Method for transfer metal column and equipment thereof

Abstract

The present invention provides a method for transfer metal column and equipment thereof. The method for transfer metal column includes placing a fixture on a vibrating tray; placing multiple metal columns onto the fixture and activating the vibrating tray to allow the metal columns to fill multiple first micro-holes; removing the first layer plate and the second layer plate; inverting the fixture onto a glass substrate with multiple through-holes, allowing the metal columns that were filled into the first micro-holes to insert into the corresponding through-holes; removing the fixture, filling the multiple through-holes with a resin layer, and then drying the resin layer; and finally, removing the supporting mold and grinding the multiple protruding metal columns to make them flush with the glass substrate.

Description

[Technical Field]

[0001] This invention relates to a transfer method and apparatus, and more particularly to a metal column transfer method and apparatus. [Previous Technology]

[0002] Existing methods for mass transfer of copper pillars often employ a pick-and-place method, which involves placing solder, such as solder balls, onto the connector pads of a circuit board to transfer the copper pillars to the target location and securely bond them to the target. However, solder balls have poor stability during the soldering pressure process, making it difficult to meet the small-pitch insulation requirements of the connector pads. This method is no longer applicable to multi-chip packaging integration processes involving a large number of connector pads and tiny connector pad pitches. Furthermore, the transfer efficiency of existing methods is low, and they are gradually failing to meet the current advanced semiconductor packaging processes' requirements for mass transfer of copper pillars.

[0003] Therefore, how to improve the efficiency of transferring a large number of copper pillars through structural design improvements to overcome the above-mentioned defects has become one of the important issues that this project aims to solve. [Summary of the Invention]

[0004] The technical problem to be solved by the present invention is to provide a metal column transfer method and device in view of the shortcomings of the prior art.

[0005] To solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a method for transferring metal columns, which includes: placing a fixture on a vibrating plate, the fixture including a first layer plate, a second layer plate, a third layer plate and an adhesive layer, the first layer plate having a plurality of first micropores, the second layer plate having a plurality of second micropores, and the third layer plate having a plurality of third micropores; placing a plurality of metal columns on the fixture and activating the vibrating plate to fill the plurality of first micropores with the plurality of metal columns. The process involves: removing the first and second layers; inverting the fixture onto a glass substrate having a plurality of through holes, such that metal pillars filled with a plurality of first micropores are inserted into the corresponding through holes, wherein the glass substrate is placed on a support mold for supporting the metal pillars inserted into the plurality of through holes; removing the fixture and filling the plurality of through holes with an adhesive layer, followed by drying the adhesive layer; and removing the support mold and grinding the plurality of protruding metal pillars to make the plurality of protruding metal pillars flush with the glass substrate.

[0006] In one embodiment of the present invention, a plurality of first micropores, a plurality of second micropores and a plurality of third micropores are arranged correspondingly to each other to form a plurality of metal pillar channels on the fixture; wherein the fixture has needle marks for alignment with the glass substrate.

[0007] In one embodiment of the present invention, the step of filling a plurality of the metal pillars into a plurality of the first micropores further includes using a monitoring module to monitor the filling status of the metal pillars in real time; wherein the monitoring module includes an optical module and an image analysis module, the optical module being electrically connected to the image analysis module, the optical module including a light emitting unit and a light receiving unit; wherein the light emitting unit is connected to a first moving device to move the light emitting unit in a three-dimensional space; wherein the light receiving unit is connected to a second moving device to move the light receiving unit in the three-dimensional space.

[0008] In one embodiment of the present invention, the light emitting unit emits a first laser beam and a second laser beam toward the substrate, wherein the wavelength range of the first laser beam and the second laser beam is 300~2000 nm, and the pulse width range of the first laser beam and the second laser beam is 50 fs to 50 The light receiving unit includes a first wavefront sensor and a second wavefront sensor, and the image analysis module includes a waveform generator. The first wavefront sensor is located on a first side of the substrate and receives reflected light from the first laser beam reflected by the substrate to generate a reflected light signal. The second wavefront sensor is located on a second side of the substrate. The light emitting unit emits a second laser beam toward the substrate, and the second wavefront sensor receives transmitted light from the second laser beam passing through the substrate to generate a transmitted light signal. The waveform generator is electrically connected to the first and second wavefront sensors to receive the reflected light signal and generate a first detection waveform, and to receive the transmitted light signal and generate a second detection waveform.

[0009] In one embodiment of the present invention, the light emitting unit emits a first laser beam and a second laser beam toward the substrate, wherein the wavelength range of the first laser beam and the second laser beam is 300~2000 nm, and the pulse width range of the first laser beam and the second laser beam is 50 fs to 50 The light receiving unit includes a first photoelastic sensor and a second photoelastic sensor, and the image analysis module includes an imaging device; wherein, the first photoelastic sensor is located on a first side of the substrate, and the first photoelastic sensor receives reflected light from the first laser beam reflected by the substrate to generate a reflected light signal; wherein, the second photoelastic sensor is located on a second side of the substrate; the light emitting unit emits a second laser beam toward the substrate, and the second photoelastic sensor receives transmitted light from the second laser beam passing through the substrate to generate a transmitted light signal; wherein, the imaging device is electrically connected to the first photoelastic sensor and the second photoelastic sensor to receive the reflected light signal and generate a first stress distribution feature map, and to receive the transmitted light signal and generate a second stress distribution feature map.

[0010] In one embodiment of the present invention, the light emitting unit emits a first laser pulse and a second laser pulse toward the substrate, wherein the wavelength range of the first laser pulse and the second laser pulse is 300 nm to 2000 nm, and the pulse width range of the first laser pulse and the second laser pulse is 50 fs to 50 The light receiving unit includes a first laser vibrometer and a second laser vibrometer, and the image analysis module includes a waveform generator; wherein, the first laser vibrometer is located on a first side of the substrate, and the first laser vibrometer receives a reflected light from the first laser pulse reflected by the substrate to generate a reflected ultrasound wave; wherein, the second laser vibrometer is located on a second side of the substrate; the light emitting unit emits a second laser pulse toward the substrate, and the second laser vibrometer receives a transmitted light from the second laser pulse passing through the substrate to generate a transmitted ultrasound wave; wherein, the waveform generator is electrically connected to the first laser vibrometer and the second laser vibrometer to receive the reflected ultrasound wave and generate a first waveform diagram, and to receive the transmitted ultrasound wave and generate a second waveform diagram.

[0011] In one embodiment of the present invention, the light emitting unit emits a first laser beam and a second laser beam toward the substrate, the light receiving unit includes a first hyperspectral sensor and a second hyperspectral sensor, and the image analysis module includes a hyperspectral generator; wherein, the first hyperspectral sensor is located on a first side of the substrate, and the first hyperspectral sensor receives reflected light from the first laser beam reflected by the substrate to generate a reflected light signal; wherein, the second hyperspectral sensor is located on a second side of the substrate; the light emitting unit emits the second laser beam toward the substrate, and the second hyperspectral sensor receives transmitted light from the second laser beam passing through the substrate to generate a transmitted light signal; wherein, the hyperspectral generator is electrically connected to the first hyperspectral sensor and the second hyperspectral sensor to receive the reflected light signal and generate a first detection spectrum, and to receive the transmitted light signal and generate a second detection spectrum; wherein, the first hyperspectral sensor and the second hyperspectral sensor receive a spectral range of 300 nm to 2500 nm, wherein the spectrum is a continuous spectrum.

[0012] In one embodiment of the present invention, the step of grinding a plurality of protruding metal pillars further includes using a cleaning module to remove impurities on the glass substrate, wherein the cleaning module includes a gas source and a gas nozzle, and the gas nozzle is connected to the gas source.

[0013] In one embodiment of the present invention, when viewed from the side, the plurality of the first micropores are funnel-shaped, and the plurality of the second micropores and the plurality of the third micropores are rectangular.

[0014] In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a metal column transfer device, which includes: a vibrating plate; and a fixture, the fixture being placed on the vibrating plate and including a first layer plate, a second layer plate, a third layer plate and an adhesive layer, the first layer plate having a plurality of first micropores, the second layer plate having a plurality of second micropores, and the third layer plate having a plurality of third micropores.

[0015] One of the beneficial effects of the present invention is that the wound solid electrolytic capacitor packaging structure and manufacturing method provided by the present invention can improve the efficiency of transferring a large number of copper pillars through the technical solutions of "the fixture includes a first layer plate, a second layer plate, a third layer plate and an adhesive layer, the first layer plate has a plurality of first micropores, the second layer plate has a plurality of second micropores, and the third layer plate has a plurality of third micropores" and "removing the first layer plate and the second layer plate".

[0016] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention.

Implementation Method

[0027] The following specific embodiments illustrate the implementation of the "Metal Column Transfer Method and Apparatus" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0028] It should be understood that although terms such as “first,” “second,” and “third” may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term “or” as used herein may, as appropriate, include any combination of one or more of the associated listed items.

[0029] Referring to Figures 1 to 10, the present invention provides a method for transferring metal pillars, which includes at least the following steps: Step S1: placing a fixture 10 on a vibrating plate R; Step S2: placing a plurality of metal pillars 20 on the fixture 10 and activating the vibrating plate R so that the plurality of metal pillars 20 fill a plurality of first micro-holes; Step S3: removing the first layer plate 11 and the second layer plate 12; Step S4: inverting the fixture 10 onto a glass substrate 40 having a plurality of through holes so that the metal pillars 20 filled with the plurality of first micro-holes are inserted into the corresponding through holes; Step S5: removing the fixture 10 and filling the plurality of through holes with an adhesive layer 60, and then drying the adhesive layer 60; and Step S6: removing the support mold 50 and grinding the plurality of protruding metal pillars 20 so that the plurality of protruding metal pillars 20 are flush with the glass substrate 40.

[0030] As shown in Figure 2, the metal column transfer method of the present invention employs a fixture 10 comprising a first layer plate 11, a second layer plate 12, a third layer plate 13, and an adhesive layer 14. The metal columns 20 are transferred by utilizing the detachable nature of each layer, achieving the purpose of mass transfer of metal columns. Further, the first layer plate 11 has a plurality of first micropores, the second layer plate 12 has a plurality of second micropores, and the third layer plate 13 has a plurality of third micropores. The plurality of first micropores, second micropores, and third micropores are arranged correspondingly to each other to form a plurality of metal column channels on the fixture 10 for the metal columns 20 to be filled. In one embodiment, when viewed from the side, the plurality of first micropores are funnel-shaped, and the plurality of second and third micropores are rectangular, so that the metal columns 20 can be easily filled into the first micropores.

[0031] In detail, as shown in FIG3, the metal column transfer method of the present invention places a jig 10 on a vibrating plate R and places a plurality of metal columns 20 on the jig 10. The vibrating plate R can repeatedly vibrate horizontally or vertically, causing the metal columns 20 to move on the jig 10 and fill the first micropores of the first layer plate 11, and be fixed in the jig 10 by an adhesive layer 14. For example, the material of the adhesive layer 14 can be epoxy resin, β-staged bisbenzocyclobutene (BCB), silicone, perfluorocyclobutane (PFCB), or polyimide.

[0032] Furthermore, the metal column transfer method of the present invention can also use the monitoring module 30 to monitor the filling status of the metal column 20 in real time, and control the vibration direction, frequency and vibration amplitude of the vibrating disk R in real time through the processing module (not shown), so as to further improve the accuracy and efficiency of filling the micro-conductive electron into the micro-hole.

[0033] Specifically, as shown in FIG4, the monitoring module 30 may include a light emitting unit 300, a first light receiving unit 341, a second light receiving unit 342, an imaging device 330, and a control device 310. The light emitting unit 300, the first light receiving unit 341, the second light receiving unit 342, and the imaging device 330 are all electrically connected to the control device 310. The light emitting unit 300 is located on the first side of the glass substrate 40 and emits a monitoring laser beam L1 toward the glass substrate 40. The first light receiving unit 341 is located on the first side of the glass substrate 40 and is used to receive the reflected light La of the first laser beam reflected by the glass substrate 40 to generate a reflected light signal. The second light receiving unit 342 is located on the second side of the glass substrate 40 and is used to receive the transmitted light Lb of the second laser beam passing through the glass substrate 40 to generate a transmitted light signal. The imaging device 330 is electrically connected to the first light receiving unit 341 and the second light receiving unit 342 to receive the reflected light La and the transmitted light Lb, and generate a detection result.

[0034] Furthermore, the monitoring module 30 may also include a moving device (not shown). For example, a first light receiving unit 341 is connected to a first moving device so that the first light receiving unit 341 can move in three-dimensional space; a second light receiving unit 342 is connected to a second moving device so that the second light receiving unit 342 can move in three-dimensional space; and a light emitting unit 300 is connected to a laser moving device so that the light emitting unit 300 can move in three-dimensional space. This allows adjustment of the light emission position of the light emitting unit 300 and the light receiving positions of the first light receiving unit 341 and the second light receiving unit 342.

[0035] In one embodiment, the monitoring module 30 is a hyperspectral monitoring module, which includes an optical module and an image analysis module (not shown); the optical module is electrically connected to the image analysis module, and the optical module includes a light emitting unit and a light receiving unit, wherein the light receiving unit is a hyperspectral camera. According to one embodiment, during the micropore filling process, the light emitting unit emits a light source onto the surface of the glass substrate 40, and the light source is reflected from the surface of the glass substrate 40 to generate a light signal; the light receiving unit receives the light signal and provides a corresponding spectrum to the image analysis module; the image analysis module analyzes the spectrum to obtain an optical result and transmits the optical result to the processing module (not shown); the processing module controls and adjusts the vibration frequency and amplitude of the vibrating disk R according to the optical result.

[0036] In one embodiment, the monitoring module 30 is a wavefront monitoring module, which includes a laser device, a wavefront sensor, and a waveform generator (not shown); the wavefront sensor is electrically connected to the waveform generator, and the laser device is disposed above the glass substrate 40. According to one embodiment, during the micro-hole filling process, the laser device emits a laser beam onto the surface of the glass substrate 40, and the laser beam is reflected from the surface of the glass substrate 40 to generate reflected light; the wavefront sensor receives the reflected light and provides a corresponding reflected light signal to the waveform generator; the waveform generator analyzes the reflected light signal to obtain a waveform detection result and transmits the waveform detection result to the processing module; the processing module controls and adjusts the vibration frequency and amplitude of the vibrating disk R according to the waveform detection result.

[0037] In one embodiment, the monitoring module 30 is a photoelasticity monitoring module, which includes a laser device, a photoelasticity sensor, and an imaging device (not shown); the photoelasticity sensor is electrically connected to the imaging device, and the laser device is disposed above the glass substrate 40. According to one embodiment, during the micro-hole filling process, the laser device emits a laser beam onto the surface of the glass substrate 40, and the laser beam is reflected from the surface of the glass substrate 40 to generate reflected light; the photoelasticity sensor receives the reflected light and provides a corresponding reflected light signal to the imaging device; the imaging device analyzes the reflected light signal to obtain a stress distribution characteristic result, and transmits the stress distribution characteristic result to the processing module; the processing module controls and adjusts the vibration frequency and amplitude of the vibrating disk R according to the stress distribution characteristic result.

[0038] In one embodiment, the monitoring module 30 is a femtosecond ultrasound monitoring module, which includes a laser device, a laser vibrometer, and a waveform generator (not shown); the laser vibrometer is electrically connected to the waveform generator, and the laser device is disposed above the glass substrate 40. According to one embodiment, during the micropore filling process, the laser device emits a laser pulse onto the surface of the glass substrate 40, and the laser pulse is reflected from the surface of the glass substrate 40 to generate a reflected ultrasound wave; the laser vibrometer receives the reflected ultrasound wave and provides a corresponding reflected ultrasound wave signal to the waveform generator; the waveform generator analyzes the reflected ultrasound wave signal to obtain a waveform diagram result, and transmits the waveform diagram result to the processing module; the processing module controls and adjusts the vibration frequency and amplitude of the vibrating disk R according to the waveform diagram result.

[0039] In one embodiment, the monitoring module 30 is a CCD monitoring module, which includes a CCD camera (not shown). According to one embodiment, during the micropore filling process, the CCD camera takes real-time pictures of the surface of the glass substrate 40 and transmits the images to the processing module; the processing module analyzes the micropore filling status based on the images and controls and adjusts the vibration frequency and amplitude of the vibrating disk R in real time.

[0040] After the monitoring module 30 confirms that each metal pillar channel is filled with a metal pillar 20, as shown in FIG. 5, the first layer plate 11 and the second layer plate 12 can be removed, exposing part of the metal pillar 20. Subsequently, as shown in FIG. 6, the fixture 10 can be inverted onto the glass substrate 40. Specifically, the glass substrate 40 has a plurality of through holes, and the third layer plate 13 and the adhesive layer 14 of the fixture 10 can be inverted onto the glass substrate 40 supported by the support mold 50, so that the metal pillars 20 filled with the plurality of first micropores are inserted into the corresponding through holes. In one embodiment, the fixture 10 may have pin marks for alignment with the glass substrate 40.

[0041] As shown in FIG. 7, after inserting the metal post 20 into the corresponding through hole, the third layer 13 and adhesive layer 14 of the fixture 10 can be removed, that is, the metal post 20 is transferred into the through hole of the glass substrate 40, and the remaining part of the fixture 10 is removed from the glass substrate 40. Next, as shown in FIG. 8, adhesive can be filled into the gap between the metal post 20 and the through hole to fix the metal post 20. In one embodiment, the adhesive can be filled by spin coating to form an adhesive layer 60, and then the adhesive layer is dried to obtain spin-on glass (SOG).

[0042] Next, the support mold 50 can be removed, and then the glass substrate 40 can be ground to make the protruding metal pillars 20 flush with the surface of the glass substrate 40. As shown in FIG9, a glass substrate 40 with a flat surface can be obtained by the metal pillar transfer method of the present invention.

[0043] Furthermore, in some embodiments, the laser drilling system of the present invention further includes a cleaning module 70, and the laser drilling method of the present invention further includes using the cleaning module 70 to remove impurities on the glass substrate 40.

[0044] Specifically, referring to Figure 10, the cleaning module 70 can be disposed above or adjacent to the glass substrate 40. The present invention does not particularly limit the arrangement of the cleaning module 70. The cleaning module 70 may include at least a gas source 702 for storing cleaning material 706, and a gas nozzle 704 for supplying the cleaning material 706 to the glass substrate 40 or the glass substrate 40. For example, the gas source 702 stores liquid carbon dioxide and supplies it to the gas nozzle 704 at a pressure between approximately 700 psi and approximately 900 psi (e.g., any positive integer between 700 psi and 900 psi), causing the liquid carbon dioxide to undergo isenthalpic expansion into a stream of solid carbon dioxide particles upon exiting the gas nozzle 704, thereby carrying away impurities from the glass substrate 40 or the glass substrate 40. In one embodiment, the distance between the gas nozzle 704 and the glass substrate 40 may be between approximately 0.5 inches and approximately 2 inches (e.g., any positive integer between 0.5 inches and 2 inches). In one embodiment, the gas nozzle 704 and the glass substrate 40 may have tilt angles of about 15 degrees and 45 degrees (e.g., any positive integer between 15 and 45 inches) to avoid the momentum of the carbon dioxide particle stream being too high and damaging the glass substrate 40.

[0045] In one embodiment of the present invention, a metal column transfer device is provided for use in the aforementioned metal column transfer method. The metal column transfer device of the present invention includes at least a vibrating disk R and a fixture 10. The fixture 10 used in the present invention is placed on the vibrating disk R and includes a first layer plate 11, a second layer plate 12, a third layer plate 13, and an adhesive layer 14. The first layer plate 11 has a plurality of first micropores, the second layer plate 12 has a plurality of second micropores, and the third layer plate 13 has a plurality of third micropores. The plurality of first micropores, the plurality of second micropores, and the plurality of third micropores are arranged correspondingly to each other to form a plurality of metal column channels on the fixture 10 for the metal columns 20 to be filled. The metal column transfer device of the present invention transfers the metal columns 20 by means of the detachable characteristics between the layers, achieving the purpose of transferring a large number of metal columns.

[0046] [Beneficial Effects of the Embodiments]

[0047] One of the beneficial effects of the present invention is that the metal column transfer method and device provided by the present invention can improve the efficiency of transferring a large number of copper columns by means of the technical solutions of "the fixture includes a first layer plate, a second layer plate, a third layer plate and an adhesive layer, the first layer plate having a plurality of first micropores, the second layer plate having a plurality of second micropores, and the third layer plate having a plurality of third micropores" and "removing the first layer plate and the second layer plate".

[0048] Furthermore, the metal pillar transfer method of the present invention employs a jig comprising a first layer plate, a second layer plate, a third layer plate, and an adhesive layer, thereby achieving the effect of mass transfer of metal pillars during the metal pillar transfer process through a layer-separation jig. In addition, the metal pillar transfer method of the present invention can grind a plurality of protruding metal pillars to make the plurality of protruding metal pillars flush with the glass substrate, thereby ensuring that a glass substrate with a flat surface can be obtained.

[0049] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention. [Simplified Explanation of the Diagram]

[0017] Figure 1 is a flowchart of the metal column transfer method of the present invention.

[0018] Figure 2 is an exploded schematic diagram of the fixture used in the metal column transfer method of the present invention.

[0019] Figure 3 is a schematic diagram of placing the metal pillar on the fixture in the metal pillar transfer method of the present invention.

[0020] Figure 4 is a schematic diagram of the monitoring module used in the metal column transfer method of the present invention.

[0021] Figure 5 is a schematic diagram of the metal column transfer method of the present invention for removing the first layer plate and the second layer plate.

[0022] Figure 6 is a schematic diagram of the metal column transfer method of the present invention, inverting the fixture onto the glass substrate.

[0023] Figure 7 is a schematic diagram of the metal column transfer method of the present invention for removing the third layer plate and the adhesive layer.

[0024] Figure 8 is a schematic diagram of the metal column transfer method of the present invention for applying adhesive.

[0025] Figure 9 is a schematic diagram of the glass substrate after grinding by the metal pillar transfer method of the present invention.

[0026] Figure 10 is a schematic diagram of the metal column transfer method of the present invention using a cleaning module.

Claims

1. A method for transferring a metal column, comprising: A fixture is placed on a vibrating plate. The fixture includes a first plate, a second plate, a third plate, and an adhesive layer. The first plate has a plurality of first micropores, the second plate has a plurality of second micropores, and the third plate has a plurality of third micropores. A plurality of metal pillars are placed on the fixture, and the vibrating plate is activated so that the plurality of metal pillars fill the plurality of first micropores. Remove the first and second layers; invert the fixture onto a glass substrate having a plurality of through holes, so that metal pillars filled with a plurality of first micropores are inserted into the corresponding through holes, wherein the glass substrate is placed on a support mold for supporting the metal pillars inserted into the plurality of through holes; remove the fixture and fill the plurality of through holes with an adhesive layer, and then dry the adhesive layer; and remove the support mold and grind the plurality of protruding metal pillars so that the plurality of protruding metal pillars are flush with the glass substrate.

2. The metal column transfer method as described in claim 1, wherein, A plurality of first micropores, a plurality of second micropores, and a plurality of third micropores are arranged correspondingly to each other to form a plurality of metal pillar channels on the fixture; wherein the fixture has needle marks for alignment with the glass substrate.

3. The metal column transfer method as described in claim 1, wherein, In the step of filling a plurality of the metal pillars into a plurality of the first micropores, the method further includes using a monitoring module to monitor the filling status of the metal pillars in real time; wherein the monitoring module includes an optical module and an image analysis module, the optical module being electrically connected to the image analysis module, the optical module including a light emitting unit and a light receiving unit; wherein the light emitting unit is connected to a first moving device to move the light emitting unit in a three-dimensional space; wherein the light receiving unit is connected to a second moving device to move the light receiving unit in the three-dimensional space.

4. The metal column transfer method as described in claim 3, wherein, The light emitting unit emits a first laser beam and a second laser beam toward the substrate. The wavelength range of the first laser beam and the second laser beam is 300~2000 nm, and the pulse width range of the first laser beam and the second laser beam is 50 fs to 50 ns. The light receiving unit includes a first optical wavefront sensor and a second optical wavefront sensor. The image analysis module includes a waveform generator. The first optical wavefront sensor is located on a first side of the substrate and receives reflected light from the first laser beam reflected by the substrate to generate a reflected light signal. The second optical wavefront sensor is located on a second side of the substrate. The light emitting unit emits the second laser beam toward the substrate, and the second optical wavefront sensor receives transmitted light from the second laser beam passing through the substrate to generate a transmitted light signal. The waveform generator is electrically connected to the first optical wavefront sensor and the second optical wavefront sensor to receive the reflected light signal and generate a first detection waveform, and to receive the transmitted light signal and generate a second detection waveform.

5. The metal column transfer method as described in claim 3, wherein, The light emitting unit emits a first laser beam and a second laser beam toward the substrate, the wavelength range of the first laser beam and the second laser beam being 300~2000 nm, and the pulse width range of the first laser beam and the second laser beam being 50 fs to 50 ns. The light receiving unit includes a first photoelastic sensor and a second photoelastic sensor. The image analysis module includes an image device. The first photoelastic sensor is located on a first side of the substrate and receives reflected light from the first laser beam reflected by the substrate to generate a reflected light signal. The second photoelastic sensor is located on a second side of the substrate. The light emitting unit emits the second laser beam toward the substrate, and the second photoelastic sensor receives transmitted light from the second laser beam passing through the substrate to generate a transmitted light signal. The image device is electrically connected to the first photoelastic sensor and the second photoelastic sensor to receive the reflected light signal and generate a first stress distribution feature map, and to receive the transmitted light signal and generate a second stress distribution feature map.

6. The metal column transfer method as described in claim 3, wherein, The light emitting unit emits a first laser pulse and a second laser pulse toward the substrate, wherein the wavelength range of the first laser pulse and the second laser pulse is 300 nm to 2000 nm, and the pulse width range of the first laser pulse and the second laser pulse is 50 fs to 50 ns. The light receiving unit includes a first laser vibrometer and a second laser vibrometer. The image analysis module includes a waveform generator. The first laser vibrometer is located on a first side of the substrate and receives reflected light from the first laser pulse reflected by the substrate to generate a reflected ultrasound wave. The second laser vibrometer is located on a second side of the substrate. The light emitting unit emits the second laser pulse toward the substrate, and the second laser vibrometer receives transmitted light from the second laser pulse passing through the substrate to generate a transmitted ultrasound wave. The waveform generator is electrically connected to the first laser vibrometer and the second laser vibrometer to receive the reflected ultrasound and generate a first waveform, and to receive the penetrating ultrasound and generate a second waveform.

7. The metal column transfer method as described in claim 3, wherein, The light emitting unit emits a first laser beam and a second laser beam toward the substrate. The light receiving unit includes a first hyperspectral sensor and a second hyperspectral sensor. The image analysis module includes a hyperspectral generator. The first hyperspectral sensor is located on a first side of the substrate and receives reflected light from the first laser beam reflected by the substrate to generate a reflected light signal. The second hyperspectral sensor is located on a second side of the substrate. The light emitting unit emits the second laser beam toward the substrate, and the second hyperspectral sensor receives transmitted light from the second laser beam passing through the substrate to generate a transmitted light signal. The hyperspectral generator is electrically connected to the first and second hyperspectral sensors to receive the reflected light signal and generate a first detection spectrum, and to receive the transmitted light signal and generate a second detection spectrum. The first and second hyperspectral sensors receive a spectral range of 300 nm to 2500 nm, wherein the spectrum is a continuous spectrum.

8. The metal column transfer method as described in claim 1, wherein, The step of grinding the plurality of protruding metal pillars further includes using a cleaning module to remove impurities from the glass substrate, wherein the cleaning module includes a gas source and a gas nozzle connected to the gas source.

9. The metal column transfer method as described in claim 1, wherein, When viewed from the side, the plurality of the first micropores are funnel-shaped, and the plurality of the second micropores and the plurality of the third micropores are rectangular.

10. A metal column transfer device, comprising: A vibrating disc; The device also includes a fixture placed on the vibrating plate and comprising a first layer plate, a second layer plate, a third layer plate, and an adhesive layer. The first layer plate has a plurality of first micropores, the second layer plate has a plurality of second micropores, and the third layer plate has a plurality of third micropores.

Images