveying mechanism (WTR1) receives 50 substrates (W) in a vertical position from the pusher mechanism (25) at the substrate receiving position (PP) and conveys the 50 substrates (W) to any of the four lifters (LF1 to LF4) of the four chemical treatment tanks (BT1 to BT4).

[0129] For example, the first conveying mechanism (WTR1) conveys 50 substrates (W) to the lifter (LF1) of the chemical treatment tank (BT1). The lifter (LF1) receives the 50 substrates (W) from an upper position of the chemical treatment tank (BT1). The lifter (LF1) immerses the 50 substrates (W) in phosphoric acid as a treatment solution in the chemical treatment tank (BT1). Thus, an etching treatment is performed on the 50 substrates (W). After the etching treatment, the lifter (LF1) pulls the 50 substrates (W) out of the phosphoric acid in the chemical treatment tank (BT1). In addition, even when 50 substrates are returned to each of the lifters (LF2 to LF4) of the other chemical treatment tanks (BT2 to BT4), the same treatment as in the chemical treatment tank (BT1) is performed.

[0130] [Step S04] Pure Cleaning Treatment (Batch Process)

[0131] The first conveying mechanism (WTR1) receives 50 substrates (W) in a vertical position from, for example, a lifter (LF1) (or a lifter (LF2)) and conveys the 50 substrates (W) to a lifter (LF5) of a water washing treatment tank (BT5). The lifter (LF5) receives the 50 substrates (W) at an upper position of the water washing treatment tank (BT5). The lifter (LF5) immerses the 50 substrates (W) in pure water within the water washing treatment tank (BT5). In this way, the 50 substrates (W) undergo a cleaning treatment.

[0132] Additionally, when the first conveying mechanism (WTR1) receives 50 substrates (W) in a vertical position from one of the lifters (LF3, LF4), the first conveying mechanism (WTR1) conveys the 50 substrates (W) to the lifter (LF6) of the water washing treatment tank (BT6). The lifter (LF6) receives the 50 substrates (W) from an upper position of the water washing treatment tank (BT6). The lifter (LF6) immerses the 50 substrates (W) in pure water within the water washing treatment tank (BT6).

[0133] In this embodiment, the second position change mechanism (31) is formed on the opposite side of the material block (5) via six batch processing tanks (BT1 to BT6). The first conveying mechanism (WTR1) conveys 50 substrates (W) in bulk to the second position change mechanism (31) from the batch processing tank (BT1 (BT3)) on the side closer to the material block (5), through the batch processing tank (BT5 (BT6)) on the side farther from the material block (5).

[0134] [Step S05] Transition to Horizontal Position

[0135] The second posture change mechanism (31) changes the posture of the substrate (W) that has undergone cleaning treatment from a vertical posture to a horizontal posture in bulk. Here, the following problem exists. That is, if the posture of 50 substrates (W) arranged at half pitch (5 mm interval) is changed in bulk, there may be cases where one hand (35) of the center robot (CR) cannot properly enter the gap between two adjacent substrates (W) among the 50 substrates (W).

[0136] Also, when the substrate (W) is aligned in a face-to-face manner, the substrate (W) converted to a horizontal position may have a device surface facing upward and a device surface facing downward. For example, it is not desirable for the hand (35) of the center robot (CR) to come into contact with the device surface of the substrate (W). Also, it is not desirable for substrates (W) with different device surface orientations to be transported to each single-wafer processing chamber (SW1 to SW4).

[0137] Therefore, in this embodiment, the spacing between two adjacent substrates (W) is widened, and the orientation of the device surfaces of 50 substrates (W) is aligned with each other. This will be explained in detail with reference to the flowcharts of FIGS. 9 and 10, FIGS. 11(a) to 11(d), FIGS. 12(a) to 12(d), and FIGS. 13(a) to 13(d).

[0138] [Step S11] Return of the substrate to the pusher mechanism

[0139] Refer to FIG. 11(a). FIG. 11(a) to FIG. 11(d) are plan views for explaining the operation of the second position change mechanism (31). The first conveying mechanism (WTR1) conveys 50 substrates (W) from one side of the lifters (LF5, LF6) to the pusher mechanism (61) of the second position change mechanism (31) (see FIG. 1). The pusher (65) of the pusher mechanism (61) holds 50 substrates (W) in a vertical position arranged in a half-pitch and face-to-face manner. Additionally, the 50 substrates (W) are aligned along the width direction (Y).

[0140] Additionally, the second conveying mechanism (WTR2) waits on the side of the position change unit (63) so as not to interfere with the first conveying mechanism (WTR1). Also, after conveying the substrate (W) to the pusher mechanism (61), the first conveying mechanism (WTR1) moves from above the pusher mechanism (61).

[0141] [Step S12] Rotation of the substrate around the vertical axis by the pusher mechanism

[0142] Refer to FIG. 11(b). The lifting and rotating part (67) of the pusher mechanism (61) rotates 50 substrates (W) 90 degrees to the left around the vertical axis (AX4) when viewed from a plane. By doing so, the pusher mechanism (61) can hand over the substrates (W) to the second conveying mechanism (WTR2) and, when changing orientation, can turn the device surface of each of the 25 substrates (W1) of the first substrate group upward.

[0143] [Step S13] Return of substrate (W1) by the second batch return mechanism

[0144] The second conveying mechanism (WTR2) moves toward the substrate standby side. That is, the second conveying mechanism (WTR2) moves so that the chuck (69, 70) is positioned above the 50 substrates (W) held by the pusher (65). The opening / closing part (71) opens the chuck (69, 70) so that the 50 substrates (W) can pass between the chucks (69, 70).

[0145] Refer to FIG. 11(c). After the chuck (69, 70) arrives above the substrate (W), the lifting part (73) of the second conveying mechanism (WTR2) lowers the chuck (69, 70) below the center of the substrate (W). Then, the opening / closing part (71) closes the chuck (69, 70) to insert 50 substrates (W). At this time, 25 substrates (W1) are each positioned in 25 V-shaped retaining grooves (78), and 25 substrates (W2) are each positioned in 25 through grooves (80).

[0146] After 50 substrates (W) are fitted into the chuck (69, 70), the lifting unit (73) raises the chuck (69, 70). By doing so, the second conveying mechanism (WTR2) can extract 25 substrates (W1) arranged at a full pitch (e.g., 10 mm spacing) from the 50 substrates (W (W1, W2)) held by the pusher (65). That is, the 25 substrates (W2) of the second substrate group are left on the pusher (65).

[0147] Refer to FIG. 11(d). The second conveying mechanism (WTR2) conveys 25 substrates (W1) in a batch between the upper and lower chucks (81, 83) of the orientation changer (63). At this time, the upper chuck (81) is moved to an open position far from the lower chuck (83) by the upper chuck moving part (84). Also, the auxiliary chucks (85, 86) are in a closed state to maintain the substrate (W) in a vertical orientation. Additionally, the auxiliary chucks (85, 86) may be in an open state.

[0148] Additionally, the lifting and rotating part (67) of the pusher mechanism (61) rotates the 25 substrates (W2) held by the pusher (65) 180 degrees around the vertical axis (AX4). This allows the device surface of each of the 25 substrates (W2) of the second substrate group to be turned upward when the orientation is changed. Also, due to the 180-degree rotation, the position of each substrate (W2) moves backward (X) by a half pitch compared to before the rotation. Therefore, when transporting the 25 substrates (W2), they can be placed into the V-shaped holding groove (78) of the chuck (69, 70). Additionally, it is preferable to perform this 180-degree rotation of the substrates (W2) in steps S13 to S17.

[0149] [Step S14] Delivery of the substrate (W1) to the attitude conversion unit

[0150] Refer to FIG. 12(a). FIG. 12(a) to FIG. 12(d) are front views, i.e., views from the single-wafer substrate transport area (R2), to explain the operation of the second position change mechanism (31). FIG. 12(a) is a front view of the state in which the second transport mechanism (WTR2) shown in FIG. 11(d) moves 25 substrates (W1) between upper and lower chucks (81, 83).

[0151] Refer to FIG. 12(b). The auxiliary chucks (85, 86) are closed to hold the substrate (W) in a vertical position. The lifting portion (73) of the second conveying mechanism (WTR2) lowers the 25 substrates (W1) held by the chucks (69, 70) until the substrate (W1) comes into contact with the V-shaped holding grooves (97) of the auxiliary chucks (85, 86). That is, the lifting portion (73) lowers the 25 substrates (W1) until the 25 substrates (W1) are held in the 25 V-shaped holding grooves (97). When 25 substrates (W1) are held in each of the 25 V-shaped retaining grooves (97) of the auxiliary chuck (85, 86), the outer edges of the 25 substrates (W1) are received in the second horizontal mounting guide groove (94) of the lower chuck (83).

[0152] After that, the upper chuck moving part (84) lowers the upper chuck (81) to bring the upper chuck (81) close to the lower chuck (83). As a result, the outer edges of the 25 substrates (W1) are received in the first horizontal mounting guide groove (93) of the upper chuck (81). Also, the 25 substrates (W1) are held (gripped) by the upper and lower chucks (81, 83) and the auxiliary chucks (85, 86).

[0153] Refer to FIG. 12(c). Afterwards, the opening / closing part (71) of the second conveying mechanism (WTR2) opens the chuck (69, 70). This releases the holding of 25 substrates (W1). Also, the 25 substrates (W1) are delivered to the position changing part (63). Afterwards, the lifting part (73) of the second conveying mechanism (WTR2) raises the chuck (69, 70) upward above the substrate (W). This moves the second conveying mechanism (WTR2) to a position that does not interfere with the position changing part (63).

[0154] [Step S15] Contact with the substrate (W1) on the surface of the repositioning

[0155] As shown in FIG. 6(b), the retraction member (88) retracts the auxiliary chuck (85, 86) (moves it backward (X)). That is, the retraction member (88) brings 25 substrates (W1), each held in 25 V-shaped retaining grooves (97), into contact with the mounting surface (95) of the horizontal mounting guide grooves (93, 94) (see FIG. 7(a) and FIG. 7(b)). By doing so, collisions caused by the movement of each substrate (W1) can be suppressed during posture change and the opening operation of the auxiliary chuck (85, 86).

[0156] [Step S16] Attitude conversion by the attitude conversion unit

[0157] Refer to FIG. 12(d). Afterwards, the upper and lower chuck rotation part (89) of the orientation conversion part (63) rotates the upper and lower chucks (81, 83), etc., which hold 25 substrates (W1), 90 degrees to the left around the horizontal axis (AX9). By doing so, the orientation of the 25 substrates (W1) of the first substrate group can be changed from vertical to horizontal. After rotating 90 degrees, the auxiliary chuck opening / closing part (87) opens the auxiliary chucks (85, 86) to a position that does not interfere with the transport of the substrates (W1) by the center robot (CR). That is, the auxiliary chucks (85, 86) are moved to the position indicated by the dashed line in FIG. 5.

[0158] [Step S17] Return of substrate (W1) by center robot

[0159] After opening the auxiliary chucks (85, 86), the center robot (CR) uses two hands (35) to sequentially extract 25 substrates (W1) in a horizontal position maintained by the upper and lower chucks (81, 83) and transfers the substrates (W1) to one side of the single-wafer processing chambers (SW1, SW2). The spacing between the substrates (W) is widened from half pitch to full pitch. Therefore, the hands (35) of the center robot (CR) can enter the gap between two adjacent substrates (W) well. Also, the substrates (W) can be extracted well.

[0160] After the center robot (CR) returns 25 substrates (W1) of the first substrate group from the posture conversion unit (63), it converts the posture of 25 substrates (W2) of the second substrate group. Since steps S18 to S22 are similar to steps S13 to S17, the overlapping parts are explained simply.

[0161] [Step S18] Return of substrate (W2) by the second batch return mechanism

[0162] Refer to FIG. 13(a). FIG. 13(a) and FIG. 13(b) are plan views for explaining the operation of the second position change mechanism (31). The second conveying mechanism (WTR2) moves so that the chuck (69, 70) is positioned above the 25 substrates (W2) held by the pusher (65).

[0163] After that, the lifting part (73) of the second conveying mechanism (WTR2) lowers the chuck (69, 70) below the center of the substrate (W2). After that, the opening / closing part (71) inserts 25 substrates (W2) by closing the chuck (69, 70). In step S13, the substrate (W2) is rotated 180 degrees, so that the position of each substrate (W2) moves by half pitch. Therefore, when the chuck (69, 70) is closed, the 25 substrates (W2) are each positioned in 25 V-shaped retaining grooves (78).

[0164] After that, the lifting unit (73) raises the chuck (69, 70). By doing so, the second conveying mechanism (WTR2) lifts 25 substrates (W2) held by the pusher (65).

[0165] Refer to FIG. 13(b). After that, the second conveying mechanism (WTR2) conveys 25 substrates (W2) in a batch between the upper and lower chucks (81, 83) of the position changer (63). Also, after the second conveying mechanism (WTR2) conveys 25 substrates (W2), the pusher (65) is in a state where it does not hold the substrates (W). Therefore, the first conveying mechanism (WTR1) can convey the next 50 substrates (W) from one of the lifters (LF3, LF6) to the pusher (65).

[0166] [Step S19] Delivery of the substrate (W2) to the attitude conversion unit

[0167] Refer to FIG. 13(c). FIG. 13(c) and FIG. 13(d) are front views of the second position change mechanism (31). 25 substrates (W2) held by the chucks (69, 70) are positioned between the upper and lower chucks (81, 83). Also, the auxiliary chucks (85, 86) are closed to hold the substrates (W2) in a vertical position. Also, the auxiliary chucks (85, 86) are moved from a contact position (state in FIG. 7(b)) to a standby position (state in FIG. 7(a)) by the reciprocating part (88).

[0168] After that, the lifting part (73) of the second conveying mechanism (WTR2) lowers the 25 substrates (W2) held by the chucks (69, 70) until each of the 25 V-shaped holding grooves (97) of the auxiliary chucks (85, 86) holds the 25 substrates (W2). After that, the upper chuck moving part (84) lowers the upper chuck (81). Thus, the 25 substrates (W2) are held (grabbed) by the upper and lower chucks (81, 83) and the auxiliary chucks (85, 86).

[0169] After that, the opening / closing part (71) of the second conveying mechanism (WTR2) opens the chuck (69, 70). As a result, the holding of the 25 substrates (W2) is released, and the 25 substrates (W2) are delivered to the position changing part (63). After that, the lifting part (73) of the second conveying mechanism (WTR2) raises the chuck (69, 70) to a position that does not interfere with the position changing part (63) above the substrate (W).

[0170] [Step S20] Contact with the substrate (W2) on the mounting surface

[0171] After that, the moving part (88) brings 25 substrates (W2), each held in 25 V-shaped holding grooves (97), into contact with the mounting surface (95) of the horizontal mounting guide grooves (93, 94) (see FIG. 7(a) and FIG. 7(b).

[0172] [Step S21] Attitude conversion by the attitude conversion unit

[0173] Refer to FIG. 13(d). Afterwards, the upper and lower chuck rotation part (89) of the position conversion part (63) rotates the upper and lower chucks (81, 83), etc., which hold 25 substrates (W2), 90 degrees to the left around the horizontal axis (AX9). By doing so, the position of the 25 substrates (W2) is changed from a vertical position to a horizontal position. After rotating 90 degrees, the auxiliary chuck opening / closing part (87) opens the auxiliary chucks (85, 86) to the position indicated by the dashed line in FIG. 5.

[0174] [Step S22] Return of the substrate (W2) by the center robot

[0175] After opening the auxiliary chuck (85, 86), the center robot (CR) sequentially extracts 25 substrates (W2) in a horizontal position and returns the substrates (W2) to either the first single-wafer processing chamber (SW1) or the second single-wafer processing chamber (SW2).

[0176] [Step S06] 1st Single-wafer Processing

[0177] Returning to the explanation of the flowchart in FIG. 8. For example, the center robot (CR) conveys the substrate (W (W1, W2)) from the orientation conversion unit (63) to the first single-wafer processing chamber (SW1). The first single-wafer processing chamber (SW1) supplies pure water to the device surface from the nozzle (47) while rotating the substrate (W) with the device surface facing upward, for example, by the rotation processing unit (45). Afterward, the first single-wafer processing chamber (SW1) supplies IPA from the nozzle (47) to the device surface (upper surface) of the substrate (W) to replace the pure water of the substrate (W) with IPA.

[0178] [Step S07] 2nd Single-wafer Processing (Drying Process)

[0179] After that, the center robot (CR) takes out the substrate (W) wet with IPA from the first single-wafer processing chamber (SW1 (SW2)) and returns the substrate (W) to one of the single-wafer processing chambers (SW3, SW4). Each single-wafer processing chamber (SW3, SW4) performs a drying treatment on the substrate (W) using supercritical carbon dioxide (supercritical fluid). By using a supercritical fluid for the drying treatment, pattern collapse on the pattern surface of the substrate (W) is suppressed.

[0180] [Step S08] Return of substrate from buffer to carrier

[0181] The center robot (CR) transfers the substrate (W) after drying process from one of the single-wafer processing chambers (SW3, SW4) to one of the shelf units (33). When one lot (25 sheets) of substrates (W1) is transferred to the buffer unit (33), the batch transfer mechanism (HTR) transfers the 25 substrates (W1) in batches from the buffer unit (33) into the empty first carrier (C) placed on shelf (13A). After that, the carrier transfer mechanism (11) in the stocker block (3) transfers the first carrier (C) to the load port (9).

[0182] Also, when one lot of substrates (W2) are loaded into the buffer section (33), the batch transport mechanism (HTR) batch transports 25 substrates (W2) from the buffer section (33) into an empty second carrier (C) loaded into the shelf (13A). After that, the carrier transport mechanism (11) in the stocker block (3) transports the second carrier (C) to the load port (9). An external transport mechanism not shown transports the two carriers (C) in sequence to the next destination.

[0183] According to the present embodiment, the batch processing area (R1), the single-wafer processing area (R3), and the single-wafer substrate transport area (R2) are formed to extend from the side of the material block (5). Six batch processing tanks (BT1 to BT6) are arranged in the front-rear direction (X) where the batch processing area (R1) extends. Also, four single-wafer processing chambers (SW1 to SW4) are arranged in the front-rear direction (X) where the single-wafer processing area (R3) extends. Additionally, a center robot (CR) is formed in the single-wafer substrate transport area (R2) that is fitted into the six batch processing tanks (BT1 to BT6) and the four single-wafer processing chambers (SW1 to SW4). A first transport mechanism (WTR1) is formed in the batch substrate transport area (R4) along the six batch processing tanks (BT1 to BT6). Therefore, the substrate processing device (1) of the present embodiment can smoothly transport the substrate (W).

[0184] This will be explained in detail. The batch transfer mechanism (HTR) of the material block (5) can take out multiple substrates (W) in batches from the carrier (C) and transfer the multiple substrates (W) in batches to the first position change mechanism (15). Also, the first transfer mechanism (WTR1) transfers multiple substrates (W) between the substrate receiving position (PP), the batch processing tank (BT1 to BT6), and the second position change mechanism (31). Also, the center robot (CR) transfers the substrates (W) between the second position change mechanism (31), the four single-wafer processing chambers (SW1 to SW4), and the buffer section (33). Also, the batch transfer mechanism (HTR) receives multiple substrates (W) in batches from the buffer section (33) and stores the multiple substrates (W) in batches in the carrier (C).

[0185] Therefore, multiple substrates (W) can be directly transferred from the material block (5) to the batch processing area (R1) without being transferred to the single-wafer processing area (R3) before being transferred to the batch processing area (R1). Also, the batch transfer mechanism (HTR) transfers multiple substrates (W) in batches between the carrier (C), the first position change mechanism (15), and the buffer section (33) without accessing each single-wafer processing chamber (SW1 to SW4). As a result, multiple substrates (W) can be quickly transferred from the carrier (C) to the first position change mechanism (15), and multiple substrates (W) can be quickly transferred from the buffer section (33) to the carrier (C). Therefore, the substrate processing device (1) of the present embodiment can smoothly transfer substrates (W). As a result, throughput can be improved. In addition, since single-wafer processing chambers (SW1 to SW4) are formed in the direction in which the single-wafer substrate transport area (R2) extends, many single-wafer processing chambers can be formed.

[0186] Additionally, the second position change mechanism (31) is formed on the opposite side of the material block (5) via six batch processing tanks (BT1 to BT6). For example, the center robot (CR) conveys multiple substrates (W) in bulk to the second position change mechanism (31) via the batch processing tank (BT1 (BT4)) on the side closer to the material block (5) and the batch processing tank (BT5 (BT6)) on the side farther from the material block (5).

[0187] While performing batch processing by the batch processing unit (BT1 to BT6), multiple substrates (W) can be transferred from the material block (5) to the second position change mechanism (31), and then, while performing single-wafer processing by the single-wafer processing chamber (SW1 to SW4), multiple substrates (W) can be transferred from the second position change mechanism (31) to the material block (5). Therefore, multiple substrates (W) can be transferred in a circular motion within the processing block (7), and thereby, the substrates (W) can be transferred smoothly.

[0188] Additionally, the second posture conversion mechanism (31) comprises a pusher (65) that holds a plurality of substrates (W) in a vertical posture conveyed by the first conveying mechanism (WTR1), a second conveying mechanism (WTR2) that can take out two or more substrates (W) from the plurality of substrates (W) held by the pusher (65), and a posture conversion unit (63) that converts the posture of two or more substrates (W) taken out by the second conveying mechanism (WTR2) from a vertical posture to a horizontal posture in a batch. Thus, for two or more substrates (W) taken out by the second conveying mechanism (WTR2), the posture conversion unit (63) can perform a posture conversion.

[0189] Example 2

[0190] Next, Example 2 of the present invention will be described with reference to the drawings. Also, descriptions that overlap with Example 1 will be omitted. FIG. 14(a) is a longitudinal section view showing the pusher mechanism (61) of the second posture change mechanism (31) related to Example 2. FIG. 14(b) is a plan view showing the second posture change mechanism (31) related to Example 2.

[0191] Refer to FIG. 14(a). The pusher mechanism (61) of the second position change mechanism (31) of Example 2 is equipped with a standby tank (107) that stores liquid and two discharge pipes (109) that supply pure water (DIW) as liquid to the standby tank (107) in order to immerse the substrate (W) held by the pusher (65) in the liquid when the pusher (65) is lowered. The discharge pipes (109) are formed to extend in a straight line in the front-rear direction (X) or the width direction (Y). The discharge pipes (109) are equipped with a plurality of discharge ports (109A) (nozzles for holding parts) in the direction in which the discharge pipes (109) extend. Each of the plurality of discharge ports (109A) discharges pure water. The standby tank (107) stores the pure water ejected by the discharge pipe (109).

[0192] For example, as shown in FIG. 11(d), when the attitude changer (63) is performing attitude change, etc. on the substrate (W1), the substrate (W2) in the atmosphere can be immersed in pure water in the atmosphere tank (107) to prevent the substrate (W) from drying out.

[0193] Additionally, the standby tank (107) does not need to store pure water. In this case, the outlet (109A) of the discharge pipe (109) may supply pure water in a shower or mist form to the substrate (W) held by the pusher (65). Also, the outlet (109A) may be positioned higher than the substrate (W), as indicated by the dashed line of the discharge pipe (109) in FIG. 14(a). When supplying pure water in a shower or mist form to the substrate (W), the standby tank (107) may or may not be formed.

[0194] Next, refer to FIG. 14(b). The second position changing mechanism (31) is equipped with a first group of nozzles (111) and a second group of nozzles (112). The nozzles (111, 112) are nozzles for the position changing unit (63). The nozzles (111, 112) each supply a liquid, for example, pure water (DIW), in a shower or mist form to a substrate (W) held by upper and lower chucks (81, 83) of the position changing unit (63). The first group of nozzles (111) and the second group of nozzles (112) are arranged to fit the substrate (W) when viewed from a plane. The nozzles (111, 112) are formed at a position higher than the substrate (W). Also, the nozzle (111, 112) may be configured to be movable so as not to interfere with the second conveying mechanism (WTR2).

[0195] The upper and lower chuck rotation part (89) sets the orientation of the substrate (W) held by the upper and lower chucks (81, 83) to either a vertical orientation or an oblique orientation. In this state, the nozzle (111, 112) supplies pure water in the form of a shower or mist to the substrate (W) held by the upper and lower chucks (81, 83). Additionally, the oblique orientation is a position in which the device surface of the substrate is facing upward.

[0196] For example, when the center robot (CR) stops conveying the substrate (W), drying of the substrate (W) held by the upper and lower chucks (81, 83) can be prevented. Also, when feeding, if the substrate (W) is in a horizontal position, it is difficult for the shower-like or mist-like pure water to reach the entire surface of the device. However, by making the substrate (W) in a vertical position and the device surface in an upward oblique position, it becomes easier for the shower-like or mist-like pure water to reach the entire surface of the device.

[0197] Additionally, the substrate processing device (1) may adopt both the configuration shown in FIG. 14(a) and the configuration shown in FIG. 14(b). Also, the substrate processing device (1) may adopt only one of the configuration shown in FIG. 14(a) and the configuration shown in FIG. 14(b).

[0198] Example 3

[0199] Next, Example 3 of the present invention will be described with reference to the drawings. Also, descriptions that overlap with Examples 1 and 2 will be omitted. FIG. 15 is a plan view showing the schematic configuration of a substrate processing apparatus (1) related to Example 3. FIG. 16(a) and FIG. 16(b) are side views for explaining buffer sections (114, 116) related to Example 3.

[0200] The buffer section (33) of Examples 1 and 2 is fixed to the bottom surface of the boundary between the material block (5) and the single-wafer transport area (R2) without moving. In this respect, the two buffer sections (114, 116) of Example 3 can move in the forward and backward direction (X) where the single-wafer transport area (R2) extends.

[0201] Refer to FIG. 15 and FIG. 16(a). A substrate processing device (1) comprises a first buffer section (114), a second buffer section (116), a horizontal moving section (118), and a horizontal moving section (120). Each of the two buffer sections (114, 116) comprises a plurality (e.g., 25) of mounting shelves arranged at a predetermined interval (full pitch) in the vertical direction (Z). Additionally, the horizontal moving sections (118, 120) each correspond to the mounting section moving mechanism of the present invention. Furthermore, in FIG. 15, the horizontal moving section (120) is depicted as being interrupted in the middle, but the horizontal moving section (120) is configured in the same way as the horizontal moving section (118).

[0202] Two buffer sections (114, 116) are formed to be movable in a single-wafer substrate transport area (R2). A horizontal movement section (118) moves the first buffer section (114) in the forward / backward direction (X). A horizontal movement section (120) moves the second buffer section (116) in the forward / backward direction (X). Each of the two horizontal movement sections (118, 120) is equipped with a linear actuator including an electric motor. Each of the horizontal movement sections (118, 120) is formed so as not to interfere with the center robot (CR).

[0203] As shown in FIG. 16(a), the buffer sections (114, 116) are each moved, for example, near the fourth single-wafer processing chamber (SW4) and between the boundary of the single-wafer substrate transport area (R2) and the material block (5). This will be explained in detail. The buffer sections (114, 116) are each moved between the recovery position (PP2) and the batch return position (PP3).

[0204] The recovery position (PP2) is a position adjacent to the material block (5) of the fourth single-wafer processing chamber (SW4) when viewed in the width direction (Y) (see FIG. 16(a)). Alternatively, the recovery position (PP2) is a position between the nearest fourth single-wafer processing chamber (SW4) and the material block (5) when viewed in the width direction (Y), and is a position further from the material block (5) than the batch return position (PP3). The batch return position (PP3) is a position where the batch return mechanism (HTR) can be accessed, and is a position closer to the material block (5) than the recovery position (PP2). Both positions (PP2, PP3) are preset positions.

[0205] The substrate processing device (1) of Example 3 operates as follows. For example, the horizontal moving unit (118) moves the first buffer unit (114) to the recovery position (PP2).

[0206] The center robot (CR) returns the substrate (W1), which has been dried in either one of the single-wafer processing chambers (SW3, SW4), to the first buffer section (114). Since the center robot (CR) does not need to move near the batch return robot (HTR), the return efficiency of the substrate (W) can be improved.

[0207] When 25 substrates (W1) are returned to the first buffer section (114), the horizontal moving section (118) moves the first buffer section (114) from the recovery position (PP2) to the batch return position (PP3). After that, the batch return mechanism (HTR) returns the 25 substrates (W1) in batches from the first buffer section (114) to an empty carrier (C) placed on the shelf (13A). When the first buffer section (114) is empty, the horizontal moving section (118) moves the empty first buffer section (114) from the batch return position (PP3) to the recovery position (PP2).

[0208] After 25 substrates (W1) are returned to the first buffer section (114), the center robot (CR) returns the substrates (W2) that have been dried in either of the single-wafer processing chambers (SW3, SW4) to the second buffer section (116) at the recovery position (PP2).

[0209] When 25 substrates (W2) are returned to the second buffer section (116), the horizontal moving section (120) moves the second buffer section (116) from the recovery position (PP2) to the batch return position (PP3). After that, the batch return mechanism (HTR) returns the 25 substrates (W2) in batches from the second buffer section (116) to an empty carrier (C) placed on the shelf (13A). When the second buffer section (116) is empty, the horizontal moving section (120) moves the second buffer section (116) from the batch return position (PP3) to the recovery position (PP2). In this way, the movement of the two buffer sections (114, 116) is repeated.

[0210] Next, a variation of Example 3 will be described. In Example 3, the two buffer units (114, 116) were moved between a preset retrieval position (PP2) (a fixed position) and a batch return position (PP3). In this case, the retrieval position (PP2) is not set, and the two buffer units (114, 116) each follow the center robot (CR). It is okay to move it to do ).

[0211] As shown in FIG. 16(b), the horizontal moving part (118) follows the center robot (CR). The first buffer unit (114) is moved in the forward and backward direction (X) so as to ) . Also, the horizontal movement unit (120) follows the center robot (CR). The second buffer section (116) is moved in the forward and backward direction (X) so as to ) follow the center robot (CR). By doing so, ( Since each buffer section (114, 116) is moved in this way, the center robot (CR) can quickly return the substrate (W) to each buffer section (114, 116).

[0212] For example, when a preset number of substrates (e.g., 25) of substrates (W1 (W2)) are returned to the first buffer unit (114), the horizontal movement unit (118) moves the first buffer unit (114) to the batch return position (PP3). Therefore, the batch return mechanism (HTR) can return the 25 substrates (W1 (W2)) to the carrier (C). When the first buffer unit (114) is emptied by the batch return mechanism (HTR), the horizontal movement unit (118) again follows the center robot (CR) ( To do so, the first buffer section (114) is moved in the forward and backward direction (X).

[0213] In addition, according to the present embodiment, the buffer sections (114, 116) are each formed to be movable to a single-wafer substrate transport area (R2). The horizontal moving section (118, 120) moves the buffer sections (114, 116) in the direction in which the single-wafer substrate transport area (R2) extends. Since the buffer sections (114, 116) are each moved by the horizontal moving section (118, 120), the center robot (CR) does not need to move to the vicinity of the batch transport mechanism (HTR), thereby improving the transport efficiency of the substrate (W).

[0214] Also, the horizontal movement unit (118, 120) follows the center robot (CR). To do so, the buffer sections (114, 116) are each moved in the forward and backward direction (X) where the single-wafer transport area (R2) is extended. Follow the center robot (CR). Since each buffer section (114, 116) is moved in this way, the center robot (CR) can quickly return the substrate (W) to each buffer section (114, 116).

[0215] Example 4

[0216] Next, Example 4 of the present invention will be described with reference to the drawings. Also, descriptions that overlap with Examples 1 to 3 will be omitted. FIG. 17 is a plan view showing the schematic configuration of a substrate processing apparatus (1) related to Example 4.

[0217] In Examples 1 to 3, the second position changing mechanism (31) is formed on the opposite side of the material block (5) via six batch processing tanks (BT1 to BT6). The location of the second position changing mechanism (31) is not limited to this. For example, in Example 4, the second position changing mechanism (31) may be formed between two batch processing tanks (BT5, BT6) among a plurality (e.g., six) of batch processing tanks (BT1 to BT6). Also, the two batch processing tanks are not limited to batch processing tanks (BT5, BT6).

[0218] Refer to FIG. 17. A second position changing mechanism (31) is formed between two batch processing tanks (BT5, BT6). That is, the second position changing mechanism (31) is positioned between three batch processing tanks (BT1, BT2, BT5) and three batch processing tanks (BT3, BT4, BT6). Also, washing tanks (BT5, BT6) are positioned on both sides of the second position changing mechanism (31).

[0219] In FIG. 17, the first conveying mechanism (WTR1) conveys a plurality of substrates (W) in a batch from the batch processing tank (BT1) on the side closer to the material block (5) toward the second position changing mechanism (31), and also conveys a plurality of substrates (W) in a batch from the batch processing tank (BT4) on the side farther from the material block (5) toward the second position changing mechanism (31). That is, a plurality (e.g., 50 substrates) of substrates (W) are conveyed in order to one of the two chemical treatment tanks (BT1, BT2) and the water washing treatment tank (BT5), and also conveyed in order to one of the two chemical treatment tanks (BT3, BT4) and the water washing treatment tank (BT6).

[0220] According to the present embodiment, since the second position change mechanism (31) is formed between two batch processing tanks (BT5, BT6), the distance from the second position change mechanism (31) to each single-wafer processing chamber (SW1 to SW4) can be made relatively even. Therefore, the center robot (CR) can transport the substrate (W) starting from near the center of the single-wafer substrate transport area (R2). Therefore, the travel distance of the center robot (CR) can be reduced, and the transport efficiency of the substrate (W) can be improved.

[0221] Example 5

[0222] Next, Example 5 of the present invention will be described with reference to the drawings. Also, descriptions that overlap with Examples 1 to 4 will be omitted. FIG. 18 is a plan view showing the schematic configuration of a substrate processing apparatus (1) related to Example 5.

[0223] In Examples 1 to 3, the second position changing mechanism (31) is formed on the opposite side of the material block (5) via six batch processing tanks (BT1 to BT6). The location of the second position changing mechanism (31) is not limited to this. For example, in Example 5, the second position changing mechanism (31) is formed between the material block (5) and a plurality (e.g., six) of batch processing tanks (BT1 to BT6).

[0224] Refer to FIG. 18. The second position change mechanism (31) is adjacent to the material block (5). The batch substrate transport mechanism (WTR1) transports multiple substrates (W) in bulk from the batch processing tank (BT1 (BT3)) on the side far from the material block (5) to the second position change mechanism (31) via the batch processing tank (BT5 (BT6)) on the side close to the material block (5).

[0225] According to the present embodiment, the second position change mechanism (31) is positioned near the material block (5). Therefore, the substrate (W) can be transported starting from the material block (5). Also, since the chemical treatment tanks (BT1 to BT4) can be positioned away from the material block (5), adverse effects such as corrosion of the mechanism (HTR) of the material block (5) by the chemical atmosphere can be suppressed. Additionally, many single-wafer processing chambers (SW1 to SW4) can be arranged along the single-wafer substrate transport area (R2).

[0226] The present invention is not limited to the above embodiments and can be modified as follows.

[0227] (1) In each of the embodiments described above, the entire length region (R5) of the substrate processing device (1) of FIG. 1 was adjacent to the stoker block (3). In this respect, the entire length region (R5) of the substrate processing device (1) of FIG. 19 does not have to be adjacent to the stoker block (3). That is, one end of the entire length region (R5) of FIG. 19 may be adjacent to the material block (5) and may be extended in the front-rear direction (X) to the single-wafer processing area (R3).

[0228] (2) In each embodiment and each variant described above, the guide rail of the horizontal moving part (41) of the center robot (CR) is formed on the bottom surface of the single-wafer transport area (R2). Instead, as shown in FIG. 20, the guide rail (41A) of the horizontal moving part (41) of the center robot (CR) is formed above the single-wafer transport area (R2), and the lifting and rotating part (39) of the center robot (CR) may be hung upside down on the guide rail (41A).

[0229] The center robot (CR) is equipped with a mechanism body (123) (two hands (35A, 35B), a reciprocating part (37), a lifting and rotating part (39)) and a horizontal moving part (41). The horizontal moving part (41) is equipped, for example, with a guide rail (41A), a slider (41B), a screw shaft, and an electric motor. The guide rail (41A) is formed in a forward-backward direction (X) so as to follow the single-wafer substrate transport area (R2) above the single-wafer substrate transport area (R2). For example, the guide rail (41A) is formed on the ceiling surface (125) of the single-wafer substrate transport area (R2) (or processing block (7)). Additionally, the guide rail (41A) corresponds to the upper rail of the present invention.

[0230] The mechanism body (123) moves in the forward and backward direction (X) along the guide rail (41A) while suspended from the guide rail (41A). This prevents droplets falling from the wet substrate (W) from contaminating, for example, the moving part (37) and the lifting and rotating part (39). For example, there is a risk that the center robot (CR) may malfunction if the moving part (37), etc., becomes contaminated with droplets, but this can be prevented.

[0231] Additionally, as shown in FIG. 20, when the first hand (35A) is formed above the second hand (35B), the first hand (35A) is used to transport the substrate (W) after drying treatment, and the second hand (35B) is used to transport the wet substrate (W) from the second position change mechanism (31) to one of the single-wafer processing chambers (SW3, SW4).

[0232] (3) In each of the embodiments and variations described above, the single-wafer processing chambers (SW3, SW4) perform a drying treatment of the substrate (W) using a supercritical fluid. In this regard, the single-wafer processing chambers (SW3, SW4) may each be equipped with a rotary processing unit (45) and a nozzle (47), just like the single-wafer processing chambers (SW1, SW2). In this case, the single-wafer processing chambers (SW1 to SW4) each supply, for example, pure water and IPA to the substrate (W) in sequence, and then perform a drying treatment (spin drying) of the substrate (W).

[0233] (4) In each embodiment and each variant described above, the configuration shown in FIG. 4(a) was adopted as the second posture change mechanism (31). In this regard, for example, the same configuration as the first posture change mechanism (15) shown in FIG. 3(a) to FIG. 3(f) may be adopted as the second posture change mechanism (31).

[0234] (5) In each embodiment and each variant described above, each batch processing unit (BT1 to BT6) processed 50 substrates (W) arranged in a half-pitch and face-to-face manner. However, each batch processing unit (BT1 to BT6) may process substrates (W) arranged in a face-to-back manner where the device surfaces of all substrates (W) face the same direction. Each batch processing unit (BT1 to BT6) may process 25 substrates (W) per carrier (C) arranged in a full pitch. In addition, in FIG. 11(b), when 50 substrates (W) are arranged in a face-to-back manner, the opening / closing unit (71) moves two chucks (69, 70) in the front-to-back direction (X) where the substrates (W) are aligned, thereby discharging 25 substrates (W1) or 25 substrates (W2). Explanation of the symbols

[0235] 1 : Substrate processing device 3: Stalker Block 5 : Lee Jae Block 7 : Processing block 13A : Shelf HTR: Batch return mechanism 15: First posture change mechanism PP: Substrate receiving position R1: Batch processing area R2: Single-wafer substrate transport area R3: Single-wafer processing area R4: Batch substrate return area 31: Second posture change mechanism BT1 ~ BT6: Batch treatment tanks SW1 ~ SW4: Single-wafer processing chambers CR: Center Robot 33 : Buffer section 41: Horizontal movement part 41A: Guide rail WTR1: 1st return mechanism 59 : Control unit 61: Pusher mechanism WTR2: Second return mechanism 63: Attitude conversion section 114,116 : Buffer section 118, 120: Horizontal moving part 123 : Device body 125 : Ceiling surface

Claims

Claim 1 A substrate processing device for continuously performing batch processing for processing multiple substrates collectively and single-wafer processing for processing substrates one by one comprises a stocker block, a transfer block adjacent to the stocker block, a processing block adjacent to the transfer block, and a substrate placement section for placing multiple substrates in a vertical direction at a predetermined interval in a horizontal position. The stocker block comprises at least one carrier for receiving multiple substrates in a horizontal position at the predetermined interval in a vertical direction, and at least one carrier placement shelf for removing and storing substrates on which the carrier is placed for receiving and discharging substrates from the carrier. The transfer block comprises a substrate handling mechanism for collectively removing and storing multiple substrates from a carrier placed on the carrier placement shelf, and a first position change mechanism for collectively changing the position of multiple substrates from a horizontal position to a vertical position. The processing block comprises a batch processing area extending in a direction away from the transfer block, and one end of which is located close to the transfer block. A single-wafer processing area extending in a direction away from the material block at one end, a single-wafer substrate transport area interposed between the batch processing area and the single-wafer processing area, with one end adjacent to the material block and the other end extending in a direction away from the material block, and a batch substrate transport area formed along the batch processing area, with one end extending to the material block and the other end extending in a direction away from the material block; wherein the batch processing area comprises a plurality of batch processing tanks arranged to collectively immerse and process a plurality of substrates in the direction in which the batch processing area extends, and a second orientation conversion mechanism formed to collectively convert the orientation of a plurality of substrates from a vertical orientation to a horizontal orientation, wherein the single-wafer processing area comprises a single-wafer processing chamber formed to process substrates one by one in the direction in which the single-wafer processing area extends, and wherein the single-wafer substrate transport area comprisesA substrate processing apparatus is characterized in that a single-wafer substrate conveying mechanism is formed between the second position changing mechanism, the single-wafer processing chamber, and the substrate placement section for conveying a substrate, and in the batch substrate conveying area, a batch substrate conveying mechanism is formed between a predetermined substrate receiving position within the transfer block, the plurality of batch processing tanks, and the second position changing mechanism for conveying a plurality of substrates in a batch. Furthermore, the substrate handling mechanism of the transfer block conveys a plurality of substrates in a batch to the first position changing mechanism and also conveys a plurality of substrates in a batch from the substrate placement section. Claim 2 A substrate processing apparatus according to claim 1, wherein the second position conversion mechanism is formed on the opposite side of the material block via the plurality of batch processing tanks. Claim 3 A substrate processing apparatus according to claim 1, wherein the second position conversion mechanism is formed between two of the plurality of batch processing tanks. Claim 4 A substrate processing apparatus according to claim 1, wherein the second position conversion mechanism is formed between the material block and the plurality of batch processing tanks. Claim 5 A substrate processing apparatus according to any one of claims 1 to 4, wherein the substrate placement portion is formed by being fixed to any one of the boundary between the transfer block and the single-wafer substrate transport area, the transfer block, and the single-wafer substrate transport area. Claim 6 A substrate processing apparatus according to any one of claims 1 to 4, further comprising a substrate placement unit moving mechanism, wherein the substrate placement unit is movably formed in the single-wafer substrate transport area, and the substrate placement unit moving mechanism moves the substrate placement unit in the direction in which the single-wafer substrate transport area extends. Claim 7 In claim 6, the above-mentioned placement unit movement mechanism is such that the substrate placement unit follows the single-wafer substrate transport mechanism ( A substrate processing apparatus characterized by moving the substrate placement portion in the direction in which the single-wafer substrate transport area is extended, so as to ) Claim 8 A substrate processing apparatus according to any one of claims 1 to 4, wherein the single-wafer substrate transport mechanism comprises a mechanism body and an upper rail formed above the single-wafer substrate transport area and also following the single-wafer substrate transport area, and wherein the mechanism body is configured to move along the upper rail while being suspended from the upper rail. Claim 9 A substrate processing apparatus according to any one of claims 1 to 4, wherein the second orientation conversion mechanism comprises: a substrate holding part for holding a plurality of substrates in a vertical orientation conveyed by the batch substrate conveying mechanism; a substrate extraction mechanism capable of extracting two or more substrates from the plurality of substrates held by the substrate holding part; and an orientation conversion part for collectively converting the orientation of the two or more substrates extracted by the substrate extraction mechanism from a vertical orientation to a horizontal orientation.

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