ARC-RESISTANT THERMOPLASTIC BASE MATERIAL FOR ELECTRICAL APPLICATIONS

Abstract

The concept described relates to thermoplastic-based materials, for example, thermoplastic-based composites, which are suitable replacements for known heat-setting-based materials, for example, unsaturated polyesters, as insulators for circuit protection in electrical contact / non-contact applications, such as, but not limited to, housings, linings, enclosures, or encapsulated or overmolded parts. In certain embodiments, thermoplastic-based materials house miniature circuit breakers, and arc-fault and ground-fault circuit breakers.

Description

THERMOPLASTIC-BASED FLASH RESISTANT MATERIAL FOR ELECTRICAL APPLICATION FIELD OF INVENTION The concept described generally refers to sustainable thermoplastic-based insulation materials for electrical contact and non-contact electrical applications, to resist electric arc and electrical discharge during a short circuit event to ensure circuit protection. BACKGROUND OF THE INVENTION During a short-circuit event, the overload current, which is approximately several orders of magnitude greater than the rated current, flows through the electrical circuit. To protect the circuit from damage caused by this overload current, circuit breakers temporarily disconnect the electrical contact. The excess current flowing through the circuit is instantly discharged as a high-energy electric arc. This arc must be immediately extinguished to prevent further fire spread and ensure safety. Insulators are generally used for circuit protection in electrical contact / non-contact applications, such as enclosures, encapsulated or overmolded parts. Ref. 331787 Connectors, switches, and the like. Thermoset materials, such as epoxies and unsaturated polyesters, are commonly used in electrical and electronic systems as insulating materials and to protect electrical components from short circuits. These thermoset materials are used as adhesives, sealants, coatings, impregnants, enclosures, molds, and encapsulation compounds to create void-free insulation around electrical components. Amine-cured epoxies and anhydride-cured epoxies are frequently used as adhesives, sealants, impregnants, and coatings. Anhydride-cured epoxies are primarily used for encapsulation and creating encapsulations. Amine-cured epoxies are used in overmolded electrical components. A specific thermoset material is selected for a given application based on multiple factors, such as desirable dielectric properties, as well as physical and mechanical strength, chemical resistance, operating temperature range and thermal cycling, dimensional stability, creep resistance under load, and resistance to shock and vibration. Desirable dielectric properties include dielectric strength, partial discharge resistance, volume resistivity, surface resistivity, dielectric constant, arc resistance, and dissipation factor. These properties can be affected by temperature and the addition of inorganic fillers, such as silica, alumina, and glass. However, there are disadvantages associated with known thermoset materials. Thermoset materials are cross-linked; once a molded part is no longer needed for its intended use, it must be disposed of or incinerated. In both situations, the carbon footprint is substantial. Furthermore, during thermoset molding, toxic and volatile emissions can pose serious health risks to humans during long-term exposure. Therefore, there is a desire and a need in the art to develop suitable replacement materials. For example, thermoplastic-based materials have been considered as a viable replacement for traditional epoxies and unsaturated polyesters.Thermoplastic-based materials exhibit advantages such as being recyclable and comparatively sustainable; they can be manufactured at a lower cost and with faster cycle times than thermoset materials; they can increase design flexibility (reduced wall thickness, press-fit features, and the like); and they are lightweight, providing ease of installation. However, thermoplastic-based materials also have associated disadvantages, such as high moisture absorption and susceptibility to ultraviolet light. ozone damage; and, generally, they exhibit little environmental resistance compared to thermoset materials. Therefore, there remains a need in the field to develop improved thermoplastic-based compounds, such as polymers, to encapsulate and insulate electrical components that exhibit the desirable properties of thermoplastic materials while minimizing or eliminating their associated disadvantages. According to the concept described, filler(s) and additive(s), such as charged materials, can be incorporated into a thermoplastic polymer matrix to enhance its electrical properties and its ability to quell high-energy arcs, thus protecting the circuit. SUMMARY OF THE INVENTION The aforementioned and other needs are met through modalities of the described concept, which provide thermoplastic-based compounds for insulating materials for electrical contact and non-contact applications, to resist electrical discharge and arcing during a short-circuit event to ensure circuit protection. In one aspect, the described concept provides a thermoplastic-based composite insulator, comprising 30 to 70 wt% of a thermoplastic polymer matrix; 10 to 40 wt% of a non-halogenated flame-retardant filler; 0.1 to 2 wt% of a processing aid and interfacial adhesion promoter; 5 to 40 wt% of a reinforcing filler; and 5 to 15 wt% of a functional filler, wherein the thermoplastic-based composite insulator has a selected shape of the housing, lining, enclosure, encapsulated or overmolded part for an electrical contact / non-contact component, and wherein the thermoplastic-based composite insulator is effective in inactivating a high-energy arc generated during a short-circuit event. The thermoplastic polymer matrix may be selected from the group consisting of polybutylene terephthalate, polyethylene terephthalate, polyamide, polycarbonate, polyphenylene ether, polyphenylene sulfide, polyoxymethylene, polyacetal, polypropylene, polyethylene, polyetherimide, polyether-ether-ketone, polyethersulfone, and combinations and mixtures thereof. The thermoplastic polymer matrix may be selected from the group consisting of polybutylene terephthalate (PBT), polyamide (PA), and combinations and mixtures thereof. The non-halogenated flame retardant filler is selected from the group consisting of: phosphorus-based compounds, phosphate-based compounds, metal hydroxide-based compounds, and combinations and mixtures thereof. The non-halogenated flame retardant filler may be selected from the group consisting of melamine polyphosphate, melamine phosphinate, metal phosphonate, zirconium phosphate, ML / aluminum-based oxide, magnesium-based oxide, magnesium-based hydroxides, aluminum-based hydroxides, zinc borate, metal oxides, and combinations and mixtures thereof. The non-halogenated flame-retardant filler agent may be selected from the group consisting of a metal hydroxide-based compound and aluminum monohydrate, and optionally mica. The processing aid and interfacial adhesion promoter can be selected from the group consisting of fumed alumina, fumed silica, polyhedral oligomeric silsesquioxane, and combinations and mixtures thereof. The reinforcing filler agent may include glass fibers. The functional filler agent can be selected from the group consisting of nanoclay, nanotalc, mica, and combinations and mixtures of these. In certain models, a carbon-free dye is added to achieve a black color while maintaining arc / tracking resistance. In another aspect, the described concept provides an electrical contact / non-contact component housed in a thermoplastic-based compound, which includes 30 to 70 wt% of a thermoplastic polymer matrix; 10 to 40 wt% of a non-halogenated flame-retardant filler agent; 0.1 to 2 wt% of a processing aid and interfacial adhesion promoter; 5 to 40 wt% of a reinforcing filler agent; and 5 to 15 wt% of a functional filler agent, wherein the thermoplastic-based compound has a selected shape of coating, enclosure, encapsulated part, or overmolded part, and wherein the thermoplastic-based compound is effective in inactivating a high-energy arc generated during a short-circuit event. The thermoplastic-based compound can provide an arc resistance of 120 to 180 s, a comparative tracking index of 400 to 600 volts, a flame retardant rating of V2 to V0, and a dielectric strength of 15 to 25 kV / mm. The component is suitable for low-voltage applications with an insulation capacity of 12 to 240 V and a rating of 15–30 A. It can be installed in indoor or semi-indoor environments. The thermoplastic-based compound can house a miniature circuit breaker or an arc-to-ground fault circuit interrupter (AFFI). In yet another aspect, the described concept provides a method for isolating a contact / non-contact electrical component from a thermoplastic base compound. The method includes combining 30 to 70 wt% of a thermoplastic polymer, 10 to 40 wt% of a non-halogenated flame-retardant filler, 0.1 to 2 wt% of a processing aid and interfacial adhesion promoter, 5 to 40 wt% of a reinforcing filler, and 5 to 15 wt% of a functional filler to form the thermoplastic base compound; constructing the contact / non-contact electrical component from the thermoplastic base compound; and placing the contact / non-contact electrical component in an indoor or quasi-indoor environment. The construction stage may include a process selected from the group that consists of applying, depositing, and positioning the thermoplastic base compound to encapsulate the contact / non-contact electrical component. The construction stage may include introducing the thermoplastic base compound into an injection or compression molding process. DETAILED DESCRIPTION OF THE INVENTION The concept described generally refers to thermoplastic-based materials, for example, thermoplastic-based compounds, which are suitable replacements for known heat-setting-based materials, for example, unsaturated polyesters, as insulators for circuit protection in electrical contact / non-contact applications, such as, but not limited to, housings, linings, enclosures, and encapsulated or overmolded parts that house or enclose one or more electrical components, including connectors, relay components, circuit breakers, circuit breakers, electromagnetic switches, terminal blocks, ground fault and arc fault circuit interrupters, actuators and isolation components, terminal switches, sensors, and the like. The housings, linings, and encapsulated or overmolded parts are composed of and / or constructed, wholly or partially, from the thermoplastic-based compounds described.Alternatively, housings, linings, enclosures, and encapsulated or overmolded parts have been deposited or applied to a surface of a coating, layer, or film that includes the thermoplastic-based compounds of the described concept. In certain embodiments, the housings, linings, enclosures, and encapsulated or overmolded parts house or enclose miniature circuit breakers, and arc-fault and ground-fault circuit breakers. For example, the casing pipe functions as a cap, a base, or a combination of a cap and a base to cover the component(s) housed therein. Thermoplastic-based materials are used as insulators in electrical contact / non-contact applications, for example, housings, linings, enclosures, and encapsulated or overmolded parts for operating environments that include indoors or quasi-indoors (within a closed / open operating environment) and more particularly, the applications are low voltage applications, such as residential applications with an insulation capacity of 12 to 240 V, with a rating of 15-30 A. Insulators ensure circuit protection by extinguishing the high-energy arc generated by electrical discharge. Furthermore, insulators ensure safety by maintaining adequate dielectric strength during short-circuit events. Traditional electrical or electronic housings, enclosures, and overmolded or encapsulated parts made of thermoset-based polymer / plastic materials are non-recyclable, disposable, or incinerated, and generally have higher carbon footprints. The use of thermoplastic-based materials, which are recyclable, more environmentally friendly, and have a lower carbon footprint, overcomes the problems associated with thermoset materials. However, thermoplastic-based materials in their original form do not have the inherent ability to withstand high-energy arcing and tracking.Therefore, thermoplastic-based materials are incorporated, for example, loaded, with appropriate ingredients or fillers such as flame retardant, mineral fillers, and nanoform or microform reinforcements, to give the thermoplastic-based materials their advantageous properties; for example, the ability to withstand high-energy arcing and tracking, which are inherent in heat-set-based materials. The concept described also includes methods for preparing the thermoplastic-based compounds, and methods for applying these thermoplastic-based compounds as insulators for circuit protection in electrical contact / non-contact applications. According to the described concept, a thermoplastic-based compound is developed by incorporating, for example, a filler, into a thermoplastic polymer, for example, the matrix, one or more filler agents that will impart one or more advantageous or desired properties, for example, those inherent in heat-setting materials. The resulting thermoplastic-based materials comply with EPA and California regulations, as well as Rach and RoHS standards, with reduced carbon footprints and imprints, and exhibit flame retardancy, arc resistance, tracking resistance, dielectric strength, and the long-term static / dynamic thermal and mechanical properties necessary for the intended application of circuit protection in electrical contact / non-contact applications.These materials and formulations are prepared and processed through a series of operations that include spraying techniques / processes, high shear mixing, extrusion, and injection molding. Thermoplastic-based compounds include a polymer matrix of thermoplastic polymer(s) or mixtures thereof. Suitable thermoplastic polymers for use are selected from a wide variety of known thermoplastic polymers, such as, but not limited to: polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyamide(s) (PA) (nylon) (PA6, PA66, PA6T, PA9T, PA12, PA4T), polycarbonate (PC), polyphenylene ether (PPE), polyphenylene sulfide (PPS), polyoxymethylene (POM) or polyacetal, polypropylene (PP), polyethylene (HDPE, 1DPE), polyetherimide (PEI), polyether ketone (PEEK), polyether sulfone (PES), and combinations and mixtures thereof. In certain formulations, the thermoplastic polymer is selected from polybutylene terephthalate (PBT), polyamide (PA), and combinations and blends thereof. The amount or concentration of thermoplastic polymer in the thermoplastic base compound varies.In certain forms, the thermoplastic polymer is present in a concentration range of 30 to 70% depending on the total weight of the thermoplastic base compound. The thermoplastic polymer(s) or mixtures thereof, for example, the matrix, are incorporated or loaded with one or more filler components including flame retardant filler, processing aid and interfacial adhesion promoter, functional filler and reinforcing filler, to form the thermoplastic base compounds. The flame-retardant filler is present in the thermoplastic base compound for arc (electric arc) quenching. During a short-circuit event, the resulting arc ionizes the oxygen in the air and converts it into oxygen free radicals (plasma medium). The generated plasma medium carries a tremendous amount of energy that needs to be quenched to prevent the arc from propagating into a fire. When exposed to high energy (during the arc formation event), the flame-retardant filler initiates degassing. During degassing, the flame-retardant filler generates free radicals in the surrounding environment. These free radicals combine with oxygen free radicals to inhibit the plasma. This phenomenon is responsible for extinguishing the arc. Suitable flame retardant filler agents include those that release free radicals during an arcing event. For example, halogen-based compounds are effective at arc inactivation because they release bromide or chloride ions during degassing to inactivate the arc plasma. However, halogenated thermoplastic-based flame retardants have been banned by the Environmental Protection Agency (EPA) due to their toxic effects on the environment and human life. Based on this concept, non-halogenated flame retardants are provided as alternatives to halogen-based flame retardants. In certain embodiments, the non-halogenated flame retardant filler ML / halogen includes one or more phosphorus-based and / or phosphate-based compounds and / or metal hydroxide-based compounds that are capable of releasing free radicals upon exposure to high energy and subsequently inhibiting the oxygen plasma generated by the short-circuit event, while complying with EPA and California regulations and meeting REACH and RoHS requirements. Non-halogen-based flame retardant filler includes single (or independent) compounds and / or synergistic combinations or compositions of non-halogen-based flame retardant, such as, but not limited to, melamine and / or phosphinate polyphosphates, metal phosphinate, zirconium phosphate, aluminum or magnesium oxides or hydroxides, zinc borates, metal oxides, and combinations and mixtures thereof. The amount or concentration of non-halogen-based flame retardant filler in the thermoplastic base compound varies.In certain forms, the non-halogen-based flame retardant filler is present in a concentration range of 10 to 40% depending on the total weight of the thermoplastic base compound. The arc formation phenomenon during a short-circuit event includes the following four stages: 1) arc generation, 2) arc discharge (air and surface), 3) arc tracking (surface), and 4) arc extinction. The flame-retardant, filler-loaded thermoplastic base compound responds to stage 2) by retarding arc formation on the insulating surface and releasing free radicals during degassing to inhibit plasma. During stage 3, the flame-retardant, filler-loaded thermoplastic compound forms a barrier layer with minimal charring, and in stage 4, it provides endothermic cooling of the substrate. In certain embodiments, the flame-retardant filler, for example, the non-halogenated flame-retardant filler, is selected and incorporated or loaded into the thermoplastic polymer matrix to inhibit flame during the gas phase of the short-circuit event. For example, melamine polyphosphate (MPP) generates PO2⁻, POs⁻, and PO₂⁻ free radicals during the gas phase, and inert N₂ gas is released during pyrolysis. Similarly, for example, metal phosphinate generates A₁PO₂⁻ free radicals and non-combustible gases during the gas phase. In other embodiments, the flame-retardant filler, for example, the non-halogenated flame-retardant filler, is selected and incorporated or loaded into the thermoplastic polymer matrix to scavenge radicals during both the gas and condensate phases. For example, aluminum monohydrate generates H⁺ and OH⁻ free radicals and forms a metal oxide layer, as well as water. The processing aid and interfacial adhesion promoter include one or more of fumed alumina, fumed silica, polyhedral oligomeric silsesquioxane (POSS), and combinations and mixtures thereof. The amount or concentration of the processing aid and interfacial adhesion promoter incorporated or loaded into the thermoplastic base compound varies. In certain embodiments, the processing aid and interfacial adhesion promoter are present at a concentration ranging from 0.1 to 2% based on the total weight of the thermoplastic base compound. In certain embodiments, improved dielectric properties are achieved by adding the processing aid and interfacial adhesion promoter, for example, fumed alumina and / or fumed silica. The reinforcing filler includes glass fibers. The amount or concentration of the reinforcing filler incorporated or loaded into the thermoplastic compound varies. In certain embodiments, the reinforcing filler is present at a concentration ranging from 5 to 40%, depending on the total weight of the thermoplastic base compound. In certain embodiments, improved strength and thermal conductivity are achieved through the addition of the glass fibers. The functional filler includes clay, mica, talc, or mixtures thereof. The amount or concentration of the functional filler incorporated or loaded into the thermoplastic base compound is variable. In certain embodiments, the functional filler is present at a concentration ranging from 5 to 15%, depending on the total weight of the thermoplastic base compound. Furthermore, the form of the functional filler varies. In certain embodiments, the functional filler is in the form of nanoparticles, for example, nanotalc and / or nanoclay, and / or microparticles. In certain models, a carbon-free colorant is added to the thermoplastic base compound to achieve a desired black color without sacrificing arc strength / tracking; for example, arc strength / tracking is maintained. Newly developed thermoplastic-based compound formulations improve one or more of the following thermoplastic polymer properties and characteristics: arc resistance of 120 to 180 seconds (PLC5 and PLC4), comparative tracking index (CTI) of 400 to 600 volts, flame retardant rating of V2 to V0, and dielectric strength of 15 to 25 kV / mm. In certain configurations, the dielectric strength can be improved by 1.5 to 3 times. Newly developed thermoplastic-based compound formulations, and housings, linings, enclosures, and encapsulated or overmolded parts that are wholly or partially composed of or constructed from these, provide one or more of the following arc quenching mechanisms or processes: they quench and inhibit the ions and plasma generated during arcing; they do not release any of the toxic gases; they function in both gaseous and condensed / substrate phases; and they promote the formation of non-carbonaceous residue. According to the concept described, thermoplastic-based compound formulations are applicable for forming and / or constructing electrical / electronic housings, linings, enclosures, and encapsulated or overmolded parts that house one or more electrical / electronic components, including connectors, relay components, switches, circuit breakers (e.g., miniature circuit breakers), electromagnetic switches, terminal blocks, earth fault and arc fault circuit interrupters, actuators and insulating components, terminal switches, and sensors. Thermoplastic-based compounds are effective as insulators, providing circuit protection and the ability to pass short-circuit testing. For example, a thermoplastic-based compound comprising polybutylene terephthalate passes the short-circuit test with excellent performance. The UL489 Sequence Z program is used to represent a polymer's ability to repeatedly interrupt short-circuit faults and retain its insulating properties when the breaker trips and the contacts separate. A 20-ampere circuit breaker rated at 120 / 240 V is tested in pairs. A 5000-ampere short-circuit fault is performed three times. The power factor is established. MA / between 0.45-0.50. After the short-circuit test, the Sequense Z procedure requires the circuit breaker to pass a dielectric voltage withstand test. A 120 / 240 V circuit breaker in the off and disconnected position must withstand 1480 V (7.1.9) without breakdown for 60 seconds. The test equipment monitors the leakage current at the load-side connection. In certain embodiments, the thermoplastic base compound comprising polybutylene terephthalate is loaded with a non-halogenated, metal hydroxide-based flame retardant filler. In certain embodiments, the non-halogenated, metal hydroxide-based flame retardant filler is aluminum monohydrate (also known as boehmite), which is optionally combined with mica. This thermoplastic base compound is applicable to both the gas and condensate phases and is highly effective at arc quenching. Furthermore, the thermoplastic base compound promotes less charring after an arcing event, which is important since carbonaceous charring can potentially promote dielectric failure because it is conductive. According to the described concept, a thermoplastic-based compound is positioned to cover the outer surface of an electrical component, such as an insulator. The thermoplastic-based compound can provide a variety of desirable properties depending on the specific fillers selected to form it. This compound can be used in a variety of applications, including housing, coating, molding, and encapsulation for circuit protection of an electrical component. A thermoplastic-based material is generally described as a plastic material, e.g., a polymer, that becomes flexible or moldable above a specific temperature (e.g., softens or melts with heat) and solidifies (e.g., hardens and becomes rigid) upon cooling. As described above, the thermoplastic-based compounds of the described concept include thermoplastic polymers, for example, a thermoplastic polymer matrix. Suitable thermoplastic polymers for use in the described concept are commercially available, such as polybutylene terephthalate resin under the trade names PBT-CRASTIN® LW9030 NC010 (DuPont), PBT-ULTRADUR® B4450GF (BASF), and PBT-CELANEX® XFR 6842 GF30 (Celanese). Generally, the term nanosize or nanoparticle refers to a particulate material with an average particle size between 1 and 100 nanometers. Nanoparticles can be distinguished from particles with a size in the micron range. That is, the terms microsize and microparticle refer to particulate material with an average particle size greater than approximately 1 pm. Nanoparticles of any size, i.e., ranging from approximately 1 nm to less than approximately 100 nm, can be used in the compositions described. Micro- and / or nano-sized fillers can include microparticles, microtubes, microplatelets, microfibers, nanoparticles, nanotubes, nanoplatelets, nanofibers, and mixtures thereof, and can be specifically selected and added to provide enhanced electrical properties to the thermoplastic base compound. For example, the thermoplastic polymer matrix, such as resin, generally exhibits lower dielectric properties than the filler. Non-limiting examples of micro- and / or nano-sized fillers include alumina, silica, polyhedral oligomeric silsesquioxanes, glass fibers, other inorganic materials, and mixtures thereof. These fillers provide enhanced dielectric properties to the thermoplastic base compound. Thermoplastic-based compounds are prepared according to conventional methods and processes, using traditional techniques and equipment. For example, the thermoplastic polymer, a thermoplastic polymer matrix, a resin, and filler(s) are combined to form a mixture. The order in which these components are combined, such as loading the filler(s) into the thermoplastic polymer matrix, is not critical and is typically performed at ambient temperature and atmospheric pressure. In certain embodiments, a twin-screw extrusion process is used to combine the new thermoplastic-based compound formulation, followed by conventional molding methods such as injection molding, compression molding, or additive manufacturing, to produce the finished part, such as housings, linings, enclosures, and encapsulated or overmolded parts. The thermoplastic-based compounds of the described concept form a coating, enclosure, encapsulated part, or overmolded part using various conventional methods and processes. Conventional insulation or encapsulation materials are formed using a casting process, which includes a setting / curing period, for example, approximately 810 hours. In certain embodiments of the described concept, an electrical component is housed, insulated, or encapsulated directly with the thermoplastic-based compound. For example, the polymer / filler formulation produces a thermoplastic-based compound that is applied, deposited, or placed on the surface of an electrical component. In other embodiments, the electrical component is housed, insulated, or encapsulated indirectly with the thermoplastic-based compound.In these embodiments, a conventional injection molding or compression molding process and associated equipment are typically used. The polymer / filler formulation is injected into a mold to form a thermoplastic base compound shell. The electrical component is then placed within this outer shell. If the electrical component is housed or encapsulated directly or indirectly with the thermoplastic base compound, there is optionally a buffer between the surface of the electrical component and the thermoplastic base compound. In certain embodiments, the buffer is in the form of an air gap or a material, such as, but not limited to, a polyurethane ceramic material, located between the surface of the electrical component and the thermoplastic base compound. In certain other forms, the thermoplastic-based compound is formed using conventional additive manufacturing processes and associated apparatus. In still other configurations, the thermoplastic-based compound is applied to the surface of the electrical component as a coating, layer, or film. The thermoplastic-based compound is applied using conventional thermal deposition processes. Before applying the thermoplastic-based compound, the surface of the electrical component is optionally subjected to a preparation process. The preparation process includes a pre-coating or surface pretreatment to facilitate or improve application and / or ML / adhesion of the thermoplastic base compound to these. Thermoplastic-based compounds encompass a wide range of thicknesses. In some applications, thermoplastic-based compounds are injection-molded parts with thicknesses ranging from approximately 0.5 mm to a few inches. In other applications, where the thermoplastic compounds are a coating or film, the thickness can range from approximately 10 microns to approximately 225 microns. Although specific embodiments of the described concept have been outlined in detail, those skilled in the art will appreciate that various modifications and alternatives to these details could be developed in light of the general principles of the description. Accordingly, the particular arrangements described are intended to be illustrative only and not to limit the scope of the described concept, which is to be given the full extent of the appended claims and any equivalents thereof. It is hereby stated that, as of this date, the best method known to the applicant for putting the aforementioned invention into practice is the one that is clear from the present description of the invention.

Claims

1. A thermoplastic-based composite insulator, characterized in that it comprises: 30 to 70 percent by weight of a thermoplastic polymer matrix; 10 to 40 percent by weight of a non-halogenated flame-retardant filler; 0.1 to 2 percent by weight of a processing aid and an interfacial adhesion promoter; 5 to 40 percent by weight of a reinforcing filler; and 5 to 15 percent by weight of a functional filler, wherein the thermoplastic-based composite insulator is in a selected housing, lining, enclosure, or encapsulated or overmolded part for a contact / non-contact electrical component, and wherein the thermoplastic-based composite insulator is effective as to inactivate a high-energy arc generated during a short-circuit event.

2. The thermoplastic-based composite insulator according to claim 1, characterized in that the thermoplastic polymer matrix is ​​selected from the group consisting of polybutylene terephthalate, polyethylene terephthalate, polyamide, polycarbonate, polyphenylene ether, polyphenylene sulfide, polyoxymethylene, polyacetal, polypropylene, polyethylene, polyetherimide, polyether-etherketone, polyethersulfone, and combinations and mixtures thereof.

3. The thermoplastic-based composite insulator according to claim 1, characterized in that the thermoplastic polymer matrix is ​​selected from the group consisting of polybutylene terephthalate (PBT), polyamide (PA), and combinations and mixtures thereof.

4. The thermoplastic-based composite insulator according to claim 1, characterized in that the non-halogenated flame-retardant filler agent is selected from the group consisting of phosphorus-based compound, phosphate-based compound, metal hydroxide-based compound, and combinations and mixtures thereof.

5. The thermoplastic-based composite insulator according to claim 1, characterized in that the non-halogenated flame-retardant filler agent is selected from the group consisting of melamine polyphosphate, melamine phosphinate, metal phosphonate, zirconium phosphate, aluminum-based oxide, magnesium-based oxide, magnesium-based hydroxides, aluminum-based hydroxides, zinc borate, metal oxides, and combinations and mixtures thereof. MA / 6. The thermoplastic-based composite insulator according to claim 1, characterized in that the non-halogenated flame-retardant filler agent is selected from the group consisting of a metal hydroxide-based compound and aluminum monohydrate, and optionally mica.

7. The thermoplastic-based composite insulator according to claim 1, characterized in that the processing aid and the interfacial adhesion promoter are selected from the group consisting of fumed alumina, fumed silica, polyhedral oligomeric silsesquioxane, and combinations and mixtures thereof.

8. The thermoplastic-based composite insulator according to claim 1, characterized in that the reinforcing filler agent comprises glass fibers.

9. The thermoplastic-based composite insulator according to claim 1, characterized in that the functional filler agent is selected from the group consisting of nanoclay, nanotalc, mica, and combinations and mixtures thereof.

10. The thermoplastic-based composite insulator according to claim 1, characterized in that a carbon-free colorant is added to achieve a black color while maintaining arc / tracking resistance.

11. A contact / non-contact electrical component ML / housed in a thermoplastic base compound, characterized in that it comprises: 30 to 70 wt% of a thermoplastic polymer matrix; 10 to 40 wt% of a non-halogenated flame-retardant filler; 0.1 to 2 wt% of a processing aid and interfacial adhesion promoter; 5 to 40 wt% of a reinforcing filler; and 5 to 15 wt% of a functional filler, wherein the thermoplastic base compound is in a selected form of a coating, enclosure, or encapsulated or overmolded part, and wherein the thermoplastic base compound is effective as to inactivate a high-energy arc generated during a short-circuit event.

12. The electrical contact / non-contact component according to claim 11, characterized in that the thermoplastic base compound provides arc resistance of 120 to 180 seconds, comparative tracking index of 400 to 600 volts, flame retardant rating of V2 to V0, and dielectric strength of 15 to 25 kV / mm.

13. The electrical contact / non-contact component according to claim 11, characterized in that it has a low voltage application with an insulation capacity of 12 to 240 V with a rating of 15-30 A.

14. The electrical contact / non-contact component according to claim 11, characterized in that it is located in an indoor or quasi-indoor environment.

15. The electrical contact / non-contact component according to claim 11, characterized in that the thermoplastic base compound comprises a miniature circuit breaker, or an arc and ground fault circuit interrupter.

16. A method for isolating an electrical contact / non-contact component from a thermoplastic base compound, characterized in that it comprises: combining 30 to 70 wt% of a thermoplastic polymer, 10 to 40 wt% of a non-halogenated flame-retardant filler, 0.1 to 2 wt% of a processing aid and interfacial adhesion promoter, 5 to 40 wt% of a reinforcing filler, and 5 to 15 wt% of a functional filler to form the thermoplastic base compound; constructing the electrical contact / non-contact component from the thermoplastic base compound; and placing the electrical contact / non-contact component in an indoor or quasi-indoor environment.

17. The method according to claim 16, characterized in that the construction step comprises a process selected from the group consisting of applying, depositing, and positioning the thermoplastic base compound to encapsulate the electrical contact / non-contact component.

18. The method according to claim 16, characterized in that the construction step comprises introducing the thermoplastic base compound into an injection or compression molding process.